PIC12F510 PIC12F510 Silicon Errata and Data Sheet Clarification The PIC12F510 device that you have received conform functionally to the current Device Data Sheet (DS41268D), except for the anomalies described in this document. The silicon/specification issues discussed in the following pages are for all silicon revisions. If, however, questions do arise concerning the silicon revision received in a particular factory shipment, please contact your local Microchip sales office for assistance. Silicon Errata None. © 2009 Microchip Technology Inc. DS80268F-page 1 PIC12F510 Data Sheet Clarifications The following typographic corrections and clarifications are to be noted for the latest version of the device data sheet (DS41268D). Changes described in Modules 1, 2, 3, and 4 below apply to the PIC12F510 only and not to the PIC16F506, which is described in the same data sheet (DS41268D): Note: Corrections are shown in bold. Where possible, the original bold text formatting has been removed for clarity. 1. Module: Analog-to-Digital Converter (ADC) The specifications listed in Table 1 supersede Table 13-3 in DS41268D. The PIC12F510 will meet the performance specifications stated in Table 1 below if the device is operated as described in this Errata. TABLE 1: Param No. A/D CONVERTER CHARACTERISTICS Sym. Characteristic Min. Typ† Max. Units Conditions A03 EIL Integral Error — — ±1.5 LSB VDD = 5.0V A04 EDL Differential Error — — -1 < EDL ≤ +1.5 LSB VDD = 5.0V A06 EOFF Offset Error — — ±1.5 LSB VDD = 5.0V A07 EGN Gain Error — — ±1.5 LSB VDD = 5.0V † Data in “Typ” column is at 5.0V 25°C unless otherwise stated. The typical parameters are for design guidance only and are not tested. Work around Table 9-2 below should replace the current Table 9-2 in the data sheet. None. 2. Module: Analog-to-Digital Converter (ADC) Section 9.1 “Clock Divisors”, paragraph 1 should read as shown in bold. The ADC has 4 clock source settings, ADCS<1:0>. There are 3 divisor values, 16, 8 and 4. The fourth setting is INTOSC with a divisor of 4. TAD FOR ADCs SETTINGS WITH VARIOUS OSCILLATORS(1) TABLE 9-2: Source ADCS<1:0> Divisor 8 MHz 4 MHz 1 MHz 500 kHz 350 kHz 200 kHz 100 kHz 32 kHz INTOSC 11 4 .5 μs 1 μs — — — — — — FOSC 10 4 .5 μs 1 μs 4 μs 8 μs 11 μs 20 μs 40 μs 125 μs(3) FOSC 01 8 1 μs 2 μs 8 μs 16 μs 23 μs 40 μs 80 μs 250 μs FOSC 00 16 2 μs(2) 4 μs(2) 16 μs 32 μs 46 μs 80 μs 160 μs 500 μs Note 1: 2: 3: Operation of the ADC module clock in any of the shaded regions shown in this table (Table 9-2) may result in linearity errors exceeding the limits stated in Table 1 of this Errata. If the internal oscillator is selected as the main clock source through the Configuration Word register, the divide-by-16 option for the ADC clock should be used. Characterized but not tested. Work around DS80268F-page 2 None. © 2009 Microchip Technology Inc. PIC12F510 3. Module: Analog-to-Digital Converter (ADC) EXAMPLE 9-2: Section 9.1.5 “Sleep”, bullets should read as follows (changes in bold). • For accurate conversions, TAD must meet the following: • 2 μs ≤ TAD < 125 μs • TAD = 1/(FOSC/divisor) MOVLW 0xF1 MOVWF ADCON0 BSF ADCON0, 1 BSF ADCON0, 2 loop0 Work around None. 4. Module: Analog-to-Digital Converter (ADC) Examples 9-1 and 9-2 changes shown in bold below. EXAMPLE 9-1: loop0 MOVLW 0xF1 ;configure A/D MOVWF ADCON0 BSF ADCON0, 1 ;start conversion NOP BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop0 MOVF ADRES, W ;read result MOVWF result0 ;save result BSF ADCON0, 2 loop1 loop2 loop1 PERFORMING AN ANALOG-TO-DIGITAL CONVERSION ;Sample code operates out of BANK0 ;setup for read of ;channel 1 ;start conversion CHANNEL SELECTION CHANGE DURING CONVERSION loop2 ;configure A/D ;start conversion ;setup for read of ;channel 1 NOP BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop0 MOVF ADRES, W ;read result MOVWF result0 ;save result BSF ADCON0, 1 ;start conversion BSF ADCON0, 3 ;setup for read of BCF ADCON0, 2 ;channel 2 NOP BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop1 MOVF ADRES, W ;read result MOVWF result1 ;save result BSF ADCON0, 1 ;start conversion NOP BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop2 MOVF ADRES, W ;read result MOVWF result2 ;save result CLRF ADCON0 ;optional: returns ;pins to Digital mode and turns off ;the ADC module Work around None. BSF ADCON0, 1 NOP BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop1 MOVF ADRES, W ;read result MOVWF result1 ;save result BSF ADCON0, 3 ;setup for read of BCF ADCON0, 2 ;channel 2 BSF ADCON0, 1 ;start conversion NOP BTFSC ADCON0, 1;wait for ‘DONE’ GOTO loop2 MOVF ADRES, W ;read result MOVWF result2 ;save result © 2009 Microchip Technology Inc. DS80268F-page 3 PIC12F510 5. Module: Analog-to-Digital Converter (ADC) The Reset value for the ADCON0 register is updated for Resets other than Power-on Reset. Changes to the tables affected are listed below, in Table 10-3, and identified in bold and italic text. TABLE 10-3: RESET CONDITIONS FOR REGISTERS – PIC12F510 Register Address W MCLR Reset, WDT Time-out, Wake-up On Pin Change, Wake-up on Comparator Change Power-on Reset — qqqq qqqu(1) qqqq qqqu(1) INDF 00h xxxx xxxx uuuu uuuu TMR0 01h xxxx xxxx uuuu uuuu PCL 02h 1111 1111 1111 1111 STATUS 03h 0001 1xxx qq0q quuu(2) FSR 04h 110x xxxx 11uu uuuu OSCCAL 05h 1111 111- uuuu uuu- GPIO 06h --xx xxxx --uu uuuu CM1CON0 07h 1111 1111 uuuu uuuu ADCON0 08h 1111 1100 1111 1100 ADRES 09h xxxx xxxx uuuu uuuu OPTION — 1111 1111 1111 1111 TRISIO — --11 1111 --11 1111 Legend: Note 1: 2: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’, q = value depends on condition. Bits <7:1> of W register contain oscillator calibration values due to MOVLW XX instruction at top of memory. See Table 10-5 for Reset value for specific conditions. Work around None. 6. Module: Electrical Characteristics The min. and max. values in Table 13-1 for Internal Voltage Reference (VIVRF) have been revised. Changes to the table are listed below and identified in bold and italic text. TABLE 13-1: COMPARATOR SPECIFICATIONS Sym. Characteristics VOS Input Offset Voltage VCM Input Common Mode Voltage CMRR TRT VIVRF * Note 1: Common Mode Rejection Ratio Response Time(1) Internal Voltage Reference Min. Typ. Max. Units — ±3 ±10 mV 0 — VDD – 1.5 V +55* — — dB — 150 400* ns 0.500 0.6 0.700 V Comments (VDD - 1.5V)/2 Internal These parameters are characterized but not tested. Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions from VSS to VDD – 1.5V. Work around None. DS80268F-page 4 © 2009 Microchip Technology Inc. PIC12F510 7. Module: Electrical Characteristics The max. values at 2V and 5V VDD for LP Oscillator IDD at 125°C have been revised as shown in Table 2 below. TABLE 2: LP OSCILLATOR 125°C IDD Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +125°C (extended) DC Characteristics Param No. D010 Sym. Characteristics Supply Current(2,3) IDD Note 1: Min. Typ(1) Max. Units Conditions — 11 24 μA FOSC = 32 kHz, VDD = 2.0V — 38 110 μA FOSC = 32 kHz, VDD = 5.0V Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance only and is not tested. The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT disabled unless noted otherwise. 2: 3: Work around None. 8. Module: Electrical Characteristics The typ. value at 5V VDD and the max. values at 2V and 5V VDD for ICMP have been revised as shown in Table 3 below. TABLE 3: ICMP Standard Operating Conditions (unless otherwise specified) Operating Temperature -40°C ≤ TA ≤ +85°C or -40°C ≤ TA ≤ +125°C DC Characteristics Param No. D023 Sym. Characteristic ICMP Comparator Current(2) Min. — — Typ(1) Max. 15 60 26 76 Units μA μA Conditions VDD = 2.0V (per comparator) VDD = 5.0V (per comparator) Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design guidance only and is not tested. 2: For standby current measurements, the conditions are the same as IDD, except that the device is in Sleep mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep. Work around None. © 2009 Microchip Technology Inc. DS80268F-page 5 PIC12F510 APPENDIX A: DOCUMENT REVISION HISTORY Rev A Document (03/2006) First Revision – Module 1: Analog-to-Digital Converter. Rev B Document (08/2006) Clarifications/Corrections to the Data Sheet: Added Module 1: Analog-to-Digital Converter: Correction to Section 9.1 Clock Divisors, paragraph 1; Table 9-2, TAD for ADCS. Rev C Document (03/2008) Updated Module 1 by removing 25°C from Conditions and updated paragraph. Clarifications/Corrections to the Data Sheet: Updated Module 1: Analog-to Digital Converter by rewording and adding Table 9-2 updates. Added Modules 2 and 3 (Analog-to Digital Converter). Rev D Document (9/2008) Removed Silicon from title; Renumbered Modules; Updated Module 2 by adding Notes 2 and 3 to Table 92 and removed shading from 125 μs(3) under the 32 kHz column; Added Table 2 to Module 1. Rev E Document (1/2009) Added Module 5: Analog-to-Digital Converter: Updates to Tables 10-3 and 10-4 (Reset Conditions); Added Module 6: Electrical Characteristic: Updates to Table 13-1 Comparator Specifications. Rev F Document(6/2009) Updated errata with the new format. Removed part number PIC16F506 from errata. See DS80475 for PIC16F506 errata items. Data Sheet Clarifications: Revised Module 1. Added Modules 7 and 8. Other minor edits. DS80268F-page 6 © 2009 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, Omniscient Code Generation, PICC, PICC-18, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2009 Microchip Technology Inc. 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