Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 64‐Pad, 9.0 x 9.0 x 1.0 mm Body, Lead Pitch 0.50 mm, 7.65 mm Exposed Pad, Plastic Very Thin Quad Flat No Lead Package (VQFN) 64M2 / N‐QFN064 GPC ZFF Yes Nickel‐Palladium‐Gold (Ni‐Pd‐Au) RoHS Compliant e4 Green Compliant Yes ASE Kaohsiung REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin B Diluent B Hardener Epoxy Resin A Diluent A Organic Peroxide Dicyandiamide 7440‐22‐4 Proprietary Proprietary Proprietary 9003‐36‐5 Proprietary Proprietary 461‐58‐5 Gold (Au) 7440‐57‐5 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary Proprietary Proprietary 1333‐86‐4 Nickel (Ni) Palladium (Pd) Gold (Au) 7440‐02‐0 7440‐05‐3 7440‐57‐5 Sub‐Total Total Weight (mg) 111.921 2.758 0.115 0.115 114.908 12.631 12.631 0.644 0.051 0.051 0.042 0.034 0.034 0.004 0.003 0.862 0.508 0.508 95.078 3.268 3.268 3.268 0.527 105.408 1.749 0.123 0.015 1.886 236.204 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 74.7 747000 5.9 59000 5.9 59000 4.9 49000 3.9 39000 3.9 39000 0.5 5000 0.3 3000 100.0 1000000 100.0 1000000 100.0 1000000 90.2 902000 3.1 31000 3.1 31000 3.1 31000 0.5 5000 100.0 1000000 92.7 927000 6.5 65000 0.8 8000 100.0 1000000 Package Percentage ppm 47.38 473830 1.17 11675 0.05 486 0.05 486 48.65 486479 5.35 53477 5.35 53477 0.27 2728 0.02 215 0.02 215 0.02 179 0.01 142 0.01 142 0.00 18 0.00 11 0.37 3651 0.21 2149 0.21 2149 40.25 402524 1.38 13834 1.38 13834 1.38 13834 0.22 2231 44.63 446258 0.74 7403 0.05 519 0.01 64 0.80 7986 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 64‐Pad, 9.0 x 9.0 x 1.0 mm Body, Lead Pitch 0.50 mm, 7.65 mm Exposed Pad, Plastic Very Thin Quad Flat No Lead Package (VQFN) 64M2 GPC ZFF Nickel‐Palladium‐Gold (Ni‐Pd‐Au) RoHS Compliant Yes e4 Green Compliant Yes ASE Korea REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Acrylic Resin Acrylate Polybutadiene Copolymer Epoxy Resin Additive Butadiene Copolymer Peroxide 7440‐22‐4 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Gold (Au) 7440‐57‐5 Silica (Amorphous) A Silica (Amorphous) B Epoxy Resin Phenol Resin Carbon Black 60676‐86‐0 7631‐86‐9 Proprietary Proprietary 1333‐86‐4 Nickel (Ni) Palladium (Pd) Gold (Au) 7440‐02‐0 7440‐05‐3 7440‐57‐5 Sub‐Total Total Weight (mg) 111.921 2.758 0.115 0.115 114.908 12.631 12.631 0.642 0.070 0.044 0.044 0.020 0.008 0.008 0.003 0.838 0.508 0.508 72.942 14.863 9.592 7.484 0.527 105.408 1.749 0.123 0.015 1.886 236.180 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 76.6 766000 8.3 83000 5.3 53000 5.2 52000 2.4 24000 0.9 9000 0.9 9000 0.4 4000 100.0 1000000 100.0 1000000 100.0 1000000 69.2 692000 14.1 141000 9.1 91000 7.1 71000 0.5 5000 100.0 1000000 92.7 927000 6.5 65000 0.8 8000 100.0 1000000 Package Percentage ppm 47.39 473880 1.17 11677 0.05 487 0.05 487 48.65 486529 5.35 53482 5.35 53482 0.27 2717 0.03 294 0.02 188 0.02 184 0.01 85 0.00 32 0.00 32 0.00 14 0.35 3547 0.21 2149 0.21 2149 30.88 308843 6.29 62929 4.06 40614 3.17 31688 0.22 2232 44.63 446304 0.74 7404 0.05 519 0.01 64 0.80 7987 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 64‐Pad, 9.0 x 9.0 x 1.0 mm Body, Lead Pitch 0.50 mm, 7.65 mm Exposed Pad, Plastic Very Thin Quad Flat No Lead Package (VQFN) 64M2 / N‐QFN064 GPC ZFF Yes Nickel‐Palladium‐Gold (Ni‐Pd‐Au) RoHS Compliant e4 Green Compliant Yes ASE Kaohsiung REACH Compliant Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Epoxy Resin B Diluent B Hardener Epoxy Resin A Diluent A Organic Peroxide Dicyandiamide 7440‐22‐4 Proprietary Proprietary Proprietary 9003‐36‐5 Proprietary Proprietary 461‐58‐5 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary Proprietary Proprietary 1333‐86‐4 Nickel (Ni) Palladium (Pd) Gold (Au) 7440‐02‐0 7440‐05‐3 7440‐57‐5 Sub‐Total Total Weight (mg) 111.921 2.758 0.115 0.115 114.908 12.631 12.631 0.644 0.051 0.051 0.042 0.034 0.034 0.004 0.003 0.862 0.231 0.006 0.237 95.078 3.268 3.268 3.268 0.527 105.408 1.749 0.123 0.015 1.886 235.933 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 74.7 747000 5.9 59000 5.9 59000 4.9 49000 3.9 39000 3.9 39000 0.5 5000 0.3 3000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 90.2 902000 3.1 31000 3.1 31000 3.1 31000 0.5 5000 100.0 1000000 92.7 927000 6.5 65000 0.8 8000 100.0 1000000 Package Percentage ppm 47.44 474375 1.17 11689 0.05 487 0.05 487 48.70 487038 5.35 53538 5.35 53538 0.27 2731 0.02 216 0.02 216 0.02 179 0.01 143 0.01 143 0.00 18 0.00 11 0.37 3656 0.10 979 0.00 24 0.10 1003 40.30 402987 1.38 13850 1.38 13850 1.38 13850 0.22 2234 44.68 446770 0.74 7412 0.05 520 0.01 64 0.80 7996 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: March 22, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.