VQFN 64 ZFR NPG

Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
64‐Pad, 7.5 x 7.5 x 0.85 mm Body, 6.20 x 6.20 mm Exposed Pad, 0.40 mm Pitch, Quad Flat No Lead Package (VQFN)
R‐QFN064
GPC
ZFR
Nickel‐Palladium‐Gold (Ni‐Pd‐Au)
RoHS Compliant
Yes
Yes
e4
Green Compliant
UTAC Thailand
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Sub‐Total
Terminal Plating
Sub‐Total
Total
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Weight (mg)
75.691
1.865
0.078
0.078
77.711
Silicon (Si)
7440‐21‐3
6.589
6.589
Silver (Ag)
7440‐22‐4
0.350
Isobornyl Methacrylate
7534‐94‐3
0.070
N,N‐(m‐phenylene)dimaleimide 3006‐93‐7
0.015
Fluoroaliphatic Polymeric Esters 1017237‐78‐3
0.003
0.437
Gold (Au)
7440‐57‐5
0.507
0.507
Silica Fused
60676‐86‐0
59.977
Epoxy Resin A
Proprietary
2.170
Epoxy Resin B
Proprietary
2.170
Phenol Resin A
Proprietary
2.170
Phenol Resin B
Proprietary
2.170
Metal Hydroxide
Proprietary
1.120
Carbon Black
1333‐86‐4
0.210
69.985
Nickel (Ni)
7440‐02‐0
1.183
Palladium (Pd)
7440‐05‐3
0.083
Gold (Au)
7440‐57‐5
0.010
1.276
156.506
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
80.0
800000
16.0
160000
3.4
34000
0.6
6000
100.0
1000000
100.0
1000000
100.0
1000000
85.7
857000
3.1
31000
3.1
31000
3.1
31000
3.1
31000
1.6
16000
0.3
3000
100.0
1000000
92.7
927000
6.5
65000
0.8
8000
100.0
1000000
Package
Percentage
ppm
48.36
483627
1.19
11917
0.05
497
0.05
497
49.65
496537
4.21
42103
4.21
42103
0.22
2234
0.04
447
0.01
95
0.00
17
0.28
2793
0.32
3242
0.32
3242
38.32
383227
1.39
13862
1.39
13862
1.39
13862
1.39
13862
0.72
7155
0.13
1342
44.72
447173
0.76
7556
0.05
530
0.01
65
0.82
8152
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration.
Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union
Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information
Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical
analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS
numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes
made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided
by a written contract or other agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
February 29, 2016
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl
Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any
homogeneous material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900
ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any
homogeneous material.