Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.300" Wide Body, Plastic Dual In‐Line Package (PDIP) 8P3 GPC PTC Matte Tin (Sn) RoHS Compliant Yes Yes e3 Green Compliant Amkor Philippines REACH Compliant Yes Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) Silicon (Si) Silver (Ag) Epoxy Resin Curing Agent & Hardener Silver (Ag) Gold (Au) Silica Epoxy Resin Phenol Resin Tin (Sn) Package Material Declaration Homogeneous Material CAS # Weight (mg) Percentage ppm 7440‐50‐8 102.935 97.4 974000 7439‐89‐6 2.536 2.4 24000 7723‐14‐0 0.106 0.1 1000 7440‐66‐6 0.106 0.1 1000 105.683 100.0 1000000 7440‐21‐3 1.473 100.0 1000000 1.473 100.0 1000000 7440‐22‐4 0.068 71.7 717000 Proprietary 0.023 24.4 244000 Proprietary 0.004 3.9 39000 0.095 100.0 1000000 7440‐22‐4 0.240 100.0 1000000 100.0 1000000 0.240 7440‐57‐5 0.078 100.0 1000000 0.078 100.0 1000000 60676‐86‐0 352.052 84.0 840000 29690‐82‐2 46.102 11.0 110000 9003‐35‐4 20.955 5.0 50000 419.110 100.0 1000000 7440‐31‐5 7.491 100.0 1000000 7.491 100.0 1000000 534.169 Package Percentage ppm 19.27 192701 0.47 4748 0.02 198 0.02 198 19.78 197845 0.28 2757 0.28 2757 0.01 127 0.00 43 0.00 7 0.02 178 0.04 449 0.04 449 0.01 145 0.01 145 65.91 659065 8.63 86306 3.92 39230 78.46 784602 1.40 14023 1.40 14023 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.300" Wide Body, Plastic Dual In‐Line Package (PDIP) 8P3 GPC PTC Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes Lingsen REACH Compliant Yes Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) Silicon (Si) Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide Silver (Ag) Gold (Au) Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Tin (Sn) Package Material Declaration Homogeneous Material CAS # Weight (mg) Percentage ppm 7440‐50‐8 102.935 97.4 974000 7439‐89‐6 2.536 2.4 24000 7723‐14‐0 0.106 0.1 1000 7440‐66‐6 0.106 0.1 1000 105.683 100.0 1000000 7440‐21‐3 1.473 100.0 1000000 1.473 100.0 1000000 7440‐22‐4 0.073 72.1 721000 9003‐36‐5 0.020 19.5 195000 3101‐60‐8 0.007 6.5 65000 0.8 8000 0.001 112‐07‐2 92‐88‐6 0.001 0.8 8000 461‐58‐5 0.000 0.3 3000 0.101 100.0 1000000 7440‐22‐4 0.240 100.0 1000000 0.240 100.0 1000000 7440‐57‐5 0.078 100.0 1000000 0.078 100.0 1000000 60676‐86‐0 325.381 85.4 854000 Proprietary 29.338 7.7 77000 29690‐82‐2 12.192 3.2 32000 Proprietary 12.192 3.2 32000 1333‐86‐4 1.905 0.5 5000 381.009 100.0 1000000 7440‐31‐5 7.491 100.0 1000000 7.491 100.0 1000000 496.073 Package Percentage ppm 20.75 207500 0.51 5113 0.02 213 0.02 213 21.30 213039 0.30 2969 0.30 2969 0.01 146 0.00 40 0.00 13 0.00 2 0.00 2 0.00 1 0.02 203 0.05 484 0.05 484 0.02 157 0.02 157 65.59 655914 5.91 59140 2.46 24578 2.46 24578 0.38 3840 76.80 768049 1.51 15100 1.51 15100 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.300" Wide Body, Plastic Dual In‐Line Package (PDIP) 8P3 GPC PTC Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes Lingsen REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide 7440‐22‐4 9003‐36‐5 3101‐60‐8 112‐07‐2 92‐88‐6 461‐58‐5 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 29690‐82‐2 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Weight (mg) 102.935 2.536 0.106 0.106 105.683 1.473 1.473 0.073 0.020 0.007 0.001 0.001 0.000 0.101 0.240 0.240 0.035 0.001 0.036 325.381 29.338 12.192 12.192 1.905 381.009 7.491 7.491 496.032 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 72.1 721000 19.5 195000 6.5 65000 0.8 8000 0.8 8000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 85.4 854000 7.7 77000 3.2 32000 3.2 32000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 20.75 207517 0.51 5113 0.02 213 0.02 213 21.31 213056 0.30 2969 0.30 2969 0.01 146 0.00 40 0.00 13 0.00 2 0.00 2 0.00 1 0.02 203 0.05 484 0.05 484 0.01 71 0.00 2 0.01 73 65.60 655969 5.91 59145 2.46 24580 2.46 24580 0.38 3841 76.81 768113 1.51 15101 1.51 15101 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.