4-Channel Headset EMI Filter Array with ESD Protection CM1410 Features Product Description • The CM1410 is a quad low-pass filter array integrating four pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains three different filter values. Each high quality filter provides more than 20dB attenuation in the 800-2700 MHz range. These pistyle filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. • • • • • • • • • • • Functionally and pin compatible with the CSPEMI200A device Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network Four channels of EMI filtering with ESD protection Includes one channel of ESD-only protection Greater than 30dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) Supports bipolar signals—ideal for audio applications Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 11-bump, 2.046mm X 1.436mm footprint Chip Scale Package (CSP) Optiguard coated for improved reliability at assembly RoHS-compatible, lead-free packaging Applications • • • • • • • EMI filtering and ESD protection for audio ports Wireless handsets Handheld PCs / PDAs MP3 players Digital camcorders Notebooks Desktop PCs In addition, the CM1410 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The CM1410 can safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CM1410 also includes a single channel of ESD-only protection. The CM1410 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1410 incorporates Optiguard coating which results in improved reliability at assembly.The CM1410 is available in a space-saving, low-profile RoHS-compliant, Chip Scale Package. ©2010 SCILLC. All rights reserved. April 2010 Rev. 2 Publication Order Number: CM1410/D CM1410 Block Diagram Rev. 2 | Page 2 of 10 | www.onsemi.com CM1410 PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 N.B. A2 MIC_IN2 A3 SPKR_OUT1 Speaker Output 1 (to speaker) A4 SPKR_OUT2 Speaker Output 2 (to speaker) B1 MIC_IN1 B2 ESD1 ESD Protection Input. Provides a channel specifically for ESD protection purposes. B3 GND Device Ground B4 GND Device Ground C1 MIC_OUT1 Microphone Output 1 (to audio circuitry) C2 MIC_OUT2 Microphone Output 2 (to audio circuitry) C3 SPKR_IN1 Speaker Input 1 (from audio circuitry) C4 SPKR_IN2 Speaker Input 2 (from audio circuitry) No Bump – used for orientation / alignment Microphone Input 2 (from microphone) Microphone Input 1 (from microphone) Ordering Information PART NUMBERING INFORMATION 1 Bumps Package Ordering Part Number Part Marking 11 CSP CM1410-03CP N103 Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 400 mW Storage Temperature Range Rev. 2 | Page 3 of 10 | www.onsemi.com CM1410 STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING UNITS -40 to +85 °C ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) CONDITIONS MIN TYP MAX UNITS SYMBOL PARAMETER R1 Resistance 1 90 100 110 Ω R2 Resistance 2 61 68 75 Ω R3 Resistance 3 9 10 11 Ω C1 Capacitance 1 38 47 57 pF C2 Capacitance 2 80 100 120 pF ILEAK Diode Leakage Current VIN=5.0V 1.0 µA VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA 15 -5 V V In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 and 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3 and 4 fC1 Cut-off frequency 1; Note 5 fC2 fC3 VESD VCL 5 -15 7 -10 ±15 kV ±8 kV +15 -19 V V R = 100Ω, C = 47pF 53 MHz Cut-off frequency 2; Note 5 R = 68Ω, C = 47pF 61 MHz Cut-off frequency 3; Note 5 R = 10Ω, C = 100pF 33 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin B1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: ZSOURCE=50Ω, ZLOAD=50Ω Rev. 2 | Page 4 of 10 | www.onsemi.com CM1410 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise) Figure 1. Microphone 1 Circuit (B1-C1) EMI Filter Performance Figure 2. Microphone 2 Circuit (A2-C2) EMI Filter Performance Rev. 2 | Page 5 of 10 | www.onsemi.com CM1410 Performance Information (Cont’d) Typical Filter Performance (nominal conditions unless specified otherwise) Figure 3. Speaker 1 Circuit (A3-C3) EMI Filter Performance Figure 4. Speaker 2 Circuit (A4-C4) EMI Filter Performance Rev. 2 | Page 6 of 10 | www.onsemi.com CM1410 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 7 of 10 | www.onsemi.com 260°C CM1410 Mechanical Details CSP Mechanical Specifications The CM1410 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 11 Dim Millimeters Min Nom Max Inches Min Nom Max A1 2.001 2.046 2.091 0.0788 0.0806 0.0823 A2 1.391 1.436 1.481 0.0548 0.0565 0.0583 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.495 0.500 0.505 0.0195 0.0197 0.0199 C1 0.223 0.273 0.323 0.0088 0.0107 0.0127 C2 0.168 0.218 0.268 0.0066 0.0086 0.0106 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1410 Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 8 of 10 | www.onsemi.com CM1410 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) CM1410 2.05 X 1.44 X 0.644 POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 2.29 X 1.60 X 0.81 8mm 178mm (7") 3500 4mm 4mm Figure 7. Tape and Reel Mechanical Data Rev. 2 | Page 9 of 10 | www.onsemi.com CM1410 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: FULFILLMENT Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: Phone 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: Fax 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: Email [email protected] N. American Technical Support: Support 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 Rev. 2 | Page 10 of 10 | www.onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative