For Electric Cars & Hybrid Cars Isolation Voltage 2,500Vrms High Voltage Detection IC BM67290FV-C Key Specifications General Description This is a voltage detector IC for DC-DC converter. Aside from being capable of converting input voltage to duty, it has built in protection functions against low voltage, overvoltage and active overvoltage. Features Built-in input PWM modulation circuit Built-in low voltage lock out circuit Built-in input under voltage protection function Built-in input overvoltage protection function Built-in magnetic isolator Built-in active overvoltage protection function Built-in reference voltage output Isolation Voltage: 2,500Vrms (Max) Power Source Voltage Range (high voltage side): 8.0V to 24V Power Source Voltage Range (low voltage side): 3.0V to 5.5V Reference Voltage : 5V±1.5% Oscillation Frequency Variability: 10kHz to 250kHz (Typ) Package W(Typ) x D(Typ) x H(Max) Application DC-DC converter SSOP-B20W 6.50mm x 8.10mm x 2.01mm Typical Application Circuit VBIAS VDD1 VDD2 REF NC VH OUT VBIAS Controller RFOV NC RFLV SD1 VDTY SD2 VACT NC RT NC GND1 GND2 GND1 GND2 Figure 1. Example of a Typical Application Circuit of DC-DC Converter ○Product structure: Silicon integrated circuit ○This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0727ABZ00010-1-2 © 2014 ROHM Co., Ltd. All rights reserved. 1/30 10.Nov.2014 Rev.001 TSZ22111・14・001 BM67290FV-C Pin Configuration REF GND2 GND1 NC RFOV VDD2 RFLV VH NC OUT VDTY SD1 VDD1 NC VACT SD2 GND1 RT GND2 NC Figure 2. BM67290FV-C Package (SSOP-B20W) Pin Descriptions Terminal Number Code I/O 1 REF O Reference voltage terminal 2 GND1 - Grounding terminal 1 (high voltage side) 3 RFOV I Input overvoltage protection value setting terminal 4 RFLV I Input low voltage protection value setting terminal 5 VH I Input voltage signal terminal 6 VDTY I Input voltage signal terminal for Duty 7 VDD1 - Power source terminal 1 (high voltage side) 8 VACT I Active voltage signal terminal 9 GND1 - Grounding terminal 1 (high voltage side) 10 RT I Timing resistance terminal 11 GND2 - Grounding terminal 2 (low voltage side) 12 NC - Disconnected terminal 13 SD2 O Protective cutoff terminal 2 14 NC - Disconnected terminal 15 SD1 O Protective cutoff terminal 1 16 OUT O Input voltage monitoring condition output signal terminal 17 NC - Disconnected terminal 18 VDD2 - Power source terminal 2 (low voltage side) 19 NC - Disconnected terminal 20 GND2 - Grounding terminal 2 (low voltage side) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Function 2/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Block Diagram VDD1 Internal circuit VDD UVLO COMP VDD2 (UVLO) VDD 7.7V/7.4V REF REF REG12V REGlogic Internal circuit 4.2V/4.0V Reset REF UVLO COMP VDD2 Transformer 1 VACT COMP VACT (PWM) (PRT1) Transformer driving circuit REF/ 4.0V Transformer receiving circuit OUT DRV GND2 VHOV COMP VH VDD2 RFOV/ 0.985 x RFOV RFOV VHLV COMP PWM Circuit/ Output mode switching (SD) Transformer driving circuit Transformer receiving circuit SD1 DRV Transformer 2 GND2 (PRT2) RFLV 0.8 x RFLV/ RFLV VDTY SD2 RT GND2 GND2 GND1 GND2 GND1 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Explanation of Operation (1) Timing when VDD2 is ON first before VDD1 VDD2 powers SD1, SD2 and OUT. When VDD2 turns ON, SD1=H, SD2=L and OUT=L initially. Then, when VDD1 turns ON and reaches VthVDD1H, REF turns ON. When REF reaches VthREF, CT turns ON. Once the above conditions are satisfied, DUTY will be outputted to OUT pin at CLK’s 2nd pulse. At the same time, SD1 becomes L and SD2 becomes Hi-Z. VTHHVDD2 VDD2 0V VTHVDD1H VTHVDD1L VDD1 0V VTHREFH VTHREFL REF 0V VTHOV, VTHVACT VTHOV×VOVZ VHVACT VTHHPWL (CT) VH VDTY VTHLV VTHLV×VLVH VTHLPWL 0V H (CLK) L VDD2 OUT 0V H (PRT1) L H (PRT2) L VDD2 SD1 0V Hi-Z SD2 0V Figure 3. VDD2 Start to VDD1 Start Timing Chart www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C (2) Timing when VDD1 is ON first before VDD2 When VDD1 turns ON and reaches VthVDD1, REF turns ON. When REF reaches VthREF, CT turns ON. When VDD2 turns ON, SD1=H, SD2=L and OUT=L initially.. When VDD2 reaches VthVDD2, DUTY will be immediately outputted to OUT pin at the next CLK pulse. SD1 and SD2 behavior at CLK’s 2nd pulse is still the same with (1), SD1=L and SD2=Hi-Z at CLK’s 2nd pulse. VTHVDD2 VDD2 0V VTHVDD1H VTHLVDD1L VDD1 0V VTHREFH VTHREFH REF 0V VthOV,VthVACT VthOV×VOVZ VHVACT VthHPWL (CT) VH VDTY VTHLV VTHLV×VLVH VTHLPWL 0V H (CLK) L VDD2 OUT 0V H (PRT1) L H (PRT2) L VDD2 SD1 0V Hi-Z SD2 0V Figure 4. VDD1 Start to VDD2 Start Timing Chart www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C (3) Timing when VDD1 is turned OFF before VDD2 When VDD1 reaches VthLVDD1, REF and CT immediately stop. Outputs become SD1=H, SD2=L and OUT=L. VDD2 0V VthVDD1H VthVDD1L VDD1 0V VthREFH VthREFL REF 0V VthOV, VACT VthOV×VOVZ VHVACT VthHPWL ( CT ) VH VDTY VthLV VthLV×VLVH VthLPWL 0V ( CLK ) H L VDD2 OUT 0V H ( PRT1 ) L H ( PRT2 ) L VDD2 SD1 0V Hi-Z SD2 0V Figure 5. VDD1 Stop to VDD2 Stop Timing Chart www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C (4) Timing when VDD2 is tuned OFF before VDD1 When VDD2 reaches VthLVDD2, the outputs become SD1=H, SD2=L and OUT=L even if REF and CT are still active. VthVDD2 VDD2 0V VthVDD1H VthVDD1L VDD1 0V VthREFH VthREFL REF 0V VthOV, VACT VthOV×VOVZ VHVACT VthHPWML ( CT ) VH VDTY VthLV VthLV×VLVH VthLPWL 0V ( CLK ) H L VDD2 OUT 0V H ( PRT1 ) L H ( PRT2 ) L VDD2 SD1 0V Hi-Z SD2 0V Figure 6. VDD2 Stop to VDD1 Stop Timing Chart www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C (5) Normal Operation During normal operation, the internal oscillator (CT) and internal clock (CLK) are active. OUT turns L every time CT is above VDTY. OUT turns H every time CLK rises. Since protection circuits are not active, SD1=L and SD2=Hi-Z. VthOV,VACT VthOV×VOVZ VHVACT VthHPWL ( CT ) VH VDTY VthLV VthLV×VLVH VthLPWL 0V ( CLK ) H L VDD2 OUT 0V H ( PRT1 ) L H ( PRT2 ) L VDD2 SD1 0V Hi-Z SD2 0V Figure 7. Normal Operation Timing Chart VTHHPWL (CT) VDTY VTHLPWL (CLK) (PWM) Minimum Duty 10% Maximum Duty 100% OUT tD1 tD2 Propagation delay time =|td1-td2| Figure 8. Propagation Delay Time, Minimum Duty, Maximum Duty www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C The output from OUT terminal varies its Duty in accordance with VDTY voltage. Duty becomes higher as VDTY voltage increases. The relationship between VDTY voltage and output Duty is shown in the graph below. The output Duty becomes 100% when VDTY voltage is above VthHPWL (Typ 4.275V) and minimum duty is achieved when VDTY voltage is below VthLPWL (Typ 0.225 V). Duty= Min duty + (VDTY-0.225V)/A frequency =10kHz : Min duty=10.0%, A=0.04500 frequency =100kHz : Min duty=10.9%, A=0.04545 frequency =250kHz : Min duty=12.1%, A=0.04607 100 Duty 50 [%] 10 0 1.0 0.225 (VthLPWL) 2.0 3.0 4.0 4.275 (VthHPWL) VDTY voltage[ V ] Figure 9. VDTY Voltage-Output Duty Property www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C (6) Overvoltage Detection (active overvoltage protection, input overvoltage protection) Overvoltage is detected when VACT > VthACT (for active overvoltage protection) and VH>VthOV (for input overvoltage protection). PRT1 immediately turns to “H” and the protection circuit is activated. At this time, OUT=H, SD1=H, and SD2=L. When the protection circuit is deactivated (VACT<VHVACT for active OVP and VH <VthOV×VOVZ for input OVP), OUT returns to normal operation, SD1=L and SD2=Hi-Z at CLK’s 2nd pulse.. VthOV (VthVACT) VthOV×VOVZ (VHVACT) VthHPWL ( CT ) VH VDTY VthLV VthLV×VLVH VthLPWL 0V ( CLK ) H L VDD2 OUT 0 2CLK H ( PRT1 ) L H ( PRT2 ) L VDD2 SD1 0V Hi-Z SD2 0V Figure 10. Protection Detection (active overvoltage protection, input overvoltage protection) Timing Chart www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C (7) Under Voltage Detection (input low voltage protection) When VH < VthLV×VLVH, input low voltage protection is activated. PRT2 immediately turns H. At this time, OUT=”L”, SD1=”H”, and SD2=”L”. When VH > VthLV, the protection circuit is deactivated and PRT2=L. OUT returns to normal operation, SD1 turns L and SD2 turns Hi-Z at CLK’s 2nd pulse. VthOV,VthVACT VthOV×VOVZ VHVACT VthHPWL ( CT ) VH VDTY VthLV VthLV×VLVH VthLPWL 0V ( CLK ) H L VDD2 OUT 0 H ( PRT1 ) L H ( PRT2 ) L VDD2 SD1 0V Hi-Z SD2 0V Figure 11. Protection Detection (input low voltage protection) Timing Chart (8) UVLO Detection This IC is equipped with UVLO circuits for VDD1 voltage, REF voltage and VDD2 voltage. When any undervoltage is detected, OUT=L, SD1=H and SD2=L. No 1 2 3 4 5 6 7 8 VDD1 UVLO L L L L H H H H H:Release VDD2 UVLO L L H H L L H H REF UVLO L H L H L H L H OUT SD1 SD2 L L L L L L L DUTY OUTPUT H H H H H H H PROTECTION OUTPUT L L L L L L L PROTECTION OUTUT L:Detection Figure 12. Output Logic of the UVLO www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Absolute Maximum Ratings Parameter Power Source Terminal (VDD1) Power Source Terminal (VDD2) Input Voltage (VH) Input Voltage (VDTY) Input Voltage (VACT) Input Voltage (RFOV) Symbol Rating VDD1 -0.3 to +30 VDD2 -0.3 to +7 VH VDTY VACT VRFOV Unit (Note 1) V (Note 2) V -0.3 to +30 (Note 1) V -0.3 to +30 (Note 1) V -0.3 to +30 (Note 1) V -0.3 to +30 (Note 1) V (Note 1) V Input Voltage (RFLV) VRFLV -0.3 to +30 Output Voltage (OUT) VOUT -0.3 to +7 (Note 2) V VSD1 (Note 2) V Output Voltage (SD1) Output Voltage (SD2) -0.3 to +7 VSD2 -0.3 to +20 (Note 2) V Pd 1.19 (Note 3) W Operating Temperature Range Topr -40 to +125 °C Storage Temperature Range Tstg -55 to+150 °C Tjmax 150 °C Power Dissipation Junction Temperature (Note 1) Based on GND1 (Note 2) Based on GND2 (Note 3) When mounted to 70.0mm×70.0mm×1.6mm glass epoxy board (with less than 3% of copper foil area)and used at Ta=25°C or above, power is dissipated by 9.52 mW/°C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Power Source Voltage VDD1 VDD1 8.0 10 24 V Power Source Voltage VDD2 VDD2 3.0 5 5.5 V (Note 3) mA Reference Voltage Output Current IREF 0 - Reference Voltage Output Capacity CREF 1.0 - 4.7 µF Timing Resistance RRT 4 10 100 kΩ Oscillation Frequency fOSC 10 100 250 kHz VICML 0 - VDD1-2.5 V VICMH 0 - 9.0 V IDIO - - 2.0 mA In-phase Input Voltage Range VDD1<11.5V In-phase Input Voltage Range VDD1≥ 11.5V Input Protection Diode Current 5 (Note 3) Should not exceed Pd. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Electrical Characteristics (Unless, otherwise specified, VDD1=8V to 24.0V, VDD2=3.0V to 5.5V, Ta=-40°C to +125°C, RT=10kΩ, described with direction of flow from IC as +) Limit Parameter Symbol Unit Conditions Min Typ Max VDD1 8.0 - 24.0 V VDD2 3.0 - 5.5 V VDD1 Circuit Current IDD1 - 4.6 10.0 mA RT=10kΩ , VDTY=2.25V VDD2 Circuit Current IDD2 - 0.2 1.0 mA RT=10kΩ , VDTY=2.25V [Whole] Input Voltage Range [Low Voltage Malfunction Prevention Circuit] Startup Threshold Voltage VTHVDD1H 7.5 7.7 7.9 V VDD1 Cutoff Threshold Voltage VTHVDD1L 7.2 7.4 7.6 V VDD1 Operation Voltage Hysteresis VHYSVDD1 0.2 0.3 0.4 V VDD1 Startup Threshold Voltage VTHREFH 4.0 4.2 4.4 V REF Cutoff Threshold Voltage VTHREFL 3.8 4.0 4.2 V REF Operation Voltage Hysteresis VHYSREF 0.1 0.2 0.3 V REF Output Voltage VREF 4.925 5.000 5.075 V IREF=0mA to 5mA Output Drive Current IREF 5 - - mA Oscillation Frequency fOSC 90 100 110 kHz Duty Precision 10kHz DutyL 52.0 55.0 58.0 % VDTY=2.25V,H duty Duty Precision 100kHz DutyM 52.5 55.5 58.5 % VDTY=2.25V, H duty Duty Precision 250kHz DutyH 53.0 56.0 59.0 % VDTY=2.25V,H duty ΔDuty/Duty - 1 - % Design assurance VTHHPWL 4.1 4.275 4.45 V VTHLPWL 0.15 0.225 0.3 V IBVDTY -1.0 - 1.0 μA Propagation Delay Time 1 tD1 - - 500 ns Propagation Delay Time 2 tD2 - - 500 ns tD1-tD2 - - 50 ns VOUTL - - 0.5 V ISINK = -20mA VOUTH VDD2-0.5 - VDD2 V ISOURCE = 20mA [Reference Voltage] [PWM Part] Duty Temperature Property/Electric Property Variation Ratio Threshold Voltage During Discharge Threshold Voltage During Charge Input Bias Current Propagation Delay Time Difference RT=10kΩ VDTY=0V to 9V [OUT Terminal] Output Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Electrical Characteristics – continued (Unless, otherwise specified, VDD1=8V to 24.0V, VDD2=3.0V to 5.5V, Ta=-40°C to +125°C, RT=10kΩ, described with direction of flow from IC as +) Limit Parameter Symbol Unit Conditions Min Typ Max VSD1L - - 0.5 V ISINK = -20mA VSD1H VDD2-0.5 - VDD2 V ISOURCE = 20mA SD2 Voltage Operation VSD2 - - 0.5 V ISOURCE = 20mA Output Off-leak Current IOFFLEAKSD2 - - 10 μA SD2 = 20V VLVH 0.78 0.80 0.82 - RFLV=1.2V, VH=1.5V to down VTHLV 1.15 1.20 1.25 V RFLV=1.2V, VH=0V to up [SD1 Terminal] Output Voltage [SD2 Terminal] [Input Low Voltage Protection Part] Protection Operation/ Protection Cancellation Voltage Ratio Protection Cancellation Threshold Voltage Protection Operation Delay Time tDLYLV - - 1.0 μs RFLV=1.2V, VH=1.5V to 0.5V to SD1:L to H SD2 : H to L RFLV Input Bias Current IBRFLV -1.0 - 1.0 μA VH= RFLV=0V to 9V IBVH -1.0 - 1.0 μA VH= RFLV=0V to 9V VTHVACT 4.9 5.0 5.1 V VACT=3.5V to up VHVACT 3.9 4.0 4.1 V VACT=5.5V to down tDLYVACT - - 1.0 μs VACT=4.5V to 5.5V to SD1：L to H, SD2：H to L IBVACT -1.0 - 1.0 μA VACT=0V to 9V VOVZ 0.970 0.985 1.000 - RFOV=5.0V, VH=5.5V to down VTHOV 4.9 5.0 5.1 V RFOV=5.0V,VH=0V to up Protection Operation Delay Time tDLYOV - - 1.0 μs RFOV=5.0V, VH=4.5V to 5.5V to SD1 : L to H, SD2 : H to L RLOV Input Bias Current IBRFOV -1.0 - 1.0 μA VH= RFOV=0V to 9V VH Input Bias Current [Active Overvoltage Protection Part] Overvoltage Threshold Voltage Protection Cancellation Threshold Voltage Protection Operation Delay Time VACT Input Bias Current [Input Overvoltage Protection Part] Protection Operation/ Protection Cancellation Voltage Ratio Protection Operation Threshold Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Typical Performance Curves 1.0 14 VDD2 Circuit Current : IDD2 [mA] IDD2[mA] VDD1 Circuit Current : IDD1 [mA] IDD1[mA] 16 12 10 8 6 125℃ 4 2 0.8 0.6 0.4 125℃ 0.2 25℃ 0.0 -40℃ 25℃ -40℃ -0.2 0 0 4 8 12 16 VDD1[V] Input Voltage : VDD1 [V] 20 0 24 Figure 13. VDD1 Circuit Current 10kHz vs Input Voltage 2 3 4 VDD2[V] Input Voltage : VDD2 [V] 5 Figure 14. VDD2 Circuit Current 10kHz vs Input Voltage 1.0 16 VDD2 Circuit Current : IDD2 [mA] IDD2[mA] 14 VDD1 Circuit Current : IDD1 [mA] IDD1[mA] 1 12 10 25℃ 8 -40℃ 6 125℃ 4 0.8 0.6 0.4 25℃ 125℃ 0.2 -40℃ 0.0 2 -0.2 0 0 4 8 12 16 VDD1[V] Input Voltage : VDD1 [V] 20 24 1 2 3 4 VDD2[V] Input Voltage : VDD2 [V] 5 Figure 16. VDD2 Circuit Current 100kHz vs Input Voltage Figure 15. VDD1 Circuit Current 100kHz vs Input Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 15/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Typical Performance Curves - continued 1.0 25℃ 14 VDD2 Circuit Current : IDD2 [mA] IDD2[mA] VDD1 Circuit Current : IDD1 [mA] IDD1[mA] 16 -40℃ 12 10 8 125℃ 6 4 0.8 0.6 125℃ 0.4 25℃ 0.2 -40℃ 0.0 2 0 -0.2 0 4 8 12 16 VDD1[V] Input Voltage : VDD1 [V] 20 24 0 Figure 17. VDD1 Circuit Current 250kHz vs Input Voltage 1 2 3 4 VDD2[V] Input Voltage : VDD2 [V] 5 Figure 18. VDD2 Circuit Current 250kHz vs Input Voltage 6 6 5 5 4 OUT Voltage : VOUT [V] UVLO[V] REF Output Voltage : VREF [V] REF[V] -40℃ -40℃ 3 25℃ 25℃ 2 125℃ 1 125℃ 125℃ 4 25℃ 3 25℃ -40℃ 2 -40℃ 125℃ 1 0 0 7.2 7.3 7.4 7.5 7.6 7.7 VDD1[V] Input Voltage : VDD1 [V] 7.8 7.9 3.9 4.0 4.1 4.2 4.3 REF OutputREF[V] Voltage : VREF [V] 4.4 Figure 20. OUT Voltage vs REF Output Voltage (REF Startup/Shutdown Threshold) Figure 19. REF Output Voltage vs Input Voltage (VDD1 Startup/Shutdown Threshold) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3.8 16/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C 5.075 5.075 5.050 5.050 10V 5.025 REF Output Voltage : VREF [V] REF[V] REF Output Voltage : VREF [V] REF[V] Typical Performance Curves - continued 24V 5.000 8V 4.975 5.025 5.000 4.975 -40℃ 4.950 4.950 4.925 4.925 -50 -25 0 25 50 75 100 125 150 Ta[℃] Temperature : Ta [°C] 0 108 90 106 80 104 OUT Duty [%] OUT Duty[%] Oscillation Frequency :fOSC [kHz] Oscillator Frequency[kHz] 100 25℃ 100 98 125℃ 50 20 92 10 90 0 25 50 75 100 125 150 Ta[℃] Temperature : Ta [°C] Figure 23. Oscillation Frequency at 100kHz vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 25℃ -40℃ 40 94 0 4 125℃ 60 30 -25 3 70 96 -50 2 Figure 22. REF Output Voltage vs REF Output Current (REF Output Load Regulation (VDD1=10V)) 110 102 1 REF OutputIREF[mA] Current : IREF [mA] Figure 21. REF Output Voltage vs Temperature -40℃ 125 ℃ 25 ℃ 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VDTY Input VDTY[V] Voltage : VDTY [V] Figure 24. OUT Duty vs VDTY Input Voltage (VDTY-DUTY Characteristic at 100kHz) 17/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C 11.0 100 10.8 90 10.6 80 -40℃ 125℃ 25℃ 70 10.4 Duty [%] OUT Duty[%] Oscillation Frequency :fOSC [kHz] Oscillator Frequency [kHz] Typical Performance Curves - continued 10.2 10.0 125℃ 9.8 25℃ 60 -40℃ 50 40 9.6 30 9.4 20 9.2 10 0 9.0 -50 -25 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VDTY[V]: VDTY [V] VDTY Input Voltage 25 50 75 100 125 150 Ta[℃] Temperature : Ta [°C] Figure 26. OUT Duty vs VDTY Input Voltage (VDTY-DUTY Characteristic at 10kHz) 275 100 270 90 265 80 260 70 255 8V OUTDuty[%] Duty [%] OUT Oscillation Frequency :fOSC [kHz] Oscillator Frequency[KHz] Figure 25. Oscillation Frequency at 10kHz vs Temperature 10V 250 245 125℃ 25℃ 60 -40℃ 50 40 30 240 24V 235 20 230 10 225 0 -50 -25 0 25 50 75 100 125 150 Ta[℃] Temperature : Ta [°C] Figure 27. Oscillation Frequency at 250kHz vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VDTY[V] Input Voltage : VDTY [V] Figure 28. OUT Duty vs Input Voltage (VDTY-DUTY Characteristic at 250kHz) 18/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C 58.5 58.0 57.5 57.0 8V 10V 24V Duty : DutyL [%] Duty[%] Duty : DutyM [%] Duty[%] Typical Performance Curves - continued 56.5 55.5 10V 24V 55.0 54.5 54.0 53.5 53.0 52.5 8V 56.0 52.0 -50 -25 0 25 50 75 100 125 150 Ta[℃] Temperature : Ta [°C] -50 Figure 29. Duty at 100kHz vs Temperature -25 0 25 50 75 100 125 150 Ta[℃] Temperature : Ta [°C] Figure 30. Duty at 10kHz vs Temperature 59.0 1.0 0.8 Input Bias Current : IbVDTY [µA] Input Bias Current[uA] Duty : DutyH [%] Duty[%] 58.0 57.0 56.0 8V 10V 24V 55.0 54.0 0.6 25℃ 0.4 -40℃ 0.2 0.0 -0.2 -0.4 125℃ -0.6 -0.8 53.0 -1.0 -50 -25 0 25 50 75 100 125 150 Ta[℃] Temperature : Ta [°C] Figure 31. Duty at 250kHz vs Temperature www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 3 6 VDTY[V] Input Voltage : VDTY [V] 9 Figure 32. Input Bias Current vs VDTY Input Voltage 19/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Typical Performance Curves - continued 6 SD1 Output Voltage : VSD1 [V] SD1[V] SD2 Output Voltage : VSD2 [V] SD2 [V] 0.5 0.4 0.3 125℃ 25℃ 0.2 0.1 5 -40℃ -40℃ 4 3 25℃ 125℃ 25℃ 125℃ 2 1 -40℃ 0.0 0 0 5 10 IIsource[mA] SOURCE [mA] 15 20 0.8 1.0 1.0 0.9 0.8 0.8 125℃ 0.7 0.6 0.5 25℃ -40℃ 0.4 0.3 0.2 0.4 -0.2 20 24 -0.6 0 3 6 9 RFLV Input RFLV[V] Voltage : VRFLV [V] Figure 35. Protection Operation Delay Time vs Input Voltage (Low Voltage Detect Delay Time) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 125℃ -0.4 -1.0 16 25℃ 0.0 0.0 VDD1[V] Input Voltage : VDD1 [V] -40℃ 0.2 -0.8 12 1.3 0.6 0.1 8 1.0 1.1 1.2 VH[V] : VH [V] VH Input Voltage Figure 34. SD1 Output Voltage vs VH Input Voltage (Low Voltage Detect/Release Threshold) InputInput Bias Bias Current : IbVDTY Current [uA][µA] Protection Operation Delay Time [µs] Protection Operation Delay Time [V] Figure 33. SD2 Output Voltage 0.9 20/30 Figure 36. Input Bias Current vs RFLV Input Voltage TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Typical Performance Curves - continued 1.0 6 5 0.6 0.4 -40℃ SD1 Output Voltage : VSD1 [V] SD1[V] Input Bias Current : IbVDTY [µA] Input Bias Current[μ A ] 0.8 25℃ 0.2 0.0 -0.2 -0.4 125℃ -0.6 -40℃ -40℃ 4 25℃ 25℃ 3 125℃ 125℃ 2 1 -0.8 -1.0 0 0 3 6 VH[V] VH Input Voltage : VH [V] 9 1.0 1.0 0.9 0.8 0.8 125℃ 0.7 0.6 0.5 25℃ -40℃ 0.4 0.3 0.2 3.5 4.0 4.5 5.0 VACT[V] VACT Input Voltage : VACT [V] 5.5 Figure 38. SD1 Output Voltage vs VACT Input Voltage (Active High Voltage Detect/Release Threshold) Input Bias Current : IbVDTY [µA] Input Bias Current[μ A ] ProtectionOperation OperationDelay DelayTime Time [µs] Protection [μ s] Figure 37. Input Bias Current vs VH Input Voltage 3.0 0.6 0.4 0.2 125℃ 25℃ 0.0 -0.2 -0.4 -40℃ -0.6 -0.8 0.1 -1.0 0.0 8 12 16 20 VDD1[V] Input Voltage : VDD1 [V] 24 Figure 39. Protection Operation Delay Time vs Input Voltage (Active High Voltage Detect Delay Time) www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/30 0 3 6 VACT[V] VACT Input Voltage : VACT [V] 9 Figure 40. Input Bias Current vs VACT Input Voltage TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Typical Performance Curves - continued 1.0 Protection Operation Delay Time [µs] Protection Operation Delay Time[μ s] 6 SD1 Output Voltage : VSD1 [V] SD1[V] 5 4 -40℃ -40℃ 3 25℃ 2 25℃ 125℃ 125℃ 1 0.9 0.8 125℃ 0.7 0.6 0.5 25℃ 0.4 -40℃ 0.3 0.2 0.1 0.0 0 4.85 4.90 4.95 5.00 VH[V] : VH [V] VH Input Voltage 5.05 Figure 41. SD1 Output Voltage vs VH Input Voltage (High Voltage Detect/Release Threshold) 8 12 16 20 VDD1[V] Input Voltage : VDD1 [V] 24 Figure 42. Protection Operation Delay Time vs Input Voltage (High Voltage Detect/Release Threshold) Input InputBias BiasCurrent Current:[μIbVDTY A ] [µA] 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -40℃ 25℃ 125℃ -0.4 -0.6 -0.8 -1.0 0 3 6 RFOV[V] RFOV Input Voltage : VRFOV [V] 9 Figure 43. Input Bias Current vs RFOV Input Voltage www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C External Resistor (1) VH,VDTY External Resistors VH terminal is used to monitor the occurrences of over and under voltage condition. VDTY is used to determine the output Duty. Voltage is provided to both terminals by a voltage divider circuit. Over voltage is detected when VH voltage> RFOV, while under voltage is detected when VH< RFLV voltage×0.8. Voltage-divider resistor ratio is determined according to the high voltage to be monitored and to be detection voltage. When R3 of Figure 44 is removed, internal diodes clamp VH and VDTY voltages to VDD+Vf. At this condition, design the values of R1 and R2 that will keep VH and VDTY currents below 2mA. High高電圧 voltage voltage 電 High voltage 高電圧 VDD1 VDD1 R1 圧 R1 VH R2 Protection detection 保護検出 VDTY Max 2mA VH VDD1+Vf R2 電圧モニタ Voltage monitor R3 Max 2mA R3 VDTY オープン Open (High voltage-VDD1)/R1<2mA (高電圧-VDD1)/R1<2mA Figure 44. VH,VDTY Partial Resistance (2) RFOV,RFLV External Resistors RFOV sets the reference value for OVP, while RFLV sets the reference for UVP. The resistor values to be used should always keep the load current of REF below 5mA. Load current 負荷電流 REF RL1 RO1 (REF voltage/(RL1+RL2)) + (REF voltage/(RO1+RO2)) < 5mA RFOV RO2 RFLV RL2 Figure 45. RFOV,RFLV Partial Resistance (3) RT External Resistors RT terminal is used to set the current of the internal reference oscillator. Reference frequency is F_OSC=(1.0*10^6)/(RT resistance) [kHz]. Upper limit of set frequency is 250 kHz (RT=4kΩ), and lower limit is 10 kHz (RT=100kΩ). RT Resistance Frequency 100kΩ 10kHz 10kΩ 100kHz 4kΩ 250kHz Figure 46. RT Resistance and Frequency (4) SD2 Resistance SD2 terminal is an open drain output terminal. Connect pull-up resistor between SD2 and power source to use it. RSD resistance value should keep the current of SD2 terminal below 20mA. VBAT RSD SD2 VBAT/RSD<20mA Figure 47. SD2 Resistance www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Power Dissipation Measurement instrument: TH156 (Kuwano Electric) State of measurement: mounted Rohm substrate 3 Substrate size: 70×70×1.6 mm 1 layer substrate: Өja=105.3°C/W PowerDissipation:P Dissipation :dPd Power [W][W] 1.5 1.19W 1.0 0.5 0 0 25 50 75 100 125 150 Ambient Temperature:T a[℃] Ambient Temperature : Ta [°C] Figure 48. Power Dissipation vs Ambient Temperature (SSOP-B20W) Thermal Dissipation Considering the power consumption (P), package power (Pd), and ambient temperature (Tj) of this IC, do not expose the chip to temperature exceeding 150°C. If Tj exceeds 150C, the chip malfunctions and problems caused by significant effect of parasitic elements and increase in leakage current will occur. Constant use of the IC under the said conditions may deteriorate the IC and further lead to its breakdown. Strictly keep Tjmax at 150C under any circumstances. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C I/O Equivalent Circuits ○VDTY, RFOV, RFLV ○VACT ○REF VDD1 VDD1 VDD1 REF Internal power supply VDD1 Internal power supply VACT GND1 GND1 VDTY RFOV RFLV GND1 GND1 ○RT ○VH VDD1 Internal power supply REF VDD1 RT VH Internal power supply GND1 GND1 ○OUT,SD1 ○SD2 VDD2 VDD2 SD2 OUT SD1 GND2 GND2 GND GND 2 2 www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned OFF completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Operational Notes – continued 12. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Pin B B GND Parasitic Elements GND N Region close-by Figure 49. Example of Monolithic IC Structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Over-Current Protection Circuit (OCP) This IC has a built-in overcurrent protection circuit that activates when the output is accidentally shorted. However, it is strongly advised not to subject the IC to prolonged shorting of the output. www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Ordering Information B M 6 7 2 Part Number 9 0 F V Package FV: SSOP-B20W CE 2 Package, forming specifications E2: Reel type embossed taping (SSOP-B20W) None: Tray, tube Marking Diagram SSOP-B20W (TOP VIEW) Part Number Marking BM67290 LOT Number 1PIN MARK www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 28/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SSOP-B20W 29/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 BM67290FV-C Revision History Date Revision 10.Nov.2014 001 Changes New Release www.rohm.com © 2014 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30/30 TSZ02201-0727ABZ00010-1-2 10.Nov.2014 Rev.001 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-SS © 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001