Ground Fault Circuit Interrupter (GFCI)

NCS37000
Ground Fault Circuit
Interrupter (GFCI)
Description
Features
• 6.0 – 12 Volt Operation (120 − 480 V AC mains with the appropriate
•
•
•
•
•
•
•
•
•
•
series impedance)
−40 to 85°C
Very Low Power Consumption: <5 mW @ 5 V
16 Pin QFN Package or 20 Pin TSSOP Package
Single Current Transformer (CT) Detection of both Differential and
Grounded−Neutral Faults
Self Syncing Internal Oscillator Adjusts to AC Mains Frequency to
Guarantee Full Resolution on 50 and 60 Hz Distribution Systems
Optimized Solenoid Deployment (coil is not energized near the AC
mains zero crossings)
Randomized Testing Sequence to Minimize Noise and Potential
Interactions on the AC Mains
>5 mA SCR Driver for use with High Igt SCR’s for Improved Noise
Immunity
Superior Immunity to Nuisance Loads/Noise (up to 10 A) without
Loss of Detection Capability or CT Saturation
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
http://onsemi.com
20
1
QFN16
MN SUFFIX
CASE 485G
TSSOP−20
DA SUFFIX
CASE 948E
1
MARKING DIAGRAMS
37000
MNG
ALYW
G
3700
0DBG
ALYWG
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
Supply
SCRdrv
The NCS37000 is a fully UL943 compliant signal processor for
GFCI applications. The device integrates a flexible power supply
(including both shunt and LDO regulators), differential fault, and
grounded-neutral detection circuits. Proprietary impedance
measurement and signal processing techniques are used to minimize
the number of external components and improve performance. The
device also includes a specialized DSP controller that offers best in
class immunity to nuisance loads without the need for external analog
filters.
MLD
CTresGN
CTbias
CTstim
1
(Top View)
CTresD
IDF
• Load Panel GFCI Breakers
• GFCI Receptacles
• In−line GFCI Circuits (power cords)
GND
ORDERING INFORMATION
Device
NCS37000MNTWG
NCS37000MNG
NCS37000DBRG
NCS37000DBG
Package
Shipping†
2500/Tape & Reel
QFN16
(Pb−Free) 120 Units / Tube
TSSOP20 2500/Tape & Reel
(Pb−Free) 74 Units / Tube
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
December, 2012 − Rev. 0
1
Publication Order Number:
NCS37000/D
Supply
NCS37000
−
HV
Bandgap
Brown
Out
+
AVDD/
DVDD
−
+
POR
CTresGN
Grounded Neutral
Detection
IDF
Low
Pass
Filter
Differential Current
Detection
SCRdrv
Mixer
Self
Trimmed
RC Osc
CTresD
Control Logic and
Digital Filter
TE
Offset
Correction
Driver
CTstim
Waveform
Generator
TestDin1−5
TestDout1−2
Vbias
MLD
G2N
Randomizer
VSS
CTbias
Figure 1. Simplified Block Diagram
http://onsemi.com
2
Mains Level
Detect (Zero
Cross)
NCS37000
Table 1. PIN FUNCTION DESCRIPTION − QFN
Pin #
Name
Pad Description
0
Ground
1
MLD
2
CTresGN
3
CTbias
Direct connection to the CT
4
CTstim
Direct connection to the CT
5
CTresD
Determines IV converter gain for detection threshold / matched to CT turns ratio (Differential Current)
6
IDF
Front end noise filter capacitor
7
NC
Tie to Ground or leave floating
8
NC
Float
QFN center slug
Mains Level Detect (Zero Cross)
Determines IV converter gain for detection threshold / matched to CT turns ratio (Ground-Neutral)
9
NC
Tie to Ground or leave floating
10
NC
Tie to Ground or leave floating
11
NC
Tie to Ground or leave floating
12
NC
Tie to Ground or leave floating
13
NC
Float
14
NC
Float
15
SCRdrv
Used to trigger the solenoid at a fault detection
16
Supply
Power supply
Table 2. PIN FUNCTION DESCRIPTION − TSSOP
Pin #
Name
Pad Description
1
CTstim
Differential and ground to neutral stimulus point for the current transformer
2
Ground
Ground connection for IC
3
CTresD
Determines IV converter gain for detection threshold / matched to CT turns ratio (Differential Current)
4
IDF
5
GFtest
6
NC
Tie to Ground or leave floating
7
NC
Float
8
NC
Tie to Ground or leave floating
9
NC
Tie to Ground or leave floating
10
NC
Tie to Ground or leave floating
Determines corner frequency of the differential current path filter
Output to induce external differential current
11
Ground
12
NC
Ground connection for IC
Float
13
NC
Float
14
SCRdrv
15
DVDD
Internal digital 5 V regulated supply
16
AVDD
Internal analog 5 V regulated supply
17
Supply
12 V shunt regulated power supply
18
MLD
19
CTresGN
20
CTbias
Used to trigger the solenoid at a fault detection
Mains Level Detect (Zero Cross) and AM slope detect (for oscillator sync/trim and AM init)
Determines IV converter gain for detection threshold / matched to CT turns ratio (Ground-Neutral)
External 2 V bias for the current transformer
http://onsemi.com
3
NCS37000
Table 3. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Supply Voltage Range
Vs
6.0 to 12 V
V
Input Voltage Range (Note 1)
Vin
−0.3 to 6.0
V
Output Voltage Range
Vout
−0.3 to 6.0 V or (Vin + 0.3),
whichever is lower
V
TJ(max)
140
°C
TSTG
−65 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2
kV
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
TSLD
260
°C
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions (Note 3)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
Table 4. THERMAL CHARACTERISTICS
Rating
Symbol
Value
Thermal Characteristics, QFN16, 3x3.3 mm (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
RqJA
64
Thermal Characteristics, TSOP−5 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
RqJA
118.6
Unit
°C/W
°C/W
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
Table 5. OPERATING RANGES (Note 6)
Parameter
Conditions
Operating Temperature
Min
−40
IDD in typical power state
Stimulus Generator Frequency
Typ
Max
Units
85
C
2.0
Tri−tone
3.1
SCR Trigger Current
mA
3.4
kHz
8.0
mA
5.5
V
5.0
mA
SCR Trigger output voltage
With 5 V supply
4.5
Fault Current Sensitivity
Programmable with CTresD
4.6
Ground Fault Response Time
5 − 20 mA
150
ms
Ground Fault Response Time
20 − 40 mA
75
ms
4.8
Ground Fault Response Time
>40 mA
25
ms
Saturation Fault Response Time
>300 mA
1.4
ms
CT Turns Ratio
Ground – Neutral Detection Threshold
Total series impedance (Rn and Rg)
200
300
3.0
6.0
Internal Oscillator Frequency
CT Stimulus Current
2.0
Internally limited
CT Driver Closed Loop BW
6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
http://onsemi.com
4
W
MHz
1.0
mA
500
kHz
NCS37000
LINE
PHASE
NEUTRAL
APPLICATIONS INFORMATION
solenoid
tvs
ResMain
CapSup
NC
NC
Supply
SCRdrv
ResMLD
NC
MLD
CapBIAS
CTresGN
NC
CTbias
TE
CTstim
NC
ResGN
CapGN
CapCT
PHASE
NEUTRAL
ResD
CapIDF
LOAD
Figure 2. Typical Application Schematic
http://onsemi.com
5
NC
NC
IDF
CTresD
ResCT
NCS37000
RECOMMENDED EXTERNAL COMPONENTS:
Component Type
Instance
Value
Note
SCR
Q1
−
ON−MCR08
Diode
Dx
−
ON−1N4007
Capacitor
Csup
1 − 5 mF
For a full bridge rectifier
Capacitor
Cgn
2 − 10 nF
Low pass corner frequency for GN detection
Capacitor
Cidf
220 nF
1kHz differential corner frequency
Capacitor
Cct
2.2 − 5 nF
Match to current transformer for resonance
Capacitor
Cbias
10 nF
Added for filtering
Resistor
RctresD
40 − 80K
Matched to current transformer
Resistor
RctGN
100 − 400K
Matched to current transformer
Resistor
Rzc
400 − 800K
Zero cross detector shunt resistance
Resistor
Rmains
10 − 20K
For a full bridge rectifier
TVS
T1
−
~250 − 400 V
Filtering
ground to neutral resistance trip level. Higher CTresGN
values will cause the part to trip at higher ground to neutral
impedances.
CtresGN = #Turns^2 x Rt/2 – Subject to CT efficiency from
3 kHz to 4 kHz
The analog signal capture portion of the IC includes a
single pole filter that can be set externally with Cidf. This
provides an additional layer of protection against false
tripping under steady state noise conditions. High frequency
steady state noise is common with pumps, motors or other
cyclic noise generators.
Cidf = 220 nF = 1 KHz low pass.
Setting Grounded−Neutral response time
Cgn is used to define the response time of the
grounded−neutral detection circuit. The analog portion
converts the impedance into a DC voltage and a high
frequency (aliased) component. The capacitor is used to
remove the high frequency component leaving just the DC
representation of the impedance.
CTcapGN= 1.8E-4/CTresGN
Setting Trip Sensitivity
The CTresD resistor sets the threshold for the differential
current fault levels. Increasing CTresD causes the fault
levels to trip at lower differential currents. CT efficiency at
60 Hz must be considered.
CTresD= 200*#Turns – Subject to CT efficiency at 60 Hz
The CTresGN resistor sets the threshold for ground to
neutral fault detection. The Rt parameter is the desired
http://onsemi.com
6
NCS37000
PACKAGE DIMENSIONS
TSSOP−20
CASE 948E−02
ISSUE C
20X
0.15 (0.006) T U
2X
L
K REF
0.10 (0.004)
S
L/2
20
M
T U
S
V
K
K1
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
S
J J1
11
B
−U−
PIN 1
IDENT
SECTION N−N
0.25 (0.010)
N
1
10
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
G
D
H
DETAIL E
0.100 (0.004)
−T− SEATING
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
--1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
PLANE
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
16X
0.36
16X
1.26
DIMENSIONS: MILLIMETERS
http://onsemi.com
7
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
--0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
NCS37000
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485G
ISSUE F
D
ÇÇÇ
ÇÇÇ
ÇÇÇ
PIN 1
LOCATION
2X
A
B
L
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
E
ÉÉ
ÉÉ
EXPOSED Cu
0.10 C
TOP VIEW
DETAIL B
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
0.10 C
2X
L
(A3)
ÉÉ
ÇÇ
ÇÇ
A3
A1
DETAIL B
A
0.05 C
MOLD CMPD
ALTERNATE
CONSTRUCTIONS
NOTE 4
A1
SIDE VIEW
C
16X
L
RECOMMENDED
SOLDERING FOOTPRINT*
D2
8
4
16X
MILLIMETERS
MIN
NOM MAX
0.80
0.90
1.00
0.00
0.03
0.05
0.20 REF
0.18
0.24
0.30
3.00 BSC
1.65
1.75
1.85
3.00 BSC
1.65
1.75
1.85
0.50 BSC
0.18 TYP
0.30
0.40
0.50
0.00
0.08
0.15
SEATING
PLANE
0.10 C A B
DETAIL A
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
9
E2
K
16X
0.58
PACKAGE
OUTLINE
1
2X
1
2X
1.84 3.30
16
e
e/2
BOTTOM VIEW
16X
b
16X
0.10 C A B
0.05 C
0.30
NOTE 3
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
8
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCS37000/D