BGU7033 1 GHz wideband low-noise amplifier with bypass Rev. 2 — 13 September 2010 Product data sheet 1. Product profile 1.1 General description The BGU7033 MMIC is a wideband amplifier with selectable gain and bypass mode. It is designed specifically for high linearity, low noise applications over a frequency range of 40 MHz to 1 GHz. It is especially suited to Set-Top Box applications. The LNA is housed in a 6-pin SOT363 plastic SMD package. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Internally biased Programmable gain and bypass modes: Gp = 10 dB, Gp = 5 dB and bypass Flat gain between 40 MHz and 1 GHz Noise figure of 4.5 dB High linearity with an IP3O of 29 dBm 75 Ω input and output impedance Power-down during bypass mode Bypass mode current consumption < 5 mA ESD protection > 2 kV Human Body Model (HBM) on all pins 1.3 Applications Terrestrial and cable Set-Top Boxes (STB) Silicon and “Can” tuners Personal and Digital Video Recorders (PVR and DVR) Home networking and in-house signal distribution BGU7033 NXP Semiconductors 1 GHz wideband low-noise amplifier with bypass 1.4 Quick reference data Table 1. Quick reference data Tamb = 25 °C; typical values at VCC = 5 V; ZS = ZL = 75 Ω; Rbias = 43 Ω; 40 MHz ≤ f1 ≤ 1000 MHz. Symbol Parameter Conditions supply voltage VCC ICC(tot) Tamb NF Min RF input AC coupled total supply current 4.75 5.0 5.25 V Gp = 5 dB mode [1] - 43 - mA Gp = 10 dB mode [1] - 43 - mA bypass mode [1] - 4 - mA −10 - +70 °C Gp = 10 dB mode [1] - 4.5 - dB bypass mode [1] - 2.5 - dB [1] - 14 - dBm [1][2] - 29 - dBm ambient temperature noise figure Typ Max Unit PL(1dB) output power at 1 dB gain compression 1 GHz; Gp = 10 dB mode IP3O output third-order intercept point Gp = 10 dB mode [1] Mode depends on setting of VCTRL1 and VCTRL2; see Table 8. [2] The fundamental frequency (f1) is 1000 MHz. The intermodulation product (IM3) is 2 × f2 − f1, where f2 = f1 ± 1 MHz. Input power Pi = −10 dBm. 2. Pinning information Table 2. Pinning Pin Description Simplified outline 1 RF_OUT 2 VCC 3 CTRL1 (gain control) 4 CTRL2 (bypass control) 5 GND 6 RF_IN 6 5 Graphic symbol 4 3 2 6 1 2 3 1 5 4 sym141 3. Ordering information Table 3. Ordering information Type number BGU7033 Package Name Description Version - plastic surface-mounted package; 6 leads SOT363 4. Marking Table 4. Marking codes Type number Marking code BGU7033 SE% Note: % character indicates the location of production. BGU7033 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2010 © NXP B.V. 2010. All rights reserved. 2 of 11 BGU7033 NXP Semiconductors 1 GHz wideband low-noise amplifier with bypass 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCC supply voltage RF input AC coupled Vctrl(Gp) power gain control voltage pin CTRL1 [1] Vctrl(bp) bypass control voltage pin CTRL2 [2] ICC(tot) total supply current [3] Min Max Unit −0.6 5.25 V 0 VCC V 0 VCC V - 60 mA - 250 mW - 10 dBm Ptot total power dissipation Tsp ≤ 100 °C Pi input power single tone Tstg storage temperature −65 +150 °C Tj junction temperature - 150 °C Tamb ambient temperature −10 +70 °C VESD electrostatic discharge voltage 2 - kV [1] Human Body Model (HBM); according to JEDEC standard 22-A114E Vctrl(Gp) must not exceed VCC; ICTRL1 must be limited to 5 mA (maximum). [2] Vctrl(bp) must not exceed VCC; ICTRL2 must be limited to 5 mA (maximum). [3] Tsp is the temperature at the solder point of the ground lead. Remark: Vctrl(Gp) must not exceed VCC; ICTRL1 must be limited to a maximum of 5 mA. Remark: Vctrl(bp) must not exceed VCC; ICTRL2 must be limited to a maximum of 5 mA. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-sp) thermal resistance from junction to solder point Conditions Typ Unit 240 K/W 7. Characteristics Table 7. Characteristics Tamb = 25 °C; typical values at VCC = 5 V; ZS = ZL = 75 Ω; Rbias = 43 Ω; 40 MHz ≤ f1 ≤ 1000 MHz. Symbol Parameter VCC ICC(tot) |s21|2 SLsl BGU7033 Product data sheet Conditions supply voltage total supply current insertion power gain Min RF input AC coupled Typ Max Unit 4.75 5.0 5.25 V Gp = 5 dB mode [1][2] - 43 - mA Gp = 10 dB mode [1][2] - 43 - mA bypass mode [1][2] - 4 - mA Gp = 5 dB mode [1] - 5 Gp = 10 dB mode [1] - 10 - dB bypass mode [1] - −2 - dB - −1 - dB slope straight line All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2010 dB © NXP B.V. 2010. All rights reserved. 3 of 11 BGU7033 NXP Semiconductors 1 GHz wideband low-noise amplifier with bypass Table 7. Characteristics …continued Tamb = 25 °C; typical values at VCC = 5 V; ZS = ZL = 75 Ω; Rbias = 43 Ω; 40 MHz ≤ f1 ≤ 1000 MHz. Symbol Parameter FL Conditions noise figure RLin RLout PL(1dB) IP3O input return loss output return loss output power at 1 dB gain compression output third-order intercept point Typ Max Unit - −0.2 - dB Gp = 5 dB mode [1] - 6.0 - dB Gp = 10 dB mode [1] - 4.5 - dB bypass mode [1] - 2.5 - dB Gp = 5 dB mode [1] - 17 - dB Gp = 10 dB mode [1] - 18 - dB bypass mode [1] - 8 - dB Gp = 5 dB mode [1] - 12 - dB Gp = 10 dB mode [1] - 12 - dB bypass mode [1] - 8 - dB 1 GHz; Gp = 5 dB mode [1] - 9 - dBm Gp = 10 dB mode [1] - 14 - dBm Gp = 5 dB mode [1][2] - 29 - dBm Gp = 10 dB mode [1][2] - 29 - dBm bypass mode [1][2] - 29 - dBm flatness of frequency response NF Min [1] Mode depends on setting of VCTRL1 and VCTRL2; see Table 8. [2] The fundamental frequency (f1) is 1000 MHz. The intermodulation product (IM3) is 2 × f2 − f1, where f2 = f1 ± 1 MHz. Input power Pi = −10 dBm. Table 8. Gain selection (pins CTRL1, CTRL2) −10 °C ≤ Tamb ≤ +70 °C; recommended power-up condition: VCTRL1 and VCTRL2 = logic 0 or < 0.7 V. VCTRL1 (Vctrl(Gp)) (V) VCTRL2 (Vctrl(bp)) (V) Mode ≤ 0.7 ≤ 0.7 bypass ≥ 4.3 ≤ 0.7 bypass ≤ 0.7 ≥ 4.3 Gp = 5 dB ≥ 4.3 ≥ 4.3 Gp = 10 dB Remark: Vctrl(Gp) must not exceed VCC; ICTRL1 must be limited to a maximum of 5 mA. Remark: Vctrl(bp) must not exceed VCC; ICTRL2 must be limited to a maximum of 5 mA. BGU7033 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2010 © NXP B.V. 2010. All rights reserved. 4 of 11 BGU7033 NXP Semiconductors 1 GHz wideband low-noise amplifier with bypass 8. Application information Other applications are possible. Please contact your local sales representative for more information. Application notes are available on the NXP website. 8.1 Application circuit VCC C6 C5 CTRL1 R1 = Rbias R3 C4 L1 3 X1 C1 RF_IN 2 6 1 5 C2 X2 RF_OUT 4 C3 R2 CTRL2 001aam384 Components are listed in Table 9. Fig 1. BGU7033 application circuit All control and supply lines must be decoupled properly. The decoupling capacitors must be placed as close to the device as possible. BGU7033 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2010 © NXP B.V. 2010. All rights reserved. 5 of 11 BGU7033 NXP Semiconductors 1 GHz wideband low-noise amplifier with bypass GND VCC CTRL1 GND CTRL2 GND 8.2 Application circuit board layout R3 C6 R2 X1 X2 C4 C3 C5 C1 RF_IN R1 L1 RF_OUT C2 001aam387 PCB material = FR4. PCB thickness = 1.6 mm. PCB size = 30 mm × 30 mm. εr = 4.5; thickness of copper layer = 35 μm. Components are listed in Table 9. Fig 2. BGU7033 application circuit board layout Table 9. List of components See Figure 1 and Figure 2. Component Description Value C1, C2 capacitor 10 nF DC blocking C3, C4, C5 capacitor 10 nF decoupling Product data sheet Function C6 capacitor 10 μF L1 chip ferrite bead 1.5 kΩ [1] Murata BLM18HE152SN1DF RF choke R1 resistor 43 Ω [1] Rbias bias setting R2, R3 resistor 1.8 kΩ X1, X2 connector 75 Ω [1] BGU7033 Remarks decoupling current limiting F-connector, edge mount PCB reflow type, Bomar 861V509ERG input/output L1 and R1 must have a power rating of 0.1 W or higher. All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2010 © NXP B.V. 2010. All rights reserved. 6 of 11 BGU7033 NXP Semiconductors 1 GHz wideband low-noise amplifier with bypass 9. Package outline Plastic surface-mounted package; 6 leads SOT363 D E B y X A HE 6 5 v M A 4 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC SOT363 Fig 3. JEDEC JEITA SC-88 EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 Package outline SOT363 BGU7033 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2010 © NXP B.V. 2010. All rights reserved. 7 of 11 BGU7033 NXP Semiconductors 1 GHz wideband low-noise amplifier with bypass 10. Abbreviations Table 10. Abbreviations Acronym Description AC Alternating Current DC Direct Current LNA Low-Noise Amplifier MMIC Monolithic Microwave Integrated Circuit PCB Printed-Circuit Board RF Radio Frequency SMD Surface-Mounted Device 11. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes BGU7033 v.2 20100913 Product data sheet - BGU7033 v.1 Modifications: BGU7033 v.1 BGU7033 Product data sheet • The status of this data sheet has been changed to Product data sheet. 20100816 Preliminary data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2010 - © NXP B.V. 2010. All rights reserved. 8 of 11 BGU7033 NXP Semiconductors 1 GHz wideband low-noise amplifier with bypass 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. BGU7033 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2010 © NXP B.V. 2010. All rights reserved. 9 of 11 BGU7033 NXP Semiconductors 1 GHz wideband low-noise amplifier with bypass Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BGU7033 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2010 © NXP B.V. 2010. All rights reserved. 10 of 11 BGU7033 NXP Semiconductors 1 GHz wideband low-noise amplifier with bypass 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 8.2 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 5 Application circuit . . . . . . . . . . . . . . . . . . . . . . . 5 Application circuit board layout . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 13 September 2010 Document identifier: BGU7033