NUF2222FC 2 Line USB 1.1 Upstream EMI Filter This device is a 2 line EMI filter array for USB port protection in wireless applications. Greater than −20 dB attenuation is obtained at frequencies from 900 MHz to 3.0 GHz. It also has 2 lines for dedicated ESD protection. ESD protection is provided across all capacitors. http://onsemi.com Features A3 • EMI Filtering and ESD Protection • Integration of 10 Discretes • Provides Protection for IEC61000−4−2 (Level 4) • • • 1.3 K A1 33 R C1 15 kV (Contact) Flip−Chip Package Moisture Sensitivity Level 1 ESD Rating: Machine Model = C; Human Body Model = 3B D2 (Gnd Pin) 33 R Benefits E1 • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution Offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass • • Filter Response Integrated Solution Improves System Reliability This is a Pb−Free Device MARKING DIAGRAM 1 Flip−Chip FC SUFFIX CASE 499AM EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Products Notebook Computers MP3 Players 2222 A Y WW 2222AYWW = Specific Device Code = Assembly Location = Year = Work Week PIN CONFIGURATION MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating E3 1 Applications • • • • • C3 B2 ♦ Symbol Value Unit VPP 15 kV Operating Temperature Range TOP −40 to +85 °C C Storage Temperature Range TSTG −55 to +150 °C D TJ +125 °C E ESD Discharge IEC61000−4−2 Contact Discharge Junction Temperature 3 2 1 A B Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ORDERING INFORMATION Device Package Shipping† NUF2222FCT1G Flip−Chip 3000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2005 June, 2005 − Rev. 0 1 Publication Order Number: NUF2222FC/D NUF2222FC ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Test Conditions Min Typ Max Unit Maximum Reverse Working Voltage VRWM − − − 5.6 V VBR IR = 1.0 mA 6.0 − 8.8 V IR VRWM = 3.3 V − 1.0 100 nA Pull Up Resistance Rpu − 1.1 1.3 1.5 kW Series Resistance RS − 28 33 38 W CLINE f = 1.0 MHz, 0 Vdc − 36 40 pF f3dB 50 W Source and 50 W Load Termination − 190 − MHz Breakdown Voltage Leakage Current Capacitance Cut−Off Frequency http://onsemi.com 2 NUF2222FC TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise specified) 0 0 −5 −10 −20 S41 (dB) S21 (dB) −10 −15 −20 −30 −40 −25 −50 −30 −35 1.0E+6 10E+6 100E+6 1.0E+9 10E+9 −60 1.0E+6 10E+6 100E+6 1.0E+9 10E+9 FREQUENCY (Hz) FREQUENCY (Hz) Figure 1. Typical Insertion Loss Characteristics Figure 2. Typical Crosstalk Characteristics 1350 34.50 1340 RESISTANCE (W) 1330 33.50 33.00 32.50 1320 1310 1300 1290 1280 1270 32.00 1260 31.50 −40 −15 10 35 60 85 1250 −40 −15 TEMPERATURE (°C) 10 60 Figure 4. Typical Resistance (R1300) vs. Temperature 45 35 25 15 0 35 TEMPERATURE (°C) Figure 3. Typical Resistance (R33) vs. Temperature CAPACITANCE (pF) RESISTANCE (W) 34.00 1 2 3 4 REVERSE VOLTAGE (V) Figure 5. Typical Line Capacitance vs. Reverse Bias Voltage http://onsemi.com 3 5 85 NUF2222FC PRINTED CIRCUIT BOARD RECOMMENDATIONS 500 mm Pitch 300 or 350 mm Solder Ball Parameter 250 mm +25 −0 PCB Pad Size Pad Shape Round Pad Type NSMD 350 mm "25 Solder Mask Opening 125 mm Solder Stencil Thickness Stencil Aperture 250 x 250 mm sq. Solder Flux Ratio 50/50 Solder Paste Type No Clean Type 3 or Finer Trace Finish OSP Cu Trace Width 150 mm Max Copper Solder mask NSMD SMD Figure 6. NSMD vs. SMD − − − − − − − − − − − − − − − − − − − − − − − − − − − − Tp = (15−30 sec) Tp = 260°C − 5°C RAMP−UP RAMP−DOWN tL (60−90 sec) PRE−HEAT ZONE 0− 15 − 30 − 45 − 60 − 75 − 90 − 105 − 119 − 134 − 149 − 165 − 180 − 195 − 209 − 224 − 239 − 254 − 269 − 284 − 299 − 314 − 329 − 344 − 359 − 374 − 389 − 404 − 419 − 434 − 449 − 464 − 479 − 494 − TEMPERATURE (°C) 280 270 260 250 240 230 TL= 217 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 TIME (seconds) Figure 7. Typical Pb−Free Solder Heating Profile http://onsemi.com 4 NUF2222FC PACKAGE DIMENSIONS 8 PIN FLIP−CHIP CASE 499AM−01 ISSUE O D 4X A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B 0.10 C TERMINAL A1 LOCATOR E DIM A A1 A2 D E b e E1 TOP VIEW A2 A1 0.10 C A 0.05 C C SIDE VIEW SEATING PLANE e e/2 8X b 0.05 C A B 0.03 C E D C B A e 1 2 3 E1 e/2 BOTTOM VIEW http://onsemi.com 5 MILLIMETERS MIN MAX −−− 0.700 0.210 0.270 0.380 0.430 1.270 BSC 1.970 BSC 0.290 0.340 0.700 BSC 1.400 BSC NUF2222FC ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 6 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NUF2222FC/D