ONSEMI NUF8000MU

NUF8000MU
Low Capacitance 8 Line EMI
Filter with ESD Protection in
UDFN Package
This device is an 8 line EMI filter array for wireless applications.
Greater than -30 dB typical attenuation is obtained at frequencies from
800 MHz to 5.0 GHz. The NUF8000MU has a typical cut-off frequency
of 95 MHz. This UDFN package is specifically designed to enhance EMI
filtering for low-profile or slim design electronics especially where space
and height is a premium. It also offers ESD protection-clamping
transients from static discharges. ESD protection is provided across all
capacitors.
Features
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16
1
Cd
Cd
2
15
Cd
Cd
3
•EMI Filtering and ESD Protection
•Integration of 40 Discrete Components
•Compliance with IEC61000-4-2 (Level 4)
•UDFN Package, 1.2 x 3.5 mm, 0.4 mm Pitch
•Moisture Sensitivity Level 1
•ESD Ratings: Machine Model = C
14
Cd
Cd
4
13
Cd
Cd
Cd
Cd
5
Human Body Model = 3B
12
6
11
•This is a Pb-Free Device*
Cd
Benefits
Cd
10
7
•Reduces EMI/RFI Emissions on a Data Line
•Low Profile Package; Typical Height of 0.5 mm
•Design-Friendly and Easy-to-Use Pin Configurations,
Cd
Cd
8
9
Cd
Particularly for Portable Electronics
•Integrated Solution Offers Cost and Space Savings in UDFN Package
•Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass
Filter Response
•Integrated Solution Improves System Reliability
Cd
(Top View)
MARKING
DIAGRAM
16
1
Applications
800 M
G
UDFN16
MU SUFFIX
CASE 517AF
•EMI Filtering and ESD Protection for Data Lines
•Keypad Interface and Protection for Portable Electronics
•Bottom Connector Interface for Mobile Handsets
•Notebook Computers and Digital Cameras
•LCD Display Interface in Mobile Handsets
•Camera Display Interface in Mobile Handsets
800
M
G
1
= Specific Device Code
= Date and Assembly Location
= Pb-Free Package
ORDERING INFORMATION
*For additional information on our Pb-Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
October, 2007 - Rev. 0
1
Device
Package
Shipping†
NUF8000MUT2G
UDFN16
(Pb-Free)
3000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NUF8000MU/D
NUF8000MU
MAXIMUM RATINGS
Parameter
Symbol
ESD Discharge IEC61000-4-2
Value
VPP
Unit
kV
Contact Discharge
8.0
Operating Temperature Range
TOP
-40 to 85
°C
Storage Temperature Range
TSTG
-55 to 150
°C
TL
260
°C
Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Maximum Reverse Working Voltage
Breakdown Voltage
Symbol
Test Conditions
Min
Typ
VRWM
VBR
IR = 1.0 mA
Leakage Current
IR
VRWM = 3.3 V
Resistance
RA
IR = 20 mA
Capacitance (Notes 1 and 2)
Cd
Cut-Off Frequency (Note 3)
f3dB
Above this frequency,
appreciable attenuation occurs
1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz.
2. Total Line Capacitance is 2 times the Diode Capacitance (Cd).
3. 50 source and 50 load termination.
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2
Max
Unit
5.0
V
8.0
V
6.0
7.0
100
nA
85
100
115
15
20
pF
95
MHz
NUF8000MU
TYPICAL PERFORMANCE CURVES (TA= 25°C unless otherwise specified)
0
0
-5
-10
-10
-20
-30
S41 (dB)
S21 (dB)
-15
-20
-25
-30
-50
-60
-35
-70
-40
-45
1.E+06
1.E+07
1.E+08
1.E+09
-80
10.0E+6
1.E+10
1.0E+9
10.0E+9
FREQUENCY (Hz)
Figure 1. Typical Insertion Loss Characteristic
Figure 2. Typical Analog Crosstalk
2
1.05
1.5
1.025
1
0.5
1
2
3
4
1
0.975
0.95
-40
0
0
100.0E+6
FREQUENCY (Hz)
RESISTANCE ()
NORMALIZED CAPACITANCE
-40
5
-20
0
20
40
60
80
REVERSE VOLTAGE (V)
TEMPERATURE (°C)
Figure 3. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance Cd at 2.5 V)
Figure 4. Typical Resistance over Temperature
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3
NUF8000MU
PACKAGE DIMENSIONS
UDFN16, 3.5x1.2, 0.4P
CASE 517AF-01
ISSUE B
0.10 C
PIN ONE
REFERENCE
2X
ÉÉÉÉ
ÉÉÉÉ
0.10 C
ÉÉ
ÇÇ
ÉÉ
A
B
D
2X
E
A1
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DETAIL A
TOP VIEW
(A3)
DETAIL A
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
A
0.10 C
16X
SEATING
PLANE
0.08 C
SIDE VIEW
D2
16X
C
A1
14X
SOLDERING FOOTPRINT*
e
L
8
1
1.35
E2
1
16X
K
16
9
BOTTOM VIEW
16X
MILLIMETERS
MIN
NOM MAX
0.45
0.50
0.55
0.00
0.03
0.05
0.127 REF
0.15
0.20
0.25
3.50 BSC
2.70
2.80
2.90
1.20 BSC
0.20
0.30
0.40
0.40 BSC
0.20
----0.20
0.25
0.30
b
0.10 C A B
0.05 C
0.35
0.30
NOTE 3
0.10
2.85
15X
0.40 PITCH
0.20
16X
0.32
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: [email protected]
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81-3-5773-3850
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4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NUF8000MU/D