Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 14‐Lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14S1 / N‐SO014 GPC SVQ Yes Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Lingsen REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Phenolic Resin Butyl Cellosolve Acetate Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 92‐88‐6 112‐07‐2 461‐58‐5 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 29690‐82‐2 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 37.461 0.923 0.038 0.038 38.461 2.673 2.673 0.132 0.036 0.012 0.001 0.001 0.001 0.183 0.247 0.247 0.123 0.123 72.245 6.514 2.707 2.707 0.423 84.596 2.505 2.505 128.787 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 72.1 721000 19.5 195000 6.5 65000 0.8 8000 0.8 8000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 85.4 854000 7.7 77000 3.2 32000 3.2 32000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 29.09 290878 0.72 7167 0.03 299 0.03 299 29.86 298643 2.08 20755 2.08 20755 0.10 1022 0.03 276 0.01 92 0.00 11 0.00 11 0.00 4 0.14 1417 0.19 1918 0.19 1918 0.10 953 0.10 953 56.10 560964 5.06 50579 2.10 21020 2.10 21020 0.33 3284 65.69 656867 1.94 19447 1.94 19447 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 18, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 14‐Lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14S1 GPC SVQ Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes ASE ChungLi REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Acrylic Resin Acrylate Polybutadiene Copolymer Epoxy Resin Additive Butadiene Copolymer Peroxide 7440‐22‐4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica (Amorphous) A Epoxy Resin Silica (Amorphous) B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 7631‐86‐9 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 37.461 0.923 0.038 0.038 38.461 2.673 2.673 0.136 0.015 0.009 0.009 0.004 0.002 0.002 0.001 0.177 0.247 0.247 0.056 0.001 0.057 65.647 7.444 7.444 3.384 0.677 84.596 2.505 2.505 128.716 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 76.6 766000 8.3 83000 5.3 53000 5.2 52000 2.4 24000 0.9 9000 0.9 9000 0.4 4000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 77.6 776000 8.8 88000 8.8 88000 4.0 40000 0.8 8000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 29.10 291038 0.72 7171 0.03 299 0.03 299 29.88 298807 2.08 20766 2.08 20766 0.11 1055 0.01 114 0.01 73 0.01 72 0.00 33 0.00 12 0.00 12 0.00 6 0.14 1377 0.19 1919 0.19 1919 0.04 434 0.00 11 0.04 445 51.00 510009 5.78 57836 5.78 57836 2.63 26289 0.53 5258 65.72 657228 1.95 19458 1.95 19458 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 18, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 14‐Lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) TU GPC SVQ Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes ASE Shanghai REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Acrylic Resin Acrylate Polybutadiene Copolymer Epoxy Resin Additive Butadiene Copolymer Peroxide 7440‐22‐4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica Fused Epoxy Resin Phenol Resin Carbon Black 60676‐86‐0 Proprietary Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 37.461 0.923 0.038 0.038 38.461 2.673 2.673 0.136 0.015 0.009 0.009 0.004 0.002 0.002 0.001 0.177 0.247 0.247 0.056 0.001 0.057 73.091 6.683 4.568 0.254 84.596 2.505 2.505 128.716 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 76.6 766000 8.3 83000 5.3 53000 5.2 52000 2.4 24000 0.9 9000 0.9 9000 0.4 4000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 86.4 864000 7.9 79000 5.4 54000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 29.10 291038 0.72 7171 0.03 299 0.03 299 29.88 298807 2.08 20766 2.08 20766 0.11 1055 0.01 114 0.01 73 0.01 72 0.00 33 0.00 12 0.00 12 0.00 6 0.14 1377 0.19 1919 0.19 1919 0.04 434 0.00 11 0.04 445 56.78 567845 5.19 51921 3.55 35490 0.20 1972 65.72 657228 1.95 19458 1.95 19458 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 18, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 14‐Lead, 0.150" Wide Body, Plastic Gull Wing Small Outline Package (SOIC) 14S1 / N‐SO014 GPC SVQ Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes Lingsen REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Phenolic Resin Butyl Cellosolve Acetate Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 92‐88‐6 112‐07‐2 461‐58‐5 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 29690‐82‐2 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 37.461 0.923 0.038 0.038 38.461 2.673 2.673 0.132 0.036 0.012 0.001 0.001 0.001 0.183 0.247 0.247 0.056 0.001 0.057 72.245 6.514 2.707 2.707 0.423 84.596 2.505 2.505 128.722 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 72.1 721000 19.5 195000 6.5 65000 0.8 8000 0.8 8000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 85.4 854000 7.7 77000 3.2 32000 3.2 32000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 29.10 291026 0.72 7171 0.03 299 0.03 299 29.88 298795 2.08 20765 2.08 20765 0.10 1022 0.03 276 0.01 92 0.00 11 0.00 11 0.00 4 0.14 1418 0.19 1919 0.19 1919 0.04 434 0.00 11 0.04 445 56.13 561250 5.06 50605 2.10 21030 2.10 21030 0.33 3286 65.72 657201 1.95 19457 1.95 19457 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 18, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.