Freescale Semiconductor Technical Data Document Number: MMG3008NT1 Rev. 6, 2/2012 Heterojunction Bipolar Transistor (InGaP HBT) Broadband High Linearity Amplifier MMG3008NT1 The MMG3008NT1 is a general purpose amplifier that is internally input and output matched. It is designed for a broad range of Class A, small--signal, high linearity, general purpose applications. It is suitable for applications with frequencies from 0 to 6000 MHz such as cellular, P C S , B W A , W L L , P H S , C AT V, V H F, U H F, U M T S a n d g e n e r a l small--signal RF. 0--6000 MHz, 18.5 dB 15 dBm InGaP HBT Features • Frequency: 0 to 6000 MHz • P1dB: 15 dBm @ 900 MHz • Small--Signal Gain: 18.5 dB @ 900 MHz • Third Order Output Intercept Point: 26 dBm @ 900 MHz • Single 5 Volt Supply • Internally Matched to 50 Ohms • Cost--effective SOT--89 Surface Mount Package • In Tape and Reel. T1 Suffix = 1000 Units, 12 mm Tape Width, 7 inch Reel. Table 1. Typical Performance (1) Characteristic Symbol 3 CASE 1514--02, STYLE 1 SOT--89 PLASTIC Table 2. Maximum Ratings 900 MHz 2140 MHz 3500 MHz Unit Small--Signal Gain (S21) Gp 18.5 16 13 dB Input Return Loss (S11) IRL --18 --22 --20 dB --20 12 Output Return Loss (S22) ORL --18 --16 dB Power Output @1dB Compression P1dB 15 14 14 dBm Third Order Output Intercept Point OIP3 26 25.5 25 dBm Symbol Value Unit Supply Voltage Rating VCC 6 V Supply Current ICC 80 mA RF Input Power Pin 10 dBm Tstg --65 to +150 °C TJ 150 °C Storage Temperature Range Junction Temperature (2) 2. For reliable operation, the junction temperature should not exceed 150°C. 1. VCC = 5 Vdc, TA = 25°C, 50 ohm system. Table 3. Thermal Characteristics Characteristic Thermal Resistance, Junction to Case Case Temperature 86°C, 5 Vdc, 38 mA, no RF applied Symbol Value (3) Unit RθJC 84 °C/W 3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes -- AN1955. © Freescale Semiconductor, Inc., 2005--2008, 2012. All rights reserved. RF Device Data Freescale Semiconductor, Inc. MMG3008NT1 1 Table 4. Electrical Characteristics (VCC = 5 Vdc, 900 MHz, TA = 25°C, 50 ohm system, in Freescale Application Circuit) Symbol Min Typ Max Unit Small--Signal Gain (S21) Characteristic Gp 17 18.5 — dB Input Return Loss (S11) IRL — --18 — dB Output Return Loss (S22) ORL — --20 — dB Power Output @ 1dB Compression P1dB — 15 — dBm Third Order Output Intercept Point OIP3 — 26 — dBm Noise Figure NF — 4 — dB Supply Current (1) ICC 32 38 48 mA Supply Voltage (1) VCC — 5 — V 1. For reliable operation, the junction temperature should not exceed 150°C. MMG3008NT1 2 RF Device Data Freescale Semiconductor, Inc. Table 5. Functional Pin Description Pin Number 2 Pin Function 1 RFin 2 Ground 3 RFout/DC Supply 1 2 3 Figure 1. Functional Diagram Table 6. ESD Protection Characteristics Test Methodology Class Human Body Model (per JESD 22--A114) 1A Machine Model (per EIA/JESD 22--A115) A Charge Device Model (per JESD 22--C101) IV Table 7. Moisture Sensitivity Level Test Methodology Per JESD 22--A113, IPC/JEDEC J--STD--020 Rating Package Peak Temperature Unit 1 260 °C MMG3008NT1 RF Device Data Freescale Semiconductor, Inc. 3 50 OHM TYPICAL CHARACTERISTICS 0 TC = 85°C 20 --10 25°C S11, S22 (dB) Gp, SMALL--SIGNAL GAIN (dB) 25 --40°C 15 S11 VCC = 5 Vdc VCC = 5 Vdc 1 0 2 3 --40 1 0 4 2 3 4 f, FREQUENCY (GHz) f, FREQUENCY (GHz) Figure 2. Small--Signal Gain (S21) versus Frequency Figure 3. Input/Output Return Loss versus Frequency 23 P1dB, 1 dB COMPRESSION POINT (dBm) 17 21 19 900 MHz 17 2140 MHz 1960 MHz 15 2600 MHz 13 3500 MHz 11 VCC = 5 Vdc 9 7 8 11 10 9 12 13 15 14 13 12 11 VCC = 5 Vdc 14 0.5 15 1 1.5 2 2.5 3 Pout, OUTPUT POWER (dBm) f, FREQUENCY (GHz) Figure 4. Small--Signal Gain versus Output Power Figure 5. P1dB versus Frequency 80 70 60 50 40 30 20 10 0 4 16 10 4.2 4.4 4.6 4.8 5 5.2 VCC, COLLECTOR VOLTAGE (V) Figure 6. Collector Current versus Collector Voltage 5.4 OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) Gp, SMALL--SIGNAL GAIN (dB) --20 --30 10 ICC, COLLECTOR CURRENT (mA) S22 3.5 30 27 24 21 18 VCC = 5 Vdc 1 MHz Tone Spacing 15 0 1 2 3 4 f, FREQUENCY (GHz) Figure 7. Third Order Output Intercept Point versus Frequency MMG3008NT1 4 RF Device Data Freescale Semiconductor, Inc. 33 OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm) 50 OHM TYPICAL CHARACTERISTICS 30 27 24 21 f = 900 MHz 1 MHz Tone Spacing 18 4.9 4.95 5 5.05 5.1 VCC, COLLECTOR VOLTAGE (V) 29 28 27 26 25 24 VCC = 5 Vdc f = 900 MHz 1 MHz Tone Spacing 23 22 --40 --20 40 60 80 100 T, TEMPERATURE (_C) 105 --30 MTTF (YEARS) --40 --50 --60 104 VCC = 5 Vdc f = 900 MHz 1 MHz Tone Spacing --70 --80 --6 103 --3 3 0 9 6 120 12 125 130 Pout, OUTPUT POWER (dBm) 6 4 2 VCC = 5 Vdc 0 1 2 3 140 145 150 NOTE: The MTTF is calculated with VCC = 5 Vdc, ICC = 38 mA Figure 11. MTTF versus Junction Temperature ACPR, ADJACENT CHANNEL POWER RATIO (dBc) 8 0 135 TJ, JUNCTION TEMPERATURE (°C) Figure 10. Third Order Intermodulation Distortion versus Output Power NF, NOISE FIGURE (dB) 20 Figure 9. Third Order Output Intercept Point versus Case Temperature Figure 8. Third Order Output Intercept Point versus Collector Voltage IMD, THIRD ORDER INTERMODULATION DISTORTION (dBc) 0 4 --20 VCC = 5 Vdc, f = 2140 MHz Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth Input Signal PAR = 8.5 dB @ 0.01% Probability (CCDF) --30 --40 --50 --60 --70 --3 0 3 6 9 f, FREQUENCY (GHz) Pout, OUTPUT POWER (dBm) Figure 12. Noise Figure versus Frequency Figure 13. Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power 12 MMG3008NT1 RF Device Data Freescale Semiconductor, Inc. 5 50 OHM APPLICATION CIRCUIT: 40--300 MHz VSUPPLY R1 C3 C4 L1 RF INPUT Z1 DUT Z2 C1 Z1, Z5 Z2 Z3 Z3 Z4 Z5 C2 VCC 0.347″ x 0.058″ Microstrip 0.575″ x 0.058″ Microstrip 0.172″ x 0.058″ Microstrip RF OUTPUT Z4 PCB 0.403″ x 0.058″ Microstrip Getek Grade ML200C, 0.031″, εr = 4.1 Figure 14. 50 Ohm Test Circuit Schematic 30 S21 S21, S11, S22 (dB) 20 R1 10 0 L1 --10 C4 C3 C2 C1 S22 --20 S11 --30 MMG30XX Rev 2 VCC = 5 Vdc --40 100 0 200 300 400 500 f, FREQUENCY (MHz) Figure 15. S21, S11 and S22 versus Frequency Figure 16. 50 Ohm Test Circuit Component Layout Table 8. 50 Ohm Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2, C3 0.01 μF Chip Capacitors C0603C103J5RAC Kemet C4 1000 pF Chip Capacitor C0603C102J5RAC Kemet L1 470 nH Chip Inductor BK2125HM471--T Taiyo Yuden R1 0 Ω Chip Resistor ERJ3GEY0R00V Panasonic MMG3008NT1 6 RF Device Data Freescale Semiconductor, Inc. 50 OHM APPLICATION CIRCUIT: 300--3600 MHz VSUPPLY R1 C3 C4 L1 RF INPUT Z1 DUT Z2 C1 Z1, Z5 Z2 Z3 Z3 Z4 Z5 C2 VCC 0.347″ x 0.058″ Microstrip 0.575″ x 0.058″ Microstrip 0.172″ x 0.058″ Microstrip RF OUTPUT Z4 PCB 0.403″ x 0.058″ Microstrip Getek Grade ML200C, 0.031″, εr = 4.1 Figure 17. 50 Ohm Test Circuit Schematic 30 VCC = 5 Vdc S21, S11, S22 (dB) 20 S21 R1 10 L1 0 C4 C3 C2 C1 --10 S11 --20 --30 300 MMG30XX Rev 2 S22 800 1300 1800 2300 2800 3300 3800 f, FREQUENCY (MHz) Figure 18. S21, S11 and S22 versus Frequency Figure 19. 50 Ohm Test Circuit Component Layout Table 9. 50 Ohm Test Circuit Component Designations and Values Part Description Part Number Manufacturer C1, C2 150 pF Chip Capacitors C0603C151J5RAC Kemet C3 0.01 μF Chip Capacitor C0603C103J5RAC Kemet C4 1000 pF Chip Capacitor C0603C102J5RAC Kemet L1 56 nH Chip Inductor HK160856NJ--T Taiyo Yuden R1 0 Ω Chip Resistor ERJ3GEY0R00V Panasonic MMG3008NT1 RF Device Data Freescale Semiconductor, Inc. 7 50 OHM TYPICAL CHARACTERISTICS Table 10. Common Emitter S--Parameters (VCC = 5 Vdc, TA = 25°C, 50 Ohm System) S11 S21 S12 S22 f MHz |S11| ∠φ |S21| ∠φ |S12| ∠φ |S22| ∠φ 100 0.03723 --157.139 9.53422 174.957 0.07125 --0.244 0.15383 --9.473 150 0.03824 --159.784 9.45692 172.557 0.07151 --0.321 0.15195 --11.4 200 0.03924 --161.141 9.38250 169.351 0.07173 --0.527 0.15038 --15.453 250 0.03984 --163.743 9.30193 166.775 0.07196 --0.705 0.14855 --20.132 300 0.04044 --165.433 9.23472 164.195 0.07227 --0.968 0.14665 --25.238 350 0.04154 --167.556 9.16107 161.651 0.07249 --1.121 0.14473 --29.059 400 0.04218 --169.996 9.08796 159.059 0.07267 --1.321 0.14297 --33.099 450 0.04330 --171.505 9.01503 156.523 0.07303 --1.54 0.14282 --37.115 500 0.04391 --173.121 8.93887 153.864 0.07333 --1.729 0.14257 --40.95 550 0.04504 --175.107 8.86645 151.441 0.07360 --1.953 0.14246 --45.011 600 0.04579 --177.279 8.79137 148.941 0.07384 --2.108 0.14236 --48.838 650 0.04639 --179.085 8.72227 146.469 0.07422 --2.436 0.14207 --52.786 700 0.04725 178.481 8.65074 144.076 0.07453 --2.667 0.14191 --56.644 750 0.04874 176.513 8.57600 141.652 0.07485 --2.877 0.14153 --60.456 800 0.05044 174.578 8.49615 139.244 0.07535 --3.216 0.13860 --64.47 850 0.05265 172.441 8.41904 136.846 0.07573 --3.535 0.13706 --68.268 900 0.05446 170.794 8.33301 134.487 0.07615 --3.858 0.13387 --72.153 950 0.05671 168.866 8.24325 132.225 0.07660 --4.215 0.13169 --76.394 1000 0.05987 166.015 8.16300 129.928 0.07706 --4.628 0.12795 --80.615 1050 0.06338 164.827 8.06445 127.713 0.07745 --5.024 0.12512 --84.753 1100 0.06818 162.719 7.97785 125.419 0.07782 --5.308 0.12243 --89.314 --94.022 1150 0.07156 160.419 7.88628 123.146 0.07832 --5.91 0.11969 1200 0.07622 158.869 7.79192 120.927 0.07888 --6.277 0.11711 --98.985 1250 0.08148 156.417 7.70036 118.767 0.07940 --6.79 0.11465 --104.195 1300 0.08625 154.855 7.61312 116.644 0.07998 --7.245 0.11217 --109.672 1350 0.08847 152.545 7.52137 114.548 0.08040 --7.843 0.10841 --114.968 1400 0.09042 150.239 7.43401 112.485 0.08082 --8.299 0.10615 --120.795 1450 0.09247 148.043 7.33853 110.413 0.08128 --8.836 0.10380 --126.657 1500 0.09461 146.969 7.25672 108.381 0.08193 --9.303 0.10158 --128.442 1550 0.09681 144.023 7.16705 106.399 0.08243 --9.992 0.10048 --133.06 1600 0.09928 141.737 7.08702 104.396 0.08305 --10.464 0.09950 --138.358 1650 0.10270 139.246 6.98699 102.42 0.08347 --11.112 0.09874 --142.307 1700 0.10530 137.14 6.90998 100.459 0.08398 --11.668 0.09873 --147.8 1750 0.10836 134.919 6.82646 98.556 0.08445 --12.336 0.09872 --152.853 1800 0.11174 132.496 6.74375 96.678 0.08491 --12.894 0.09935 --157.527 1850 0.11560 130.26 6.65836 94.774 0.08539 --13.604 0.09998 --162.646 1900 0.11980 128.189 6.57651 92.937 0.08590 --14.2 0.10150 --167.628 1950 0.12349 126.377 6.49376 91.045 0.08640 --14.843 0.10335 --172.451 2000 0.12873 124.287 6.41028 89.21 0.08693 --15.588 0.10540 --176.909 2050 0.13268 121.985 6.33373 87.389 0.08742 --16.17 0.10798 178.048 2100 0.13725 120.2 6.25726 85.623 0.08786 --16.886 0.11081 174.074 2150 0.14017 118.487 6.18534 83.864 0.08852 --17.695 0.11466 169.543 2200 0.14638 116.403 6.10210 82.117 0.08869 --18.285 0.11714 166.109 2250 0.15016 114.638 6.02971 80.32 0.08941 --19.001 0.12062 161.975 (continued) MMG3008NT1 8 RF Device Data Freescale Semiconductor, Inc. 50 OHM TYPICAL CHARACTERISTICS Table 10. Common Emitter S--Parameters (VCC = 5 Vdc, TA = 25°C, 50 Ohm System) (continued) S11 S21 S12 S22 f MHz |S11| ∠φ |S21| ∠φ |S12| ∠φ |S22| ∠φ 2300 0.15521 112.618 5.95603 78.605 0.08986 --19.642 0.12414 158.434 2350 0.15976 110.76 5.88332 76.922 0.09022 --20.411 0.12774 155.044 2400 0.16414 109.067 5.81205 75.215 0.09063 --21.132 0.13152 151.453 2450 0.16931 107.269 5.74220 73.556 0.09110 --21.914 0.13622 148.114 2500 0.17290 105.625 5.67374 71.895 0.09160 --22.568 0.13975 145.204 2550 0.17697 103.866 5.60911 70.217 0.09197 --23.366 0.14370 142.104 2600 0.18119 102.097 5.54039 68.601 0.09243 --24.135 0.14796 139.028 2650 0.18491 100.467 5.48069 66.985 0.09288 --24.891 0.15201 136.155 2700 0.18871 98.781 5.41580 65.359 0.09335 --25.672 0.15562 133.387 2750 0.19276 97.217 5.35397 63.725 0.09367 --26.386 0.16040 130.458 2800 0.19700 95.483 5.29285 62.113 0.09412 --27.158 0.16438 127.735 2850 0.20042 93.791 5.23322 60.504 0.09452 --28.071 0.16843 124.907 2900 0.20441 92.231 5.17959 58.977 0.09485 --28.821 0.17329 122.375 2950 0.20776 90.583 5.11646 57.358 0.09546 --29.704 0.17724 119.612 3000 0.21089 89.007 5.06803 55.76 0.09593 --30.551 0.18220 116.735 3050 0.21615 87.21 5.01467 54.217 0.09605 --31.388 0.18674 114.476 3100 0.21938 85.618 4.95573 52.66 0.09660 --32.161 0.19068 111.831 3150 0.22294 84.139 4.90100 51.117 0.09698 --33.041 0.19574 109.296 3200 0.22712 82.548 4.85380 49.552 0.09728 --33.934 0.20063 106.823 3250 0.23123 80.985 4.80281 47.99 0.09759 --34.778 0.20541 104.361 3300 0.23510 79.448 4.75341 46.438 0.09808 --35.752 0.21019 101.936 3350 0.23920 77.951 4.70392 44.903 0.09840 --36.597 0.21526 99.673 3400 0.24357 76.439 4.65357 43.375 0.09872 --37.435 0.22065 97.38 3450 0.24799 75.054 4.60593 41.828 0.09894 --38.395 0.22551 95.15 3500 0.25252 73.636 4.55940 40.312 0.09929 --39.286 0.23111 92.952 3550 0.25708 72.232 4.51351 38.767 0.09959 --40.173 0.23653 90.83 3600 0.26176 70.859 4.46687 37.242 0.09973 --41.064 0.24174 88.712 MMG3008NT1 RF Device Data Freescale Semiconductor, Inc. 9 1.7 7.62 0.305 diameter 2.49 3.48 5.33 2.54 1.27 1.27 0.58 0.86 0.64 3.86 Recommended Solder Stencil NOTES: 1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE USED IN PCB LAYOUT DESIGN. 2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN. 3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL AND RF PERFORMANCE. 4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM PITCH. Figure 20. Recommended Mounting Configuration MMG3008NT1 10 RF Device Data Freescale Semiconductor, Inc. PACKAGE DIMENSIONS MMG3008NT1 RF Device Data Freescale Semiconductor, Inc. 11 MMG3008NT1 12 RF Device Data Freescale Semiconductor, Inc. MMG3008NT1 RF Device Data Freescale Semiconductor, Inc. 13 PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following documents, software and tools to aid your design process. Application Notes • AN1955: Thermal Measurement Methodology of RF Power Amplifiers • AN3100: General Purpose Amplifier and MMIC Biasing Software • .s2p File Development Tools • Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software & Tools tab on the part’s Product Summary page to download the respective tool. REVISION HISTORY The following table summarizes revisions to this document. Revision Date Description 3 Mar. 2007 • Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS compliant part numbers, p. 6, 7 4 July 2007 • Replaced Case Outline 1514--01 with 1514--02, Issue D, p. 1, 11--13. Case updated to add missing dimension for Pin 1 and Pin 3. 5 Mar. 2008 • Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1 • Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis (ACPR) unit of measure to dBc, p. 5 • Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected frequency values from GHz to MHz, p. 8, 9 6 Feb. 2012 • Corrected temperature at which ThetaJC is measured from 25°C to 86°C and added “no RF applied” to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1 • Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD ratings are characterized during new product development but are not 100% tested during production. ESD ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive devices, p. 3 • Removed ICC bias callout from applicable graphs and Table 10, Common Emitter S--Parameters heading as bias is not a controlled value, p. 4--9 • Added .s2p File availability to Product Software and Printed Circuit Boards to Development Tools, p. 14 MMG3008NT1 14 RF Device Data Freescale Semiconductor, Inc. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005--2008, 2012. All rights reserved. MMG3008NT1 Document Number: RF Device Data MMG3008NT1 Rev. 6, 2/2012 Freescale Semiconductor, Inc. 15