ICs Modules Cables FTDI Chip USB Solutions www.ftdichip.com @FTDIChip BRIDGING TECHNOLOGIES USB AS EASY AS 1 23 FTDI Chip develops innovative silicon solutions that enhance interaction with today’s technology. When a designer needs to add a USB port, rest assured that FTDI Chip has a full range of USB solutions to get the job done. The Universal Serial Bus (USB) interface is now established as the de-facto interface for connecting systems with a reliable, low-cost digital link. USB has expanded beyond PC usage, and can now be found in all market segments, including Industrial, Medical, Consumer, Communications, Networking, and more. Enabling designers to implement USB quickly into a design, FTDI Chip provides total solutions including silicon chips, development tools, application notes, and software support. Expertise in USB bridges provides seamless integration for a variety of interfaces such as UART, FIFO, I2C, SPI, PWM and GPIO, where the bridge converts the signalling and protocol from the selected interface to USB. USB solutions are delivered in packages as small as 10 pin DFN (3x3mm); in modules that can be inserted into boards for development and production; or in cables that bridge USB to numerous interfaces. Whenever your development or product needs USB, check out FTDI Chip (www.ftdichip.com) for complete solutions that can shorten your design time, while providing robust system implementations, and realise how FTDI Chip makes design easy. Extensive USB Portfolio Software Whether your design needs silicon chips, cables, or modules, check out FTDI Chip’s large portfolio of USB and system level products. Drivers for most major operating systems such as Windows, MAC OS, Android and Linux are available for free download thus allowing for easy integration with minimum development effort. Peripheral Or Host USB connectivity designs are constructed from two distinct functional capabilities: a host and a device/peripheral type. As part of the total solution, FTDI Chip is able to offer both types of capabilities. With over 30 USB peripheral chips offered in 5 product families, designers can choose the device which best matches their system need. On the USB host side, the FT311D targets the Android ecosystem and joins the Vinculum family which provides system level capabilities with its micro-controller capability, USB host, and USB peripheral support. Speed FTDI Chip devices are aimed at full, high and super speed solutions. SuperSpeed USB 3.0 provides the greatest level of data throughput, while hi-speed and full speed devices continue to be a robust, growing market where matching system needs with device features can provide the optimum USB implementation. The Vinculum family of host controllers is also supported with free, precompiled firmware as well as a free toolchain for designers wishing to tailor the firmware to their specific requirements. Modules Development modules are available to enable rapid design development. The modules are available in a variety of mechanical formats to allow easy bread-boarding or immediate access to the bridge interfaces. Additionally application modules are available which provide specific system functionality. Cables Advanced Features To conserve PCB area and offer additional system value, FTDI Chip adds unique features to enhance USB functionality, like battery charging detection which enables faster charging. FTDI Chip also offers devices linking one USB port to 1, 2, or 4 application interfaces without requiring a USB hub. Save space, power, and system cost when EEPROM (MTP) memory, or unique clocking features are utilized in your system design. Similar to the module solutions are a range of cables offering TTL, RS232, RS422 or RS485 level interfaces. These cables can be used for development purposes or as accessories for accessing existing products over USB. USB 3.0 SUPERSPEED BRIDGE SOLUTION (FT60X SERIES) FTDI Chip is proud to announce its first SuperSpeed series in the FT60X, a sophisticated USB3.0 to FIFO bridge in a low count pin package. The FT600Q and FT601Q are FTDI Chip’s first generation USB 3.0 products that function as SuperSpeed USB 3.0 to FIFO bridges, providing data bursting rates of up to 3.2Gbps. The FT600Q comes in a 56-pin QFN package and has a 16-bit wide FIFO bus interface, while the FT601Q comes in a 76-pin QFN package and has a 32-bit wide FIFO bus interface. Both chips support up to 8 endpoints, other than the management endpoints. The endpoints are linked to a configurable endpoint buffers of 16kByte length for IN and 16kByte for OUT. Simple to connect and control. No additional firmware development required. Just “fit and forget”. Applications that need to transfer data over USB at faster rates benefit from the FT60X series: • • • • • • • Multi Function Printers Scanners High resolution video cameras High resolution displays Professional still image cameras Data acquisition systems that require high bandwidth FPGA & MCU development boards that require high bandwidth connectivity USB 2.0 HI-SPEED BRIDGE SOLUTION H Chip Series Fast, flexible, multi-channel USB bridges. Application Interface Channels Clocking EEPROM Data Throughput Package FT232H UART ASYNC FIFO SYNC FIFO MPSSE 1 External (12MHz) External 12MBaud 10MByte/s 40MByte/s 30Mbit/s 48 QFN 48 LQFP FT2232H UART ASYNC FIFO SYNC FIFO MPSSE x 2 2 External (12MHz) External 12MBaud 10MByte/s 40MByte/s 30Mbit/s 64 QFN 64 LQFP FT4232H UART MPSSE x2 4 External (12MHz) External 12MBaud 30Mbit/s 64 QFN 64 LQFP FT4222H SPI/I2C (Master/Slave) GPIO 4 Channel SPI slave selection External (12MHz) Internal OTP Upto 27Mbps 32 VQFN • • • IO Levels 3.3V (5V tolerant) Typical operating current 70mA Extended Temperature Range: -40˚C to +85˚C In addition to the higher data rates these devices offer, (upto 40Mbytes/s) when compared to full speed solutions, the Hi-Speed series also offers a range of multi-channel interfacing. The benefits of a multi channel bridge is that the system BOM is reduced by taking away the need for a USB hub chip. Additionally, each channel of the device appears to the host PC as a separate device enabling each channel to be independently configured for different modes, e.g. UART, MPSSE or FIFO and with different parameters such as 4 UARTS all operating with different baud rates. For portable or battery operated devices the FT4222H also offers support for battery charger detection, enabling higher charge currents to be requested thus reducing battery charge times. USB 2.0 FULL SPEED BRIDGE SOLUTION X Chip Series Optimised for small footprint, low power and battery charger detection. FT200XD FT201XQ Application Interface Channels Configureable CBUS Pins MTP Memory Data Throughput IC 1 1 Internal 3.4Mbit/s 2 IC 1 7 Internal 3.4Mbit/s 4-Bit SPI/FT1248 1 1 Internal 500kByte/s 8-Bit SPI/FT1248 1 1 Internal 1MByte/s Basic UART 1 4 Internal 3MBaud FT231XS Full Handshake UART 1 4 Internal 3MBaud FT234XD Basic UART 1 1 Internal 3MBaud FT240XQ 8-bit FIFO 1 2 Internal 1MByte/s FT201XS FT220XQ FT220XS FT221XQ FT221XS FT230XQ FT230XS FT231XQ 2 FT240XS • • • • • • Package 10 DFN 16 QFN 16 SSOP 16 QFN 16 SSOP 20 QFN 20 SSOP 16 QFN 16 SSOP 20 QFN 20 SSOP 12 DFN 24 QFN 24 SSOP IO Levels 1.8V to 3.3V (5V tolerant) Typical operating current 8mA Battery Charger Detection Internal data buffering: TX - 512 bytes, RX – 512 bytes Internally generated clocking - No external crystal required. Extended Temperature Range: -40˚C to +85˚C The X-chip series for full speed USB bridge solutions is the latest generation in full speed USB bridging technology, offering the widest range of interface options all backed up with robust driver support on Windows, Linux, MAC OSX and WinCE. USB 2.0 FULL SPEED BRIDGE SOLUTION R Chip Series Optimised for minimal external components on a PCB design. FT232RL FT232RQ FT245RL FT245RQ • • • • • Application Interface Channels Configureable CBUS Pins EEPROM Data Throughput UART 1 5 Internal 3MBaud 8-bit FIFO 1 0 Internal 1MByte/s Package 28 SSOP 32 QFN 28 SSOP 32 QFN IO Levels 1.8V to 5V Typical operating current 15mA Internal data buffering: TX - 128 bytes, RX – 256 bytes Internally generated clocking - No external crystal required. Extended Temperature Range: -40˚C to +85˚C The R chip solution offers a highly integrated solution combining USB protocol handling, internal clock control and EEPROM capabilities in one IC package. BL and D Chip Series Original, robust and market hardened solution. FT232BL FT245BL FT2232D • • • • • Application Interface UART 8-bit FIFO UART ASYNC FIFO MPSSE* Channels Clocking EEPROM 1 1 External (6MHz) External (6MHz) External External 2 External (6MHz) External Data Throughput 3MBaud 1MByte/s 3MBaud 1Myte/s 5.6Mbit/s IO Levels 3.3V to 5V Typical operating current 25mA Internal data buffering: TX - 128 bytes, RX – 384 bytes Extended Temperature Range: -40˚C to +85˚C MPSSE - Multi Protocol Synchronous Serial Engine on FT2232D channel A only Package 32 LQFP 32 LQFP 48 LQFP USB 2.0 FULL SPEED BRIDGE SOLUTION FT12 Series Fully configurable Full Speed USB Device Controller series, to add any class or vendor specific USB device interface support to MCUs. • • • Application Interface Endpoints Supported Selectable Endpoints Battery Charger Detection Data Throughput Package FT120 Parallel (MCU) 6 Bulk Isochronous Interrupt NO Upto 1MByte/s 28 TSSOP 28 QFN FT121 SPI slave 8 Bulk Isochronous Interrupt YES Upto 1MByte/s 28 TSSOP 28 QFN FT122 Parallel (MCU) 8 Bulk Isochronous Interrupt YES Upto 1MByte/s 28 TSSOP 28 QFN IO Levels 3.3V to 5V Typical operating current 7mA Extended Temperature Range: -40˚C to +85˚C While the other USB bridge devices focus on a fixed vendor USB class with silicon and host driver support both supplied and configured for maximum compatibility and efficiency, the FT12 series allows for something a little different. The series provides a fully configurable device controlled by an external MCU, allowing the device to be identified as a variety of USB device classes such as BOM (Mass Storage), HID (KeyBoard/Mouse), and CDC (Serial Port), thus enabling generic pre-loaded system drivers to access the USB port. Applications: • Printers • Industrial Control • FPGA USB expansion ports USB HOST SOLUTIONS As mobility accelerates, the need for host support in tablets, handsets, and consumer equipment becomes critical to enable USB connections. FTDI Chip is expanding its USB host solutions with a focus on: Android Open Accessories Initiative, add-on USB host capability for USB2.0 Hi-Speed, and continued support for system level solutions that include USB technology (16 bit micro-controller, USB host, and USB device capabilities). Integrated circuits that provide USB host ports in a system solution are provided in the Vinculum family of devices. The Vinculum II (VNC2) provides ample hardware support including 16 bit microcontroller, USB host and device capabilities, embedded flash memory, and extensive interface options. In addition, the VNC2 has an extensive suite of application ROM design files, and a toolchain for developing application specific designs. VNC2 FT311D FT312D FT313H Description Programmable USB 2.0 Host/Device Controller ANDROID USB Host ANDROID USB Host Programmable USB 2.0 Host USB Speed Full (12Mbps) / Low speed (1.5Mbps) Full-Speed (12Mbps) Full-Speed (12Mbps) Hi-Speed (480Mbps) USB Transfer Types Bulk, Interrupt, Isochronous Bulk Bulk Bulk, Interrupt, Isochronous 2 1 1 1 Flexible 1 1 1 ASYNC FIFO, SYNC FIFO, UART, 2 x SPI SLAVE, 1 x SPI MASTER, GPIO, PWM, DEBUG PORT GPIO, PWM, UART, I2C Master, SPI Master, SPI Slave UART 8/16 bit multiplexed bus, SRAM, NOR Core 16/32-bit Harvard MCU Core - - - Internal Memory 16kB RAM 256kB FLASH - 5512B-Rx, 256B-Tx 320 B Data rates Up to 6MBaud Up to 1MBaud Up to 1MBaud 2-25 MB/s Internal flash - - Internal Registers Clocking 12MHz Crystal 12MHz Crystal 12MHz Crystal 6MHz Crustal Operating temp. -40ºC to +85ºC -40ºC to +85ºC -40ºC to +85ºC -40ºC to +85ºC No. of USB ports No. of external channels Supported External Interfaces Configuration Storage Core supply 1.8V 1.8V 1.8V 3.3V IO Supply 3.3V 3.3V 3.3V 1.8V to 3.3V Packages 32/48/64 LQFP and QFN 32 LQFP and QFN 32 LQFP and QFN 64 QFN/LQFP/TQFP Android Host (FT311D) The FT311D IC is designed to specifically host Android platforms that support Android Open Accessories Mode (Android 3.1 onwards). This chip will enumerate and enable an Android platform to provide a bridge to a variety of platforms selectable from 3 GPIO lines. The interfaces include GPIO, UART, PWM, I2C Master, SPI Master and SPI slave. Packaged in 32 pin QFN or LQFP options the device offers a small, reliable bridge to allow Android devices such as mobile phones or tablets to communicate with peripheral hardware over USB. The device does not require any drivers to be loaded on the Android platform and draws no power from the Android USB port as the FT311D is the USB host. To support the FT311D host chip, FTDI is offering a development kit and GPIO interface board to jump-start engineers’ designs and provide easy access and integration into users’ end systems. With this fixed function, bridged host chip, designers can quickly and easily add USB functionality into products and connect to the expanding Android ecosystem. USB2.0 Hi-Speed Host Solution (FT313H) The FT313H offers a fast rate of data transfer at 480Mpbs. The device interfaces a single USB channel to a parallel bus, with DMA engine for optimized data transfer. The device also supports battery charge host emulation. X CHIP BATTERY CHARGER DETECTION VBUS BCD# PWREN# *SLEEP# CHG CURRENT 0V Logic 0 Logic 0 Logic 0 0 – In Shutdown 5V Dedicated Charger Logic 0 Logic 1 Logic 1 1.1A 5V Standard Downstream Port (Enumerated) Logic 1 Logic 0 Logic 1 0.44A * SLEEP# can be programmed to be de-activated when connected to a dedicated charger port in the FT-X MTP ROM. Charge current is determined by the resistance to gnd on the prog pin of the LTC4053. For more information, please visit our website to access Application Note 175: Battery Charger Detection over USB with FT-X Devices. DEVELOPMENT MODULES USB HOST SUPPORT UMFT311EV UMFT313EV V2EVAL VINCO VNC2 Debugger / Programmer Description: FT311 host development module connects to an Android USB device port. This development system enables the bridge from SPI master, SPI slave, I2C, UART, GPIO, and PWM to a USB host port. Description: FT313 Hi-Speed USB host development module Description: Motherboard for VNC2 daughter cards. Includes connectors for all IO and USB plus a prototyping area Description: Arduino inspired form factor for VNC2 development. Based on VNC2-64L and includes additional 10-bit ADC Description: VNC2 Programmer/debugger module for use with the IDE development tools USB connector: Type-B for debug port. 2 x Type-A USB connector: Type A and mini-B USB connector: 1 x Type-A USB connector: 1 x Type-A Notes: Supports 3 VNC2 package sizes USB connector: Mini-B Notes: Used to load and debug firmware in VNC2 devices, via the debug pin Notes: May be used with Arduino or VNC2 shields EXT32 (32 pin daughter card) EXT48 (48 pin daughter card) EXT64 (64 pin daughter card) H-CHIP SERIES SUPPORT USB2.0 Hi-Speed support with multi-channel capabilities UM232HB UM232H FT2232H Mini Module FT4232H Mini Module FT4232H Hi-Speed Serial/Hub UMFT4222EV UMFT4222HPROG Chip: FT232HL Chip: FT232HL Chip: FT2232HL Chip: FT4232HL USB connector: PCB tracks only USB connector: Mini-B USB connector: Mini-B USB connector: Mini-B Form Factor: Breakout module Form Factor: 28 pin 0.6” wide DIP Application: USB to UART, ASYNC FIFO, SYNC FIFO, or MPSSE Application: USB to UART, ASYNC FIFO, SYNC FIFO, or MPSSE Form Factor: Two 26 pin double row headers Form Factor: Two 26 pin double row headers Application: USB to UART, ASYNC FIFO, SYNC FIFO, or MPSSE x 2 Application: USB to UART or MPSSE x 2 Chip: FT4232HL USB connector: Type A Form Factor: 36 pin 0.6” wide DIP with one USB upstream connector and two downstream connectors. Application: USB to UART, MPSSE or a USB hub. May act as an expansion device to VNC2 USB host. Chip: FT4222H USB connector: Type A Form Factor: Standard 20.2mm (0.8”) wide 24 pin DIP socket. Pins are on a 2.60mm (0.1”) pitch. Application: USB to SPI/I2C master/ slave. Chip: FT4222H USB connector: Type A Form Factor: 42.38mm x 41.23mm board mounted with components and connectors. Application: For Programming the FT4222H IC descriptors. X-CHIP SERIES SUPPORT An advanced USB2.0 Full Speed Family with optimized power, footprint and feature set UMFTxxxXB* UMFTxxxXA* UMFTxxxXE* UMFT231XC Description: Breakout Module Supported IC’s: FT200XD, FT201XQ, FT220XQ, FT230XQ USB connector: PCB tracks only Description: 0.3” wide development Supported IC’s: FT201XS, FT220XS, FT221XS, FT230XS, FT231XS, FT240XS USB connector: Mini-B Description: 0.6” wide development Supported IC’s: FT201XS, FT221XS, FT231XS, FT240XS USB connector: Mini-B Description: Battery Charger Detection Module Supported IC’s: FT231XS USB connector: Micro-B * ‘xxx’ correlates to the numbers of the supported part types R-CHIP SERIES SUPPORT FTDI Chip’s popular USB2.0 Full Speed Family UM232R MM232R UB232R Chip: FT232RL USB connector: Type B Form Factor: 24 pin, 0.6” wide DIP Application: USB to UART Chip: FT232RQ USB connector: Type B Form Factor: 16 pin 0.1” pitch Application: USB to UART Chip: FT232RQ USB connector: Type B Form Factor: 8 contacts, 0.1” pitch Application: USB to UART EVAL232R USB-Key UM245R Chip: FT232RL USB connector: Type B Form Factor: USB to DB9 converter Application: USB to RS232 Chip: FT232RL USB connector: Type A Form Factor: Dongle Application: ChipID Chip: FT245RL USB connector: Type B Form Factor: 24 pin 0.6” wide DIP Application: USB to FIFO FT12 SERIES SUPPORT Inspired by the D12, industry standard, with value-added features and footprints UMFT12XEV UMFT120DC UMFT121DC UMFT122DC Description: Development system with LPC1114 microcontroller for use with daughtercards for system development Chip: FT120T USB Connector: Micro-B Footprint: 28 pin 0.8” wide DIP Chip: FT121T USB Connector: Micro-B Footprint: 14 pin 0.8” wide DIP Chip: FT122T USB Connector: Micro-B Footprint: 28 pin 0.8” wide DIP USB TO TTL SERIAL CABLES USB TO LEGACY RS232 OR RS422 OR RS485 CONVERTER CABLES USB TO LEGACY RS232 CONVERTER CABLES CABLE SOLUTIONS PART NUMBER Premium USB to Legacy RS232 Converter USB-Serial Converter Chipi-x US232R-100 RS232 US232R-500 UT232R-200 UT232R-500 RS232 CHIPI-X10 RS232 PART NUMBER IO LEVELS USB-RS232-WE-1800-BT_0.0 USB-RS232-WE-1800-BT_3.3 RS232 Converter USB-RS232-WE-1800-BT_5.0 USB-RS232-WE-5000-BT_0.0 RS232 USB-RS232-WE-5000-BT_3.3 USB-RS232-WE-5000-BT_5.0 RS422 Converter RS485 Converter USB-RS422-WE-1800-BT USB-RS422-WE-5000-BT USB-RS485-WE-1800-BT USB-RS485-WE-5000-BT PART NUMBER Type A USB to wire end TTL Serial Type A USB to SIP Connector Type A USB to 3.5mm Audio Jack USB HI SPEED CABLES IO LEVELS US232R-10 Usb Hi-Speed To UART Cables RS485 IO LEVELS TTL-232RG-VREG1V8-WE 1.8V TTL-232RG-VREG3V3-WE 3.3V TTL-232RG-VSW3V3-WE 3.3V TTL-232RG-VSW5V-WE 5V TTL-232RG-VIP-WE 1.8V to 5.25V1 TTL-232R-3V3-WE 3.3V TTL-232R-5V-WE 5V TTL-232R-5V 5V TTL-232R-3V3 3.3V TTL-232R-3V3-2MM 3.3V TTL-232R-5V-AJ 5V TTL-232R-3V3-AJ 3.3V PART NUMBER Usb Hi Speed To MPSSE Cables RS422 C232HM-DDHSL-0 C232HM-EDHSL-0 C232HD-DDHSP-0 C232HD-EDHSP-0 IO FTDI Chip’s instant USB converter cables provide connectivity options from USB to RS232, RS422, or RS485 and TTL based signalling interfaces. The cables feature integrated electronics assemblies by using FTDI Chip’s ICs, to provide an easy-to-use USB conversion. Custom cable versions are available upon request. MAX BAUD RATE RX/TX LED CABLE LENGTH CABLE TERMINATION TEMPERATURE RANGE DB9 -20ºC to +80ºC DB9 -20ºC to +80ºC DB9 -40ºC to +85ºC NOTES 10cm 1 Mbaud RX/TX LED Retaining nut on DB9 connector. 1m 5m 1 Mbaud – 250 kBaud – POWER OUTPUT PIN MAX BAUD RATE 2m 5m 10cm RX/TX LED CABLE LENGTH 0V 1.8m 3.3V 1.8m 5V 0V 1 Mbaud RX/TX LED 1.8m 5m 3.3V 5m 5V 5m 0V 3 Mbaud RX/TX LED 0V 3 Mbaud RX/TX LED POWER OUTPUT PIN MAX BAUD RATE RX/TX LED 1.8m 5m 1.8m 5m CABLE LENGTH CABLE TERMINATION Thumb screw on DB9 connector. TEMPERATURE RANGE NOTES Option of transparent or black USB connector. Wire ended LEDs for visual indication of traffic on the cable. -40ºC to +85ºC Also available as PCB. Wire ended -40ºC to +85ºC Wire ended -40ºC to +85ºC CABLE END TEMPERATURE RANGE NOTES 1.8V@100mA LEDs for visual indication of traffic on the cable. 3.3V@250mA 3.3V@50mA 5V@450mA RX/TX LED 3 Mbaud 1.8m Wire ended -40ºC to +85ºC Transparent USB connector. 1.8V to 5.25V1 5V@75mA – 5V@75mA Available as PCB. 5V@75mA 5V@75mA 0.1” pitch 3 Mbaud – 1.8m Single in line socket -40ºC to +85ºC 3 Mbaud – 1.8m Audio Jack -40ºC to +85ºC MAX DATA RATE RX/TX LED CABLE LENGTH CABLE TERMINATION TEMPERATURE RANGE NOTES 30Mbps RX/TX LED** 0.5M Wire ended -40ºC to +85ºC **In UART Mode Only 12 Mbaud RX/TX LED 1.8M Wire ended -40ºC to +85ºC 2mm pitch, for VMUSIC2 and VDRIVE2 5V@75mA – O LEVELS 3.3V 5V 3.3V 5V Tip - Tx, Ring - Rx, Sleeve Ground 1 adj.logic threshold level (from external supply) * All cables are powered from the host USB port, except TTL-232RG-VIP-WE All cables use FTDI royalty free drivers - available on Windows, MAC, Linux, and WinCE All cables FCC/CE approved • Custom cable options on request subject to MOQ/NRE About FTDI Chip FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineeers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. These platforms enable creation of electronic designs with high performance, few peripheral component requirements, low power budgets and minimal board real estate. FTDI Chip’s long-established, continuously expanding Universal Serial Bus (USB) product line boasts such universally recognized product brands as the ubiquitous R-Chip, X-Chip, Hi-Speed and SuperSpeed USB 3.0 series. In addition to both host and bridge chips, it includes highly-integrated system solutions with built-in microcontroller functionality. The company’s Embedded Video Engine (EVE) graphic controllers each pack display, audio and touch functionality onto a single chip. The unique, streamlined approach utilised by these ICs allow dramatic reductions in the development time and bill-of-materials costs involved in next generation Human Machine Interface (HMI) implementation. FTDI Chip also provides families of highly-differentiated, speed-optimised microcontroller units (MCUs) with augmented connectivity features, specifically designed with compatibility to its USB and Display product lines in mind. These MCUs are targeted at key applications where they can add value with their superior processing performance and high levels of operational efficiency. FTDI Chip is a fab-less semiconductor company, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and techical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). For more information go to: www.ftdichip.com www.youtube.com/FTDIChip www.facebook.com/FTDIDesignMadeEasy @FTDIChip FTDI CHIP GLOBAL LOCATIONS Europe, Middle East, Africa Americas China Asia/Pacific Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH, UK 7130 SW Fir Loop, Tigard, OR 97223-8160, USA Room 1103, No. 666 West Huaihai Road, Shanghai, 200052, China 2F, No. 516, Sec.1, NeiHu Road, Taipei 114, Taiwan ROC Tel: +44 (0) 141 429 2777 Fax: +44 (0) 141 429 2758 Tel: +1 (503) 547 0988 Fax: +1 (503) 547 0987 Tel: +86 (0) 21 6235 1596 Fax: +86 (0) 21 6235 1595 Tel: +886-2-8797 1330 Fax: +886-2-8751 9737 E-mail (Sales): [email protected] Email (Sales): [email protected] Email (Sales): [email protected] Email (Sales): [email protected] Email (Support): [email protected] Email (Support): [email protected] Email (Support): [email protected] Email (Support): [email protected] All trademarks remain the property of their respective owners.