UDFN16 3.2x2.4, 0.4P

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN16 3.2x2.4, 0.4P
CASE 517AL−01
ISSUE O
16
DATE 04 APR 2007
1
SCALE 4:1
A
B
D
PIN ONE
REFERENCE
2X
0.10 C
2X
DETAIL A
OPTIONAL CONSTRUCTION
2X SCALE
ÏÏÏÏ
ÏÏÏÏ
ÏÏÏÏ
0.10 C
E
(A3)
TOP VIEW
DETAIL B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
A1
DETAIL B
OPTIONAL CONSTRUCTION
4X SCALE
A
(A3)
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
0.05 C
16X
MILLIMETERS
MIN
MAX
0.45
0.60
0.00
0.05
0.13 REF
0.15
0.25
3.20 BSC
2.70
2.90
2.40 BSC
1.00
1.20
0.40 BSC
0.20
−−−
0.30
0.50
0.05 C
SIDE VIEW
NOTE 4
C
A1
SOLDERING FOOTPRINT*
SEATING
PLANE
2.90
D2
16X
L
DETAIL A
8
1
1.20
2.70
E2
16X
16X
K
16
16X
e/2
b
0.10 C A B
BOTTOM VIEW
DOCUMENT NUMBER:
16X
0.24
0.63
9
e
1
98AON24329D
0.05 C
NOTE 3
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN16 3.2X2.4, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON24329D
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY E. SOTO.
DATE
04 APR 2007
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2007
April, 2007 − Rev. 01O
Case Outline Number:
517AL