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Data Sheet
Schottky Barrier Diode
RBE2VA20A
lDimensions (Unit : mm)
lApplications
Rectifying Small Power
lLand size figure (Unit : mm)
1.1
0.17±0.1
0.05
2.5±0.2
1.9±0.1
lFeatures
1)Small Power Mold Type (TUMD2)
2)High reliability
0.8 0.5
2.0
1.3±0.05
TUMD2
lStructure
0.8±0.05
0.6±0.2
0.1
ROHM : TUMD2
dot (year week factory)
lTaping dimensions (Unit : mm)
0.25±0.05
8.0±0.2
2.75
1.43±0.05
lAbsolute maximum ratings (Tc=25C)
Parameter
Symbol
VRM
Reverse voltage (repetitive)
VR
Reverse voltage (DC)
Average rectified forward current
Io
IFSM
Forward current surge peak (60Hz・1cyc)
Junction temperature
Tj
Storage temperature
Tstg
lElectrical characteristics (Tj=25C)
Parameter
Symbol
VF1
Forward voltage
VF2
Reverse current
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IR
φ 1.0±0.2
0
4.0±0.1
Limits
30
20
2
5
125
0.9±0.08
Unit
V
V
A
A
C
C
-40 to +125
Min.
Typ.
Max.
Unit
-
-
0.39
V
IF=1A
-
-
0.46
V
-
-
700
μA
IF=2A
VR=20V
1/4
2.8±0.05
φ 1.55±0.1
0
1.75±0.1
2.0±0.05
3.5±0.05
4.0±0.1
Conditions
2011.10 - Rev.A
Data Sheet
RBE2VA20A
100
10
Ta=125°C
REVERSE CURRENT:IR(mA)
FORWARD CURRENT:IF(A)
Ta=125°C
1
Ta=75°C
0.1
Ta=25°C
0.01
10
Ta=75°C
1
Ta=25°C
0.1
Ta=-25°C
0.01
Ta=-25°C
0.001
0
100
200
300
400
0.001
500
5
10
15
20
25
30
450
1000
f=1MHz
440
FORWARD VOLTAGE:VF(mV)
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
0
REVERSE VOLTAGE：VR(V)
VR-IR CHARACTERISTICS
FORWARD VOLTAGE：VF(mV)
VF-IF CHARACTERISTICS
100
10
Ta=25°C
IF=2A
n=30pcs
430
420
410
AVE:397.8mV
400
390
380
370
360
1
0
5
10
15
20
25
350
30
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS
VF DISPERSION MAP
250
REVERSE CURRENT:IR(μA)
450
Ta=25°C
VR=20V
n=30pcs
400
350
AVE:254.3μA
300
250
200
150
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
500
Ta=25°C
f=1MHz
VR=0V
n=10pcs
240
230
220
AVE:211pF
210
100
50
200
0
Ct DISPERSION MAP
IR DISPERSION MAP
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2/4
2011.10 - Rev.A
30
50
1cyc
IFSM
40
REVERSE RECOVERY TIME:trr(ns)
PEAK SURGE
FORWARD CURRENT:IFSM(A)
Data Sheet
RBE2VA20A
8.3ms
AVE:25A
30
20
10
Ta=25°C
IF=0.5A
IR=1A
Irr=0.25*IR
n=10pcs
25
20
15
AVE:9.2ns
10
5
0
0
trr DISPERSION MAP
IFSM DISRESION MAP
50
50
45
IFSM
40
8.3ms
35
PEAK SURGE
FORWARD CURRENT:IFSM(A)
PEAK SURGE
FORWARD CURRENT:IFSM(A)
45
8.3ms
1cyc
30
25
20
15
10
t
35
30
25
20
15
10
5
5
0
IFSM
40
1
10
NUMBER OF CYCLES
IFSM-CYCLE CHARACTERISTICS
0
100
1
10
100
TIME:t(ms)
IFSM-t CHARACTERISTICS
2
10000
1.5
1000
Rth(j-a)
100
Rth(j-c)
FORWARD POWER
DISSIPATION:Pf(W)
TRANSIENT
THERMAL IMPEDANCE:Rth (°C/W)
Mounted on epoxy board
10
1
0.001
D=1/2
1
Sin(θ＝180)
0.5
0.01
0.1
1
10
100
0
1000
TIME:t(s)
Rth-t CHARACTERISTICS
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3/4
DC
0
0.5
1
1.5
2
2.5
AVERAGE RECTIFIED
FORWARD CURRENT：Io(A)
Io-Pf CHARACTERISTICS
3
3.5
2011.10 - Rev.A
Data Sheet
RBE2VA20A
3
5
0A
4.5
2
1.5
1
DC
Sin(θ＝180)
0.5
D=1/2
0
10
20
T
2.5
DC
D=1/2
2
1.5
1
Sin(θ＝180)
0
25
50
75
100
125
AMBIENT TEMPERATURE:Ta(°C)
DERATING CURVE (Io-Ta)
REVERSE VOLTAGE:VR(V)
VR-PR CHARACTERISTICS
5
30
Io
0A
0V
4
t
DC
3.5
T
No break at 30kV
25
VR
D=t/T
VR=10V
Tj=125°C
ELECTROSTATIC
DISCHARGE TEST ESD(KV)
4.5
AVERAGE RECTIFIED
FORWARD CURRENT:Io(A)
D=t/T
VR=10V
Tj=125°C
3
0
30
VR
t
3.5
0.5
0
Io
0V
4
AVERAGE RECTIFIED
FORWARD CURRENT:Io(A)
REVERSE POWER
DISSIPATION:PR (W)
2.5
3
D=1/2
2.5
2
1.5
Sin(θ＝180)
1
20
15
10
AVE:4.4kV
5
0.5
0
0
25
50
75
100
0
125
C=200pF
R=0Ω
CASE TEMPERATURE:Tc(°C)
DERATING CURVE (Io-Tc)
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C=100pF
R=1.5kΩ
ESD DISPERSION MAP
4/4
2011.10 - Rev.A
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
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(Note 1)
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intend to use our Products in devices requiring extremely high reliability (such as medical equipment
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Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
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CLASSⅢ
CLASSⅡb
CLASSⅢ
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[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
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Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
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This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
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isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
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1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
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Rev.001
Datasheet
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Rev.001