Dual J-K Master-Slave Flip-Flop

MC10135
Dual J-K Master-Slave
Flip-Flop
The MC10135 is a dual master–slave dc coupled J–K flip–flop.
Asynchro– nous set (S) and reset (R) are provided. The set and reset
inputs override the clock.
A common clock is provided with separate J–K inputs. When the
clock is static, the J–K inputs do not effect the output.
The output states of the flip–flop change on the positive transition of
the clock.
• PD = 280 mW typ/pkg (No Load)
• fTog = 140 MHz typ
• tpd = 3.0 ns typ
• tr, tf = 2.5 ns typ (20%–80%)
DIP PIN ASSIGNMENT
S1 5
VCC1
1
16
VCC2
J1 7
Q1
2
15
Q2
K1 6
Q1
3
14
Q2
R1
4
13
R2
S1
5
12
S2
K1
6
11
K2
J1
7
10
J2
9
C
VEE
8
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MARKING
DIAGRAMS
16
CDIP–16
L SUFFIX
CASE 620
1
16
LOGIC DIAGRAM
Q1
2
Q1
3
PDIP–16
P SUFFIX
CASE 648
1
1
C 9
PLCC–20
FN SUFFIX
CASE 775
S2 12
J2 10
Q2
15
K2
11
Q2
14
A
WL
YY
WW
R2 13
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
CLOCK J–K TRUTH TABLE*
R
S
Qn+1
J
K
Qn+1
L
L
H
H
L
H
L
H
Qn
H
L
N.D.
L
H
L
H
L
L
H
H
Qn
L
H
Qn
 Semiconductor Components Industries, LLC, 2002
January, 2002 – Rev. 7
10135
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
N.D. = Not Defined
MC10135P
AWLYYWW
R1 4
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 18 of the ON Semiconductor MECL
Data Book (DL122/D).
R–S TRUTH TABLE
MC10135L
AWLYYWW
Package
Shipping
MC10135L
CDIP–16
25 Units / Rail
MC10135P
PDIP–16
25 Units / Rail
MC10135FN
PLCC–20
46 Units / Rail
* Output states change on positive
transition of clock for J–K input
condition present.
1
Publication Order Number:
MC10135/D
MC10135
ELECTRICAL CHARACTERISTICS
Test Limits
Characteristic
Symbol
Pin
Under
Test
Power Supply Drain Current
IE
8
75
IinH
6,7,9,10,11
4,5,12,13
425
620
IinL
4,5,6,7,9,
10,11,12,13
0.5
0.5
Input Current
–30°C
Min
+25°C
Max
Min
+85°C
Typ
Max
Max
Unit
54
68
75
mAdc
265
390
265
390
µAdc
0.5
0.5
Min
µAdc
0.3
0.3
Output Voltage
Logic 1
VOH
2
2 (3.)
–1.060
–1.060
–0.890
–0.890
–0.960
–0.960
–0.810
–0.810
–0.890
–0.890
–0.700
–0.700
Vdc
Output Voltage
Logic 0
VOL
3
3 (3.)
–1.890
–1.890
–1.675
–1.675
–1.850
–1.850
–1.650
–1.650
–1.825
–1.825
–1.615
–1.615
Vdc
Threshold Voltage
Logic 1
VOHA
2
2 (4.)
–1.080
–1.080
Threshold Voltage
Logic 0
VOLA
3
3 (4.)
–0.980
–0.980
–0.910
–0.910
–1.655
–1.655
–1.630
–1.630
Vdc
–1.595
–1.595
Switching Times (50Ω Load)
Clock Input
Propagation Delay
Vdc
ns
t9+2+
t9+2–
2
2
1.8
1.8
5.0
5.0
1.8
1.8
3.0
3.0
4.5
4.5
1.8
1.8
4.6
4.6
Rise Time
(20 to 80%)
t2+, t3+
2, 3
1.1
4.8
1.1
2.0
4.5
1.1
4.7
Fall Time
(20 to 80%)
t2–, t3–
2, 3
1.1
4.8
1.1
2.0
4.5
1.1
4.7
Set Input
ns
Propagation Delay
t5+2+
t12+15+
t5+3–
t12+14–
2
15
3
14
1.8
1.8
1.8
1.8
5.6
5.6
5.6
5.6
1.8
1.8
1.8
1.8
3.0
3.0
3.0
3.0
5.0
5.0
5.0
5.0
1.8
5.2
5.2
5.2
5.2
Reset Input
Propagation Delay
ns
t4+2–
t4+3–
t13+15–
t13+14+
2
3
15
14
1.8
1.8
1.8
1.8
Setup Time
tsetup
7
Hold Time
thold
7
Toggle Frequency (Max)
ftog
2
5.6
5.6
5.6
5.6
1.8
1.8
1.8
1.8
3.0
3.0
3.0
3.0
2.5
2.5
1.0
2.5
ns
1.5
1.5
1.0
2.5
ns
125
125
140
125
MHz
1. Individually test each input; apply VIHmax to pin under test.
2. Individually test each input; apply VILmin to pin under test.
3. Output level to be measured after a clock pulse has been applied to the CE Input (Pin 6)
4. Output level to be measured after a clock pulse has been applied to the CE Input (Pin 6)
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2
5.0
5.0
5.0
5.0
1.8
1.8
1.8
1.8
VIHmax
VILmin
VIHAmax
VILAmin
5.2
5.2
5.2
5.2
MC10135
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
Characteristic
Power Supply Drain Current
Input Current
@ Test Temperature
VIHmax
VILmin
VIHAmin
VILAmax
VEE
–30°C
–0.890
–1.890
–1.205
–1.500
–5.2
+25°C
–0.810
–1.850
–1.105
–1.475
–5.2
+85°C
–0.700
–1.825
–1.035
–1.440
–5.2
Symbol
Pin
Under
Test
IE
8
IinH
6,7,9,10,11
4,5,12,13
IinL
4,5,6,7,9,
10,11,12,13
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
VIHmax
VILmin
VIHAmin
VILAmax
Note 1.
Note 1.
Note 2.
Note 2.
VEE
(VCC)
Gnd
8
1, 16
8
8
1, 16
1, 16
8
8
1, 16
1, 16
Output Voltage
Logic 1
VOH
2
2 (3.)
5
6
8
8
1, 16
1, 16
Output Voltage
Logic 0
VOL
3
3 (3.)
5
6
8
8
1, 16
1, 16
Threshold Voltage
Logic 1
VOHA
2
2 (4.)
5
6
8
8
1, 16
1, 16
3
3 (4.)
5
6
8
8
1, 16
1, 16
Threshold Voltage
Switching Times
Clock Input
Logic 0
VOLA
(50Ω Load)
Propagation Delay
Pulse In
Pulse Out
–3.2 V
+2.0 V
t9+2+
t9+2–
2
2
9
9
2
2
8
8
1, 16
1, 16
Rise Time
(20 to 80%)
t2+, t3+
2, 3
9
2, 3
8
1, 16
Fall Time
(20 to 80%)
t2–, t3–
2, 3
9
2, 3
8
1, 16
Propagation Delay
t5+2+
t12+15+
t5+3–
t12+14–
2
15
3
14
5
12
5
12
2
15
3
14
8
8
8
8
1, 16
1, 16
1, 16
1, 16
Propagation Delay
t4+2–
t4+3–
t13+15–
t13+14+
2
3
15
14
4
4
13
13
2
3
15
14
8
8
8
8
1, 16
1, 16
1, 16
1, 16
Setup Time
tsetup
7
6, 9
2
8
1, 16
Hold Time
thold
7
6, 9
2
8
1, 16
Toggle Frequency (Max)
ftog
2
9
2
8
1, 16
Set Input
Reset Input
1. Individually test each input; apply V IHmax to pin under test.
2. Individually test each input; apply VILmin to pin under test.
3. Output level to be measured after a clock pulse has been applied to the CE Input (Pin 6)
4. Output level to be measured after a clock pulse has been applied to the CE Input (Pin 6)
VIHmax
VILmin
VIHAmax
VILAmin
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.
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3
MC10135
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180)
B
Y BRK
–N–
M
T L-M
0.007 (0.180)
U
M
N
S
T L-M
S
G1
0.010 (0.250)
S
N
S
D
–L–
–M–
Z
W
20
D
1
X
V
S
T L-M
S
N
S
VIEW D–D
A
0.007 (0.180)
M
T L-M
S
N
S
R
0.007 (0.180)
M
T L-M
S
N
S
Z
0.007 (0.180)
H
M
T L-M
S
N
S
K1
K
C
E
F
0.004 (0.100)
G
J
–T–
VIEW S
G1
0.010 (0.250) S T L-M
S
N
S
0.007 (0.180)
M
T L-M
S
VIEW S
SEATING
PLANE
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
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4
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
--0.025
--0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
--0.020
2
10 0.310
0.330
0.040
---
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
--0.64
--8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
--0.50
2
10 7.88
8.38
1.02
---
N
S
MC10135
PACKAGE DIMENSIONS
–A–
16
9
1
8
–B–
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE T
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
S
T A
M
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5
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
--0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
15 0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
--5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
15 0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
10 0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
10 0.51
1.01
MC10135
Notes
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MC10135
Notes
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7
MC10135
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MC10135/D