SC2516 Datasheet

SC2516
Complete Three-in-One DDR
Power Solution With BF_CUT
POWER MANAGEMENT
Description
Features
The SC2516 is a fully integrated, Three-in-One DDR Controller supplying power to the VDDQ, VTT and GMCH
rails. Two synchronous buck controller provide the VDDQ
and GMCH at high efficiency, while an internal linear regulator supplies the termination voltage with 1.8A(min)
Source/Sink capability.
‹ Uses Latched BF_Cut from Intel Glue Chip to
control regulators
‹ External VDDQ divider allows DDRI or DDRII Compatibility
‹ High efficiency VDDQ switcher
‹ External GMCH divider allows 1.5V or 1.25V pro-
The SC2516 uses the Intel® defined Latched BF_Cut
signal to comply with motherboard state transitions. The
regulator uses the 5VDUAL rail to supply VDDQ under all
motherboard states, via the VDDQ switcher. The GMCH
regulator is slaved off the 5V main regulator, using a separate UVLO on that rail. Additional logic and supervisory
circuitry complete the functionality of this single chip DDR
power solution in compliance with ACPI requirements.
‹
‹
‹
‹
‹
‹
The MLP package with a copper pad provides excellent ‹
thermal impedance while keeping small footprint. VDDQ
short circuit protection along with VTT current limit as
well as two independent thermal shutdown circuits assure safe operation under all fault conditions.
gramming
High efficiency GMCH switcher supplies programmed output from the 5V or 3.3V rail
Single chip solution complies fully with ACPI power
sequencing specifications
1.8A (min) VTT Source/Sink capability
High current 1Amp gate driver for VDDQ switcher
Independent thermal shutdown for VTT
Fast transient response
Space saving 22-pin MLP package with copper
thermal pad for heatsinking to PC Board
Applications
‹ Power Solution for DDR memory per Intel
motherboard specification
Typical Application Circuit
‹ High speed data line termination
12VCC
2
FBVDDQ
3
SS/EN
4
VTT
5
VDDQ
6
7
8
VDDQ
9
10
PGND
FBVDDQ
BG
SS/EN
TG
VTTGND
BST
VTT
5VSBY
VDDQ
COMP_GMCH
AGND
BF_CUT
VTTFB
TG_GMCH
REFSENS
BG_GMCH
FB_GMCH
GND_GMCH
SS_GMCH
23
11
COMP
TH _PAD
1
POK
5Vdual
22
21
VDDQ
20
19
18
5VSBY
FBVDDQ
17
16
15
Latched BF_CUT
3VCC
14
13
12
GMCH
SC2516
FB_GMCH
ATXPWR_OK
Revision 8, May. 2005
FB_GMCH
1
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SC2516
POWER MANAGEMENT
Absolute Maximum Ratings
Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified
in the Electrical Characteristics section is not implied.
Parameter
Symbol
Maximum
U nits
V BST
20
V
V 5V S B Y
7
V
I/O
5VSTBY +0.3, AGND -0.3
V
0.3
V
IO(VTT)
+/- 2
A
Operati ng Ambi ent Temperature Range
TA
0 to 70
o
C
Operati ng Juncti on Temperature
TJ
125
o
C
Thermal Resi stance Juncti on to Ambi ent
θJA
25
o
C /W
Thermal Resi stance Juncti on to C ase
θJC
4
o
C /W
TSTG
-65 to 150
Supply Voltage, BST to AGND
Standby Input Voltage
Inputs
AGND to PGND or LGND
VTT Output C urrent
Storage Temperature Range
o
C
TG/BG/TG_GMC H/BG_GMC H D C Voltage
BST + 0.3, PGND -0.3
V
TG/BG/TG_GMC H/BG_GMC H AC Voltage
BST + 1.0, PGND -4.0
t < 100 nS
(measured from 50% to 50%)
V
2
KV
ESD Rati ng (Human Body Model)
ESD
Electrical Characteristics
Unless specified: TA = 25 oC , 5VSBY = 5V
Parameter
Symbol
5VSBY Voltage
V 5V S B Y
Qui escent C urrent
IQ(5VSBY)
C onditions
Min
Typ
Max
U nits
4.5
5
5.5
V
BF_C UT low
12
16
BF_C UT Hi gh
8
10
mA
BF_C UT Threshold
0.8
TTL
2.4
V
P_OK Threshold
0.8
TTL
2.4
V
UVLO5VSBY
2.4
2.7
3
V
VREF
1.238
1.25
1.263
V
5VSBY Under Voltage Lockout
VD D Q Feedback Reference
IFB
VFB = 1.25V
-2
SS/EN Shutdown Threshold
VEN(TH)
VD D Q/VTT @ Shutdown
0.3
Thermal Shutdown
TJ-SHDN
150
o
C
Thermal Shutdown Hysteresi s
TJ-HYST
10
o
C
VD D Q Feedback C urrent
© 2005 Semtech Corp.
2
uA
0.5
V
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SC2516
POWER MANAGEMENT
Electrical Characteristics (Cont.)
Unless specified: TA = 25oC, 5VSBY = 5V.
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Switcher
Load Regulation
IVDDQ = 0A to 10A
Oscillator Frequency
fOSC
Soft Start Current
ISS
VSS = 800mV
0.2
%
225
250
275
KHz
20
25
30
uA
75
80
%
75
80
%
Maximum Duty Cycle
Overcurrent Trip Voltage
VTRIP
% of VDDQ Setpoint
Top Gate Rise Time
TGR
Gate capacitance = 4000pF
25
nS
Top Gate Fall Time
TGF
Gate capacitance = 4000pF
25
nS
Bottom Gate Rise Time
BGR
Gate capacitance = 4000pF
35
nS
Bottom Gate Fall Time
BGF
Gate capacitance = 4000pF
35
nS
70
Dead Time
td
20
50
80
nS
Error Amplifier Transconductance
Gm
0.8
1
1.2
mS
Error Amplifier Gain @ DC
AEA
Error Amplifier Bandwidth
GBW
Error Amplifier Source Current
Error Amplifier Sink Current
Internal Ramp
RCOMP = open
38
dB
5
MHz
FB = 0 , COMP = 1V
55
70
85
uA
FB = 1.5V , COMP = 1V
70
90
110
uA
VRAMP
Peak - to - Peak
0.55
VTT
VVDDQ = 2.500V
1.235
Source and Sink Currents
IVTT
VVDDQ = 2.500V
Source and Sink Currents
IVTT
∆VTT/ ∆I
V
VT T LDO
Output Voltage
Load Regulation
Error Amplifier Gain
AEA_VTT
Current Limit
VTTILIM
© 2005 Semtech Corp.
1.265
V
-1.8
+1.8
A
VVDDQ = 1.500V
-1.4
+1.4
A
IVTT =+1.8A to -1.8A
-1
+1
%
BF_CUT = low
3
1.250
75
dB
3
A
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SC2516
POWER MANAGEMENT
Electrical Characteristics (Cont.)
Unless specified: TA = 25oC,5VSBY = 5V.
Parameter
Symbol
Conditions
Min
Typ
Max
Units
1.238
1.25
1.263
V
GMCH Sw itcher
GMCH Feedback Reference
GMCH Feedback current
VREF_GMCH
VFB_GMCH = 1.25V
IFB_GMCH
IGMCH = 0A to 5A
Load Regulation
Oscillator Frequency
Soft start current
-2
fOSC
VSS = 200mV
ISS_GMCH
uA
0.2
%
225
250
275
KHz
8
10
12
uA
75
80
%
Maximum Duty Cycle
Top Gate Rise Time
TGR
Gate capacitance = 2000pF
40
nS
Top Gate Fall Time
TGF
Gate capacitance = 2000pF
40
nS
Bottom Gate Rise Time
BGR
Gate capacitance = 2000pF
40
nS
Bottom Gate Fall Time
BGF
Gate capacitance = 2000pF
40
nS
Dead Time
td
50
85
120
nS
Error Amplifier Transconductance
Gm
0.8
1
1.2
mS
Error Amplifier Gain @ DC
A EA
38
dB
Error Amplifier Bandwidth
GBW
1
MHz
VFB_GMCH = 0 - 1.5V, COMP = 1V
Error Amplifier Sink/Source Current
Internal Ramp
Peak - to - Peak
VRAMP
60
75
90
0.55
uA
V
Ordering Information
Pin Configuration
Part Numbers
Package
SC2516MLTR(1)
MLP-22
SC2516MLTRT(1),(2)
MLP-22
Notes:
(1) Only available in tape and reel packaging.
A reel contains 3000 devices.
(2) Lead free package. Device is fully WEEE and RoHS
compliant.
Note: Pin 23 is the thermal Pad on the bottom of the device
© 2005 Semtech Corp.
4
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SC2516
POWER MANAGEMENT
Pin Descriptions
Pin #
Pin Name
1
COMP
Compensation pin for the PWM transconductance amplifier for the VDDQ Switcher.
2
FBVDDQ
Feedback for the VDDQ regulator. Connect to the VDDQ sense at the point of load.
3
SS/EN
4
VTTGND
VTT return. Connect to copper plane carrying VTT return current. The trace connecting to this pin
must be able to carry 2 Amps.
5
VTT
VTT Regulator output. Regulates to 1/2 VDDQ. Sources or sinks 1.8 Amps. The trace connecting
to this pin must be able to carry 2 Amps.
6
VDDQ
VDDQ power input to VTT LDO. The trace connecting to this pin must be able to carry 2 Amps.
7
AGND
Analog ground. Compensation components and the Soft Start Capacitor connect to this ground.
8
VTTFB
Sense input for the VTT regulator. Connect to Point of Load for the VTT rail.
9
REFSNS
Sense input for the VDDQ rail. VTT will be regulated to 1/2 of its voltage. Connect to Point of
Load, where the VREF for the memory is generated.
10
FB_GMCH
Sense input for the GMCH. Connect to Point of Load for the GMCH rail.
11
SS_GMCH
Soft start for GMCH switcher . Connect a capacitor to GND.
12
POK
13
GND_GMCH
14
BG_GMCH
Bottom FET Gate drive for the GMCH regulator.
15
TG_GMCH
Top FET Gate drive for the GMCH regulator.
16
BF_CUT
17
Pin Function
Soft start capacitor to GND. Pull low to disable controller.
Connect to power OK signal from ATX power.
Gate Drive return Ground for the GMCH regulator. Connect to Source of bottom FET.
Latched BF_CUT input from Glue Chip.
COMP_GMCH Compensation pin for the PWM transconductance amplifier for the GMCH Switcher
18
5VSBY
19
BST
The Top and Bottom Gate drive bus.Generated using bootstrap diode/capacitor. An additional
diode is also required to trap the peak Bootstrap voltage for the BG drive. (see typical
application circuit)
20
TG
Top FET gate drive.
21
BG
Bottom FET gate drive.
22
PGND
23
TH_PAD
© 2005 Semtech Corp.
Connect to 5VSTBY input.
Gate drive return. Keep this pin close to bottom FET source.
Copper pad on bottom of chip used for heatsinking. It must be connected to ground plane under
IC.
5
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SC2516
POWER MANAGEMENT
Block Diagram
© 2005 Semtech Corp.
6
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SC2516
POWER MANAGEMENT
Timing Diagram
VCC_Rail
ATX _POK
BF_CUT
SS/EN
TG
BG
VDDQ
VTT
SS_GMCH
TG_GMCH
BG_GMCH
GMCH
S5
© 2005 Semtech Corp.
S0
S3
7
S0
S5
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SC2516
POWER MANAGEMENT
Application information
Description
The SEMTECH SC2516 DDR power supply controller is
the latest and most complete, Three in One switching
and linear regulator controller, providing the necessary
functions to comply with S3 and S5 sleep state signals
generated by the Desktop Computer Motherboards. The
SC2516 uses the Latched BF_CUT input signal which is
generated externally on IntelR P4 Motherboard glue chip
to comply with the power sequencing requirements.
Logically, the BF_CUT signal can be represented as:
Short Circuit Protection
Short circuit protection is implemented by sensing the
VDDQ output voltage. If it falls to 75% (typical) of its
nominal voltage, as sensed by the FB pin, the TG and BG
pins are latched off and the VDDQ switcher is shutdown.
It will shutdown the VTT also, since the VTT regulator is
fed from the VDDQ bus. To recover from the short circuit
protection mode, either the 5VSBY rail has to be recycled,
or the SS/EN pin must be pulled below 0.3V and
released to restart VDDQ switcher operation.
BF _ CUT = S 3 • P _ OK
GMCH Power Section
The SC2516 Switching controller supplies a 1.5V or 1.
25V GMCH (Graphic Memory Control Hub) voltage via a
standard synchronous BUCK converter typically
connected to the 5VCC or 3.3VCC power rail from Silverbox supply. Base on the basic advantage of switching
mode controller, The GMCH output current can support
up to 20A.
(For details of the Latched BF_CUT signal definition, refer
to Intel documentation).
Where S3 is the input to the Silver-box Supply for Suspend
to RAM, (S3=1 for Suspend to RAM) and P_OK is a signal
generated by the Silver-box supply, indicating that all rails
are within specification.
S3 and S5 States
During S3 and S5 sleep states, The operation of the
VDDQ and VTT is governed by the intelR specifications
with regards to the BF_CUT signal. The timing diagram
demonstrates the state of the controller and each of
the VDDQ, VTT and GMCH supplies during S3 and S5
transitions
VDDQ Power Section
SC2516 architecture eliminates the need for the BackFeed Cut MOSFET, since the VDDQ is always supplied
from the same input voltage bus (5V dual). The SC2516
is capable of driving a 4000pf capacitor in 25ns (typical,
top gate). This drive capability allows 15-20A DC load on
the VDDQ supply from the 5V main input rail.
Power Sequencing
Once BF_CUT signal low and P_OK signal goes high, The
VDDQ supply will be activated with S0 as well. The SS/
EN pin voltage is charged by internal constant current
source. When SS/EN voltage reaches to 0.3V (typical),
High side driver begins chopping and main power is
activated as an asynchronous Buck converter. When SS/
EN voltage reaches to 1.25V (typical), Low side driver
begins chopping and main power is activated as a
synchronous Buck converter.
When BF_CUT signal goes high (S3 state), the VDDQ
switcher is always on and is sourced by 5VSTBY rail during
this time.
When both BF_CUT and P_OK signals are low, The VDDQ
supply be disabled with S5 as well. Both high side and
low side drivers are pulled low.
© 2005 Semtech Corp.
Power Sequencing
Since the Chip-Set supply should come up before the
Active Memory cycle, the GMCH supply is sequenced with
the rising edge of the P_OK signal from Sliver-box supply.
Thus the GMCH regulator drivers are on when P_OK signal
is greater than its respective threshold. The external
MOSFET gates are pulled low when P_OK signal is lower
than its threshold. Thus the GMCH is disabled during S3
and S5 (See timing diagram).
VTT Rail
The VTT termination voltage is supplied via an internal
sink/source linear regulator when BF_CUT is low, and
the P_OK signal has met its threshold voltage and SS/
EN voltage reaches to 1V. When BF_CUT is high, the VTT
termination voltage is not needed and is thus tri-stated.
The VTT linear regulator is capable of sourcing and sinking
1.8 Amps (Minimum). It is recommended that one should
use at least 470uF low ESR capacitor and 1uF ceramic
capacitor (from VTT pin to Ground with short distance)
to ensure the stable operation.
Short Circuit Protection
The VTT regulator has two internal current limit circuits,
one for the sink and one for the source regulators. Both
current limits are set at 3Amp (typical). If maintained at
current limit, the internal regulators act like constant
current sources, and supply the max current until the
device temperature raises above thermal shutdown
thresholds, at which point that regulator shuts down.
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SC2516
POWER MANAGEMENT
Applications Information (Cont.)
The task here is to properly choose the compensation
network for a nicely shaped loop-gain Bode plot. The
following design procedures are recommended to accomplish the goal:
Gpwm
L
EA
R1
R
Vbg
1.25Vdc
(1) Calculate the corner frequency of the output filter:
Rc
Vin
Ro
Co
C
F o :=
R2
F esr :=
Compensation design of the VDDQ Channel
The control model of SC2516 VDDQ and GMCH section
can be depicted in Fig. 1. This model can also be used in
Spice kind of simulator to generate loop gain Bode plots.
The bandgap reference is 1.25 V and trimmed to +/-1%
accuracy. The desired output voltage can be achieved
by setting the resistive divider network, R1 and R2.
F esr <
0.001⋅ A
V
F x_over ≤
V ramp
1
s. R c. C o
s. R c. C o
L
Ro
2
s . L. C o . 1
F sw
5
If the transient specification is not stringent, it is better
to choose a crossover frequency that is less than one
tenth of the switching frequency for good noise immunity.
The resistor in the compensation network can then be
calculated as:
The total control loop-gain can then be derived as
follows:
Rc
⎛ F esr ⎞
R :=
⋅⎜
G pwm ⋅ V in⋅ G m ⎝ F o ⎠
1
Ro
where
⎛ V bg ⎞
2
⎛ F x_over ⎞ ⎛ V o ⎞
⋅⎜
⎝ F esr ⎠ ⎝ V bg ⎠
⋅⎜
when
T o := G m⋅ G pwm ⋅ V in⋅ R ⋅ ⎜
⎝ Vo ⎠
© 2005 Semtech Corp.
5
(4) Choose the loop gain cross over frequency (0 dB frequency). It is recommended that the crossover frequency
is always less than one fifth of the switching frequency :
where the ramp amplitude (peak-to-peak) is 0.55 volts .
1
F sw
1
G pwm
s . R. C .
.
s R. C
2⋅ π⋅ R c⋅ C o
If this condition is not met, the compensation structure
may not provide loop stability. The solution is to add
some electrolytic capacitors to the output capacitor bank
to correct the output filter corner frequency and the ESR
zero frequency. In some cases, the filter inductance may
also need to be adjusted to shift the filter corner
frequency. It is not recommended to use only high frequency multi-layer ceramic capacitors for output filter.
The compensation network includes a resistor and a capacitor in series, which terminates from the output of
the error amplifier to the ground. The PWM gain is inversion of the ramp amplitude, and this gain is given by:
1
1
(3) Check that the ESR zero frequency is not too high.
The error amplifier is transconductance type with fixed
gain of:
T( s ) T o .
2⋅ π⋅ L⋅ C o
(2) Calculate the ESR zero frequency of the output filter
capacitor:
Fig. 1. SC2516 small signal model.
G m :=
1
F o < F esr < F x_over
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SC2516
POWER MANAGEMENT
Applications Information (Cont.)
Step 1. Output filter corner frequency
or
R :=
Fo = 1.6 KHz
2
1
G pwm ⋅ V in⋅ G m
⎛ F o ⎞ ⎛ F x_over ⎞ ⎛ V o ⎞
⋅⎜
⋅⎜
⎝ F esr ⎠ ⎝ F o ⎠ ⎝ V bg ⎠
⋅⎜
Step 2. ESR zero frequency:
Fesr = 3.537 KHz
when
F esr < F o < F x_over
(5) The compensation capacitor is determined by choosing the compensator zero to be about one fifth of the
output filter corner frequency:
F zero
C
F o
Vo := 2.5⋅ V
Io := 20⋅ A
Fsw := 250⋅ KHz
L := 2.2⋅ µH
Co := 4500⋅ µF
Rc := 0.01⋅ Ω
Vbg := 1.25⋅ V
Vramp := 0.55⋅ V
Gm :=
© 2005 Semtech Corp.
0.001⋅ A
V
F sw
5
Which is satisfied in this case.
Fx_over = 50 KHz
zero
(6) The final step is to generate the Bode plot, either by
using the simulation model in Fig. 1 or using the equations provided here with Mathcad. The phase margin
can then be checked using the Bode plot. Usually, this
design procedure ensures a healthy phase margin.
(7) An additional capacitor should be reserved at the
compensation pin to ground to have another high frequency pole.
An example is given below to demonstrate the procedure introduced above. The parameters of the power
supply (typical for VDDQ section) are given as :
Vin := 5⋅ V
F esr <
Step 4. Choose crossover frequency and calculate
compensator R:
5
1
.
.
.
2 π R F
Step 3. Check the following condition:
R = 15 KΩ
Step 5. Calculate the compensator C:
C = 33 nF
Step 6. Generate Bode plot and check the phase margin.
In this case, the phase margin is about 85oC that ensures the loop stability. Fig. 2 shows the Bode plot of the
loop.
Compensation design of the GMCH Channel
The configuration of the PWM comparator of GMCH
channel is such that its inverter input is connected to
Comp_GMCH and the non-inverter input is connected
to the internal ramp. The peak voltage of the internal
ramp is 1.1V and the valley voltage is 0.55V. When
COMP_GMCH voltage is below 0.55V, the maximum duty
cycle will be generated by PWM comparator. If
COMP_GMCH voltage is over 1.1V then the minimum
duty cycle will be generated.
To ensure proper soft start function of the GMCH
channel, COMP_GMCH voltage must rise above 1.1V at
the beginning of soft start period quickly. So a higher
compensation gain is required. The following example
shows that by choosing the compensation parameters
as 15kOhm and 27nF for a typical output filter with
1~2uH inductor and 2000uF capacitor (ESR of 8~12
mOhm), the circuit will yield smooth soft start, stable
control loop, and satisfactory transient response. The
measured Bode plot of the loop gain is shown in Figure
3.
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SC2516
POWER MANAGEMENT
Applications Information (Cont.)
Loop Gain Mag (dB)
100
mag
50
( i)
0
50
10
100
3
1 . 10
4
1 . 10
5
1 . 10
6
1 . 10
5
1 . 10
6
1 . 10
Fi
Loop Gain Phase (Degree)
0
45
phase
( i)
90
135
180
10
100
3
1 . 10
4
1 . 10
Fi
Fig. 2. Bode plot of the VDDQ Channel
Fig. 3. Bode plot of the GMCH Channel
© 2005 Semtech Corp.
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SC2516
POWER MANAGEMENT
Typical application Schematic
FBVDDQ
SS/EN
VTT
C6
100n
C4 33n
C15
1uF
C1
100p
15K
1
2
3
4
6
5
VDDQ
7
C21
22nF
11
10
9
8
C16
1uF
R1
VDDQ
C18
1uF
FB_GMCH
U1
FBVDDQ
TG
BG
PGND
SS/EN
BST
COMP
VTTGND
AGND
VDDQ
TG_GMCH
BF_CUT
COMP_GMCH
5VSBY
VTTFB
BG_GMCH
VTT
REFSENS
FB_GMCH
SS_GMCH
GND_GMCH
POK
SC2516
C5
2.2nF
R2
2R2
22
21
Latched BF_CUT
C17 non pop.
27nF
5VSBY
2R2
C9
R3
R5 15K
20
19
18
17
16
15
14
13
12
ATXPWR_OK
D2
12VCC
D1
R7
2R2
2R2
C8
1uF
D3
1N4148
1N 4148
C13
1uF
1N 4148
R9
C7
Q1
5Vdual
1uF
3VCC
Q3
Q4
Q2
L1
L2
C2
C3
C20
1.5uH
C19
1.5uH
C10
C23
C11
C12
VDDQ
R4
1k
R6
1k
FBVDDQ
R10 FB_GMCH
1K
R8
200R
1.5V GMCH
C22
1500uF
1500uF
1500uF
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12
© 2005 Semtech Corp.
1500uF
1000uF
1500uF
1000uF
4.7uF
4.7uF
IP D 09N 03
IP D 09N 03
IP D 09N 03
IP D 09N 03
T H _PAD
23
C14
470uF
SC2516
POWER MANAGEMENT
Application Schematic for Intel Broadwater platform
FBVDDQ
SS/EN
0.9VTT
C6
100n
C4 33n
C15
1uF
C1
100p
15K
1
2
3
4
6
5
VDDQ
7
C21
22nF
11
10
9
8
C16
1uF
R1
VDDQ
C18
1uF
FB_GMCH
U2
FBVDDQ
TG
BG
PGND
SS/EN
BST
COMP
VTTGND
VDDQ
BF_CUT
COMP_GMCH
5VSBY
AGND
TG_GMCH
VTT
VTTFB
BG_GMCH
POK
GND_GMCH
REFSENS
FB_GMCH
SS_GMCH
SC2516
C5
2.2nF
R2
2R2
22
21
Latched BF_CUT
C17 non pop.
27nF
5VSBY
2R2
C9
R3
R5 15K
20
19
18
17
16
15
14
13
12
ATXPWR_OK
D2
12VCC
D1
R7
2R2
2R2
C8
1uF
D3
1N4148
1N 4148
C13
1uF
1N 4148
R9
C7
5Vdual
Q1
1uF Q2
3VCC
Q3
Q4
L1
L2
C2
C3
C20
1.2uH
C19
1.2uH
C10
C23
C11
C24
C12
C25
C26
C21
1.8VDDQ
R4
442R
FBVDDQ
R6
1k
FB_GMCH
R10
non. pop.
R8
0R
1.25V GMCH
C22
10uF
1500uF
1500uF
www.semtech.com
13
© 2005 Semtech Corp.
10uF
10uF
1500uF
10uF
1500uF
2200uF
1500uF
2200uF
4 .7u F
4.7uF
IP D 05N 03LA
IP D 05N 03LA
IP D 05N 03LA
IP D 05 N 03LA
T H _PAD
23
C14
470uF
SC2516
POWER MANAGEMENT
Outline Drawing - MLP-22
© 2005 Semtech Corp.
14
www.semtech.com
SC2516
POWER MANAGEMENT
Land Pattern- MLP-22
Contact Information
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2005 Semtech Corp.
15
www.semtech.com