ONSEMI CM1410-03CP

4-Channel Headset EMI Filter Array
with ESD Protection
CM1410
Features
Product Description
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The CM1410 is a quad low-pass filter array
integrating four pi-style filters (C-R-C) that reduce
EMI/RFI emissions while at the same time providing
ESD protection. This device is custom-designed to
interface with the headset port on a cellular
telephone, and contains three different filter values.
Each high quality filter provides more than 20dB
attenuation in the 800-2700 MHz range. These pistyle filters support bidirectional filtering, controlling
EMI both to and from the microphone and speaker
elements. They also support bipolar signals, enabling
audio signals to pass through without distortion.
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Functionally and pin compatible with the
CSPEMI200A device
Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network
Four channels of EMI filtering with ESD
protection
Includes one channel of ESD-only protection
Greater than 30dB attenuation at 1GHz
+8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+15kV ESD protection on each channel (HBM)
Supports bipolar signals—ideal for
audio applications
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
11-bump, 2.046mm X 1.436mm footprint
Chip Scale Package (CSP)
Optiguard coated for improved reliability at
assembly
RoHS-compatible, lead-free packaging
Applications
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EMI filtering and ESD protection for audio ports
Wireless handsets
Handheld PCs / PDAs
MP3 players
Digital camcorders
Notebooks
Desktop PCs
In addition, the CM1410 provides a very high level of
protection for sensitive electronic components that
may be subject to electrostatic discharge (ESD). The
CM1410 can safely dissipate ESD strikes of +8kV,
the maximum requirement of the IEC 61000-4-2
international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for
contact discharges to greater than +15kV. The
CM1410 also includes a single channel of ESD-only
protection.
The CM1410 is particularly well suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight.
The CM1410 incorporates Optiguard coating which
results in improved reliability at assembly.The
CM1410 is available in a space-saving, low-profile
RoHS-compliant, Chip Scale Package.
©2010 SCILLC. All rights reserved.
April 2010 Rev. 2
Publication Order Number:
CM1410/D
CM1410
Block Diagram
Rev. 2 | Page 2 of 10 | www.onsemi.com
CM1410
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
A1
N.B.
A2
MIC_IN2
A3
SPKR_OUT1
Speaker Output 1 (to speaker)
A4
SPKR_OUT2
Speaker Output 2 (to speaker)
B1
MIC_IN1
B2
ESD1
ESD Protection Input. Provides a channel specifically for ESD protection purposes.
B3
GND
Device Ground
B4
GND
Device Ground
C1
MIC_OUT1
Microphone Output 1 (to audio circuitry)
C2
MIC_OUT2
Microphone Output 2 (to audio circuitry)
C3
SPKR_IN1
Speaker Input 1 (from audio circuitry)
C4
SPKR_IN2
Speaker Input 2 (from audio circuitry)
No Bump – used for orientation / alignment
Microphone Input 2 (from microphone)
Microphone Input 1 (from microphone)
Ordering Information
PART NUMBERING INFORMATION
1
Bumps
Package
Ordering Part Number
Part Marking
11
CSP
CM1410-03CP
N103
Note 1: Parts are shipped in Tape and Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
400
mW
Storage Temperature Range
Rev. 2 | Page 3 of 10 | www.onsemi.com
CM1410
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
UNITS
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTICS
(NOTE 1)
CONDITIONS
MIN
TYP
MAX
UNITS
SYMBOL
PARAMETER
R1
Resistance 1
90
100
110
Ω
R2
Resistance 2
61
68
75
Ω
R3
Resistance 3
9
10
11
Ω
C1
Capacitance 1
38
47
57
pF
C2
Capacitance 2
80
100
120
pF
ILEAK
Diode Leakage Current
VIN=5.0V
1.0
µA
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
15
-5
V
V
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2 and 4
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3 and 4
fC1
Cut-off frequency 1; Note 5
fC2
fC3
VESD
VCL
5
-15
7
-10
±15
kV
±8
kV
+15
-19
V
V
R = 100Ω, C = 47pF
53
MHz
Cut-off frequency 2; Note 5
R = 68Ω, C = 47pF
61
MHz
Cut-off frequency 3; Note 5
R = 10Ω, C = 100pF
33
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input pins with respect to GND, one at a time, pins A2, A3, A4, B1 and B2 only.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin
B1, then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: ZSOURCE=50Ω, ZLOAD=50Ω
Rev. 2 | Page 4 of 10 | www.onsemi.com
CM1410
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 1. Microphone 1 Circuit (B1-C1) EMI Filter Performance
Figure 2. Microphone 2 Circuit (A2-C2) EMI Filter Performance
Rev. 2 | Page 5 of 10 | www.onsemi.com
CM1410
Performance Information (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise)
Figure 3. Speaker 1 Circuit (A3-C3) EMI Filter Performance
Figure 4. Speaker 2 Circuit (A4-C4) EMI Filter Performance
Rev. 2 | Page 6 of 10 | www.onsemi.com
CM1410
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50µm
Solder Ball Side Coplanarity
+20µm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 7 of 10 | www.onsemi.com
260°C
CM1410
Mechanical Details
CSP Mechanical Specifications
The CM1410 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
11
Dim
Millimeters
Min
Nom
Max
Inches
Min
Nom
Max
A1
2.001 2.046 2.091 0.0788 0.0806 0.0823
A2
1.391 1.436 1.481 0.0548 0.0565 0.0583
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.495 0.500 0.505 0.0195 0.0197 0.0199
C1
0.223 0.273 0.323 0.0088 0.0107 0.0127
C2
0.168 0.218 0.268 0.0066 0.0086 0.0106
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for CM1410
Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 2 | Page 8 of 10 | www.onsemi.com
CM1410
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
CM1410
2.05 X 1.44 X
0.644
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
2.29 X 1.60 X 0.81
8mm
178mm (7")
3500
4mm
4mm
Figure 7. Tape and Reel Mechanical Data
Rev. 2 | Page 9 of 10 | www.onsemi.com
CM1410
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
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Rev. 2 | Page 10 of 10 | www.onsemi.com
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