VQFN 64 ZGJ

Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
64‐Lead, 9.0 x 9.0 mm Body, 7.1 mm Exposed Pad, Lead Pitch 0.50 mm, Quad Flat No Lead Package (VQFN)
R‐QFN064
GPC
ZGJ
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
ASE Kaohsiung
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Epoxy Resin
t‐Butyl Phenyl Glycidyl Ether
Phenolic Resin
Epoxy Silane
Dicyandiamide
7440‐22‐4
9003‐36‐5
3101‐60‐8
9003‐35‐4
2530‐83‐8
461‐58‐5
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica Fused
Epoxy Resin A
Epoxy Resin B
Phenol Resin A
Phenol Resin B
Metal Hydroxide
Carbon Black
60676‐86‐0
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
98.714
2.432
0.101
0.101
101.349
9.799
9.799
0.565
0.095
0.051
0.024
0.010
0.004
0.748
2.273
2.273
0.508
0.508
90.544
3.275
3.275
3.275
3.275
1.690
0.317
105.652
4.740
4.740
225.068
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
75.5
755000
12.7
127000
6.8
68000
3.2
32000
1.3
13000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
85.7
857000
3.1
31000
3.1
31000
3.1
31000
3.1
31000
1.6
16000
0.3
3000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
43.86
438596
1.08
10807
0.05
450
0.05
450
45.03
450303
4.35
43536
4.35
43536
0.25
2508
0.04
422
0.02
226
0.01
106
0.00
43
0.00
17
0.33
3322
1.01
10098
1.01
10098
0.23
2256
0.23
2256
40.23
402296
1.46
14552
1.46
14552
1.46
14552
1.46
14552
0.75
7511
0.14
1408
46.94
469424
2.11
21061
2.11
21061
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China
RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes
made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by
a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
March 22, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.
Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
64‐Lead, 9.0 x 9.0 mm Body, 7.1 mm Exposed Pad, Lead Pitch 0.50 mm, Quad Flat No Lead Package (VQFN)
R‐QFN064
GPC
ZGJ
Matte Tin (Sn)
RoHS Compliant
Yes
e3
Green Compliant
Yes
ASE Kaohsiung
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Poybutadiene Derivative
Acrylate
Acrylic Resin
Butadiene Resin
Additive
Peroxide
7440‐22‐4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Silver (Ag)
7440‐22‐4
Copper (Cu)
Palladium (Pd)
7440‐50‐8
7440‐05‐3
Silica (Amorphous)
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
60676‐86‐0
Proprietary
Proprietary
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Weight (mg)
98.714
2.432
0.101
0.101
101.349
9.799
9.799
0.472
0.056
0.044
0.044
0.016
0.007
0.003
0.641
2.273
2.273
0.231
0.006
0.237
95.299
3.275
3.275
3.275
0.528
105.652
4.740
4.740
224.690
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
73.7
737000
8.7
87000
6.8
68000
6.8
68000
2.5
25000
1.1
11000
0.4
4000
100.0
1000000
100.0
1000000
100.0
1000000
97.6
976000
2.4
24000
100.0
1000000
90.2
902000
3.1
31000
3.1
31000
3.1
31000
0.5
5000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
43.93
439333
1.08
10825
0.05
451
0.05
451
45.11
451061
4.36
43609
4.36
43609
0.21
2102
0.02
248
0.02
194
0.02
194
0.01
71
0.00
31
0.00
11
0.29
2852
1.01
10115
1.01
10115
0.10
1028
0.00
25
0.11
1053
42.41
424132
1.46
14577
1.46
14577
1.46
14577
0.24
2351
47.02
470213
2.11
21096
2.11
21096
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China
RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes
made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by
a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
March 22, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.