Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 10 June 2016, 12:00 GMT Diotec Semiconductor AG DUNS-Nummer: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations Autorisiert durch: Udo Steinebrunner, Product Manager, - Deklaration gilt ab: 11 December 2012 [Approved on 10 June 2016, 11:58 GMT] Materialien und Stoffe Verwendung/Andordnung Material group Chip (die) Other inorganic materials Die attach Encapsulation Leadfinish Leadframe Page 1 % w/w des Materials im Artikel 0.43000% Lead and 0.24000% Lead alloys EP (Epoxy resin) Tin plating Copper alloys 49.04000% 0.51000% 49.78000% Substances in the material CAS Number % w/w des Stoffs im Artikel Gold 7440-57-5 1.50000% Silicon dioxide 14808-60-7 5.05000% Silicon 7440-21-3 93.45000% Silver 7440-22-4 2.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 92.50000% Carbon black 1333-86-4 0.30000% ANTIMONY TRIOXIDE 1309-64-4 0.80000% 3,5,3â¬5â‐ Tetrabromobisphenol A (TBBA) 79-94-7 0.99000% Epoxy resin 89 26335-32-0 27.61000% Quartz silica 14808-60-7 70.30000% Copper 7440-50-8 0.50000% Nickel 8049-31-8 0.60000% Silver 7440-22-4 3.00000% Tin 7440-31-5 95.90000% iron 14127-53-8 2.00000% Copper 7440-50-8 98.00000% Report generated: 10 June 2016, 12:00 GMT Full Material Declaration for attached parts list Beigefügte Artikelliste Part number Artikelbezeichnung Artikelmasse Artikelmasse UoM DBIxx-xxX Bridge Rectifier Three phase 9 g Page 2 Report generated: 10 June 2016, 12:00 GMT