pdf

Product / Package Information
Environmental Compliance Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
7 X 7 X 0.75 (5.6 EP)
48
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon black
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
3.51E-02
2.44E-03
2.44E-03
6.10E-04
1.22E-04
4.07E-02
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.00
862000
60000
60000
15000
3000
1000000
24.96
1.74
1.74
0.43
0.09
28.96
PPM
249635
17376
17376
4344
869
289599
Leadframe
Component Level
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Weight (g)
8.31 E-02
2.00 E-03
1.02 E-04
2.56 E-05
8.52 E-02
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
59.14
1.43
0.07
0.02
60.66
PPM
591441
14255
728
182
606606
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Weight (g)
1.14 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.81
PPM
8116
External Leadframe Plating
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Weight (g)
4.80 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.34
PPM
3417
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Component Level
Weight (g)
1.26 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.90
PPM
8970
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
1.02 E-02
Percentage (%)
PPM
Percentage (%)
100.0
1000000
7.23
PPM
72329
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Others
Other organic materials
Other organic materials
Others
Others
Subtotal
Package Totals
Substance
Silver
Epoxy resin A
Anhydride
2,6-Diglycidyl phenyl allyl ether oligomer
Epoxy resin B
Epoxy resin modifier
Anhydride
CAS#
7440-22-4
TS ref# 10013
TS ref# 10181
Unassigned
TS ref# 10237
TS ref# 10038
TS ref# 10180
Component Level
Weight (g)
1.13 E-03
1.13 E-04
1.13 E-04
4.53 E-05
4.53 E-05
4.53 E-05
4.53 E-05
1.54 E-03
Weight (g)
1.40 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
73.54
7.35
7.35
2.94
2.94
2.94
2.94
100.00
735400
73500
73500
29400
29400
29400
29400
1000000
0.81
0.08
0.08
0.03
0.03
0.03
0.03
1.10
Percentage (%)
100
PPM
8062
806
806
322
322
322
322
10963
PPM
1000000
Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
7 X 7 X 0.75 (5.6EP)
48
NiPdAu
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Others
Subtotal
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Others
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
Percentage (%)
PPM
Percentage (%)
83.25
5.42
3.45
5.42
2.46
100.00
832500
54200
34500
54200
24600
1000000
24.19
1.58
1.00
1.58
0.71
29.06
3.39E-02
2.20E-03
1.40E-03
2.20E-03
1.00E-03
4.07E-02
PPM
241918
15750
10025
15750
7149
290592
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
Component Level
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
59.35
1.43
0.07
0.02
60.87
8.31 E-02
2.00 E-03
1.02 E-04
2.56 E-05
8.52 E-02
PPM
593469
14304
730
183
608686
Internal / External Leadframe Plating
Homogeneous Material Level
Substance
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Nickel
Palladium
Gold
CAS#
7440-02-0
7440-05-3
7440-57-5
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
97.3
2.3
0.5
100.00
972697
22621
4683
1000000
0.79
0.02
0.00
0.81
1.11 E-03
2.58 E-05
5.34 E-06
1.14 E-03
PPM
7921
184
38
8143
Bond Wires
Homogeneous Material Level
Description
Precious metals
Precious metals
Subtotal
Substance
Gold
Palladium
CAS#
7440-57-5
7440-05-3
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
99
1.0
100 0
100.0
990000
10000
1000000
0.89
0.01
0 90
0.90
1.25 E-03
1.26 E-05
1 26 E
1.26
E-03
03
PPM
8911
90
9001
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
7.26
1.02 E-02
PPM
72577
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
t-butyl phenyl glycidyl ether
Phenolic hardener
Butyl cellosolve acetate
CAS#
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.10
PPM
7440-22-4
9003-36-5 / 30583-72-3
3101-60-8
92-88-6 / 26834-02-6
112-07-2
1.54 E-03
Weight (g)
1.40 E-01
Percentage (%)
100.00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
11001
PPM
1000000