Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 32‐Lead, 7 x 7 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 32A / N‐TQ032 GPC AUT Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes Amkor Korea / Amkor Philippines REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol F Diglycidyl Ether Dihydro‐3‐(tetrapropenyl)furan‐2,5‐dione 2,6‐Diglycidyl Phenyl Allyl Ether Oligomer Dodecyloxirane 1,4‐Bis(2,3‐epoxypropoxy)butane Methylhexahydrophthalic Anhydride Copper Oxide 7440‐22‐4 39817‐09‐9 26544‐38‐7 Proprietary 3234‐28‐4 2425‐79‐8 19438‐60‐9 1317‐38‐0 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica (Amorphous) A Epoxy Resin Silica (Amorphous) B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 7631‐86‐9 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 48.134 1.186 0.049 0.049 49.419 5.067 5.067 0.270 0.021 0.021 0.020 0.007 0.007 0.007 0.002 0.356 0.360 0.360 0.250 0.250 67.324 7.635 7.635 3.470 0.694 86.758 4.058 4.058 146.268 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 75.8 758000 6.0 60000 6.0 60000 5.6 56000 2.0 20000 2.0 20000 2.0 20000 0.6 6000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 77.6 776000 8.8 88000 8.8 88000 4.0 40000 0.8 8000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 32.91 329082 0.81 8109 0.03 338 0.03 338 33.79 337866 3.46 34639 3.46 34639 0.18 1844 0.01 146 0.01 146 0.01 136 0.00 49 0.00 49 0.00 49 0.00 15 0.24 2433 0.25 2462 0.25 2462 0.17 1708 0.17 1708 46.03 460281 5.22 52197 5.22 52197 2.37 23726 0.47 4745 59.31 593146 2.77 27747 2.77 27747 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: April 8, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 32‐Lead, 7 x 7 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 32A GPC AUT Yes Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Lingsen REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 112‐07‐2 92‐88‐6 461‐58‐5 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica (Amorphous) A Silica (Amorphous) B Epoxy Resin Phenol Resin Carbon Black 60676‐86‐0 7631‐86‐9 Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 47.008 1.466 0.293 0.098 48.865 5.067 5.067 0.249 0.067 0.022 0.003 0.003 0.001 0.346 0.360 0.360 0.250 0.250 60.037 12.233 7.895 6.160 0.434 86.758 4.058 4.058 145.704 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 72.1 721000 19.5 195000 6.5 65000 0.8 8000 0.8 8000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 69.2 692000 14.1 141000 9.1 91000 7.1 71000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 32.26 322627 1.01 10061 0.20 2012 0.07 671 33.54 335371 3.48 34773 3.48 34773 0.17 1712 0.05 463 0.02 154 0.00 19 0.00 19 0.00 7 0.24 2374 0.25 2471 0.25 2471 0.17 1714 0.17 1714 41.20 412046 8.40 83957 5.42 54185 4.23 42276 0.30 2977 59.54 595442 2.79 27854 2.79 27854 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: April 8, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 32‐Lead, 7 x 7 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 32A / N‐TQ032 GPC AUT Yes Matte Tin (Sn) RoHS Compliant e3 Green Compliant Yes Amkor Korea / Amkor Philippines REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol F Diglycidyl Ether Dihydro‐3‐(tetrapropenyl)furan‐2,5‐dione 2,6‐Diglycidyl Phenyl Allyl Ether Oligomer Dodecyloxirane 1,4‐Bis(2,3‐epoxypropoxy)butane Methylhexahydrophthalic Anhydride Copper Oxide 7440‐22‐4 39817‐09‐9 26544‐38‐7 Proprietary 3234‐28‐4 2425‐79‐8 19438‐60‐9 1317‐38‐0 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica (Amorphous) A Epoxy Resin Silica (Amorphous) B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 7631‐86‐9 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 48.134 1.186 0.049 0.049 49.419 5.067 5.067 0.270 0.021 0.021 0.020 0.007 0.007 0.007 0.002 0.356 0.360 0.360 0.178 0.004 0.182 67.313 7.633 7.633 3.470 0.694 86.744 4.058 4.058 146.186 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 75.8 758000 6.0 60000 6.0 60000 5.6 56000 2.0 20000 2.0 20000 2.0 20000 0.6 6000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 77.6 776000 8.8 88000 8.8 88000 4.0 40000 0.8 8000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 32.93 329267 0.81 8113 0.03 338 0.03 338 33.81 338057 3.47 34659 3.47 34659 0.18 1845 0.01 146 0.01 146 0.01 136 0.00 49 0.00 49 0.00 49 0.00 15 0.24 2434 0.25 2463 0.25 2463 0.12 1214 0.00 30 0.12 1244 46.05 460464 5.22 52218 5.22 52218 2.37 23735 0.47 4747 59.34 593381 2.78 27762 2.78 27762 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: April 8, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 32‐Lead, 7 x 7 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 32A / MA GPC AUT Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes ASE ChungLi REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) Acrylic Resin Acrylate Poybutadiene Resin Epoxy Resin Additive Butadiene Copolymer Peroxide 7440‐22‐4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica Fused Epoxy Resin Phenol Resin Carbon Black 60676‐86‐0 Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 47.008 1.466 0.293 0.098 48.865 5.067 5.067 0.257 0.028 0.018 0.017 0.008 0.003 0.003 0.001 0.336 0.360 0.360 0.178 0.004 0.182 75.207 6.506 4.771 0.260 86.744 4.058 4.058 145.612 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 76.6 766000 8.3 83000 5.3 53000 5.2 52000 2.4 24000 0.9 9000 0.9 9000 0.4 4000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 86.7 867000 7.5 75000 5.5 55000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 32.28 322832 1.01 10068 0.20 2014 0.07 671 33.56 335584 3.48 34795 3.48 34795 0.18 1768 0.02 192 0.01 122 0.01 120 0.01 55 0.00 21 0.00 21 0.00 9 0.23 2308 0.25 2473 0.25 2473 0.12 1219 0.00 30 0.12 1249 51.65 516489 4.47 44679 3.28 32765 0.18 1787 59.57 595719 2.79 27872 2.79 27872 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: April 8, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 32‐Lead, 7 x 7 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 32A GPC AUT Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes Lingsen REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 112‐07‐2 92‐88‐6 461‐58‐5 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica (Amorphous) A Silica (Amorphous) B Epoxy Resin Phenol Resin Carbon Black 60676‐86‐0 7631‐86‐9 Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 47.008 1.466 0.293 0.098 48.865 5.067 5.067 0.249 0.067 0.022 0.003 0.003 0.001 0.346 0.360 0.360 0.114 0.003 0.116 60.037 12.233 7.895 6.160 0.434 86.758 4.058 4.058 145.571 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 72.1 721000 19.5 195000 6.5 65000 0.8 8000 0.8 8000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 69.2 692000 14.1 141000 9.1 91000 7.1 71000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 32.29 322923 1.01 10070 0.20 2014 0.07 671 33.57 335679 3.48 34805 3.48 34805 0.17 1713 0.05 463 0.02 154 0.00 19 0.00 19 0.00 7 0.24 2376 0.25 2473 0.25 2473 0.08 780 0.00 19 0.08 800 41.24 412423 8.40 84034 5.42 54235 4.23 42315 0.30 2980 59.60 595987 2.79 27880 2.79 27880 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: April 8, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.