;6
21
BGU7004
SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS, Galileo
and Compass
Rev. 2 — 20 February 2015
Product data sheet
1. Product profile
1.1 General description
The BGU7004 is an AEC-Q100 qualified Low Noise Amplifier (LNA) for GNSS receiver
applications in a plastic leadless 6-pin, extremely small SOT886 package. The BGU7004
requires only one external matching inductor and one external decoupling capacitor.
The BGU7004 adapts itself to the changing environment resulting from co-habitation of
different radio systems in modern cellular handsets. It has been designed for low power
consumption and optimal performance when jamming signals from co-existing cellular
transmitters are present. At low jamming power levels it delivers 16.5 dB gain at a noise
figure of 0.85 dB. During high jamming power levels, resulting for example from a cellular
transmit burst, it temporarily increases its bias current to improve sensitivity.
1.2 Features and benefits
AEC-Q100 qualified (see Section 9.1)
Covers full GNSS L1 band, from 1559 MHz to 1610 MHz
Noise figure (NF) = 0.85 dB and gain (Gp) = 16.5 dB
High input 1 dB compression point Pi (1dB) of 11 dBm
High out of band IP3i of 9 dBm
Supply voltage 1.5 V to 2.85 V
Power-down mode current consumption < 1 A
Optimized performance at low supply current of 4.5 mA
Integrated matching for the output
Requires only one input matching inductor and one supply decoupling capacitor
Input and output DC decoupled
ESD protection on all pins (HBM > 2 kV)
Integrated temperature stabilized bias for easy design
Small 6-pin leadless package 1 mm 1.45 mm 0.5 mm
110 GHz transit frequency - SiGe:C technology
1.3 Applications
LNA for GPS, GLONASS, Galileo and Compass (BeiDou) in automotive applications
like Toll Collection and Emergency Call.
LNA for GPS, GLONASS, Galileo and Compass (BeiDou) in smart phones, feature
phones, tablet PCs, Personal Navigation Devices, Digital Still Cameras, Digital Video
Cameras, RF Front End modules, complete GPS chipset modules and theft protection
(laptop, ATM).
BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
1.4 Quick reference data
Table 1.
Quick reference data
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using
a 5.6 nH inductor; unless otherwise specified.
Symbo Parameter
l
Conditions
Min Typ Max Unit
1.5
-
2.85 V
3.2
4.5
5.7
VCC
supply voltage
RF input AC coupled
ICC
supply current
VENABLE 0.8 V
Pi < 40 dBm
Pi = 20 dBm
Pi < 40 dBm, no jammer
power gain
Gp
Pi = 20 dBm, no jammer
NF
noise figure
input power at 1 dB
gain compression
8.1
11.6 14.4 mA
14
16.5 19
dB
15
17.5 20
dB
Pi < 40 dBm, no jammer
[1]
-
0.85 1.2
dB
Pi < 40 dBm, no jammer
[2]
-
0.9
1.3
dB
-
1.2
1.6
dB
Pi = 20 dBm, no jammer
Pi(1dB)
mA
f = 1559 MHz to 1610 MHz
VCC = 1.5 V
15 12
-
dBm
VCC = 1.8 V
14 11
-
dBm
VCC = 2.85 V
11 8
-
dBm
-
dBm
input third-order intercept point f = 1.575 GHz
IP3i
VCC = 1.5 V
[3]
5
8
VCC = 1.8 V
[3]
5
9
-
dBm
VCC = 2.85 V
[3]
5
12
-
dBm
[1]
PCB losses are substracted.
[2]
Including PCB losses.
[3]
f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = 30 dBm.
2. Pinning information
Table 2.
Pin
Description
1
GND
2
GND
3
RF_IN
4
VCC
5
ENABLE
6
BGU7004
Product data sheet
Pinning
Simplified outline
Graphic symbol
RF_OUT
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Rev. 2 — 20 February 2015
7UDQVSDUHQW
WRSYLHZ
V\P
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
3. Ordering information
Table 3.
Ordering information
Type number
BGU7004
Package
Name
Description
Version
XSON6
plastic extremely thin small outline package; no leads; SOT886
6 terminals; body 1 1.45 0.5 mm
4. Marking
Table 4.
Marking codes
Type number
Marking code
BGU7004
UY
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
RF input AC coupled
0.5
3.1
V
VENABLE
voltage on pin ENABLE
VCC 2.5 V
V
0.5
3.1
[2]
0.5
VCC + 0.6 V
VCC 3.0 V
[3]
0.5
3.6
VCC < 3.0 V
[2][3]
0.5
VCC + 0.6 V
VCC 1.8 V
[3]
0.5
3.6
VCC < 1.8 V
[2][3]
0.5
VCC + 1.8 V
-
0
dBm
55
mW
VCC < 2.5 V
VRF_IN
VRF_OUT
voltage on pin RF_IN
voltage on pin RF_OUT
DC
DC
input power
Pi
V
Tsp 130 C
[1]
V
Ptot
total power dissipation
Tstg
storage temperature
65
150
C
Tj
junction temperature
-
150
C
[1]
Tsp is the temperature at the soldering point of the emitter lead.
[2]
Due to internal ESD diode protection, the applied voltage should not exceed the specified maximum in
order to avoid excess current.
[3]
The RF input and RF output are AC coupled through internal DC blocking capacitors.
6. Thermal characteristics
BGU7004
Product data sheet
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to solder point
Conditions
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 February 2015
Typ
Unit
225
K/W
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
7. Characteristics
Table 7.
Characteristics
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 5.6 nH
inductor; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ
Max
Unit
1.5
-
2.85
V
Pi < 40 dBm
3.2
4.5
5.7
mA
Pi = 20 dBm
8.1
11.6
14.4
mA
-
-
VCC
supply voltage
RF input AC coupled
ICC
supply current
VENABLE 0.8 V
VENABLE 0.3 V
Tamb
ambient temperature
Gp
power gain
1
A
40 +25
+125
C
Pi < 40 dBm, no jammer
14
16.5
19
dB
Pi = 20 dBm, no jammer
15
17.5
20
dB
Pjam = 20 dBm; fjam = 850 MHz
15
17.5
20
dB
Pjam = 20 dBm; fjam = 1850 MHz
15
17.5
20
dB
Tamb = 25 C
40 C Tamb +125 C
RLin
RLout
input return loss
output return loss
ISL
isolation
NF
noise figure
Pi < 40 dBm, no jammer
13
-
20
dB
Pi = 20 dBm, no jammer
14
-
21
dB
Pjam = 20 dBm; fjam = 850 MHz
14
-
21
dB
Pjam = 20 dBm; fjam = 1850 MHz
14
-
21
dB
Pi < 40 dBm
5
8
-
dB
Pi = 20 dBm
6
10
-
dB
Pi < 40 dBm
10
20
-
dB
Pi = 20 dBm
10
14
-
dB
20
23
-
dB
Tamb = 25 C
Pi < 40 dBm, no jammer
[1]
-
0.85
1.2
dB
Pi < 40 dBm, no jammer
[2]
-
0.9
1.3
dB
Pi = 20 dBm, no jammer
-
1.2
1.6
dB
Pjam = 20 dBm; fjam = 850 MHz
-
1.1
1.5
dB
Pjam = 20 dBm; fjam = 1850 MHz
-
1.3
1.7
dB
40 C Tamb +125 C
BGU7004
Product data sheet
Pi < 40 dBm, no jammer
-
-
1.8
dB
Pi = 20 dBm, no jammer
-
-
2.0
dB
Pjam = 20 dBm; fjam = 850 MHz
-
-
1.9
dB
Pjam = 20 dBm; fjam = 1850 MHz
-
-
2.1
dB
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Rev. 2 — 20 February 2015
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
Table 7.
Characteristics …continued
f = 1559 MHz to 1610 MHz; VCC = 1.8 V; VENABLE 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 5.6 nH
inductor; unless otherwise specified.
Symbol Parameter
Conditions
Pi(1dB)
f = 1559 MHz to 1610 MHz
input power at 1 dB
gain compression
Min Typ
Max
Unit
VCC = 1.5 V
15 12
-
dBm
VCC = 1.8 V
14 11
-
dBm
VCC = 2.85 V
11 8
-
dBm
f = 806 MHz to 928 MHz
VCC = 1.5 V
[3]
15 12
-
dBm
VCC = 1.8 V
[3]
14 11
-
dBm
VCC = 2.85 V
[3]
14 11
-
dBm
VCC = 1.5 V
[3]
13 10
-
dBm
VCC = 1.8 V
[3]
12 9
-
dBm
VCC = 2.85 V
[3]
10 7
-
dBm
VCC = 1.5 V
[4]
5
8
-
dBm
VCC = 1.8 V
[4]
5
9
-
dBm
VCC = 2.85 V
[4]
5
12
-
dBm
turn-on time
[5]
-
-
2
s
toff
turn-off time
[5]
-
-
1
s
K
Rollett stability factor
1
-
-
f = 1612 MHz to 1909 MHz
input third-order intercept point
IP3i
ton
[1]
PCB losses are subtracted.
[2]
Including PCB losses.
[3]
Out of band.
f = 1.575 GHz
[4]
f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = 30 dBm.
[5]
Within 10 % of the final gain.
Table 8.
ENABLE (pin 5)
40 C Tamb +125 C; 1.5 V VCC 2.85 V
BGU7004
Product data sheet
VENABLE (V)
State
0.3
OFF
0.8
ON
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Rev. 2 — 20 February 2015
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
8. Application information
8.1 GNSS LNA
9HQ 9FF
&
5)LQSXW
/
,&
5)RXWSXW
DDN
For a list of components see Table 9.
Fig 1.
Schematics GNSS LNA evaluation board
Table 9.
List of components
For schematics see Figure 1.
Component
Description
Value
Supplier
C1
decoupling capacitor
1 nF
various
IC1
BGU7004
-
NXP
L1
high quality matching inductor
5.6 nH
Murata LQW15A
DDR
,&&
P$
Remarks
DDR
,&&
P$
9&&9
Pi = 45 dBm.
7DPE&
Pi = 45 dBm.
(1) Tamb = 40 C
(1) VCC = 1.5 V
(2) Tamb = +25 C
(2) VCC = 1.8 V
(3) Tamb = +85 C
(3) VCC = 2.85 V
(4) Tamb = +125 C
Fig 2.
Supply current as a function of supply voltage;
typical values
BGU7004
Product data sheet
Fig 3.
Supply current as a function of ambient
temperature; typical values
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
DDR
*S
G%
DDN
*S
G%
I0+]
VCC = 1.8 V; Pi = 45 dBm.
(1) Pi = 45 dBm
(2) Tamb = +25 C
(2) Pi = 30 dBm
(3) Tamb = +85 C
(3) Pi = 20 dBm
(4) Tamb = +125 C
(4) Pi = 15 dBm
Power gain as a function of frequency;
typical values
Fig 5.
DDN
Power gain as a function of frequency;
typical values
DDR
*S
G%
*S
G%
*S
I0+]
VCC = 1.8 V; Tamb = 25 C.
(1) Tamb = 40 C
Fig 4.
,&&
P$
,&&
I0+]
Pi = 45 dBm; Tamb = 25 C.
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
(3) VCC = 2.85 V
Power gain as a function of frequency;
typical values
BGU7004
Product data sheet
3LG%P
Tamb = 25 C; f = 1575 MHz.
(1) VCC = 1.5 V
Fig 6.
Fig 7.
Power gain and supply current as function of
input power; typical values
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
DDR
1)
G%
DDN
1)
G%
I0+]
f = 1575 MHz; Tamb = 25 C; no jammer.
Fig 8.
9&&9
f = 1575 MHz; Tamb = 25 C; no jammer.
Noise figure as a function of supply voltage;
typical values
Fig 9.
DDR
Noise figure as a function of supply voltage;
typical values
DDN
1)
G%
1)
G%
7DPE&
3MDPG%P
fjam= 850 MHz; Tamb = 25 C; f = 1575 MHz.
f = 1575 MHz; VCC = 1.8 V; no jammer.
(1) VCC = 1.5 V
(2) VCC = 1.8 V
(3) VCC = 2.85 V
Fig 10. Noise figure as a function of ambient
temperature; typical values
BGU7004
Product data sheet
Fig 11. Noise figure as a function of jamming power;
typical values
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
DDN
DDR
5/LQ
G%
1)
G%
3MDPG%P
fjam = 1850 MHz; Tamb = 25 C; f = 1575 MHz.
I0+]
VCC = 1.8 V; Pi = 45 dBm.
(1) VCC = 1.5 V
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
(4) Tamb = +125 C
Fig 12. Noise figure as a function of jamming power;
typical values
Fig 13. Input return loss as a function of frequency;
typical values
DDN
5/LQ
G%
DDN
5/LQ
G%
I0+]
VCC = 1.8 V; Tamb = 25 C.
I0+]
Pi = 45 dBm; Tamb = 25 C.
(1) Pi = 45 dBm
(1) VCC = 1.5 V
(2) Pi = 30 dBm
(2) VCC = 1.8 V
(3) Pi = 20 dBm
(3) VCC = 2.85 V
(4) Pi = 15 dBm
Fig 14. Input return loss as a function of frequency;
typical values
BGU7004
Product data sheet
Fig 15. Input return loss as a function of frequency;
typical values
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
DDN
5/LQ
G%
DDR
5/RXW
G%
3LG%P
Tamb = 25 C; f = 1575 MHz.
I0+]
VCC = 1.8 V; Pi = 45 dBm.
(1) VCC = 1.5 V
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
(4) Tamb = +125 C
Fig 16. Input return loss as a function of input power;
typical values
DDN
5/RXW
G%
Fig 17. Output return loss as a function of frequency;
typical values
DDN
5/RXW
G%
I0+]
VCC = 1.8 V; Tamb = 25 C.
I0+]
Pi = 45 dBm; Tamb = 25 C.
(1) Pi = 45 dBm
(1) VCC = 1.5 V
(2) Pi = 30 dBm
(2) VCC = 1.8 V
(3) Pi = 20 dBm
(3) VCC = 2.85 V
(4) Pi = 15 dBm
Fig 18. Output return loss as a function of frequency;
typical values
BGU7004
Product data sheet
Fig 19. Output return loss as a function of frequency;
typical values
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
DDN
5/RXW
G%
DDR
,6/
G%
3LG%P
Tamb = 25 C; f = 1575 MHz.
I0+]
VCC = 1.8 V; Pi = 45 dBm.
(1) VCC = 1.5 V
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
(4) Tamb = +125 C
Fig 20. Output return loss as a function of input
power; typical values
Fig 21. Isolation as a function of frequency; typical
values
DDN
,6/
G%
DDN
,6/
G%
I0+]
VCC = 1.8 V; Tamb = 25 C.
I0+]
Pi = 45 dBm; Tamb = 25 C.
(1) Pi = 45 dBm
(1) VCC = 1.5 V
(2) Pi = 30 dBm
(2) VCC = 1.8 V
(3) Pi = 20 dBm
(3) VCC = 2.85 V
(4) Pi = 15 dBm
Fig 22. Isolation as a function of frequency; typical
values
BGU7004
Product data sheet
Fig 23. Isolation as a function of frequency; typical
values
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
DDN
DDR
3LG%
G%P
,6/
G%
3LG%P
Tamb = 25 C; f = 1575 MHz.
9&&9
f = 850 MHz.
(1) VCC = 1.5 V
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
(4) Tamb = +125 C
Fig 24. Isolation as a function of input power;
typical values
DDR
Fig 25. Input power at 1 dB gain compression as a
function of supply voltage; typical values
3LG%
G%P
3LG%
G%P
DDR
9&&9
f = 1850 MHz.
f = 1575 MHz.
(1) Tamb = 40 C
(1) Tamb = 40 C
(2) Tamb = +25 C
(2) Tamb = +25 C
(3) Tamb = +85 C
(3) Tamb = +85 C
(4) Tamb = +125 C
(4) Tamb = +125 C
Fig 26. Input power at 1 dB gain compression as a
function of supply voltage; typical values
BGU7004
Product data sheet
9&&9
Fig 27. Input power at 1 dB gain compression as a
function of supply voltage; typical values
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
DDN
,0'
3/
G%P 3/RI0+]VLJQDO
DDR
,0'
3/
G%P 3/RI0+]VLJQDO
,0'RI0+]VLJQDO
,0'RI0+]VLJQDO
3LG%P
3LG%P
f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz;
VCC = 1.8 V.
f = 1575 MHz; f1 = 1713 MHz; f2 = 1851 MHz;
Tamb = 25 C.
(1) VCC = 1.5 V
(1) Tamb = 40 C
(2) VCC = 1.8 V
(2) Tamb = +25 C
(3) VCC = 2.85 V
(3) Tamb = +85 C
(4) Tamb = +125 C
Fig 28. Third order intermodulation distortion and
output power as function of input power;
typical values
DDR
.
Fig 29. Third order intermodulation distortion and
output power as function of input power;
typical values
DDN
.
I0+]
VCC = 1.8 V; Pi = 45 dBm.
I0+]
Tamb = 25 C; Pi = 45 dBm.
(1) Tamb = 40 C
(1) VCC = 1.5 V
(2) Tamb = +25 C
(2) VCC = 1.8 V
(3) Tamb = +85 C
(3) VCC = 2.85 V
(4) Tamb = +125 C
Fig 30. Rollett stability factor as a function of
frequency; typical values
BGU7004
Product data sheet
Fig 31. Rollett stability factor as a function of
frequency; typical values
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
8.2 GPS front-end
The GPS LNA is typically used in a GPS front-end. A GPS front-end application circuit
and its characteristics is provided here.
9HQ 9FF
&
5)LQ
%3)
/
,&
%3)
5)RXW
DDN
For a list of components see Table 10.
Fig 32. Schematics GPS front-end evaluation board
Table 10. List of components
For schematics see Figure 32.
Component
Description
Value
Supplier
Remarks
BPF1, BPF2
GPS SAW filter
-
Murata SAFEA1G57KE0F00
Alternatives from Epcos:
•
B9444
Alternatives from Murata:
•
•
SAFEA1G57KH0F00
SAFEA1G57KB0F00
Alternatives from Fujitsu:
•
•
C1
decoupling capacitor
1 nF
Various
IC1
BGU7004
-
NXP
L1
high quality matching inductor
5.6 nH Murata LQW15A
BGU7004
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 February 2015
FAR-F6KA-1G5754-L4AA
FAR-F6KA-1G5754-L4AJ
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BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
8.3 Characteristics GPS front-end
Table 11. Characteristics GPS front-end
f = 1575 MHz; VCC = 1.8 V; VENABLE 0.8 V; power at LNA input Pi < 40 dBm; Tamb = 25 C; input and output matched to
50 ; unless otherwise specified.
Symbol Parameter
Conditions
VCC
supply voltage
ICC
supply current
RF input AC coupled
power gain
Gp
RLin
RLout
NF
input return loss
output return loss
noise figure
Pi(1dB)
IP3i
Min Typ
Max
Unit
1.5
-
2.85
V
-
4.5
-
mA
power at LNA input Pi < 40 dBm
[1]
-
14.5 -
dB
power at LNA input Pi = 20 dBm
[1]
-
15.5 -
dB
power at LNA input Pi < 40 dBm
[1]
-
8.5
-
dB
power at LNA input Pi = 20 dBm
[1]
-
10.5 -
dB
power at LNA input Pi < 40 dBm
[1]
-
14.5 -
dB
power at LNA input Pi = 20 dBm
[1]
-
12.5 -
dB
power at LNA input Pi < 40 dBm
[1]
-
1.8
-
dB
power at LNA input Pi = 20 dBm
[1]
-
1.9
-
dB
8.2
dBm
f = 806 MHz to 928 MHz
[2]
31
dBm
f = 1612 MHz to 1909 MHz
[2]
40
dBm
input third-order intercept point
[3]
64
dBm
attenuation
f = 850 MHz
[4]
95
-
-
dBc
f = 1850 MHz
[4]
90
-
-
dBc
-
-
2
s
-
-
1
s
input power at 1 dB gain compression
f = 1575 MHz
ton
turn-on time
[5]
toff
turn-off time
[5]
[1]
Power at GPS front-end input = power at LNA input + attenuation BPF1.
[2]
Out of band.
[3]
f1 = 1713 MHz; f2 = 1851 MHz; P1 = P2 = +10 dBm.
[4]
Relative to f = 1575 MHz.
[5]
Within 10 % of the final gain.
9. Test information
9.1 Quality information
All qualification tests are performed according AEC-Q100 except for read point testing
(final test of qualification sample). Which is done only at room temperature.
As part of the zero defect program, the following is part of the industrial test flow:
• Part Average Testing
• Maverick Lot Handling at assembly factory
BGU7004
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
15 of 20
BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
10. Package outline
627
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Fig 33. Package outline SOT886 (XSON6)
BGU7004
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
16 of 20
BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
11. Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
12. Abbreviations
Table 12.
Abbreviations
Acronym
Description
AEC
Automotive Electronics Council
ATM
Automated Teller Machine (cash dispenser)
BPF
Band-Pass Filter
ESD
ElectroStatic Discharge
GLONASS
GLObal NAvigation Satellite System
GNSS
Global Navigation Satellite System
GPS
Global Positioning System
HBM
Human Body Model
MMIC
Monolithic Microwave Integrated Circuit
PCB
Printed Circuit Board
SAW
Surface Acoustic Wave
SiGe:C
Silicon Germanium Carbon
13. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGU7004 v.2
20150220
Product data sheet
-
BGU7004 v.1
Modifications:
•
•
•
•
BGU7004 v.1
BGU7004
Product data sheet
The title of this data sheet has been changed.
Section 1.3 on page 1: Added GLONASS, Galileo and Compass (BeiDou) to the possible
applications.
Section 11 on page 17: ESD information has moved from Section 1.1 to this section.
Section 14.3 on page 18: Adjusted the disclaimers with respect to “suitability to use in
automotive applications” and “Translations”.
20110705
Product data sheet
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 February 2015
-
© NXP Semiconductors N.V. 2015. All rights reserved.
17 of 20
BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGU7004
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
18 of 20
BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
14.4 Trademarks
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGU7004
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 February 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
19 of 20
BGU7004
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass
16. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
8.2
8.3
9
9.1
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 6
GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
GPS front-end. . . . . . . . . . . . . . . . . . . . . . . . . 14
Characteristics GPS front-end . . . . . . . . . . . . 15
Test information . . . . . . . . . . . . . . . . . . . . . . . . 15
Quality information . . . . . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Handling information. . . . . . . . . . . . . . . . . . . . 17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 20 February 2015
Document identifier: BGU7004