General Multilayer Ceramic Capacitors MLCC is an electronic part that temporarily stores an electrical charge and the most prevalent type of capacitor today. New technologies have enabled the MLCC manufacturers to follow the trend dictated by smaller and smaller electronic devices such as Cellular telephones, Computers, DSC, DVC General Features - Miniature Size - Wide Capacitance and Voltage Range - Tape & Reel for Surface Mount Assembly - Low ESR Applications - General Electronic Circuit Part Numbering 10 2 ● B 3 ● 104 4 ● K 5 ● B 6 ● 8 7 ● N 8 ● N 9 ● N 10 ● C 11 ● 1 Samsung Multilayer Ceramic Capacitor ● 7 Thickness Option ● 2 Size(mm) ● 3 Capacitance Temperature Characteristic ● 8 Product & Plating Method ● 9 Samsung Control Code ● 4 Nominal Capacitance ● 5 Capacitance Tolerance ● 6 Rated Voltage ● 108Reserved For Future Use ● 118Packaging Type ● 1 Samsung Multilayer Ceramic Capacitor ● 2 SIZE(mm) ● Code EIA CODE Size(mm) 03 0201 0.6 × 0.3 05 0402 1.0 × 0.5 10 0603 1.6 × 0.8 21 0805 2.0 × 1.25 31 1206 3.2 × 1.6 32 1210 3.2 × 2.5 43 1812 4.5 × 3.2 55 2220 5.7 × 5.0 General Capacitors CL 1 ● 3 CAPACITANCE TEMPERATURE CHARACTERISTIC ● Code Temperature Temperature Characteristics Range C COG C△ 0±30(ppm/ ℃) P P2H P△ -150±60 R R2H R△ -220±60 S2H S△ -330±60 T T2H T△ -470±60 U U2J U△ -750±60 L S2L S△ +350 ~ -1000 A X5R X5R ±15% -55 ~ +85℃ X7R X7R ±15% -55 ~ +125℃ X X6S X6S ±22% -55 ~ +105℃ F Y5V Y5V +22 ~ -82% -30 ~ +85℃ Class Ⅰ S B Class Ⅱ -55 ~ +125℃ Temperature Characteristics Below 2.0pF 2.2 ~ 3.9pF Above 4.0pF Above 10pF CΔ C0G C0G C0G C0G PΔ - P2J P2H P2H RΔ - R2J R2H R2H SΔ - S2J S2H S2H TΔ - T2J T2H T2H UΔ - U2J U2J U2J J : ±120PPM/℃, H : ±60PPM/℃, G : ±30PPM/℃ 4 NOMINAL CAPACITANCE ● Nominal capacitance is identified by 3 digits. The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. 'R' identifies a decimal point. ● Example Code Nominal Capacitance 1R5 1.5pF 103 10,000pF, 10nF, 0.01μF 104 100,000pF, 100nF, 0.1μF General Capacitors ※ Temperature Characteristic 5 CAPACITANCE TOLERANCE ● Code Tolerance A ±0.05pF B ±0.1pF C ±0.25pF D ±0.5pF F ±1pF F ±1% G ±2% J ±5% K ±10% M ±20% Z +80, -20% Nominal Capacitance Less than 10pF (Including 10pF) More than 10pF Code Rated Voltage Code Rated Voltage R 4.0V D 200V Q 6.3V E 250V P 10V G 500V O 16V H 630V A 25V I 1,000V L 35V J 2,000V B 50V K 3,000V C 100V General Capacitors 6 RATED VOLTAGE ● 7 THICKNESS OPTION ● Size Code Thickness(T) 0201(0603) 3 0402(1005) 0603(1608) 0805(2012) 1206(3216) Code Thickness(T) 0.30±0.03 F 1.25±0.20 5 0.50±0.05 H 1.6±0.20 8 0.80±0.10 I 2.0±0.20 A 0.65±0.10 J 2.5±0.20 C 0.85±0.10 L 3.2±0.30 F 1.25±0.10 F 1.25±0.20 Q 1.25±0.15 H 1.6±0.20 Y 1.25±0.20 I 2.0±0.20 C 0.85±0.15 J 2.5±0.20 F 1.25±0.15 L 3.2±0.30 H 1.6±0.20 F 1.25±0.20 H 1.6±0.20 I 2.0±0.20 J 2.5±0.20 V 2.5±0.30 1812(4532) 2220(5750) General Capacitors 1210(3225) Size 8 PRODUCT & PLATING METHOD ● Code Electrode Termination Plating Type A Pd Ag Sn_100% N Ni Cu Sn_100% G Cu Cu Sn_100% 9 SAMSUNG CONTROL CODE ● Code Description of the code Code Description of the code A Array (2-element) N Normal B Array (4-element) P C High - Q L Automotive LICC 10 RESERVED FOR FUTURE USE ● 6 Code Description of the code N Reserved for future use 11 PACKAGING TYPE ● Code Packaging Type Code Packaging Type B Bulk F Embossing 13" (10,000EA) P Bulk Case L Paper 13" (15,000EA) C Paper 7" O Paper 10" D Paper 13" (10,000EA) S Embossing 10" E Embossing 7" General Capacitors APPEARANCE AND DIMENSION L T W BW CODE DIMENSION ( mm ) EIA CODE L W T (MAX) BW 03 0201 0.6 ± 0.03 0.3 ± 0.03 0.33 0.15 ± 0.05 05 0402 1.0 ± 0.05 0.5 ± 0.05 0.55 10 0603 1.6 ± 0.1 0.8 ± 0.1 0.9 21 0805 2.0 ± 0.1 1.25 ± 0.1 1.35 0.5 +0.2/-0.3 1206 1.40 0.5 +0.2/-0.3 31 0.5 +0.3/-0.3 32 1210 43 55 0.2 +0.15/-0.1 0.3 ± 0.2 3.2 ± 0.15 1.6 ± 0.15 3.2 ± 0.2 1.6 ± 0.2 1.8 3.2 ± 0.3 2.5 ± 0.2 2.7 3.2 ± 0.4 2.5 ± 0.3 2.8 1812 4.5 ± 0.4 3.2 ± 0.3 3.5 0.8 ± 0.3 2220 5.7 ± 0.4 5.0 ± 0.4 3.5 1.0 ± 0.3 0.6 ± 0.3 RELIABILTY TEST CONDITION NO ITEM 1 App earance PERFORMA NCE TEST CONDIT ION No Abnormal Exterior Appeara nce Thro ugh Micr osco pe(×10) 1 0,0 00㏁ or 500㏁·㎌ which ever is sma ller Insu lation 2 Resistance Apply the Ra ted Voltage Fo r 6 0 ~ 120 Sec. Ra ted Voltage is b elo w 16V ; 1 0,0 00㏁ or 100㏁·㎌ which ever is sma ller 3 W ithstanding Voltage Ⅰ w ith less than 5 0㎃ current W ith in the spe cified tolerance nce Ⅱ Q Class Ca pacita nce Frequency ≤ 1,000㎊ 1㎒ ±1 0% >1,000㎊ 1㎑ ±1 0% Ca pacita nce Frequency Voltage 0.5 ~ 5 Vrms Capacita Class 5 C lassⅡ :2 50% of the R ated Voltage for 1~5 sec . is applied Mechanical Breakd own Class 4 C lassⅠ : 300 % of the R ated Voltage for 1~ 5 sec. No Diele ctric Breakdo wn or W ithin the specified to lerance Ca pacita nce ≥ 3 0㎊ : Q ≥ 1,000 Ⅰ ≤ 10㎌ 1㎑ ±1 0% 1.0± 0 .2Vrms >10㎌ 120㎐± 20% 0.5± 0 .1Vrms Ca pacita nce Frequency < 30㎊ : Q ≥ 400 +20C ≤ 1,000㎊ 1㎒ ±1 0% ( C : Capacitance ) >1,000㎊ 1㎑ ±1 0% Ca pacita nce Frequency 1. Characteristic : A(X5R), B(X7R), X(X6S) ≥ 25V 0.025 max 16V 0.035 max 10V 0.05 max 6.3V 0.05 max/ 0.10max*1 Voltage 0.5 ~ 5 Vrms Voltage ≤ 10㎌ 1㎑ ±1 0% 1.0± 0 .2Vrms >10㎌ 120㎐± 20% 0.5± 0 .1Vrms *1. 0201 C≥ 0.022uF, 0402 C ≥0.22uF, 0603 C ≥2.2uF, 0805 C ≥4.7 uF, 1206 C≥10uF, 1210 C≥ 22uF, 1812 C ≥47uF, 22 20 C≥100 uF, 2. Characteristic : F(Y5V) 6 Ta nδ Class R ated Voltage Spec Ⅱ 50V 0.05 max, 0.07max* 2 35V 0.07 max 25V 0.05 max/ 0.07 max*3 / 0.09max*4 16V 0.09 max/ 0.125max* 5 10V 0.125 max/ 0.16max* 6 6.3V 0.16max All Low Profile Cap acito rs (P.16). *2.. 0603 C≥0.47uF, 0 805 C≥1u F *3. 0402 C≥ 0.0 33uF, 06 03 C>0 .1uF All 0805, 1206 size, 121 0 C ≤ 6.8uF *4.. 1210 C>6.8u F *5.. 0402 C≥0.22u F *6.. All 1812 size General Capacitors Spec R ated Voltage Voltage RELIABILTY TEST CONDITION NO ITEM PERFORMANCE TEST CONDITION Capacitance shall be measured by the steps Characteristics Temp. Coefficient (PPM/℃) Ⅰ Step 0 ± 30 1 PH -150 ± 60 2 RH -220 ± 60 SH -330 ± 60 TH -470 ± 60 C0G Class shown in the following table. UL -750 ± 120 SL +350 ~ -1000 Temp.(℃) 25 ± 2 Min. operating temp. ± 2 25 ± 2 3 Max. operating temp ± 2 4 25 ± 2 5 (1) Class Ⅰ Temperature Coefficient shall be calculated from Temperature 7 the formula as below. Characteristics C2 - C1 Temp, Coefficient = of Capacitance × 106 [ppm/℃] C1×△T C1; Capacitance at step 3 Class Capacitance Change with No Bias A(X5R)/ B(X7R) ±15% X(X6S) ±22% F(Y5V) +22% ~ -82% C2: Capacitance at 85℃ △T: 60℃(=85℃-25℃) (2) CLASS Ⅱ Capacitance Change shall be calculated from the formula as below. △C = C2 - C1 × 100(%) C1 C1; Capacitance at step 3 C2: Capacitance at step 2 or 4 Apply 500g.f * Pressure for 10± 1 sec. * 200g.f for 0201 case size. 8 Adhesive Strength of Termination No Indication Of Peeling Shall Occur On The Terminal Electrode. 500g.f Bending limit ; 1mm Apperance No mechanical damage shall occur. Characteristics Capacitance Change Test speed ; 1.0mm/SEC. Keep the test board at the limit point in 5 sec., Then measure capacitance. Within ±5% or ± 0. Class I 5 pF whichever is 20 R=230 larger 9 Bending 50 Strength A(X5R)/ Capacitance B(X7R)/ Within ±12.5% X(X6S) ○ ○ 45± 1 Class II F(Y5V) Within ±30% Bending limit 45±1 General Capacitors Ⅱ Characteristics RELIABILTY TEST CONDITION NO ITEM PERFORMANCE More Than 75% of the terminal surface is to be soldered newly, So metal part does not come out or dissolve 10 TEST CONDITION Solder Solder Temp. Solder ability Sn-3Ag-0.5Cu 63Sn-37Pb 245±5℃ 235±5℃ Flux Dip Time Pre-heating Apperance No mechanical damage shall occur. Characteristics Capacitance Change Within ±2.5% or Class Ⅰ ±0.25㎊ whichever is RMA Type 3±0.3 sec. 5±0.5 sec. at 80~120℃ for 10~30 sec. Solder Temperature : 270±5℃ Dip Time : 10±1 sec. Each termination shall be fully immersed and preheated as below : larger Capacitance A(X5R)/ Class Ⅱ 11 Q 80~100 60 X(X6S) Within ±15% 150~180 60 F Within ±20% Leave the capacitor in ambient condition for : Q≥ 1000 specified time* before measurement : Q≥ 400+20×C * 24 ± 2 hours (Class Ⅰ) <30㎊ Insulation Resistance Withstanding Voltage Appearance (C: Capacitance) Within the specified initial value Within the specified initial value Within the specified initial value No mechanical damage shall occur. Characteristics Capacitance Change Within ±2.5% or Class Ⅰ ±0.25㎊ whichever is larger Capacitance 12 Vibration Test Q (Class Ⅰ) Tanδ (Class Ⅱ) Insulation Resistance 24 ± 2 hours (Class Ⅱ) A(X5R)/ The capacitor shall be subjected to a Harmonic Motion having a total amplitude of 1.5mm changing frequency from 10Hz to 55Hz and back to 10Hz In 1 min. Within ±5% Class B(X7R) Ⅱ X(X6S) Within ±10% F(Y5V) Within ±20% Repeat this for 2hours each in 3 mutually Within the specified initial value Within the specified initial value Within the specified initial value perpendicular directions General Capacitors Tanδ (Class Ⅱ) TIME(SEC.) 2 Capacitance ≥ 30㎊ (Class Ⅰ) TEMP.(℃) 1 B(X7R) Resistance to Soldering heat STEP Within ±7.5% RELIABILTY TEST CONDITION NO ITEM PERFORMANCE Appearance TEST CONDIT ION No mechanical damage shall occur. Characteristics Within ±5.0% or Class Ⅰ Capacitance Temperature Capacitance Change ±0.5㎊ : 40±2 ℃ Relative humidity : 90~95 %RH Duration time : 500 +12/-0 hr. whichever is larger Leave the capacitor in ambient A(X5R)/ Class B(X7R)/ Ⅱ X(X6S) condition for specified time* before Within ±12.5% measurement. CLASSⅠ : 24±2 Hr. F(Y5V) Humidity 13 (Steady Q CLASSⅠ State) Within ±30% CLASSⅡ : 24±2 Hr. Capacitance ≥ 30㎊ : Q≥ 350 10≤ Capacitance <30㎊ : Q≥ 275 + 2.5×C Capacitance < 10pF : Q≥ 200 + 10×C (C: Capacitance) 2. Characteristic : F(Y5V) 1. Characteristic : A(X5R), B(X7R) Tanδ CLASS Ⅱ 0.05max (16V and over) 0.075max (25V and over) 0.075max (10V) 0.1max (16V, C<1.0㎌ ) 0.075max 0.125max(16V, C≥ 1.0㎌) (6.3V except Table 1) 0.15max (10V) 0.195max (6.3V) 0.125max* Insulation Resistance Appearance 1,000 ㏁ or 50㏁ ·㎌ whichever is smaller. Applied Voltage : rated voltage No mechanical damage shall occur. Characteristics Capacitance Change Temperature : 40±2 ℃ Humidity : :90~95%RH Within ±5.0% or Class Ⅰ Capacitance ±0.5㎊ whichever is larger A(X5R)/ Within ±12.5% B(X7R)/ Within ±12.5% X(X6S) Within ±30% Class Ⅱ Moisture Q (Class Ⅰ) Capacitance ≥ 30㎊ : Q≥ 200 Capacitance <30㎊ : Q≥ 100 + 10/3×C (C: Capacitance) 1. Characteristic : A(X5R), 2. Characteristic : F(Y5V) B(X7R) Tanδ (Class Ⅱ) 0.05max (16V and over) 0.075max (25V and over) 0.075max (10V) 0.1max (16V, C<1.0㎌ ) 0.075max 0.125max(16V, C≥ 1.0㎌) (6.3V except Table 1) 0.125max* 0.15max (10V) 0.195max (6.3V) (refer to Table 1) X(X6S) 0.11max (6.3V and below) Insulation Resistance Perform the initial measurement according to Note1 . Perform the final measurement according to Within ±30% Resistance Charge/Discharge Current : 50㎃ max. Within ±30% F(Y5V) 14 Duration Time : 500 +12/-0 Hr. 500 ㏁ or 25㏁·㎌ whichever is smaller. Note2. General Capacitors (refer to Table 1) RELIABILTY TEST CONDITION NO ITEM PERFORMANCE Appearance No mechanical damage shall occur. TEST CONDITION Applied Voltage : 200%* of the rated voltage Temperature : max. operating temperature Characteristics Within ±3% or ±0.3㎊, Class Ⅰ Whichever is larger A(X5R)/ Capacitance B(X7R) Class Ⅱ Capacitance Change X(X6S) Duration Time : 1000 +48/-0 Hr. Charge/Discharge Current : 50㎃ max. * refer to table(3) : 150%/100% of the rated Within ±12.5% voltage Within ±25% Perform the initial measurement according to Within ±30% Note1 for Class Ⅱ F(Y5V) Within ±30% Q (Class Ⅰ) High 15 Capacitance ≥30㎊ : Q ≥ 350 10≤ Capacitance <30 ㎊ : Q ≥ 275 + 2.5×C Perform the final measurement according to Note2. Capacitance < 10㎊ :Q ≥ 200 +10×C (C: Capacitance) 1. Characteristic : A(X5R), 2. Characteristic : F(Y5V) Temperature B(X7R) Resistance 0.05max 0.075max Tanδ (Class Ⅱ) (25V and over) 0.1max(16V, C<1.0㎌) 0.075max 0.125max(16V, C≥1.0㎌) (6.3V except Table 1) 0.125max* General Capacitors (16V and over) 0.075max (10V) 0.15max (10V) 0.195max (6.3V) (refer to Table 1) X(X6S) 0.11max (6.3V and below) Insulation Resistance Appearance 1,000 ㏁ or 50㏁·㎌ whichever is smaller. No mechanical damage shall occur. Characteristics Class Ⅰ Capacitance 16 Temperature Cycle Q (Class Ⅰ) Tanδ (Class Ⅱ) Insulation Resistance A(X5R)/ Capacitance Change Within ±2.5% or ±0.25㎊ Whichever is larger Within ±7.5% Class B(X7R)/ Ⅱ X(X6S) Within ±15% F(Y5V) Within ±20% Capacitor shall be subjected to 5 cycles. Condition for 1 cycle : Step 1 2 3 4 Temp.(℃) Min. operating temp.+0/-3 25 Max. operating temp.+3/-0 25 Time(min.) 30 2~3 30 2~3 Within the specified initial value Leave the capacitor in ambient condition for specified time* before measurement Within the specified initial value * 24 ± 2 hours (Class Ⅰ) 24 ± 2 hours (Class Ⅱ) Within the specified initial value RELIABILTY TEST CONDITION Recommended Soldering Method Size Temperature inch (mm) Characteristic 0201 (0603) Condition Capacitance - Flow Reflow - - ○ 0402 (1005) Class I 0603 (1608) Soldering Method 0805 (2012) Class II By Size & Capacitance ○ ○ ○ C ≥ 1㎌ - ○ - ○ ○ ○ ○ C ≥ 4.7㎌ - ○ - - ○ Array Class I 1206 (3216) ○ C ＜ 4.7㎌ Class I Recommended 18 Class II C ＜ 1㎌ Class II Array - ○ ○ C ＜ 10㎌ ○ ○ C ≥ 10㎌ - ○ - - ○ ○ 1210 (3225) ○ 1808 (4520) - - ○ ○ 2220 (5750) Note1. Initial Measurement For Class Ⅱ Perform the heat treatment at 150℃+0/-10℃ for 1 hour. Then Leave the capacitor in ambient condition for 48±4 hours before measurement. Then perform the measurement. Note2. Latter Measurement 1. CLASSⅠ Leave the capacitor in ambient condition for 24±2 hours before measurement Then perform the measurement. 2. Class Ⅱ Perform the heat treatment at 150℃+0/-10℃ for 1 hour. Then Leave the capacitor in ambient condition for 48±4 hours before measurement. Then perform the measurement. *Table1. Tanδ *Table2. 0.125max* 0201 C ≥ 0.022㎌ ClassⅡ A(X5R), B(X7R) *Table3. High Temperature Resistance test ΔC (Y5V) ± 30% 0402 C ≥ 0.22㎌ 0402 C ≥ 0.47㎌ 0603 C ≥ 2.2㎌ 0603 C ≥ 2.2㎌ 0805 C ≥ 4.7㎌ 0805 C ≥ 4.7㎌ 1206 C ≥ 10.0㎌ ClassⅡ 1210 C ≥ 22.0㎌ F(Y5V) High Temperature Resistance test Applied 100% of the rated 150% of the rated Voltage voltage voltage 1206 C ≥ 10.0㎌ ClassⅡ 1210 C ≥ 22.0㎌ A(X5R), 1812 C ≥ 47.0㎌ 1812 C ≥ 47.0㎌ B(X7R), 2220 C ≥ 100.0㎌ 2220 C ≥ 100.0㎌ X(X6S), All Low Profile Capacitors (P.16). Note3. All Size In Reliability Test Condition Section is "inch" F(Y5V) 0201 C ≥ 0.1㎌ 0201 C ≥ 0.022㎌ 0402 C ≥ 1.0㎌ 0402 C ≥ 0.47㎌ 0603 C ≥ 4.7㎌ 0603 C ≥ 2.2㎌ 0805 C ≥ 22.0㎌ 0805 C ≥ 4.7㎌ 1206 C ≥ 47.0㎌ 1206 C ≥ 10.0㎌ 1210 C ≥ 100.0㎌ 1210 C ≥ 22.0㎌ All Low Profile Capacitors (P.16). 1812 C ≥ 47.0㎌ 2220 C ≥ 100.0㎌ General Capacitors - 1812 (4532) PACKAGING ● CARDBOARD PAPER TAPE (4mm) Feeding Hole Chip Inserting Hole D E A F B t P0 P2 W P1 unit : mm Sym bol Type B 0603 (1608) 1.1 ±0.2 1.9 ±0.2 0805 (2012) 1.6 ±0.2 2.4 ±0.2 1206 (3216) 2.0 ±0.2 3.6 ±0.2 W F E P1 P2 P0 D t 8.0 ±0.3 3.5 ±0.05 1.75 ±0.1 4.0 ±0.1 2.0 ±0.05 4.0 ±0.1 Φ1.5 +0.1/-0 1.1 Below ● CARDBOARD PAPER TAPE (2mm) Feeding Hole Chip Inserting Hole D E A F B t P0 P2 W P1 unit : mm Sym bol Type D i m e n s i o n 0201 (0603) A B 0.38 ±0.03 0.68 ±0.03 W 0.62 ±0.04 1.12 ±0.04 E P1 P2 P0 D t 0.37 ±0.03 8.0 ±0.3 0402 (1005) F 3.5 ±0.05 1.75 ±0.1 2.0 ±0.05 2.0 ±0.05 4.0 ±0.1 Φ1.5 +0.1/-0.03 0.6 ±0.05 General Capacitors D i m e n s i o n A PACKAGING ● EMBOSSED PLASTIC TAPE F e e d in g H o le C h ip in se r tin g H o le D E A F W B t1 P0 P2 P1 t0 u n it : m m S ym b o l T yp e 0805 (2 0 1 2 ) 1206 (3 2 1 6 ) 1210 (3 2 2 5 ) 1808 (4 5 2 0 ) 1812 (4 5 3 2 ) 2220 (5 7 5 0 ) B 1 .4 5 ± 0.2 1 .9 ± 0.2 2 .9 ± 0.2 2 .3 ± 0.2 3 .6 ± 0.2 5 .5 ± 0.2 2 .3 ± 0 .2 3 .5 ± 0 .2 3 .7 ± 0 .2 4 .9 ± 0 .2 4 .9 ± 0 .2 6 .2 ± 0 .2 W F E 8 .0 ±0 .3 3 .5 ± 0 .0 5 P1 P2 D 5 .6 0 ± 0 .0 5 t1 t0 2.5 m ax 4 .0 ± 0 .1 1 .7 5 ± 0 .1 1 2 .0 ±0 .3 P0 2 .0 ± 0 .0 5 4 .0 ± 0 .1 Φ 1 .5 +0 .1 /-0 8 .0 ± 0 .1 0 .6 B e lo w 3.8 m ax ● TAPING SIZE E m p ty S e ctio n E m p ty S e ctio n 4 5 P itch P a cke d P a r t L o a d in g S e ctio n 5 0 P itch 3 5 P itch EN D T yp e 7" R eel 10" R eel ST AR T S ym b o l C O S iz e C a rd b o a rd P ap er T ap e 0 2 0 1( 0 6 0 3 ) 1 0 ,0 0 0 0 4 0 2( 1 0 0 5 ) 1 0 ,0 0 0 OT H ER S 4 ,00 0 - 1 0 ,0 0 0 0 4 0 2( 1 0 0 5 ) 5 0 ,0 0 0 OT H ER S 1 0 ,0 0 0 S iz e E A ll S ize ≤ 3 2 1 6 1 2 1 0 (3 2 2 5 ) ,1 8 0 8 ( 4 5 2 0) ( t≤ 1 .6 m m ) 1 2 1 0 (3 2 2 5 ) (t≥ 2 .0 m m ) 1 ,0 0 0 1 8 0 8 (4 5 2 0 ) (t≥ 2 .0 m m ) 1 ,0 0 0 A ll S ize ≤ 3 2 1 6 1 2 1 0 (3 2 2 5 ) ,1 8 0 8 ( 4 5 2 0) (t<1 .6 m m ) 12 1 0 ( 3 2 2 5 )( 1 .6 ≤ t<2 .0 m m ) 1 2 0 6 (3 2 1 6 )( 1 .6 ≤ t) 1 2 1 0 (3 2 2 5 ) ,1 8 0 8 ( 4 5 2 0) ( t≥ 2 .0 m m ) - - D 13" R eel L E m b o sse d P l a s ti c T a p e S ym b o l F 2 ,0 0 0 1 0 ,0 0 0 8 ,0 0 0 0 6 0 3( 1 6 0 8 ) 1 0 ,0 0 0 o r 1 5 ,0 0 0 0 8 0 5( 2 0 1 2 ) ( t≤ 0 .85 m m ) 1 2 0 6( 3 2 1 6 ) ( t≤ 0 .85 m m ) 1 5 ,0 0 0 o r 1 0 ,0 0 0 ( O p tio n ) 1 8 1 2 (4 5 3 2 ) (t≤ 2 .0 m m ) 4 ,0 0 0 4 ,0 0 0 1 0 ,0 0 0 1 8 1 2 ( 4 53 2 ) (t>2 .0 m m ) 5 7 5 0( 2 2 2 0 ) 2 ,0 0 0 General Capacitors D i m e n s i o n A PACKAGING ● REEL DIMENSION E C B R D W t unit : mm Symbol 7" Reel 13" Reel A B φ180+0/ -3 φ60+1/ -3 φ330±2.0 φ80+1/ -3 C D E W φ13 ±0.3 25 ±0.5 2.0± 0.5 9 ±1.5 t R 1.2± 0.2 2.2± 0.2 1.0 General Capacitors A ● BULK CASE PACKAGING - Bulk case packaging can reduce the stock space and transportation costs. - The bulk feeding system can increase the productivity. - It can eliminate the components loss. A B T C D E G H L I unit : mm Symbol A B T C D E Dimension 6.8±0.1 8.8±0.1 12±0.1 1.5+0.1/-0 2+0/-0.1 3.0+0.2/-0 Symbol F W G H L I Dimension 31.5+0.2/-0 36+0/-0.2 19±0.35 7±0.35 110±0.7 5±0.35 ● QUANTITY OF BULK CASE PACKAGING unit : pcs Size 04 02 (10 05 ) 06 03 (16 08 ) Quan tity 50 ,0 00 10 ,0 00 or 15,0 00 0 805 (2 012 ) T=0 .6 5m m T=0 .8 5m m 10 ,0 00 5 ,000 or 10 ,000 General Capacitors W F APPLICATION MANUAL ● ELECTRICAL CHARACTERISTICS ▶ CAPACITANCE - TEMPERATURE CHARACTERISTICS % 8 % C C 40 6 20 4 X5R S2L 2 -5 5 -40 -2 0 25 40 60 -6 0 -4 0 25 -2 0 100 125 COG Te m p .(oo C) 40 60 80 10 0 X7R 80 12 0 -2 0 -2 -4 0 -4 Y5V U 2J -6 0 -6 -8 0 -8 -1 0 ▶ CAPACITANCE - DC VOLTAGE CHARACTERISTICS ▶CAPACITANCE CHANGE - AGING C0G COG X7R 16V 10 C/C Δ [%] X5R 50V -60 -70 -80 -90 -100 X7R/X5R 5 X7R 50V Y5V 15 Y5V 10 20 30 40 50 1 Vdc 10 100 1000 10000 Time(hr) ▶ IMPEDANCE - FREQUENCY CHARACTERISTICS C0G Ohm Ohm 100 100 10 10 X7R /X5R /Y5V 0.001㎌ 0.01㎌ 0.1㎌ 1 1 10pF 100pF 0.1 0.1 1000pF 0.01 1.E+06 1MHz 1.E+07 10MHz 1.E+08 100MHz 1.E+09 1GHz 1.E+10 10GHz 0.01 1.E+06 1MHz 1.E+07 10MHz 1.E+08 100MHz 1.E+09 1GHz General Capacitors 20 10 C % 0 -10 -20 -30 -40 -50 ● STORAGE CONDITION ▶ Storage Environment The electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative humidity of less than 40℃ and 70%, respectively. Guaranteed storage period is within 6 months from the outgoing date of delivery. ▶ Corrosive Gases Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases. ▶ Temperature Fluctuations Since dew condensation may occur by the differences in temperature when the MLCCs are taken ● DESIGN OF LAND PATTERN When designing printed circuit boards, the shape and size of the lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder. In contrast, if too little solder is applied, the termination strength will be insufficiently. Use the following illustrations as guidelines for proper land design. Recommendation of Land Shape and Size. S o ld er R e sist S o ld er R e sist T W S o ld er Land b a 2/3 W < b < W 2/3 T < a < T General Capacitors out of storage, it is important to maintain the temperature-controlled environment. ● ADHESIVES When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions. ▶ Requirements for Adhesives They must have enough adhesion, so that, the chips will not fall off or move during the handling of the circuit board. They must maintain their adhesive strength when exposed to soldering temperature. They should not spread or run when applied to the circuit board. They should harden quickly. They should not corrode the circuit board or chip material. They should be a good insulator. They should be non-toxic, and not produce harmful gases, nor be harmful when touched. ▶ Application Method It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor adhesion and overflow into the land, respectively. Land a a b unit : mm Type 21 31 a 0.2 min 0.2 min b 70~100 ㎛ 70~100 ㎛ c > 0 > 0 PCB c c ▶ Adhesive hardening Characteristics To prevent oxidation of the terminations, the adhesive must harden at 160℃ or less, within 2 minutes or less. ● MOUNTING ▶ Mounting Head Pressure Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during mounting. General Capacitors Solder Resist ▶ Bending Stress When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the board. When the MLCCs are mounted onto the other side, it is important to support the board as shown in the illustration. If the circuit board is not supported, the crack occur to the ready-installed MLCCs by the bending stress. nozzle force support pin Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator's carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. ▶ Amount of Solder Too m uc h S olde r N ot eno ug h S olde r Goo d C rac k s tend to oc c ur due to larg e s tres s W eak hold ing forc e m ay c aus e bad c onne c tions or detac h ing of the c apac itor General Capacitors ▶ Manual Soldering ▶ Cooling Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference(△T) must be less than 100℃ ▶ Cleaning If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This means that the cleaning fluid must be carefully selected, and should always be new. ▶ Notes for Separating Multiple, Shared PC Boards. A multi-PC board is separated into many individual circuit boards after soldering has been completed. If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending often circuit board. General Capacitors ▶ Recommended Soldering Profile Reflow Pre-heating Soldering Temp.(℃ ) 260+0/-5℃ 10sec.max. Gradual cooling in the air 200℃ 150℃ Time(sec) Flow Pre-heating 260±3℃ Gradual Cooling 5 sec. max. in the air Soldering Temp. (℃) △T i) 1206(3216) and below : 150℃ max. Pre-heating Temp. (℃) Time (sec.) 120 sec. min. Variation of Temp. △T≤130 Soldering Pre-heating Soldering Cooling Temp (℃) Time (Sec) Time(Sec) Time(Sec) 300±10℃max ≥ 60 ≤ 4 - Condition of Iron facilities Wattage Tip Diameter Soldering Time 20W Max 3㎜ Max 4 Sec Max * Caution - Iron Tip Should Not Contact With Ceramic Body Directly. General Capacitors Soldering Iron