ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module DATASHEET Description The Atmel® | SMART SAMW25 module is based on the industry-leading lowpower 2.4GHz IEEE® 802.11 b/g/n Wi-Fi® ATWINC1500 SoC (System on Chip) combined with the ARM® Cortex®-M0+ based microcontroller technology from Atmel. This turnkey system provides an integrated software solution with application and security protocols such as TLS and integrated network services (TCP/IP stack) which are all available through Atmel Studio 6 integrated development environment (IDE). The Atmel SmartConnect modules offer the ideal solutions for designers seeking to add Wi-Fi connectivity with minimal previous experience in 802.11, IP Stack, or RF. Atmel SmartConnect Wi-Fi opens the door of the Internet of Things (IoT) to the vast array of battery-powered devices and applications requiring the integration of WLAN connectivity without compromising on cost or power consumption. While we compete with other Wi-Fi modules on size, RF performance, cost, and other characteristics, the Atmel SmartConnect product family has a distinctive advantage when it comes to power consumption and power saving modes. The ATSAMW25 device is a standalone end point, where a complete small application can be executed on the module by itself. Features Key features with SAMW25 Wireless connectivity solution: Certified Wi-Fi ATWINC1500B-MU-T with SAMD21 MCU IEEE 802.11 b/g/n 20MHz (1x1) solution Single spatial stream in 2.4GHz ISM band Compact footprint: 33.863 x 14.882mm Radio: – Output power - 802.11b /11Mbps: 17dBm ±1dB – 802.11g /54Mbps: 16dBm ±1dB @ EVM -28dB – 802.11n /72Mbps: 14dBm ±1dB @ EVM -30dB Application processor: – Atmel SAM D21 ARM Cortex M0+ based microcontroller – 256KB embedded Flash and 32KB SRAM – Full-Speed USB Device and embedded Host Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 CryptoAuthentication™ ATECC508 (optional) I/O operating voltage: 2.7 to 3.6V Power Amplifier and On-board Switching Regulator operating voltage: 2.7 to 4.3V Power states supported: – Provision (AP/Sniffer) IDLE LISTEN • IDLE • SUSPEND Extreme low-power, on-chip low-power sleep oscillator Serial Host Interface SPI or UART Software Upgrade Over-the-Air (OTA) FCC, CE, IC, and TELEC Certified; RoHS compliant Security protocols; WPA/WPA2 Personal, TLS, and SSL Network services; DHCP, DNS, TCP/IP (IPv4), UDP, HTTP, and HTTPS Target Applications IoT applications Smart appliances Multimedia streaming Safety and security Home automation Consumer electronics Industrial automation 2 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 Table of Contents 1 Block Diagram ............................................................................................................... 4 2 Ordering Information and IC Marking ........................................................................... 4 3 Pinout and Package Information .................................................................................. 5 3.1 3.2 4 Electrical Specifications................................................................................................ 9 4.1 4.2 4.3 5 Absolute Ratings ..................................................................................................................................... 9 Recommended Operating Conditions ................................................................................................... 10 DC Electrical Characteristics ................................................................................................................. 10 Application and Core Subsystems ............................................................................. 11 5.1 5.2 6 Pin Description ........................................................................................................................................ 5 Package Description ............................................................................................................................... 8 Host Processor ...................................................................................................................................... 11 5.1.1 Host MCU Description .............................................................................................................. 11 5.1.2 Host MCU Key Features ........................................................................................................... 11 Wi-Fi Core Processor ............................................................................................................................ 11 5.2.1 Memory Subsystem .................................................................................................................. 12 5.2.2 Non-volatile Memory (eFuse).................................................................................................... 12 WLAN Subsystem ........................................................................................................ 13 6.1 6.2 6.3 MAC 6.1.1 6.1.2 PHY 6.2.1 6.2.2 Radio 6.3.1 6.3.2 ................................................................................................................................................. 13 Features ................................................................................................................................... 13 Description................................................................................................................................ 13 ................................................................................................................................................. 14 Features ................................................................................................................................... 14 Description................................................................................................................................ 14 ................................................................................................................................................. 14 Receiver Performance .............................................................................................................. 14 Transmitter Performance .......................................................................................................... 16 7 Recommended Reflow Profile .................................................................................... 17 8 Module Schematic ....................................................................................................... 18 9 Bill of Materials (BOM)................................................................................................. 20 10 Application Schematic ................................................................................................ 21 11 Design Guidelines ....................................................................................................... 22 12 Reference Documentation and Support ..................................................................... 23 12.1 Reference Documents ........................................................................................................................... 23 12.2 Related Documents ............................................................................................................................... 23 13 Revision History .......................................................................................................... 24 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 3 1 Block Diagram Figure 1-1. 2 ATSAMW25 Block Diagram Ordering Information and IC Marking Table 2-1. Ordering Details Atmel ordering code 4 Package ATSAMW25-MR210PB ATWINC1500 + SAM D21 module. Tray Packing. ATSAMW25-MR510PA ATWINC1500 + SAM D21 + ATECC508 module. Tray Packing. ATSAMW25-XPRO Xplained board evaluation kit ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 3 Pinout and Package Information 3.1 Pin Description Figure 3-1. Pin Assignment ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 5 Table 3-1. Pin # 6 Pin Description Pin description I/O type Function (default) Programmable pull-up/-down resistor 1 GND N/A Common ground 2 UART_TxD ATWINC1500 output Currently used only for Atmel debug. Not for customer use. Leave unconnected. Yes – pull-up 3 UART_RxD ATWINC1500 input Currently used only for Atmel debug. Not for customer use. Leave unconnected. Yes – pull-up 4 Wi-Fi Chip_En ATWINC1500 input Currently used only for Atmel debug. Not for customer use. Leave unconnected. No 5 Wi-Fi GPIO_1/RTC ATWINC1500 I/O ATWINC1500 General purpose I/O. Can also be used to input a 32.768KHz Real Time Clock for accurate timing of Wi-Fi sleep intervals Yes – pull-up 6 Wi-Fi GPIO_3 - ATWINC1500 General purpose I/O Yes – pull-up 7 VBAT Power Supply for Wi-Fi RF Power Amplifier and Internal 1.3V Switching Regulator 8 PA16 See SAM D21G datasheet See SAM D21G datasheet Yes 9 PA17 See SAM D21G datasheet See SAM D21G datasheet Yes 10 GND Power Ground 11 PA18 See SAM D21G datasheet See SAM D21G datasheet Yes 12 PA19 See SAM D21G datasheet See SAM D21G datasheet Yes 13 PA20 See SAM D21G datasheet See SAM D21G datasheet Yes 14 PA21 See SAM D21G datasheet See SAM D21G datasheet Yes 15 PA22 See SAM D21G datasheet See SAM D21G datasheet Yes 16 PA23 See SAM D21G datasheet See SAM D21G datasheet Yes 17 GND Power Ground 18 PA24/USB_DM See SAM D21G datasheet Host Interface USB Data minus pin Yes 19 PA25/USB_DP See SAM D21G datasheet Host Interface USB Data Plus pin Yes 20 GND Power Ground 21 VCC Power Power supply for I/O 22 PB22 See SAM D21G datasheet See SAM D21G datasheet Yes 23 PB23 See SAM D21G datasheet See SAM D21G datasheet Yes 24 RESET_N Input see SAM D21G datasheet System Reset. Low level on this pin resets the entire module. Yes 25 PA30/SWCLK See SAM D21G datasheet Cortex Serial Wire Debug Interface CLK Yes ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 Pin # Pin description I/O type Function (default) Programmable pull-up/-down resistor 26 PA31/SWDIO See SAM D21G datasheet Cortex Serial Wire Debug Interface Data I/O Yes 27 PB02 See SAM D21G datasheet See SAM D21G datasheet Yes 28 PB03 See SAM D21G datasheet See SAM D21G datasheet Yes 29 PA00/GPIO/XIN32 See SAM D21G datasheet See SAM D21G datasheet Yes 30 PA01/GPIO/XOUT32 See SAM D21G datasheet See SAM D21G datasheet Yes 31 PA02 I/O See SAM D21G datasheet Yes 32 GND Power Ground Yes 33 PA03 See SAM D21G datasheet See SAM D21G datasheet Yes 34 PA04 See SAM D21G datasheet See SAM D21G datasheet Yes 35 PA05 See SAM D21G datasheet See SAM D21G datasheet Yes 36 PA06 See SAM D21G datasheet See SAM D21G datasheet Yes 37 PA07 See SAM D21G datasheet See SAM D21G datasheet Yes 38 PA08 See SAM D21G datasheet See SAM D21G datasheet Yes 39 PA09 See SAM D21G datasheet See SAM D21G datasheet Yes 40 PA10 See SAM D21G datasheet See SAM D21G datasheet Yes 41 PA11 See SAM D21G datasheet See SAM D21G datasheet Yes 42 GND Power Ground 43 PB10 See SAM D21G datasheet See SAM D21G datasheet Yes 44 PB11 See SAM D21G datasheet See SAM D21G datasheet Yes 45 Wi-Fi GPIO_4 ATWINC1500 I/O ATWINC1500 General purpose I/O Yes – pull-up 46 Wi-Fi GPIO_5 ATWINC1500 I/O ATWINC1500 General purpose I/O Yes – pull-up 47 Wi-Fi GPIO_6 ATWINC1500 I/O ATWINC1500 General purpose I/O Yes – pull-up 48 Wi-Fi I2C_SCL ATWINC1500 I/O Currently used only for Atmel debug. Not for customer use. Leave unconnected. Yes – pull-up 49 Wi-Fi I2C_SDA ATWINC1500 I/O Currently used only for Atmel debug. Not for customer use. Leave unconnected. Yes – pull-up 50 Wi-Fi Reset_n ATWINC1500 Input Currently used only for Atmel debug. Not for customer use. Leave unconnected. No 51 GND Power Ground ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 7 3.2 Package Description The ATSAMW25-MR210PB package information. Figure 3-2. SAMW25 MR210PB Package TOP VIEW SHIELD SIDE VIEW SHIELD NOTE: GND PADS MUST BE SOLDERED TO GND. P1 P51 GND GND GND GND NOTE: GND PADS MUST BE SOLDERED TO SYSTEM GND. GND GND GND GND P1 SOLDER PADS FOOTPRINT - TOP VIEW BOTTOM VIEW 8 Untoleranced Dimensions ATSAMW25-MR210 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 4 Electrical Specifications 4.1 Absolute Ratings All typical values are measured at T = 25°C unless otherwise specified. All minimum and maximum values are valid across operating temperature and voltage unless otherwise specified. Table 4-1. Absolute Maximum Ratings Parameters Minimum Maximum VBAT power supply voltage 0 5.0 VCC power supply voltage 0 3.63 GND-0.3 VCC+0.3 -40 +125 Pin voltage with respect to GND and VCC Storage temperature range Table 4-2. V °C General Operating Ratings Parameters Minimum Typical Maximum VBATT 3.0 3.6 4.3 VCC 2.7 3.30 3.6 Operating temperature range -40 25 85 Table 4-3. Unit °C Physical Characteristics Parameters Value Comments Size 33.863 x 14.882mm - Connector pins pitch See module footprint - Table 4-4. Unit I/O Pins Characteristics Characteristic Minimum Typical Maximum Input Low Voltage VIL -0.30 0.65 Input High Voltage VIH VCC-0.60 VCC+0.30 Unit V Output Low Voltage VOL Output High Voltage VOH 0.45 VCC-0.50 Output Loading 20 Digital Input Load 6 pF Pull-up Resistor 76K 90K 104K Ω I/O pin characteristics for pins 5, 45, 46, and 47 (for all other I/O, see the SAM D21G datasheet). ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 9 4.2 Recommended Operating Conditions Table 4-5. Recommended Operating Conditions Characteristic Symbol Minimum Typical Maximum I/O supply voltage VCC 2.7 3.3 3.6 Battery supply voltage VBATT 3.0 3.6 4.3 Unit V Operating temperature Notes: 4.3 1. 2. -40 85 ºC I/O supply voltage is applied to the following pins: VDDIO_A and VDDIO. Battery supply voltage is applied to following pins: VDD_BATT_PPA, VDD_BATT_PA, and VBATT_BUCK. DC Electrical Characteristics Table 4-6 provides the DC characteristics for the ATSAMW25 digital pads. Table 4-6. DC Electrical Characteristics Characteristic Minimum Maximum Input Low Voltage VIL -0.30 0.65 Input High Voltage VIH VCC-0.60 VCC+0.30 Unit V Output Low Voltage VOL 0.45 Output High Voltage VOH VCC-0.50 Output Loading 20 Digital Input Load 6 pF Pad Drive Strength (regular pads1) Pad Drive Strength (high-drive pads1) 8 13.5 16 27 mA Note: 1. The following are high-drive pads: I2C_SCL, I2C_SDA; all other pads are regular. 10 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 5 Application and Core Subsystems 5.1 Host Processor The Atmel | SMART SAM D ARM Cortex-M0+ based microcontroller (MCU) series builds on decades of innovation and experience in embedded Flash microcontroller technology. It not only sets a new benchmark for flexibility and ease-of-use but also combines the performance and energy efficiency of an ARM Cortex-M0+ based MCU with an optimized architecture and peripheral set. The Atmel | SMART SAM D gives you a truly differentiated general-purpose microcontroller that is ideal for many low-power, cost-sensitive industrial, and consumer applications. 5.1.1 Host MCU Description A rich set of peripherals, flexibility, and ease-of-use combined with low power consumption make the Atmel SAM D21 ideal for a wide range of home automation, consumer, metering, and industrial applications. 5.1.2 ARM Cortex-M0+ based MCU running up to 48MHz 256KB embedded Flash and 32KB SRAM DMA and Event system Six flexible serial communication modules (SERCOM) Full-speed USB device and embedded Host 12-bit ADC (SAM D21G: 14 channels); 10-bit DAC Hardware touch support Host MCU Key Features Low power consumption, down to 70µA/MHz Enhanced Analog Performance – ADC with offset and gain correction – Averaging, oversampling, and decimation 5.2 – Flexible DAC – New low-power internal oscillators – ±2% accuracy over operating range Digital Innovations – – Programmable Event System Enhanced TC for Control Applications – Programmable SERCOM module – I2C / SPI / USART / LIN2 / IrDA – Full Speed USB Device and Host – No external components needed – 6-12 channel DMA with CRC module – PTC Hardware touch module – I2S module with PDM support Wi-Fi Core Processor ATWINC1500B has a Cortus APS3 32-bit processor. This processor performs many of the MAC functions, including but not limited to association, authentication, power management, security key management, and MSDU aggregation/de-aggregation. In addition, the processor provides flexibility for various modes of operation, such as STA and AP modes. ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 11 5.2.1 Memory Subsystem The APS3 core uses a 128KB instruction/boot ROM along with a 128KB instruction RAM and a 64KB data RAM. ATWINC1500B also has 8Mb of flash memory, which can be used for system software. In addition, the device uses a 128KB shared RAM, accessible by the processor and MAC, which allows the APS3 core to perform various data management tasks on the TX and RX data packets. 5.2.2 Non-volatile Memory (eFuse) ATWINC1500B has 768 bits of non-volatile eFuse memory that can be read by the CPU after device reset. This non-volatile one-time-programmable (OTP) memory can be used to store customer-specific parameters, such as MAC address; various calibration information, such as TX power, crystal frequency offset, etc.; and other software-specific configuration parameters. The eFuse is partitioned into six 128-bit banks. Each bank has the same bit map, which is shown in Figure 5-1. The purpose of the first 80 bits in each bank is fixed, and the remaining 48 bits are general-purpose software dependent bits, or reserved for future use. Since each bank can be programmed independently, this allows for several updates of the device parameters following the initial programming, e.g. updating MAC address. Refer to ATWINC1500B Programming Guide for the eFuse programming instructions. Flags 8 Bank 0 F 48 MAC Addr TX Gain Correcti on 8 G 1 15 Freq. Offset 7 1 Used 1 Used 4 MAC ADDR Used 3 Reserved 1 Invalid Used 1 eFuse Bit Map Version Figure 5-1. 16 FO Bank 1 Bank 2 Bank 3 Bank 4 Bank 5 128 Bits 12 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 6 WLAN Subsystem The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY). The following two subsections describe the MAC and PHY in detail. 6.1 MAC 6.1.1 Features The ATWINC1500B IEEE802.11 MAC supports the following functions: IEEE 802.11b/g/n IEEE 802.11e WMM® QoS EDCA/PCF multiple access categories traffic scheduling Advanced IEEE 802.11n features: – Transmission and reception of aggregated MPDUs (A-MPDU) – Transmission and reception of aggregated MSDUs (A-MSDU) – Immediate Block Acknowledgement – Reduced Interframe Spacing (RIFS) Support for IEEE802.11i and WFA security with key management – WEP 64/128 – WPA-TKIP – 128-bit WPA2 CCMP (AES) Support for WAPI security Advanced power management – – 6.1.2 Standard 802.11 Power Save Mode Wi-Fi Alliance WMM-PS (U-APSD) RTS-CTS and CTS-self support Supports either STA or AP mode in the infrastructure basic service set mode Supports independent basic service set (IBSS) Description The ATWINC1500B MAC is designed to operate at low power while providing high data throughput. The IEEE 802.11 MAC functions are implemented with a combination of dedicated data path engines, hardwired control logic, and a low-power, high-efficiency microprocessor. The combination of dedicated logic with a programmable processor provides optimal power efficiency and real-time response while providing the flexibility to accommodate evolving standards and future feature enhancements. Dedicated data path engines are used to implement data path functions with heavy computational. For example, an FCS engine checks the CRC of the transmitting and receiving packets, and a cipher engine performs all the required encryption and decryption operations for the WEP, WPA-TKIP, WPA2 CCMP-AES, and WAPI security requirements. Control functions, which have real-time requirements, are implemented using hardwired control logic modules. These logic modules offer real-time response while maintaining configurability via the processor. Examples of hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX control, inter-frame spacing, etc.), protocol timer module (responsible for the Network Access Vector, back-off timing, timing synchronization function, and slot management), MPDU handling module, aggregation/deaggregation module, block ACK controller (implements the protocol requirements for burst block communication), and TX/RX control FSMs (coordinate data movement between PHY-MAC interface, cipher engine, and the DMA interface to the TX/RX FIFOs).ø The MAC functions implemented solely in software on the microprocessor have the following characteristics: Functions with high memory requirements or complex data structures. Examples are association table management and power save queuing. ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 13 Functions with low computational load or without critical real-time requirements. Examples are authentication and association. Functions which need flexibility and upgradeability. Examples are beacon frame processing and QoS scheduling. 6.2 PHY 6.2.1 Features The ATWINC1500B IEEE802.11 PHY supports the following functions: Single antenna 1x1 stream in 20MHz channels Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, and 11Mbps Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, and 54Mbps Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2, 13.0, 14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, and 72.2Mbps IEEE 802.11n mixed mode operation 6.2.2 Per packet TX power control Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery, and frame detection Description The ATWINC1500B WLAN PHY is designed to achieve reliable and power-efficient physical layer communication specified by IEEE 802.11 b/g/n in single stream mode with 20MHz bandwidth. Advanced algorithms have been employed to achieve maximum throughput in a real world communication environment with impairments and interference. The PHY implements all the required functions such as FFT, filtering, FEC (Viterbi decoder), frequency and timing acquisition and tracking, channel estimation and equalization, carrier sensing, and clear channel assessment, as well as the automatic gain control. 6.3 Radio 6.3.1 Receiver Performance Radio performance under typical conditions: VBAT = 3.3V; VDDIO = 3.3V; Temp.: 25°C @ RF pins Table 6-1. Parameter Receiver Performance Description Frequency Sensitivity 802.11b 14 Minimum Typical 2,412 Maximum Unit 2,484 MHz 1Mbps DSS -98 dBm 2Mbps DSS -94 dBm 5.5Mbps DSS -92 dBm 11Mbps DSS -88 dBm ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 Parameter Sensitivity 802.11g Sensitivity 802.11n (BW=20MHz) Maximum Receive Signal Level Adjacent Channel Rejection Cellular Blocker Immunity Description Minimum Typical Maximum Unit 6Mbps OFDM -90 dBm 9Mbps OFDM -89 dBm 12Mbps OFDM -88 dBm 18Mbps OFDM -85 dBm 24Mbps OFDM -83 dBm 36Mbps OFDM -80 dBm 48Mbps OFDM -76 dBm 54Mbps OFDM -74 dBm MCS 0 -89 dBm MCS 1 -87 dBm MCS 2 -85 dBm MCS 3 -82 dBm MCS 4 -77 dBm MCS 5 -74 dBm MCS 6 -72 dBm MCS 7 -70.5 dBm 1-11Mbps DSS 0 dBm 6-54Mbps OFDM 0 dBm MCS 0 – 7 0 dBm 1Mbps DSS (30MHz offset) 50 dB 11Mbps DSS (25MHz offset) 43 dB 6Mbps OFDM (25MHz offset) 40 dB 54Mbps OFDM (25MHz offset) 25 dB MCS 0 – 20MHz BW (25MHz offset) 40 dB MCS 7 – 20MHz BW (25MHz offset) 20 dB 776-794MHz CDMA -14 dBm 824-849MHz GSM -10 dBm 880-915MHz GSM -10 dBm 1710-1785MHz GSM -15 dBm 1850-1910MHz GSM -15 dBm 1850-1910MHz WCDMA -24 dBm 1920-1980MHz WCDMA -24 dBm Measured at RF pin assuming 50Ω differential; RF performance guaranteed for temperature range -30 to 85ºC. 1dB derating in performance at -40ºC. ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 15 6.3.2 Transmitter Performance Radio performance under typical conditions: VBAT = 3.3V; VDDIO = 3.3V; Temp.: 25°C @ RF pins Table 6-2. Transmitter Performance Parameter Description Frequency Minimum Typical 2,412 Maximum Unit 2,484 MHz 802.11b 1Mbps 18.5 dBm 802.11b 11Mbps 19.5 dBm 802.11g 6Mbps 18.5 dBm 802.11g 54Mbps 16.5 dBm 802.11n MCS 0 17.0 dBm 802.11n MCS 7 14.5 dBm 802.11b 1Mbps 17.0 dBm 802.11b 11Mbps 17.5 dBm 802.11g 6-18Mbps 16.0 dBm 802.11g >18Mbps N/A dBm 802.11n MCS 0-3 14.5 dBm 802.11n >MCS 3 N/A dBm TX Power Accuracy ±1.52 dB Carrier Suppression 30.0 dBc 76-108 -125 dBm/Hz 776-794 -125 dBm/Hz 869-960 -125 dBm/Hz 925-960 -125 dBm/Hz 1570-1580 -125 dBm/Hz 1805-1880 -125 dBm/Hz 1930-1990 -125 dBm/Hz 2110-2170 -125 dBm/Hz Output Power1, ON_Transmit_High_Power Mode Output Power1, ON_Transmit_Low_Power Mode Out of Band Transmit Power 2nd -41 dBm/MHz 3rd -41 dBm/MHz Harmonic Output Power Notes: 16 1. 2. Measured at 802.11 spec compliant EVM/Spectral Mask. Measured after RF matching network. See reference design. ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 7 Recommended Reflow Profile ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 17 8 Module Schematic The ATSAMW25-MR210PB/MR510PB Module schematic is shown in Figure 8-1. Figure 8-1. 18 ATSAMW25-MR210PB/MR510 Module Schematic ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 19 9 Bill of Materials (BOM) 20 ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 10 Application Schematic Figure 10-1. Connections for the ATSAMW25 The basic power supply connections for the ATSAMW25 module are shown in Figure 10-1. The test points shown (TP1 – TP6) should be added in case Atmel is required to debug the design. The Wi-Fi chip can use its own internal oscillator for a Real Time Clock (RTC) or it can use an external 32.768KHz clock provided on the RTC pin. Using an external clock derived from a crystal oscillator can be used as a more accurate sleep timer for the Wi-Fi chip than its own internal oscillator. This in turn can reduce sleep current. If power consumption during sleep is a priority then a 32.768KHz crystal can be added to the SAM D21 module as shown in the reference design. The design shown above displays a connection from pin 15 (PA22) to pin 5 (GPIO_1). GPIO_1 is the input pin for the Wi-Fi’s Real Time Clock. PA22 can be configured to output a 32.768KHz RTC clock – derived from the 32.768KHz crystal - to be used as the source for the Wi-Fi’s RTC. If cost is a priority versus power consumption, then the 32.768KHz crystal can be left off of the design and the PA22 – GPIO_1 connection can be deleted. ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 21 11 Design Guidelines It is critical to follow the recommendations listed below to achieve the best RF performance: When the module is placed on the motherboard, a provision for the antenna must be made. There should be nothing under the portion of the module which contains the antenna. This means the antenna should not be placed directly on top of the motherboard PCB. This can be accomplished by, for example, placing the module at the edge of the board such that the module edge with the antenna extends beyond the main board edge by 6.5mm. Alternatively, a cutout in the motherboard can be provided under the antenna. The cutout should be at least 22 x 6.5mm. Ground vias spaced 2.5mm apart should be placed all around the perimeter of the cutout. No large components should be placed near the antenna. Keep away from antenna, as far as possible, large metal objects to avoid electromagnetic field blocking Do not enclose the antenna within a metal shield Keep any components which may radiate noise or signals within the 2.4 – 2.5GHz frequency band far away from the antenna, or better yet, shield those components. Any noise radiated from the main board in this frequency band will degrade the sensitivity of the module. The main board should have a solid ground plane. Each ground pin of the module (including each of the center ground pads) should have a via placed either in the pad or right next to the pad going down to the ground plane. 22 Place a 10µF decoupling capacitor from VBAT to ground right next to pin 7. Place another 10µF capacitor from VCC to ground right next to pin 21. Contact Atmel for assistance if any other placement is required ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 12 Reference Documentation and Support 12.1 Reference Documents Atmel offers a set of collateral documentation to ease integration and device ramp. The following list of documents available on Atmel web or integrated into development tools. Table 12-1. Reference Documents Title Content Datasheet This document Design Files User Guide, Schematic, PCB layout, Gerber, BOM, and System notes on: RF/Radio Full Test Report, radiation pattern, design guidelines, temperature performance, ESD. Package How to use package: Out of the Box starting guide, HW limitations and notes, SW Quick start guidelines. Platform Getting started Guide Best practices and recommendations to design a board with the product, including: Antenna Design for Wi-Fi (layout recommendations, types of antennas, impedance matching, using a power amplifier etc.), SPI/UART protocol between Wi-Fi SoC and the Host MCU. HW Design Guide Integration guide with clear description of: High level Arch, overview on how to write a networking application, list all API, parameters and structures. Features of the device, SPI/handshake protocol between device and host MCU, with flow/sequence/state diagram, timing. SW Design Guide Explain in details the flow chart and how to use each API to implement all generic use cases (e.g. start AP, start STA, provisioning, UDP, TCP, http, TLS, p2p, errors management, connection/transfer recovery mechanism/state diagram) - usage and sample application note. For a complete listing of development-support tools and documentation, visit http://www.atmel.com/ or contact the nearest Atmel field representative. 12.2 Related Documents [1] ATSAM D21 Datasheet: Web page: http://www.atmel.com/products/microcontrollers/arm/sam-d.aspx?tab=documents. Document: Atmel SAM D21 Datasheet (.pdf file). Then select the required device (ATSAMD21E18A) and get the latest datasheet (.pdf file). [2] ATWINC1500B Datasheet. [3] ATSAM W25 Network Controller Programming Guide. [4] ATSAM W25 Starter Kit User Guide. ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 23 13 Revision History Doc Rev. 24 Date Comments 42618B 05/2016 Updated Figure 3-2 with new POD drawing which has PCB footprint and to solder GND pads. 42618A 11/2015 Initial document release. ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 │ www.atmel.com © 2016 Atmel Corporation. / Rev.: Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. ARM®, ARM Connected® logo, Cortex®, and others are the registered trademarks or trademarks of ARM Ltd. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license , express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. 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Atmel products are not designed nor intended for use in military or aerospace application s or environments unless specifically designated by Atmel as military-grade. Atmel products are not designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive -grade. ATSAMW25-MR210PB IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [DATASHEET] Atmel-42618B-SmartConnect-ATSAMW25-MR210PB_Datasheet_05/2016 25