CM1204 4-Channel ESD Array in CSP Product Description The CM1204 is a quad ESD transient voltage suppression diode array. Each diode provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). These diodes safely dissipate ESD strikes of ±15 kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±30 kV. The CM1204 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1204 features Optiguardt coating which results in improved reliability at assembly. It is available in a space-saving, low-profile chip scale package with RoHS-compliant lead-free finishing. http://onsemi.com CSP−5 CP SUFFIX CASE 567AY BLOCK DIAGRAM ESD_1 ESD_2 ESD_3 A1 A3 C1 ESD_4 C3 Features • Functionally and Pin Compatible with ON Semiconductor’s • • • • • • • CSPESD304 Optiguardt Coated for Improved Reliability Four Channels of ESD Protection ±15 kV ESD Protection on Each Channel (IEC 61000-4-2 Level 4, Contact Discharge) ±30 kV ESD Protection on Each Channel (HBM) Chip Scale Package Features Extremely Low Lead Inductance for Optimum ESD Protection 5-bump, 0.960 mm X 1.330 mm Footprint Chip Scale Package (CSP) These Devices are Pb−Free and are RoHS Compliant S S Protection for Portable Devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs January, 2011 − Rev. 4 = Specific Device Code ORDERING INFORMATION • ESD Protection for Sensitive Electronic Equipment • I/O Port and Keypad and Button Circuitry © Semiconductor Components Industries, LLC, 2011 B2 MARKING DIAGRAM Applications • • • • • • GND Device Package Shipping† CM1204−03CP CSP (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 Publication Order Number: CM1204/D CM1204 PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS Name Description A1 ESD_1 ESD Channel 1 A3 ESD_2 ESD Channel 2 B2 GND Device Ground C1 ESD_3 ESD Channel 3 C3 ESD_4 ESD Channel 4 Orientation Marking Top View (Bumps Down View) Bottom View (Bumps Up View) ESD_3 + Pin ESD_4 C1 C3 GND B2 ESD_1 ESD_2 A1 A3 A1 Orientation Marking CM1204 CSP Package with OptiGuardt SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Range Rating Units −65 to +150 °C 200 mW DC Package Power Rating Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units −40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter VDIODE Diode Reverse Breakdown Voltage IDIODE = 10 μA ILEAK Diode Leakage Current VIN = 3.3 V, TA = 25°C VSIG Signal Voltage Positive Clamp Negative Clamp IDIODE = 10 mA VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 (Note 2) Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8 kV Positive Transients Negative Transients (Note 2) Diode Capacitance At 2.5 VDC Reverse Bias, 1 MHz, 30 mVAC VCL CDIODE Conditions Min Typ Max 6.0 V 100 5.6 −1.5 6.8 −0.8 Units 9.0 −0.4 nA V kV ±30 ±15 V +15 −8 1. TA = −40 to +85°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. http://onsemi.com 2 22 27 32 pF CM1204 PERFORMANCE INFORMATION Diode Characteristics (nominal conditions unless specified otherwise) Figure 1. Typical Diode Capacitance vs. Input Voltage (Normalized to 2.5 VDC) Figure 2. Frequency Response (Single Channel vs. GND, in 50 W System) http://onsemi.com 3 CM1204 APPLICATION INFORMATION Refer to Application Note “The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by ON Semiconductor. Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.275 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.325 mm Round Solder Stencil Thickness 0.125 mm − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106 A) Tolerance — Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature 260°C Figure 3. Recommended Non−Solder Mask Defined Pad Illustration Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 4 CM1204 PACKAGE DIMENSIONS WLCSP5, 0.96x1.33 CASE 567AY−01 ISSUE O D 2X A ÈÈ ÈÈ PIN A1 REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE 0.05 C 2X 0.05 C TOP VIEW ÉÉÉ ÉÉÉ A2 OptiGuard Option 0.05 C 0.05 C NOTE 3 A1 A SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* C SEATING PLANE A1 eD/2 5X 0.05 C A B 0.03 C PACKAGE OUTLINE 0.87 eD b MILLIMETERS MIN MAX 0.56 0.72 0.21 0.27 0.40 REF 0.29 0.35 0.96 BSC 1.33 BSC 0.50 BSC 0.435 BSC eE C 0.44 B 0.25 0.50 A 5X 0.25 DIMENSIONS: MILLIMETERS 1 2 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. BOTTOM VIEW Optiguard is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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