%*
8
BGU8006
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo
and Compass
Rev. 2 — 12 December 2012
Product data sheet
1. Product profile
1.1 General description
The BGU8006 is a Low Noise Amplifier (LNA) for GNSS receiver applications. It comes as
extremely small and thin Wafer Level Chip Scale Package (WLCSP). The BGU8006
requires one external matching inductor and one external decoupling capacitor.
The BGU8006 adapts itself to the changing environment resulting from co-habitation of
different radio systems in modern cellular handsets. It has been designed for low power
consumption and optimal performance when jamming signals from co-existing cellular
transmitters are present. At low jamming power levels it delivers 17.2 dB gain at a noise
figure of 0.60 dB. During high jamming power levels, resulting for example from a cellular
transmit burst, it temporarily increases its bias current to improve sensitivity.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
Covers full GNSS L1 band, from 1559 MHz to 1610 MHz
Noise figure (NF) = 0.60 dB
Gain 17.2 dB
High input 1 dB compression point of 7.5 dBm
High out of band IP3i of 6 dBm
Supply voltage 1.5 V to 3.1 V
Optimized performance at very low 3.6 mA supply current
Power-down mode current consumption < 1 A
Integrated temperature stabilized bias for easy design
Requires only one input matching inductor and one supply decoupling capacitor
Input and output DC decoupled
ESD protection on all pins (HBM > 2 kV)
Integrated matching for the output
Extremely small Wafer Level Chip Scale Package (WLCSP) 0.65 0.44 0.2 mm;
6 solder bumps; 0.22 mm bump pitch
180 GHz transit frequency - SiGe:C technology
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
1.3 Applications
LNA for GPS, GLONASS, Galileo and Compass (BeiDou) in smart phones, feature
phones, tablet, digital still cameras, digital video cameras, RF front-end modules,
complete GNSS modules and personal health applications.
1.4 Quick reference data
Table 1.
Quick reference data
f = 1575 MHz; VCC = 2.85 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a
5.6 nH inductor, see Figure 1; unless otherwise specified.
Symbol Parameter
Conditions
VCC
supply voltage
ICC
supply current
Min Typ Max Unit
Pi = 20 dBm
Pi < 40 dBm
power gain
Pi = 20 dBm
NF
-
3.1
V
-
3.6
-
mA
VI(ENABLE) 0.8 V
Pi < 40 dBm
Gp
1.5
noise figure
Pi < 40 dBm
[1]
Pi < 40 dBm
[2]
Pi(1dB)
input power at 1 dB gain compression
f = 1575 MHz
IP3i
input third-order intercept point
f = 1575 MHz
[1]
PCB losses are subtracted.
[2]
Including PCB losses.
[3]
f1 = 1713 MHz; f2 = 1851 MHz; Pi = 20 dBm per carrier.
[3]
-
8.4
-
mA
-
17.2 -
dB
-
19.0 -
dB
-
0.60 -
dB
-
0.65 -
dB
-
7.5 -
dBm
-
6
dBm
-
2. Pinning information
Table 2.
Pinning
Pin
Description
1
GND_RF
2
RF_IN
3
ENABLE
4
GND
5
VCC
6
RF_OUT
Simplified outline
Graphic symbol
DDD
Bump side view
3. Ordering information
Table 3.
Ordering information
Type
number
Package
Name
Description
Version
BGU8006 WLCSP6 extremely small wafer level chip scale package; 6 solder bumps; WLCSP6
0.22 mm bump pitch; body 0.65 0.44 0.2 mm
OM7829
BGU8006
Product data sheet
EVB
BGU8006 evaluation board
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
2 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
4. Marking
Table 4.
Marking codes
Type number
Marking code
BGU8006
single character, indicating assembly month.[1]
[1]
Month code see Table 5.
Table 5.
Calender marking month code
Underscore indicates pin 1.
Year
[1]
Month
J
F
M
A
M
J
J
A
S
O
N
D
2012
A
B
C
D
E
F
G
H
I
J
K
L
2013
M
N
O
P
Q
R
S
T
U
V
W
X
2014
Y
Z
b
d
f
h
3
4
5
6
7
9
[1]
Rotates every 3 years.
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Absolute Maximum Ratings are given as Limiting Values of stress conditions during operation, that must not be exceeded
under the worst probable conditions.
Symbol
Parameter
Conditions
supply voltage
VCC
Min
Max
Unit
[1]
0.5
+5.0
V
[1][2]
VI(ENABLE)
input voltage on pin ENABLE
VI(ENABLE) < VCC + 0.6 V
0.5
+5.0
V
VI(RF_IN)
input voltage on pin RF_IN
DC, VI(RF_IN) < VCC + 0.6 V
[1][2][3]
0.5
+5.0
V
DC, VI(RF_OUT) < VCC + 0.6 V
[1][2][3]
0.5
+5.0
V
-
10
dBm
VI(RF_OUT)
input voltage on pin RF_OUT
Pi
input power
1575 MHz
[1]
Tstg
storage temperature
65
+150
C
Tj
junction temperature
-
150
C
VESD
electrostatic discharge voltage
Human Body Model (HBM) According to
JEDEC standard 22-A114E
-
2
kV
Charged Device Model (CDM) According to
JEDEC standard 22-C101B
-
2
kV
[1]
Stressed with pulses of 200 ms in duration, with application circuit as in Figure 1.
[2]
Warning: due to internal ESD diode protection, the applied DC voltage should not exceed VCC + 0.6 V and shall not exceed 5.0 V in
order to avoid excess current.
[3]
The RF input and RF output are AC coupled through internal DC blocking capacitors.
BGU8006
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
3 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
6. Recommended operating conditions
Table 7.
Operating conditions
Symbol
Parameter
Conditions
Min Typ Max Unit
VCC
supply voltage
1.5
-
Tamb
ambient temperature
40
+25 +85
VI(ENABLE)
input voltage on pin ENABLE
3.1
V
C
OFF state
-
-
0.35 V
ON state
0.8
-
-
V
7. Thermal characteristics
Table 8.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to solder point
Conditions
Typ
Unit
217
K/W
8. Characteristics
Table 9.
Characteristics at Vcc = 1.8 V
f = 1575 MHz; VCC = 1.8 V; VI(ENABLE) >= 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50
using a 5.6 nH inductor, see Figure 1; unless otherwise specified.
Symbol Parameter
ICC
Gp
RLin
RLout
ISL
NF
Pi(1dB)
BGU8006
Product data sheet
Conditions
supply current
power gain
input return loss
output return loss
Min
Max Unit
VI(ENABLE) 0.8 V
Pi < 40 dBm
-
3.5
-
mA
Pi = 20 dBm
-
8
-
mA
VI(ENABLE) 0.35 V
-
-
1
A
no jammer
-
17.0
-
dB
Pjam = 20 dBm; fjam = 850 MHz
-
17.5
-
dB
Pjam = 20 dBm; fjam = 1850 MHz
-
19.0
-
dB
Pi < 40 dBm
-
9
-
dB
Pi = 20 dBm
-
14
-
dB
Pi < 40 dBm
-
13
-
dB
Pi = 20 dBm
-
11
-
dB
isolation
noise figure
Typ
-
27
-
dB
Pi = 40 dBm, no jammer
[1]
-
0.60
-
dB
Pi = 40 dBm, no jammer
[2]
-
0.65
-
dB
Pjam = 20 dBm; fjam = 850 MHz
[2]
-
0.7
-
dB
Pjam = 20 dBm; fjam = 1850 MHz
[2]
-
0.9
-
dB
-
11.2 -
input power at 1 dB
gain compression
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
dBm
© NXP B.V. 2012. All rights reserved.
4 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
Table 9.
Characteristics at Vcc = 1.8 V …continued
f = 1575 MHz; VCC = 1.8 V; VI(ENABLE) >= 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50
using a 5.6 nH inductor, see Figure 1; unless otherwise specified.
Symbol Parameter
Conditions
IP3i
input third-order
intercept point
f = 1.575 GHz
ton
turn-on time
toff
turn-off time
Min
[3]
Typ
Max Unit
-
0
-
dBm
time from VI(ENABLE) ON, to 90 % of
the gain
-
-
2
s
time from VI(ENABLE) OFF, to 10 % of
the gain
-
-
1
s
[1]
PCB losses are subtracted
[2]
Including PCB losses
[3]
f1 = 1713 MHz; f2 = 1851 MHz, Pi = 20 dBm per carrier.
Table 10. Characteristics at Vcc = 2.85 V
f = 1575 MHz; VCC = 2.85 V; VI(ENABLE) >= 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50
using a 5.6 nH inductor, see Figure 1; unless otherwise specified.
Symbol Parameter
supply current
ICC
power gain
Gp
RLin
RLout
ISL
Product data sheet
input return loss
output return loss
Min Typ Max Unit
VI(ENABLE) 0.8 V
Pi < 40 dBm
-
3.6
-
mA
Pi = 20 dBm
-
8.4
-
mA
VI(ENABLE) 0.35 V
-
-
1
A
no jammer
-
17.2 -
dB
Pjam = 20 dBm; fjam = 850 MHz
-
18.0 -
dB
Pjam = 20 dBm; fjam = 1850 MHz
-
19.0 -
dB
Pi < 40 dBm
-
9
-
dB
Pi = 20 dBm
-
15
-
dB
Pi < 40 dBm
-
13
-
dB
Pi = 20 dBm
-
11
-
dB
isolation
NF
BGU8006
Conditions
noise figure
-
27
-
dB
Pi = 40 dBm, no jammer
[1]
-
0.60 -
dB
Pi = 40 dBm, no jammer
[2]
-
0.65 -
dB
Pjam = 20 dBm; fjam = 850 MHz
[2]
-
0.65 -
dB
Pjam = 20 dBm; fjam = 1850 MHz
[2]
-
0.9
dB
-
7.5 -
dBm
-
6
-
dBm
-
Pi(1dB)
input power at 1 dB
gain compression
f = 1575 MHz
IP3i
input third-order
intercept point
f = 1.575 GHz
ton
turn-on time
time from VI(ENABLE) ON, to 90 % of
the gain
-
-
2
s
toff
turn-off time
time from VI(ENABLE) OFF, to 10 % of
the gain
-
-
1
s
[1]
PCB losses are subtracted
[2]
Including PCB losses
[3]
f1 = 1713 MHz; f2 = 1851 MHz, Pi = 20 dBm per carrier
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
[3]
© NXP B.V. 2012. All rights reserved.
5 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
9. Application information
9.1 GNSS LNA
9HQ 9FF
5)LQ
/
,&
&
5)RXW
DDD
For a list of components see Table 11.
Fig 1.
Schematics GNSS LNA evaluation board
Table 11. List of components
For schematics see Figure 1.
Component
Description
Value
Remarks
C1
decoupling capacitor
1 nF
IC1
BGU8006
-
NXP
L1
high quality matching inductor
5.6 nH
Murata LQW15A
9.2 Graphs
,&&
P$
DDD
,&&
P$
DDD
9&&9
Pi = 45 dBm.
7DPE&
Pi = 45 dBm.
(1) Tamb = 40 C
(1) VCC = 1.5 V
(2) Tamb = +25 C
(2) VCC = 1.8 V
(3) Tamb = +85 C
(3) VCC = 2.85 V
(4) VCC = 3.1 V
Fig 2.
Supply current as a function of supply voltage;
typical values
BGU8006
Product data sheet
Fig 3.
Supply current as a function of ambient
temperature; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
6 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
*S
G%
DDD
*S
G%
DDD
I0+]
Pi = 45 dBm; VCC = 1.8 V.
I0+]
Tamb = 25 C; VCC = 1.8 V.
(1) Tamb = 40 C
(1) Pi = 45 dBm
(2) Tamb = +25 C
(2) Pi = 30 dBm
(3) Tamb = +85 C
(3) Pi = 20 dBm
(4) Pi = 15 dBm
Fig 4.
*S
G%
Power gain as a function of frequency;
typical values
Fig 5.
DDD
*S
G%
Power gain as a function of frequency;
typical values
DDD
*S
,&&
P$
,&&
I0+]
Pi = 45 dBm; Tamb = 25 C.
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
(4) VCC = 3.1 V
(4) VCC = 3.1 V
Power gain as a function of frequency;
typical values
BGU8006
Product data sheet
3LG%P
f = 1575 MHz; Tamb = 25 C.
(1) VCC = 1.5 V
Fig 6.
Fig 7.
Power gain and supply current as function of
input power; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
7 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
1)
G%
DDD
DDD
1)
G%
I0+]
Tamb = 25 C; no jammer, including PCB losses.
9&&9
f = 1575 MHz; no jammer, including PCB losses.
(1) VCC = 1.5 V
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
(4) VCC = 3.1 V
Fig 8.
Noise figure as a function of frequency;
typical values
Fig 9.
Noise figure as a function of supply voltage;
typical values
DDD
1)
G%
7DPE&
f = 1575 MHz; no jammer, including PCB losses.
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(4) VCC = 3.1 V
Fig 10. Noise figure as a function of ambient temperature; typical values
BGU8006
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
8 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
1)
G%
DDD
1)
G%
DDD
3MDPG%P
fjam = 850 MHz; Tamb = 25 C; f = 1575 MHz;
including PCB losses.
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
(4) VCC = 3.1 V
(4) VCC = 3.1 V
5/LQ
G%
5/LQ
G%
3MDPG%P
Fig 12. Noise figure as a function of jamming power;
typical values
DDD
fjam = 1850 MHz; Tamb = 25 C; f = 1575 MHz;
including PCB losses.
(1) VCC = 1.5 V
Fig 11. Noise figure as a function of jamming power;
typical values
DDD
I0+]
Pi = 45 dBm; VCC = 1.8 V.
I0+]
Tamb = 25 C; VCC = 1.8 V.
(1) Tamb = 40 C
(1) Pi = 45 dBm
(2) Tamb = +25 C
(2) Pi = 30 dBm
(3) Tamb = +85 C
(3) Pi = 20 dBm
(4) Pi = 15 dBm
Fig 13. Input return loss as a function of frequency;
typical values
BGU8006
Product data sheet
Fig 14. Input return loss as a function of frequency;
typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
9 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
5/LQ
G%
DDD
5/LQ
G%
DDD
I0+]
Pi = 45 dBm; Tamb = 25 C.
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
(4) VCC = 3.1 V
(4) VCC = 3.1 V
Fig 15. Input return loss as a function of frequency;
typical values
5/RXW
G%
3LG%P
DDD
Fig 16. Input return loss as a function of input power;
typical values
DDD
f = 1575 MHz; Tamb = 25 C.
(1) VCC = 1.5 V
5/RXW
G%
I0+]
Pi = 45 dBm; VCC = 1.8 V.
I0+]
Tamb = 25 C; VCC = 1.8 V.
(1) Tamb = 40 C
(1) Pi = 45 dBm
(2) Tamb = +25 C
(2) Pi = 30 dBm
(3) Tamb = +85 C
(3) Pi = 20 dBm
(4) Pi = 15 dBm
Fig 17. Output return loss as a function of frequency;
typical values
BGU8006
Product data sheet
Fig 18. Output return loss as a function of frequency;
typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
10 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
5/RXW
G%
DDD
5/RXW
G%
DDD
I0+]
Pi = 45 dBm; Tamb = 25 C.
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
(4) VCC = 3.1 V
(4) VCC = 3.1 V
Fig 19. Output return loss as a function of frequency;
typical values
,6/
G%
3LG%P
I0+]
Pi = 45 dBm; VCC = 1.8 V.
DDD
Fig 20. Output return loss as a function of input
power; typical values
DDD
f = 1575 MHz; Tamb = 25 C.
(1) VCC = 1.5 V
,6/
G%
I0+]
Tamb = 25 C; VCC = 1.8 V.
(1) Tamb = 40 C
(1) Pi = 45 dBm
(2) Tamb = +25 C
(2) Pi = 30 dBm
(3) Tamb = +85 C
(3) Pi = 20 dBm
(4) Pi = 15 dBm
Fig 21. Isolation as a function of frequency;
typical values
BGU8006
Product data sheet
Fig 22. Isolation as a function of frequency;
typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
11 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
,6/
G%
DDD
,6/
G%
I0+]
DDD
Pi = 45 dBm; Tamb = 25 C.
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
(4) VCC = 3.1 V
(4) VCC = 3.1 V
Fig 23. Isolation as a function of frequency;
typical values
3LG%
G%P
3LG%P
DDD
Fig 24. Isolation as a function of input power;
typical values
DDD
f = 1575 MHz; Tamb = 25 C.
(1) VCC = 1.5 V
3LG%
G%P
9&&9
f = 850 MHz.
(1) Tamb = 40 C
(2) Tamb = +25 C
(2) Tamb = +25 C
(3) Tamb = +85 C
(3) Tamb = +85 C
Fig 25. Input power at 1 dB gain compression as a
function of supply voltage; typical values
Product data sheet
9&&9
f = 1850 MHz.
(1) Tamb = 40 C
BGU8006
Fig 26. Input power at 1 dB gain compression as a
function of supply voltage; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
12 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
3LG%
G%P
DDD
9&&9
f = 1575 MHz.
(1) Tamb = 40 C
(2) Tamb = +25 C
(3) Tamb = +85 C
Fig 27. Input power at 1 dB gain compression as a function of supply voltage; typical values
DDD
3/
G%P
3/
,0'
,0'
G%P
3LG%P
Tamb = 25 C; f = 1575 MHz; f1 = 1713 MHz;
f2 = 1851 MHz; Pi per carrier.
DDD
3/
G%P
3/
,0'
G%P
,0'
3LG%P
VCC = 2.85 V; f = 1575 MHz; f1 = 1713 MHz;
f2 = 1851 MHz; Pi per carrier.
(1) VCC = 1.5 V
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
(4) VCC = 3.1 V
Fig 28. Output power and third order intermodulation
distortion as function of input power;
typical values
BGU8006
Product data sheet
Fig 29. Output power and third order intermodulation
distortion as function of input power;
typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
13 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
.
DDD
.
I0+]
VCC = 1.8 V; Pi = 45 dBm.
DDD
I0+]
Tamb = 25 C; Pi = 45 dBm.
(1) Tamb = 40 C
(1) VCC = 1.5 V
(2) Tamb = +25 C
(2) VCC = 1.8 V
(3) Tamb = +85 C
(3) VCC = 2.85 V
(4) VCC = 3.1 V
Fig 30. Rollett stability factor as a function of
frequency; typical values
BGU8006
Product data sheet
Fig 31. Rollett stability factor as a function of
frequency; typical values
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
14 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
10. Package outline
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Fig 32. Package outline BGU8006 (WLCSP6)
BGU8006
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
15 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
11. Abbreviations
Table 12.
Abbreviations
Acronym
Description
GLONASS
GLObal NAvigation Satellite System
GNSS
Global Navigation Satellite System
GPS
Global Positioning System
HBM
Human Body Model
MMIC
Monolithic Microwave Integrated Circuit
PCB
Printed Circuit Board
SiGe:C
Silicon Germanium Carbon
12. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGU8006 v.2
20121212
Product data sheet
-
BGU8006 v.1
Modifications:
BGU8006 v.1
BGU8006
Product data sheet
•
•
•
•
•
•
Table 1 on page 2: several changes have been made.
Table 4 on page 3: removed ‘code’ in first row.
Table 6 on page 3: several changes have been made.
Section 6 on page 4: section has been added.
Table 9 on page 4: several changes have been made.
Table 10 on page 5: several changes have been made.
20120911
Preliminary data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
-
© NXP B.V. 2012. All rights reserved.
16 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGU8006
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
17 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGU8006
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 12 December 2012
© NXP B.V. 2012. All rights reserved.
18 of 19
BGU8006
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
9.1
9.2
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 6
GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 12 December 2012
Document identifier: BGU8006