Features • Low Voltage and Standard Voltage Operation • • • • • • • • • • • – 2.7 (VCC = 2.7V to 5.5V) – 1.8 (VCC = 1.8V to 5.5V) Internally Organized 128 x 8 Two-wire Serial Interface Bidirectional Data Transfer Protocol 400 kHz (1.8V) and 1 MHz (2.5V, 2.7V, 5V) Compatibility 4-Byte Page Write Mode Self-Timed Write Cycle (5 ms max) High Reliability – Endurance: 1 Million Write Cycles – Data Retention: 100 Years Automotive Grade, Extended Temperature and Lead-Free/Halogen-Free Devices Available 8-lead PDIP, 8-lead JEDEC SOIC, 5-lead SOT23 and 8-lead TSSOP Packages Die Sales: Wafer Form, Waffle Pack, and Bumped Wafers Access to One Additional Page Upon Request Two-wire Serial EEPROM 1K (128 x 8) AT24C11 Description Note: The AT24C11 provides 1024 bits of serial electrically erasable and programmable read only memory (EEPROM) organized as 128 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. The AT24C11 is available in space saving 8-lead PDIP, 8-lead JEDEC SOIC, 5-lead SOT23 and 8-lead TSSOP packages and is accessed via a two-wire serial interface. In addition, the entire family is available in 2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions. Not recommended for new design; please refer to AT24C01B datasheet. 8-lead TSSOP Table 0-1. Pin Configuration Pin Name Function NC No Connect SDA Serial Data SCL Serial Clock Input TEST Test Input (GND or VCC) NC NC NC GND 8-lead PDIP 1 2 3 4 8 7 6 5 8 7 6 5 VCC TEST SCL SDA 8-lead SOIC NC NC NC GND NC NC NC GND 1 2 3 4 1 2 3 4 VCC TEST SCL SDA 8 7 6 5 5-lead SOT23 VCC TEST SCL SDA SCL GND SDA 1 2 3 5 VCC 4 TEST Rev. 3409G–SEEPR–8/07 Absolute Maximum Ratings* Operating Temperature..................................–55°C to +125°C *NOTICE: Storage Temperature .....................................–65°C to +150°C Voltage on Any Pin with Respect to Ground .................................... –1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V DC Output Current........................................................ 5.0 mA Block Diagram VCC GND WP START STOP LOGIC SCL SDA SERIAL CONTROL LOGIC LOAD DEVICE ADDRESS COMPARATOR A2 A1 A0 R/W EN H.V. PUMP/TIMING COMP LOAD DATA RECOVERY INC DATA WORD ADDR/COUNTER Y DEC X DEC Figure 0-1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. EEPROM SERIAL MUX DOUT/ACK LOGIC DIN DOUT 1. Pin Description SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open collector devices. 2 AT24C11 3409G–SEEPR–8/07 AT24C11 2. Memory Organization AT24C11, 1K SERIAL EEPROM: Internally organized with 32 pages of 4 bytes each. The 1K requires a 7-bit data word address for random word addressing. Access to one additional page (33rd page) available upon request. Table 2-1. Pin Capacitance Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V. Symbol Test Condition Max Units Condition CI/O Input/Output Capacitance (SDA) 8 pF VI/O = 0V CIN Input Capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V Table 2-2. DC Characteristics Applicable over recommended operating range from: TAI = –40°C to +85°C, VCC = +1.8V to +5.5V, VCC = +2.7V to +5.5V (unless otherwise noted) Symbol Parameter VCC1 Supply Voltage VCC2 Max Units 1.8 5.5 V Supply Voltage 2.5 5.5 V VCC3 Supply Voltage 2.7 5.5 V VCC4 Supply Voltage 4.5 5.5 V ICC Supply Current VCC = 5.0V READ at 100 kHz 0.4 1.0 mA ICC Supply Current VCC = 5.0V WRITE at 100 kHz 2.0 3.0 mA ISB1 Standby Current VCC = 1.8V VIN = VCC or VSS 0.6 3.0 µA ISB2 Standby Current VCC = 2.5V VIN = VCC or VSS 1.4 4.0 µA ISB3 Standby Current VCC = 2.7V VIN = VCC or VSS 1.6 4.0 µA ISB4 Standby Current VCC = 5.0V VIN = VCC or VSS 8.0 18.0 µA ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 µA ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 µA VIL Test Condition Min Typ (1) –0.6 VCC × 0.3 V (1) VCC × 0.7 VCC + 0.5 V Input Low Level VIH Input High Level VOL2 Output Low Level VCC = 3.0V IOL = 2.1 mA 0.4 V Output Low Level VCC = 1.8V IOL = 0.15 mA 0.2 V VOL1 Note: 1. VIL min and VIH max are reference only and are not tested. 3 3409G–SEEPR–8/07 Table 2-3. AC Characteristics Applicable over recommended operating range from TAI = –40°C to +85°C, VCC = +1.8V to +5.5V, VCC = +2.7V to +5.5V, CL = 1 TTL Gate and 100 pF (unless otherwise noted) 1.8V Min 2.7V, 2.5V, 5.0V Symbol Parameter Max Min fSCL Clock Frequency, SCL tLOW Clock Pulse Width Low 1.2 0.4 µs tHIGH Clock Pulse Width High 0.6 0.4 µs tAA Clock Low to Data Out Valid 0.1 tBUF Time the bus must be free before a new transmission can start(1) 1.2 0.5 µs tHD.STA Start Hold Time 0.6 0.25 µs tSU.STA Start Set-up Time 0.6 0.6 µs tHD.DAT Data In Hold Time 0 0 µs tSU.DAT Data In Set-up Time 100 100 ns 400 (1) 0.9 0.05 Max Units 1000 kHz 0.55 µs tR Inputs Rise Time 0.3 0.3 µs tF Inputs Fall Time(1) 300 100 ns tSU.STO Stop Set-up Time 0.6 0.25 µs tDH Data Out Hold Time 50 50 ns tWR Write Cycle Time Endurance(1) 5.0V, 25°C, Page Mode Note: 4 5 1M 5 1M ms Write Cycles 1. This parameter is characterized and is not 100% tested. AT24C11 3409G–SEEPR–8/07 AT24C11 3. Device Operation CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (see Figure 3-3 on page 7). Data changes during SCL high periods will indicate a start or stop condition as defined below. START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (see Figure 3-4 on page 7). STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition which terminates all communications. After a read sequence, the stop command will place the EEPROM in a standby power mode (see Figure 3-4 on page 7). ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. Any device on the system bus receiving data (when communicating with the EEPROM) must pull the SDA bus low to acknowledge that it has successfully received each word. This must happen during the ninth clock cycle after each word received and after all other system devices have freed the SDA bus. The EEPROM will likewise acknowledge by pulling SDA low after receiving each address or data word (see Figure 3-5 on page 7). STANDBY MODE: The AT24C11 features a low power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the completion of any internal operations. MEMORY RESET: After an interruption in protocol, power loss or system reset, any 2-wire part can be reset by following these steps: (a) clock up to 9 cycles, (b) look for SDA high in each cycle while SCL is high and then (c) create a start condition as SDA is high. 5 3409G–SEEPR–8/07 Figure 3-1. Bus Timing SCL: Serial Clock, SDA: Serial Data I/O tHIGH tF tR tLOW SCL tSU.STA tLOW tHD.STA tHD.DAT tSU.DAT tSU.STO SDA IN tAA tDH tBUF SDA OUT Figure 3-2. Write Cycle Timing SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th BIT ACK WORDn (1) twr STOP CONDITION Note: 6 START CONDITION 1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. AT24C11 3409G–SEEPR–8/07 AT24C11 Figure 3-3. Data Validity SDA SCL DATA STABLE DATA STABLE DATA CHANGE Figure 3-4. Start and Stop Definition SDA SCL START Figure 3-5. STOP Output Acknowledge 1 SCL 8 9 DATA IN DATA OUT START ACKNOWLEDGE 7 3409G–SEEPR–8/07 4. Write Operations BYTE WRITE: Following a start condition, a write operation requires a 7-bit data word address and a low write bit. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally-timed write cycle to the nonvolatile memory. All inputs are disabled during this write cycle, tWR, and the EEPROM will not respond until the write is complete (see Figure 5-1 on page 9). PAGE WRITE: The AT24C11 is capable of a 4-byte page write. A page write is initiated the same as a byte write but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to three more data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see Figure 5-2 on page 9). The data word address lower 2 bits are internally incremented following the receipt of each data word. The higher five data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than four data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. Access to 1 additional page is available upon request. ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. 5. Read Operations Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are two read operations: byte read and sequential read. BYTE READ: A byte read is initiated with a start condition followed by a 7-bit data word address and a high read bit. The AT24C11 will respond with an acknowledge and then serially output 8 data bits. The microcontroller does not respond with a zero but does generate a following stop condition (see Figure 5-3 on page 9). SEQUENTIAL READ: Sequential reads are initiated the same as a byte read. After the microcontroller receives an 8-bit data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond with an input zero but does generate a following stop condition (see Figure 5-4 on page 9). 8 AT24C11 3409G–SEEPR–8/07 AT24C11 Figure 5-1. Byte Write Figure 5-2. Page Write Figure 5-3. Byte Read Figure 5-4. Sequential Read 9 3409G–SEEPR–8/07 AT24C11 Ordering Information(1) Ordering Code Package AT24C11-10PI-2.7 AT24C11N-10SI-2.7 AT24C11-10TI-2.7 8P3 8S1 8A2 Industrial Temperature (–40°C to 85°C) AT24C11-10PI-1.8 AT24C11N-10SI-1.8 AT24C11-10TI-1.8 8P3 8S1 8A2 Industrial Temperature (–40°C to 85°C) AT24C11-10PU-2.7(2) AT24C11-10PU-1.8(2) AT24C11N-10SU-2.7(2) AT24C11N-10SU-1.8(2) AT24C11-10TU-2.7(2) AT24C11-10TU-1.8(2) AT24C11-10TSU-1.8(2) 8P3 8P3 8S1 8S1 8A2 8A2 5TS1 AT24C11-W2.7-11(3) AT24C11-W1.8-11(3) Die Sale Die Sale Notes: Operation Range Lead-free/Halogen-free/ Industrial Temperature (–40°C to 85°C) Industrial Temperature (–40°C to 85°C) 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics tables. 2. “U” designates Green package + RoHS compliant. 3. Die sales available in waffle pack and wafer form, order as SL719 for wafer form. Bumped die sales available upon request. Please contact Serial EEPROM Marketing. Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8A2 8-lead, 4.4 mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP) 5TS1 5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23) Options –2.7 Low-Voltage (2.7V to 5.5V) –1.8 Low-Voltage (1.8V to 5.5V) 10 AT24C11 3409G–SEEPR–8/07 AT24C11 6. Packaging Information 8P3 – PDIP E 1 E1 N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = inches) D e D1 A2 A SYMBOL MIN NOM A b2 b3 b 4 PLCS Side View Notes: L MAX 0.210 NOTE 2 A2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 D 0.355 0.365 0.400 D1 0.005 E 0.300 0.310 0.325 4 E1 0.240 0.250 0.280 3 3 3 e 0.100 BSC eA 0.300 BSC L 0.115 4 0.130 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 01/09/02 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) DRAWING NO. REV. 8P3 B 11 3409G–SEEPR–8/07 8S1 – JEDEC SOIC C 1 E E1 L N ∅ Top View End View e B COMMON DIMENSIONS (Unit of Measure = mm) A A1 D Side View SYMBOL MIN NOM MAX A 1.35 – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.00 E1 3.81 – 3.99 E 5.79 – 6.20 e NOTE 1.27 BSC L 0.40 – 1.27 ∅ 0˚ – 8˚ Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 10/7/03 R 12 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING NO. 8S1 REV. B AT24C11 3409G–SEEPR–8/07 AT24C11 8A2 – TSSOP 3 2 1 Pin 1 indicator this corner E1 E L1 N L Top View End View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A b D MIN 2.90 E e D A2 MAX NOTE 3.00 3.10 2, 5 3, 5 6.40 BSC E1 4.30 4.40 4.50 A – – 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 e Side View NOM L 4 0.65 BSC 0.45 L1 0.60 0.75 1.00 REF Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E1 to be determined at Datum Plane H. 5/30/02 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8A2, 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) DRAWING NO. 8A2 REV. B 13 3409G–SEEPR–8/07 5TS1 – SOT23 e1 C 4 5 E1 C L E L1 1 3 2 END VIEW TOP VIEW b A2 SEATING PLANE e A A1 D COMMON DIMENSIONS (Unit of Measure = mm) SIDE VIEW 1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side. 2. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB for additional information. SYMBOL A A1 A2 c D E E1 L1 e e1 b MIN R 14 MAX 0.00 0.70 0.08 1.10 0.10 0.90 1.00 0.20 2.90 BSC 2.80 BSC 1.60 BSC 0.60 REF 0.95 BSC 1.90 BSC 0.30 0.50 TITLE 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 NOM 5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SHRINK SOT) NOTE 3 1,2 1,2 1,2 3,4 6/20/03 DRAWING NO. PO5TS1 REV. A AT24C11 3409G–SEEPR–8/07 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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