BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo and Compass Rev. 3 — 29 March 2012 Product data sheet 1. Product profile 1.1 General description The BGU7007 is a Low Noise Amplifier (LNA) for GNSS receiver applications in a plastic leadless 6-pin, extremely small SOT886 package. The BGU7007 requires only one external matching inductor and one external decoupling capacitor. The BGU7007 adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for low power consumption and optimal performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels it delivers 18.5 dB gain at a noise figure of 0.85 dB. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Covers full GNSS L1 band, from 1559 MHz to 1610 MHz Noise figure (NF) = 0.85 dB Gain 18.5 dB High input1 dB compression point Pi (1dB) of 12 dBm High out of band IP3i of 4 dBm Supply voltage 1.5 V to 3.1 V Power-down mode current consumption < 1 A Optimized performance at low supply current of 4.8 mA Integrated temperature stabilized bias for easy design Requires only one input matching inductor and one supply decoupling capacitor Input and output DC decoupled ESD protection on all pins (HBM > 2 kV) Integrated matching for the output Small 6-pin leadless package 1 mm 1.45 mm 0.5 mm 110 GHz transit frequency - SiGe:C technology BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 1.3 Applications LNA for GPS, GLONASS, Galileo and Compass (BeiDou) in smart phones, feature phones, tablet PCs, Personal Navigation Devices, Digital Still Cameras, Digital Video Cameras, RF Front End modules, complete GPS chipset modules and theft protection (laptop, ATM) 1.4 Quick reference data Table 1. Quick reference data f = 1559 MHz to 1610 MHz; VCC = 1.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 1.5 - 3.1 V Pi < 40 dBm 3.4 4.8 6.1 mA Pi = 20 dBm 8.9 12.8 15.9 mA VCC supply voltage RF input AC coupled ICC supply current VENABLE 0.8 V power gain Gp NF noise figure Pi < 40 dBm, no jammer 16.5 18.5 20.5 dB Pi = 20 dBm 17.5 19.5 21.5 dB Pi < 40 dBm, no jammer [1] - 0.85 1.2 dB Pi < 40 dBm, no jammer [2] - 0.90 1.3 dB - 1.2 1.6 dB VCC = 1.5 V 16 13 - dBm VCC = 1.8 V 15 12 - dBm VCC = 2.85 V 14 11 - dBm Pi = 20 dBm Pi(1dB) input third-order intercept point IP3i [1] input power at 1 dB gain compression f = 1559 MHz to 1610 MHz f = 1.575 GHz VCC = 1.5 V [3] 1 4 - dBm VCC = 1.8 V [3] 1 4 - dBm VCC = 2.85 V [3] 2 5 - dBm PCB losses are subtracted. [2] Including PCB losses. [3] f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = 30 dBm. 2. Pinning information Table 2. Pin Description 1 GND 2 GND 3 RF_IN 4 VCC 5 ENABLE 6 BGU7007 Product data sheet Pinning Simplified outline 6 5 Graphic symbol 4 4 5 3 6 2 1 RF_OUT All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 2 3 Transparent top view 1 sym129 © NXP B.V. 2012. All rights reserved. 2 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 3. Ordering information Table 3. Ordering information Type number BGU7007 Package Name Description Version XSON6 plastic extremely thin small outline package; no leads; SOT886 6 terminals; body 1 1.45 0.5 mm 4. Marking Table 4. Marking codes Type number Marking code BGU7007 B6 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit supply voltage RF input AC coupled 0.5 +5.0 V VENABLE voltage on pin ENABLE VENABLE < VCC + 0.6 [2] 0.5 +5.0 V DC; VRF_IN < VCC + 0.6 [2][3] 0.5 +5.0 V DC; VRF_OUT < VCC + 0.6 [2][3] VCC VRF_IN voltage on pin RF_IN VRF_OUT voltage on pin RF_OUT Pi input power Ptot total power dissipation Tstg storage temperature Tj junction temperature VESD electrostatic discharge voltage Tsp 130 C 0.5 +5.0 V - 0 dBm 55 mW 65 +150 C [1] - 150 C Human Body Model (HBM); According JEDEC standard 22-A114E - 4 kV Charged Device Model (CDM); According JEDEC standard 22-C101B - 1 kV [1] Tsp is the temperature at the soldering point of the emitter lead. [2] Warning: due to internal ESD diode proctection, the applied DC voltage should not exceed VCC + 0.6 and shall not exceed 5.0 V in order to avoid excess current. [3] The RF input and RF output are AC coupled through internal DC blocking capacitors. 6. Thermal characteristics BGU7007 Product data sheet Table 6. Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to solder point Conditions All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 Typ Unit 225 K/W © NXP B.V. 2012. All rights reserved. 3 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 7. Characteristics Table 7. Characteristics f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit 1.5 - 3.1 V Pi < 40 dBm 3.4 4.8 6.1 mA Pi = 20 dBm 8.9 12.8 15.9 VCC supply voltage RF input AC coupled ICC supply current VENABLE 0.8 V VENABLE 0.35 V Tamb ambient temperature Gp power gain 1 mA A - - 40 +25 +85 C 16.5 18.5 20.5 dB Tamb = 25 C Pi < 40 dBm, no jammer Pi = 20 dBm, no jammer 17.5 19.5 21.5 dB Pjam = 20 dBm; fjam = 850 MHz 17.5 19.5 21.5 dB Pjam = 20 dBm; fjam = 1850 MHz 17.5 19.5 21.5 dB 40 C Tamb +85 C RLin RLout input return loss output return loss ISL isolation NF noise figure Pi < 40 dBm, no jammer 16 - 21 dB Pi = 20 dBm, no jammer 17 - 22 dB Pjam = 20 dBm; fjam = 850 MHz 17 - 22 dB Pjam = 20 dBm; fjam = 1850 MHz 17 - 22 dB Pi < 40 dBm 5 7 - dB Pi = 20 dBm 7 10 - dB Pi < 40 dBm 12 18 - dB Pi = 20 dBm 15 24 - dB 22 24 - dB Tamb = 25 C Pi < 40 dBm, no jammer [1] - 0.85 1.2 dB Pi < 40 dBm, no jammer [2] - 0.90 1.3 dB Pi = 20 dBm, no jammer - 1.2 1.6 dB Pjam = 20 dBm; fjam = 850 MHz - 1.1 1.5 dB Pjam = 20 dBm; fjam = 1850 MHz - 1.3 1.7 dB 40 C Tamb +85 C BGU7007 Product data sheet Pi < 40 dBm, no jammer - - 1.7 dB Pi = 20 dBm, no jammer - - 1.9 dB Pjam = 20 dBm; fjam = 850 MHz - - 1.8 dB Pjam = 20 dBm; fjam = 1850 MHz - - 2.0 dB All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 4 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass Table 7. Characteristics …continued f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE >= 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 5.6 nH inductor; unless otherwise specified. Symbol Parameter Pi(1dB) Conditions Min Typ Max Unit input power at 1 dB gain compression f = 1559 MHz to 1610 MHz VCC = 1.5 V 16 13 - dBm VCC = 1.8 V 15 12 - dBm VCC = 2.85 V 14 11 - dBm f = 806 MHz to 928 MHz VCC = 1.5 V [3] 16 13 - dBm VCC = 1.8 V [3] 15 12 - dBm VCC = 2.85 V [3] 15 12 - dBm VCC = 1.5 V [3] 14 11 - dBm VCC = 1.8 V [3] 13 10 - dBm VCC = 2.85 V [3] 11 8 - dBm VCC = 1.5 V [4] 1 4 - dBm VCC = 1.8 V [4] 1 4 - dBm VCC = 2.85 V [4] 2 5 - dBm turn-on time [5] - - 2 s toff turn-off time [5] s K Rollett stability factor f = 1612 MHz to 1909 MHz input third-order intercept point IP3i ton [1] PCB losses are subtracted. [2] Including PCB losses. [3] Out of band. f = 1.575 GHz [4] f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = 30 dBm. [5] Within 10 % of the final gain. - - 1 1 - - Table 8. ENABLE (pin 5) 40 C Tamb +85 C; 1.5 V VCC 3.1 V BGU7007 Product data sheet VENABLE (V) State 0.35 OFF 0.8 ON All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 5 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 8. Application information 8.1 GNSS LNA Ven Vcc C1 RF input 5 L1 3 IC1 4 RF output 6 1 2 001aak685 For a list of components see Table 9. Fig 1. Schematics GNSS LNA evaluation board Table 9. List of components For schematics see Figure 1. Component Description Value Supplier C1 decoupling capacitor 1 nF various IC1 BGU7007 - NXP L1 high quality matching inductor 5.6 nH Murata LQW15A 001aao158 6.5 ICC (mA) Remarks 001aao159 6.0 ICC (mA) (1) (2) 5.5 (3) 5.0 (3) (2) (1) 4.5 4.0 3.5 1.0 1.5 2.0 2.5 3.0 -55 3.0 3.5 VCC (V) Pi = 45 dBm. -15 (1) VCC = 1.5 V (2) Tamb = +25 C (2) VCC = 1.8 V (3) Tamb = +85 C (3) VCC = 2.85 V Supply current as a function of supply voltage; typical values BGU7007 Product data sheet 65 105 Tamb (°C) Pi = 45 dBm. (1) Tamb = 40 C Fig 2. 25 Fig 3. Supply current as a function of ambient temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 6 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 001aao160 20 Gp (dB) 001aao161 20 Gp (dB) 16 16 12 12 (4) (1) (3) (2) 8 8 (3) (2) (1) 4 4 0 500 1000 1500 2000 0 500 2500 3000 f (MHz) VCC = 1.8 V; Pi = 45 dBm. 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 C. (1) Tamb = 40 C (1) Pi = 45 dBm (2) Tamb = +25 C (2) Pi = 30 dBm (3) Tamb = +85 C (3) Pi = 20 dBm (4) Pi = 15 dBm Fig 4. Power gain as a function of frequency; typical values Fig 5. 001aao162 20 Gp (dB) Power gain as a function of frequency; typical values 001aao163 22 Gp (dB) 16 ICC (mA) (3) (2) (1) Gp 19 25 20 (3) 12 (2) (3) (2) (1) 16 (1) 8 10 ICC 5 13 4 0 500 1000 1500 2000 10 -50 2500 3000 f (MHz) Pi = 45 dBm; Tamb = 25 C. 0 -40 (1) VCC = 1.5 V (2) VCC = 1.8 V (2) VCC = 1.8 V (3) VCC = 2.85 V Product data sheet -10 0 Pi (dBm) (3) VCC = 2.85 V Power gain as a function of frequency; typical values BGU7007 -20 Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V Fig 6. -30 Fig 7. Power gain as a function of input power; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 7 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 001aao164 1.6 NF (dB) 1.2 0.8 0.4 0 1550 1564 1578 1592 1606 1620 f (MHz) VCC = 1.8 V; Tamb = 25 C; no jammer. Fig 8. Noise figure as a function of frequency; typical values 001aao165 1.6 NF (dB) NF (dB) 1.2 1.2 0.8 0.8 0.4 0.4 0 1.2 1.6 2 2.4 2.8 3.2 VCC (V) f = 1575 MHz; Tamb = 25 C; no jammer. Fig 9. 001aao166 1.6 Product data sheet -20 10 40 70 100 Tamb (°C) f = 1575 MHz; VCC = 1.8 V; no jammer. Noise figure as a function of supply voltage; typical values BGU7007 0 -50 Fig 10. Noise figure as a function of ambient temperature; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 8 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 001aao167 4 NF (dB) 001aao168 4 NF (dB) 3 3 2 2 1 (3) (2) (1) 1 (3) (2) (1) 0 -50 -40 -30 -20 0 -50 -10 0 Pjam (dBM) fjam= 850 MHz; Tamb = 25 C; f = 1575 MHz. -40 -20 -10 0 Pjam (dBM) fjam= 1850 MHz; Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V (1) VCC = 1.5 V (2) VCC = 1.8 V (2) VCC = 1.8 V (3) VCC = 2.85 V (3) VCC = 2.85 V Fig 11. Noise figure as a function of jamming power; typical values Fig 12. Noise figure as a function of jamming power; typical values 001aao169 0 -30 RLin (dB) 001aao170 0 RLin (dB) -5 -10 -10 -15 -20 (1) (3) -20 (2) (2) (4) (1) (3) -25 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = 45 dBm. -30 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 C. (1) Tamb = 40 C (1) Pi = 45 dBm (2) Tamb = +25 C (2) Pi = 30 dBm (3) Tamb = +85 C (3) Pi = 20 dBm (4) Pi = 15 dBm Fig 13. Input return loss as a function of frequency; typical values BGU7007 Product data sheet Fig 14. Input return loss as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 9 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 001aao171 0 001aao172 0 RLin (dB) RLin (dB) -5 -3 -10 -6 -15 -9 -20 -12 (1) (2) (3) -25 500 1000 1500 2000 (1) (2) (3) 2500 3000 f (MHz) -15 -50 Pi = 45 dBm; Tamb = 25 C. -40 -20 -10 0 Pi (dBm) Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V (1) VCC = 1.5 V (2) VCC = 1.8 V (2) VCC = 1.8 V (3) VCC = 2.85 V (3) VCC = 2.85 V Fig 15. Input return loss as a function of frequency; typical values 001aao173 0 -30 RLout (dB) Fig 16. Input return loss as a function of input power; typical values 001aao174 0 RLout (dB) -5 -5 -10 -10 -15 -20 -15 (1) (2) -25 (1) (2) (3) -20 -25 500 1000 (3) (4) -30 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = 45 dBm. -35 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 C. (1) Tamb = 40 C (1) Pi = 45 dBm (2) Tamb = +25 C (2) Pi = 30 dBm (3) Tamb = +85 C (3) Pi = 20 dBm (4) Pi = 15 dBm Fig 17. Output return loss as a function of frequency; typical values BGU7007 Product data sheet Fig 18. Output return loss as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 10 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 001aao175 0 RLout (dB) 001aao176 0 RLout (dB) -5 -4 -10 -8 -15 -20 -12 (3) (1) -25 (3) -16 -30 (2) (1) -20 500 1000 (2) 1500 2000 2500 3000 f (MHz) -35 -50 Pi = 45 dBm; Tamb = 25 C. -40 -20 -10 0 Pi (dBm) Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V (1) VCC = 1.5 V (2) VCC = 1.8 V (2) VCC = 1.8 V (3) VCC = 2.85 V (3) VCC = 2.85 V Fig 19. Output return loss as a function of frequency; typical values Fig 20. Output return loss as a function of input power; typical values 001aao177 0 -30 ISL (dB) 001aao178 0 ISL (dB) -10 -10 (1) (2) (3) -20 -20 (3) (2) (4) (1) -30 -30 -40 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Pi = 45 dBm. -40 500 1000 1500 2000 2500 3000 f (MHz) VCC = 1.8 V; Tamb = 25 C. (1) Tamb = 40 C (1) Pi = 45 dBm (2) Tamb = +25 C (2) Pi = 30 dBm (3) Tamb = +85 C (3) Pi = 20 dBm (4) Pi = 15 dBm Fig 21. Isolation as a function of frequency; typical values BGU7007 Product data sheet Fig 22. Isolation as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 11 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 001aao179 0 001aao180 0 ISL (dB) ISL (dB) -10 -10 (1) (2) (3) (1) -20 -20 (2) (3) -30 -30 -40 500 1000 1500 2000 2500 3000 f (MHz) -40 -50 Pi = 45 dBm; Tamb = 25 C. -40 (1) VCC = 1.5 V (2) VCC = 1.8 V (2) VCC = 1.8 V (3) VCC = 2.85 V (3) VCC = 2.85 V Fig 23. Isolation as a function of frequency; typical values 001aao181 -10 0 Pi (dBm) Fig 24. Isolation as a function of input power; typical values Pi(1dB) (dBm) -4 -4 -8 -8 (3) (2) 001aao182 0 Pi(1dB) (dBm) -12 -20 Tamb = 25 C; f = 1575 MHz. (1) VCC = 1.5 V 0 -30 (3) -12 (2) (1) (1) -16 -16 -20 1.2 1.6 2 2.4 2.8 3.2 VCC (V) f = 1575 MHz. -20 1.2 1.6 (1) Tamb = 40 C (2) Tamb = +25 C (2) Tamb = +25 C (3) Tamb = +85 C (3) Tamb = +85 C Fig 25. Input power at 1 dB gain compression as a function of supply voltage; typical values Product data sheet 2.4 2.8 3.2 VCC (V) f = 850 MHz. (1) Tamb = 40 C BGU7007 2 Fig 26. Input power at 1 dB gain compression as a function of supply voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 12 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 001aao183 0 Pi(1dB) (dBm) -4 (3) (2) (1) -8 -12 -16 -20 1.2 1.6 2 2.4 2.8 3.2 VCC (V) f = 1850 MHz. (1) Tamb = 40 C (2) Tamb = +25 C (3) Tamb = +85 C Fig 27. Input power at 1 dB gain compression as a function of supply voltage; typical values 001aao184 20 IMD3, PL (dBm) 0 PL of 1713 MHz signal 001aao185 20 IMD3, PL (dBm) 0 (1) PL of 1713 MHz signal (2) (3) (1) -20 -20 (2) (3) IMD3 of 1575 MHz signal -40 -40 IMD3 of 1575 MHz signal (3) -60 -60 (1) (2) (3) -80 (2) (1) -80 -100 -100 -120 -40 -30 -20 -10 -120 -40 -30 Pi (dBm) f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz; VCC = 1.8 V. (1) VCC = 1.5 V (1) Tamb = 40 C (2) VCC = 1.8 V (2) Tamb = +25 C (3) VCC = 2.85 V (3) Tamb = +85 C Fig 28. Third order intermodulation distortion and output power as function of input power; typical values Product data sheet -10 Pi (dBm) f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz; Tamb = 25 C. BGU7007 -20 Fig 29. Third order intermodulation distortion and output power as function of input power; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 13 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 001aao186 102 K 001aao187 102 K (3) (2) (3) (1) 10 10 (2) (1) 1 1 10-1 10-1 0 2000 4000 6000 8000 10000 f (MHz) 0 VCC = 1.8 V; Pi = 45 dBm. 2000 (1) VCC = 1.5 V (2) Tamb = +25 C (2) VCC = 1.8 V (3) Tamb = +85 C (3) VCC = 2.85 V Fig 30. Rollett stability factor as a function of frequency; typical values Product data sheet 6000 8000 10000 f (MHz) Tamb = 25 C; Pi = 45 dBm. (1) Tamb = 40 C BGU7007 4000 Fig 31. Rollett stability factor as a function of frequency; typical values All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 14 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 9. Package outline SOT886 XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm b 1 2 3 4x (2) L L1 e 6 5 e1 4 e1 6x A (2) A1 D E terminal 1 index area 0 1 2 mm scale Dimensions (mm are the original dimensions) Unit mm max nom min A(1) 0.5 A1 b D E 0.04 0.25 1.50 1.05 0.20 1.45 1.00 0.17 1.40 0.95 e e1 0.6 0.5 L L1 0.35 0.40 0.30 0.35 0.27 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. Outline version SOT886 sot886_po References IEC JEDEC JEITA European projection Issue date 04-07-22 12-01-05 MO-252 Fig 32. Package outline SOT886 (XSON6) BGU7007 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 15 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 10. Abbreviations Table 10. Abbreviations Acronym Description AC Alternating Current ATM Automated Teller Machine (cash dispenser) DC Direct Current GLONASS GLObal NAvigation Satellite System GNSS Global Navigation Satellite System GPS Global Positioning System HBM Human Body Model MMIC Monolithic Microwave Integrated Circuit PC Personal Computer PCB Printed Circuit Board RF Radio Frequency SiGe:C Silicon Germanium Carbon 11. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes BGU7007 v.3 Product data sheet - BGU7007 v.2 Modifications: 20120329 • • • • • • • Added ‘Compass’ to descriptive title Section 1.3 on page 2: added ‘Compass’ to text Section 1.2 on page 1: row 6, changed 2.85 V to 3.1 V Table 1 on page 2: changed max. value VCC from 2.85 V to 3.1 V Table 7 on page 4: changed max. value VCC from 2.85 V to 3.1 V Table 8 on page 5: changed max. value VCC from 2.85 V to 3.1 V Table 5 on page 3: Several additions and changes BGU7007 v.2 20111103 Product data sheet - BGU7007 v.1 BGU7007 v.1 20110520 Product data sheet - - BGU7007 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 16 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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This document supersedes and replaces all information supplied prior to the publication hereof. BGU7007 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 17 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BGU7007 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 29 March 2012 © NXP B.V. 2012. All rights reserved. 18 of 19 BGU7007 NXP Semiconductors SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 6 GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 29 March 2012 Document identifier: BGU7007