Features • Low Voltage and Standard Voltage Operation • • • • • • • • • – 2.7 (VCC = 2.7V to 5.5V) – 1.8 (VCC = 1.8V to 5.5V) Internally Organized 128 x 8 2-Wire Serial Interface Bidirectional Data Transfer Protocol 100 kHz (1.8V) and 400 kHz (2.5V, 2.7V, 5V) Compatibility 4-Byte Page Write Mode Self-Timed Write Cycle (5 ms max) High Reliability – Endurance: 1 Million Write Cycles – Data Retention: 100 Years Automotive Grade, Extended Temperature and Lead-Free/Halogen-Free Devices Available 8-lead PDIP, 8-lead JEDEC SOIC, 5-lead SOT23 and 8-lead TSSOP Packages Description The AT24C11 provides 1024 bits of serial electrically erasable and programmable read only memory (EEPROM) organized as 128 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. The AT24C11 is available in space saving 8-lead PDIP, 8-lead JEDEC SOIC, 5-lead SOT23 and 8-lead TSSOP packages and is accessed via a 2-wire serial interface. In addition, the entire family is available in 2.7V (2.7V to 5.5V) and 1.8V (1.8V to 5.5V) versions. NC NC NC GND Pin Name Function NC No Connect SDA Serial Data SCL Serial Clock Input TEST Test Input (GND or VCC) 8 7 6 5 AT24C11 Preliminary 1 2 3 4 8 7 6 5 VCC TEST SCL SDA 8-lead SOIC 8-lead PDIP 1 2 3 4 1K (128 x 8) 8-lead TSSOP Pin Configurations NC NC NC GND 2-Wire Serial EEPROM NC NC NC GND VCC TEST SCL SDA 1 2 3 4 8 7 6 5 VCC TEST SCL SDA 5-lead SOT23 SCL GND SDA 1 2 3 5 TEST 4 VCC Rev. 3409B–SEEPR–12/03 1 Absolute Maximum Ratings* Operating Temperature.................................. -55°C to +125°C Storage Temperature ..................................... -65°C to +150°C Voltage on Any Pin with Respect to Ground .....................................-1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Output Current........................................................ 5.0 mA Block Diagram 2 AT24C11 [Preliminary] 3409B–SEEPR–12/03 AT24C11 [Preliminary] Pin Description SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open collector devices. Memory Organization AT24C11, 1K SERIAL EEPROM: Internally organized with 128 pages of 1 byte each. The 1K requires a 7-bit data word address for random word addressing. Pin Capacitance Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V. Symbol Test Condition Max Units Condition CI/O Input/Output Capacitance (SDA) 8 pF VI/O = 0V CIN Input Capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V DC Characteristics Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = +1.8V to +5.5V, TAE = -40°C to +125°C, VCC = +1.8V to +5.5V (unless otherwise noted). Symbol Parameter VCC1 Supply Voltage VCC2 Max Units 1.8 5.5 V Supply Voltage 2.5 5.5 V VCC3 Supply Voltage 2.7 5.5 V VCC4 Supply Voltage 4.5 5.5 V ICC Supply Current VCC = 5.0V READ at 100 kHz 0.4 1.0 mA ICC Supply Current VCC = 5.0V WRITE at 100 kHz 2.0 3.0 mA ISB1 Standby Current VCC = 1.8V VIN = VCC or VSS 0.6 3.0 µA ISB2 Standby Current VCC = 2.5V VIN = VCC or VSS 1.4 4.0 µA ISB3 Standby Current VCC = 2.7V VIN = VCC or VSS 1.6 4.0 µA ISB4 Standby Current VCC = 5.0V VIN = VCC or VSS 8.0 18.0 µA ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 µA ILO Output Leakage Current VOUT = VCC or V SS 0.05 3.0 µA -0.6 VCC × 0.3 V VCC × 0.7 VCC + 0.5 V VIL Input Low Level Test Condition (1) (1) Min Typ VIH Input High Level VOL2 Output Low Level VCC = 3.0V IOL = 2.1 mA 0.4 V VOL1 Output Low Level VCC = 1.8V IOL = 0.15 mA 0.2 V Note: 1. VIL min and VIH max are reference only and are not tested. 3 3409B–SEEPR–12/03 AC Characteristics Applicable over recommended operating range from TAI = -40°C to +85°C, TAE = -40°C to +125°C, VCC = +1.8V to +5.5V, CL = 1 TTL Gate and 100 pF (unless otherwise noted). 1.8V Symbol Parameter Min fSCL Clock Frequency, SCL tLOW Clock Pulse Width Low tHIGH Clock Pulse Width High 2.7V, 2.5V, 5.0V Max Min 100 Max Units 400 kHz 4.7 1.2 µs 4.0 0.6 µs (1) tI Noise Suppression Time tAA Clock Low to Data Out Valid 0.1 tBUF Time the bus must be free before a new transmission can start(1) 4.7 1.2 µs tHD.STA Start Hold Time 4.0 0.6 µs tSU.STA Start Set-up Time 4.7 0.6 µs tHD.DAT Data In Hold Time 0 0 µs tSU.DAT Data In Set-up Time 200 100 ns tR Inputs Rise Time(1) 100 (1) 4.5 0.1 50 ns 0.9 µs 1.0 0.3 µs 300 300 ns tF Inputs Fall Time tSU.STO Stop Set-up Time 4.7 0.6 µs tDH Data Out Hold Time 100 50 ns tWR Write Cycle Time Endurance(1) 5.0V, 25°C, Page Mode Note: 4 5 1M 5 1M ms Write Cycles 1. This parameter is characterized and is not 100% tested. AT24C11 [Preliminary] 3409B–SEEPR–12/03 AT24C11 [Preliminary] Device Operation CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (refer to Data Validity timing diagram). Data changes during SCL high periods will indicate a start or stop condition as defined below. START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (refer to Start and Stop Definition timing diagram). STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition which terminates all communications. After a read sequence, the stop command will place the EEPROM in a standby power mode (refer to Start and Stop Definition timing diagram). ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. Any device on the system bus receiving data (when communicating with the EEPROM) must pull the SDA bus low to acknowledge that it has successfully received each word. This must happen during the ninth clock cycle after each word received and after all other system devices have freed the SDA bus. The EEPROM will likewise acknowledge by pulling SDA low after receiving each address or data word (refer to Acknowledge Response from Receiver timing diagram). STANDBY MODE: The AT24C11 features a low power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the completion of any internal operations. MEMORY RESET: After an interruption in protocol, power loss or system reset, any 2wire part can be reset by following these steps: (a) Clock up to 9 cycles, (b) look for SDA high in each cycle while SCL is high and then (c) create a start condition as SDA is high. 5 3409B–SEEPR–12/03 Bus Timing SCL: Serial Clock, SDA: Serial Data I/O Write Cycle Timing SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th BIT ACK WORDn twr STOP CONDITION Note: 6 (1) START CONDITION 1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. AT24C11 [Preliminary] 3409B–SEEPR–12/03 AT24C11 [Preliminary] Data Validity Start and Stop Definition Output Acknowledge 7 3409B–SEEPR–12/03 Write Operations BYTE WRITE: Following a start condition, a write operation requires a 7-bit data word address and a low write bit. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally-timed write cycle to the nonvolatile memory. All inputs are disabled during this write cycle , tWR, and the EEPROM will not respond until the write is complete (refer to Figure 1). PAGE WRITE: The AT24C11 is capable of a 4-byte page write. A page write is initiated the same as a byte write but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to three more data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (refer to Figure 2). The data word address lower 2 bits are internally incremented following the receipt of each data word. The higher five data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than four data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. ACKNOWLEDGE POLLING: Once the internally-timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. Read Operations Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are two read operations: byte read and sequential read. BYTE READ: A byte read is initiated with a start condition followed by a 7-bit data word address and a high read bit. The AT24C11 will respond with an acknowledge and then serially output 8 data bits. The microcontroller does not respond with a zero but does generate a following stop condition (refer to Figure 3). SEQUENTIAL READ: Sequential reads are initiated the same as a byte read. After the microcontroller receives an 8-bit data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond with an input zero but does generate a following stop condition (refer to Figure 4). 8 AT24C11 [Preliminary] 3409B–SEEPR–12/03 AT24C11 [Preliminary] Figure 1. Byte Write Figure 2. Page Write Figure 3. Byte Read Figure 4. Sequential Read 9 3409B–SEEPR–12/03 AT24C11 Ordering Information Ordering Code Package AT24C11-10PI-2.7 AT24C11N-10SI-2.7 AT24C11-10TI-2.7 AT24C11-10TSI-2.7 8P3 8S1 8A2 5TS1 Industrial (-40°C to 85°C) AT24C11-10PI-1.8 AT24C11N-10SI-1.8 AT24C11-10TI-1.8 8P3 8S1 8A2 Industrial (-40°C to 85°C) AT24C11N-10SU-2.7 AT24C11N-10SU-1.8 AT24C11-10TU-2.7 AT24C11-10TU-1.8 8S1 8S1 8A2 8A2 Lead-Free/Halogen-Free/ Industrial Temperature (-40°C to 85°C) AT24C11N-10SE-2.7 8S1 High Grade/Extended Temperature (-40°C to 125°C) Note: Operation Range For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics tables. Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP) 5TS1 5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23) Options -2.7 Low-Voltage (2.7V to 5.5V) -1.8 Low-Voltage (1.8V to 5.5V) 10 AT24C11 [Preliminary] 3409B–SEEPR–12/03 AT24C11 [Preliminary] Packaging Information 8P3 – PDIP E 1 E1 N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = inches) D e D1 A2 A MIN NOM A2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 D 0.355 0.365 0.400 D1 0.005 E 0.300 0.310 0.325 4 E1 0.240 0.250 0.280 3 SYMBOL A b2 b3 b 4 PLCS Side View L Notes: 0.210 0.100 BSC eA 0.300 BSC 0.115 NOTE 2 3 3 e L MAX 0.130 4 0.150 2 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 01/09/02 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) DRAWING NO. REV. 8P3 B 11 3409B–SEEPR–12/03 8S1 – JEDEC SOIC C 1 E E1 L N ∅ Top View End View e B COMMON DIMENSIONS (Unit of Measure = mm) A SYMBOL A1 D Side View MIN NOM MAX A 1.35 – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.00 E1 3.81 – 3.99 E 5.79 – 6.20 e NOTE 1.27 BSC L 0.40 – 1.27 ∅ 0˚ – 8˚ Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 10/7/03 R 12 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING NO. 8S1 REV. B AT24C11 [Preliminary] 3409B–SEEPR–12/03 AT24C11 [Preliminary] 8A2 – TSSOP 3 2 1 Pin 1 indicator this corner E1 E L1 N L Top View End View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A b D MIN NOM MAX NOTE 2.90 3.00 3.10 2, 5 3, 5 E e D A2 6.40 BSC E1 4.30 4.40 4.50 A – – 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 e Side View L 0.65 BSC 0.45 L1 Notes: 4 0.60 0.75 1.00 REF 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E1 to be determined at Datum Plane H. 5/30/02 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8A2, 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) DRAWING NO. 8A2 REV. B 13 3409B–SEEPR–12/03 5TS1 – SOT23 e1 C 4 5 E1 C L E L1 1 3 2 End View Top View b A2 Seating Plane e A A1 D COMMON DIMENSIONS (Unit of Measure = mm) Side View NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB, for additional information. 2. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side. 3. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. 4. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 5. Dimension "b" does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. The Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. SYMBOL MIN NOM MAX A – – 1.10 A1 0.00 – 0.10 A2 0.70 0.90 1.00 c 0.08 – 0.20 NOTE 4 D 2.90 BSC 2, 3 E 2.80 BSC 2, 3 E1 1.60 BSC 2, 3 L1 0.60 REF e 0.95 BSC e1 b 1.90 BSC 0.30 – 0.50 4, 5 6/25/03 R 14 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SHRINK SOT) DRAWING NO. PO5TS1 REV. A AT24C11 [Preliminary] 3409B–SEEPR–12/03 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Regional Headquarters Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France Tel: (33) 2-40-18-18-18 Fax: (33) 2-40-18-19-60 ASIC/ASSP/Smart Cards 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France Tel: (33) 4-76-58-30-00 Fax: (33) 4-76-58-34-80 Zone Industrielle 13106 Rousset Cedex, France Tel: (33) 4-42-53-60-00 Fax: (33) 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906, USA Tel: 1(719) 576-3300 Fax: 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland Tel: (44) 1355-803-000 Fax: (44) 1355-242-743 Literature Requests www.atmel.com/literature Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life support devices or systems. © Atmel Corporation 2003. All rights reserved. Atmel ® and combinations thereof, are the registered trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be the trademarks of others. Printed on recycled paper. 3409B–SEEPR–12/03 xM