ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module PRELIMINARY DATASHEET Description The Atmel® | SMART SAMW25 module is based on the industry-leading lowpower 2.4GHz IEEE® 802.11 b/g/n Wi-Fi ATWINC1500 SoC (System on Chip) combined with the ARM® Cortex®-M0+ based microcontroller technology from Atmel. This turnkey system provides an integrated software solution with application and security protocols such as TLS, integrated network services (TCP/IP stack) which are all available through Atmel Studio 6 integrated development environment (IDE).The Atmel SmartConnect modules offer the ideal solutions for designers seeking to add Wi-Fi connectivity with minimal previous experience in 802.11, IP Stack or RF. Atmel SmartConnect Wi-Fi from Atmel opens the door of the Internet of Things (IoT) to the vast array of battery-powered devices and applications requiring the integration of WLAN connectivity without compromising on cost or power consumption. While we compete with other Wi-Fi modules on size, RF performance, cost and other characteristics, our Atmel SmartConnect product family has a distinctive advantage when it comes to power consumption and power saving modes. The ATSAMW25 device is a standalone end point, where a complete small application can be executed on the module by itself. Features Key features with SAMW25 Wireless connectivity solution: Certified Wi-Fi ATWINC1500A-MU-T with SAMD21 application IEEE 802.11 b/g/n 20MHz (1x1) solution Single spatial stream in 2.4GHz ISM band Compact footprint: 33.863 x 14.882mm Radio: – Output power - 802.11b /11Mbps: 17dBm ±1dB – 802.11g /54Mbps: 15dBm ±1dB @ EVM -28dB – 802.11n /65Mbps: 13dBm ±1dB @ EVM -30dB Application processor: – Atmel SAMD21 ARM Cortex M0+ based microcontroller – 256KB embedded Flash and 32KB SRAM – Full-Speed USB Device and embedded Host Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 CryptoAuthentication™ ATECC508 (optional) I/O operating voltage: 2.7 to 3.6V Power Amplifier and On-board Switching Regulator operating voltage: 2.7 to 4.6V Power states supported: – Provision (AP/ Sniffer) IDLE LISTEN – IDLE – SUSPEND Extreme low power, on-chip low power sleep oscillator Serial Host Interface SPI or UART Software Upgrade Over-the-Air (OTA) FCC, CE, IC, and TELEC Certified; RoHS compliant Security protocols; WPA/WPA2 Personal, TLS, SSL Network services; DHCP, DNS, TCP/IP (IPv4), UDP, HTTP, HTTPS Target Applications IoT applications Smart appliances Multimedia streaming Safety and security Home automation Consumer electronics Industrial automation 2 ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 2 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 Ta bl e of Conte nts 1 Block Diagram ............................................................................................................. 4 2 Ordering Information and IC Marking ........................................................................ 4 3 Pinout and Package Information ................................................................................ 5 3.1 3.2 4 Electrical Specifications ........................................................................................... 10 4.1 4.2 4.3 5 Absolute Ratings ................................................................................................................................. 10 Recommended Operating Conditions ................................................................................................. 11 DC Electrical Characteristics ............................................................................................................... 11 Application and Core Subsystems ........................................................................... 12 5.1 5.2 6 Pin Description ...................................................................................................................................... 5 Package Description ............................................................................................................................. 9 Host Processor .................................................................................................................................... 12 5.1.1 Host MCU Description ............................................................................................................ 12 5.1.2 Host MCU Key Features ......................................................................................................... 12 Wi-Fi Core Processor .......................................................................................................................... 12 5.2.1 Memory Subsystem ................................................................................................................ 13 5.2.2 Non-Volatile Memory (eFuse) ................................................................................................. 13 WLAN Subsystem ...................................................................................................... 14 6.1 6.2 6.3 MAC 6.1.1 6.1.2 PHY 6.2.1 6.2.2 Radio 6.3.1 6.3.2 .............................................................................................................................................. 14 Features ................................................................................................................................. 14 Description.............................................................................................................................. 14 .............................................................................................................................................. 15 Features ................................................................................................................................. 15 Description.............................................................................................................................. 15 .............................................................................................................................................. 15 Receiver Performance ............................................................................................................ 15 Transmitter Performance ........................................................................................................ 16 7 Recommended Reflow Profile .................................................................................. 17 8 Reference Design ...................................................................................................... 18 9 Bill of Materials (BOM) .............................................................................................. 19 10 Application Schematics ............................................................................................ 20 11 Design Guidelines ..................................................................................................... 21 12 Reference Documentation and Support................................................................... 22 12.1 Reference Documents......................................................................................................................... 22 12.2 Related Documents ............................................................................................................................. 22 13 Revision History ........................................................................................................ 23 ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 3 3 1 Block Diagram Figure 1-1. 2 ATSAMW25 Block Diagram Ordering Information and IC Marking Table 2-1. Ordering Details Atmel Ordering Code 4 Package ATSAMW25-MR210PA WINC1500 + SAMD21 module. Tray Packing ATSAMW25-MR510PA WINC1500+SAMD21+ATECC508 module. Tray Packing ATSAMW25-XPRO Xplained board evaluation kit ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 4 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 3 Pinout and Package Information 3.1 Pin Description Figure 3-1. Pin Assignment ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 5 5 Table 3-1. Pin # 6 Pin Description Pin Description I/O Type Function (default) Programmable Pullup/-down Resistor 1 GND N/A Common Ground 2 UART_TxD WINC1500 Output Currently used only for Atmel debug. Not for customer use. Leave unconnected. Yes – Pullup 3 UART_RxD WINC1500 Input Currently used only for Atmel debug. Not for customer use. Leave unconnected. Yes – Pullup 4 Wi-Fi Chip_En WINC1500 Input Currently used only for Atmel debug. Not for customer use. Leave unconnected. No 5 Wi-Fi GPIO_1/RTC WINC1500 I/O ATWINC1500 General purpose I/O. Can also be used to input a 32.768KHz Real Time Clock for accurate timing of Wi-Fi sleep intervals Yes – Pullup 6 NC - No connect 7 VBAT Power Supply for Wi-Fi RF Power Amplifier and Internal 1.3V Switching Regulator 8 PA16 See SAM D21G datasheet See SAM D21G datasheet Yes 9 PA17 See SAM D21G datasheet See SAM D21G datasheet Yes 10 GND Power Ground 11 PA18 See SAM D21G datasheet See SAM D21G datasheet Yes 12 PA19 See SAM D21G datasheet See SAM D21G datasheet Yes 13 PA20 See SAM D21G datasheet See SAM D21G datasheet Yes 14 PA21 See SAM D21G datasheet See SAM D21G datasheet Yes 15 PA22 See SAM D21G datasheet See SAM D21G datasheet Yes 16 PA23 See SAM D21G datasheet See SAM D21G datasheet Yes 17 GND Power Ground 18 PA24/USB_DM See SAM D21G datasheet Host Interface USB Data minus pin Yes 19 PA25/USB_DP See SAM D21G datasheet Host Interface USB Data Plus pin Yes 20 GND Power Ground 21 VCC Power Power supply for I/O 22 PB22 See SAM D21G datasheet See SAM D21G datasheet Yes 23 PB23 See SAM D21G datasheet See SAM D21G datasheet Yes 24 RESET_N Input see SAM D21G datasheet System Reset. Low level on this pin resets the entire module. Yes 25 PA30/SWCLK See SAM D21G datasheet Cortex Serial Wire Debug Interface CLK Yes ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 6 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 Pin # Pin Description I/O Type Function (default) Programmable Pullup/-down Resistor 26 PA31/SWDIO See SAM D21G datasheet Cortex Serial Wire Debug Interface Data I/O Yes 27 PB02 See SAM D21G datasheet See SAM D21G datasheet Yes 28 PB03 See SAM D21G datasheet See SAM D21G datasheet Yes 29 PA00/GPIO/XIN32 See SAM D21G datasheet See SAM D21G datasheet Yes 30 PA01/GPIO/XOUT32 See SAM D21G datasheet See SAM D21G datasheet Yes 31 PA02 I/O See SAM D21G datasheet Yes 32 GND Power Ground Yes 33 PA03 See SAM D21G datasheet See SAM D21G datasheet Yes 34 PA04 See SAM D21G datasheet See SAM D21G datasheet Yes 35 PA05 See SAM D21G datasheet See SAM D21G datasheet Yes 36 PA06 See SAM D21G datasheet See SAM D21G datasheet Yes 37 PA07 See SAM D21G datasheet See SAM D21G datasheet Yes 38 PA08 See SAM D21G datasheet See SAM D21G datasheet Yes 39 PA09 See SAM D21G datasheet See SAM D21G datasheet Yes 40 PA10 See SAM D21G datasheet See SAM D21G datasheet Yes 41 PA11 See SAM D21G datasheet See SAM D21G datasheet Yes 42 GND Power Ground 43 PB10 See SAM D21G datasheet See SAM D21G datasheet Yes 44 PB11 See SAM D21G datasheet See SAM D21G datasheet Yes 45 Wi-Fi GPIO_15 WINC1500 I/O ATWINC1500 General purpose I/O. Pin must not be driven or pulled high when the ATWINC1500 is in Suspend Mode. Yes – Pullup 46 Wi-Fi GPIO_16 WINC1500 I/O ATWINC1500 General purpose I/O. Pin must not be driven or pulled high when the ATWINC1500 is in Suspend Mode. Yes – Pullup 47 Wi-Fi GPIO_18 WINC1500 I/O ATWINC1500 General purpose I/O. Pin must not be driven or pulled high when the ATWINC1500 is in Suspend Mode. Yes – Pullup 48 Wi-Fi I2C_SCL WINC1500 I/O Currently used only for Atmel debug. Not for customer use. Leave unconnected. Yes – Pullup 49 Wi-Fi I2C_SDA WINC1500 I/O Currently used only for Atmel debug. Not for customer use. Leave unconnected. Yes – Pullup ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 7 7 Pin # 8 Pin Description I/O Type Function (default) 50 Wi-Fi Reset_n WINC1500 Input Currently used only for Atmel debug. Not for customer use. Leave unconnected. 51 GND Power Ground ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 8 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 Programmable Pullup/-down Resistor No 3.2 Package Description The ATSAMW25-MR210PA package information. Figure 3-2. SAMW25 MR210PA Package ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 9 9 4 Electrical Specifications 4.1 Absolute Ratings All typical values are measured at T = 25°C unless otherwise specified. All minimum and maximum values are valid across operating temperature and voltage unless otherwise specified. Table 4-1. Absolute Maximum Ratings Parameters Minimum Maximum VBAT power supply voltage 0 5.0 VCC power supply voltage 0 3.63 GND-0.3 VCC+0.3 -40 +125 Pin voltage with respect to GND and VCC Storage temperature range Table 4-2. V °C General Operating Ratings Parameters Minimum Typical Maximum VBATT 2.7 3.30 4.2 VCC 1.62 3.30 3.6 Operating temperature range -40 25 85 Table 4-3. Unit °C Physical Characteristics Parameters Value Comments Size 33.863 x 14.882mm - Connector pins pitch see module footprint - Table 4-4. Unit I/O Pins Characteristics VDDIO Condition Characteristic Minimum Typical Maximum Input Low Voltage VIL -0.30 0.60 Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 Unit VDDIOL Output Low Voltage VOL Output High Voltage VOH 0.45 VDDIO-0.50 Input Low Voltage VIL -0.30 0.63 Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 VDDIOM Output Low Voltage VOL Output High Voltage VOH 0.45 VDDIO-0.50 Input Low Voltage VIL -0.30 0.65 Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 (up to 3.60) VDDIOH 10 ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 1 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 0 V VDDIO Condition Characteristic Minimum Typical Maximum Output Low Voltage VOL Unit 0.45 V Output High Voltage VOH VDDIO-0.50 All Output Loading 20 All Digital Input Load 6 pF Pull-up resistor 76K 90K 104K ohms Unit I/O pin characteristics for pins 5, 45, 46, 47 (for all other I/O, see the SAM D21G datasheet). 4.2 Recommended Operating Conditions Table 4-5. Recommended Operating Conditions Characteristic Symbol Minimum Typical Maximum I/O supply voltage VDDIO 2.7 3.3 3.6 Battery supply voltage VBATT 3.0 3.6 4.2 V Operating temperature Notes: 4.3 1. 2. -40 85 ºC I/O supply voltage is applied to the following pins: VDDIO_A, VDDIO. Battery supply voltage is applied to following pins: VDD_BATT_PPA, VDD_BATT_PA, and VBATT_BUCK. DC Electrical Characteristics Table 4-6 provides the DC characteristics for the ATSAMW25 digital pads. Table 4-6. DC Electrical Characteristics VDDIO Condition Characteristic Minimum Maximum Input Low Voltage VIL -0.30 0.60 Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 Unit VDDIOL Output Low Voltage VOL Output High Voltage VOH 0.45 VDDIO-0.50 Input Low Voltage VIL -0.30 0.63 Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 VDDIOM V Output Low Voltage VOL Output High Voltage VOH 0.45 VDDIO-0.50 Input Low Voltage VIL -0.30 0.65 Input High Voltage VIH VDDIO-0.60 VDDIO+0.30 (up to 3.60) VDDIOH Output Low Voltage VOL Output High Voltage VOH 0.45 VDDIO-0.50 All Output Loading 20 All Digital Input Load 6 pF ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 11 1 1 5 Application and Core Subsystems 5.1 Host Processor The Atmel | SMART SAM D ARM Cortex-M0+ based microcontroller (MCU) series builds on decades of innovation and experience in embedded Flash microcontroller technology. It not only sets a new benchmark for flexibility and ease-of-use but also combines the performance and energy efficiency of an ARM Cortex-M0+ based MCU with an optimized architecture and peripheral set. The Atmel | SMART SAM D gives you a truly differentiated general-purpose microcontroller that is ideal for many low-power, cost-sensitive industrial and consumer applications. 5.1.1 Host MCU Description A rich set of peripherals, flexibility and ease-of-use combined with low power consumption make the Atmel SAM D21 ideal for a wide range of home automation, consumer, metering, and industrial applications. 5.1.2 ARM Cortex-M0+ based MCU running up to 48MHz 256KB embedded Flash and 32KB SRAM DMA and Event system Six flexible serial communication modules (SERCOM) Full-Speed USB Device and embedded Host 12-bit ADC (SAM D21G: 14 channels); 10-bit DAC Hardware touch support Host MCU Key Features Low power consumption, down to 70µA/MHz Enhanced Analog Performance 5.2 – ADC with offset and gain correction – Averaging, oversampling, and decimation – Flexible DAC – New low power internal oscillators – ±2% accuracy over operating range Digital Innovations – Programmable Event System – Enhanced TC for Control Applications – Programmable SERCOM module – I2C / SPI / USART / LIN2 / IrDA – Full Speed USB Device and Host – No external components needed – 6-12 channel DMA with CRC module – PTC Hardware touch module – I2S module with PDM support Wi-Fi Core Processor ATWINC1500A has a Cortus APS3 32-bit processor. This processor performs many of the MAC functions, including but not limited to association, authentication, power management, security key management, and MSDU aggregation/de-aggregation. In addition, the processor provides flexibility for various modes of operation, such as STA and AP modes. 12 ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 1 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 2 5.2.1 Memory Subsystem The APS3 core uses a 128KB instruction/boot ROM along with a 128KB instruction RAM and a 64KB data RAM. ATWINC1500A also has 4Mb of flash memory, which can be used for system software. In addition, the device uses a 128KB shared RAM, accessible by the processor and MAC, which allows the APS3 core to perform various data management tasks on the TX and RX data packets. Non-Volatile Memory (eFuse) ATWINC1500A has 768 bits of non-volatile eFuse memory that can be read by the CPU after device reset. This non-volatile one-time-programmable (OTP) memory can be used to store customer-specific parameters, such as MAC address; various calibration information, such as TX power, crystal frequency offset, etc.; and other software-specific configuration parameters. The eFuse is partitioned into six 128-bit banks. Each bank has the same bit map, which is shown in Figure 5-1. The purpose of the first 80 bits in each bank is fixed, and the remaining 48 bits are general-purpose software dependent bits, or reserved for future use. Since each bank can be programmed independently, this allows for several updates of the device parameters following the initial programming, e.g. updating MAC address. Refer to ATWINC1500A Programming Guide for the eFuse programming instructions. Flags 8 Bank 0 F 48 MAC ADDR 8 G 1 15 Freq. Offset 7 Used 1 TX Gain Correc tion 1 Used 4 Reserved 3 Version 1 Invalid 1 eFuse Bit Map MAC ADDR Used Figure 5-1. Used 5.2.2 16 FO Bank 1 Bank 2 Bank 3 Bank 4 Bank 5 128 Bits ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 13 1 3 6 WLAN Subsystem The WLAN subsystem is composed of the Media Access Controller (MAC) and the Physical Layer (PHY). The following two subsections describe the MAC and PHY in detail. 6.1 MAC 6.1.1 Features The ATWINC1500A IEEE802.11 MAC supports the following functions: IEEE 802.11b/g/n IEEE 802.11e WMM QoS EDCA/PCF multiple access categories traffic scheduling Advanced IEEE 802.11n features: 6.1.2 – Transmission and reception of aggregated MPDUs (A-MPDU) – Transmission and reception of aggregated MSDUs (A-MSDU) – Immediate Block Acknowledgement – Reduced Interframe Spacing (RIFS) Support for IEEE802.11i and WFA security with key management – WEP 64/128 – WPA-TKIP – 128-bit WPA2 CCMP (AES) Support for WAPI security Advanced power management – Standard 802.11 Power Save Mode – Wi-Fi Alliance WMM-PS (U-APSD) RTS-CTS and CTS-self support Supports either STA or AP mode in the infrastructure basic service set mode Supports independent basic service set (IBSS) Description The ATWINC1500A MAC is designed to operate at low power while providing high data throughput. The IEEE 802.11 MAC functions are implemented with a combination of dedicated data path engines, hardwired control logic, and a low-power, high-efficiency microprocessor. The combination of dedicated logic with a programmable processor provides optimal power efficiency and real-time response while providing the flexibility to accommodate evolving standards and future feature enhancements. Dedicated data path engines are used to implement data path functions with heavy computational. For example, an FCS engine checks the CRC of the transmitting and receiving packets, and a cipher engine performs all the required encryption and decryption operations for the WEP, WPA-TKIP, WPA2 CCMP-AES, and WAPI security requirements. Control functions which have real-time requirements are implemented using hardwired control logic modules. These logic modules offer real-time response while maintaining configurability via the processor. Examples of hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX control, interframe spacing, etc.), protocol timer module (responsible for the Network Access Vector, back-off timing, timing synchronization function, and slot management), MPDU handling module, aggregation/deaggregation module, block ACK controller (implements the protocol requirements for burst block communication), and TX/RX control FSMs (coordinate data movement between PHY-MAC interface, cipher engine, and the DMA interface to the TX/RX FIFOs). 14 ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 1 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 4 The MAC functions implemented solely in software on the microprocessor have the following characteristics: Functions with high memory requirements or complex data structures. Examples are association table management and power save queuing. Functions with low computational load or without critical real-time requirements. Examples are authentication and association. Functions which need flexibility and upgradeability. Examples are beacon frame processing and QoS scheduling. 6.2 PHY 6.2.1 Features The ATWINC1500A IEEE802.11 PHY supports the following functions: 6.2.2 Single antenna 1x1 stream in 20MHz channels Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5, 11Mbps Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48, 54Mbps Supports IEEE 802.11n HT modulations MCS0-7, 20MHz, 800 and 400ns guard interval: 6.5, 7.2, 13.0, 14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0, 72.2Mbps IEEE 802.11n mixed mode operation Per packet TX power control Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery, and frame detection Description The ATWINC1500A WLAN PHY is designed to achieve reliable and power-efficient physical layer communication specified by IEEE 802.11 b/g/n in single stream mode with 20MHz bandwidth. Advanced algorithms have been employed to achieve maximum throughput in a real world communication environment with impairments and interference. The PHY implements all the required functions such as FFT, filtering, FEC (Viterbi decoder), frequency and timing acquisition and tracking, channel estimation and equalization, carrier sensing, and clear channel assessment, as well as the automatic gain control. 6.3 Radio 6.3.1 Receiver Performance Radio Performance under Typical Conditions: VBAT=3.3V; VDDIO=3.3V; Temp.: 25°C @ RF pins Table 6-1. Receiver Performance Parameter Description Frequency Minimum Typical (1) 2,412 1Mbps DSS -95.5 2Mbps DSS -93.5 Maximum Unit 2,484 MHz Sensitivity 802.11b dBm 5.5Mbps DSS -91 11Mbps DSS -87 ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 15 1 5 Parameter Description Minimum Typical (1) 6Mbps OFDM -89 9Mbps OFDM -87.5 12Mbps OFDM -86.5 18Mbps OFDM -84.5 24Mbps OFDM -81.5 36Mbps OFDM -78 48Mbps OFDM -74 54Mbps OFDM -72 Maximum Sensitivity 802.11g Sensitivity 802.11n (BW=20MHz) Note: 6.3.2 1. Unit dBm MCS 0 -87.5 MCS 1 -85 MCS 2 -82 MCS 3 -79.5 MCS 4 -75.5 MCS 5 -72 MCS 6 -70 MCS 7 -68.5 dBm Measured at RF pin assuming 50Ω differential; RF performance guaranteed for temperature range -30 to 85ºC. 1dB derating in performance at -40ºC. Transmitter Performance Radio Performance under Typical Conditions: VBAT=3.3V; VDDIO=3.3V; Temp.: 25°C @ RF pins Table 6-2. Transmitter Performance Parameter Description Frequency 16 1. Typical (1) 2,412 Output power Note: Minimum 802.11b / 11Mbps 17 802.11g / 54Mbps 15@EVM -28dB 802.11n / 65Mbps 13@EVM -30dB Maximum Unit 2,484 MHz Measured at 802.11 spec compliant EVM / Spectral Mask; Measured at RF pin assuming 50Ω differential RF performance guaranteed for temperature range -30 to 85ºC. 1dB derating in performance at -40ºC. ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 1 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 6 dBm 7 Recommended Reflow Profile ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 17 1 7 8 Reference Design The ATSAMW25-MR210PA reference design schematic is shown in Figure 8-1. Figure 8-1. 18 ATSAMW25-MR210PA Reference Schematic ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 1 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 8 9 Bill of Materials (BOM) Item Qty. Reference Value Description Manufacturer 1 1 A1 Antenna Antenna, printed circuit, inverted F 2 1 C1 0.01µF CAP,CER,0.01µF,10%,XSR,0201,10V,-55-125ºC 3 13 C2,C4,C5,C6,C8,C9,C11,C 0.1µF 12,C13,C14,C19,C20,C25 4 3 C3,C10,C18 5 1 C7 6 2 7 8 Part Number Footprint Non component PCB F Murata GRM033R61A103KA01D CS0201 CAP,CER,0.1µF,10%,XSR,0201,6.3V,-55-125ºC Murata GRM033R60J104KE19D CS0201 2.2µF CAP,CER,2.2µF,10%,XSR,0402,6.3V,-55-85ºC TDK C1005XSR0J225K CS0402 1.0µF CAP,CER,1.0µF,10%,XSR,0402,6.3V,-55-85ºC GRM155R60J10SKE19D GRM155R60J10SKE19D CS0402 C15,C16 5.6pF CAP,CER,5.6pF,0.5pF,NPO,0201,25V,-55-125ºC Murata GRM0335C2A5R6DA01D CS0201 2 C17,C32 1.0pF CAP,CER,1.0pF,0.1pF,NPO,0201,25V,-55-125ºC Murata GRM0335C1E1R0BA01J RS0201 1 C21 DNI CAP,CER,1.0pF,0.1pF,NPO,0201,25V,-55-125ºC Murata GRM0335C1E1R0BA01J RS0201 9 1 C22 DNI CAP,CER,0.5pF,0.1pF,NPO,0201,25V,-55-125ºC Murata 500RGRM0335C1ER50BA0 RS0201 10 2 C23,C24 6.8pF CAP,CER,6.8pF,0.5pF,NPO,0201,25V,-55-125ºC TDK C0603C0G1E6R8D030BA RS0201 11 1 C33 0.7pF CAP,CER,0.7pF,0.05pF,NPO,0201,25V,-55-125ºC TDK C0603C0G1E0R7W030BF RS0201 Murata 500RGRM0335C1ER50BA0 RS0201 1D0750R5AV4T CAP,CER,0.5pF,0.1pF,NPO,0201,25V,-55-125ºC 12 2 C34,C35 DNI 13 1 C102 1.0µF Panasonic ECJ-0EB0J105M CS0402 Murata BLM03AG121SN1 FB50201 CAP,CER,1.0µF,20%,XSR,0402,6.3V 14 4 FB1,FB2,FB3,FB4 BLM03AG121SN FERRITE,120Ω@100MHz,200mA,0201,-55-125ºC 1 15 1 L1 1µH Power inductor,1µH,20%,940mA, 0.125Ω,0603,shielded,-40-85ºC Murata LQM18PN1R0MFRL LS0603 16 1 L5 15nH Inductor,multilayer,15nH,5%, 350mA,Q=8@100MHz,0402 Murata LQG15HS15NJ02D LS0402 17 2 L8,L9 3.3nH Inductor,3.3nH,0.2nH,Q=13@500MHz, SRF=8.1GHz,0201,-55-125ºC Taiyo Yuden HKQ0603S3N3C-T LS0201 18 51 P1,P2,P3,P4,P5,P6,P7,P8, P9,P10,P11,P12,P13,P14, P15,P16,P17,P18,P19,P20, P21,P22,P23,P24,P25,P26, P27,P28,P29,P30,P31,P32, PAD 0.7X1.2 P33,P34,P35,P36,P37,P38, P39,P40,P41,P42,P43,P44, P45,P46,P47,P48,P49,P50, P51 LGA module pad, 0.7mm x 1.2mm Non component PAD 0.7x1.2mm 19 1 R1 2.0nH Inductor,2.0nH,0.2nH,Q=13@500MHz, SRF=8.1GHz,0201,-55-125ºC Taiyo Yuden HKQ0603S2N0C-T RS0201 20 1 R2 0.5pF CAP,CER,0.5pF,0.1pF,NPO,0201,25V,-55-125ºC Murata 500RGRM0335C1ER50BA0 RS0201 21 1 R3 DNI CAP,CER,0.5pF,0.1pF,NPO,0201,25V,-55-125ºC Murata 500RGRM0335C1ER50BA0 RS0201 Murata LQP03TN1N2B02D RS0201 22 1 R4 1.2nH Inductor,1.2nH,0.1nH,Q=14@500MHz, SRF=6GHz,0201,-55-125ºC 23 3 R5,R6,R7 1MΩ Resistor, thick film,1MΩ,5%,0201 Vishay CRCW0201-105J RS0201 24 9 R8,R11,R12,R13,R14,R15, 0 R16,R17,R18 Resistor, thick film,0Ω,0201 Panasonic ERJ-1GN0R00C RS0201 25 2 R9,R10 DNI Resistor, thick film,0Ω,0201 Panasonic ERJ-1GN0R00C RS0201 26 2 R19,R20 4.7KΩ Resistor, thick film,4.7kΩ,5%,0201 Vishay CRCW0201-472J RS0201 27 1 SH1 SHIELD Shield 28 1 TP1 DNI Test point, surface mount,0.030”sq. 29 1 U1 ATWINC1500 IC, Wi-Fi, 40QFN 30 1 U2 ATECC108A SHIELD_164 Non component TP_SMD25SQ Atmel ATWINC1500 40QFN IC, memory, CryptoAuthentication,8UDFN Atmel ATECC108A-MAHDA BUDFN Vishay SI1855DDL SC70-6 48QFN 31 1 U3 SI1865DDL IC, load switch, 1.8V-12V in, RDSon=0.3Ω@2.5V,SC70-6 32 1 U4 SAMD21G18AMU MCU Atmel SAMD21G18A-MU 33 1 Y1 26MHz XTAL,26MHz,CL=7.36pF,10ppm, -30-85ºC,ESR=50,3.2x2.5mm NDK NX3225SA-26.000000MHZUM_ABM8 G3 ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 19 1 9 10 Application Schematics Figure 10-1. Connections for the SAMW25 The basic power supply connections for the SAMW25 module are shown in Figure 10-1. The test points shown (TP1 – TP6) should be added in case Atmel is required to debug the design. The Wi-Fi chip can use its own internal oscillator for a Real Time Clock (RTC) or it can use an external 32.768KHz clock provided on the RTC pin. Using an external clock derived from a crystal oscillator can be used as a more accurate sleep timer for the Wi-Fi chip than its own internal oscillator. This in turn can reduce sleep current. If power consumption during sleep is a priority then a 32.768KHz crystal can be added to the SAMD21 module as shown in the reference design. The design shown above displays a connection from pin 15 (PA22) to pin 5 (GPIO_1). GPIO_1 is the input pin for the Wi-Fi’s Real Time Clock. PA22 can be configured to output a 32.768KHz RTC clock – derived from the 32.768KHz crystal - to be used as the source for the Wi-Fi’s RTC. If cost is a priority versus power consumption, then the 32.768KHz crystal can be left off of the design and the PA22 – GPIO_1 connection can be deleted. 20 ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 2 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 0 11 Design Guidelines It is critical to follow the recommendations listed below to achieve the best RF performance: When the module is placed on the motherboard, a provision for the antenna must be made. There should be nothing under the portion of the module which contains the antenna. This means the antenna should not be placed directly on top of the motherboard PCB. This can be accomplished by, for example, placing the module at the edge of the board such that the module edge with the antenna extends beyond the main board edge by 6.5mm. Alternatively, a cutout in the motherboard can be provided under the antenna. The cutout should be at least 22mm x 6.5mm. Ground vias spaced 2.5mm apart should be placed all around the perimeter of the cutout. No large components should be placed near the antenna. Keep away from antenna, as far as possible, large metal objects to avoid electromagnetic field blocking Do not enclose the antenna within a metal shield Keep any components which may radiate noise or signals within the 2.4 – 2.5GHz frequency band far away from the antenna or better yet, shield those components. Any noise radiated from the main board in this frequency band will degrade the sensitivity of the module. The main board should have a solid ground plane. Each ground pin of the module (including each of the center ground pads) should have a via placed either in the pad or right next to the pad going down to the ground plane. Place a 10µF decoupling capacitor from VBAT to ground right next to pin 7. Place another 10µF capacitor from VCC to ground right next to pin 21. Contact Atmel for assistance if any other placement is required ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 21 2 1 12 Reference Documentation and Support 12.1 Reference Documents Atmel offers a set of collateral documentation to ease integration and device ramp. The following list of documents available on Atmel web or integrated into development tools. Table 12-1. Reference Documents Title Content Datasheet This document Design Files User Guide, Schematic, PCB layout, Gerber, BOM, and System notes on: RF/Radio Full Test Report, radiation pattern, design guidelines, temperature performance, ESD. Package How to use package: Out of the Box starting guide, HW limitations and notes, SW Quick start guidelines. Platform Getting started Guide Best practices and recommendations to design a board with the product, including: Antenna Design for Wi-Fi (layout recommendations, types of antennas, impedance matching, using a power amplifier etc.), SPI/UART protocol between Wi-Fi SoC and the Host MCU. HW Design Guide Integration guide with clear description of: High level Arch, overview on how to write a networking application, list all API, parameters and structures. Features of the device, SPI/handshake protocol between device and host MCU, with flow/sequence/state diagram, timing. SW Design Guide Explain in details the flow chart and how to use each API to implement all generic use cases (e.g. start AP, start STA, provisioning, UDP, TCP, http, TLS, p2p, errors management, connection/transfer recovery mechanism/state diagram) - usage and sample application note. For a complete listing of development-support tools and documentation, visit http://www.atmel.com/ or contact the nearest Atmel field representative. 12.2 Related Documents [1] ATSAMD21 Datasheet: Web page: http://www.atmel.com/products/microcontrollers/arm/sam-d.aspx?tab=documents. Document: Atmel SAM D21 Datasheet (.pdf file). Then select the required device (ATSAMD21E18A) and get the latest datasheet (.pdf file). [2] ATWINC1500 Datasheet. [3] ATSAM W25 Network Controller Programming Guide. [4] ATSAM W25 Starter Kit User Guide. 22 ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] 2 Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 2 13 Revision History Doc Rev. Date 42395A 03/2015 Comments Initial document release. ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi Module [PRELIMINARY DATASHEET] Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 23 2 3 Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 │ www.atmel.com © 2015 Atmel Corporation. / Rev.: Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation in U.S. and other countries. ARM®, ARM Connected® logo, and others are the registered trademarks or trademarks of ARM Ltd. Other terms and product names may be trademarks of others. DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppe l or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LI MITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accurac y or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are no t intended, authorized, or warranted for use as components in applications intended to support or sustain life. SAFETY-CRITICAL, MILITARY, AND AUTOMOTIVE APPLICATIONS DISCLAIMER: Atmel products are not designed for and will not be used in connection with any applications where the failure of such products would reasonably be expected to result in significant personal injury or death (“Safety-Critical Applications”) without an Atmel officer's specific written consent. Safety-Critical Applications include, without limitation, life support devices and systems, equipment or systems for the operation o f nuclear facilities and weapons systems. Atmel products are not designed nor intended for use in military or aerospace applications or environments specifically desi gnated by Atmel as military-grade. Atmel products are not ATSAMW25-MR210PA IEEE 802.11 b/g/n SmartConnect Wi-Fi unless Module [PRELIMINARY DATASHEET designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive-grade. Atmel-42395A-SmartConnect-ATSAMW25-MR210PA_Datasheet_032015 24 2 4 ]