Product / Package Information Environmental Compliance Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 7 X 7 X 0.75 (5.6 EP) 48 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black CAS# 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) 3.51E-02 2.44E-03 2.44E-03 6.10E-04 1.22E-04 4.07E-02 Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.00 862000 60000 60000 15000 3000 1000000 24.96 1.74 1.74 0.43 0.09 28.96 PPM 249635 17376 17376 4344 869 289599 Leadframe Component Level Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Weight (g) 8.31 E-02 2.00 E-03 1.02 E-04 2.56 E-05 8.52 E-02 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 59.14 1.43 0.07 0.02 60.66 PPM 591441 14255 728 182 606606 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) 1.14 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 0.81 PPM 8116 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Weight (g) 4.80 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.34 PPM 3417 Bond Wires Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Component Level Weight (g) 1.26 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 0.90 PPM 8970 Chip Component Level Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Weight (g) 1.02 E-02 Percentage (%) PPM Percentage (%) 100.0 1000000 7.23 PPM 72329 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Others Other organic materials Other organic materials Others Others Subtotal Package Totals Substance Silver Epoxy resin A Anhydride 2,6-Diglycidyl phenyl allyl ether oligomer Epoxy resin B Epoxy resin modifier Anhydride CAS# 7440-22-4 TS ref# 10013 TS ref# 10181 Unassigned TS ref# 10237 TS ref# 10038 TS ref# 10180 Component Level Weight (g) 1.13 E-03 1.13 E-04 1.13 E-04 4.53 E-05 4.53 E-05 4.53 E-05 4.53 E-05 1.54 E-03 Weight (g) 1.40 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 73.54 7.35 7.35 2.94 2.94 2.94 2.94 100.00 735400 73500 73500 29400 29400 29400 29400 1000000 0.81 0.08 0.08 0.03 0.03 0.03 0.03 1.10 Percentage (%) 100 PPM 8062 806 806 322 322 322 322 10963 PPM 1000000 Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 7 X 7 X 0.75 (5.6EP) 48 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Others Subtotal Silica Epoxy resin Phenol resin Metal Hydroxide Others CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary Proprietary Percentage (%) PPM Percentage (%) 83.25 5.42 3.45 5.42 2.46 100.00 832500 54200 34500 54200 24600 1000000 24.19 1.58 1.00 1.58 0.71 29.06 3.39E-02 2.20E-03 1.40E-03 2.20E-03 1.00E-03 4.07E-02 PPM 241918 15750 10025 15750 7149 290592 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# Component Level Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 59.35 1.43 0.07 0.02 60.87 8.31 E-02 2.00 E-03 1.02 E-04 2.56 E-05 8.52 E-02 PPM 593469 14304 730 183 608686 Internal / External Leadframe Plating Homogeneous Material Level Substance Description Nickel & its alloys Precious metals Precious metals Subtotal Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 97.3 2.3 0.5 100.00 972697 22621 4683 1000000 0.79 0.02 0.00 0.81 1.11 E-03 2.58 E-05 5.34 E-06 1.14 E-03 PPM 7921 184 38 8143 Bond Wires Homogeneous Material Level Description Precious metals Precious metals Subtotal Substance Gold Palladium CAS# 7440-57-5 7440-05-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 99 1.0 100 0 100.0 990000 10000 1000000 0.89 0.01 0 90 0.90 1.25 E-03 1.26 E-05 1 26 E 1.26 E-03 03 PPM 8911 90 9001 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 7.26 1.02 E-02 PPM 72577 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Silver Epoxy Resin t-butyl phenyl glycidyl ether Phenolic hardener Butyl cellosolve acetate CAS# Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 1.10 PPM 7440-22-4 9003-36-5 / 30583-72-3 3101-60-8 92-88-6 / 26834-02-6 112-07-2 1.54 E-03 Weight (g) 1.40 E-01 Percentage (%) 100.00 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 11001 PPM 1000000