Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 64‐Pad, 7.5 x 7.5 x 0.85 mm Body, 6.20 x 6.20 mm Exposed Pad, 0.40 mm Pitch, Quad Flat No Lead Package (VQFN) R‐QFN064 GPC ZFR Nickel‐Palladium‐Gold (Ni‐Pd‐Au) RoHS Compliant Yes Yes e4 Green Compliant UTAC Thailand REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Weight (mg) 75.691 1.865 0.078 0.078 77.711 Silicon (Si) 7440‐21‐3 6.589 6.589 Silver (Ag) 7440‐22‐4 0.350 Isobornyl Methacrylate 7534‐94‐3 0.070 N,N‐(m‐phenylene)dimaleimide 3006‐93‐7 0.015 Fluoroaliphatic Polymeric Esters 1017237‐78‐3 0.003 0.437 Gold (Au) 7440‐57‐5 0.507 0.507 Silica Fused 60676‐86‐0 59.977 Epoxy Resin A Proprietary 2.170 Epoxy Resin B Proprietary 2.170 Phenol Resin A Proprietary 2.170 Phenol Resin B Proprietary 2.170 Metal Hydroxide Proprietary 1.120 Carbon Black 1333‐86‐4 0.210 69.985 Nickel (Ni) 7440‐02‐0 1.183 Palladium (Pd) 7440‐05‐3 0.083 Gold (Au) 7440‐57‐5 0.010 1.276 156.506 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 80.0 800000 16.0 160000 3.4 34000 0.6 6000 100.0 1000000 100.0 1000000 100.0 1000000 85.7 857000 3.1 31000 3.1 31000 3.1 31000 3.1 31000 1.6 16000 0.3 3000 100.0 1000000 92.7 927000 6.5 65000 0.8 8000 100.0 1000000 Package Percentage ppm 48.36 483627 1.19 11917 0.05 497 0.05 497 49.65 496537 4.21 42103 4.21 42103 0.22 2234 0.04 447 0.01 95 0.00 17 0.28 2793 0.32 3242 0.32 3242 38.32 383227 1.39 13862 1.39 13862 1.39 13862 1.39 13862 0.72 7155 0.13 1342 44.72 447173 0.76 7556 0.05 530 0.01 65 0.82 8152 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: February 29, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.