ZigBit™ 700/800/900 MHz Wireless Modules .................................................................................................................... ATZB-900-B0 Datasheet 8227C–MCU Wireless–06/09 ZigBit™ 700/800/900 MHz Wireless Modules 1-2 8227C–MCU Wireless–06/09 Section 1 1.1 Summary............................................................................................................................ 1-1 1.2 Applications........................................................................................................................ 1-1 1.3 Key Features...................................................................................................................... 1-2 1.4 Benefits .............................................................................................................................. 1-2 1.5 Abbreviations and Acronyms ............................................................................................. 1-2 1.6 Related Documents............................................................................................................ 1-3 Section 2 2.1 Overview ............................................................................................................................ 2-1 Section 3 3.1 Electrical Characteristics.................................................................................................... 3-3 3.1.1 Absolute Maximum Ratings ................................................................................. 3-3 3.1.2 Test Conditions .................................................................................................... 3-3 3.1.3 RF Characteristics ............................................................................................... 3-4 3.1.4 ATmega1281V Microcontroller Characteristics ................................................... 3-4 3.1.5 Module Interfaces characteristics ........................................................................ 3-5 3.2 Physical/Environmental Characteristics and Outline.......................................................... 3-5 3.3 Pin Configuration................................................................................................................ 3-6 3.4 Mounting Information ......................................................................................................... 3-9 3.5 Soldering Profile............................................................................................................... 3-10 3.6 Antenna Reference Design .............................................................................................. 3-10 3.6.1 General recommendations ................................................................................ 3-11 Section 4 4.1 Ordering Information ........................................................................................................ 4-12 ZigBit™ 700/800/900 MHz Wireless Modules 1-i 8227C–MCU Wireless–06/09 Section 1 Introduction 1.1 Summary ZigBit ™ 900 is an ultra-compact, extended range, low-power, high-sensitivity 784/868/915 MHz IEEE 802.15.4/ZigBee® OEM module, based on the innovative Atmel’s mixed-signal hardware platform. It is designed for wireless sensing, control and data acquisition applications. ZigBit modules eliminate the need for costly and time-consuming RF development, and shortens time to market for a wide range of wireless applications. This module is the latest addition to the ZigBit family also represented by 2.4 GHz modules ATZB-24A2/B0 [1], and ATZB-A24-UFL/U0 [3]. 1.2 Applications ZigBit 900 module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing mesh network, while optimizing network traffic and minimizing power consumption. Atmel offers two stack configurations: BitCloud and SerialNet. BitCloud is a ZigBee PRO certified software development platform supporting reliable, scalable, and secure wireless applications running on Atmel’s ZigBit modules. SerialNet allows programming of the module via serial AT-command interface. The applications include, but are not limited to: • Building automation & monitoring • • • • • • • – Lighting controls – Wireless smoke and CO detectors – Structural integrity monitoring HVAC monitoring & control Inventory management Environmental monitoring Security Water metering Industrial monitoring – Machinery condition and performance monitoring – Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc. Automated meter reading (AMR) ZigBit™ 700/800/900 MHz Wireless Modules 1-1 8227C–MCU Wireless–06/09 Introduction 1.3 Key Features • • • • • • • • • • • • • 1.4 Ultra compact size (18.8 x 13.5 mm) High RX sensitivity (-110 dBm) Outperforming link budget (120 dB) Up to 11 dBm output power Very low power consumption (< 6 µA in Sleep mode) Ample memory resources (128K bytes of flash memory, 8K bytes RAM, 4K bytes EEPROM) Wide range of interfaces (both analog and digital): – 9 spare GPIO, 2 spare IRQ lines – 4 ADC lines + 1 line for supply voltage control (up to 9 lines with JTAG disabled) – UART with CTS/RTS control – USART – I2C – SPI – 1-Wire – Up to 30 lines configurable as GPIO Capability to write own MAC address into the EEPROM Optional antenna reference designs IEEE 802.15.4 compliant transceiver 868 / 915 MHz band 784 MHz Chinese band BitCloud embedded software, including serial bootloader and AT command set Benefits • • • • • • Over 6 km (4 miles) outdoor line-of-sight range Small physical footprint and low profile for optimum fit in even the smallest of devices(1) Extended battery life Mesh networking capability Easy-to-use low cost Evaluation Kit Single source of support for HW and SW Note: 1.5 1. The module is to be certified Abbreviations and Acronyms ADC Analog-to -Digital Converter API Application Programming Interface BPSK Binary Phase-Shift Keying modulation scheme DC Direct Current DTR Data Terminal Ready EEPROM Electrically Erasable Programmable Read-Only Memory ESD Electrostatic Discharge ZigBit™ 700/800/900 MHz Wireless Modules 1-2 8227C–MCU Wireless–06/09 Introduction 1.6 GPIO General Purpose Input/Output HVAC Heating, Ventilating and Air Conditioning HW Hardware I2C Inter-Integrated Circuit IEEE Institute of Electrical and Electrionics Engineers IRQ Interrupt Request ISM Industrial, Scientific and Medical radio band JTAG Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard interface MAC Medium Access Control layer MCU Microcontroller Unit. In this document it also means the processor, which is the core of ZigBit module O-QPSK Offset Quadrature Phase-Shift Keying modulation scheme OEM Original Equipment Manufacturer OTA Over-The-Air upgrade PCB Printed Circuit Board PER Package Error Ratio RAM Random Access Memory RF Radio Frequency RTS/CTS Request to Send/ Clear to Send RX Receiver SMA Surface Mount Assembly SPI Serial Peripheral Interface SW Software TTM Time To Market TX Transmitter UART Universal Asynchronous Receiver/Transmitter USART Universal Synchronous/Asynchronous Receiver/Transmitter USB Universal Serial Bus ZDK ZigBit Development Kit ZigBee, ZigBee PRO Wireless networking standards targeted at low-power applications 802.15.4 The IEEE 802.15.4-2006 standard applicable to low-rate wireless Personal Area Network Related Documents [1] ZigBit™ 2.4 GHz Wireless Modules ATZB-24-A2/B0 Datasheet. Atmel’s doc8226.pdf [2] ZigBit™ Development Kit. User Guide. MeshNetics Doc. S-ZDK-451 - TBD [3] ZigBit™ Amplified 2.4 GHz Wireless Modules datasheet. Atmel’s doc8228.pdf ZigBit™ 700/800/900 MHz Wireless Modules 1-3 8227C–MCU Wireless–06/09 Introduction [4] Atmel 8-bit AVR Microcontroller with 64K/128K/256K Bytes In-System Programmable Flash. 2549F AVR 04/06 [5] Atmel AT86RF212 Low Power 800/900 MHz Transceiver for IEEE 802.15.4b, Zigbee, and ISM Applications. Preliminary specification [6] Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height. http://www.hirose.co.jp/cataloge_hp/e32119372.pdf [7] ZigBit 900 Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~03 TBD [8] IEEE Std 802.15.4-2006 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [9] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007 [10] BitCloud™ IEEE 802.15.4/ZigBee Software. AVR2050: BitCloud User Guide. Atmel’s doc8199.pdf ZigBit™ 700/800/900 MHz Wireless Modules 1-4 8227C–MCU Wireless–06/09 Section 2 Zigbit™700/800/900 MHz Wireless Modules Overview 2.1 Overview ZigBit 900 is an extended-range low-power, a low-power, high-sensitivity IEEE 802.15.4/ ZigBee-compliant OEM module, which occupies less than a square inch. Based on a solid combination of Atmel’s latest MCU Wireless hardware platform [5], power amplifier and low-noise amplifier, the ZigBit 900 offers superior radio performance, ultra-low power consumption and exceptional ease of integration. Figure 2-1. ATZB-900-B0 Block Diagram VCC (1.8 - 3.6V) IRQ UART USART/SPI I2C JTAG ANALOG AT86RF212 RF Tranceiver ATmega1281 GPIO RF I/O SPI Bus ZigBit 900 contains Atmel’s ATmega1281V Microcontroller [4] and AT86RF212 RF Transceiver [5]. The module features 128 Kbytes flash memory and 8 Kbytes RAM. The ZigBit 900 already contains a complete RF/MCU-related design with all the necessary passive components included. The module can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. Compared to a custom RF/MCU design, a module-based solution offers considerable savings in development time and NRE cost per unit during the design, prototyping, and mass production phases of product development. To jumpstart evaluation and development, Atmel also offers a complete set of evaluation and development tools. The new ZigBit 900 Development Kit [7] comes with everything you need to create custom applications featuring ZigBit 900 module. The kit features MeshBean development boards (ATZB-EVB-900-SMA) with an easy-to-access extension connector for attaching third party sensors and other peripherals, and a JTAG connector for easy application uploading and debugging. The kit also includes reference applications to speed up application development, source code for hardware interface layer and reference drivers for the all the module interfaces, intuitive development environment from Atmel, and comprehensive set of application notes and product documentation. ZigBit™ 700/800/900 MHz Wireless Modules 2-1 8227C–MCU Wireless–06/09 Zigbit™700/800/900 MHz Wireless Modules Overview ZigBit 900 modules come bundled with BitCloud, a 2nd generation embedded software stack from Atmel. BitCloud is fully compliant with ZigBee PRO and ZigBee standards for wireless sensing and control [8], [9], [10] and it provides an augmented set of APIs which, while maintaining 100% compliance with the standard, offer extended functionality designed with developer's convenience and ease-of-use in mind. Depending on end-user design requirements, ZigBit 900 can operate as a self-contained sensor node, where it would function as a single MCU, or it can be paired with a host processor driving the module over a serial interface. In the former case, a user application may be used with the BitCloud software allowing customization of embedded applications through BitCloud’s C API. In the latter case, the host processor controls data transmission and manages module peripherals via an extensive set of SerialNet AT commands. Thus, no firmware customization is required for a successful module design-in. Additionally, third-party sensors can be connected directly to the module, thus expanding the existing set of peripheral interfaces. ZigBit™ 700/800/900 MHz Wireless Modules 2-2 8227C–MCU Wireless–06/09 Section 3 Specifications 3.1 Electrical Characteristics 3.1.1 Absolute Maximum Ratings Table 3-1. Absolute Maximum Ratings(1)(2) Parameters Min Max Voltage on any pin, except RESET with respect to Ground -0.5V VCC + 0.5V DC Current per I/O Pin 40 mA DC Current DVCC and DGND pins 300 mA Input RF Level +5 dBm Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Attention! ZigBit 900 is an ESD-sensitive device. Precaution should be taken when handling the device in order to prevent permanent damage. 3.1.2 Test Conditions Table 3-2. Test conditions (unless otherwise stated), VCC = 3V, Tamb = 25°C Parameters Condition Supply Voltage, VCC (1) Current Consumption: RX mode (1) PTX = 5 dBm Current Consumption: TX mode Current Consumption: Power-save mode Note: (1) Range Unit 1.8 to 3.6 V 15 mA 20 mA 6 µA 1. Preliminary data Current consumption actually depends on multiple factors, including but not limited to, the board design and materials, BitCloud settings, network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an application. ZigBit™ 700/800/900 MHz Wireless Modules 3-3 8227C–MCU Wireless–06/09 Specifications 3.1.3 RF Characteristics Table 3-3. RF Characteristics Parameters Condition Frequency Band Range Unit 779 to 787 868 to 868.6 902 to 928 MHz Number of Channels 15 Channel Spacing 2 MHz -11 to +11 dBm Transmitter Output Power Receiver Sensitivity AWGN channel, PER = 1% (2) 20 kbit/s -110 (2) -108 40 kbit/s PSDU length of 20 octets (2) -101 100 kbit/s (2) 250 kbit/s -100 200 kbit/s -97 dBm 400 kbit/s -90 PSDU length of 127 octets 500 kbit/s -97 1000 kbit/s -92 BPSK modulation 20 (at 868 MHz), 40 (at 915 MHz) kbps O-QPSK modulation 100 (at 868 MHz) 250 (at 915 MHz and 784 MHz) For balanced output 100 Ω For balanced output 6 km On-Air Data Rate TX Output/ RX Input Nominal Impedance Range, outdoors Notes: 3.1.4 (1) 1. Preliminary data 2. IEEE 802.15.4-2006 compliant ATmega1281V Microcontroller Characteristics Table 3-4. ATmega1281V Characteristics Parameters Range Unit 128 Kbytes On-chip RAM size 8 Kbytes On-chip EEPROM size 4 Kbytes Operation Frequency 4 MHz On-chip Flash Memory size ZigBit™ 700/800/900 MHz Wireless Modules Condition 3-4 8227C–MCU Wireless–06/09 Specifications 3.1.5 Module Interfaces characteristics Table 3-5. Module Interfaces characteristics Parameters Condition UART Maximum Baud Rate ADC Resolution/ Conversion Time In the single conversion mode ADC Input Resistance ADC Reference Voltage (VREF) ADC Input Voltage 2 I C Maximum Clock GPIO Output Voltage (High/Low) -10/ 5 mA, VCC=3V Real Time Oscillator Frequency 3.2 Range Unit 38.4 kbps 10/200 Bits/µs >1 MΩ 1.0 to VCC - 3 V 0 - VREF V 222 kHz 2.3/ 0.5 V 32.768 kHz Physical/Environmental Characteristics and Outline Parameters Size Operating Temperature Range Operating Relative Humidity Range Note: Value Comments 18.8 x 13.5 x 2.0 mm ATZB-900-B0 -20°C to +70°C -40°C to +85°C operational(1) no more than 80% 1. Minor degration of clock stability may occur. Figure 3-1. ATZB-900-B0 Mechanical drawing ZigBit™ 700/800/900 MHz Wireless Modules 3-5 8227C–MCU Wireless–06/09 Specifications 3.3 Pin Configuration Figure 3-2. ATZB-900-B0 Pinout Table 3-6. Pin descriptions Connector Pin Pin Name Description I/O O 1 SPI_CLK 2 SPI_MISO Reserved for stack operation(4) I/O 3 SPI_MOSI Reserved for stack operation(4) I/O 4 5 GPIO0 GPIO1 6 GPIO2 7 OSC32K_OUT Reserved for stack operation (4) Default State after Power on General Purpose digital Input/Output 0 (2)(3)(4)(7) I/O tri-state General Purpose digital Input/Output 1 (2)(3)(4)(7) I/O tri-state General Purpose digital Input/Output 2 (2)(3)(4)(7) I/O tri-state 32.768 kHz clock output(4)(5) O (4) 8 RESET 9,22,23 DGND Digital Ground 10 CPU_CLK RF clock output. When module is in active state, 4 MHz signal is present on this line. While module is in the sleeping state, clock generation is also stopped(4). O 11 I2C_CLK I2C serial clock output(2)(3)(4)(7) O tri-state I/O tri-state O tri-state 12 I2C_DATA Reset input (active low) (2)(3)(4)(7) 2 I C serial clock input/output 13 UART_TXD 14 UART_RXD UART receive input(1)(2)(3)(4)(7) I tri-state 15 UART_RTS RTS input (Request To send) for UART hardware flow control. Active low(2)(3)(4)(7) I tri-state ZigBit™ 700/800/900 MHz Wireless Modules UART transmit output (1)(2)(3)(4)(7) 3-6 8227C–MCU Wireless–06/09 Specifications Table 3-6. Pin descriptions (Continued) Connector Pin Pin Name Description I/O Default State after Power on 16 UART_CTS CTS output (Clear To send) for UART hardware flow control. Active low(2)(3)(4)(7) O tri-state 17 GPIO6 General Purpose digital Input/Output 6(2)(3)(4)(7) I/O tri-state GPIO7 (2)(3)(4)(7) I/O tri-state (2)(3)(4)(7) 18 General Purpose digital Input/Output 7 19 GPIO3 General Purpose digital Input/Output 3 I/O tri-state 20 GPIO4 General Purpose digital Input/Output 4(2)(3)(4)(7) I/O tri-state GPIO5 (2)(3)(4)(7) General Purpose digital Input/Output 5 I/O tri-state 24,25 D_VCC (9) 26 JTAG_TMS 21 27 28 29 JTAG_TDI JTAG_TDO JTAG_TCK Digital Supply Voltage (VCC) JTAG Test Mode Select(2)(3)(4)(6) (2)(3)(4)(6) JTAG Test Data Input JTAG Test Data Output JTAG Test Clock (2)(3)(4)(6) (2)(3)(4)(6) I I O I (2)(3)(7) I tri-state 30 ADC_INPUT_3 ADC Input Channel 3 31 ADC_INPUT_2 ADC Input Channel 2(2)(3)(7) I tri-state 32 ADC_INPUT_1 ADC Input Channel 1(2)(3)(7) I tri-state 33 BAT ADC Input Channel 0, used for battery level measurement. This pin equals VCC/3.(2)(3)(7) I tri-state 34 A_VREF Input/Output reference voltage for ADC I/O tri-state 35 AGND Analog ground 36 GPIO_1WR 1-wire interface(2)(3)(4)(7) I/O 37 UART_DTR DTR input (Data Terminal Ready) for UART. Active low(2)(3)(4)(7) I tri-state 38 USART0_RXD USART/SPI Receive pin(2)(3)(4)(7) I tri-state USART0_TXD (2)(3)(4)(7) O tri-state I/O tri-state 39 USART /SPI Transmit pin 40 USART0_EXTCLK 41 GPIO8 General Purpose Digital Input/Output 8(2)(3)(4)(7) I/O tri-state 42 IRQ_7 Digital Input Interrupt request 7(2)(3)(4)(7) I tri-state 43 IRQ_6 (2)(3)(4)(7) I tri-state 44,46,48 RF GND RF Analog Ground 45 RFP_IO Differential RF Input/Output I/O 47 RFN_IO Differential RF Input/Output I/O Notes: USART/SPI External Clock (2)(3)(4)(7) Digital Input Interrupt request 6 1. The UART_TXD pin is intended for input (i.e. its designation as "TXD" implies some complex system containing ZigBit 900 as its RF terminal unit), while UART_RXD pin, vice versa, is for output. 2. Most of pins can be configured for general purpose I/O or for some alternate functions as described in details in the ATmega1281V Datasheet [1]. 3. GPIO pins can be programmed either for output, or for input with/without pull-up resistors. Output pin drivers are strong enough to drive LED displays directly (refer to figures on pages 387-388, [1]). 4. All digital pins are provided with protection diodes to D_VCC and DGND ZigBit™ 700/800/900 MHz Wireless Modules 3-7 8227C–MCU Wireless–06/09 Specifications 5. It is strongly recommended to avoid assigning an alternate function for OSC32K_OUT pin because it is used by BitCloud. However, this signal can be used if another peripheral or host processor requires 32.768 kHz clock, otherwise this pin can be disconnected. 6. Normally, JTAG_TMS, JTAG_TDI, JTAG_TDO, JTAG_TCK pins are used for on-chip debugging and flash burning. They can be used for A/D conversion if JTAGEN fuse is disabled. 7. The following pins can be configured with the BitCloud software to be general-purpose I/O lines: GPIO0, GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, GPIO_1WR, I2C_CLK, I2C_DATA, UART_TXD, UART_RXD, UART_RTS, UART_CTS, ADC_INPUT_3, ADC_INPUT_2, ADC_INPUT_1, BAT, UART_DTR, USART0_RXD, USART0_TXD, USART0_EXTCLK, IRQ_7, IRQ_6. Additionally, four JTAG lines can be programmed with software as GPIO as well, but this requires changing the fuse bits and will disable JTAG debugging. 8. With BitCloud, CTS pin can be configured to indicate sleep/active condition of the module thus providing mechanism for power management of host processor. If this function is necessary, connection of this pin to external pull-down resistor is recommended to prevent the undesirable transients during module reset process. 9. Using ferrite bead and 1 µF capacitor located closely to the power supply pin is recommended, as shown below. 10. In SPI mode, USART0_EXTCLK is output. In USART mode, this pin can be configured as either input or output pin. ZigBit™ 700/800/900 MHz Wireless Modules 3-8 8227C–MCU Wireless–06/09 Specifications Figure 3-3. Typical Reference Schematic 1 2 3 4 5 6 7 8 RST 9 10 11 Host MCU 12 UART_TXD 13 UART_RXD 14 UART_RTS 15 UART_CTS 16 17 18 19 20 21 22 23 VCC 1,8..3,6V 3.4 24 1uF 25 SPI_CLK JTAG_TMS SPI_MISO JTAG_TDI SPI_MOSI JTAG_TDO GPIO0 JTAG_TCK GPIO1 ADC_INPUT_3 GPIO2 ADC_INPUT_2 OSC32K_OUT ADC_INPUT_1 RESET DGND BAT A_VREF CPU_CLK AGND I2C_CLK GPIO9 26 5 27 9 28 3 29 1 JTAG_TCK 4 JTAG_VCC 30 31 32 JTAG_TDI JTAG_TDO 7 100k NC 8 33 6 34 2 35 10 NC JTAG_RST JTAG_GND JTAG_GND 36 37 I2C_DATA UART_DTR UART_TXD USART0_RXD UART_RXD USART0_TXD UART_RTS USART0_EXTCLK UART_CTS GPIO8 GPIO6 IRQ_7 GPIO7 IRQ_6 GPIO3 RF_GND 44 GPIO4 RFP_IO 45 GPIO5 RF_GND 46 DGND RFN_IO 47 RF_GND 48 DGND VCC JTAG_TMS 38 39 40 41 42 43 two capacitors* Balun 0900BL18B100 6 3 5 2 4 1 D_VCC D_VCC *) 68 pF GRM 1555C1H101JZ01D Mounting Information The below diagrams show the PCB layout recommended for ZigBit 900 module. Neither via-holes nor wires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement, RF_GND pins should be grounded via several holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and losses. ZigBit™ 700/800/900 MHz Wireless Modules 3-9 8227C–MCU Wireless–06/09 Specifications Figure 3-4. 3.5 ATZB-900-B0 PCB Recommended Layout, Top View Soldering Profile The J-STD-020C-compliant soldering profile is recommended, as given below. Table 3-7. Soldering Profile(1) Profile Feature Average ramp-up rate (217 °C to peak) 3 °C/s max. Preheat temperature 175 °C ± 25 °C 180 s max. Temperature maintained above 217 °C 60 s to 150 s Time within 5 °C of actual peak temperature 20 s to 40 s Peak temperature range 6 °C/s max. Ramp-down rate Note: 3.6 Green Package 8 minutes max. 1. The package is backward compatible with Pb/Sn soldering profile Antenna Reference Design This section presents PCB design which may be used to combine ZigBit 900 with an external antenna This antenna reference designs is recommended for successful design-in. ZigBit™ 700/800/900 MHz Wireless Modules 3-10 8227C–MCU Wireless–06/09 Specifications Figure 3-5. FCC/CE compliant RF reference design with RP-SMA connector recommended for ATZB-900-B0 Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board material and thickness, shields, the material used for enclosure, the board neighborhood, and other components adjacent to antenna. 3.6.1 General recommendations Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning. Placing high profile components next to antenna should be avoided. Having holes punched around the periphery of the board eliminates parasitic radiation from the board edges also distorting antenna pattern. ZigBit 900 module should not be placed next to the consumer electronics which might interfere with ZigBit 900's RF frequency band. The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna pattern. To eliminate this effect, metalized and grounded holes must be placed around the board's edges. ZigBit™ 700/800/900 MHz Wireless Modules 3-11 8227C–MCU Wireless–06/09 Section 4 Ordering Information 4.1 Ordering Information Part Number Description ATZB-900-B0R(1) 783/868/915 MHz IEEE802.15.4/ZigBee Wireless Module w/ Balanced RF Port Note: 1. Tape and Reel quantity: 200 ZigBit™ 700/800/900 MHz Wireless Modules 4-12 8227C–MCU Wireless–06/09 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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