CM1410 4-Channel Headset EMI Filter Array with ESD Protection Product Description The CM1410 is a quad low−pass filter array integrating four pi−style filters (C−R−C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom−designed to interface with the headset port on a cellular telephone, and contains three different filter values. Each high quality filter provides more than 20 dB attenuation in the 800−2700 MHz range. These pi−style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the CM1410 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The CM1410 can safely dissipate ESD strikes of ±8 kV, the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±15 kV. The CM1410 also includes a single channel of ESD−only protection. The CM1410 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1410 incorporates OptiGuardt coating which results in improved reliability at assembly. The CM1410 is available in a space−saving, low−profile Chip Scale Package with RoHS−compliant lead−free finishing. Features • Functionally and Pin Compatible with CSPEMI200A Device • Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) • • • • • • • Network Four Channels of EMI Filtering with ESD Protection Includes One Channel of ESD−Only Protection Greater than 30 dB Attenuation at 1 GHz ±8 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) ±15 kV ESD Protection on Each Channel (HBM) Supports Bipolar Signals − Ideal for Audio Applications These Devices are Pb−Free and are RoHS Compliant March, 2011 − Rev. 3 MARKING DIAGRAM N103 MG G N103 = CM1410−03CP M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping† CM1410−03CP CSP−11 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Inductance for Optimum Filter and ESD Performance • 11−Bump, 2.046 mm X 1.436 mm Footprint Chip Scale • Package (CSP) OptiGuardt Coated for Improved Reliability at Assembly • Digital Camcorders • Notebooks • Desktop PCs EMI Filtering and ESD Protection for Audio Ports Wireless Handsets Handheld PCs / PDAs MP3 Players © Semiconductor Components Industries, LLC, 2011 WLCSP11 CP SUFFIX CASE 567BN • Chip Scale Package Features Extremely Low Lead Applications • • • • http://onsemi.com 1 Publication Order Number: CM1410/D CM1410 BLOCK DIAGRAM MC_IN1 47 pF 47 pF 68 W C2 10 W C3 SPKR_IN2 MC_OUT2 47 pF 10 W C4 SPKR_OUT1 A4 B3 SPKR_OUT2 B2 B4 Top View (Bumps Down View) 11−bump CSP Package Pin Name A1 N.B. Orientation Marking Description No Bump − used for orientation / alignment A2 MIC_IN2 A3 SPKR_OUT1 Speaker Output 1 (to speaker) A4 SPKR_OUT2 Speaker Output 2 (to speaker) B1 MIC_IN1 Microphone Input 1 (from microphone) B2 ESD1 ESD Protection Input. Provides a channel specifically for ESD protection purposes. B3 GND Device Ground Device Ground A Microphone Input 2 (from microphone) 1 B4 GND MIC_OUT1 Microphone Output 1 (to audio circuitry) C2 MIC_OUT2 Microphone Output 1 (to audio circuitry) C3 SPKR_IN1 Speaker Input 1 (from audio circuitry) 2 3 4 A1 N103 B C1 SPKR_IN2 ESD1 PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS C4 A3 100 pF GND SPKR_IN1 100 pF 47 pF GND MC_OUT1 100 pF A2 C1 100 pF MC_IN2 100 W B1 C Bottom View (Bumps Up View) C1 C2 C3 C4 B1 B2 B3 B4 A2 A3 A4 Orientation Marking Speaker Input 2 (from audio circuitry) A1 CM1410 CSP Package SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units –65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 400 mW Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 CM1410 Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Min Typ Max Units R1 Resistance 1 Parameter Conditions 90 100 110 W R2 Resistance 2 61 68 75 W R3 Resistance 3 9 10 11 W C1 Capacitance 1 38 47 57 pF C2 Capacitance 2 80 100 120 pF 1.0 mA ILEAK Diode Leakage Current VIN = 5.0 V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 (Notes 2 and 4) Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients (Notes 2, 3 and 4) fC1 Cut−off Frequency 1 (Note 5) R = 100 W, C = 47 pF 53 MHz fC2 Cut−off Frequency 2 (Note 5) R = 68 W, C = 47 pF 61 MHz fC3 Cut−off Frequency 3 (Note 5) R = 10 W, C = 100 pF 33 MHz VCL 5 −15 7 –10 15 −5 V kV ±15 ±8 V +15 –19 1. TA = 25°C unless otherwise specified. 2. ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only. 3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1, then clamping voltage is measured at Pin C1. 4. Unused pins are left open 5. ZSOURCE = 50 W, ZLOAD = 50 W http://onsemi.com 3 CM1410 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise) Figure 1. Microphone 1 Circuit (B1−C1) EMI Filter Performance Figure 2. Microphone 2 Circuit (A2−C2) EMI Filter Performance http://onsemi.com 4 CM1410 PERFORMANCE INFORMATION Typical Filter Performance (nominal conditions unless specified otherwise) Figure 3. Speaker 1 Circuit (A3−C3) EMI Filter Performance Figure 4. Speaker 2 Circuit (A4−C4) EMI Filter Performance http://onsemi.com 5 CM1410 APPLICATION INFORMATION Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.240 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.290 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C Non−Solder Mask Defined Pad 0.240 mm DIA. Solder Stencil Opening 0.300 mm DIA. Solder Mask Opening 0.290 mm DIA. Figure 5. Recommended Non−Solder Mask Defined Pad Illustration Temperature (5C) 250 200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 6. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 6 CM1410 PACKAGE DIMENSIONS WLCSP11, 2.05x1.44 CASE 567BN−01 ISSUE O 2X D È PIN A1 REFERENCE A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. E DIM A A1 A2 b D E e 0.05 C 2X 0.05 C TOP VIEW ÉÉÉÉÉ OptiGuard Option 0.05 C A2 RECOMMENDED SOLDERING FOOTPRINT* A A1 0.05 C NOTE 3 C SIDE VIEW A1 MILLIMETERS MIN MAX 0.72 0.56 0.21 0.27 0.42 REF 0.29 0.35 2.05 BSC 1.44 BSC 0.50 BSC SEATING PLANE PACKAGE OUTLINE e 11X 0.05 C A B 0.03 C e/2 b e C 0.50 PITCH B 11X 0.50 PITCH 0.25 DIMENSIONS: MILLIMETERS A 1 2 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 4 BOTTOM VIEW OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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