EMI/RFI Surface Mount π & C Filters for SMT Applications APPLICA TION APPLICATION EMI/RFI Filter Specifications TUSONIX 4700/4701 Series π Filters & 4702 Series C Filters are used where cost and space savings have priority and improved insertion loss is required. 1.0 Scope This specification describes the basic performance requirements of the TUSONIX EMI/RFI surface mount Filters. TUSONIX’ unique design makes the filter suitable for common production soldering processes. TUSONIX’ state-of-the-art manufacturing process results in excellent electrical and mechanical performance. The square or round body allows easy handling, positioning and soldering onto the PCB. This is another cost effective quality product from TUSONIX. FEA TURES FEATURES • Excellent Performance • Easy Placement • Excellent Solderability • Reduces PCB Component Count Pi Filter Data INSERTION LOSS (dB) Typical Shielded Insertion Loss vs. Frequency 80 70 8200pF 60 50 5000pF 40 30 2000pF 20 10 0 1MHz 10MHz 100MHz 470pF 100pF 10GHz 7.0 Packaging Tape and reeled for auto placement. 4.00 ±.10 Typical Unshielded Insertion Loss vs. Frequency INSERTION LOSS (dB) 4.0 Operating Conditions Filters are designed to operate continuously at the temperature, voltage and current stated for each TUSONIX part number. Operating temperature ranges are from -55°C to either 85°C or 125°C. 6.0 Insulation Resistance Measured at 25°C±2°C with 100Vdc and charging current limited to 50mA max. The IR after two minutes maximum shall be a minimum of 10,000 Megohms. FREQUENCY 80 70 60 50 8200pF 40 5000pF 30 20 2000pF 10 0 1MHz 10MHz 3.0 Insertion Loss 3.1 Measurement Conditions: Attenuations listed are measured in a 50Ω system at 25°C±2°C under no-load conditions (per MIL-STD-220). 3.2 Insertion Loss Tolerance: The attenuations listed are typical values under indicated conditions. 3.3 Listed insertion loss data is a measurement of filter performance in a matched 50Ω system. It is highly recommended that filter performance be verified under actual circuit operation conditions. 5.0 Dielectric W ithstanding V oltage Withstanding Voltage Filters shall withstand three times the DC working voltage applied between either terminal and ground electrode. 1000pF 1GHz 2.0 Capacitance 2.1 Measurement Conditions: Capacitance measured at 25°±2°C, 50% max R.H. and Frequency of 1 KHz @ 1±0.2VRMS. 2.2 Capacitance Tolerance: Listed capacitances are minimum value at 25°±2°C unless otherwise specified. 1.5 D IA. 2.00 ±.05 .40 1.75 ±.10 7.5 ±.10 16.00 ±0.3 2.2 ± .10 4.00 ±.10 1.5 D IA. H O LE SEC TIO N DIM EN SIO NS AR E IN M ETR IC 1000pF 470pF N O TES: 100pF 100MHz FREQUENCY 1GHz 10GHz R EFER EN C E IEC -286-3 TYPE IIAN D EIA-481-A TAPIN G O F SU R FAC E M O U N T C O M PO N EN TS FO R AU TO M ATIC PLAC EM EN T Revised 9/01/01 7741 North Business Park Drive Tucson, Arizona 85743 Ph: 520-744-0400 Fax: 520-744-6155 Website: www .tusonix.com E-mail: [email protected] www.tusonix.com Revision 5, Updated 03-26-03 EMI/RFI Surface Mount 4700 & 4702 SER IES .315 M AX. [8 M AX.] .090 ±.005 [2.29 ±0.12] SQ U AR E .230 ±.010 [5.84 ±0.25] C IR C UIT Soldering Notes: Surface Mount π & C Filters may be soldered to Printed Circuit Boards and substrates in a variety of methods: solder wave, hot air, oven soldering, vapor phase reflow, infrared soldering or immersion soldering. 4702 = .039/.012 [1 /0.30] 2 PLC S. .020 M IN . [0.50] 2 PLC S. C IR C UIT .025 M AX R . [.63] ALL C O R N ER S .126/.099 [3.20 /2.51] .125 [3.18] .102 [2.59] SO LD ER H .M .P 4701 SER IES ELEC TR O D E TER M IN ATIO N SO LD ER PLATED .394 M AX. [10 M AX.] .090 ±.005 [2.29 ± 0.12] SQ U AR E Ceramic Components require careful soldering techniques to avoid the possible effects of thermal shock. SO LD ER H .M .P These effects can be minimized by using a preheat process prior to soldering. Both time and temperature are important in the preheat cycle. .336 ±.010 [8.53 ±0.25] .125 [3.18] .125 [3.18] .043 [1.09] .039/.012 [1 /0.30] 2 PLC S. .020 M IN . [0.50] 2 PLC S. .043 [1.09] SU G G ESTED M O U N TIN G PATTER N Dielectric Withstanding - 300VDC Direct Current Rating - 10 ADC Inductance Value - 100nH Minimum Please note: Additional Capacitance Values and Mounting Patterns are available upon request. .025 M AX R . [.63] ALL C O R N ER S .226/.199 [5.74 /5.05] .125 [3.18] .202 [5.13] ELEC TR O D E TER M IN ATIO N SO LD ER PLATED .125 [3.18] .125 [3.18] .043 [1.09] .043 [1.09] SU G G ESTED M O U N TIN G PATTER N ◗Denotes “C” type filters - 20 Adc SQUARE FIL TERS FILTERS TUSONIX Part Number 4700-006 4700-009 4700-005 4700-003 4700-008 4701-002 4701-001 ◗4702-000 ◗4702-001 ◗4702-002 ◗4702-003 ◗4702-004 ◗4702-005 Working Volts DC 85°C 125°C 100 100 100 100 100 100 100 100 100 -100 -100 -100 100 100 100 100 100 100 100 100 100 100 -- Cap. Capacitance (pF) Tolerance 100 470 1000 2000 4000 6800 8200 100 470 1000 1500 2500 4000 +80%/-20% +80%/-20% GMV GMV +80%/-20% +80%/-20% +80%/-20% +80%/-20% +80%/-20% +80%/-20% +80%/-20% +80%/-20% +80%/-20% Typical No-Load Insertion Loss (dB) at 25°C per MIL-Std-220 10MHz 1GHz 100MHz 16 -3 40 1 16 65 7 40 70 10 45 70 13 52 70 16 60 70 20 65 19 -1 27 -12 35 3 20 37 5 22 40 10 25 45 15 30 ROUND FIL TERS FILTERS TUSONIX Part Number 4700-059 4700-058 4700-053 4700-056 & C Filters for SMT Applications Product Installation Recommendations for Surface Mount π & C Filters 4700/4701 = .085 ±.005 [2.2 ±0.12] π Typical No-Load Insertion Loss Working Cap. Capacitance (dB) at 25°C per MIL-Std-220 Volts DC Tolerance 10MHz 100MHz 1GHz 85°C 125°C (pF) 100 16 +80%/-20% 100 100 -3 100 65 GMV 100 1000 7 40 100 70 GMV 100 2000 10 45 100 70 -5000 +80%/-20% 15 55 When using soldering irons, it is very important that the solder iron tip does not touch the ceramic body. The iron should be applied only to the termination solder fillet. The temperature of the soldering tip should be controlled to 500°F (260°C) max. Soldering should be achievable in 2-3 seconds. Recommended solder composition is 60% tin and 40% lead. Failure to follow proper preheat and solder practices can result in thermal shock to the ceramic body which may be manifested as: • Micro cracks in the ceramic body • Electrical shorts • Insulation resistance degradation in accelerated life test conditions. All Surface Mount π & C Filters have nickel barrier, solder plated electrodes and are ideally suited for manufacturers who use various soldering techniques on a multitude of products. However, the amount of solder must be controlled to allow for adequate transfer of heat and mechanical stresses from the PCB to the Filter. Handling: Extreme care should be exercised when handling ceramic components. They should be treated as fragile components. Excessive force or direct impact to the dielectric may result in chips, cracks or breakage. Cleaning: Components should be cleaned immediately following the soldering operation to optimize flux removal conditions. Cleaning solutions should be kept clean to avoid contaminating the components. The user should consult the manufacturer’s Material Safety Data Sheets for specific handling details. Excessive temperature differences or excessive agitation during cleaning may damage the filters.