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BGU8103UK
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
Rev. 1 — 25 January 2016
Preliminary data sheet
1. General description
The BGU8103UK is an ultra low current and Low-Noise Amplifier (LNA) for GNSS
receiver applications. It comes as an extremely small and thin Wafer Level Chip Scale
Package (WLCSP). This product is only used in an overmolded module. The BGU8103UK
requires only one external matching inductor.
The BGU8103UK adapts itself to the changing environment resulting from co-habitation of
different radio systems in modern cellular handsets. It has been designed for ultra low
power consumption and optimal performance when jamming signals from co-existing
cellular transmitters are present. At low jamming power levels, it delivers 18.5 dB gain at a
noise figure of 0.80 dB and a supply current of 1.2 mA. During high jamming power levels,
resulting for example from a cellular transmit burst, it temporarily increases its bias current
to improve sensitivity.
2. Features and benefits
Optimized performance at a low supply current of 1.2 mA
Covers full GNSS L1 band, from 1559 MHz to 1610 MHz
Noise figure = 0.80 dB
Gain 18.5 dB
Input 1 dB compression point of 17 dBm
Out of band IP3i of 11 dBm
Supply voltage 1.5 V to 3.1 V
Integrated supply decoupling capacitor
Power-down mode current consumption < 1 A
Integrated temperature stabilized bias for easy design
Requires only one input matching inductor
Integrated DC blocking at both RF input and output
ESD protection on all pins (HBM > 2 kV)
Integrated matching for the output
Available in a WLCSP 0.69 mm 0.44 mm 0.29 mm: SOT1445-1
180 GHz transit frequency - SiGe:C technology
Moisture sensitivity level 1
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
3. Applications
LNA for GPS
GLONASS
Galileo and COMPASS (BeiDou) in smart phones
Feature phones
Tablet PCs
Digital still cameras
Digital video cameras
RF front-end modules
Complete GNSS modules and wearable applications
4. Quick reference data
Table 1.
Quick reference data
f = 1575 MHz; VCC = 1.8 V; VI(ENABLE) 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 12 nH inductor;
see Figure 4; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
VCC
supply voltage
1.5
-
3.1
V
ICC
supply current
-
1.2
-
mA
Gp
power gain
no jammer
NF
noise figure
Pi = 40 dBm; no jammer
Pi(1dB)
input power at 1 dB gain compression
IP3i
input third-order intercept point
[1]
PCB losses are subtracted.
[2]
f1 = 1713 MHz; f2 = 1851 MHz; Pi = 20 dBm at f1; Pi = 65 dBm at f2.
-
18.5 -
dB
[1]
-
0.8
dB
-
17
-
dBm
[2]
-
11
-
dBm
-
5. Ordering information
Table 2.
Ordering information
Type number
BGU8103UK
Package
Name
Description
Version
WLCSP6
wafer level chip-scale package; 6 bumps; 0.69 0.44 0.29 mm
SOT1445-1
6. Marking
Table 3.
Marking codes
Type number
Marking code
BGU8103UK
single character, indicating assembly month[1]
[1]
Month codes see Table 4.
BGU8103UK
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 13
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
Table 4.
Calender marking month code
Replace asterisk (*) by character in table, see Figure 1.
Year[1]
Month
J
F
M
A
M
J
J
A
S
O
N
D
2015
A
B
C
D
E
F
G
H
I
J
K
L
2016
M
N
O
P
Q
R
S
T
U
V
W
X
2017
Y
Z
b
d
f
h
3
4
5
6
7
9
[1]
Rotates every 3 years.
DDD
Pin A1 location: the marking stripes below character indicate the side where pin A1 is located.
Fig 1.
Marking code description example
7. Block diagram
$ %
%
&
$ &
DDD
Fig 2.
Block diagram
BGU8103UK
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 13
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
8. Pinning information
8.1 Pinning
&
&
%
%
$
$
DDD
Fig 3.
Bump side view
8.2 Pin description
Table 5.
Bump description
Symbol
Bump
Description
GND
A1
ground
VCC
B1
supply voltage
RF_OUT
C1
RF output
ENABLE
A2
enable
RF_IN
B2
RF input
GND_RF
C2
ground RF
9. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
Parameter
Conditions
supply voltage
RF input AC coupled
Min
Max
Unit
[1]
0.5
+5.0
V
[1][2]
VI(ENABLE)
input voltage on pin ENABLE
VI(ENABLE) < VCC + 0.6 V
0.5
+5.0
V
VI(RF_IN)
input voltage on pin RF_IN
DC; VI(RF_IN) < VCC + 0.6 V
[1][2][3]
0.5
+5.0
V
DC; VI(RF_OUT) < VCC + 0.6 V
[1][2][3]
0.5
+5.0
V
-
10
dBm
VI(RF_OUT)
input voltage on pin RF_OUT
[1]
Pi
input power
Ptot
total power dissipation
-
55
mW
Tstg
storage temperature
65
+150
C
Tj
junction temperature
-
150
C
BGU8103UK
Preliminary data sheet
Tsp 130 C
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VESD
electrostatic discharge voltage
Human Body Model (HBM) according to
JEDEC standard JS-001-2010
-
2
kV
Charged Device Model (CDM) according to
JEDEC standard JESD22-C101C
-
2
kV
[1]
Stressed with pulses of 200 ms in duration, with application circuit as in Figure 4.
[2]
Warning: due to internal ESD diode protection, the applied DC voltage shall not exceed VCC + 0.6 V and shall not exceed 5.0 V in order
to avoid excess current.
[3]
The RF input and RF output are AC coupled through internal DC blocking capacitors.
10. Recommended operating conditions
Table 7.
Operating conditions
Symbol
Parameter
Conditions
Min
VCC
supply voltage
1.5
Tamb
ambient temperature
40
VI(ENABLE)
input voltage on pin ENABLE
OFF state
-
ON state
0.8
Typ
Max
Unit
-
3.1
V
+25
+85
C
-
0.3
V
-
-
V
11. Thermal characteristics
Table 8.
Thermal characteristics
Symbol
Parameter
Rth(j-sp)
thermal resistance from junction to solder point
BGU8103UK
Preliminary data sheet
Conditions
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
Typ
Unit
225
K/W
© NXP Semiconductors N.V. 2016. All rights reserved.
5 of 13
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
12. Characteristics
Table 9.
Characteristics at VCC = 1.8 V
f = 1575 MHz; VCC = 1.8 V; VI(ENABLE) 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 12 nH inductor;
see Figure 4; unless otherwise specified.
Symbol
Parameter
Conditions
ICC
supply current
VI(ENABLE) 0.8 V
power gain
Gp
Min Typ
Max Unit
Pi < 40 dBm
-
1.2
-
mA
Pi = 20 dBm
-
2.5
-
mA
VI(ENABLE) 0.3 V
-
-
1
A
no jammer
-
18.5
-
dB
Pjam = 20 dBm;
-
20.0
-
dB
-
20.0
-
dB
Pi < 40 dBm
-
8
-
dB
Pi = 20 dBm
-
9
-
dB
Pi < 40 dBm
-
11
-
dB
Pi = 20 dBm
-
11
-
dB
fjam = 850 MHz
Pjam = 20 dBm;
fjam = 1850 MHz
RLin
input return loss
RLout
output return loss
ISL
isolation
NF
noise figure
-
35
-
dB
Pi = 40 dBm; no jammer
[1]
-
0.8
-
dB
Pi = 40 dBm; no jammer
[2]
-
0.9
-
dB
Pjam = 20 dBm; fjam = 850 MHz
[2]
-
1.1
-
dB
Pjam = 20 dBm;
fjam = 1850 MHz
[2]
-
1.4
-
dB
-
17
-
dBm
input third-order intercept point
[3]
-
11
-
dBm
IMD3
third-order intermodulation distortion
output referred
[3]
-
64
-
dBm
ton
turn-on time
time from VI(ENABLE) ON
to 90 % of the gain
-
-
2
s
toff
turn-off time
time from VI(ENABLE) OFF
to 10 % of the gain
-
-
1
s
Pi(1dB)
IP3i
input power at 1 dB gain compression
[1]
PCB losses are subtracted.
[2]
Including PCB losses.
[3]
f1 = 1713 MHz; f2 = 1851 MHz; Pi = 20 dBm at f1; Pi = 65 dBm at f2.
BGU8103UK
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 13
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
Table 10. Characteristics at VCC = 2.85 V
f = 1575 MHz; VCC = 2.85 V; VI(ENABLE) 0.8 V; Pi < 40 dBm; Tamb = 25 C; input matched to 50 using a 12 nH inductor;
see Figure 4; unless otherwise specified.
Symbol
Parameter
Conditions
ICC
supply current
VI(ENABLE) 0.8 V
power gain
Gp
RLin
input return loss
RLout
output return loss
ISL
isolation
NF
noise figure
Pi(1dB)
Min Typ
Max Unit
Pi < 40 dBm
-
1.2
-
mA
Pi = 20 dBm
-
2.5
-
mA
VI(ENABLE) 0.3 V
-
-
1
A
no jammer
-
18.5
-
dB
Pjam = 20 dBm; fjam = 850 MHz
-
20.0
-
dB
Pjam = 20 dBm;
fjam = 1850 MHz
-
20.0
-
dB
Pi < 40 dBm
-
8
-
dB
Pi = 20 dBm
-
9
-
dB
Pi < 40 dBm
-
11
-
dB
Pi = 20 dBm
-
11
-
dB
-
35
-
dB
Pi = 40 dBm; no jammer
[1]
-
0.8
-
dB
Pi = 40 dBm; no jammer
[2]
-
0.9
-
dB
Pjam = 20 dBm; fjam = 850 MHz
[2]
-
1.1
-
dB
Pjam = 20 dBm;
fjam = 1850 MHz
[2]
-
1.4
-
dB
-
dBm
-
14
[3]
-
9
-
dBm
[3]
-
68
-
dBm
input power at 1 dB gain compression
IP3i
input third-order intercept point
IMD3
third-order intermodulation distortion
output referred
ton
turn-on time
time from VI(ENABLE) ON
to 90 % of the gain
-
-
2
s
toff
turn-off time
time from VI(ENABLE) OFF
to 10 % of the gain
-
-
1
s
[1]
PCB losses are subtracted.
[2]
Including PCB losses.
[3]
f1 = 1713 MHz; f2 = 1851 MHz; Pi = 20 dBm at f1; Pi = 65 dBm at f2.
BGU8103UK
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 13
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
13. Application information
13.1 GNSS LNA
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For a list of components, see Table 11.
Fig 4.
Schematics GNSS LNA evaluation board
Table 11. List of components
For schematics, see Figure 4.
Component
Description
Value
Cd
decoupling capacitor
1 nF
to suppress power supply noise
IC1
BGU8103UK
-
NXP Semiconductors
L1
high-quality matching inductor
12 nH
Murata LQW15A
BGU8103UK
Preliminary data sheet
Remarks
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
8 of 13
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
14. Package outline
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BGU8103UK
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 13
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
15. Handling information
15.1 ElectroStatic Discharge (ESD)
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
16. Mounting
This WLCSP is only used in an overmolded module (using MUF).
17. Abbreviations
Table 12.
Abbreviations
Acronym
Description
ESD
ElectroStatic Discharge
GLONASS
Global Navigation Satellite System
GNSS
Global Navigation Satellite System
GPS
Global Positioning System
LNA
Low-Noise Amplifier
HBM
Human Body Model
MMIC
Monolithic Microwave Integrated Circuit
MUF
Molded UnderFill
PCB
Printed-Circuit Board
SiGe:C
Silicon Germanium Carbon
WLCSP
Wafer Level Chip Scale Package
18. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BGU8103UK v.1
20160225
Preliminary data sheet
-
-
BGU8103UK
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
10 of 13
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
BGU8103UK
Preliminary data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
11 of 13
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BGU8103UK
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 January 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
12 of 13
BGU8103UK
NXP Semiconductors
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS
21. Contents
1
2
3
4
5
6
7
8
8.1
8.2
9
10
11
12
13
13.1
14
15
15.1
16
17
18
19
19.1
19.2
19.3
19.4
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Thermal characteristics . . . . . . . . . . . . . . . . . . 5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application information. . . . . . . . . . . . . . . . . . . 8
GNSS LNA . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Handling information. . . . . . . . . . . . . . . . . . . . 10
ElectroStatic Discharge (ESD) . . . . . . . . . . . . 10
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 25 January 2016
Document identifier: BGU8103UK