NCS37005 Product Preview Ground Fault Interrupter (GFI) Description The NCS37005 is a signal processor for GFI applications. The device integrates a flexible power supply (including both shunt and LDO regulators), and differential fault detection circuits. The proprietary fault processing circuitry offers high performance with low turns ratio ferrite current transformers. The device also includes a specialized DSP controller that offers best in class immunity to nuisance loads without the need for external analog filters. http://onsemi.com 16 1 QFN 16 MN SUFFIX CASE 485G TSSOP 16 DA SUFFIX CASE 948F 1 Features • • • • • • • • • • Series Impedance) −40 to 85°C Very Low Power Consumption: <5 mW @ 5 V 16 Pin QFN Package Low Cost/Turns Ratio Ferrite Current Transformer (CT) Detection of Differential Self Syncing Internal Oscillator Adjusts to AC Mains Frequency to Guarantee Full Resolution on 50 and 60 Hz Distribution Systems Optimized Solenoid Deployment (coil is not energized near the AC mains zero crossings) Randomized Testing Sequence to Minimize Noise and Potential Interactions on the AC Mains >5 mA SCR Driver for Additional Immunity to Supply Noise/Interference Superior Immunity to Nuisance Loads/Noise (up to 10 A) without Loss of Detection Capability or CT Saturation These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MARKING DIAGRAM XXXXX ALYWG CCCCC XXXXX A L Y W G or G CCCCC = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package = Country of Origin PIN CONNECTIONS Supply SCRdrv • 6.0 – 18 Volt Operation (120 − 480 V AC Mains with the Appropriate MLD CTresGN CTbias CTstim 1 GND (Top View) Typical Applications CTresD IDF • Load Panel GFI/RCD Breakers • GFI Receptacles • In−line GFI Circuits (power cords) This document contains information on a product under development. ON Semiconductor reserves the right to change or discontinue this product without notice. ORDERING INFORMATION Device Package Shipping† NCS37005MNTWG QFN16 Tape & Reel NCS37005MNG QFN16 Tube NCS37005DARG TSSOP20 Tape & Reel NCS37005DAG TSSOP20 Tube †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2012 April, 2012 − Rev. P0 1 Publication Order Number: NCS37005/D Supply NCS37005 − HV Bandgap Brown Out + AVDD/ DVDD − + POR CTresGN Grounded Neutral Detection IDF Low Pass Filter Differential Current Detection SCRdrv Mixer Self Trimmed RC Osc CTresD Control Logic and Digital Filter TE Offset Correction Driver CTstim Waveform Generator TestDin1−5 TestDout1−2 Vbias MLD G2N Randomizer VSS CTbias Figure 1. Simplified Block Diagram http://onsemi.com 2 Mains Level Detect (Zero Cross) NCS37005 Table 1. PIN FUNCTION DESCRIPTION − QFN Pin # Name Pad Description 0 Ground 1 MLD 2 CTtest Test port (Must be tied to CTbias in functional mode). 3 CTbias 2 V reference that is connected to the external CT sensor 4 CTstim Differential current measurement port for external CT 5 CTresD Determines IV converter gain for detection threshold / matched to CT turns ratio (Differential Current) 6 IDF Front end noise filter capacitor 7 NC Tie to Ground or leave floating 8 NC Tie to Ground or leave floating QFN center slug Mains Level Detect (Zero Cross) 9 NC Tie to Ground or leave floating 10 NC Tie to Ground or leave floating 11 NC Tie to Ground or leave floating 12 NC Tie to Ground or leave floating 13 NC Float 14 NC Float 15 SCRdrv Used to trigger the solenoid at a fault detection 16 Supply Power supply Table 2. PIN FUNCTION DESCRIPTION − TSSOP Pin # Name Pad Description 1 CTstim Differential current measurement port for external CT 2 Ground Main ground connection for IC. 3 CTresD Determines IV converter gain for detection threshold / matched to CT turns ratio (Differential Current) 4 IDF Front end noise filter capacitor 5 TE Test enable 6 NC Tie to Ground or leave floating 7 NC Tie to Ground or leave floating 8 NC Tie to Ground or leave floating 9 NC Tie to Ground or leave floating 10 NC Tie to Ground or leave floating 11 NC Float 12 NC Float 13 SCRdrv Used to trigger the solenoid at a fault detection 14 Supply Power supply 15 MLD 16 CTbias Mains Level Detect (Zero Cross) 2 V reference that is connected to the external CT sensor http://onsemi.com 3 NCS37005 Table 3. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Supply Voltage Range Vs 6.0 to 19 V V Input Voltage Range (Note 1) Vin −0.3 to 6.0 V Output Voltage Range Vout −0.3 to 6.0 V or (Vin + 0.3), whichever is lower V Maximum Junction Temperature TJ(max) 140 °C Storage Temperature Range TSTG −65 to 150 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2 kV ESD Capability, Machine Model (Note 2) ESDMM 200 V TSLD 260 °C Lead Temperature Soldering Reflow (SMD Styles Only), Pb−Free Versions (Note 3) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating: v150 mA per JEDEC standard: JESD78 3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D Table 4. THERMAL CHARACTERISTICS Rating Symbol Value RθJA RψJL 64 Thermal Characteristics, QFN16, 3x3.3 mm (Note 4) Thermal Resistance, Junction−to−Air (Note 5) Thermal Reference, Junction−to−Lead2 (Note 5) Thermal Characteristics, TSOP−5 (Note 4) Thermal Resistance, Junction−to−Air (Note 5) Unit °C/W °C/W RθJA 4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Table 5. OPERATING RANGES (Note 6) Parameter Conditions Operating Temperature Min Typ −40 IDD Max Units 85 C 2 SCR Trigger Current mA 8 SCR Trigger output voltage With 5 V supply 4.5 Fault Current Sensitivity Ground Fault with ±1% resistor for RctresD 4.5 Ground Fault Response Time mA 5 V 5.5 mA 5−20 mA 150 ms Ground Fault Response Time 20−100 mA 75 ms Ground Fault Response Time >100 mA 25 ms CT Turns Ratio 5 100 Internal Oscillator Frequency 300 2 CT Driver Closed Loop BW MHz 500 6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. http://onsemi.com 4 KHz NCS37005 APPLICATIONS INFORMATION Q1 Solenoid Rmains Dx Full Wave Rectifier or Switch mode supply T1 SCRdrv Csup Supply Rzc MLD CTresGN Cgn CTbias CTresD IDF CTstim Cidf RctD Figure 2. Typical Application Schematic http://onsemi.com 5 NCS37005 RECOMMENDED EXTERNAL COMPONENTS: Component Type Instance Value Note SCR Q1 − ON−MCR08 Diode Dx − ON−1N4007 Capacitor Csup 1 − 4.7 mF For a full bridge rectifier Capacitor Cidf 180 − 220 nF Differential current filtering Resistor RctD 20 − 70 K Matched to current transformer Resistor Rzc 400 − 800 K Zero cross detection resistor. Value limits current Resistor Rmains 10 − 45 K For a full bridge rectifier TVS T1 − ~250 − 400 V Filtering Setting Trip Sensitivity The analog signal capture portion of the IC includes a single pole filter that can be set externally with Cidf. This provides an additional layer of protection against false tripping under steady state noise conditions. High frequency steady state noise is common with pumps, motors or other cyclic noise generators. Cidf = 220 nF = 1 KHz low pass. The CTresD resistor sets the threshold for the differential current fault levels. Increasing CTresD causes the fault levels to trip at lower differential currents. CT efficiency at 60 Hz must be considered. . CTresD= 400*#Turns – Subject to CT efficiency at 60 Hz http://onsemi.com 6 NCS37005 PACKAGE DIMENSIONS TSSOP−16 CASE 948F−01 ISSUE B 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S K S ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. N 8 1 0.25 (0.010) M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 0.36 16X 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 7 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ NCS37005 PACKAGE DIMENSIONS QFN16 3x3, 0.5P CASE 485G−01 ISSUE F D ÇÇÇ ÇÇÇ ÇÇÇ PIN 1 LOCATION 2X A B DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E ÉÉ ÉÉ EXPOSED Cu 0.10 C TOP VIEW (A3) DETAIL B 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L1 0.10 C 2X L L A1 DETAIL B A 0.05 C ÉÉ ÇÇ ÉÉ A3 MOLD CMPD ALTERNATE CONSTRUCTIONS NOTE 4 A1 SIDE VIEW C 16X L RECOMMENDED SOLDERING FOOTPRINT* D2 8 4 16X MILLIMETERS MIN NOM MAX 0.80 0.90 1.00 0.00 0.03 0.05 0.20 REF 0.18 0.24 0.30 3.00 BSC 1.65 1.75 1.85 3.00 BSC 1.65 1.75 1.85 0.50 BSC 0.18 TYP 0.30 0.40 0.50 0.00 0.08 0.15 SEATING PLANE 0.10 C A B DETAIL A DIM A A1 A3 b D D2 E E2 e K L L1 9 E2 K 16X 0.58 PACKAGE OUTLINE 1 2X 1 2X 1.84 3.30 16 e e/2 BOTTOM VIEW 16X b 0.10 C A B 0.05 C 16X 0.30 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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