MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−14 EP CASE 948AW ISSUE C 14 1 SCALE 1:1 B NOTE 6 14 DATE 09 OCT 2012 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.07 mm MAX. AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD IS 0.07. 4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 mm PER SIDE. DIMENSION D IS DETERMINED AT DATUM H. 5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.25 mm PER SIDE. DIMENSION E1 IS DETERMINED AT DATUM H. 6. DATUMS A AND B ARE DETERMINED AT DATUM H. 7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT ON THE PACKAGE BODY. 8. SECTION B−B TO BE DETERMINED AT 0.10 TO 0.25 mm FROM THE LEAD TIP. b 8 ÉÉ ÇÇÇ ÇÇÇ ÉÉ b1 E1 c1 E NOTE 5 PIN 1 REFERENCE 1 7 A 2X 14 TIPS D A2 NOTE 4 0.05 C 0.10 C 14X 14X NOTE 8 0.20 C B A e TOP VIEW NOTE 6 SECTION B−B c b 0.10 C B S A A S DETAIL A B C M SEATING PLANE c B NOTE 3 END VIEW SIDE VIEW D2 H E2 A1 NOTE 7 L2 L DETAIL A BOTTOM VIEW RECOMMENDED SOLDERING FOOTPRINT* 3.40 14X 1.15 C GAUGE PLANE DIM A A1 A2 b b1 c c1 D D2 E E1 E2 e L L2 M MILLIMETERS MIN MAX −−−− 1.20 0.05 0.15 0.80 1.05 0.19 0.30 0.19 0.25 0.09 0.20 0.09 0.16 4.90 5.10 3.09 3.62 6.40 BSC 4.30 4.50 2.69 3.22 0.65 BSC 0.45 0.75 0.25 BSC 0_ 8_ GENERIC MARKING DIAGRAM* 14 XXXX XXXX ALYWG G 1 3.06 6.70 1 0.65 PITCH 14X 0.42 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 98AON66474E XXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com TSSOP−14 EP, 5.0X4.4 DESCRIPTION: October, 2002 − Rev. 0 PAGE 1 OFXXX 2 1 DOCUMENT NUMBER: 98AON66474E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY J. KREMMER. 12 JAN 2012 A CHANGED DATUM SCHEME FOR GD&T. REQ. BY J. KREMMER. 26 JAN 2012 B CHANGED DIMENSION D2 TO 3.09 MIN & 3.35 MAX. REQ. BY J. KREMMER. 02 MAR 2012 C UPDATED EXPOSED PAD DIMENSIONS. REQ. BY J. KREMMER. 09 OCT 2012 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. C Case Outline Number: 948AW