MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 21 June 2016, 16:25 GMT
Diotec Semiconductor AG
DUNS-Nummer: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations Autorisiert durch:
Udo Steinebrunner, Product Manager, -
Deklaration gilt ab: 1 January 2007 [Approved on 21 June 2016, 16:24 GMT]
Materialien und Stoffe
Verwendung/Andordnung
Chip (die)
Die attach
Encapsulation
Leadfinish
Leadframe
Material
group
Other
inorganic
materials
Lead and Lead
alloys
% w/w des
Materials
im Artikel
2.00000%
1.20000%
Other
40.00000%
thermoplastics
Tin plating
Copper alloys
0.50000%
56.30000%
Substances in the
material
CAS Number
% w/w des
Stoffs im
Artikel
Nickel
8049-31-8
1.00000%
Gold
7440-57-5
11.50000%
Polydimethylsiloxane
63394-02-5
rubber
25.00000%
Silicon
7440-21-3
62.50000%
SILVER METAL
7440-22-4
2.50000%
Tin
7440-31-5
5.00000%
Lead
7439-92-1
92.50000%
Carbon black
1333-86-4
0.30000%
ANTIMONY
TRIOXIDE
1309-64-4
0.80000%
3,5,3​â​¬5​â​‐
Tetrabromobisphenol A (TBBA)
79-94-7
0.99000%
Epoxy resin 89
26335-32-0
27.61000%
Quartz silica
14808-60-7
70.30000%
Copper
7440-50-8
0.70000%
Silver
7440-22-4
2.80000%
Tin
7440-31-5
96.50000%
Copper
7440-50-8
100.00000%
Beigefügte Artikelliste
Part number
Artikelbezeichnung
Artikelmasse
Artikelmasse
UoM
GBUxxX
Bridge Rectifier Single Inline
3.8
g
Page 1
Report generated: 21 June 2016, 16:25 GMT