Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 28‐Lead, 8 x 13.4 mm, Plastic Thin Small Outline Package, Type I (TSOP) 28T GPC TBB Yes Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Lingsen REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) CAS # 7440‐50‐8 7440‐02‐0 7440‐21‐3 7439‐95‐4 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 112‐07‐2 92‐88‐6 461‐58‐5 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica (Amorphous) A Silica (Amorphous) B Epoxy Resin Phenol Resin Carbon Black 60676‐86‐0 7631‐86‐9 Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 45.905 1.432 0.286 0.095 47.718 7.645 7.645 0.376 0.102 0.034 0.004 0.004 0.002 0.522 0.770 0.770 0.311 0.311 119.701 24.390 15.741 12.282 0.865 172.979 2.159 2.159 232.104 Homogeneous Material Percentage ppm 96.2 962000 3.0 30000 0.6 6000 0.2 2000 100.0 1000000 100.0 1000000 100.0 1000000 72.1 721000 19.5 195000 6.5 65000 0.8 8000 0.8 8000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 69.2 692000 14.1 141000 9.1 91000 7.1 71000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 19.78 197777 0.62 6168 0.12 1234 0.04 411 20.56 205589 3.29 32936 3.29 32936 0.16 1621 0.04 439 0.01 146 0.00 18 0.00 18 0.00 7 0.22 2249 0.33 3318 0.33 3318 0.13 1341 0.13 1341 51.57 515724 10.51 105083 6.78 67819 5.29 52914 0.37 3726 74.53 745266 0.93 9301 0.93 9301 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 19, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.