NSR0170P2T5G Schottky Barrier Diode Schottky barrier diodes are optimized for very low forward voltage drop and low leakage current and are used in a wide range of dc-dc converter, clamping and protection applications in portable devices. NSR0170P2 in a SOD-923 miniature package enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. http://onsemi.com Features 70 V SCHOTTKY BARRIER DIODE •Very Low Forward Voltage Drop - 560 mV @ 10 mA •Low Reverse Current - 25 nA @ 50 V VR •70 mA of Continuous Forward Current •Power Dissipation of 240 mW with Minimum Trace •Very High Switching Speed •Low Capacitance - CT = 2 pF •This is a Pb-Free Device 1 CATHODE Typical Applications 1 MG G 2 Q = Specific Device Code M = Month Code G = Pb-Free Package (Note: Microdot may be in either location) •Mobile Handsets •MP3 Players •Digital Camera and Camcorders •Notebook PCs & PDAs •GPS ORDERING INFORMATION MAXIMUM RATINGS Symbol Value Unit Reverse Voltage VR 70 V Forward Current (DC) IF 70 mA Human Body Model Machine Model Q 1 SOD-923 CASE 514AB PLASTIC Markets ESD Rating: MARKING DIAGRAM 2 •LCD and Keypad Backlighting •Camera Photo Flash •Buck and Boost dc-dc Converters •Reverse Voltage and Current Protection •Clamping & Protection Rating 2 ANODE ESD Device Package Shipping† NSR0170P2T5G SOD-923 (Pb-Free) 2 mm Pitch 8000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Class 2 Class B Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2008 April, 2008 - Rev. 0 1 Publication Order Number: NSR0170P2/D NSR0170P2T5G THERMAL CHARACTERISTICS Characteristic Thermal Resistance Junction-to-Ambient (Note 1) Total Power Dissipation @ TA = 25°C Thermal Resistance Junction-to-Ambient (Note 2) Total Power Dissipation @ TA = 25°C Symbol Junction and Storage Temperature Range Min Typ Max Unit RqJA PD 520 240 °C/W mW RqJA PD 175 710 °C/W mW TJ, Tstg -55 to +150 °C Typ Max Unit 25 - 90 3.0 nA mA 0.34 0.56 0.65 0.39 0.64 0.73 1. Mounted onto a 4 in square FR-4 board 10 mm sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state. 2. Mounted onto a 4 in square FR-4 board 1 in sq. 1 oz. Cu 0.06” thick single sided. Operating to steady state. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol IR Forward Voltage (IF = 1.0 mA) (IF = 10 mA) (IF = 15 mA) VF Total Capacitance (VR = 0 V, f = 1 MHz) CT 1000 100 100 10 Min V 2.0 pF Ir, REVERSE CURRENT (mA) 150°C 150°C 10 125°C 1 85°C 0.1 25°C 0.01 -40°C 0.001 0 0.2 0.4 125°C 1 85°C 0.1 25°C 0.01 0.001 -40°C 0.0001 0.00001 0.6 0.8 1.0 1.2 1.4 0 1.6 10 20 30 40 50 VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 1. Forward Voltage Figure 2. Leakage Current 2.5 CT, TOTAL CAPACITANCE (pF) IF, FORWARD CURRENT (mA) Reverse Leakage (VR = 50 V) (VR = 70 V) TA = 25°C 2.0 1.5 1.0 0.5 0 0 10 20 30 40 50 60 VR, REVERSE VOLTAGE (V) Figure 3. Total Capacitance http://onsemi.com 2 70 80 60 70 NSR0170P2T5G PACKAGE DIMENSIONS SOD-923 CASE 514AB-01 ISSUE B -X- D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. -YE 1 b 2 2X 0.08 (0.0032) X Y DIM A b c D E HE L A c L HE MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.15 0.20 0.25 0.07 0.12 0.17 0.75 0.80 0.85 0.55 0.60 0.65 0.95 1.00 1.05 0.05 0.10 0.15 MIN 0.013 0.006 0.003 0.030 0.022 0.037 0.002 INCHES NOM 0.015 0.008 0.005 0.031 0.024 0.039 0.004 MAX 0.016 0.010 0.007 0.033 0.026 0.041 0.006 SOLDERING FOOTPRINT* 0.90 0.40 0.30 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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