MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS D2PAK CASE 418AF ISSUE E DATE 15 SEP 2015 SCALE 1:1 T C A K S B T C OPTIONAL CHAMFER ES V H 2 U ED OPTIONAL CHAMFER 1 TERMINAL 4 DETAIL C DETAIL C 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCHES. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 6. SINGLE GAUGE DESIGN WILL BE SHIPPED AFTER FPCN EXPIRATION IN OCTOBER 2011. J F G SIDE VIEW D 0.010 (0.254) 3X TOP VIEW N M R SIDE VIEW SINGLE GAUGE CONSTRUCTION DUAL GAUGE CONSTRUCTION T M T SEATING PLANE L P BOTTOM VIEW BOTTOM VIEW DETAIL C OPTIONAL CONSTRUCTIONS SOLDERING FOOTPRINT* 10.490 DIM A B C D ED ES F G H J K L M N P R S U V INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.018 0.026 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 0_ 8_ 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 0.457 0.660 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 0_ 8_ 2.946 REF 5.080 MIN 6.350 MIN GENERIC MARKING DIAGRAM* XX XXXXXXXXX AWLYYWWG 8.380 16.155 3X 3.504 3X 1.016 2.540 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 98AON21981D XXXXX A WL YY WW G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G”, may or not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com http://onsemi.com D2PAK, 3 LEAD, NON−CROPPED DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 11 DOCUMENT NUMBER: 98AON21981D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY A. NOAH. 13 FEB 2006 A ADDED SOLDERING FOOTPRINT. REQ. BY M. FILLION. 18 JUN 2007 B ADDED SINGLE AND DUAL GAUGE SIDE VIEWS AND BOTTOM VIEW. REQ. BY J. KREMMER. 08 NOV 2011 C CORRECTED SOLDERING FOOTPRINT TO VERSION FROM ISSUE A. REQ. BY J. KREMMER. 13 APR 2012 D CORRECTED SOLDERING FOOTPRINT BACK TO VERSION FROM ISSUE B. REQ. BY J. KREMMER. 24 MAY 2012 E REVISED DIMENSION R FROM 5 DEGREES REFERENCE TO 0 & 8 DEGREES MIN & MAX. REQ. BY K. MUSTAFA. 15 SEP 2015 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. http://onsemi.com © Semiconductor Components Industries, LLC, 2015 September, 2015 − Rev. E 2 Case Outline Number: 418AF