MN101C74 Series MN101C74F Type MN101C74G FLASH 96K ROM (byte) MN101CF74G Mask ROM Internal ROM type 128K 6K RAM (byte) Package (Lead-free) Minimum Instruction Execution Time LQFP100-P-1414, MLGA100-L-1010, QFP100-P-1818B 0.1 µs (at 3.0 V to 3.6 V, 10 MHz) 0.235 µs (at 1.8 V to 3.6 V, 4.25 MHz)* 62.5 µs (at 1.8 V to 3.6 V, 32 kHz)* *: The lower limit for operation guarantee for flash memory built-in type is 2.2 V. Interrupts RESET. Watchdog. External 0 to 5. External 6 (key interrupt dedicated). Timer 0 to 3. Timer 6. Timer 7 (2 systems). Timer 8 (2 systems). Time base. Serial 0 (2 systems). Serial 1 (2 systems). Serial 3. Serial 4. A/D conversion finish. Automatic transfer finish Timer Counter 8-bit timer × 5 Timer 0 ..................Square-wave/8-bit PWM output. Event count. Remote control carrier output. Simple pulse width measurement. Added pulse (2-bit) type PWM output. Square-wave/PWM output to large current terminal PC3 possible Timer 1 ..................Square-wave output. Event count. Synchronous output event Timer 2 ..................Square-wave output. Added pulse (2-bit) type PWM output. PWM output. Serial transfer clock output. Event count. Synchronous output event. Simple pulse width measurement. Square-wave/PWM output to large current terminal PC5 possible Timer 3 ..................Square-wave output. Event count. Serial transfer clock output Timer 6 ..................8-bit freerun timer Timer 0, 1 can be cascade-connected Timer 2, 3 can be cascade-connected 16-bit timer × 2 Timer 7 ..................Square-wave output. 16-bit PWM output (cycle/duty continuous variable). Event count. Synchronous output event. Pulse width measurement. Input capture. Real time output control. High performance IGBT output. Squarewave/PWM output to large current terminal PC4 possible Timer 8 ..................Square-wave/16-bit PWM output (duty continuous variable). Event count. Pulse width measurement. Input capture. Square-wave/PWM output to large current terminal PC6 possible Timer 7, 8 can be cascade-connected: Square-wave output, PWM is possible as a 32-bit timer Time base timer: One-minute count setting Watchdog timer × 1 Serial interface Synchronous type/UART (full-duplex) × 2: Serial 0, 1 Synchronous type/Single-master I2C × 1: Serial 3 I2C slave × 1: Serial 4 Serial 4...................I2C high-speed transfer mode. 7-bit/10-bit address setting. General call DMA controller Maximum transfer cycles: 255 Starting factor: External request. Various types of interrupt. Software Transfer mode: 1-byte transfer. Word transfer. Burst transfer I/O Pins I/O 87 : Common use. Specified pull-up resistor available. Input/output selectable (bit unit) A/D converter 10-bit × 16 channels (with S/H) Display control function LCD: 47 segments × 4 commons (Static, 1/2, 1/3, or 1/4 duty) LCD power supply separated from VDD (usable if VDD ≤ VLCD ≤ 3.6 V) LCD power step-up circuit contained (3/2 times, 2 times and 3 times) LCD power shunt resistance contained Special Ports Buzzer output. Inverted buzzer output. Remote control carrier output. High-current drive port MAD00048GEM MN101C74F, MN101C74G, MN101CF74G ROM Correction Correcting address designation: Up to 7 addresses possible Electrical Charactreistics (Supply current) Parameter Operating supply current Supply current at HALT Supply current at STOP Symbol Condition min Limit typ 1.1 max 1.9 20 µA IDD1 fosc = 4 MHz. VDD = 3 V IDD2 fx = 32 kHz. VDD = 3 V 6 3 IDD3 fx = 32 kHz. VDD = 3 V. Ta = 25 °C 6 µA fx = 32 kHz. VDD = 3 V. Ta = -40 °C to +85 °C 13 µA IDD5 VDD = 3 V. Ta = 25 °C 2 µA IDD6 VDD = 3 V. Ta = -40 °C to +85 °C 10 µA 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 P56, SEG25, A6 P55, SEG26, A5 P54, SEG27, A4 P53, SEG28, A3 P52, SEG29, A2 P51, SEG30, A1 P50, SEG31, A0 P47, SEG32, D7, KEY7, SDO7 P46, SEG33, D6, KEY6, SDO6 P45, SEG34, D5, KEY5, SDO5 P44, SEG35, D4, KEY4, SDO4 P43, SEG36, D3, KEY3, SDO3 P42, SEG37, D2, KEY2, SDO2 P41, SEG38, D1, KEY1, SDO1 P40, SEG39, D0, KEY0, SDO0 P06, SEG40, NRE P05, SEG41, NWE P04, SEG42, NCS, SBI3B P03, SEG43, NDK, SBO3B, SDA3B P02, SEG44, SYSCLK, SBT3B, SCL3B P01, SEG45, NBUZZER, SCL4B P00, SEG46, BUZZER, SDA4B P25, IRQ5 P24, IRQ4 P23, IRQ3 QFP100-P-1818B, LQFP100-P-1414, MLGA100-L-1010 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 COM0, P90 COM1, P91 COM2, P92 COM3, P93 VLC3, P94 VLC2 VLC1 C2 C1, RXD0B, SBI0B, LED0, PC0 TXD0B, SBO0B, LED1, PC1 SBT0B, LED2, PC2 TM0O, LED3, PC3 TM7O, LED4, PC4 TM2O, LED5, PC5 TM8O, LED6, PC6 VSS OSC1 OSC2 VDD XI XO MMOD NRST, P27 DMOD VREF+ MAD00048GEM mA IDD4 Pin Assignment A7, SEG24, P57 A8, SEG23, P60 A9, SEG22, P61 A10, SEG21, P62 A11, SEG20, P63 A12, SEG19, P64 A13, SEG18, P65 A14, SEG17, P66 A15, SEG16, P67 A16, SEG15, P70 A17, SEG14, P71 SEG13, P72 SEG12, P73 SEG11, P74 SEG10, P75 SEG9, P76 SEG8, P77 SEG7, P80 SEG6, P81 SEG5, P82 SEG4, P83 SEG3, P84 SEG2, P85 SEG1, P86 SEG0, P87 Unit 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 P22, IRQ2 P21, ACZ1, IRQ1 P20, IRQ0 P15, TM8IO P14, TM7IO P13, TM3IO P12, TM2IO P11, TM1IO P10, TM0IO, RMOUT PB7, AN15, SBI1, RXD1 PB6, AN14, SBO1, TXD1 PB5, AN13, SBT1 PB4, AN12, SBI0A, RXD0A PB3, AN11, SBO0A, TXD0A PB2, AN10, SBT0A PB1, AN9, SCL4A PB0, AN8, SDA4A PA7, AN7, SBI3A PA6, AN6, SBO3A, SDA3A PA5, AN5, SBT3A, SCL3A PA4, AN4 PA3, AN3 PA2, AN2 PA1, AN1 PA0, AN0 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20080805