ATMEL AT24C11N-10SU-2.7

Features
• Low Voltage and Standard Voltage Operation
•
•
•
•
•
•
•
•
•
– 2.7 (VCC = 2.7V to 5.5V)
– 1.8 (VCC = 1.8V to 5.5V)
Internally Organized 128 x 8
2-Wire Serial Interface
Bidirectional Data Transfer Protocol
100 kHz (1.8V) and 400 kHz (2.5V, 2.7V, 5V) Compatibility
4-Byte Page Write Mode
Self-Timed Write Cycle (5 ms max)
High Reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
Automotive Grade, Extended Temperature and Lead-Free/Halogen-Free
Devices Available
8-lead PDIP, 8-lead JEDEC SOIC, 5-lead SOT23 and 8-lead TSSOP Packages
Description
The AT24C11 provides 1024 bits of serial electrically erasable and programmable
read only memory (EEPROM) organized as 128 words of 8 bits each. The device is
optimized for use in many industrial and commercial applications where low power
and low voltage operation are essential. The AT24C11 is available in space saving
8-lead PDIP, 8-lead JEDEC SOIC, 5-lead SOT23 and 8-lead TSSOP packages and is
accessed via a 2-wire serial interface. In addition, the entire family is available in 2.7V
(2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions.
NC
NC
NC
GND
Pin Name
Function
NC
No Connect
SDA
Serial Data
SCL
Serial Clock Input
TEST
Test Input (GND or VCC)
8
7
6
5
AT24C11
Preliminary
1
2
3
4
8
7
6
5
VCC
TEST
SCL
SDA
8-lead SOIC
8-lead PDIP
1
2
3
4
1K (128 x 8)
8-lead TSSOP
Pin Configurations
NC
NC
NC
GND
2-Wire Serial
EEPROM
NC
NC
NC
GND
VCC
TEST
SCL
SDA
1
2
3
4
8
7
6
5
VCC
TEST
SCL
SDA
5-lead SOT23
SCL
GND
SDA
1
2
3
5
TEST
4
VCC
Rev. 3409B–SEEPR–12/03
1
Absolute Maximum Ratings*
Operating Temperature.................................. -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
Voltage on Any Pin
with Respect to Ground .....................................-1.0V to +7.0V
Maximum Operating Voltage .......................................... 6.25V
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
DC Output Current........................................................ 5.0 mA
Block Diagram
2
AT24C11 [Preliminary]
3409B–SEEPR–12/03
AT24C11 [Preliminary]
Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each
EEPROM device and negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is
open-drain driven and may be wire-ORed with any number of other open-drain or open
collector devices.
Memory Organization
AT24C11, 1K SERIAL EEPROM: Internally organized with 128 pages of 1 byte each.
The 1K requires a 7-bit data word address for random word addressing.
Pin Capacitance
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V.
Symbol
Test Condition
Max
Units
Condition
CI/O
Input/Output Capacitance (SDA)
8
pF
VI/O = 0V
CIN
Input Capacitance (A0, A1, A2, SCL)
6
pF
VIN = 0V
DC Characteristics
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = +1.8V to +5.5V, TAE = -40°C to +125°C,
VCC = +1.8V to +5.5V (unless otherwise noted).
Symbol
Parameter
VCC1
Supply Voltage
VCC2
Max
Units
1.8
5.5
V
Supply Voltage
2.5
5.5
V
VCC3
Supply Voltage
2.7
5.5
V
VCC4
Supply Voltage
4.5
5.5
V
ICC
Supply Current VCC = 5.0V
READ at 100 kHz
0.4
1.0
mA
ICC
Supply Current VCC = 5.0V
WRITE at 100 kHz
2.0
3.0
mA
ISB1
Standby Current VCC = 1.8V
VIN = VCC or VSS
0.6
3.0
µA
ISB2
Standby Current VCC = 2.5V
VIN = VCC or VSS
1.4
4.0
µA
ISB3
Standby Current VCC = 2.7V
VIN = VCC or VSS
1.6
4.0
µA
ISB4
Standby Current VCC = 5.0V
VIN = VCC or VSS
8.0
18.0
µA
ILI
Input Leakage Current
VIN = VCC or VSS
0.10
3.0
µA
ILO
Output Leakage Current
VOUT = VCC or V SS
0.05
3.0
µA
-0.6
VCC × 0.3
V
VCC × 0.7
VCC + 0.5
V
VIL
Input Low Level
Test Condition
(1)
(1)
Min
Typ
VIH
Input High Level
VOL2
Output Low Level VCC = 3.0V
IOL = 2.1 mA
0.4
V
VOL1
Output Low Level VCC = 1.8V
IOL = 0.15 mA
0.2
V
Note:
1. VIL min and VIH max are reference only and are not tested.
3
3409B–SEEPR–12/03
AC Characteristics
Applicable over recommended operating range from TAI = -40°C to +85°C, TAE = -40°C to +125°C, VCC = +1.8V to +5.5V,
CL = 1 TTL Gate and 100 pF (unless otherwise noted).
1.8V
Symbol
Parameter
Min
fSCL
Clock Frequency, SCL
tLOW
Clock Pulse Width Low
tHIGH
Clock Pulse Width High
2.7V, 2.5V, 5.0V
Max
Min
100
Max
Units
400
kHz
4.7
1.2
µs
4.0
0.6
µs
(1)
tI
Noise Suppression Time
tAA
Clock Low to Data Out Valid
0.1
tBUF
Time the bus must be free before a new
transmission can start(1)
4.7
1.2
µs
tHD.STA
Start Hold Time
4.0
0.6
µs
tSU.STA
Start Set-up Time
4.7
0.6
µs
tHD.DAT
Data In Hold Time
0
0
µs
tSU.DAT
Data In Set-up Time
200
100
ns
tR
Inputs Rise Time(1)
100
(1)
4.5
0.1
50
ns
0.9
µs
1.0
0.3
µs
300
300
ns
tF
Inputs Fall Time
tSU.STO
Stop Set-up Time
4.7
0.6
µs
tDH
Data Out Hold Time
100
50
ns
tWR
Write Cycle Time
Endurance(1)
5.0V, 25°C, Page Mode
Note:
4
5
1M
5
1M
ms
Write
Cycles
1. This parameter is characterized and is not 100% tested.
AT24C11 [Preliminary]
3409B–SEEPR–12/03
AT24C11 [Preliminary]
Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (refer to
Data Validity timing diagram). Data changes during SCL high periods will indicate a start
or stop condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition
which must precede any other command (refer to Start and Stop Definition timing
diagram).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition
which terminates all communications. After a read sequence, the stop command will
place the EEPROM in a standby power mode (refer to Start and Stop Definition timing
diagram).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from
the EEPROM in 8-bit words. Any device on the system bus receiving data (when communicating with the EEPROM) must pull the SDA bus low to acknowledge that it has
successfully received each word. This must happen during the ninth clock cycle after
each word received and after all other system devices have freed the SDA bus. The
EEPROM will likewise acknowledge by pulling SDA low after receiving each address or
data word (refer to Acknowledge Response from Receiver timing diagram).
STANDBY MODE: The AT24C11 features a low power standby mode which is enabled:
(a) upon power-up and (b) after the receipt of the STOP bit and the completion of any
internal operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any 2wire part can be reset by following these steps:
(a) Clock up to 9 cycles, (b) look for SDA high in each cycle while SCL is high and then
(c) create a start condition as SDA is high.
5
3409B–SEEPR–12/03
Bus Timing
SCL: Serial Clock, SDA: Serial Data I/O
Write Cycle Timing
SCL: Serial Clock, SDA: Serial Data I/O
SCL
SDA
8th BIT
ACK
WORDn
twr
STOP
CONDITION
Note:
6
(1)
START
CONDITION
1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.
AT24C11 [Preliminary]
3409B–SEEPR–12/03
AT24C11 [Preliminary]
Data Validity
Start and Stop Definition
Output Acknowledge
7
3409B–SEEPR–12/03
Write Operations
BYTE WRITE: Following a start condition, a write operation requires a 7-bit data word
address and a low write bit. Upon receipt of this address, the EEPROM will again
respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8bit data word, the EEPROM will output a zero and the addressing device, such as a
microcontroller, must terminate the write sequence with a stop condition. At this time the
EEPROM enters an internally-timed write cycle to the nonvolatile memory. All inputs are
disabled during this write cycle , tWR, and the EEPROM will not respond until the write is
complete (refer to Figure 1).
PAGE WRITE: The AT24C11 is capable of a 4-byte page write.
A page write is initiated the same as a byte write but the microcontroller does not send a
stop condition after the first data word is clocked in. Instead, after the EEPROM
acknowledges receipt of the first data word, the microcontroller can transmit up to three
more data words. The EEPROM will respond with a zero after each data word received.
The microcontroller must terminate the page write sequence with a stop condition (refer
to Figure 2).
The data word address lower 2 bits are internally incremented following the receipt of
each data word. The higher five data word address bits are not incremented, retaining
the memory page row location. When the word address, internally generated, reaches
the page boundary, the following byte is placed at the beginning of the same page. If
more than four data words are transmitted to the EEPROM, the data word address will
“roll over” and previous data will be overwritten.
ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The read/write bit is
representative of the operation desired. Only if the internal write cycle has completed
will the EEPROM respond with a zero allowing the read or write sequence to continue.
Read Operations
Read operations are initiated the same way as write operations with the exception that
the read/write select bit in the device address word is set to one. There are two read
operations: byte read and sequential read.
BYTE READ: A byte read is initiated with a start condition followed by a 7-bit data word
address and a high read bit. The AT24C11 will respond with an acknowledge and then
serially output 8 data bits. The microcontroller does not respond with a zero but does
generate a following stop condition (refer to Figure 3).
SEQUENTIAL READ: Sequential reads are initiated the same as a byte read. After the
microcontroller receives an 8-bit data word, it responds with an acknowledge. As long as
the EEPROM receives an acknowledge, it will continue to increment the data word
address and serially clock out sequential data words. When the memory address limit is
reached, the data word address will “roll over” and the sequential read will continue. The
sequential read operation is terminated when the microcontroller does not respond with
an input zero but does generate a following stop condition (refer to Figure 4).
8
AT24C11 [Preliminary]
3409B–SEEPR–12/03
AT24C11 [Preliminary]
Figure 1. Byte Write
Figure 2. Page Write
Figure 3. Byte Read
Figure 4. Sequential Read
9
3409B–SEEPR–12/03
AT24C11 Ordering Information
Ordering Code
Package
AT24C11-10PI-2.7
AT24C11N-10SI-2.7
AT24C11-10TI-2.7
AT24C11-10TSI-2.7
8P3
8S1
8A2
5TS1
Industrial
(-40°C to 85°C)
AT24C11-10PI-1.8
AT24C11N-10SI-1.8
AT24C11-10TI-1.8
8P3
8S1
8A2
Industrial
(-40°C to 85°C)
AT24C11N-10SU-2.7
AT24C11N-10SU-1.8
AT24C11-10TU-2.7
AT24C11-10TU-1.8
8S1
8S1
8A2
8A2
Lead-Free/Halogen-Free/
Industrial Temperature
(-40°C to 85°C)
AT24C11N-10SE-2.7
8S1
High Grade/Extended Temperature
(-40°C to 125°C)
Note:
Operation Range
For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics tables.
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2
8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
5TS1
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
Options
-2.7
Low-Voltage (2.7V to 5.5V)
-1.8
Low-Voltage (1.8V to 5.5V)
10
AT24C11 [Preliminary]
3409B–SEEPR–12/03
AT24C11 [Preliminary]
Packaging Information
8P3 – PDIP
E
1
E1
N
Top View
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
D
e
D1
A2 A
MIN
NOM
A2
0.115
0.130
0.195
b
0.014
0.018
0.022
5
b2
0.045
0.060
0.070
6
b3
0.030
0.039
0.045
6
c
0.008
0.010
0.014
D
0.355
0.365
0.400
D1
0.005
E
0.300
0.310
0.325
4
E1
0.240
0.250
0.280
3
SYMBOL
A
b2
b3
b
4 PLCS
Side View
L
Notes:
0.210
0.100 BSC
eA
0.300 BSC
0.115
NOTE
2
3
3
e
L
MAX
0.130
4
0.150
2
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
DRAWING NO.
REV.
8P3
B
11
3409B–SEEPR–12/03
8S1 – JEDEC SOIC
C
1
E
E1
L
N
∅
Top View
End View
e
B
COMMON DIMENSIONS
(Unit of Measure = mm)
A
SYMBOL
A1
D
Side View
MIN
NOM
MAX
A
1.35
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.00
E1
3.81
–
3.99
E
5.79
–
6.20
e
NOTE
1.27 BSC
L
0.40
–
1.27
∅
0˚
–
8˚
Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
10/7/03
R
12
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
DRAWING NO.
8S1
REV.
B
AT24C11 [Preliminary]
3409B–SEEPR–12/03
AT24C11 [Preliminary]
8A2 – TSSOP
3
2 1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
b
D
MIN
NOM
MAX
NOTE
2.90
3.00
3.10
2, 5
3, 5
E
e
D
A2
6.40 BSC
E1
4.30
4.40
4.50
A
–
–
1.20
A2
0.80
1.00
1.05
b
0.19
–
0.30
e
Side View
L
0.65 BSC
0.45
L1
Notes:
4
0.60
0.75
1.00 REF
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO.
8A2
REV.
B
13
3409B–SEEPR–12/03
5TS1 – SOT23
e1
C
4
5
E1
C
L
E
L1
1
3
2
End View
Top View
b
A2
Seating
Plane
e
A
A1
D
COMMON DIMENSIONS
(Unit of Measure = mm)
Side View
NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing
MO-193, Variation AB, for additional information.
2. Dimension D does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end.
Dimension E1 does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.15 mm per side.
3. The package top may be smaller than the package bottom. Dimensions
D and E1 are determined at the outermost extremes of the plastic body
exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of the plastic body.
4. These dimensions apply to the flat section of the lead between 0.08 mm
and 0.15 mm from the lead tip.
5. Dimension "b" does not include Dambar protrusion. Allowable Dambar
protrusion shall be 0.08 mm total in excess of the "b" dimension at
maximum material condition. The Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and an adjacent lead
shall not be less than 0.07 mm.
SYMBOL
MIN
NOM
MAX
A
–
–
1.10
A1
0.00
–
0.10
A2
0.70
0.90
1.00
c
0.08
–
0.20
NOTE
4
D
2.90 BSC
2, 3
E
2.80 BSC
2, 3
E1
1.60 BSC
2, 3
L1
0.60 REF
e
0.95 BSC
e1
b
1.90 BSC
0.30
–
0.50
4, 5
6/25/03
R
14
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
Small Outline Package (SHRINK SOT)
DRAWING NO.
PO5TS1
REV.
A
AT24C11 [Preliminary]
3409B–SEEPR–12/03
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
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3409B–SEEPR–12/03
xM