Data Sheet

Freescale Semiconductor
Technical Data
Heterojunction Bipolar Transistor
(InGaP HBT)
Broadband High Linearity Amplifier
MMG3011NT1
The MMG3011NT1 is a general purpose amplifier that is internally
input and output matched. It is designed for a broad range of Class A,
small--signal, high linearity, general purpose applications. It is suitable
for applications with frequencies from 0 to 6000 MHz such as cellular,
PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general small-signal RF.
0--6000 MHz, 15 dB
15 dBm
InGaP HBT GPA
LIFETIME BUY
Features
 Frequency: 0 to 6000 MHz
 P1dB: 15 dBm @ 900 MHz
 Small--Signal Gain: 15 dB @ 900 MHz
 Third Order Output Intercept Point: 28 dBm @ 900 MHz
 Single 5 V Supply
 Internally Matched to 50 Ohms
 Cost--effective SOT--89 Surface Mount Plastic Package
 In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel.
Table 1. Typical Performance (1)
SOT--89
Table 2. Maximum Ratings
Rating
Characteristic
Symbol
900
MHz
2140
MHz
3500
MHz
Unit
Small--Signal Gain
(S21)
Gp
15
14
12
dB
Input Return Loss
(S11)
IRL
--18
--25
--25
dB
Output Return Loss
(S22)
ORL
--25
--18
--17
dB
Power Output @1dB
Compression
P1dB
15
13.5
13.5
dBm
Third Order Output
Intercept Point
OIP3
28
26.5
26
dBm
Symbol
Value
Unit
Supply Voltage
VCC
6
V
Supply Current
ICC
80
mA
RF Input Power
Pin
10
dBm
Storage Temperature Range
Tstg
--65 to +150
C
Junction Temperature
TJ
150
C
1. VCC = 5 Vdc, TA = 25C, 50 ohm system.
Table 3. Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Case
Case Temperature 87C, 5 Vdc, 41 mA, no RF applied
Symbol
Value (2)
Unit
RJC
83
C/W
2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
 Freescale Semiconductor, Inc., 2005--2008, 2012, 2014. All rights reserved.
RF Device Data
Freescale Semiconductor, Inc.
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
Document Number: MMG3011NT1
Rev. 7, 9/2014
MMG3011NT1
1
Symbol
Min
Typ
Max
Unit
Small--Signal Gain (S21)
Characteristic
Gp
13.5
15
—
dB
Input Return Loss (S11)
IRL
—
--18
—
dB
Output Return Loss (S22)
ORL
—
--25
—
dB
Power Output @ 1dB Compression
P1dB
—
15
—
dBm
Third Order Output Intercept Point
OIP3
—
28
—
dBm
Noise Figure
NF
—
4.6
—
dB
Supply Current
ICC
32
41
48
mA
Supply Voltage
VCC
—
5
—
V
Table 5. Functional Pin Description
LIFETIME BUY
Pin
Number
2
Pin Function
1
RFin
2
Ground
3
RFout/DC Supply
1
2
3
Figure 1. Functional Diagram
Table 6. ESD Protection Characteristics
Test Methodology
Class
Human Body Model (per JESD 22--A114)
1A
Machine Model (per EIA/JESD 22--A115)
A
Charge Device Model (per JESD 22--C101)
IV
Table 7. Moisture Sensitivity Level
Test Methodology
Per JESD 22--A113, IPC/JEDEC J--STD--020
Rating
Package Peak Temperature
Unit
1
260
C
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
Table 4. Electrical Characteristics (VCC = 5 Vdc, 900 MHz, TA = 25C, 50 ohm system, in Freescale Application Circuit)
MMG3011NT1
2
RF Device Data
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS
25C
--10
S11, S22 (dB)
15
--40C
10
1
0
S11
2
3
--40
2
3
4
f, FREQUENCY (GHz)
Figure 2. Small--Signal Gain (S21) versus
Frequency
Figure 3. Input/Output Return Loss versus
Frequency
17
17
16
900 MHz
15
2140 MHz
1960 MHz
14
13
2600 MHz
12
3500 MHz
11
VCC = 5 Vdc
10
5
9
7
13
11
15
14
13
12
11
VCC = 5 Vdc
0.5
15
1
1.5
2
2.5
3
Pout, OUTPUT POWER (dBm)
f, FREQUENCY (GHz)
Figure 4. Small--Signal Gain versus Output
Power
Figure 5. P1dB versus Frequency
70
60
50
40
30
20
10
4
16
10
80
0
1
0
4
f, FREQUENCY (GHz)
P1dB, 1 dB COMPRESSION POINT (dBm)
Gp, SMALL--SIGNAL GAIN (dB)
LIFETIME BUY
--20
VCC = 5 Vdc
VCC = 5 Vdc
5
ICC, COLLECTOR CURRENT (mA)
S22
--30
4.2
4.4
4.6
4.8
5
5.2
VCC, COLLECTOR VOLTAGE (V)
Figure 6. Collector Current versus Collector
Voltage
5.4
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
Gp, SMALL--SIGNAL GAIN (dB)
TC = 85C
30
27
24
21
18
VCC = 5 Vdc
1 MHz Tone Spacing
15
0
1
2
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
0
20
3
f, FREQUENCY (GHz)
Figure 7. Third Order Output Intercept Point
versus Frequency
3.5
4
MMG3011NT1
RF Device Data
Freescale Semiconductor, Inc.
3
27
24
21
f = 900 MHz
1 MHz Tone Spacing
18
4.9
4.95
5
5.05
5.1
VCC, COLLECTOR VOLTAGE (V)
31
30
29
28
27
26
VCC = 5 Vdc
f = 900 MHz
1 MHz Tone Spacing
25
24
--40
--20
20
40
60
80
100
T, TEMPERATURE (_C)
Figure 9. Third Order Output Intercept Point
versus Case Temperature
Figure 8. Third Order Output Intercept Point
versus Collector Voltage
105
--30
--40
MTTF (YEARS)
IMD, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
0
--50
--60
104
VCC = 5 Vdc
f = 900 MHz
1 MHz Tone Spacing
--70
--80
--6
103
--3
3
0
9
6
120
12
125
4
2
VCC = 5 Vdc
0
3
145
150
Figure 11. MTTF versus Junction Temperature
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
6
2
140
NOTE: The MTTF is calculated with VCC = 5 Vdc, ICC = 41 mA
Figure 10. Third Order Intermodulation Distortion
versus Output Power
1
135
TJ, JUNCTION TEMPERATURE (C)
Pout, OUTPUT POWER (dBm)
0
130
4
--20
VCC = 5 Vdc, f = 2140 MHz
Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth
Input Signal PAR = 8.5 dB @ 0.01% Probability (CCDF)
--30
--40
--50
--60
--70
--3
0
3
6
9
f, FREQUENCY (GHz)
Pout, OUTPUT POWER (dBm)
Figure 12. Noise Figure versus Frequency
Figure 13. Single--Carrier W--CDMA Adjacent
Channel Power Ratio versus Output Power
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
30
8
NF, NOISE FIGURE (dB)
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
33
LIFETIME BUY
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
50 OHM TYPICAL CHARACTERISTICS
12
MMG3011NT1
4
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 40--300 MHz
R1
C3
C4
L1
RF
INPUT
Z1
DUT
Z2
C1
S21, S11, S22 (dB)
LIFETIME BUY
Z1, Z5
Z2
Z3
Z3
Z4
Z5
C2
VCC
0.347 x 0.058 Microstrip
0.575 x 0.058 Microstrip
0.172 x 0.058 Microstrip
RF
OUTPUT
Z4
PCB
0.403 x 0.058 Microstrip
Getek Grade ML200C, 0.031, r = 4.1
Figure 14. 50 Ohm Test Circuit Schematic
20
S21
10
R1
0
L1
--10
--30
S11
VCC = 5 Vdc
--40
0
100
C2
C1
S22
--20
200
C4
C3
MMG30XX
Rev 2
300
400
500
f, FREQUENCY (MHz)
Figure 15. S21, S11 and S22 versus Frequency
Figure 16. 50 Ohm Test Circuit Component Layout
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2, C3
0.01 F Chip Capacitors
C0603C103J5RAC
Kemet
C4
1000 pF Chip Capacitor
C0603C102J5RAC
Kemet
L1
470 nH Chip Inductor
BK2125HM471--T
Taiyo Yuden
R1
0 Ω Chip Resistor
ERJ3GEY0R00V
Panasonic
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
VSUPPLY
MMG3011NT1
RF Device Data
Freescale Semiconductor, Inc.
5
50 OHM APPLICATION CIRCUIT: 300--3600 MHz
R1
C3
C4
L1
RF
INPUT
Z1
DUT
Z2
C1
S21, S11, S22 (dB)
LIFETIME BUY
Z1, Z5
Z2
Z3
Z3
Z4
Z5
C2
VCC
0.347 x 0.058 Microstrip
0.575 x 0.058 Microstrip
0.172 x 0.058 Microstrip
RF
OUTPUT
Z4
PCB
0.403 x 0.058 Microstrip
Getek Grade ML200C, 0.031, r = 4.1
Figure 17. 50 Ohm Test Circuit Schematic
20
S21
10
R1
0
L1
--10
C2
C1
S22
--20
C4
C3
S11
--30
--40
300
MMG30XX
Rev 2
VCC = 5 Vdc
800
1300
1800
2300
2800
3300
3800
f, FREQUENCY (MHz)
Figure 18. S21, S11 and S22 versus Frequency
Figure 19. 50 Ohm Test Circuit Component Layout
Table 9. 50 Ohm Test Circuit Component Designations and Values
Part
Description
Part Number
Manufacturer
C1, C2
150 pF Chip Capacitors
C0603C151J5RAC
Kemet
C3
0.01 F Chip Capacitor
C0603C103J5RAC
Kemet
C4
1000 pF Chip Capacitor
C0603C102J5RAC
Kemet
L1
56 nH Chip Inductor
HK160856NJ--T
Taiyo Yuden
R1
0 Ω Chip Resistor
ERJ3GEY0R00V
Panasonic
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
VSUPPLY
MMG3011NT1
6
RF Device Data
Freescale Semiconductor, Inc.
LIFETIME BUY
Table 10. Common Emitter S--Parameters (VCC = 5 Vdc, TA = 25C, 50 Ohm System)
S11
S21
S12
S22
f
MHz
|S11|

|S21|

|S12|

|S22|

100
0.06552
170.033
5.96942
176.263
0.09975
--0.816
0.13385
--2.955
150
0.06383
167.931
5.93739
174.155
0.09991
--1.18
0.13500
--4.514
200
0.06269
165.117
5.91539
171.527
0.10015
--2.477
0.13601
--6.374
250
0.06117
162.063
5.89348
169.546
0.10045
--2.883
0.13724
--9.6
300
0.05981
158.66
5.87619
167.518
0.10063
--3.34
0.13832
--12.707
350
0.05830
154.766
5.86975
165.398
0.10085
--4.05
0.14046
--14.848
400
0.05702
150.967
5.85785
163.377
0.10108
--4.506
0.14191
--17.031
450
0.05620
147.157
5.84533
161.303
0.10131
--5.159
0.14371
--19.568
500
0.05480
143.805
5.83028
159.19
0.10142
--5.766
0.14461
--21.523
550
0.05404
139.862
5.81371
157.192
0.10154
--6.253
0.14562
--23.875
600
0.05345
136.215
5.79406
155.172
0.10159
--6.83
0.14624
--25.878
650
0.05300
132.595
5.77608
153.133
0.10166
--7.449
0.14664
--28.005
700
0.05301
129.164
5.75924
151.135
0.10172
--7.985
0.14651
--30.174
750
0.05337
125.784
5.73951
149.108
0.10177
--8.608
0.14648
--32.244
800
0.05401
122.842
5.71885
147.093
0.10184
--9.178
0.14551
--34.496
850
0.05502
120.061
5.69616
145.064
0.10204
--9.746
0.14435
--36.557
900
0.05607
117.736
5.67188
143.066
0.10209
--10.319
0.14281
--38.707
950
0.05712
115.541
5.65082
141.112
0.10222
--10.915
0.14087
--40.982
1000
0.05849
113.614
5.62851
139.109
0.10236
--11.506
0.13859
--43.169
1050
0.06056
112.274
5.60006
137.159
0.10243
--12.103
0.13641
--45.576
1100
0.06216
111.255
5.57557
135.169
0.10254
--12.71
0.13320
--47.809
1150
0.06385
110.823
5.55100
133.202
0.10280
--13.306
0.12952
--50.265
1200
0.06581
110.396
5.52258
131.231
0.10297
--13.892
0.12567
--52.695
1250
0.06795
110.14
5.49787
129.289
0.10307
--14.559
0.12169
--55.267
1300
0.07029
110.037
5.47256
127.359
0.10327
--15.203
0.11718
--57.902
1350
0.06417
110.3
5.44429
125.432
0.10350
--15.851
0.11263
--60.543
1400
0.06615
110.33
5.41593
123.531
0.10367
--16.46
0.10814
--63.335
1450
0.06834
110.566
5.38670
121.627
0.10385
--17.039
0.10311
--66.301
1500
0.07037
111.203
5.35727
119.73
0.10409
--17.682
0.09824
--69.317
1550
0.06361
106.262
5.33305
117.89
0.10444
--18.324
0.09725
--65.446
1600
0.06510
104.31
5.30415
116
0.10462
--18.939
0.09352
--67.448
1650
0.06709
103.387
5.26958
114.125
0.10474
--19.656
0.09017
--69.038
1700
0.06871
101.77
5.24166
112.251
0.10505
--20.294
0.08614
--71.347
1750
0.07086
100.502
5.21283
110.413
0.10523
--20.945
0.08224
--73.345
1800
0.07328
99.404
5.18411
108.549
0.10547
--21.577
0.07847
--75.924
1850
0.07577
98.261
5.15395
106.674
0.10576
--22.375
0.07419
--78.51
1900
0.07845
97.17
5.12325
104.849
0.10592
--23.012
0.07045
--81.64
1950
0.08096
96.588
5.09284
102.996
0.10612
--23.742
0.06627
--85.166
2000
0.08378
95.835
5.06020
101.184
0.10637
--24.419
0.06270
--88.825
2050
0.08710
94.791
5.03015
99.346
0.10667
--25.036
0.05860
--93.023
2100
0.08957
94.206
5.00175
97.519
0.10686
--25.835
0.05542
--97.743
2150
0.09160
93.044
4.96977
95.715
0.10722
--26.591
0.05191
--103.413
2200
0.09580
92.472
4.93541
93.926
0.10725
--27.253
0.04928
--109.11
2250
0.09801
91.352
4.90425
92.125
0.10767
--27.931
0.04677
--115.508
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
50 OHM TYPICAL CHARACTERISTICS
(continued)
MMG3011NT1
RF Device Data
Freescale Semiconductor, Inc.
7
LIFETIME BUY
Table 10. Common Emitter S--Parameters (VCC = 5 Vdc, TA = 25C, 50 Ohm System) (continued)
S11
S21
S12
f
MHz
|S11|

|S21|

|S12|
2300
0.10125
90.343
4.87215
90.327
2350
0.10384
89.16
4.84064
88.561
2400
0.10702
88.397
4.80597
2450
0.11008
87.519
2500
0.11241
86.11
2550
0.11540
2600
2650
2700
2750
S22

|S22|

0.10777
--28.67
0.04452
--122.296
0.10817
--29.394
0.04294
--129.541
86.77
0.10841
--30.211
0.04205
--138.1
4.77373
85.006
0.10869
--30.924
0.04158
--146.363
4.73852
83.289
0.10879
--31.661
0.04157
--154.578
85.045
4.71080
81.53
0.10916
--32.408
0.04231
--162.984
0.11824
83.877
4.67765
79.803
0.10931
--33.203
0.04340
--171.06
0.12090
82.346
4.64616
78.061
0.10958
--33.929
0.04508
--178.591
0.12340
81.156
4.61372
76.324
0.10994
--34.621
0.04725
174.366
0.12606
79.687
4.58063
74.605
0.10994
--35.444
0.05010
167.162
2800
0.12922
78.399
4.55022
72.881
0.11034
--36.246
0.05315
160.781
2850
0.13144
77.016
4.51863
71.172
0.11063
--37.03
0.05620
154.624
2900
0.13428
75.734
4.49057
69.495
0.11089
--37.754
0.06004
149.451
2950
0.13713
74.325
4.45366
67.734
0.11109
--38.64
0.06342
144.065
3000
0.13914
72.892
4.42536
66.061
0.11140
--39.407
0.06743
138.972
3050
0.14320
71.422
4.39730
64.387
0.11161
--40.164
0.07181
134.77
3100
0.14613
70.248
4.36561
62.698
0.11191
--40.968
0.07596
130.079
3150
0.14898
69.069
4.33420
61.007
0.11211
--41.861
0.08043
125.992
3200
0.15264
67.768
4.30556
59.316
0.11252
--42.74
0.08543
122.138
3250
0.15656
66.632
4.27446
57.648
0.11258
--43.528
0.09047
117.963
3300
0.15948
65.655
4.24479
55.984
0.11281
--44.448
0.09540
114.29
3350
0.16325
64.574
4.21546
54.301
0.11317
--45.247
0.10082
110.967
3400
0.16694
63.679
4.18743
52.638
0.11329
--46.134
0.10661
107.412
3450
0.17113
62.876
4.15740
50.961
0.11352
--46.992
0.11195
104.192
3500
0.17493
62.049
4.12688
49.288
0.11374
--47.856
0.11808
101.204
3550
0.17906
61.193
4.09892
47.63
0.11391
--48.768
0.12404
98.182
3600
0.18310
60.522
4.06981
45.971
0.11410
--49.604
0.13009
95.337
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
50 OHM TYPICAL CHARACTERISTICS
MMG3011NT1
8
RF Device Data
Freescale Semiconductor, Inc.
7.62
0.305 diameter
2.49
3.48
5.33
1.27
1.27
0.58
0.86
0.64
3.86
LIFETIME BUY
Recommended Solder Stencil
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
PITCH.
Figure 20. Recommended Mounting Configuration
M3011N
( )
YYWW
Figure 21. Product Marking
2.54
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
1.7
MMG3011NT1
RF Device Data
Freescale Semiconductor, Inc.
9
PACKAGE DIMENSIONS
MMG3011NT1
10
RF Device Data
Freescale Semiconductor, Inc.
MMG3011NT1
RF Device Data
Freescale Semiconductor, Inc.
11
MMG3011NT1
12
RF Device Data
Freescale Semiconductor, Inc.
PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS
 AN1955: Thermal Measurement Methodology of RF Power Amplifiers
 AN3100: General Purpose Amplifier and MMIC Biasing
Software
 .s2p File
Development Tools
 Printed Circuit Boards
LAST ORDER 24 MAY 14 LAST SHIP 24 MAY 15
Refer to the following resources to aid your design process.
Application Notes
For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to
Software & Tools on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
LIFETIME BUY
The following table summarizes revisions to this document.
Revision
Date
Description
3
Mar. 2007
 Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS
compliant part numbers, pp. 6, 7
4
July 2007
 Replaced Case Outline 1514--01 with 1514--02, Issue D, pp. 1, 11--13. Case updated to add missing
dimension for Pin 1 and Pin 3.
5
Mar. 2008
 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
 Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 5
 Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, pp. 8, 9
6
Feb. 2012
 Corrected temperature at which ThetaJC is measured from 25C to 87C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no
RF signal applied, p. 1
 Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD
ratings are characterized during new product development but are not 100% tested during production. ESD
ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive
devices, p. 3
 Removed ICC bias callout from applicable graphs and Table 10, Common Emitter S--Parameters heading
as bias is not a controlled value, pp. 4--9
 Added .s2p File availability to Product Software and Printed Circuit Boards to Development Tools, p. 14
7
Sept. 2014
 Added Fig. 21, Product Marking, p. 9
MMG3011NT1
RF Device Data
Freescale Semiconductor, Inc.
13
How to Reach Us:
Home Page:
freescale.com
Web Support:
freescale.com/support
Information in this document is provided solely to enable system and software
implementers to use Freescale products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits based on the
information in this document.
Freescale reserves the right to make changes without further notice to any products
herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for
each customer application by customer’s technical experts. Freescale does not convey
any license under its patent rights nor the rights of others. Freescale sells products
pursuant to standard terms and conditions of sale, which can be found at the following
address: freescale.com/SalesTermsandConditions.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,
Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their
respective owners.
E 2005--2008, 2012, 2014 Freescale Semiconductor, Inc.
MMG3011NT1
Document Number: MMG3011NT1
Rev.
14 7, 9/2014
RF Device Data
Freescale Semiconductor, Inc.