PIC16F1713 DATA SHEET (01/13/2016) DOWNLOAD

PIC16(L)F1713/6
Cost Effective 8-Bit Intelligent Analog Flash Microcontrollers
Description:
PIC16(L)F1713/6 microcontrollers combine Intelligent Analog integration with low cost and extreme low power (XLP) to
suit a variety of general purpose applications. These 28-pin devices deliver on-chip op amps, Core Independent Peripherals (CLC, NCO and COG), Peripheral Pin Select and Zero-Cross Detect, providing for increased design flexibility.
Core Features:
Digital Peripherals:
• C Compiler Optimized RISC Architecture
• Only 49 Instructions
• Operating Speed:
- 0-32 MHz clock input
- 125 ns minimum instruction cycle
• Interrupt Capability
• 16-Level Deep Hardware Stack
• Up to Four 8-bit Timers
• One 16-bit Timer
• Power-on Reset (POR)
• Power-up Timer (PWRT)
• Low-Power Brown-out Reset (LPBOR)
• Programmable Watchdog Timer (WDT) up to
256s
• Programmable Code Protection
• Configurable Logic Cell (CLC):
- Integrated combinational and sequential logic
• Complementary Output Generator (COG):
- Rising/falling edge dead-band control/
blanking
• Numerically Controlled Oscillator (NCO):
- Generates true linear frequency control and
increased frequency resolution
- Input Clock: 0Hz < FNCO < 32 MHz
- Resolution: FNCO/220
• Capture/Compare/PWM (CCP) module
• PWM: Two 10-bit Pulse-Width Modulators
• Serial Communications:
- SPI, I2C, RS-232, RS-485, LIN compatible
- Auto-Baud Detect, auto-wake-up on start
• Up to 35 I/O Pins and One Input Pin:
- Individually programmable pull-ups
- Slew rate control
- Interrupt-on-change with edge-select
• Peripheral Pin Select (PPS):
- Enables pin mapping of digital I/O
Memory:
•
•
•
•
Up to 8 Kwords Flash Program Memory
Up to 1024 Bytes Data SRAM Memory
Direct, Indirect and Relative Addressing modes
High-Endurance Flash Data Memory (HEF)
- 128 bytes if nonvolatile data storage
- 100k erase/write cycles
Operating Characteristics:
• Operating Voltage Range:
- 1.8V to 3.6V (PIC16LF1713/6)
- 2.3V to 5.5V (PIC16F1713/6)
• Temperature Range:
- Industrial: -40°C to 85°C
- Extended: -40°C to 125°C
eXtreme Low-Power (XLP) Features:
•
•
•
•
Sleep mode: 50 nA @ 1.8V, typical
Watchdog Timer: 500 nA @ 1.8V, typical
Secondary Oscillator: 500 nA @ 32 kHz
Operating Current:
- 8 uA @ 32 kHz, 1.8V, typical
- 32 uA/MHz @ 1.8V, typical
 2013-2016 Microchip Technology Inc.
Intelligent Analog Peripherals:
• Operational Amplifiers:
- Two configurable rail-to-rail op amps
- Selectable internal and external channels
- 2 MHz gain bandwidth product
• High-Speed Comparators:
- Up to two comparators
- 50 ns response time
- Rail-to-rail inputs
• 10-Bit Analog-to-Digital Converter (ADC):
- Up to 28 external channels
- Conversion available during Sleep
- Temperature indicator
• Zero-Cross Detector (ZCD):
- Detect when AC signal on pin crosses
ground
• 8-Bit Digital-to-Analog Converter (DAC):
- Output available externally
- Internal connections to comparators, op
amps, Fixed Voltage Reference (FVR) and
ADC
• Internal Voltage Reference module
DS40001726C-page 1
PIC16(L)F1713/6
Clocking Structure:
Programming/Debug Features:
• 16 MHz Internal Oscillator Block:
- ±1% at calibration
- Selectable frequency range from 0 to 32 MHz
• 31 kHz Low-Power Internal Oscillator
• External Oscillator Block with:
- Three crystal/resonator modes up to 20 MHz
- Two external clock modes up to 20 MHz
• Fail-Safe Clock Monitor
• Two-Speed Oscillator Start-up
• Oscillator Start-up Timer (OST)
• In-Circuit Debug Integrated On-Chip
• Emulation Header for Advanced Debug:
- Provides trace, background debug and up to
32 hardware break points
• In-Circuit Serial Programming™ (ICSP™) via Two
Pins
Data Sheet Index
Program Memory
Flash (words)
Data SRAM
(bytes)
High-Endurance
Flash (bytes)
I/Os(2)
10-bit ADC (ch)
5/8-bit DAC
High-Speed/
Comparators
Op Amp
Zero Cross
Timers
(8/16-bit)
CCP
PWM
COG
EUSART
MSSP (I2C/SPI)
CLC
NCO
PPS
Debug(1)
XLP
PIC16(L)F1713/6 Family Types
PIC16(L)F1713
(1)
4096
512
128
25
17
1/1
2
2
1
4/1
2
2
1
1
1
4
1
Y
I/E
Y
PIC16(L)F1716
(1)
8192
1024
128
25
17
1/1
2
2
1
4/1
2
2
1
1
1
4
1
Y
I/E
Y
PIC16(L)F1717
(2)
8192
1024
128
36
28
1/1
2
2
1
4/1
2
2
1
1
1
4
1
Y
I/E
Y
PIC16(L)F1718
(2) 16384
2048
128
25
17
1/1
2
2
1
4/1
2
2
1
1
1
4
1
Y
I/E
Y
PIC16(L)F1719
(2) 16384
2048
128
36
28
1/1
2
2
1
4/1
2
2
1
1
1
4
1
Y
I/E
Y
Device
Note 1:
2:
Debugging Methods: (I) – Integrated on Chip; (H) – using Debug Header; E – using Emulation Header.
One pin is input-only.
Data Sheet Index: (Unshaded devices are described in this document.)
1: DS40001726
PIC16(L)F1713/6 Data Sheet, 28-Pin Flash, 8-bit Microcontrollers.
2: DS40001740
PIC16(L)F1717/8/9 Data Sheet, 28/40-Pin Flash, 8-bit Microcontrollers.
Note:
For other small form-factor package availability and marking information, please visit
http://www.microchip.com/packaging or contact your local sales office.
DS40001726C-page 2
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Pin Diagrams
28-PIN PDIP, SOIC, SSOP
1
28
RB7
RA0
2
27
RB6
RA1
3
26
RB5
RA2
4
25
RB4
RA3
5
RB3
RA4
6
24
23
22
21
RB1
RB0
20
VDD
RA5
VSS
7
RA7
9
RA6
Note:
8
10
RC0
11
RC1
RB2
19
VSS
18
RC7
12
17
RC6
RC2
13
16
RC5
RC3
14
15
RC4
See Table 1 for the pin allocation table.
28-PIN (U)QFN
28
27
26
25
24
23
22
RA1
RA0
FIGURE 2:
PIC16(L)F1713/6
VPP/MCLR/RE3
RE3/MCLR/VPP
RB7
RB6
RB5
RB4
FIGURE 1:
8
9
10
11
12
13
14
RC0
RA7
RA6
1
2
3
PIC16(L)F1713/6
4
5
6
7
Note:
21
20
19
18
17
16
15
RB3
RB2
RB1
RB0
VDD
VSS
RC7
RC1
RC2
RC3
RC4
RC5
RC6
RA2
RA3
RA4
RA5
VSS
See Table 1 for the pin allocation table.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 3
C1IN0+
C2IN0+
RA3
5
2
AN3
Vref+
C1IN1+
RA4
6
3
RA5
7
4
RA6
10
RA7
CLCIN0(1)
IOC
Y
CLCIN1(1)
IOC
Y
IOC
Y
DAC1OUT1
Basic
Vref-
Pull-up
AN2
Interrupt
1
OPA1OUT
CLC
4
EUSART
RA2
MSSP
C1IN1C2IN1-
COG
AN1
PWM
28
NCO
3
CCP
RA1
Timers
C1IN0C2IN0-
Zero Cross
AN0
DAC
ADC
27
Op Amp
QFN, UQFN
2
Reference
PDIP, SOIC,
SSOP
RA0
(2)
I/O
Comparator
28-PIN ALLOCATION TABLE (PIC16(L)F1713/6)
IOC
Y
IOC
Y
IOC
Y
7
IOC
Y
OSC2
CLKOUT
9
6
IOC
Y
OSC1
CLKIN
RB0
21
18
AN12
C2IN1+
INT(1)
IOC
Y
RB1
22
19
AN10
C1IN3C2IN3-
OPA2OUT
IOC
Y
RB2
23
20
AN8
OPA2IN-
IOC
Y
OPA2IN+
IOC
Y
AN4
RB3
24
21
AN9
RB4
25
22
AN11
RB5
26
23
AN13
RB6
27
24
RB7
28
(1)
OPA1IN+
OPA1IN-
C1IN2C2IN2-
T0CKI
nSS(1)
DAC2OUT1
COG1IN(1)
ZCD
 2013-2016 Microchip Technology Inc.
IOC
Y
IOC
Y
CLCIN2(1)
IOC
Y
ICSPCLK
(1)
IOC
Y
ICSPDAT
IOC
Y
CCP2(1)
IOC
Y
(1)
IOC
Y
IOC
Y
(1)
T1G
DAC1OUT2
DAC2OUT2
25
CLCIN3
(1)
RC0
11
T1CKI
SOSCO
8
RC1
12
9
RC2
13
10
AN14
SOSCI
RC3
14
11
AN15
CCP1
SCL/ SCK
Note 1: Default peripheral input. Alternate pins can be selected as the peripheral input with the PPS input selection registers.
2: All pin digital outputs default to PORT latch data. Alternate outputs can be selected as the peripheral digital output with the PPS output selection registers.
3: These peripheral functions are bidirectional. The output pin selections must be the same as the input pin selections.
4: Alternate outputs are excluded from solid shaded areas.
5: Alternate inputs are excluded from dot shaded areas.
(1)
PIC16(L)F1713/6
DS40001726C-page 4
TABLE 1:
(3)
RC7
18
15
AN19
RX(3)
RE3
1
26
Vdd
20
17
Vdd
8
5
Vss
19
16
CLC
MSSP
COG
NCO
CCP
Timers
IOC
Y
IOC
Y
IOC
Y
IOC
Y
IOC
Y
Basic
CK
Pull-up
AN18
Interrupt
AN17
14
EUSART
13
17
PWM
16
RC6
Zero Cross
RC5
DAC
AN16
Op Amp
ADC
Comparator
QFN, UQFN
12
Reference
PDIP, SOIC,
SSOP
15
(2)
I/O
(1)
TX/CK
DT(3)
CLC4OUT
CLC3OUT
CLC2OUT
CLC1OUT
RX(3)
CK
CLCIN0
CLCIN1
CLCIN2
CLCIN3
SCK/SCL
MCLR
Vpp
INT
SDO
SS
(3)
SCK/SCL
(3)
SDA
(3)
SDI
COG1D
COG1B
COG1C
COG1IN
COG1A
PWM4OUT
PWM3OUT
CCP2
CCP2
NCO1OUT
CCP1
CCP1
T0CKI
T1CKI
IN(5)
T1G
OUT(4)
SDA(1)
C2OUT
Vss
SDI
C1OUT
 2013-2016 Microchip Technology Inc.
RC4
Note 1: Default peripheral input. Alternate pins can be selected as the peripheral input with the PPS input selection registers.
2: All pin digital outputs default to PORT latch data. Alternate outputs can be selected as the peripheral digital output with the PPS output selection registers.
3: These peripheral functions are bidirectional. The output pin selections must be the same as the input pin selections.
4: Alternate outputs are excluded from solid shaded areas.
DS40001726C-page 5
PIC16(L)F1713/6
5: Alternate inputs are excluded from dot shaded areas.
PIC16(L)F1713/6
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 8
2.0 Enhanced Mid-Range CPU ........................................................................................................................................................ 13
3.0 Memory Organization ................................................................................................................................................................. 15
4.0 Device Configuration .................................................................................................................................................................. 46
5.0 Resets ........................................................................................................................................................................................ 52
6.0 Oscillator Module (with Fail-Safe Clock Monitor) ....................................................................................................................... 60
7.0 Interrupts .................................................................................................................................................................................... 78
8.0 Power-Down Mode (Sleep) ........................................................................................................................................................ 91
9.0 Watchdog Timer (WDT) ............................................................................................................................................................. 95
10.0 Flash Program Memory Control ............................................................................................................................................... 100
11.0 I/O Ports ................................................................................................................................................................................... 116
12.0 Peripheral Pin Select (PPS) Module ........................................................................................................................................ 134
13.0 Interrupt-On-Change ................................................................................................................................................................ 140
14.0 Fixed Voltage Reference (FVR) .............................................................................................................................................. 149
15.0 Temperature Indicator Module ................................................................................................................................................. 152
16.0 Comparator Module.................................................................................................................................................................. 154
17.0 Pulse Width Modulation (PWM) ............................................................................................................................................... 163
18.0 Complementary Output Generator (COG) Module................................................................................................................... 169
19.0 Configurable Logic Cell (CLC).................................................................................................................................................. 203
20.0 Numerically Controlled Oscillator (NCO) Module ..................................................................................................................... 220
21.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 229
22.0 Operational Amplifier (OPA) Modules ...................................................................................................................................... 243
23.0 8-Bit Digital-to-Analog Converter (DAC1) Module .................................................................................................................... 246
24.0 5-Bit Digital-to-Analog Converter (DAC2) Module .................................................................................................................... 250
25.0 Timer0 Module ......................................................................................................................................................................... 254
26.0 Timer1 Module with Gate Control............................................................................................................................................. 257
27.0 Timer2/4/6 Module ................................................................................................................................................................... 268
28.0 Zero-Cross Detection (ZCD) Module........................................................................................................................................ 273
29.0 Capture/Compare/PWM Modules ............................................................................................................................................ 277
30.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 285
31.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 337
32.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 368
33.0 Instruction Set Summary .......................................................................................................................................................... 370
34.0 Electrical Specifications............................................................................................................................................................ 384
35.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 418
36.0 Development Support............................................................................................................................................................... 441
37.0 Packaging Information.............................................................................................................................................................. 445
Appendix A: Data Sheet Revision History......................................................................................................................................... 460
DS40001726C-page 6
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
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The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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 2013-2016 Microchip Technology Inc.
DS40001726C-page 7
PIC16(L)F1713/6
DEVICE OVERVIEW
TABLE 1-1:
DEVICE PERIPHERAL
SUMMARY
Peripheral
PIC16(L)F1716
The PIC16(L)F1713/6 are described within this data
sheet. They are available in 28-pin SPDIP, SSOP,
SOIC, QFN, and UQFN packages. Figure 1-1 shows a
block diagram of the PIC16(L)F1713/6 devices.
Table 1-2 shows the pinout descriptions.
PIC16(L)F1713
1.0
Analog-to-Digital Converter (ADC)
●
●
Complementary Output Generator (COG)
●
●
Fixed Voltage Reference (FVR)
●
●
Zero-Cross Detection (ZCD)
●
●
Temperature Indicator
●
●
Numerically Controlled Oscillator (NCO)
●
●
DAC1
●
●
DAC2
●
●
Reference Table 1-1 for peripherals available per device.
Digital-to-Analog Converter (DAC)
Capture/Compare/PWM (CCP/ECCP) Modules
CCP1
●
●
CCP2
●
●
C1
●
●
C2
●
●
CLC1
●
●
CLC2
●
●
CLC3
●
●
CLC4
●
●
Comparators
Configurable Logic Cell (CLC)
Enhanced Universal Synchronous/Asynchronous
Receiver/Transmitter (EUSART)
EUSART
●
●
MSSP
●
●
Op Amp 1
●
●
Op Amp 2
●
●
PWM3
●
●
PWM4
●
●
Timer0
●
●
Timer1
●
●
Timer2
●
●
Master Synchronous Serial Ports
Op Amp
Pulse Width Modulator (PWM)
Timers
DS40001726C-page 8
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 1-1:
PIC16(L)F1713/6 BLOCK DIAGRAM
Program
Flash Memory
RAM
PORTA
PORTB
CLKOUT
Timing
Generation
HFINTOSC/
LFINTOSC
Oscillator
CLKIN
PORTC
CPU
Figure 2-1
MCLR
NCO
ZCD
Op Amps
PWM
Timer0
Timer1
Timer2
MSSP
Comparators
COG
Temp.
Indicator
Note
1:
ADC
10-Bit
FVR
DACs
CCPs
EUSART
CLCs
See applicable chapters for more information on peripherals.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 9
PIC16(L)F1713/6
TABLE 1-2:
PIC16(L)F1713/6 PINOUT DESCRIPTION
Name
RA0/AN0/C1IN0-/C2IN0-/
CLCIN0(1)
RA1/AN1/C1IN1-/C2IN1-/
OPA1OUT/CLCIN1(1)
RA2/AN2/VREF-/C1IN0+/C2IN0+/
DAC1OUT1
Function
RA0
AN0
RA4/OPA1IN+/T0CKI(1)
RA5/AN4/OPA1IN-/DAC2OUT1/
SS(1)
RA6/OSC2/CLKOUT
RA7/OSC1/CLKIN
RB0/AN12/C2IN1+/ZCD/
COGIN(1)
Output
Type
Description
TTL/ST CMOS General purpose I/O.
AN
—
ADC Channel 0 input.
C1IN0-
AN
—
Comparator C2 negative input.
C2IN0-
AN
—
Comparator C3 negative input.
CLCIN0
TTL/ST
—
Configurable Logic Cell source input.
RA1
TTL/ST CMOS General purpose I/O.
AN1
AN
—
ADC Channel 1 input.
C1IN1-
AN
—
Comparator C1 negative input.
C2IN1-
AN
—
Comparator C2 negative input.
OPA1OUT
—
AN
Operational Amplifier 1 output.
CLCIN1
TTL/ST
—
Configurable Logic Cell source input.
RA2
TTL/ST CMOS General purpose I/O.
AN2
AN
—
ADC Channel 2 input.
VREF-
AN
—
ADC Negative Voltage Reference input.
C1IN0+
AN
—
Comparator C2 positive input.
C2IN0+
AN
—
Comparator C3 positive input.
—
AN
Digital-to-Analog Converter output.
DAC1OUT1
RA3/AN3/VREF+/C1IN1+
Input
Type
RA3
TTL/ST CMOS General purpose I/O.
AN3
AN
—
ADC Channel 3 input.
VREF+
AN
—
ADC Voltage Reference input.
C1IN1+
AN
—
Comparator C1 positive input.
RA4
TTL/ST CMOS General purpose I/O.
OPA1IN+
AN
—
Operational Amplifier 1 non-inverting input.
T0CKI
TTL/ST
—
Timer0 gate input.
RA5
TTL/ST CMOS General purpose I/O.
AN4
AN
—
ADC Channel 4 input.
OPA1IN-
AN
—
Operational Amplifier 1 inverting input.
DAC2OUT1
—
AN
Digital-to-Analog Converter output.
SS
TTL/ST
—
Slave Select enable input.
RA6
TTL/ST CMOS General purpose I/O.
OSC2
—
CLKOUT
—
RA7
XTAL
TTL/ST CMOS General purpose I/O.
OSC1
—
XTAL
CLKIN
TTL/ST
—
RB0
Crystal/Resonator (LP, XT, HS modes).
CMOS FOSC/4 output.
Crystal/Resonator (LP, XT, HS modes).
External clock input (EC mode).
TTL/ST CMOS General purpose I/O.
AN12
AN
—
ADC Channel 12 input.
C2IN1+
AN
—
Comparator C2 positive input.
ZCD
AN
—
Zero-Cross Detection Current Source/Sink.
COGIN
TTL/ST
—
Complementary Output Generator input.
Legend: AN = Analog input or output CMOS = CMOS compatible input or output
OD = Open-Drain
TTL = TTL compatible input ST
= Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C
HV = High Voltage
XTAL = Crystal levels
Note 1: Default peripheral input. Alternate pins can be selected as the peripheral input with the PPS input selection registers.
2: All pin digital outputs default to PORT latch data. Alternate outputs can be selected as the peripheral digital output with
the PPS output selection registers.
3: These peripheral functions are bidirectional. The output pin selections must be the same as the input pin selections.
DS40001726C-page 10
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 1-2:
PIC16(L)F1713/6 PINOUT DESCRIPTION (CONTINUED)
Name
RB1/AN10/C1IN3-/C2IN3-/
OPA2OUT
RB2/AN8/OPA2IN-
RB3/AN9/C1IN2-/C2IN2-/
OPA2IN+
RB4/AN11
Function
RB1
RB7/DAC1OUT2/DAC2OUT2/
CLCIN3(1)/ICSPDAT
RC1/SOSCI/CCP2(1)
AN
—
ADC Channel 10 input.
—
Comparator C1 negative input.
C2IN3-
AN
—
Comparator C2 negative input.
OPA2OUT
—
AN
Operational Amplifier 2 output.
RB2
AN
—
ADC Channel 8 input.
OPA2IN-
AN
—
Operational Amplifier 2 inverting input.
RB3
TTL/ST CMOS General purpose I/O.
AN9
AN
—
ADC Channel 9 input.
C1IN2-
AN
—
Comparator C1 negative input.
C2IN2-
AN
—
Comparator C2 negative input.
OPA2IN+
AN
—
Operational Amplifier 2 non-inverting input.
RB4
RB5
TTL/ST CMOS General purpose I/O.
AN
—
ADC Channel 11 input.
TTL/ST CMOS General purpose I/O.
AN
—
ADC Channel 13 input.
T1G
TTL/ST
—
Timer1 gate input.
RB6
TTL/ST CMOS General purpose I/O.
CLCIN2
TTL/ST
—
Configurable Logic Cell source input.
ICSPCLK
ST
—
Serial Programming Clock.
RB7
DAC1OUT2
TTL/ST CMOS General purpose I/O.
—
AN
DAC2OUT2
—
AN
Digital-to-Analog Converter output.
CLCIN3
TTL/ST
—
Configurable Logic Cell source input.
RC0
ST
CMOS ICSP™ Data I/O.
T1CKI
TTL/ST
—
XTAL
XTAL
RC1
RC2
Digital-to-Analog Converter output.
TTL/ST CMOS General purpose I/O.
SOSCO
CCP2
RC3/AN15/SCL/SCK(1)
TTL/ST CMOS General purpose I/O.
AN8
SOSCI
RC2/AN14/CCP1(1)
TTL/ST CMOS General purpose I/O.
AN
ICSPDAT
RC0/T1CKI(1)/SOSCO
Description
AN10
AN13
RB6/CLCIN2(1)/ICSPCLK
Output
Type
C1IN3-
AN11
RB5/AN13/T1G(1)
Input
Type
Timer1 clock input.
Secondary Oscillator Connection.
TTL/ST CMOS General purpose I/O.
XTAL
XTAL
TTL/ST
—
Secondary Oscillator Connection.
Capture input
TTL/ST CMOS General purpose I/O.
AN14
AN
—
ADC Channel 14 input.
CCP1
TTL/ST
—
Capture input
RC3
TTL/ST CMOS General purpose I/O.
AN15
AN
—
ADC Channel 15 input.
SCL/SCK
I2C
—
I2C/SPI clock input.
Legend: AN = Analog input or output CMOS = CMOS compatible input or output
OD = Open-Drain
TTL = TTL compatible input ST
= Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C
HV = High Voltage
XTAL = Crystal levels
Note 1: Default peripheral input. Alternate pins can be selected as the peripheral input with the PPS input selection registers.
2: All pin digital outputs default to PORT latch data. Alternate outputs can be selected as the peripheral digital output with
the PPS output selection registers.
3: These peripheral functions are bidirectional. The output pin selections must be the same as the input pin selections.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 11
PIC16(L)F1713/6
TABLE 1-2:
PIC16(L)F1713/6 PINOUT DESCRIPTION (CONTINUED)
Name
RC4/AN16/SDI(1)/SDA(1)
RC5/AN17
Function
RC4
RC7/AN19/RX(1)
RE3/MCLR/VPP
VDD
OUT
Description
TTL/ST CMOS General purpose I/O.
AN
—
ADC Channel 16 input.
SDI
TTL/ST
—
SPI Data input
SDA
I2C
—
I2C Data input
RC5
RC6
TTL/ST CMOS General purpose I/O.
AN
AN
CK
TTL/ST
RC7
—
ADC Channel 17 input.
TTL/ST CMOS General purpose I/O.
AN16
—
ADC Channel 16 input.
EUSART synchronous clock
TTL/ST CMOS General purpose I/O.
AN18
AN
—
ADC Channel 18 input.
RX
TTL/ST
—
EUSART receive
RE3
TTL/ST
—
General purpose input.
MCLR
ST
—
Master clear input
VPP
HV
—
Programming enable
VDD
Power
—
Positive supply
Power
—
Ground reference
VSS
(2)
Output
Type
AN16
AN17
RC6/AN18/CK(1)
Input
Type
C1OUT
CMOS Comparator 1 output
C2OUT
CMOS Comparator 2 output
CCP1
CMOS Compare/PWM1 output
CCP2
CMOS Compare/PWM2 output
NCO1OUT
CMOS Numerically controlled oscillator output
PWM3OUT
CMOS PWM3 output
PWM4OUT
COGA
CMOS PWM4 output
CMOS Complementary output generator output A
COGB
CMOS Complementary output generator output B
COGC
CMOS Complementary output generator output C
COGD
CMOS Complementary output generator output D
SDA(3)
SCK
SCL(3)
SDO
TX/CK
DT(3)
OD
I2C Data output
CMOS SPI clock output
OD
I2C clock output
CMOS SPI data output
CMOS EUSART asynchronous TX data/synchronous clock out
CMOS EUSART synchronous data output
CLC1OUT
CMOS Configurable logic cell 1 output
CLC2OUT
CMOS Configurable logic cell 2 output
CLC3OUT
CMOS Configurable logic cell 3 output
CLC4OUT
CMOS Configurable logic cell 4 output
Legend: AN = Analog input or output CMOS = CMOS compatible input or output
OD = Open-Drain
TTL = TTL compatible input ST
= Schmitt Trigger input with CMOS levels I2C = Schmitt Trigger input with I2C
HV = High Voltage
XTAL = Crystal levels
Note 1: Default peripheral input. Alternate pins can be selected as the peripheral input with the PPS input selection registers.
2: All pin digital outputs default to PORT latch data. Alternate outputs can be selected as the peripheral digital output with
the PPS output selection registers.
3: These peripheral functions are bidirectional. The output pin selections must be the same as the input pin selections.
DS40001726C-page 12
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
2.0
Relative addressing modes are available. Two File
Select Registers (FSRs) provide the ability to read
program and data memory.
ENHANCED MID-RANGE CPU
This family of devices contain an enhanced mid-range
8-bit CPU core. The CPU has 49 instructions. Interrupt
capability includes automatic context saving. The
hardware stack is 16 levels deep and has Overflow and
Underflow Reset capability. Direct, Indirect, and
FIGURE 2-1:
•
•
•
•
Automatic Interrupt Context Saving
16-level Stack with Overflow and Underflow
File Select Registers
Instruction Set
CORE BLOCK DIAGRAM
15
Configuration
15
MUX
Flash
Program
Memory
Program
Bus
16-Level
8 Level Stack
Stack
(13-bit)
(15-bit)
14
Instruction
Instruction Reg
reg
8
Data Bus
Program Counter
RAM
Program Memory
Read (PMR)
12
RAM Addr
Addr MUX
Direct Addr 7
5
Indirect
Addr
12
12
BSR
FSR Reg
reg
15
FSR0reg
Reg
FSR
FSR1
Reg
FSR reg
15
STATUS Reg
reg
STATUS
8
3
Power-up
Timer
OSC1/CLKIN
OSC2/CLKOUT
Instruction
Decodeand
&
Decode
Control
Timing
Generation
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
MUX
ALU
8
W reg
Internal
Oscillator
Block
VDD
 2013-2016 Microchip Technology Inc.
VSS
DS40001726C-page 13
PIC16(L)F1713/6
2.1
Automatic Interrupt Context
Saving
During interrupts, certain registers are automatically
saved in shadow registers and restored when returning
from the interrupt. This saves stack space and user
code. See Section 7.5 “Automatic Context Saving”
for more information.
2.2
16-Level Stack with Overflow and
Underflow
These devices have a hardware stack memory 15 bits
wide and 16 words deep. A Stack Overflow or Underflow will set the appropriate bit (STKOVF or STKUNF)
in the PCON register, and if enabled, will cause a software Reset. See Section 3.6 “Stack” for more details.
2.3
File Select Registers
There are two 16-bit File Select Registers (FSR). FSRs
can access all file registers and program memory,
which allows one Data Pointer for all memory. When an
FSR points to program memory, there is one additional
instruction cycle in instructions using INDF to allow the
data to be fetched. General purpose memory can now
also be addressed linearly, providing the ability to
access contiguous data larger than 80 bytes. There are
also new instructions to support the FSRs. See
Section 3.7 “Indirect Addressing” for more details.
2.4
Instruction Set
There are 49 instructions for the enhanced mid-range
CPU to support the features of the CPU. See
Section 33.0 “Instruction Set Summary” for more
details.
DS40001726C-page 14
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
3.0
MEMORY ORGANIZATION
These devices contain the following types of memory:
• Program Memory
- Configuration Words
- Device ID
- User ID
- Flash Program Memory
• Data Memory
- Core Registers
- Special Function Registers
- General Purpose RAM
- Common RAM
3.1
The enhanced mid-range core has a 15-bit program
counter capable of addressing a 32K x 14 program
memory space. Table 3-1 and Table 3-2 show the
memory sizes implemented for the PIC16(L)F1713/6
family. Accessing a location above these boundaries will
cause a wrap-around within the implemented memory
space. The Reset vector is at 0000h and the interrupt
vector is at 0004h (see Figure 3-1).
3.2
Note 1: The method to access Flash memory
through the PMCON registers is described
in Section 10.0 “Flash Program Memory
Control”.
Program Memory Organization
High Endurance Flash
This device has a 128-byte section of high-endurance
program Flash memory (PFM) in lieu of data EEPROM.
This area is especially well suited for nonvolatile data
storage that is expected to be updated frequently over
the life of the end product. See Section 10.2 “Flash
Program Memory Overview” for more information on
writing data to PFM. See Section 3.2.1.2 “Indirect
Read with FSR” for more information about using the
FSR registers to read byte data stored in PFM.
The following features are associated with access and
control of program memory and data memory:
• PCL and PCLATH
• Stack
• Indirect Addressing
TABLE 3-1:
DEVICE SIZES AND ADDRESSES
Program Memory Space
(Words)
Last Program Memory
Address
High-Endurance Flash
Memory Address Range(1)
PIC16(L)F1713
4,096
FFFh
F80h-FFFh
PIC16(L)F1716
16,384
3FFFh
3F80h-3FFFh
Device
Note 1:
High-endurance Flash applies to the low byte of each address in the range.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 15
PIC16(L)F1713/6
FIGURE 3-1:
PROGRAM MEMORY MAP
AND STACK FOR
PIC16(L)F1713
FIGURE 3-2:
PROGRAM MEMORY MAP
AND STACK FOR
PIC16(L)F1716
Rev. 10-000040E
7/30/2013
Rev. 10-000040B
7/30/2013
PC<14:0>
PC<14:0>
CALL, CALLW
RETURN, RETLW
Interrupt, RETFIE
CALL, CALLW
RETURN, RETLW
Interrupt, RETFIE
15
15
Stack Level 0
Stack Level 0
Stack Level 1
Stack Level 1
Stack Level 15
Stack Level 15
Reset Vector
0000h
Interrupt Vector
0004h
0005h
Reset Vector
0000h
Interrupt Vector
0004h
0005h
Page 0
07FFh
0800h
Page 0
07FFh
0800h
Page 1
0FFFh
1000h
Page 1
On-chip
Program
Memory
0FFFh
1000h
Page 2
17FFh
1800h
On-chip
Program
Memory
Page 2
17FFh
1800h
Page 3
Page 3
Rollover to Page 0
1FFFh
2000h
Page 4
Page 7
Rollover to Page 3
DS40001726C-page 16
1FFFh
2000h
Rollover to Page 0
3FFFh
4000h
Rollover to Page 7
7FFFh
7FFFh
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
3.2.1
READING PROGRAM MEMORY AS
DATA
There are two methods of accessing constants in
program memory. The first method is to use tables of
RETLW instructions. The second method is to set an
FSR to point to the program memory.
3.2.1.1
RETLW Instruction
The RETLW instruction can be used to provide access
to tables of constants. The recommended way to create
such a table is shown in Example 3-1.
EXAMPLE 3-1:
constants
BRW
RETLW
RETLW
RETLW
RETLW
DATA0
DATA1
DATA2
DATA3
RETLW INSTRUCTION
;Add Index in W to
;program counter to
;select data
;Index0 data
;Index1 data
my_function
;… LOTS OF CODE…
MOVLW
DATA_INDEX
call constants
;… THE CONSTANT IS IN W
The BRW instruction makes this type of table very
simple to implement. If your code must remain portable
with previous generations of microcontrollers, then the
BRW instruction is not available so the older table read
method must be used.
3.2.1.2
Indirect Read with FSR
The program memory can be accessed as data by
setting bit 7 of the FSRxH register and reading the
matching INDFx register. The MOVIW instruction will
place the lower eight bits of the addressed word in the
W register. Writes to the program memory cannot be
performed via the INDF registers. Instructions that
access the program memory via the FSR require one
extra instruction cycle to complete. Example 3-2
demonstrates accessing the program memory via an
FSR.
EXAMPLE 3-2:
ACCESSING PROGRAM
MEMORY VIA FSR
constants
DW DATA0
;First constant
DW DATA1
;Second constant
DW DATA2
DW DATA3
my_function
;… LOTS OF CODE…
MOVLW DATA_INDEX
ADDLW LOW constants
MOVWF FSR1L
MOVLW HIGH constants;MSb sets
automatically
MOVWF FSR1H
BTFSC STATUS, C
;carry from ADDLW?
INCF
FSR1H, f
;yes
MOVIW 0[FSR1]
;THE PROGRAM MEMORY IS IN W
3.3
Data Memory Organization
The data memory is partitioned in 32 memory banks
with 128 bytes in a bank. Each bank consists of
(Figure 3-3):
•
•
•
•
12 core registers
20 Special Function Registers (SFR)
Up to 80 bytes of General Purpose RAM (GPR)
16 bytes of common RAM
The active bank is selected by writing the bank number
into the Bank Select Register (BSR). Unimplemented
memory will read as ‘0’. All data memory can be
accessed either directly (via instructions that use the
file registers) or indirectly via the two File Select
Registers (FSR). See Section 3.7 “Indirect
Addressing” for more information.
Data memory uses a 12-bit address. The upper five bits
of the address define the Bank address and the lower
seven bits select the registers/RAM in that bank.
The high directive will set bit<7> if a label points to a
location in program memory.
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DS40001726C-page 17
PIC16(L)F1713/6
3.3.1
CORE REGISTERS
The core registers contain the registers that directly
affect the basic operation. The core registers occupy
the first 12 addresses of every data memory bank
(addresses x00h/x08h through x0Bh/x8Bh). These
registers are listed below in Table 3-2. For detailed
information, see Table 3-10.
TABLE 3-2:
CORE REGISTERS
Addresses
BANKx
x00h or x80h
x01h or x81h
x02h or x82h
x03h or x83h
x04h or x84h
x05h or x85h
x06h or x86h
x07h or x87h
x08h or x88h
x09h or x89h
x0Ah or x8Ah
x0Bh or x8Bh
INDF0
INDF1
PCL
STATUS
FSR0L
FSR0H
FSR1L
FSR1H
BSR
WREG
PCLATH
INTCON
DS40001726C-page 18
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
3.3.1.1
STATUS Register
The STATUS register, shown in Register 3-1, contains:
• the arithmetic status of the ALU
• the Reset status
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
3.4
For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not
affecting any Status bits (Refer to Section 33.0
“Instruction Set Summary”).
Note:
The C and DC bits operate as Borrow and
Digit Borrow out bits, respectively, in
subtraction.
Register Definitions: Status
REGISTER 3-1:
STATUS: STATUS REGISTER
U-0
U-0
U-0
R-1/q
R-1/q
R/W-0/u
R/W-0/u
R/W-0/u
—
—
—
TO
PD
Z
DC(1)
C(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7-5
Unimplemented: Read as ‘0’
bit 4
TO: Time-Out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT Time-out occurred
bit 3
PD: Power-Down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2
Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1
DC: Digit Carry/Digit Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0
C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1:
For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 19
PIC16(L)F1713/6
3.4.1
SPECIAL FUNCTION REGISTER
The Special Function Registers are registers used by
the application to control the desired operation of
peripheral functions in the device. The Special Function
Registers occupy the 20 bytes after the core registers of
every data memory bank (addresses x0Ch/x8Ch
through x1Fh/x9Fh). The registers associated with the
operation of the peripherals are described in the
appropriate peripheral chapter of this data sheet.
3.4.2
FIGURE 3-3:
7-bit Bank Offset
0Bh
0Ch
GENERAL PURPOSE RAM
Core Registers
(12 bytes)
Special Function Registers
(20 bytes maximum)
1Fh
20h
Linear Access to GPR
The general purpose RAM can be accessed in a
non-banked method via the FSRs. This can simplify
access to large memory structures. See Section 3.7.2
“Linear Data Memory” for more information.
3.4.3
Memory Region
00h
There are up to 80 bytes of GPR in each data memory
bank. The Special Function Registers occupy the 20
bytes after the core registers of every data memory
bank (addresses x0Ch/x8Ch through x1Fh/x9Fh).
3.4.2.1
BANKED MEMORY
PARTITIONING
General Purpose RAM
(80 bytes maximum)
COMMON RAM
There are 16 bytes of common RAM accessible from all
banks.
6Fh
70h
Common RAM
(16 bytes)
7Fh
3.4.4
DEVICE MEMORY MAPS
The memory maps for the device family are as shown
in Tables 3-3 through 3-9.
DS40001726C-page 20
 2013-2016 Microchip Technology Inc.
 2013-2016 Microchip Technology Inc.
TABLE 3-3:
PIC16(L)F1713 MEMORY MAP (BANKS 0-7)
BANK 0
000h
BANK 1
080h
Core Registers
(Table 3-2)
BANK 2
100h
Core Registers
(Table 3-2)
BANK 3
180h
Core Registers
(Table 3-2)
BANK 4
200h
Core Registers
(Table 3-2)
BANK 5
280h
Core Registers
(Table 3-2)
BANK 6
300h
Core Registers
(Table 3-2)
BANK 7
380h
Core Registers
(Table 3-2)
Core Registers
(Table 3-2)
00Bh
00Ch
00Dh
00Eh
00Fh
010h
011h
012h
013h
014h
015h
016h
PORTA
PORTB
PORTC
—
PORTE
PIR1
PIR2
PIR3
—
TMR0
TMR1L
08Bh
08Ch
08Dh
08Eh
08Fh
090h
091h
092h
093h
094h
095h
096h
TRISA
TRISB
TRISC
—
TRISE
PIE1
PIE2
PIE3
—
OPTION_REG
PCON
10Bh
10Ch
10Dh
10Eh
10Fh
110h
111h
112h
113h
114h
115h
116h
LATA
LATB
LATC
—
—
CM1CON0
CM1CON1
CM2CON0
CM2CON1
CMOUT
BORCON
18Bh
18Ch
18Dh
18Eh
18Fh
190h
191h
192h
193h
194h
195h
196h
ANSELA
ANSELB
ANSELC
—
—
PMADRL
PMADRH
PMDATL
PMDATH
PMCON1
PMCON2
20Bh
20Ch
20Dh
20Eh
20Fh
210h
211h
212h
213h
214h
215h
216h
WPUA
WPUB
WPUC
—
WPUE
SSP1BUF
SSP1ADD
SSP1MSK
SSP1STAT
SSP1CON1
SSP1CON2
28Bh
28Ch
28Dh
28Eh
28Fh
290h
291h
292h
293h
294h
295h
296h
ODCONA
ODCONB
ODCONC
—
—
CCPR1L
CCPR1H
CCP1CON
—
—
—
30Bh
30Ch
30Dh
30Eh
30Fh
310h
311h
312h
313h
314h
315h
316h
SLRCONA
SLRCONB
SLRCONC
—
—
—
—
—
—
—
—
38Bh
38Ch
38Dh
38Eh
38Fh
390h
391h
392h
393h
394h
395h
396h
INLVLA
INLVLB
INLVLC
—
INLVLE
IOCAP
IOCAN
IOCAF
IOCBP
IOCBN
IOCBF
017h
018h
019h
01Ah
01Bh
01Ch
01Dh
01Eh
TMR1H
T1CON
T1GCON
TMR2
PR2
T2CON
—
—
097h
098h
099h
09Ah
09Bh
09Ch
09Dh
09Eh
WDTCON
OSCTUNE
OSCCON
OSCSTAT
ADRESL
ADRESH
ADCON0
ADCON1
117h
118h
119h
11Ah
11Bh
11Ch
11Dh
11Eh
FVRCON
DAC1CON0
DAC1CON1
DAC2CON0
DAC2CON1
ZCD1CON
—
—
197h
198h
199h
19Ah
19Bh
19Ch
19Dh
19Eh
VREGCON(1)
—
RC1REG
TX1REG
SP1BRGL
SP1BRGH
RC1STA
TX1STA
217h
218h
219h
21Ah
21Bh
21Ch
21Dh
21Eh
SSP1CON3
—
—
—
—
—
—
—
297h
298h
299h
29Ah
29Bh
29Ch
29Dh
29Eh
—
CCPR2L
CCPR2H
CCP2CON
—
—
—
CCPTMRS
317h
318h
319h
31Ah
31Bh
31Ch
31Dh
31Eh
—
—
—
—
—
—
—
—
397h
398h
399h
39Ah
39Bh
39Ch
39Dh
39Eh
IOCCP
IOCCN
IOCCF
—
—
—
IOCEP
IOCEN
01Fh
020h
—
09Fh
0A0h
ADCON2
11Fh
120h
—
19Fh
1A0h
BAUD1CON
21Fh
220h
—
29Fh
2A0h
—
31Fh
—
39Fh
320h General Purpose 3A0h
Register
32Fh
16 Bytes
330h
IOCEF
06Fh
070h
General
Purpose
Register
80 Bytes
0EFh
0F0h
Common RAM
70h – 7Fh
07Fh
16Fh
170h
Accesses
70h – 7Fh
0FFh
Legend:
DS40001726C-page 21
Note
1:
General
Purpose
Register
80 Bytes
1EFh
1F0h
Accesses
70h – 7Fh
17Fh
= Unimplemented data memory locations, read as ‘0’.
Unimplemented on PIC16(L)F1713/6.
General
Purpose
Register
80 Bytes
General
Purpose
Register
80 Bytes
26Fh
270h
Accesses
70h – 7Fh
1FFh
General
Purpose
Register
80 Bytes
27Fh
36Fh
370h
2EFh
2F0h
Accesses
70h – 7Fh
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
2FFh
3EFh
3F0h
Accesses
70h – 7Fh
37Fh
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
3FFh
PIC16(L)F1713/6
General
Purpose
Register
80 Bytes
PIC16(L)F1716 MEMORY MAP (BANKS 0-7)
BANK 0
000h
BANK 1
080h
Core Registers
(Table 3-2)
BANK 2
100h
Core Registers
(Table 3-2)
BANK 3
180h
Core Registers
(Table 3-2)
BANK 4
200h
Core Registers
(Table 3-2)
BANK 5
280h
Core Registers
(Table 3-2)
BANK 6
300h
Core Registers
(Table 3-2)
BANK 7
380h
Core Registers
(Table 3-2)
Core Registers
(Table 3-2)
00Bh
00Ch
00Dh
00Eh
00Fh
010h
011h
012h
013h
014h
015h
016h
PORTA
PORTB
PORTC
—
PORTE
PIR1
PIR2
PIR3
—
TMR0
TMR1L
08Bh
08Ch
08Dh
08Eh
08Fh
090h
091h
092h
093h
094h
095h
096h
TRISA
TRISB
TRISC
—
TRISE
PIE1
PIE2
PIE3
—
OPTION_REG
PCON
10Bh
10Ch
10Dh
10Eh
10Fh
110h
111h
112h
113h
114h
115h
116h
LATA
LATB
LATC
—
—
CM1CON0
CM1CON1
CM2CON0
CM2CON1
CMOUT
BORCON
18Bh
18Ch
18Dh
18Eh
18Fh
190h
191h
192h
193h
194h
195h
196h
ANSELA
ANSELB
ANSELC
—
—
PMADRL
PMADRH
PMDATL
PMDATH
PMCON1
PMCON2
20Bh
20Ch
20Dh
20Eh
20Fh
210h
211h
212h
213h
214h
215h
216h
WPUA
WPUB
WPUC
—
WPUE
SSP1BUF
SSP1ADD
SSP1MSK
SSP1STAT
SSP1CON1
SSP1CON2
28Bh
28Ch
28Dh
28Eh
28Fh
290h
291h
292h
293h
294h
295h
296h
ODCONA
ODCONB
ODCONC
—
—
CCPR1L
CCPR1H
CCP1CON
—
—
—
30Bh
30Ch
30Dh
30Eh
30Fh
310h
311h
312h
313h
314h
315h
316h
SLRCONA
SLRCONB
SLRCONC
—
—
—
—
—
—
—
—
38Bh
38Ch
38Dh
38Eh
38Fh
390h
391h
392h
393h
394h
395h
396h
INLVLA
INLVLB
INLVLC
—
INLVLE
IOCAP
IOCAN
IOCAF
IOCBP
IOCBN
IOCBF
017h
018h
019h
01Ah
01Bh
01Ch
01Dh
01Eh
TMR1H
T1CON
T1GCON
TMR2
PR2
T2CON
—
—
097h
098h
099h
09Ah
09Bh
09Ch
09Dh
09Eh
WDTCON
OSCTUNE
OSCCON
OSCSTAT
ADRESL
ADRESH
ADCON0
ADCON1
117h
118h
119h
11Ah
11Bh
11Ch
11Dh
11Eh
FVRCON
DAC1CON0
DAC1CON1
DAC2CON0
DAC2CON1
ZCD1CON
—
—
197h
198h
199h
19Ah
19Bh
19Ch
19Dh
19Eh
VREGCON(1)
—
RC1REG
TX1REG
SP1BRGL
SP1BRGH
RC1STA
TX1STA
217h
218h
219h
21Ah
21Bh
21Ch
21Dh
21Eh
SSP1CON3
—
—
—
—
—
—
—
297h
298h
299h
29Ah
29Bh
29Ch
29Dh
29Eh
—
CCPR2L
CCPR2H
CCP2CON
—
—
—
CCPTMRS
317h
318h
319h
31Ah
31Bh
31Ch
31Dh
31Eh
—
—
—
—
—
—
—
—
397h
398h
399h
39Ah
39Bh
39Ch
39Dh
39Eh
IOCCP
IOCCN
IOCCF
—
—
—
IOCEP
IOCEN
01Fh
020h
—
09Fh
0A0h
ADCON2
11Fh
120h
—
19Fh
1A0h
BAUD1CON
21Fh
220h
—
29Fh
2A0h
—
31Fh
320h
—
39Fh
3A0h
IOCEF
General
Purpose
Register
80 Bytes
 2013-2016 Microchip Technology Inc.
06Fh
070h
0EFh
0F0h
Common RAM
70h – 7Fh
07Fh
Note
16Fh
170h
Accesses
70h – 7Fh
0FFh
Legend:
1:
General
Purpose
Register
80 Bytes
General
Purpose
Register
80 Bytes
1EFh
1F0h
Accesses
70h – 7Fh
17Fh
= Unimplemented data memory locations, read as ‘0’.
Unimplemented on PIC16(L)F1713/6.
General
Purpose
Register
80 Bytes
General
Purpose
Register
80 Bytes
26Fh
270h
Accesses
70h – 7Fh
1FFh
General
Purpose
Register
80 Bytes
27Fh
36Fh
370h
2EFh
2F0h
Accesses
70h – 7Fh
General
Purpose
Register
80 Bytes
Accesses
70h – 7Fh
2FFh
General
Purpose
Register
80 Bytes
3EFh
3F0h
Accesses
70h – 7Fh
37Fh
Accesses
70h – 7Fh
3FFh
PIC16(L)F1713/6
DS40001726C-page 22
TABLE 3-4:
 2013-2016 Microchip Technology Inc.
TABLE 3-5:
PIC16(L)F1713 MEMORY MAP, BANK 8-23
BANK 8
400h
BANK 9
480h
Core Registers
(Table 3-2)
40Bh
40Ch
40Dh
40Eh
40Fh
410h
411h
412h
413h
414h
415h
416h
417h
418h
419h
41Ah
41Bh
41Ch
41Dh
41Eh
41Fh
420h
—
—
—
—
—
—
—
—
—
TMR4
PR4
T4CON
—
—
—
—
TMR6
PR6
T6CON
—
Core Registers
(Table 3-2)
48Bh
48Ch
48Dh
48Eh
48Fh
490h
491h
492h
493h
494h
495h
496h
497h
498h
499h
49Ah
49Bh
49Ch
49Dh
49Eh
49Fh
4A0h
Unimplemented
Read as ‘0’
46Fh
470h
—
—
—
—
—
—
—
—
—
—
—
—
NCO1ACCL
NCO1ACCH
NCO1ACCU
NCO1INCL
NCO1INCH
NCO1INCU
NCO1CON
NCO1CLK
DS40001726C-page 23
Unimplemented
Read as ‘0’
86Fh
870h
Unimplemented
Read as ‘0’
8EFh
8F0h
Accesses
70h – 7Fh
87Fh
Legend:
Unimplemented
Read as ‘0’
8FFh
9EFh
9F0h
96Fh
970h
Accesses
70h – 7Fh
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
97Fh
= Unimplemented data memory locations, read as ‘0’.
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
9FFh
Core Registers
(Table 3-2)
B8Bh
B8Ch
Unimplemented
Read as ‘0’
Unimplemented
Read as ‘0’
BEFh
BF0h
B6Fh
B70h
Accesses
70h – 7Fh
AFFh
BANK 23
B80h
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
A7Fh
BANK 22
B0Bh
B0Ch
AEFh
AF0h
A6Fh
A70h
Accesses
70h – 7Fh
7FFh
B00h
Core Registers
(Table 3-2)
Accesses
70h – 7Fh
B7Fh
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
BANK 21
A8Bh
A8Ch
78Bh
78Ch
78Dh
78Eh
78Fh
790h
791h
792h
793h
794h
795h
796h
797h
798h
799h
79Ah
79Bh
79Ch
79Dh
79Eh
79Fh
7A0h
7EFh
7F0h
77Fh
A80h
Core Registers
(Table 3-2)
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
BANK 20
A0Bh
A0Ch
70Bh
70Ch
70Dh
70Eh
70Fh
710h
711h
712h
713h
714h
715h
716h
717h
718h
719h
71Ah
71Bh
71Ch
71Dh
71Eh
71Fh
720h
76Fh
770h
6FFh
A00h
Core Registers
(Table 3-2)
—
—
—
—
—
COG1PHR
COG1PHF
COG1BLKR
COG1BLKF
COG1DBR
COG1DBF
COG1CON0
COG1CON1
COG1RIS
COG1RSIM
COG1FIS
COG1FSIM
COG1ASD0
COG1ASD1
COG1STR
BANK 15
780h
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
BANK 19
98Bh
98Ch
68Bh
68Ch
68Dh
68Eh
68Fh
690h
691h
692h
693h
694h
695h
696h
697h
698h
699h
69Ah
69Bh
69Ch
69Dh
69Eh
69Fh
6A0h
6EFh
6F0h
67Fh
980h
Core Registers
(Table 3-2)
—
—
—
—
—
—
—
—
—
—
—
PWM3DCL
PWM3DCH
PWM3CON
PWM4DCL
PWM4DCH
PWM4CON
—
—
—
BANK 14
700h
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
BANK 18
90Bh
90Ch
88Bh
88Ch
80Bh
80Ch
60Bh
60Ch
60Dh
60Eh
60Fh
610h
611h
612h
613h
614h
615h
616h
617h
618h
619h
61Ah
61Bh
61Ch
61Dh
61Eh
61Fh
620h
66Fh
670h
5FFh
900h
Core Registers
(Table 3-2)
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
BANK 13
680h
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
BANK 17
Core Registers
(Table 3-2)
58Bh
58Ch
58Dh
58Eh
58Fh
590h
591h
592h
593h
594h
595h
596h
597h
598h
599h
59Ah
59Bh
59Ch
59Dh
59Eh
59Fh
5A0h
5EFh
5F0h
57Fh
880h
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
BANK 16
—
—
—
—
—
OPA1CON
—
—
—
OPA2CON
—
—
—
—
—
—
—
—
—
—
56Fh
570h
4FFh
800h
50Bh
50Ch
50Dh
50Eh
50Fh
510h
511h
512h
513h
514h
515h
516h
517h
518h
519h
51Ah
51Bh
51Ch
51Dh
51Eh
51Fh
520h
BANK 12
600h
Accesses
70h – 7Fh
BFFh
PIC16(L)F1713/6
Accesses
70h – 7Fh
BANK 11
580h
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
4EFh
4F0h
47Fh
BANK 10
500h
PIC16(L)F1716 MEMORY MAP, BANK 8-23
BANK 8
400h
BANK 9
480h
Core Registers
(Table 3-2)
40Bh
40Ch
40Dh
40Eh
40Fh
410h
411h
412h
413h
414h
415h
416h
417h
418h
419h
41Ah
41Bh
41Ch
41Dh
41Eh
41Fh
420h
—
—
—
—
—
—
—
—
—
TMR4
PR4
T4CON
—
—
—
—
TMR6
PR6
T6CON
—
Core Registers
(Table 3-2)
48Bh
48Ch
48Dh
48Eh
48Fh
490h
491h
492h
493h
494h
495h
496h
497h
498h
499h
49Ah
49Bh
49Ch
49Dh
49Eh
49Fh
4A0h
General
Purpose
Register
80 Bytes
46Fh
470h
—
—
—
—
—
—
—
—
—
—
—
—
NCO1ACCL
NCO1ACCH
NCO1ACCU
NCO1INCL
NCO1INCH
NCO1INCU
NCO1CON
NCO1CLK
Accesses
70h – 7Fh
 2013-2016 Microchip Technology Inc.
Unimplemented
Read as ‘0’
86Fh
870h
8EFh
8F0h
87Fh
Accesses
70h – 7Fh
8FFh
Accesses
70h – 7Fh
97Fh
= Unimplemented data memory locations, read as ‘0’.
Accesses
70h – 7Fh
9FFh
A7Fh
BANK 23
B80h
Core Registers
(Table 3-2)
Core Registers
(Table 3-2)
B8Bh
B8Ch
B0Bh
B0Ch
Unimplemented
Read as ‘0’
Unimplemented
Read as ‘0’
BEFh
BF0h
B6Fh
B70h
Accesses
70h – 7Fh
AFFh
Accesses
70h – 7Fh
BANK 22
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
Unimplemented
Read as ‘0’
7FFh
B00h
Core Registers
(Table 3-2)
Accesses
70h – 7Fh
B7Fh
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
7EFh
7F0h
77Fh
AEFh
AF0h
78Bh
78Ch
78Dh
78Eh
78Fh
790h
791h
792h
793h
794h
795h
796h
797h
798h
799h
79Ah
79Bh
79Ch
79Dh
79Eh
79Fh
7A0h
Accesses
70h – 7Fh
BANK 21
Unimplemented
Read as ‘0’
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
A8Bh
A8Ch
A6Fh
A70h
70Bh
70Ch
70Dh
70Eh
70Fh
710h
711h
712h
713h
714h
715h
716h
717h
718h
719h
71Ah
71Bh
71Ch
71Dh
71Eh
71Fh
720h
76Fh
770h
A80h
A0Bh
A0Ch
9EFh
9F0h
96Fh
970h
6EFh
6F0h
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
—
—
—
—
—
COG1PHR
COG1PHF
COG1BLKR
COG1BLKF
COG1DBR
COG1DBF
COG1CON0
COG1CON1
COG1RIS
COG1RSIM
COG1FIS
COG1FSIM
COG1ASD0
COG1ASD1
COG1STR
BANK 15
780h
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
BANK 20
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
68Bh
68Ch
68Dh
68Eh
68Fh
690h
691h
692h
693h
694h
695h
696h
697h
698h
699h
69Ah
69Bh
69Ch
69Dh
69Eh
69Fh
6A0h
6FFh
A00h
BANK 14
700h
Core Registers
(Table 3-2)
Accesses
70h – 7Fh
BANK 19
98Bh
98Ch
90Bh
90Ch
60Bh
60Ch
—
60Dh
—
60Eh
—
60Fh
—
610h
—
611h
—
612h
—
613h
—
614h
—
615h
—
616h
—
617h
PWM3DCL
618h
PWM3DCH
619h
PWM3CON
61Ah
PWM4DCL
61Bh
PWM4DCH
61Ch
PWM4CON
61Dh
—
61Eh
—
61Fh
—
620h General Purpose
Register
48 Bytes
64Fh
Unimplemented
Read as ‘0’
66Fh
670h
67Fh
980h
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
Legend:
BANK 18
BANK 13
680h
Core Registers
(Table 3-2)
Accesses
70h – 7Fh
5FFh
900h
Core Registers
(Table 3-2)
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
General
Purpose
Register
80 Bytes
Accesses
70h – 7Fh
BANK 17
88Bh
88Ch
80Bh
80Ch
58Bh
58Ch
58Dh
58Eh
58Fh
590h
591h
592h
593h
594h
595h
596h
597h
598h
599h
59Ah
59Bh
59Ch
59Dh
59Eh
59Fh
5A0h
5EFh
5F0h
57Fh
880h
Core Registers
(Table 3-2)
—
—
—
—
—
OPA1CON
—
—
—
OPA2CON
—
—
—
—
—
—
—
—
—
—
BANK 12
600h
Core Registers
(Table 3-2)
General
Purpose
Register
80 Bytes
Accesses
70h – 7Fh
BANK 16
800h
50Bh
50Ch
50Dh
50Eh
50Fh
510h
511h
512h
513h
514h
515h
516h
517h
518h
519h
51Ah
51Bh
51Ch
51Dh
51Eh
51Fh
520h
56Fh
570h
4FFh
BANK 11
580h
Core Registers
(Table 3-2)
General
Purpose
Register
80 Bytes
4EFh
4F0h
47Fh
BANK 10
500h
Accesses
70h – 7Fh
BFFh
PIC16(L)F1713/6
DS40001726C-page 24
TABLE 3-6:
 2013-2016 Microchip Technology Inc.
TABLE 3-7:
PIC16(L)F1713/6 MEMORY MAP, BANK 24-31
BANK 24
C00h
BANK 25
C80h
Core Registers
(Table 3-2)
C0Bh
C0Ch
C0Dh
C0Eh
C0Fh
C10h
C11h
C12h
C13h
C14h
C15h
C16h
C17h
C18h
C19h
C1Ah
C1Bh
C1Ch
C1Dh
C1Eh
C1Fh
C20h
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Core Registers
(Table 3-2)
C8Bh
C8Ch
C8Dh
C8Eh
C8Fh
C90h
C91h
C92h
C93h
C94h
C95h
C96h
C97h
C98h
C99h
C9Ah
C9Bh
C9Ch
C9Dh
C9Eh
C9Fh
CA0h
Unimplemented
Read as ‘0’
CFFh
Core Registers
(Table 3-2)
D0Bh
D0Ch
D0Dh
D0Eh
D0Fh
D10h
D11h
D12h
D13h
D14h
D15h
D16h
D17h
D18h
D19h
D1Ah
D1Bh
D1Ch
D1Dh
D1Eh
D1Fh
D20h
Unimplemented
Read as ‘0’
CEFh
CF0h
Accesses
70h – 7Fh
Legend:
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
D6Fh
D70h
D8Bh
D8Ch
D8Dh
D8Eh
D8Fh
D90h
D91h
D92h
D93h
D94h
D95h
D96h
D97h
D98h
D99h
D9Ah
D9Bh
D9Ch
D9Dh
D9Eh
D9Fh
DA0h
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Accesses
70h – 7Fh
D7Fh
BANK 29
E80h
Core Registers
(Table 3-2)
BANK 30
F00h
Core Registers
(Table 3-2)
BANK 31
F80h
Core Registers
(Table 3-2)
Core Registers
(Table 3-2)
E0Bh
E0Ch
E0Dh
E0Eh
E0Fh
E10h
E11h
E12h
E13h
E14h
E15h
E16h
E17h
See Table 3-9 for
E18h register mapping
E19h
details
E1Ah
E1Bh
E1Ch
E1Dh
E1Eh
E1Fh
E20h
E8Bh
E8Ch
E8Dh
E8Eh
E8Fh
E90h
E91h
E92h
E93h
E94h
E95h
E96h
E97h
See Table 3-9 for
E98h register mapping
E99h
details
E9Ah
E9Bh
E9Ch
E9Dh
E9Eh
E9Fh
EA0h
F0Bh
F0Ch
F0Dh
F0Eh
F0Fh
F10h
F11h
F12h
F13h
F14h
F15h
F16h
F17h
See Table 3-9 for
F18h register mapping
F19h
details
F1Ah
F1Bh
F1Ch
F1Dh
F1Eh
F1Fh
F20h
F8Bh
F8Ch
F8Dh
F8Eh
F8Fh
F90h
F91h
F92h
F93h
F94h
F95h
F96h
F97h
See Table 3-9 for
F98h register mapping
F99h
details
F9Ah
F9Bh
F9Ch
F9Dh
F9Eh
F9Fh
FA0h
E6Fh
E70h
EEFh
EF0h
F6Fh
F70h
FEFh
FF0h
Unimplemented
Read as ‘0’
DEFh
DF0h
= Unimplemented data memory locations, read as ‘0’.
BANK 28
E00h
Core Registers
(Table 3-2)
Unimplemented
Read as ‘0’
Accesses
70h – 7Fh
CFFh
BANK 27
D80h
Accesses
70h – 7Fh
DFFh
Accesses
70h – 7Fh
E7Fh
Accesses
70h – 7Fh
EFFh
Accesses
70h – 7Fh
F7Fh
Accesses
70h – 7Fh
FFFh
DS40001726C-page 25
PIC16(L)F1713/6
C6Fh
C70h
BANK 26
D00h
PIC16(L)F1713/6
TABLE 3-8:
PIC16(L)F1713/6 MEMORY MAP, BANK 28-30
Bank 28
E0Ch
E0Dh
E0Eh
E0Fh
E10h
E11h
E12h
E13h
E14h
E15h
E16h
E17h
E18h
E19h
E1Ah
E1Bh
E1Ch
E1Dh
E1Eh
E1Fh
E20h
E21h
E22h
E23h
E24h
E25h
E26h
E27h
E28h
E29h
E2Ah
E2Bh
E2Ch
E2Dh
E2Eh
E2Fh
E30h
E31h
E32h
E33h
E34h
E35h
E36h
E37h
E38h
E39h
E3Ah
E3Bh
E3Ch
E3Dh
E3Eh
E3Fh
E40h
—
—
—
PPSLOCK
INTPPS
T0CKIPPS
T1CKIPPS
T1GPPS
CCP1PPS
CCP2PPS
—
COGINPPS
—
—
—
—
—
—
—
—
SSPCLKPPS
SSPDATPPS
SSPSSPPS
—
RXPPS
CKPPS
—
—
CLCIN0PPS
CLCIN1PPS
CLCIN2PPS
CLCIN3PPS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Bank 29
E8Ch
E8Dh
E8Eh
E8Fh
E90h
E91h
E92h
E93h
E94h
E95h
E96h
E97h
E98h
E99h
E9Ah
E9Bh
E9Ch
E9Dh
E9Eh
E9Fh
EA0h
EA1h
EA2h
EA3h
EA4h
EA5h
EA6h
EA7h
EA8h
EA9h
EAAh
EABh
EACh
EADh
EAEh
EAFh
EB0h
EB1h
EB2h
EB3h
EB4h
EB5h
EB6h
EB7h
EB8h
EB9h
EBAh
EBBh
EBCh
EBDh
EBEh
EBFh
EC0h
—
E6Fh
Legend:
Note 1:
DS40001726C-page 26
—
—
—
—
RA0PPS
RA1PPS
RA2PPS
RA3PPS
RA4PPS
RA5PPS
RA6PPS
RA7PPS
RB0PPS
RB1PPS
RB2PPS
RB3PPS
RB4PPS(1)
RB5PPS(1)
RB6PPS(1)
RB7PPS(1)
RC0PPS
RC1PPS
RC2PPS
RC3PPS
RC4PPS
RC5PPS
RC6PPS(1)
RC7PPS(1)
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Bank 30
F0Ch
F0Dh
F0Eh
F0Fh
F10h
F11h
F12h
F13h
F14h
F15h
F16h
F17h
F18h
F19h
F1Ah
F1Bh
F1Ch
F1Dh
F1Eh
F1Fh
F20h
F21h
F22h
F23h
F24h
F25h
F26h
F27h
F28h
F29h
F2Ah
F2Bh
F2Ch
F2Dh
F2Eh
F2Fh
F30h
F31h
F32h
F33h
F34h
F35h
F36h
F37h
F38h
F39h
F3Ah
F3Bh
F3Ch
F3Dh
F3Eh
F3Fh
F40h
—
—
EEFh
—
—
—
CLCDATA
CLC1CON
CLC1POL
CLC1SEL0
CLC1SEL1
CLC1SEL2
CLC1SEL3
CLC1GLS0
CLC1GLS1
CLC1GLS2
CLC1GLS3
CLC2CON
CLC2POL
CLC2SEL0
CLC2SEL1
CLC2SEL2
CLC2SEL3
CLC2GLS0
CLC2GLS1
CLC2GLS2
CLC2GLS3
CLC3CON
CLC3POL
CLC3SEL0
CLC3SEL1
CLC3SEL2
CLC3SEL3
CLC3GLS0
CLC3GLS1
CLC3GLS2
CLC3GLS3
CLC4CON
CLC4POL
CLC4SEL0
CLC4SEL1
CLC4SEL2
CLC4SEL3
CLC4GLS0
CLC4GLS1
CLC4GLS2
CLC4GLS3
—
—
—
—
—
—
—
—
F6Fh
= Unimplemented data memory locations, read as ‘0’,
Only available on PIC16(L)F1713 devices
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 3-9:
PIC16(L)F1713/6 MEMORY
MAP, BANK 31
Bank 31
F8Ch
Unimplemented
Read as ‘0’
FE3h
FE4h
FE5h
FE6h
FE7h
FE8h
FE9h
FEAh
FEBh
FECh
FEDh
FEEh
FEFh
FF0h
STATUS_SHAD
WREG_SHAD
BSR_SHAD
PCLATH_SHAD
FSR0L_SHAD
FSR0H_SHAD
FSR1L_SHAD
FSR1H_SHAD
—
STKPTR
TOSL
TOSH
—
FFFh
Legend:
= Unimplemented data memory locations,
read as ‘0’,
 2013-2016 Microchip Technology Inc.
DS40001726C-page 27
PIC16(L)F1713/6
3.4.5
CORE FUNCTION REGISTERS
SUMMARY
The Core Function registers listed in Table 3-10 can
be addressed from any Bank.
TABLE 3-10:
Addr
Name
CORE FUNCTION REGISTERS SUMMARY
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR, BOR
Value on all
other Resets
Bank 0-31
x00h or
INDF0
x80h
Addressing this location uses contents of FSR0H/FSR0L to address data memory
(not a physical register)
xxxx xxxx
uuuu uuuu
x01h or
INDF1
x81h
Addressing this location uses contents of FSR1H/FSR1L to address data memory
(not a physical register)
xxxx xxxx
uuuu uuuu
x02h or
PCL
x82h
Program Counter (PC) Least Significant Byte
0000 0000
0000 0000
---1 1000
---q quuu
x03h or
STATUS
x83h
—
—
—
TO
PD
Z
DC
C
x04h or
FSR0L
x84h
Indirect Data Memory Address 0 Low Pointer
0000 0000
uuuu uuuu
x05h or
FSR0H
x85h
Indirect Data Memory Address 0 High Pointer
0000 0000
0000 0000
x06h or
FSR1L
x86h
Indirect Data Memory Address 1 Low Pointer
0000 0000
uuuu uuuu
x07h or
FSR1H
x87h
Indirect Data Memory Address 1 High Pointer
0000 0000
0000 0000
---0 0000
---0 0000
0000 0000
uuuu uuuu
-000 0000
-000 0000
0000 0000
0000 0000
x08h or
BSR
x88h
—
x09h or
WREG
x89h
—
x0Bh or
INTCON
x8Bh
GIE
Note
1:
—
BSR4
BSR3
BSR2
BSR1
BSR0
Working Register
x0Ah or
PCLATH
x8Ah
Legend:
—
Write Buffer for the upper 7 bits of the Program Counter
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
These registers can be addressed from any bank.
DS40001726C-page 28
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 3-11:
SPECIAL FUNCTION REGISTER SUMMARY
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR, BOR
Value on all
other
Resets
00Ch PORTA
RA7
RA6
RA5
RA4
RA3
RA2
RA1
RA0
xxxx xxxx
--uu uuuu
00Dh PORTB
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
xxxx xxxx
uuuu ----
00Eh PORTC
RC7(
RC6
RC5
RC4
RC3
RC2
RC1
RC0
xxxx xxxx
uuuu uuuu
—
—
—
—
—
—
RE3
—
—
—
---- x---
---- u--0000 0-00
Addr
Name
Bank 0
00Fh —
Unimplemented
010h
PORTE
011h
PIR1
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
0000 0000
012h
PIR2
OSFIF
C2IF
C1IF
—
BCL1IF
TMR6IF
TMR4IF
CCP2IF
000- 0000
000- 00--
013h
PIR3
—
NCOIF
COGIF
ZCDIF
CLC4IF
CLC3IF
CLC2IF
CLC1IF
-000 0000
--00 -000
014h
—
Unimplemented
—
—
015h
TMR0
Timer0 Module Register
xxxx xxxx
uuuu uuuu
016h
TMR1L
Holding Register for the Least Significant Byte of the 16-bit TMR1 Register
xxxx xxxx
uuuu uuuu
017h
TMR1H
Holding Register for the Most Significant Byte of the 16-bit TMR1 Register
xxxx xxxx
uuuu uuuu
018h
T1CON
0000 00-0
uuuu uu-u
019h
T1GCON
0000 0x00
uuuu uxuu
TMR1CS<1:0>
TMR1GE
T1GPOL
T1CKPS<1:0>
T1GTM
T1GSPM
T1OSCEN
T1SYNC
T1GGO/
DONE
T1GVAL
—
TMR1ON
T1GSS<1:0>
01Ah TMR2
Holding Register for the 8-bit TMR2 Register
0000 0000
uuuu uuuu
01Bh PR2
Timer2 Period Register
1111 1111
uuuu uuuu
-000 0000
-000 0000
—
—
01Ch T2CON
01Dh
to —
01Fh
—
T2OUTPS<3:0>
TMR2ON
T2CKPS<1:0>
Unimplemented
Bank 1
08Ch TRISA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
1111 1111
--11 1111
08Dh TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISA0
1111 1111
1111 ----
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
1111 1111
1111 1111
—
—
08Eh TRISC
08Fh —
Unimplemented
090h
TRISE
—
—
—
—
—
—
—
---- 1---
---- 1---
091h
PIE1
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
0000 0000
0000 0000
092h
PIE2
OSFIE
C2IE
C1IE
—
BCL1IE
TMR6IE
TMR4IE
CCP2IE
000- 0000
000- 0000
093h
PIE3
—
NCOIE
COGIE
ZCDIE
CLC4IE
CLC3IE
CLC2IE
CLC1IE
-000 0000
--00 -000
094h
—
095h
OPTION_REG
WPUEN
INTEDG
TMR0CS
TMR0SE
096h
PCON
STKOVF
STKUNF
—
RWDT
097h
WDTCON
—
—
098h
OSCTUNE
—
—
099h
OSCCON
SPLLEN
09Ah OSCSTAT
SOSCR
Unimplemented
PLLR
ADC Result Register Low
09Ch ADRESH
ADC Result Register High
09Dh ADCON0
—
09Eh ADCON1
ADFM
09Fh ADCON2
Note
1:
2:
PSA
—
—
1111 1111
1111 1111
BOR
00-1 11qq
qq-q qquu
SWDTEN
--01 0110
--01 0110
--00 0000
--00 0000
0011 1-00
0011 1-00
PS<2:0>
RMCLR
RI
POR
WDTPS<4:0>
TUN<5:0>
IRCF<3:0>
09Bh ADRESL
Legend:
TRISE3
OSTS
HFIOFR
—
HFIOFL
MFIOFR
CHS<4:0>
ADCS<2:0>
TRIGSEL<3:0>
SCS<1:0>
LFIOFR
GO/DONE
—
ADNREF
—
—
HFIOFS
ADON
ADPREF<1:0>
—
—
00q0 0q0q
qqqq --0q
xxxx xxxx
uuuu uuuu
xxxx xxxx
uuuu uuuu
-000 0000
-000 0000
0000 -000
0000 --00
0000 ----
0000 ----
x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Unimplemented, read as ‘1’.
Unimplemented on PIC16(L)F1713/6.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 29
PIC16(L)F1713/6
TABLE 3-11:
Addr
SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR, BOR
Value on all
other
Resets
Bank 2
10Ch LATA
LATA7
LATA6
LATA5
LATA4
LATA3
LATA2
LATA1
LATA0
xxxx xxxx
--uu -uuu
10Dh LATB
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
xxxx xxxx
uuuu ----
LATC7
LATC6
LATC5
LATC4
LATC3
LATC2
LATC1
LATC0
10Eh LATC
xxxx xxxx
uuuu uuuu
10Fh —
Unimplemented
—
—
110h
—
Unimplemented
—
—
111h
CM1CON0
C1ON
C1OUT
00-0 0100
00-0 0100
112h
CM1CON1
C1INTP
C1INTN
0000 0000
0000 0000
113h
CM2CON0
C2ON
C2OUT
00-0 0100
00-0 0100
114h
CM2CON1
C2INTP
C2INTN
0000 0000
0000 0000
115h
CMOUT
—
—
—
—
—
—
MC2OUT
MC1OUT
---- --00
---- --00
116h
BORCON
SBOREN
BORFS
—
—
—
—
—
BORRDY
10-- ---q
uu-- ---u
117h
FVRCON
118h
DAC1CON0
119h
DAC1CON1
11Ah
DAC2CON0
11Bh
DAC2CON1
—
C1POL
C1ZLF
C1SP
C2ZLF
C2SP
C1HYS
C1PCH<2:0>
—
C2POL
C1SYNC
C1NCH<2:0>
C2HYS
C2PCH<2:0>
C2SYNC
C2NCH<2:0>
FVREN
FVRRDY
TSEN
TSRNG
CDAFVR<1:0>
DAC1EN
---
DAC1OE1
DAC1OE2
DAC1PSS<1:0>
DAC2EN
—
DAC2OE1
DAC2OE2
DAC2PSS<1:0>
—
—
—
ZCD1EN
—
ZCD1OUT
ZCD1POL
—
ADFVR<1:0>
0000 0000
0000 0000
0-00 00-0
0-00 00-0
—
DAC2NSS
---0 0000
---0 0000
ZCD1INTP
ZCD1INTN
0-x0 --00
0-00 --00
DAC2R<4:0>
—
0q00 0000
0-00 00-0
DAC1NSS
DAC1R<7:0>
11Ch ZCD1CON
0q00 0000
0-00 00-0
---
11Dh —
Unimplemented
—
—
11Eh
—
Unimplemented
—
—
11Fh
—
Unimplemented
—
—
Bank 3
18Ch ANSELA
—
—
ANSA5
ANSA4
ANSA3
ANSA2
ANSA1
ANSA0
--11 1111
---1 1111
18Dh ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
--11 1111
--11 ----
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
18Eh ANSELC
1111 11--
1111 1111
18Fh —
Unimplemented
—
—
190h
—
Unimplemented
—
—
191h
PMADRL
Program Memory Address Register Low Byte
0000 0000
0000 0000
1000 0000
1000 0000
192h
PMADRH
193h
PMDATL
194h
PMDATH
195h
PMCON1
196h
PMCON2
—
Program Memory Address Register High Byte
Program Memory Read Data Register Low Byte
—
—
—
CFGS
Program Memory Read Data Register High Byte
LWLO
FREE
WRERR
WREN
WR
RD
Program Memory Control Register 2
197h
VREGCON
198h
—
Unimplemented
199h
RC1REG
USART Receive Data Register
19Ah TX1REG
USART Transmit Data Register
—
—
—
—
—
—
VREGPM
Reserved
xxxx xxxx
uuuu uuuu
--xx xxxx
--uu uuuu
-000 x000
-000 q000
0000 0000
0000 0000
---- --01
---- --01
—
—
0000 0000
0000 0000
0000 0000
0000 0000
19Bh SP1BRGL
SP1BRG<7:0>
0000 0000
0000 0000
19Ch SP1BRGH
SP1BRG<15:8>
0000 0000
0000 0000
0000 0000
19Dh RC1STA
SPEN
RX9
SREN
CREN
ADDEN
FERR
OERR
RX9D
0000 0000
19Eh TX1STA
CSRC
TX9
TXEN
SYNC
SENDB
BRGH
TRMT
TX9D
0000 0010
0000 0010
ABDOVF
RCIDL
—
SCKP
BRG16
—
WUE
ABDEN
01-0 0-00
01-0 0-00
19Fh BAUD1CON
Legend:
Note
1:
2:
x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Unimplemented, read as ‘1’.
Unimplemented on PIC16(L)F1713/6.
DS40001726C-page 30
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 3-11:
SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR, BOR
Value on all
other
Resets
20Ch WPUA
WPUA7
WPUA6
WPUA5
WPUA4
WPUA3
WPUA2
WPUA1
WPUA0
1111 1111
--11 1111
20Dh WPUB
WPUB7
WPUB6
WPUB5
WPUB4
WPUB3
WPUB2
WPUB1
WPUB0
1111 1111
1111 ----
20Eh WPUC
WPUC7
WPUC6
WPUC5
WPUC4
WPUC3
WPUC2
WPUC1
WPUC0
1111 1111
1111 1111
—
—
—
—
—
WPUE3
—
—
—
---- 1---
---- 1---
XXXX XXXX
uuuu uuuu
Addr
Name
Bank 4
20Fh —
Unimplemented
210h
WPUE
211h
SSP1BUF
212h
SSP1ADD
ADD<7:0>
XXXX XXXX
0000 0000
213h
SSP1MSK
MSK<7:0>
XXXX XXXX
1111 1111
214h
SSP1STAT
SMP
CKE
D/A
P
0000 0000
0000 0000
215h
SSP1CON1
WCOL
SSPOV
SSPEN
CKP
0000 0000
0000 0000
216h
SSP1CON2
GCEN
ACKSTAT
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
0000 0000
0000 0000
217h
SSP1CON3
ACKTIM
PCIE
SCIE
BOEN
SDAHT
SBCDE
AHEN
DHEN
0000 0000
0000 0000
—
—
--00 -000
—
218h
— —
21Fh
Synchronous Serial Port Receive Buffer/Transmit Register
S
R/W
UA
BF
SSPM<3:0>
Unimplemented
Bank 5
28Ch ODCONA
ODA7
ODA6
ODA5
ODA4
ODA3
ODA2
ODA1
ODA0
0000 0000
28Dh ODCONB
ODB7
ODB6
ODB5
ODB4
ODB3
ODB2
ODB1
ODB0
0000 000-
0000 ----
28Eh ODCONC
ODC7
ODC6
ODC5
ODC4
ODC3
ODC2
ODC1
ODC0
0000 0000
0000 0000
—
28Fh —
Unimplemented
—
290h
—
Unimplemented
—
—
291h
CCPR1L
Capture/Compare/PWM Register 1 (LSB)
xxxx xxxx
uuuu uuuu
292h
CCPR1H
Capture/Compare/PWM Register 1 (MSB)
293h
CCP1CON
—
—
DC1B<1:0>
CCP1M<3:0>
xxxx xxxx
uuuu uuuu
--00 0000
--00 0000
—
—
uuuu uuuu
294h
— —
297h
Unimplemented
298h
CCPR2L
Capture/Compare/PWM Register 2 (LSB)
xxxx xxxx
299h
CCPR2H
Capture/Compare/PWM Register 2 (MSB)
xxxx xxxx
uuuu uuuu
--00 0000
--00 0000
—
—
0000 0000
0000 0000
—
—
29Ah CCP2CON
29Bh
— —
29Dh
—
—
DC2B<1:0>
CCP2M<3:0>
Unimplemented
29Eh CCPTMRS
29Fh —
P4TSEL<1:0>
P3TSEL<1:0>
C2TSEL<1:0>
C1TSEL<1:0>
Unimplemented
Bank 6
30Ch SLRCONA
SLRA7
SLRA6
SLRA5
SLRA4
SLRA3
SLRA2
SLRA1
SLRA0
1111 1111
--00 -000
30Dh SLRCONB
SLRB7
SLRB6
SLRB5
SLRB4
SLRB3
SLRB2
SLRB1
SLRB0
1111 1111
0000 ----
30Eh SLRCONC
SLRC7
SLRC6
SLRC5
SLRC4
SLRC3
SLRC2
SLRC1
SLRC0
1111 1111
0000 0000
—
—
30Fh
— —
31Fh
Legend:
Note
1:
2:
Unimplemented
x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Unimplemented, read as ‘1’.
Unimplemented on PIC16(L)F1713/6.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 31
PIC16(L)F1713/6
TABLE 3-11:
SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR, BOR
Value on all
other
Resets
38Ch INLVLA
INLVLA7
INLVLA6
INLVLA5
INLVLA4
INLVLA3
INLVLA2
INLVLA1
INLVLA0
1111 1111
--11 1111
38Dh INLVLB
INLVLB7
INLVLB6
INLVLB5
INLVLB4
INLVLB3
INLVLB2
INLVLB1
INLVLB0
1111 1111
1111 ----
38Eh INLVLC
INLVLC7
INLVLC6
INLVLC5
INLVLC4
INLVLC3
INLVLC2
INLVLC1
INLVLC0
1111 1111
1111 1111
Addr
Name
Bank 7
38Fh —
390h
Unimplemented
INLVLE
INLVLE3
—
—
---- 1---
---- 1----00 0000
391h
IOCAP
IOCAP7
IOCAP6
IOCAP5
IOCAP4
IOCAP3
IOCAP2
IOCAP1
IOCAP0
0000 0000
392h
IOCAN
IOCAN7
IOCAN6
IOCAN5
IOCAN4
IOCAN3
IOCAN2
IOCAN1
IOCAN0
0000 0000
--00 0000
393h
IOCAF
IOCAF7
IOCAF6
IOCAF5
IOCAF4
IOCAF3
IOCAF2
IOCAF1
IOCAF0
0000 0000
--00 0000
0000 ----
394h
IOCBP
IOCBP7
IOCBP6
IOCBP5
IOCBP4
IOCBP3
IOCBP2
IOCBP1
IOCBP0
0000 0000
395h
IOCBN
IOCBN7
IOCBN6
IOCBN5
IOCBN4
IOCBN3
IOCBN2
IOCBN1
IOCBN0
0000 0000
0000 ----
396h
IOCBF
IOCBF7
IOCBF6
IOCBF5
IOCBF4
IOCBF3
IOCBF2
IOCBF1
IOCBF0
0000 0000
0000 ----
397h
IOCCP
IOCCP7
IOCCP6
IOCCP5
IOCCP4
IOCCP3
IOCCP2
IOCCP1
IOCCP0
0000 0000
0000 0000
398h
IOCCN
IOCCN7
IOCCN6
IOCCN5
IOCCN4
IOCCN3
IOCCN2
IOCCN1
IOCCN0
0000 0000
0000 0000
399h
IOCCF
IOCCF7
IOCCF6
IOCCF5
IOCCF4
IOCCF3
IOCCF2
IOCCF1
IOCCF0
0000 0000
0000 0000
—
—
39Ah
— —
39Ch
Unimplemented
39Dh IOCEP
—
—
—
—
IOCEP3
—
—
—
---- 0---
---- 0---
39Eh IOCEN
—
—
—
—
IOCEN3
—
—
—
---- 0---
---- 0---
39Fh IOCEF
—
—
—
—
IOCEF3
—
—
—
---- 0---
---- 0---
—
—
uuuu uuuu
Bank 8
40Ch
— —
414h
Unimplemented
415h
TMR4
Holding Register for the 8-bit TMR4 Register
0000 0000
416h
PR4
Timer4 Period Register
1111 1111
uuuu uuuu
417h
T4CON
-000 0000
-000 0000
—
—
uuuu uuuu
—
T4OUTPS<3:0>
TMR4ON
T4CKPS<1:0>
418h
— —
41Bh
Unimplemented
41Ch TMR6
Holding Register for the 8-bit TMR6 Register
0000 0000
41Dh PR6
Timer6 Period Register
1111 1111
uuuu uuuu
-000 0000
-000 0000
Unimplemented
—
—
Unimplemented
—
—
41Eh T6CON
41Fh —
—
T6OUTPS<3:0>
TMR6ON
T6CKPS<1:0>
Bank 9
48Ch
to —
497h
498h NCO1ACCL
NCO1ACC
0000 0000
0000 0000
499h NCO1ACCH
NCO1ACC
0000 0000
0000 0000
49Ah NCO1ACCU
NCO1ACC
---- 0000
---- 0000
49Bh NCO1INCL
NCO1INC
0000 0001
0000 0001
49Ch NCO1INCH
NCO1INC
0000 0000
0000 0000
49Dh NCO1INCU
NCO1INC
---- 0000
---- 0000
0-00 ---0
0-00 ---0
000- --00
000- --00
49Eh NCO1CON
49Fh NCO1CLK
Legend:
Note
1:
2:
N1EN
—
N1PWS<2:0>
N1OUT
N1POL
—
—
—
—
—
—
N1PFM
N1CKS<1:0>
x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Unimplemented, read as ‘1’.
Unimplemented on PIC16(L)F1713/6.
DS40001726C-page 32
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 3-11:
Addr
Name
SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Value on
POR, BOR
Value on all
other
Resets
—
—
00-0 --00
00-0 --00
—
—
00-0 --00
00-0 --00
Unimplemented
—
—
Unimplemented
—
—
Unimplemented
—
—
xx-- ----
uu-- ----
xxxx xxxx
uuuu uuuu
u-uu ----
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bank 10
50Ch
— —
510h
Unimplemented
511h
OPA1CON
512h
—
514h
—
515h
OPA2CON
OPA1EN
OPA1SP
—
OPA1UG
—
—
OPA1PCH<1:0>
Unimplemented
516h
— —
51Fh
OPA2EN
OPA2SP
—
OPA2UG
—
—
OPA2PCH<1:0>
Bank 11
58Ch
to —
59Fh
Bank 12
60Ch
to —
616h
617h
PWM3DCL
618h
PWM3DCH
619h
PWM3CON
61Ah PWM4DCL
PWM3DC<1:0>
—
61Dh
— —
61Fh
—
—
—
—
PWM3DCH<7:0>
PWM3EN
—
—
—
—
—
0-x0 ----
—
—
—
—
xx-- ----
uu-- ----
xxxx xxxx
uuuu uuuu
0-x0 ----
u-uu ----
Unimplemented
—
—
Unimplemented
—
—
PWM4DCL<1:0>
PWM3OUT PWM3POL
—
61Bh PWM4DCH
61Ch PWM4CON
—
—
PWM4DCH<7:0>
PWM4EN
—
PWM4OUT PWM4POL
—
—
—
—
Bank 13
68Ch
to —
690h
691h
COG1PHR
—
—
COG Rising Edge Phase Delay Count Register
--xx xxxx
--uu uuuu
692h
COG1PHF
—
—
COG Falling Edge Phase Delay Count Register
--xx xxxx
--uu uuuu
693h
COG1BLKR
—
—
COG Rising Edge Blanking Count Register
--xx xxxx
--uu uuuu
694h
COG1BLKF
—
—
COG Falling Edge Blanking Count Register
--xx xxxx
--uu uuuu
695h
COG1DBR
—
—
COG Rising Edge Dead-band Count Register
--xx xxxx
--uu uuuu
696h
COG1DBF
—
—
COG Falling Edge Dead-band Count Register
--xx xxxx
--uu uuuu
697h
COG1CON0
G1EN
G1LD
00-0 0000
00-0 0000
698h
COG1CON1
G1RDBS
G1FDBS
—
—
G1POLD
G1POLC
G1POLB
G1POLA
00-- 0000
00-- 0000
699h
COG1RIS
G1RIS7
G1RIS6
G1RIS5
G1RIS4
G1RIS3
G1RIS2
G1RIS1
G1RIS0
0000 0000
-000 0000
G1RSIM7
G1RSIM6
G1RSIM5
G1RSIM4
G1RSIM3
G1RSIM2
G1RSIM1
G1RSIM0
0000 0000
-000 0000
G1FIS7
G1FIS6
G1FIS5
G1FIS4
G1FIS3
G1FIS2
G1FIS1
G1FIS0
0000 0000
-000 0000
G1FSIM5
G1FSIM4
G1FSIM3
G1FSIM2
G1FSIM1
G1FSIM0
0000 0000
-000 0000
—
—
0001 01--
0001 01--
69Ah COG1RSIM
69Bh COG1FIS
—
G1CS<1:0>
G1MD<2:0>
69Ch COG1FSIM
G1FSIM7
G1FSIM6
69Dh COG1ASD0
G1ASE
G1ARSEN
69Eh COG1ASD1
—
—
—
—
G1AS3E
G1AS2E
G1AS1E
G1AS0E
---- 0000
---- 0000
69Fh COG1STR
G1SDATD
G1SDATC
G1SDATB
G1SDATA
G1STRD
G1STRC
G1STRB
G1STRA
0000 0001
0000 0001
Legend:
Note
1:
2:
G1ASDBD<1:0>
G1ASDAC<1:0>
x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Unimplemented, read as ‘1’.
Unimplemented on PIC16(L)F1713/6.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 33
PIC16(L)F1713/6
TABLE 3-11:
Addr
SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Value on
POR, BOR
Value on all
other
Resets
Unimplemented
—
—
Unimplemented
—
—
---- ---0
---- ---0
---u uuuu
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bank 14-27
x0Ch/
x8Ch
— —
x1Fh/
x9Fh
Bank 28
E0Ch
— —
E0Eh
E0Fh
E10h
PPSLOCK
—
—
—
INTPPS
—
—
—
—
—
—
—
PPSLOCKED
INTPPS<4:0>
---0 1000
E11h
T0CKIPPS
—
—
—
T0CKIPPS<4:0>
---0 0100
---u uuuu
E12h
T1CKIPPS
—
—
—
T1CKIPPS<4:0>
---1 0000
---u uuuu
E13h
T1GPPS
—
—
—
T1GPPS<4:0>
---0 1101
---u uuuu
E14h
CCP1PPS
—
—
—
CCP1PPS<4:0>
---1 0010
---u uuuu
E15h
CCP2PPS
—
—
—
CCP2PPS<4:0>
---1 0001
---u uuuu
—
—
—
—
COGINPPS<4:0>
---0 1000
---u uuuu
E16h
—
E17h
COGINPPS
Unimplemented
—
E18h —
Unimplemented
—
—
E19h —
Unimplemented
—
—
Unimplemented
—
—
---u uuuu
E1Ah
—
E1FH
E20h
SSPCLKPPS
—
—
—
SSPCLKPPS<4:0>
---1 0011
E21h
SSPDATPPS
—
—
—
SSPDATPPS<4:0>
---1 0100
---u uuuu
E22h
SSPSSPPS
—
—
—
SSPSSPPS<4:0>
---0 0101
---u uuuu
—
—
—
—
—
RXPPS<4:0>
---1 0111
---u uuuu
—
—
—
CKPPS<4:0>
E23h
—
E24h
RXPPS
E25h
CKPPS
E26h
E27h
Unimplemented
---1 0110
---u uuuu
—
Unimplemented
—
—
—
Unimplemented
—
—
E28h
CLCIN0PPS
—
—
—
CLCIN0PPS<4:0>
---0 0000
---u uuuu
E29h
CLCIN1PPS
—
—
—
CLCIN1PPS<4:0>
---0 0001
---u uuuu
E2Ah
CLCIN2PPS
—
—
—
CLCIN2PPS<4:0>
---0 1110
---u uuuu
CLCIN3PPS
—
—
—
CLCIN3PPS<4:0>
---0 1111
---u uuuu
—
—
E2Bh
E2Ch
to —
E6Fh
Legend:
Note
1:
2:
Unimplemented
x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Unimplemented, read as ‘1’.
Unimplemented on PIC16(L)F1713/6.
DS40001726C-page 34
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 3-11:
Addr
Name
SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR, BOR
Value on all
other
Resets
—
—
Bank 29
E8Ch
— —
E8Fh
E90h
Unimplemented
RA0PPS
—
—
—
RA0PPS<4:0>
---0 0000
---u uuuu
RA1PPS
—
—
—
RA1PPS<4:0>
---0 0000
---u uuuu
E92h
RA2PPS
—
—
—
RA2PPS<4:0>
---0 0000
---u uuuu
E93h
RA3PPS
—
—
—
RA3PPS4:0>
---0 0000
---u uuuu
E94h
RA4PPS
—
—
—
RA4PPS<4:0>
---0 0000
---u uuuu
E95h
RA5PPS
—
—
—
RA5PPS<4:0>
---0 0000
---u uuuu
E96h
RA6PPS
—
—
—
RA6PPS<4:0>
---0 0000
---u uuuu
E97h
RA7PPS
—
—
—
RA7PPS<4:0>
---0 0000
---u uuuu
E98h
RB0PPS
—
—
—
RB0PPS<4:0>
---0 0000
---u uuuu
E99h
RB1PPS
—
—
—
RB1PPS<4:0>
---0 0000
---u uuuu
E9Ah
RB2PPS
—
—
—
RB2PPS<4:0>
---0 0000
---u uuuu
E9Bh
RB3PPS
—
—
—
RB3PPS<4:0>
---0 0000
---u uuuu
—
—
RB4PPS<4:0>
---0 0000
---u uuuu
E91h
RB4PPS
—
E9Dh
RB5PPS
—
—
—
RB5PPS<4:0>
---0 0000
---u uuuu
E9Eh
RB6PPS
—
—
—
RB6PPS<4:0>
---0 0000
---u uuuu
E9Fh
RB7PPS
—
—
—
RB7PPS<4:0>
---0 0000
---u uuuu
EA0h
RC0PPS
—
—
—
RC0PPS<4:0>
---0 0000
---u uuuu
—
—
RC1PPS<4:0>
---0 0000
---u uuuu
E9Ch
EA1h
RC1PPS
—
EA2h
RC2PPS
—
—
—
RC2PPS<4:0>
---0 0000
---u uuuu
EA3h
RC3PPS
—
—
—
RC3PPS<4:0>
---0 0000
---u uuuu
EA4h
RC4PPS
—
—
—
RC4PPS<4:0>
---0 0000
---u uuuu
EA5h
RC5PPS
—
—
—
RC5PPS<4:0>
---0 0000
---u uuuu
RC6PPS
—
—
—
RC6PPS<4:0>
---0 0000
---u uuuu
RC7PPS
—
—
—
RC7PPS<4:0>
---0 0000
---u uuuu
—
—
EA6h
EA7h
EA8h
— —
EEFh
Legend:
Note
1:
2:
Unimplemented
x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Unimplemented, read as ‘1’.
Unimplemented on PIC16(L)F1713/6.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 35
PIC16(L)F1713/6
TABLE 3-11:
Addr
SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR, BOR
Value on all
other
Resets
—
—
Bank 30
F0Ch
— —
F0Eh
Unimplemented
F0Fh CLCDATA
—
—
—
—
MLC4OUT
F10h CLC1CON
LC1EN
—
LC1OUT
LC1INTP
LC1INTN
F11h
—
CLC1POL
MLC3OUT
MLC2OUT
MLC1OUT
LC1MODE<2:0>
---- 0000
---- 0000
0-x0 0000
0-00 0000
LC1POL
—
—
x--- xxxx
0--- uuuu
F12h CLC1SEL0
—
—
—
LC1D1S<4:0>
---x xxxx
---u uuuu
F13h CLC1SEL1
—
—
—
LC1D2S<4:0>
---x xxxx
---u uuuu
F14h CLC1SEL2
—
—
—
LC1D3S<4:0>
---x xxxx
---u uuuu
F15h CLC1SEL3
—
—
—
LC1D4S<4:0>
---x xxxx
---u uuuu
LC1G4POL LC1G3POL LC1G2POL
LC1G1POL
F16h CLC1GLS0
LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T
LC1G1D1N
xxxx xxxx
uuuu uuuu
F17h CLC1GLS1
LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T
LC1G2D1N
xxxx xxxx
uuuu uuuu
F18h CLC1GLS2
LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T
LC1G3D1N
xxxx xxxx
uuuu uuuu
F19h CLC1GLS3
LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T
LC1G4D1N
xxxx xxxx
uuuu uuuu
F1Ah CLC2CON
LC2EN
—
LC2OUT
LC2INTP
F1Bh CLC2POL
LC2POL
—
—
—
F1Ch CLC2SEL0
—
—
—
F1Dh CLC2SEL1
—
—
—
F1Eh CLC2SEL2
—
—
F1Fh CLC2SEL3
—
—
LC2INTN
LC2MODE<2:0>
0-x0 0000
0-00 0000
x--- xxxx
0--- uuuu
LC2D1S<4:0>
---x xxxx
---u uuuu
LC2D2S<4:0>
---x xxxx
---u uuuu
—
LC2D3S<4:0>
---x xxxx
---u uuuu
—
LC2D4S<4:0>
---x xxxx
---u uuuu
LC2G4POL LC2G3POL LC2G2POL
LC2G1POL
F20h CLC2GLS0
LC2G1D4T LC2G1D4N LC2G1D3T LC2G1D3N LC2G1D2T LC2G1D2N LC2G1D1T
LC2G1D1N
xxxx xxxx
uuuu uuuu
F21h CLC2GLS1
LC2G2D4T LC2G2D4N LC2G2D3T LC2G2D3N LC2G2D2T LC2G2D2N LC2G2D1T
LC2G2D1N
xxxx xxxx
uuuu uuuu
F22h CLC2GLS2
LC2G3D4T LC2G3D4N LC2G3D3T LC2G3D3N LC2G3D2T LC2G3D2N LC2G3D1T
LC2G3D1N
xxxx xxxx
uuuu uuuu
F23h CLC2GLS3
LC2G4D4T LC2G4D4N LC2G4D3T LC2G4D3N LC2G4D2T LC2G4D2N LC2G4D1T
LC2G4D1N
xxxx xxxx
uuuu uuuu
F24h CLC3CON
LC3EN
—
LC3OUT
LC3INTP
F25h CLC3POL
LC3POL
—
—
—
F26h CLC3SEL0
—
—
—
F27h CLC3SEL1
—
—
—
F28h CLC3SEL2
—
—
F29h CLC3SEL3
—
F2Ah CLC3GLS0
—
LC3INTN
LC3MODE<2:0>
0-x0 0000
0-00 0000
x--- xxxx
0--- uuuu
LC3D1S<4:0>
---x xxxx
---u uuuu
LC3D2S<4:0>
---x xxxx
---u uuuu
—
LC3D3S<4:0>
---x xxxx
---u uuuu
—
—
LC3D4S<4:0>
---x xxxx
---u uuuu
—
—
LC3G4POL LC3G3POL LC3G2POL
LC3G1POL
LC3G1D3N LC3G1D2T LC3G1D2N LC3G1D1T
LC3G1D1N
---x xxxx
uuuu uuuu
F2Bh CLC3GLS1
LC3G2D4T LC3G2D4N LC3G2D3T LC3G2D3N LC3G2D2T LC3G2D2N LC3G2D1T
LC3G2D1N
xxxx xxxx
uuuu uuuu
F2Ch CLC3GLS2
LC3G3D4T LC3G3D4N LC3G3D3T LC3G3D3N LC3G3D2T LC3G3D2N LC3G3D1T
LC3G3D1N
xxxx xxxx
uuuu uuuu
F2Dh CLC3GLS3
LC3G4D4T LC3G4D4N LC3G4D3T LC3G4D3N LC3G4D2T LC3G4D2N LC3G4D1T
LC3G4D1N
xxxx xxxx
uuuu uuuu
F2Eh CLC4CON
LC4EN
—
LC4OUT
LC4INTP
F2Fh CLC4POL
LC4POL
—
—
—
F30h CLC4SEL0
—
—
—
F31h CLC4SEL1
—
—
—
F32h CLC4SEL2
—
—
F33h CLC4SEL3
—
—
LC4INTN
LC4MODE<2:0>
0-X0 0000
0-00 0000
x--- xxxx
0--- uuuu
LC4D1S<4:0>
---x xxxx
---u uuuu
LC4D2S<4:0>
---x xxxx
---u uuuu
—
LC4D3S<4:0>
---x xxxx
---u uuuu
—
LC4D4S<4:0>
---x xxxx
---u uuuu
LC4G4POL LC4G3POL LC4G2POL
LC4G1POL
F34h CLC4GLS0
LC4G1D4T LC4G1D4N LC4G1D3T LC4G1D3N LC4G1D2T LC4G1D2N LC4G1D1T
LC4G1D1N
xxxx xxxx
uuuu uuuu
F35h CLC4GLS1
LC4G2D4T LC4G2D4N LC4G2D3T LC4G2D3N LC4G2D2T LC4G2D2N LC4G2D1T
LC4G2D1N
xxxx xxxx
uuuu uuuu
F36h CLC4GLS2
LC4G3D4T LC4G3D4N LC4G3D3T LC4G3D3N LC4G3D2T LC4G3D2N LC4G3D1T
LC4G3D1N
xxxx xxxx
uuuu uuuu
F37h CLC4GLS3
LC4G4D4T LC4G4D4N LC4G4D3T LC4G4D3N LC4G4D2T LC4G4D2N LC4G4D1T
LC4G4D1N
xxxx xxxx
uuuu uuuu
F38h
— —
F6Fh
Unimplemented
—
—
Legend:
Note
1:
2:
x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Unimplemented, read as ‘1’.
Unimplemented on PIC16(L)F1713/6.
DS40001726C-page 36
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 3-11:
Addr
SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on
POR, BOR
Value on all
other
Resets
—
—
---- -xxx
---- -uuu
Bank 31
F8Ch
— —
FE3h
FE4h
Unimplemented
STATUS_SHAD
—
—
—
FE5h WREG_SHAD
—
—
Z_SHAD
DC_SHAD
WREG_SHAD
FE6h BSR_SHAD
—
FE7h PCLATH_SHAD
—
—
—
BSR_SHAD
PCLATH_SHAD
FE8h FSR0L_SHAD
FSR0L_SHAD
C_SHAD
xxxx xxxx
uuuu uuuu
---x xxxx
---u uuuu
-xxx xxxx
-uuu uuuu
xxxx xxxx
uuuu uuuu
FE9h FSR0H_SHAD
FSR0H_SHAD
xxxx xxxx
uuuu uuuu
FEAh FSRIL_SHAD
FSRIL_SHAD
xxxx xxxx
uuuu uuuu
FEBh FSRIH_SHAD
FSR1H_SHAD
xxxx xxxx
uuuu uuuu
FECh —
Unimplemented
FEDh STKPTR
—
—
—
FEEh TOSL
FEFh TOSH
Legend:
Note
1:
2:
—
STKPTR
TOSL
—
TOSH
---1 1111
---1 1111
xxxx xxxx
uuuu uuuu
-xxx xxxx
-uuu uuuu
x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Unimplemented, read as ‘1’.
Unimplemented on PIC16(L)F1713/6.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 37
PIC16(L)F1713/6
3.5
3.5.3
PCL and PCLATH
COMPUTED FUNCTION CALLS
The Program Counter (PC) is 15 bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC<14:8>) is not directly
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 3-4 shows the five
situations for the loading of the PC.
A computed function CALL allows programs to maintain
tables of functions and provide another way to execute
state machines or look-up tables. When performing a
table read using a computed function CALL, care
should be exercised if the table location crosses a PCL
memory boundary (each 256-byte block).
FIGURE 3-4:
If using the CALL instruction, the PCH<2:0> and PCL
registers are loaded with the operand of the CALL
instruction. PCH<6:3> is loaded with PCLATH<6:3>.
PC
LOADING OF PC IN
DIFFERENT SITUATIONS
14
PCH
6
7
14
PCH
PCL
0
PCLATH
PC
8
ALU Result
PCL
0
4
0
11
OPCODE <10:0>
PC
14
PCH
PCL
0
CALLW
6
PCLATH
PC
Instruction with
PCL as
Destination
GOTO, CALL
6
PCLATH
0
14
7
0
PCH
8
W
PCL
0
BRW
PC + W
14
PCH
3.5.4
BRANCHING
The branching instructions add an offset to the PC.
This allows relocatable code and code that crosses
page boundaries. There are two forms of branching,
BRW and BRA. The PC will have incremented to fetch
the next instruction in both cases. When using either
branching instruction, a PCL memory boundary may be
crossed.
If using BRW, load the W register with the desired
unsigned address and execute BRW. The entire PC will
be loaded with the address PC + 1 + W.
If using BRA, the entire PC will be loaded with PC + 1 +,
the signed value of the operand of the BRA instruction.
15
PC
The CALLW instruction enables computed calls by combining PCLATH and W to form the destination address.
A computed CALLW is accomplished by loading the W
register with the desired address and executing CALLW.
The PCL register is loaded with the value of W and
PCH is loaded with PCLATH.
PCL
0
BRA
15
PC + OPCODE <8:0>
3.5.1
MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program
Counter PC<14:8> bits (PCH) to be replaced by the
contents of the PCLATH register. This allows the entire
contents of the program counter to be changed by
writing the desired upper seven bits to the PCLATH
register. When the lower eight bits are written to the
PCL register, all 15 bits of the program counter will
change to the values contained in the PCLATH register
and those being written to the PCL register.
3.5.2
COMPUTED GOTO
A computed GOTO is accomplished by adding an offset to
the program counter (ADDWF PCL). When performing a
table read using a computed GOTO method, care should
be exercised if the table location crosses a PCL memory
boundary (each 256-byte block). Refer to Application
Note AN556, “Implementing a Table Read” (DS00556).
DS40001726C-page 38
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
3.6
3.6.1
Stack
All devices have a 16-level x 15-bit wide hardware
stack (refer to Figure 3-1). The stack space is not part
of either program or data space. The PC is PUSHed
onto the stack when CALL or CALLW instructions are
executed or an interrupt causes a branch. The stack is
POPed in the event of a RETURN, RETLW or a RETFIE
instruction execution. PCLATH is not affected by a
PUSH or POP operation.
The stack operates as a circular buffer if the STVREN
bit is programmed to ‘0‘ (Configuration Words). This
means that after the stack has been PUSHed sixteen
times, the seventeenth PUSH overwrites the value that
was stored from the first PUSH. The eighteenth PUSH
overwrites the second PUSH (and so on). The
STKOVF and STKUNF flag bits will be set on an Overflow/Underflow, regardless of whether the Reset is
enabled.
Note:
There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the CALL,
CALLW, RETURN, RETLW and RETFIE
instructions or the vectoring to an interrupt
address.
FIGURE 3-5:
ACCESSING THE STACK
The stack is available through the TOSH, TOSL and
STKPTR registers. STKPTR is the current value of the
Stack Pointer. TOSH:TOSL register pair points to the
TOP of the stack. Both registers are read/writable. TOS
is split into TOSH and TOSL due to the 15-bit size of the
PC. To access the stack, adjust the value of STKPTR,
which will position TOSH:TOSL, then read/write to
TOSH:TOSL. STKPTR is five bits to allow detection of
overflow and underflow.
Note:
Care should be taken when modifying the
STKPTR while interrupts are enabled.
During normal program operation, CALL, CALLW and
Interrupts will increment STKPTR while RETLW,
RETURN, and RETFIE will decrement STKPTR. At any
time, STKPTR can be inspected to see how much
stack is left. The STKPTR always points at the currently
used place on the stack. Therefore, a CALL or CALLW
will increment the STKPTR and then write the PC, and
a return will unload the PC and then decrement the
STKPTR.
Reference Figure 3-5 through Figure 3-8 for examples
of accessing the stack.
ACCESSING THE STACK EXAMPLE 1
TOSH:TOSL
0x0F
STKPTR = 0x1F
Stack Reset Disabled
(STVREN = 0)
0x0E
0x0D
0x0C
0x0B
0x0A
Initial Stack Configuration:
0x09
After Reset, the stack is empty. The
empty stack is initialized so the Stack
Pointer is pointing at 0x1F. If the Stack
Overflow/Underflow Reset is enabled, the
TOSH/TOSL registers will return ‘0’. If
the Stack Overflow/Underflow Reset is
disabled, the TOSH/TOSL registers will
return the contents of stack address 0x0F.
0x08
0x07
0x06
0x05
0x04
0x03
0x02
0x01
0x00
TOSH:TOSL
 2013-2016 Microchip Technology Inc.
0x1F
0x0000
STKPTR = 0x1F
Stack Reset Enabled
(STVREN = 1)
DS40001726C-page 39
PIC16(L)F1713/6
FIGURE 3-6:
ACCESSING THE STACK EXAMPLE 2
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
This figure shows the stack configuration
after the first CALL or a single interrupt.
If a RETURN instruction is executed, the
return address will be placed in the
Program Counter and the Stack Pointer
decremented to the empty state (0x1F).
0x08
0x07
0x06
0x05
0x04
0x03
0x02
0x01
TOSH:TOSL
FIGURE 3-7:
0x00
Return Address
STKPTR = 0x00
ACCESSING THE STACK EXAMPLE 3
0x0F
0x0E
0x0D
0x0C
After seven CALLs or six CALLs and an
interrupt, the stack looks like the figure
on the left. A series of RETURN instructions
will repeatedly place the return addresses
into the Program Counter and pop the stack.
0x0B
0x0A
0x09
0x08
0x07
TOSH:TOSL
DS40001726C-page 40
0x06
Return Address
0x05
Return Address
0x04
Return Address
0x03
Return Address
0x02
Return Address
0x01
Return Address
0x00
Return Address
STKPTR = 0x06
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 3-8:
ACCESSING THE STACK EXAMPLE 4
TOSH:TOSL
3.6.2
0x0F
Return Address
0x0E
Return Address
0x0D
Return Address
0x0C
Return Address
0x0B
Return Address
0x0A
Return Address
0x09
Return Address
0x08
Return Address
0x07
Return Address
0x06
Return Address
0x05
Return Address
0x04
Return Address
0x03
Return Address
0x02
Return Address
0x01
Return Address
0x00
Return Address
When the stack is full, the next CALL or
an interrupt will set the Stack Pointer to
0x10. This is identical to address 0x00
so the stack will wrap and overwrite the
return address at 0x00. If the Stack
Overflow/Underflow Reset is enabled, a
Reset will occur and location 0x00 will
not be overwritten.
STKPTR = 0x10
OVERFLOW/UNDERFLOW RESET
If the STVREN bit in Configuration Words is
programmed to ‘1’, the device will be reset if the stack
is PUSHed beyond the sixteenth level or POPed
beyond the first level, setting the appropriate bits
(STKOVF or STKUNF, respectively) in the PCON
register.
3.7
Indirect Addressing
The INDFn registers are not physical registers. Any
instruction that accesses an INDFn register actually
accesses the register at the address specified by the
File Select Registers (FSR). If the FSRn address
specifies one of the two INDFn registers, the read will
return ‘0’ and the write will not occur (though Status bits
may be affected). The FSRn register value is created
by the pair FSRnH and FSRnL.
The FSR registers form a 16-bit address that allows an
addressing space with 65536 locations. These locations
are divided into three memory regions:
• Traditional Data Memory
• Linear Data Memory
• Program Flash Memory
 2013-2016 Microchip Technology Inc.
DS40001726C-page 41
PIC16(L)F1713/6
FIGURE 3-9:
INDIRECT ADDRESSING
0x0000
0x0000
Traditional
Data Memory
0x0FFF
0x1000
0x1FFF
0x0FFF
Reserved
0x2000
Linear
Data Memory
0x29AF
0x29B0
FSR
Address
Range
0x7FFF
0x8000
Reserved
0x0000
Program
Flash Memory
0xFFFF
Note:
0x7FFF
Not all memory regions are completely implemented. Consult device memory tables for memory limits.
DS40001726C-page 42
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
3.7.1
TRADITIONAL DATA MEMORY
The traditional data memory is a region from FSR
address 0x000 to FSR address 0xFFF. The addresses
correspond to the absolute addresses of all SFR, GPR
and common registers.
FIGURE 3-10:
TRADITIONAL DATA MEMORY MAP
Direct Addressing
4
BSR
0
6
Indirect Addressing
From Opcode
0
7
0
Bank Select
Location Select
FSRxH
0
0
0
7
FSRxL
0
0
Bank Select
00000 00001 00010
11111
Bank 0 Bank 1 Bank 2
Bank 31
Location Select
0x00
0x7F
 2013-2016 Microchip Technology Inc.
DS40001726C-page 43
PIC16(L)F1713/6
3.7.2
3.7.3
LINEAR DATA MEMORY
The linear data memory is the region from FSR
address 0x2000 to FSR address 0x29AF. This region is
a virtual region that points back to the 80-byte blocks of
GPR memory in all the banks.
Unimplemented memory reads as 0x00. Use of the
linear data memory region allows buffers to be larger
than 80 bytes because incrementing the FSR beyond
one bank will go directly to the GPR memory of the next
bank.
The 16 bytes of common memory are not included in
the linear data memory region.
FIGURE 3-11:
7
FSRnH
0 0 1
LINEAR DATA MEMORY
MAP
0
7
FSRnL
0
PROGRAM FLASH MEMORY
To make constant data access easier, the entire
program Flash memory is mapped to the upper half of
the FSR address space. When the MSB of FSRnH is
set, the lower 15 bits are the address in program
memory which will be accessed through INDF. Only the
lower eight bits of each memory location is accessible
via INDF. Writing to the program Flash memory cannot
be accomplished via the FSR/INDF interface. All
instructions that access program Flash memory via the
FSR/INDF interface will require one additional
instruction cycle to complete.
FIGURE 3-12:
7
1
FSRnH
PROGRAM FLASH
MEMORY MAP
0
Location Select
Location Select
0x2000
7
FSRnL
0x8000
0
0x0000
0x020
Bank 0
0x06F
0x0A0
Bank 1
0x0EF
0x120
Program
Flash
Memory
(low 8
bits)
Bank 2
0x16F
0xF20
Bank 30
0x29AF
DS40001726C-page 44
0xF6F
0xFFFF
0x7FFF
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
NOTES:
 2013-2016 Microchip Technology Inc.
DS40001726C-page 45
PIC16(L)F1713/6
4.0
DEVICE CONFIGURATION
Device configuration consists of Configuration Words,
Code Protection and Device ID.
4.1
Configuration Words
There are several Configuration Word bits that allow
different oscillator and memory protection options.
These are implemented as Configuration Word 1 at
8007h and Configuration Word 2 at 8008h.
Note:
The DEBUG bit in Configuration Words is
managed automatically by device
development tools including debuggers
and programmers. For normal device
operation, this bit should be maintained as
a ‘1’.
DS40001726C-page 46
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
4.2
Register Definitions: Configuration Words
REGISTER 4-1:
CONFIG1: CONFIGURATION WORD 1
R/P-1
R/P-1
R/P-1
FCMEN
IESO
CLKOUTEN
R/P-1
R/P-1
U-1
BOREN<1:0>
—
bit 13
R/P-1
(1)
CP
R/P-1
R/P-1
MCLRE
PWRTE
bit 8
R/P-1
R/P-1
R/P-1
WDTE<1:0>
R/P-1
R/P-1
FOSC<2:0>
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared
‘1’ = Bit is set
-n = Value when blank or after Bulk Erase
bit 13
FCMEN: Fail-Safe Clock Monitor Enable bit
1 = Fail-Safe Clock Monitor and internal/external switchover are both enabled.
0 = Fail-Safe Clock Monitor is disabled
bit 12
IESO: Internal External Switchover bit
1 = Internal/External Switchover mode is enabled
0 = Internal/External Switchover mode is disabled
bit 11
CLKOUTEN: Clock Out Enable bit
If FOSC configuration bits are set to LP, XT, HS modes:
This bit is ignored, CLKOUT function is disabled. Oscillator function on the CLKOUT pin.
All other FOSC modes:
1 = CLKOUT function is disabled. I/O function on the CLKOUT pin.
0 = CLKOUT function is enabled on the CLKOUT pin
bit 10-9
BOREN<1:0>: Brown-out Reset Enable bits
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
01 = BOR controlled by SBOREN bit of the BORCON register
00 = BOR disabled
bit 8
Unimplemented: Read as ‘1’
bit 7
CP: Code Protection bit(1)
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 6
MCLRE: MCLR/VPP Pin Function Select bit
If LVP bit = 1:
This bit is ignored.
If LVP bit = 0:
1 = MCLR/VPP pin function is MCLR; Weak pull-up enabled.
0 = MCLR/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of
WPUE3 bit.
bit 5
PWRTE: Power-up Timer Enable bit
1 = PWRT disabled
0 = PWRT enabled
bit 4-3
WDTE<1:0>: Watchdog Timer Enable bit
11 = WDT enabled
10 = WDT enabled while running and disabled in Sleep
01 = WDT controlled by the SWDTEN bit in the WDTCON register
00 = WDT disabled
 2013-2016 Microchip Technology Inc.
DS40001726C-page 47
PIC16(L)F1713/6
REGISTER 4-1:
bit 2-0
Note 1:
CONFIG1: CONFIGURATION WORD 1 (CONTINUED)
FOSC<2:0>: Oscillator Selection bits
111 = ECH: External Clock, High-Power mode (4-20 MHz): device clock supplied to CLKIN pin
110 = ECM: External Clock, Medium Power mode (0.5-4 MHz): device clock supplied to CLKIN pin
101 = ECL: External Clock, Low-Power mode (0-0.5 MHz): device clock supplied to CLKIN pin
100 = INTOSC oscillator: I/O function on CLKIN pin
011 = EXTRC oscillator: External RC circuit connected to CLKIN pin
010 = HS oscillator: High-speed crystal/resonator connected between OSC1 and OSC2 pins
001 = XT oscillator: Crystal/resonator connected between OSC1 and OSC2 pins
000 = LP oscillator: Low-power crystal connected between OSC1 and OSC2 pins
The entire Flash program memory will be erased when the code protection is turned off during an erase.
When a Bulk Erase Program Memory Command is executed, the entire program Flash memory and
configuration memory will be erased.
DS40001726C-page 48
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
REGISTER 4-2:
CONFIG2: CONFIGURATION WORD 2
R/P-1
LVP
(1)
R/P-1
DEBUG
R/P-1
(2)
LPBOR
R/P-1
(3)
BORV
R/P-1
R/P-1
STVREN
PLLEN
bit 13
bit 8
R/P-1
U-1
U-1
U-1
U-1
R/P-1
ZCDDIS
—
—
—
—
PPS1WAY
R/P-1
bit 7
R/P-1
WRT<1:0>
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared
‘1’ = Bit is set
-n = Value when blank or after Bulk Erase
bit 13
LVP: Low-Voltage Programming Enable bit(1)
1 = Low-voltage programming enabled
0 = High-voltage on MCLR must be used for programming
bit 12
DEBUG: In-Circuit Debugger Mode bit(2)
1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins
0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger
bit 11
LPBOR: Low-Power BOR Enable bit
1 = Low-Power Brown-out Reset is disabled
0 = Low-Power Brown-out Reset is enabled
bit 10
BORV: Brown-out Reset Voltage Selection bit(3)
1 = Brown-out Reset voltage (VBOR), low trip point selected.
0 = Brown-out Reset voltage (VBOR), high trip point selected.
bit 9
STVREN: Stack Overflow/Underflow Reset Enable bit
1 = Stack Overflow or Underflow will cause a Reset
0 = Stack Overflow or Underflow will not cause a Reset
bit 8
PLLEN: PLL Enable bit
1 = 4xPLL enabled
0 = 4xPLL disabled
bit 7
ZCDDIS: ZCD Disable bit
1 = ZCD disabled. ZCD can be enabled by setting the ZCDSEN bit of ZCDCON
0 = ZCD always enabled
bit 6-3
Unimplemented: Read as ‘1’
bit 2
PPS1WAY: PPSLOCK Bit One-Way Set Enable bit
1 = The PPSLOCK bit can only be set once after an unlocking sequence is executed; once PPSLOCK is set, all
future changes to PPS registers are prevented
0 = The PPSLOCK bit can be set and cleared as needed (provided an unlocking sequence is executed)
bit 1-0
WRT<1:0>: Flash Memory Self-Write Protection bits
4 kW Flash memory
11 = Write protection off
10 = 000h to 1FFh write protected, 200h to FFFh may be modified by PMCON control
01 = 000h to 7FFh write protected, 800h to FFFh may be modified by PMCON control
00 = 000h to FFFh write protected, no addresses may be modified by PMCON control
Note 1:
2:
3:
The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.
The DEBUG bit in Configuration Words is managed automatically by device development tools including debuggers
and programmers. For normal device operation, this bit should be maintained as a ‘1’.
See VBOR parameter for specific trip point voltages.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 49
PIC16(L)F1713/6
4.3
Code Protection
Code protection allows the device to be protected from
unauthorized access. Program memory protection is
controlled independently. Internal access to the
program memory is unaffected by any code protection
setting.
4.3.1
PROGRAM MEMORY PROTECTION
The entire program memory space is protected from
external reads and writes by the CP bit in Configuration
Words. When CP = 0, external reads and writes of
program memory are inhibited and a read will return all
‘0’s. The CPU can continue to read program memory,
regardless of the protection bit settings. Writing the
program memory is dependent upon the write
protection
setting.
See
Section 4.4
“Write
Protection” for more information.
4.4
Write Protection
Write protection allows the device to be protected from
unintended self-writes. Applications, such as boot
loader software, can be protected while allowing other
regions of the program memory to be modified.
The WRT<1:0> bits in Configuration Words define the
size of the program memory block that is protected.
4.5
User ID
Four memory locations (8000h-8003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
readable and writable during normal execution. See
Section 10.4 “User ID, Device ID and Configuration
Word Access” for more information on accessing
these memory locations. For more information on
checksum calculation, see the “PIC16(L)F170X
Memory Programming Specification” (DS41683).
DS40001726C-page 50
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PIC16(L)F1713/6
4.6
Device ID and Revision ID
The 14-bit device ID word is located at 8006h and the
14-bit revision ID is located at 8005h. These locations
are read-only and cannot be erased or modified. See
Section 10.4 “User ID, Device ID and Configuration
Word Access” for more information on accessing
these memory locations.
Development tools, such as device programmers and
debuggers, may be used to read the Device ID and
Revision ID.
4.7
Register Definitions: Device and Revision
REGISTER 4-3:
DEVID: DEVICE ID REGISTER
R
R
R
R
R
R
DEV<13:8>
bit 13
R
R
bit 8
R
R
R
R
R
R
DEV<7:0>
bit 7
bit 0
Legend:
R = Readable bit
‘1’ = Bit is set
bit 13-0
‘0’ = Bit is cleared
DEV<13:0>: Device ID bits
Device
DEVID<13:0> Values
PIC16F1713
11 0000 0100 0011 (3043h)
PIC16LF1713
11 0000 0100 0101 (3045h)
PIC16F1716
11 0000 0100 0010 (3042h)
PIC16LF1716
11 0000 0100 0100 (3044h)
REGISTER 4-4:
REVID: REVISION ID REGISTER
R
R
R
R
R
R
REV<13:8>
bit 13
R
R
bit 8
R
R
R
R
R
R
REV<7:0>
bit 7
bit 0
Legend:
R = Readable bit
‘1’ = Bit is set
bit 13-0
‘0’ = Bit is cleared
REV<13:0>: Revision ID bits
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5.0
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 5-1.
RESETS
There are multiple ways to reset this device:
•
•
•
•
•
•
•
•
•
Power-on Reset (POR)
Brown-out Reset (BOR)
Low-Power Brown-out Reset (LPBOR)
MCLR Reset
WDT Reset
RESET instruction
Stack Overflow
Stack Underflow
Programming mode exit
To allow VDD to stabilize, an optional power-up timer
can be enabled to extend the Reset time after a BOR
or POR event.
FIGURE 5-1:
SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Rev. 10-000006A
8/14/2013
ICSP™ Programming Mode Exit
RESET Instruction
Stack Underflow
Stack Overlfow
MCLRE
VPP/MCLR
Sleep
WDT
Time-out
Device
Reset
Power-on
Reset
VDD
BOR
Active(1)
Brown-out
Reset
LPBOR
Reset
Note 1:
R
LFINTOSC
Power-up
Timer
PWRTE
See Table 5-1 for BOR active conditions.
DS40001726C-page 52
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PIC16(L)F1713/6
5.1
Power-On Reset (POR)
5.2
Brown-Out Reset (BOR)
The POR circuit holds the device in Reset until VDD has
reached an acceptable level for minimum operation.
Slow rising VDD, fast operating speeds or analog
performance may require greater than minimum VDD.
The PWRT, BOR or MCLR features can be used to
extend the start-up period until all device operation
conditions have been met.
The BOR circuit holds the device in Reset when VDD
reaches a selectable minimum level. Between the
POR and BOR, complete voltage range coverage for
execution protection can be implemented.
5.1.1
•
•
•
•
POWER-UP TIMER (PWRT)
The Power-up Timer provides a nominal 64 ms
time-out on POR or Brown-out Reset.
The device is held in Reset as long as PWRT is active.
The PWRT delay allows additional time for the VDD to
rise to an acceptable level. The Power-up Timer is
enabled by clearing the PWRTE bit in Configuration
Words.
The Power-up Timer starts after the release of the POR
and BOR.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
TABLE 5-1:
The Brown-out Reset module has four operating
modes controlled by the BOREN<1:0> bits in Configuration Words. The four operating modes are:
BOR is always on
BOR is off when in Sleep
BOR is controlled by software
BOR is always off
Refer to Table 5-1 for more information.
The Brown-out Reset voltage level is selectable by
configuring the BORV bit in Configuration Words.
A VDD noise rejection filter prevents the BOR from
triggering on small events. If VDD falls below VBOR for
a duration greater than parameter TBORDC, the device
will reset. See Figure 5-2 for more information.
BOR OPERATING MODES
BOREN<1:0>
SBOREN
Device Mode
BOR Mode
11
X
X
Active
Awake
Active
10
X
Sleep
Disabled
1
X
Active
0
X
Disabled
X
X
Disabled
01
00
Instruction Execution upon:
Release of POR or Wake-up from Sleep
Waits for BOR ready(1) (BORRDY = 1)
Waits for BOR ready (BORRDY = 1)
Waits for BOR ready(1) (BORRDY = 1)
Begins immediately (BORRDY = x)
Note 1: In these specific cases, “Release of POR” and “Wake-up from Sleep”, there is no delay in start-up. The BOR
ready flag, (BORRDY = 1), will be set before the CPU is ready to execute instructions because the BOR
circuit is forced on by the BOREN<1:0> bits.
5.2.1
BOR IS ALWAYS ON
When the BOREN bits of Configuration Words are
programmed to ‘11’, the BOR is always on. The device
start-up will be delayed until the BOR is ready and VDD
is higher than the BOR threshold.
BOR protection is active during Sleep. The BOR does
not delay wake-up from Sleep.
5.2.2
BOR IS OFF IN SLEEP
When the BOREN bits of Configuration Words are
programmed to ‘10’, the BOR is on, except in Sleep.
The device start-up will be delayed until the BOR is
ready and VDD is higher than the BOR threshold.
5.2.3
BOR CONTROLLED BY SOFTWARE
When the BOREN bits of Configuration Words are
programmed to ‘01’, the BOR is controlled by the
SBOREN bit of the BORCON register. The device
start-up is not delayed by the BOR ready condition or
the VDD level.
BOR protection begins as soon as the BOR circuit is
ready. The status of the BOR circuit is reflected in the
BORRDY bit of the BORCON register.
BOR protection is unchanged by Sleep.
BOR protection is not active during Sleep. The device
wake-up will be delayed until the BOR is ready.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
FIGURE 5-2:
BROWN-OUT SITUATIONS
VDD
VBOR
Internal
Reset
TPWRT(1)
VDD
VBOR
Internal
Reset
< TPWRT
TPWRT(1)
VDD
VBOR
Internal
Reset
Note 1:
5.3
TPWRT(1)
TPWRT delay only if PWRTE bit is programmed to ‘0’.
Register Definitions: BOR Control
REGISTER 5-1:
BORCON: BROWN-OUT RESET CONTROL REGISTER
R/W-1/u
R/W-0/u
U-0
U-0
U-0
U-0
U-0
R-q/u
SBOREN
BORFS(1)
—
—
—
—
—
BORRDY
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
SBOREN: Software Brown-out Reset Enable bit
If BOREN <1:0> in Configuration Words  01:
SBOREN is read/write, but has no effect on the BOR.
If BOREN <1:0> in Configuration Words = 01:
1 = BOR Enabled
0 = BOR Disabled
bit 6
BORFS: Brown-out Reset Fast Start bit(1)
If BOREN<1:0> = 11 (Always on) or BOREN<1:0> = 00 (Always off)
BORFS is Read/Write, but has no effect.
If BOREN <1:0> = 10 (Disabled in Sleep) or BOREN<1:0> = 01 (Under software control):
1 = Band gap is forced on always (covers sleep/wake-up/operating cases)
0 = Band gap operates normally, and may turn off
bit 5-1
Unimplemented: Read as ‘0’
bit 0
BORRDY: Brown-out Reset Circuit Ready Status bit
1 = The Brown-out Reset circuit is active
0 = The Brown-out Reset circuit is inactive
Note 1:
BOREN<1:0> bits are located in Configuration Words.
DS40001726C-page 54
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PIC16(L)F1713/6
5.4
Low-Power Brown-Out Reset
(LPBOR)
The Low-Power Brown-out Reset (LPBOR) is an
essential part of the Reset subsystem. Refer to
Figure 5-1 to see how the BOR interacts with other
modules.
The LPBOR is used to monitor the external VDD pin.
When too low of a voltage is detected, the device is
held in Reset. When this occurs, a register bit (BOR) is
changed to indicate that a BOR Reset has occurred.
The same bit is set for both the BOR and the LPBOR.
Refer to Register 5-2.
5.4.1
ENABLING LPBOR
The LPBOR is controlled by the LPBOR bit of
Configuration Words. When the device is erased, the
LPBOR module defaults to disabled.
5.4.1.1
LPBOR Module Output
The output of the LPBOR module is a signal indicating
whether or not a Reset is to be asserted. This signal is
OR’d together with the Reset signal of the BOR
module to provide the generic BOR signal, which goes
to the PCON register and to the power control block.
5.5
MCLR
5.6
Watchdog Timer (WDT) Reset
The Watchdog Timer generates a Reset if the firmware
does not issue a CLRWDT instruction within the time-out
period. The TO and PD bits in the STATUS register are
changed to indicate the WDT Reset. See Section 9.0
“Watchdog Timer (WDT)” for more information.
5.7
RESET Instruction
A RESET instruction will cause a device Reset. The RI
bit in the PCON register will be set to ‘0’. See Table 5-4
for default conditions after a RESET instruction has
occurred.
5.8
Stack Overflow/Underflow Reset
The device can reset when the Stack Overflows or
Underflows. The STKOVF or STKUNF bits of the PCON
register indicate the Reset condition. These Resets are
enabled by setting the STVREN bit in Configuration
Words. See 3.6.2 “Overflow/Underflow Reset” for
more information.
5.9
Programming Mode Exit
Upon exit of Programming mode, the device will
behave as if a POR had just occurred.
The MCLR is an optional external input that can reset
the device. The MCLR function is controlled by the
MCLRE bit of Configuration Words and the LVP bit of
Configuration Words (Table 5-2).
5.10
TABLE 5-2:
The Power-up Timer is controlled by the PWRTE bit of
Configuration Words.
MCLR CONFIGURATION
MCLRE
LVP
MCLR
0
0
Disabled
1
0
Enabled
x
1
Enabled
5.5.1
MCLR ENABLED
When MCLR is enabled and the pin is held low, the
device is held in Reset. The MCLR pin is connected to
VDD through an internal weak pull-up.
The device has a noise filter in the MCLR Reset path.
The filter will detect and ignore small pulses.
Note:
5.5.2
A Reset does not drive the MCLR pin low.
MCLR DISABLED
When MCLR is disabled, the pin functions as a general
purpose input and the internal weak pull-up is under
software control. See Section 11.1 “PORTA Registers” for more information.
 2013-2016 Microchip Technology Inc.
Power-Up Timer
The Power-up Timer optionally delays device execution
after a BOR or POR event. This timer is typically used to
allow VDD to stabilize before allowing the device to start
running.
5.11
Start-up Sequence
Upon the release of a POR or BOR, the following must
occur before the device will begin executing:
1.
2.
3.
Power-up Timer runs to completion (if enabled).
Oscillator start-up timer runs to completion (if
required for oscillator source).
MCLR must be released (if enabled).
The total time-out will vary based on oscillator configuration and Power-up Timer configuration. See
Section 6.0 “Oscillator Module (with Fail-Safe
Clock Monitor)” for more information.
The Power-up Timer and oscillator start-up timer run
independently of MCLR Reset. If MCLR is kept low
long enough, the Power-up Timer and oscillator
start-up timer will expire. Upon bringing MCLR high, the
device will begin execution after 10 FOSC cycles (see
Figure 5-3). This is useful for testing purposes or to
synchronize more than one device operating in parallel.
DS40001726C-page 55
PIC16(L)F1713/6
FIGURE 5-3:
RESET START-UP SEQUENCE
VDD
Internal POR
TPWRT
Power-up Timer
MCLR
TMCLR
Internal RESET
Oscillator Modes
External Crystal
TOST
Oscillator Start-up Timer
Oscillator
FOSC
Internal Oscillator
Oscillator
FOSC
External Clock (EC)
CLKIN
FOSC
DS40001726C-page 56
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PIC16(L)F1713/6
5.12
Determining the Cause of a Reset
Upon any Reset, multiple bits in the STATUS and
PCON register are updated to indicate the cause of the
Reset. Table 5-3 and Table 5-4 show the Reset
conditions of these registers.
TABLE 5-3:
RESET STATUS BITS AND THEIR SIGNIFICANCE
STKOVF STKUNF RWDT
RMCLR
RI
POR
BOR
TO
PD
Condition
0
0
1
1
1
0
x
1
1
Power-on Reset
0
0
1
1
1
0
x
0
x
Illegal, TO is set on POR
0
0
1
1
1
0
x
x
0
Illegal, PD is set on POR
0
0
u
1
1
u
0
1
1
Brown-out Reset
u
u
0
u
u
u
u
0
u
WDT Reset
u
u
u
u
u
u
u
0
0
WDT Wake-up from Sleep
u
u
u
u
u
u
u
1
0
Interrupt Wake-up from Sleep
u
u
u
0
u
u
u
u
u
MCLR Reset during normal operation
u
u
u
0
u
u
u
1
0
MCLR Reset during Sleep
u
u
u
u
0
u
u
u
u
RESET Instruction Executed
1
u
u
u
u
u
u
u
u
Stack Overflow Reset (STVREN = 1)
u
1
u
u
u
u
u
u
u
Stack Underflow Reset (STVREN = 1)
TABLE 5-4:
RESET CONDITION FOR SPECIAL REGISTERS
Program
Counter
STATUS
Register
PCON
Register
Power-on Reset
0000h
---1 1000
00-- 110x
MCLR Reset during normal operation
0000h
---u uuuu
uu-- 0uuu
MCLR Reset during Sleep
0000h
---1 0uuu
uu-- 0uuu
WDT Reset
0000h
---0 uuuu
uu-- uuuu
WDT Wake-up from Sleep
PC + 1
---0 0uuu
uu-- uuuu
Brown-out Reset
0000h
---1 1uuu
00-- 11u0
---1 0uuu
uu-- uuuu
---u uuuu
uu-- u0uu
Condition
Interrupt Wake-up from Sleep
RESET Instruction Executed
PC + 1
(1)
0000h
Stack Overflow Reset (STVREN = 1)
0000h
---u uuuu
1u-- uuuu
Stack Underflow Reset (STVREN = 1)
0000h
---u uuuu
u1-- uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’.
Note 1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on
the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 57
PIC16(L)F1713/6
5.13
Power Control (PCON) Register
The PCON register bits are shown in Register 5-2.
The Power Control (PCON) register contains flag bits
to differentiate between a:
•
•
•
•
•
•
•
Power-on Reset (POR)
Brown-out Reset (BOR)
Reset Instruction Reset (RI)
MCLR Reset (RMCLR)
Watchdog Timer Reset (RWDT)
Stack Underflow Reset (STKUNF)
Stack Overflow Reset (STKOVF)
5.14
Register Definitions: Power Control
REGISTER 5-2:
PCON: POWER CONTROL REGISTER
R/W/HS-0/q
R/W/HS-0/q
U-0
STKOVF
STKUNF
—
R/W/HC-1/q R/W/HC-1/q
RWDT
R/W/HC-1/q
R/W/HC-q/u
R/W/HC-q/u
RI
POR
BOR
RMCLR
bit 7
bit 0
Legend:
HC = Bit is cleared by hardware
HS = Bit is set by hardware
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-m/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
STKOVF: Stack Overflow Flag bit
1 = A Stack Overflow occurred
0 = A Stack Overflow has not occurred or cleared by firmware
bit 6
STKUNF: Stack Underflow Flag bit
1 = A Stack Underflow occurred
0 = A Stack Underflow has not occurred or cleared by firmware
bit 5
Unimplemented: Read as ‘0’
bit 4
RWDT: Watchdog Timer Reset Flag bit
1 = A Watchdog Timer Reset has not occurred or set to ‘1’ by firmware
0 = A Watchdog Timer Reset has occurred (cleared by hardware)
bit 3
RMCLR: MCLR Reset Flag bit
1 = A MCLR Reset has not occurred or set to ‘1’ by firmware
0 = A MCLR Reset has occurred (cleared by hardware)
bit 2
RI: RESET Instruction Flag bit
1 = A RESET instruction has not been executed or set to ‘1’ by firmware
0 = A RESET instruction has been executed (cleared by hardware)
bit 1
POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0
BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset
occurs)
DS40001726C-page 58
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PIC16(L)F1713/6
TABLE 5-5:
SUMMARY OF REGISTERS ASSOCIATED WITH RESETS
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
BORCON
SBOREN
BORFS
—
—
—
—
—
BORRDY
54
PCON
STKOVF
STKUNF
—
RWDT
RMCLR
RI
POR
BOR
58
STATUS
—
—
—
TO
PD
Z
DC
C
19
WDTCON
—
—
SWDTEN
98
WDTPS<4:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
6.0
OSCILLATOR MODULE (WITH
FAIL-SAFE CLOCK MONITOR)
6.1
Overview
The oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing performance and minimizing power consumption. Figure 6-1
illustrates a block diagram of the oscillator module.
Clock sources can be supplied from external oscillators,
quartz crystal resonators, ceramic resonators and
Resistor-Capacitor (RC) circuits. In addition, the system
clock source can be supplied from one of two internal
oscillators and PLL circuits, with a choice of speeds
selectable via software. Additional clock features
include:
• Selectable system clock source between external
or internal sources via software.
• Two-Speed Start-up mode, which minimizes
latency between external oscillator start-up and
code execution.
• Fail-Safe Clock Monitor (FSCM) designed to
detect a failure of the external clock source (LP,
XT, HS, ECH, ECM, ECL or EXTRC modes) and
switch automatically to the internal oscillator.
• Oscillator Start-up Timer (OST) ensures stability
of crystal oscillator sources.
DS40001726C-page 60
The oscillator module can be configured in one of the
following clock modes.
1.
2.
3.
4.
5.
6.
7.
8.
ECL – External Clock Low-Power mode
(0 MHz to 0.5 MHz)
ECM – External Clock Medium Power mode
(0.5 MHz to 4 MHz)
ECH – External Clock High-Power mode
(4 MHz to 32 MHz)
LP – 32 kHz Low-Power Crystal mode.
XT – Medium Gain Crystal or Ceramic Resonator
Oscillator mode (up to 4 MHz)
HS – High Gain Crystal or Ceramic Resonator
mode (4 MHz to 20 MHz)
EXTRC – External Resistor-Capacitor
INTOSC – Internal oscillator (31 kHz to 32 MHz)
Clock Source modes are selected by the FOSC<2:0>
bits in the Configuration Words. The FOSC bits
determine the type of oscillator that will be used when
the device is first powered.
The ECH, ECM, and ECL clock modes rely on an
external logic level signal as the device clock source.
The LP, XT, and HS clock modes require an external
crystal or resonator to be connected to the device.
Each mode is optimized for a different frequency range.
The EXTRC clock mode requires an external resistor
and capacitor to set the oscillator frequency.
The INTOSC internal oscillator block produces low,
medium, and high-frequency clock sources,
designated LFINTOSC, MFINTOSC and HFINTOSC.
(see Internal Oscillator Block, Figure 6-1). A wide
selection of device clock frequencies may be derived
from these three clock sources.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM
FIGURE 6-1:
Secondary
Oscillator Timer1
Timer1 Clock Source Option
for other modules
SOSCO
T1OSCEN
Enable
Oscillator
SOSCI
T1OSC
01
External
Oscillator
LP, XT, HS, RC, EC
OSC2
0
Sleep
00
PRIMUX
OSC1
4 x PLL
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
250 kHz
125 kHz
62.5 kHz
31.25 kHz
PLLMUX
500 kHz
Source
16 MHz
(HFINTOSC)
500 kHz
(MFINTOSC)
31 kHz
Source
INTOSC
SCS<1:0>
31 kHz
0000
31 kHz (LFINTOSC)
WDT, PWRT, Fail-Safe Clock Monitor
Two-Speed Start-up and other modules
Inputs
FOSC<2:0>
PLLEN or
SPLLEN
0
=100
1
=00
≠100
≠00
X
0
Outputs
IRCF
PRIMUX
PLLMUX
x
1
0
=1110
1
1
≠1110
1
0
x
0
0
1
x
0
1
X
X
X
X
 2013-2016 Microchip Technology Inc.
1X
1111
MUX
HFPLL
Postscaler
Internal
Oscillator
Block
FOSC
To CPU and
Peripherals
1
IRCF<3:0>
SCS
Sleep
0
1
DS40001726C-page 61
PIC16(L)F1713/6
6.2
Clock Source Types
Clock sources can be classified as external or internal.
External clock sources rely on external circuitry for the
clock source to function. Examples are: oscillator
modules (ECH, ECM, ECL mode), quartz crystal resonators or ceramic resonators (LP, XT and HS modes)
and Resistor-Capacitor (EXTRC) mode circuits.
Internal clock sources are contained within the
oscillator module. The internal oscillator block has two
internal oscillators and a dedicated Phase-Lock Loop
(HFPLL) that are used to generate three internal
system clock sources: the 16 MHz High-Frequency
Internal Oscillator (HFINTOSC), 500 kHz (MFINTOSC)
and the 31 kHz Low-Frequency Internal Oscillator
(LFINTOSC).
The system clock can be selected between external or
internal clock sources via the System Clock Select
(SCS) bits in the OSCCON register. See Section 6.3
“Clock Switching” for additional information.
6.2.1
FIGURE 6-2:
EXTERNAL CLOCK (EC)
MODE OPERATION
OSC1/CLKIN
Clock from
Ext. System
PIC® MCU
FOSC/4 or I/O(1)
Note 1:
OSC2/CLKOUT
Output depends upon CLKOUTEN bit of the
Configuration Words.
EXTERNAL CLOCK SOURCES
An external clock source can be used as the device
system clock by performing one of the following
actions:
• Program the FOSC<2:0> bits in the Configuration
Words to select an external clock source that will
be used as the default system clock upon a
device Reset.
• Write the SCS<1:0> bits in the OSCCON register
to switch the system clock source to:
- Secondary oscillator during run-time, or
- An external clock source determined by the
value of the FOSC bits.
See Section 6.3 “Clock Switching”for more information.
6.2.1.1
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC® MCU design is fully
static, stopping the external clock input will have the
effect of halting the device while leaving all data intact.
Upon restarting the external clock, the device will
resume operation as if no time had elapsed.
EC Mode
The External Clock (EC) mode allows an externally
generated logic level signal to be the system clock
source. When operating in this mode, an external clock
source is connected to the OSC1 input.
OSC2/CLKOUT is available for general purpose I/O or
CLKOUT. Figure 6-2 shows the pin connections for EC
mode.
6.2.1.2
LP, XT, HS Modes
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 and OSC2 (Figure 6-3). The three modes select
a low, medium or high gain setting of the internal
inverter-amplifier to support various resonator types
and speed.
LP Oscillator mode selects the lowest gain setting of the
internal inverter-amplifier. LP mode current consumption
is the least of the three modes. This mode is designed to
drive only 32.768 kHz tuning-fork type crystals (watch
crystals).
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current consumption is the medium of the three modes.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode selects the highest gain setting of the
internal inverter-amplifier. HS mode current consumption
is the highest of the three modes. This mode is best
suited for resonators that require a high drive setting.
Figure 6-3 and Figure 6-4 show typical circuits for
quartz crystal and ceramic resonators, respectively.
EC mode has three power modes to select from through
Configuration Words:
• ECH – High power, 4-32 MHz
• ECM – Medium power, 0.5-4 MHz
• ECL – Low power, 0-0.5 MHz
DS40001726C-page 62
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 6-3:
QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
FIGURE 6-4:
CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
PIC® MCU
PIC® MCU
OSC1/CLKIN
C1
To Internal
Logic
Quartz
Crystal
C2
Note 1:
2:
OSC1/CLKIN
RS(1)
RF(2)
C1
Sleep
OSC2/CLKOUT
A series resistor (RS) may be required for
quartz crystals with low drive level.
RP(3)
C2 Ceramic
RS(1)
Resonator
Note 1:
The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
Note 1: Quartz
crystal
characteristics
vary
according to type, package and
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
2: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator design assistance, reference
the following Microchip Application Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design”
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
 2013-2016 Microchip Technology Inc.
To Internal
Logic
RF(2)
Sleep
OSC2/CLKOUT
A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
3: An additional parallel feedback resistor (RP)
may be required for proper ceramic resonator
operation.
6.2.1.3
Oscillator Start-up Timer (OST)
If the oscillator module is configured for LP, XT or HS
modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended,
unless either FSCM or Two-Speed Start-Up are
enabled. In this case, code will continue to execute at
the selected INTOSC frequency while the OST is
counting. The OST ensures that the oscillator circuit,
using a quartz crystal resonator or ceramic resonator,
has started and is providing a stable system clock to
the oscillator module.
In order to minimize latency between external oscillator
start-up and code execution, the Two-Speed Clock
Start-up mode can be selected (see Section 6.4
“Two-Speed Clock Start-up Mode”).
DS40001726C-page 63
PIC16(L)F1713/6
6.2.1.4
4x PLL
The oscillator module contains a 4x PLL that can be
used with both external and internal clock sources to
provide a system clock source. The input frequency for
the 4x PLL must fall within specifications. See the PLL
Clock Timing Specifications in Table 34-9.
The 4x PLL may be enabled for use by one of two
methods:
1.
2.
Program the PLLEN bit in Configuration Words
to a ‘1’.
Write the SPLLEN bit in the OSCCON register to
a ‘1’. If the PLLEN bit in Configuration Words is
programmed to a ‘1’, then the value of SPLLEN
is ignored.
6.2.1.5
Secondary Oscillator
The secondary oscillator is a separate crystal oscillator
that is associated with the Timer1 peripheral. It is
optimized for timekeeping operations with a 32.768
kHz crystal connected between the SOSCO and
SOSCI device pins.
The secondary oscillator can be used as an alternate
system clock source and can be selected during
run-time using clock switching. Refer to Section 6.3
“Clock Switching” for more information.
FIGURE 6-5:
Note 1: Quartz
crystal
characteristics
vary
according to type, package and
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
2: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator design assistance, reference
the following Microchip Application Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design”
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
• TB097, “Interfacing a Micro Crystal
MS1V-T1K 32.768 kHz Tuning Fork
Crystal to a PIC16F690/SS” (DS91097)
• AN1288, “Design Practices for
Low-Power External Oscillators”
(DS01288)
QUARTZ CRYSTAL
OPERATION
(SECONDARY
OSCILLATOR)
PIC® MCU
SOSCI
C1
To Internal
Logic
32.768 kHz
Quartz
Crystal
C2
DS40001726C-page 64
SOSCO
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PIC16(L)F1713/6
6.2.1.6
External RC Mode
6.2.2
The external Resistor-Capacitor (EXTRC) mode supports the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required.
The RC circuit connects to OSC1. OSC2/CLKOUT is
available for general purpose I/O or CLKOUT. The
function of the OSC2/CLKOUT pin is determined by the
CLKOUTEN bit in Configuration Words.
Figure 6-6 shows the external RC mode connections.
FIGURE 6-6:
VDD
EXTERNAL RC MODES
PIC® MCU
The device may be configured to use the internal
oscillator block as the system clock by performing one
of the following actions:
• Program the FOSC<2:0> bits in Configuration
Words to select the INTOSC clock source, which
will be used as the default system clock upon a
device Reset.
• Write the SCS<1:0> bits in the OSCCON register
to switch the system clock source to the internal
oscillator during run-time. See Section 6.3
“Clock Switching” for more information.
In INTOSC mode, OSC1/CLKIN is available for general
purpose I/O. OSC2/CLKOUT is available for general
purpose I/O or CLKOUT.
The function of the OSC2/CLKOUT pin is determined
by the CLKOUTEN bit in Configuration Words.
REXT
OSC1/CLKIN
Internal
Clock
CEXT
VSS
The internal oscillator block has two independent
oscillators and a dedicated Phase-Lock Loop, HFPLL
that can produce one of three internal system clock
sources.
1.
FOSC/4 or I/O(1)
OSC2/CLKOUT
Recommended values: 10 k  REXT  100 k, <3V
3 k  REXT  100 k, 3-5V
CEXT > 20 pF, 2-5V
Note 1:
INTERNAL CLOCK SOURCES
Output depends upon CLKOUTEN bit of the
Configuration Words.
The RC oscillator frequency is a function of the supply
voltage, the resistor (REXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
• threshold voltage variation
• component tolerances
• packaging variations in capacitance
2.
3.
The HFINTOSC (High-Frequency Internal
Oscillator) is factory calibrated and operates at
16 MHz. The HFINTOSC source is generated
from the 500 kHz MFINTOSC source and the
dedicated Phase-Lock Loop, HFPLL. The
frequency of the HFINTOSC can be
user-adjusted via software using the OSCTUNE
register (Register 6-3).
The MFINTOSC (Medium Frequency Internal
Oscillator) is factory calibrated and operates at
500 kHz. The frequency of the MFINTOSC can
be user-adjusted via software using the
OSCTUNE register (Register 6-3).
The LFINTOSC (Low-Frequency Internal
Oscillator) is uncalibrated and operates at
31 kHz.
The user also needs to take into account variation due
to tolerance of external RC components used.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
6.2.2.1
HFINTOSC
The High-Frequency Internal Oscillator (HFINTOSC) is
a factory calibrated 16 MHz internal clock source. The
frequency of the HFINTOSC can be altered via
software using the OSCTUNE register (Register 6-3).
The output of the HFINTOSC connects to a postscaler
and multiplexer (see Figure 6-1). One of multiple
frequencies derived from the HFINTOSC can be
selected via software using the IRCF<3:0> bits of the
OSCCON register. See Section 6.2.2.7 “Internal
Oscillator Clock Switch Timing” for more information.
The HFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired HF frequency, and
• FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’
A fast start-up oscillator allows internal circuits to power
up and stabilize before switching to HFINTOSC.
The High-Frequency Internal Oscillator Ready bit
(HFIOFR) of the OSCSTAT register indicates when the
HFINTOSC is running.
The High-Frequency Internal Oscillator Status Locked
bit (HFIOFL) of the OSCSTAT register indicates when
the HFINTOSC is running within 2% of its final value.
The High-Frequency Internal Oscillator Stable bit
(HFIOFS) of the OSCSTAT register indicates when the
HFINTOSC is running within 0.5% of its final value.
6.2.2.2
MFINTOSC
The
Medium
Frequency
Internal
Oscillator
(MFINTOSC) is a factory calibrated 500 kHz internal
clock source. The frequency of the MFINTOSC can be
altered via software using the OSCTUNE register
(Register 6-3).
The output of the MFINTOSC connects to a postscaler
and multiplexer (see Figure 6-1). One of nine
frequencies derived from the MFINTOSC can be
selected via software using the IRCF<3:0> bits of the
OSCCON register. See Section 6.2.2.7 “Internal
Oscillator Clock Switch Timing” for more information.
The MFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired HF frequency, and
• FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’
The Medium Frequency Internal Oscillator Ready bit
(MFIOFR) of the OSCSTAT register indicates when the
MFINTOSC is running.
DS40001726C-page 66
6.2.2.3
Internal Oscillator Frequency
Adjustment
The 500 kHz internal oscillator is factory calibrated.
This internal oscillator can be adjusted in software by
writing to the OSCTUNE register (Register 6-3). Since
the HFINTOSC and MFINTOSC clock sources are
derived from the 500 kHz internal oscillator a change in
the OSCTUNE register value will apply to both.
The default value of the OSCTUNE register is ‘0’. The
value is a 6-bit two’s complement number. A value of
1Fh will provide an adjustment to the maximum
frequency. A value of 20h will provide an adjustment to
the minimum frequency.
When the OSCTUNE register is modified, the oscillator
frequency will begin shifting to the new frequency. Code
execution continues during this shift. There is no
indication that the shift has occurred.
OSCTUNE does not affect the LFINTOSC frequency.
Operation of features that depend on the LFINTOSC
clock source frequency, such as the Power-up Timer
(PWRT), Watchdog Timer (WDT), Fail-Safe Clock
Monitor (FSCM) and peripherals, are not affected by the
change in frequency.
6.2.2.4
LFINTOSC
The Low-Frequency Internal Oscillator (LFINTOSC) is
an uncalibrated 31 kHz internal clock source.
The output of the LFINTOSC connects to a multiplexer
(see Figure 6-1). Select 31 kHz, via software, using the
IRCF<3:0> bits of the OSCCON register. See
Section 6.2.2.7 “Internal Oscillator Clock Switch
Timing” for more information. The LFINTOSC is also
the frequency for the Power-up Timer (PWRT),
Watchdog Timer (WDT) and Fail-Safe Clock Monitor
(FSCM).
The LFINTOSC is enabled by selecting 31 kHz
(IRCF<3:0> bits of the OSCCON register = 000) as the
system clock source (SCS bits of the OSCCON
register = 1x), or when any of the following are
enabled:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired LF frequency, and
• FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’
Peripherals that use the LFINTOSC are:
• Power-up Timer (PWRT)
• Watchdog Timer (WDT)
• Fail-Safe Clock Monitor (FSCM)
The Low-Frequency Internal Oscillator Ready bit
(LFIOFR) of the OSCSTAT register indicates when the
LFINTOSC is running.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
6.2.2.5
Internal Oscillator Frequency
Selection
The system clock speed can be selected via software
using the Internal Oscillator Frequency Select bits
IRCF<3:0> of the OSCCON register.
The postscaled output of the 16 MHz HFINTOSC,
500 kHz MFINTOSC, and 31 kHz LFINTOSC connect
to a multiplexer (see Figure 6-1). The Internal Oscillator
Frequency Select bits IRCF<3:0> of the OSCCON
register select the frequency output of the internal
oscillators. One of the following frequencies can be
selected via software:
-
32 MHz (requires 4x PLL)
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz (default after Reset)
250 kHz
125 kHz
62.5 kHz
31.25 kHz
31 kHz (LFINTOSC)
Note:
Following any Reset, the IRCF<3:0> bits
of the OSCCON register are set to ‘0111’
and the frequency selection is set to
500 kHz. The user can modify the IRCF
bits to select a different frequency.
6.2.2.6
32 MHz Internal Oscillator
Frequency Selection
The Internal Oscillator Block can be used with the
4x PLL associated with the External Oscillator Block to
produce a 32 MHz internal system clock source. The
following settings are required to use the 32 MHz
internal clock source:
• The FOSC bits in Configuration Words must be
set to use the INTOSC source as the device
system clock (FOSC<2:0> = 100).
• The SCS bits in the OSCCON register must be
cleared to use the clock determined by
FOSC<2:0> in Configuration Words
(SCS<1:0> = 00).
• The IRCF bits in the OSCCON register must be
set to the 8 MHz HFINTOSC set to use
(IRCF<3:0> = 1110).
• The SPLLEN bit in the OSCCON register must be
set to enable the 4x PLL, or the PLLEN bit of the
Configuration Words must be programmed to a
‘1’.
Note:
When using the PLLEN bit of the
Configuration Words, the 4x PLL cannot
be disabled by software and the SPLLEN
option will not be available.
The 4x PLL is not available for use with the internal
oscillator when the SCS bits of the OSCCON register
are set to ‘1x’. The SCS bits must be set to ‘00’ to use
the 4x PLL with the internal oscillator.
The IRCF<3:0> bits of the OSCCON register allow
duplicate selections for some frequencies. These
duplicate choices can offer system design trade-offs.
Lower power consumption can be obtained when
changing oscillator sources for a given frequency.
Faster transition times can be obtained between
frequency changes that use the same oscillator source.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 67
PIC16(L)F1713/6
6.2.2.7
Internal Oscillator Clock Switch
Timing
When switching between the HFINTOSC, MFINTOSC
and the LFINTOSC, the new oscillator may already be
shut down to save power (see Figure 6-7). If this is the
case, there is a delay after the IRCF<3:0> bits of the
OSCCON register are modified before the frequency
selection takes place. The OSCSTAT register will
reflect the current active status of the HFINTOSC,
MFINTOSC and LFINTOSC oscillators. The sequence
of a frequency selection is as follows:
1.
2.
3.
4.
5.
6.
7.
IRCF<3:0> bits of the OSCCON register are
modified.
If the new clock is shut down, a clock start-up
delay is started.
Clock switch circuitry waits for a falling edge of
the current clock.
The current clock is held low and the clock
switch circuitry waits for a rising edge in the new
clock.
The new clock is now active.
The OSCSTAT register is updated as required.
Clock switch is complete.
See Figure 6-7 for more details.
If the internal oscillator speed is switched between two
clocks of the same source, there is no start-up delay
before the new frequency is selected. Clock switching
time delays are shown in Table 6-1.
Start-up delay specifications are located in the
oscillator tables of Section 34.0 “Electrical
Specifications”.
DS40001726C-page 68
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 6-7:
HFINTOSC/
MFINTOSC
INTERNAL OSCILLATOR SWITCH TIMING
LFINTOSC (FSCM and WDT disabled)
HFINTOSC/
MFINTOSC
Start-up Time
2-cycle Sync
Running
LFINTOSC
IRCF <3:0>
0
0
System Clock
HFINTOSC/
MFINTOSC
LFINTOSC (Either FSCM or WDT enabled)
HFINTOSC/
MFINTOSC
2-cycle Sync
Running
LFINTOSC
0
IRCF <3:0>
0
System Clock
LFINTOSC
HFINTOSC/MFINTOSC
LFINTOSC turns off unless WDT or FSCM is enabled
LFINTOSC
Start-up Time
2-cycle Sync
Running
HFINTOSC/
MFINTOSC
IRCF <3:0>
=0
0
System Clock
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
6.3
Clock Switching
6.3.3
SECONDARY OSCILLATOR
The system clock source can be switched between
external and internal clock sources via software using
the System Clock Select (SCS) bits of the OSCCON
register. The following clock sources can be selected
using the SCS bits:
The secondary oscillator is a separate crystal oscillator
associated with the Timer1 peripheral. It is optimized
for timekeeping operations with a 32.768 kHz crystal
connected between the SOSCO and SOSCI device
pins.
• Default system oscillator determined by FOSC
bits in Configuration Words
• Timer1 32 kHz crystal oscillator
• Internal Oscillator Block (INTOSC)
The secondary oscillator is enabled using the
T1OSCEN control bit in the T1CON register. See
Section 26.0 “Timer1 Module with Gate Control” for
more information about the Timer1 peripheral.
6.3.1
SYSTEM CLOCK SELECT (SCS)
BITS
The System Clock Select (SCS) bits of the OSCCON
register select the system clock source that is used for
the CPU and peripherals.
• When the SCS bits of the OSCCON register = 00,
the system clock source is determined by the
value of the FOSC<2:0> bits in the Configuration
Words.
• When the SCS bits of the OSCCON register = 01,
the system clock source is the secondary oscillator.
• When the SCS bits of the OSCCON register = 1x,
the system clock source is chosen by the internal
oscillator frequency selected by the IRCF<3:0>
bits of the OSCCON register. After a Reset, the
SCS bits of the OSCCON register are always
cleared.
Note:
Any automatic clock switch, which may
occur from Two-Speed Start-up or
Fail-Safe Clock Monitor, does not update
the SCS bits of the OSCCON register. The
user can monitor the OSTS bit of the
OSCSTAT register to determine the current
system clock source.
When switching between clock sources, a delay is
required to allow the new clock to stabilize. These
oscillator delays are shown in Table 6-1.
6.3.2
6.3.4
SECONDARY OSCILLATOR READY
(SOSCR) BIT
The user must ensure that the secondary oscillator is
ready to be used before it is selected as a system clock
source. The Secondary Oscillator Ready (SOSCR) bit
of the OSCSTAT register indicates whether the
secondary oscillator is ready to be used. After the
SOSCR bit is set, the SCS bits can be configured to
select the secondary oscillator.
6.3.5
CLOCK SWITCHING BEFORE
SLEEP
When clock switching from an old clock to a new clock
is requested just prior to entering Sleep mode, it is
necessary to confirm that the switch is complete before
the SLEEP instruction is executed. Failure to do so may
result in an incomplete switch and consequential loss
of the system clock altogether. Clock switching is
confirmed by monitoring the clock status bits in the
OSCSTAT register. Switch confirmation can be
accomplished by sensing that the ready bit for the new
clock is set or the ready bit for the old clock is cleared.
For example, when switching between the internal
oscillator with the PLL and the internal oscillator without
the PLL, monitor the PLLR bit. When PLLR is set, the
switch to 32 MHz operation is complete. Conversely,
when PLLR is cleared, the switch from 32 MHz
operation to the selected internal clock is complete.
OSCILLATOR START-UP TIMER
STATUS (OSTS) BIT
The Oscillator Start-up Timer Status (OSTS) bit of the
OSCSTAT register indicates whether the system clock
is running from the external clock source, as defined by
the FOSC<2:0> bits in the Configuration Words, or
from the internal clock source. In particular, OSTS
indicates that the Oscillator Start-up Timer (OST) has
timed out for LP, XT or HS modes. The OST does not
reflect the status of the secondary oscillator.
DS40001726C-page 70
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PIC16(L)F1713/6
6.4
Two-Speed Clock Start-up Mode
Two-Speed Start-up mode provides additional power
savings by minimizing the latency between external
oscillator start-up and code execution. In applications
that make heavy use of the Sleep mode, Two-Speed
Start-up will remove the external oscillator start-up
time from the time spent awake and can reduce the
overall power consumption of the device. This mode
allows the application to wake-up from Sleep, perform
a few instructions using the INTOSC internal oscillator
block as the clock source and go back to Sleep without
waiting for the external oscillator to become stable.
Two-Speed Start-up provides benefits when the oscillator module is configured for LP, XT or HS modes.
The Oscillator Start-up Timer (OST) is enabled for
these modes and must count 1024 oscillations before
the oscillator can be used as the system clock source.
6.4.1
TWO-SPEED START-UP MODE
CONFIGURATION
Two-Speed Start-up mode is configured by the
following settings:
• IESO (of the Configuration Words) = 1;
Internal/External Switchover bit (Two-Speed
Start-up mode enabled).
• SCS (of the OSCCON register) = 00.
• FOSC<2:0> bits in the Configuration Words
configured for LP, XT or HS mode.
Two-Speed Start-up mode is entered after:
• Power-on Reset (POR) and, if enabled, after
Power-up Timer (PWRT) has expired, or
• Wake-up from Sleep.
If the oscillator module is configured for any mode
other than LP, XT or HS mode, then Two-Speed
Start-up is disabled. This is because the external clock
oscillator does not require any stabilization time after
POR or an exit from Sleep.
If the OST count reaches 1024 before the device
enters Sleep mode, the OSTS bit of the OSCSTAT
register is set and program execution switches to the
external oscillator. However, the system may never
operate from the external oscillator if the time spent
awake is very short.
Note:
Executing a SLEEP instruction will abort
the oscillator start-up time and will cause
the OSTS bit of the OSCSTAT register to
remain clear.
TABLE 6-1:
Switch From
OSCILLATOR SWITCHING DELAYS
Switch To
Frequency
Oscillator Delay
LFINTOSC(1)
Sleep
MFINTOSC(1)
HFINTOSC(1)
31 kHz
31.25 kHz-500 kHz
31.25 kHz-16 MHz
Oscillator Warm-up Delay (TLFOSC ST)(2)
Oscillator Warm-up Delay (TIOSC ST)(2)
Sleep/POR
EC, RC(1)
DC – 32 MHz
2 cycles
LFINTOSC
EC,
RC(1)
DC – 32 MHz
1 cycle of each
Sleep/POR
Secondary Oscillator
LP, XT, HS(1)
32 kHz-20 MHz
1024 Clock Cycles (OST)
Any clock source
MFINTOSC(1)
HFINTOSC(1)
31.25 kHz-500 kHz
31.25 kHz-16 MHz
2 s (approx.)
Any clock source
LFINTOSC(1)
31 kHz
1 cycle of each
Any clock source
Secondary Oscillator
32 kHz
1024 Clock Cycles (OST)
PLL inactive
PLL active
16-32 MHz
2 ms (approx.)
Note 1:
2:
PLL inactive.
See Section 34.0 “Electrical Specifications”.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
6.4.2
1.
2.
3.
4.
5.
6.
7.
TWO-SPEED START-UP
SEQUENCE
6.4.3
Wake-up from Power-on Reset or Sleep.
Instructions begin execution by the internal
oscillator at the frequency set in the IRCF<3:0>
bits of the OSCCON register.
OST enabled to count 1024 clock cycles.
OST timed out, wait for falling edge of the
internal oscillator.
OSTS is set.
System clock held low until the next falling edge
of new clock (LP, XT or HS mode).
System clock is switched to external clock
source.
FIGURE 6-8:
CHECKING TWO-SPEED CLOCK
STATUS
Checking the state of the OSTS bit of the OSCSTAT
register will confirm if the microcontroller is running
from the external clock source, as defined by the
FOSC<2:0> bits in the Configuration Words, or the
internal oscillator.
TWO-SPEED START-UP
INTOSC
TOST
OSC1
0
1
1022 1023
OSC2
Program Counter
PC - N
PC
PC + 1
System Clock
DS40001726C-page 72
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PIC16(L)F1713/6
6.5
6.5.3
Fail-Safe Clock Monitor
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue operating should the external oscillator fail.
The FSCM can detect oscillator failure any time after
the Oscillator Start-up Timer (OST) has expired. The
FSCM is enabled by setting the FCMEN bit in the
Configuration Words. The FSCM is applicable to all
external Oscillator modes (LP, XT, HS, EC, Secondary
Oscillator and RC).
FIGURE 6-9:
FSCM BLOCK DIAGRAM
Clock Monitor
Latch
External
Clock
LFINTOSC
Oscillator
÷ 64
31 kHz
(~32 s)
488 Hz
(~2 ms)
S
Q
R
Q
Sample Clock
6.5.1
FAIL-SAFE DETECTION
The FSCM module detects a failed oscillator by
comparing the external oscillator to the FSCM sample
clock. The sample clock is generated by dividing the
LFINTOSC by 64. See Figure 6-9. Inside the fail
detector block is a latch. The external clock sets the
latch on each falling edge of the external clock. The
sample clock clears the latch on each rising edge of the
sample clock. A failure is detected when an entire
half-cycle of the sample clock elapses before the
external clock goes low.
6.5.2
The Fail-Safe condition is cleared after a Reset,
executing a SLEEP instruction or changing the SCS bits
of the OSCCON register. When the SCS bits are
changed, the OST is restarted. While the OST is
running, the device continues to operate from the
INTOSC selected in OSCCON. When the OST times
out, the Fail-Safe condition is cleared after successfully
switching to the external clock source. The OSFIF bit
should be cleared prior to switching to the external
clock source. If the Fail-Safe condition still exists, the
OSFIF flag will again become set by hardware.
6.5.4
Clock
Failure
Detected
FAIL-SAFE CONDITION CLEARING
RESET OR WAKE-UP FROM SLEEP
The FSCM is designed to detect an oscillator failure
after the Oscillator Start-up Timer (OST) has expired.
The OST is used after waking up from Sleep and after
any type of Reset. The OST is not used with the EC or
RC Clock modes so that the FSCM will be active as
soon as the Reset or wake-up has completed. When
the FSCM is enabled, the Two-Speed Start-up is also
enabled. Therefore, the device will always be executing
code while the OST is operating.
Note:
Due to the wide range of oscillator start-up
times, the Fail-Safe circuit is not active
during oscillator start-up (i.e., after exiting
Reset or Sleep). After an appropriate
amount of time, the user should check the
Status bits in the OSCSTAT register to
verify the oscillator start-up and that the
system clock switchover has successfully
completed.
FAIL-SAFE OPERATION
When the external clock fails, the FSCM switches the
device clock to an internal clock source and sets the bit
flag OSFIF of the PIR2 register. Setting this flag will
generate an interrupt if the OSFIE bit of the PIE2
register is also set. The device firmware can then take
steps to mitigate the problems that may arise from a
failed clock. The system clock will continue to be
sourced from the internal clock source until the device
firmware successfully restarts the external oscillator
and switches back to external operation.
The internal clock source chosen by the FSCM is
determined by the IRCF<3:0> bits of the OSCCON
register. This allows the internal oscillator to be
configured before a failure occurs.
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PIC16(L)F1713/6
FIGURE 6-10:
FSCM TIMING DIAGRAM
Sample Clock
Oscillator
Failure
System
Clock
Output
Clock Monitor Output
(Q)
Failure
Detected
OSCFIF
Test
Note:
Test
Test
The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in
this example have been chosen for clarity.
DS40001726C-page 74
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PIC16(L)F1713/6
6.6
Register Definitions: Oscillator Control
REGISTER 6-1:
R/W-0/0
OSCCON: OSCILLATOR CONTROL REGISTER
R/W-0/0
R/W-1/1
SPLLEN
R/W-1/1
R/W-1/1
IRCF<3:0>
U-0
R/W-0/0
—
R/W-0/0
SCS<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
SPLLEN: Software PLL Enable bit
If PLLEN in Configuration Words = 1:
SPLLEN bit is ignored. 4x PLL is always enabled (subject to oscillator requirements)
If PLLEN in Configuration Words = 0:
1 = 4x PLL Is enabled
0 = 4x PLL is disabled
bit 6-3
IRCF<3:0>: Internal Oscillator Frequency Select bits
1111 = 16 MHz HF
1110 = 8 MHz or 32 MHz HF(2)
1101 = 4 MHz HF
1100 = 2 MHz HF
1011 = 1 MHz HF
1010 = 500 kHz HF(1)
1001 = 250 kHz HF(1)
1000 = 125 kHz HF(1)
0111 = 500 kHz MF (default upon Reset)
0110 = 250 kHz MF
0101 = 125 kHz MF
0100 = 62.5 kHz MF
0011 = 31.25 kHz HF(1)
0010 = 31.25 kHz MF
000x = 31 kHz LF
bit 2
Unimplemented: Read as ‘0’
bit 1-0
SCS<1:0>: System Clock Select bits
1x = Internal oscillator block
01 = Secondary oscillator
00 = Clock determined by FOSC<2:0> in Configuration Words
Note 1:
2:
Duplicate frequency derived from HFINTOSC.
32 MHz when SPLLEN bit is set. Refer to Section 6.2.2.6 “32 MHz Internal Oscillator Frequency
Selection”.
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REGISTER 6-2:
OSCSTAT: OSCILLATOR STATUS REGISTER
R-1/q
R-0/q
R-q/q
R-0/q
R-0/q
R-q/q
R-0/0
R-0/q
SOSCR
PLLR
OSTS
HFIOFR
HFIOFL
MFIOFR
LFIOFR
HFIOFS
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Conditional
bit 7
SOSCR: Secondary Oscillator Ready bit
If T1OSCEN = 1:
1 = Secondary oscillator is ready
0 = Secondary oscillator is not ready
If T1OSCEN = 0:
1 = Secondary clock source is always ready
bit 6
PLLR 4x PLL Ready bit
1 = 4x PLL is ready
0 = 4x PLL is not ready
bit 5
OSTS: Oscillator Start-up Timer Status bit
1 = Running from the clock defined by the FOSC<2:0> bits of the Configuration Words
0 = Running from an internal oscillator (FOSC<2:0> = 100)
bit 4
HFIOFR: High-Frequency Internal Oscillator Ready bit
1 = HFINTOSC is ready
0 = HFINTOSC is not ready
bit 3
HFIOFL: High-Frequency Internal Oscillator Locked bit
1 = HFINTOSC is at least 2% accurate
0 = HFINTOSC is not 2% accurate
bit 2
MFIOFR: Medium Frequency Internal Oscillator Ready bit
1 = MFINTOSC is ready
0 = MFINTOSC is not ready
bit 1
LFIOFR: Low-Frequency Internal Oscillator Ready bit
1 = LFINTOSC is ready
0 = LFINTOSC is not ready
bit 0
HFIOFS: High-Frequency Internal Oscillator Stable bit
1 = HFINTOSC is at least 0.5% accurate
0 = HFINTOSC is not 0.5% accurate
DS40001726C-page 76
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REGISTER 6-3:
OSCTUNE: OSCILLATOR TUNING REGISTER
U-0
U-0
—
—
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
TUN<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
TUN<5:0>: Frequency Tuning bits
100000 = Minimum frequency
•
•
•
111111 =
000000 = Oscillator module is running at the factory-calibrated frequency
000001 =
•
•
•
011110 =
011111 = Maximum frequency
TABLE 6-2:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
Bit 7
Bit 6
Bit 5
Bit 4
OSCCON
SPLLEN
OSCSTAT
SOSCR
PLLR
OSCTUNE
—
—
PIR2
OSFIF
C2IF
C1IF
—
PIE2
OSFIE
C2IE
C1IE
—
T1CON
Legend:
Bit 3
IRCF<3:0>
TMR1CS<1:0>
OSTS
Bit 1
—
HFIOFR
HFIOFL
Bit 0
SCS<1:0>
MFIOFR
LFIOFR
75
HFIOFS
TUN<5:0>
BCL1IF
T1CKPS<1:0>
Register
on Page
76
77
TMR6IF
TMR4IF
CCP2IF
88
BCL1IE
TMR6IE
T1OSCEN
T1SYNC
TMR4IE
CCP2IE
85
—
TMR1ON
265
— = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.
TABLE 6-3:
SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES
Name
Bits
Bit -/7
Bit -/6
Bit 13/5
Bit 12/4
Bit 11/3
CONFIG1
13:8
—
—
FCMEN
IESO
CLKOUTEN
7:0
CP
MCLRE
PWRTE
Legend:
Bit 2
WDTE<1:0>
Bit 10/2
Bit 9/1
Bit 8/0
BOREN<1:0>
—
FOSC<2:0>
Register
on Page
47
— = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.
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7.0
INTERRUPTS
The interrupt feature allows certain events to preempt
normal program flow. Firmware is used to determine
the source of the interrupt and act accordingly. Some
interrupts can be configured to wake the MCU from
Sleep mode.
This chapter contains the following information for
Interrupts:
•
•
•
•
•
Operation
Interrupt Latency
Interrupts During Sleep
INT Pin
Automatic Context Saving
Many peripherals produce interrupts. Refer to the
corresponding chapters for details.
A block diagram of the interrupt logic is shown in
Figure 7-1.
FIGURE 7-1:
INTERRUPT LOGIC
TMR0IF
TMR0IE
Peripheral Interrupts
(TMR1IF) PIR1<0>
(TMR1IE) PIE1<0>
Wake-up
(If in Sleep mode)
INTF
INTE
IOCIF
IOCIE
Interrupt
to CPU
PEIE
PIRn<7>
PIEn<7>
DS40001726C-page 78
GIE
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PIC16(L)F1713/6
7.1
Operation
Interrupts are disabled upon any device Reset. They
are enabled by setting the following bits:
• GIE bit of the INTCON register
• Interrupt Enable bit(s) for the specific interrupt
event(s)
• PEIE bit of the INTCON register (if the Interrupt
Enable bit of the interrupt event is contained in the
PIE1 or PIE2 registers)
7.2
Interrupt Latency
Interrupt latency is defined as the time from when the
interrupt event occurs to the time code execution at the
interrupt vector begins. The latency for synchronous
interrupts is three or four instruction cycles. For
asynchronous interrupts, the latency is three to five
instruction cycles, depending on when the interrupt
occurs. See Figure 7-2 and Figure 7-3 for more details.
The INTCON, PIR1 and PIR2 registers record individual interrupts via interrupt flag bits. Interrupt flag bits will
be set, regardless of the status of the GIE, PEIE and
individual interrupt enable bits.
The following events happen when an interrupt event
occurs while the GIE bit is set:
• Current prefetched instruction is flushed
• GIE bit is cleared
• Current Program Counter (PC) is pushed onto the
stack
• Critical registers are automatically saved to the
shadow registers (See “Section 7.5 “Automatic
Context Saving”)
• PC is loaded with the interrupt vector 0004h
The firmware within the Interrupt Service Routine (ISR)
should determine the source of the interrupt by polling
the interrupt flag bits. The interrupt flag bits must be
cleared before exiting the ISR to avoid repeated
interrupts. Because the GIE bit is cleared, any interrupt
that occurs while executing the ISR will be recorded
through its interrupt flag, but will not cause the
processor to redirect to the interrupt vector.
The RETFIE instruction exits the ISR by popping the
previous address from the stack, restoring the saved
context from the shadow registers and setting the GIE
bit.
For additional information on a specific interrupt’s
operation, refer to its peripheral chapter.
Note 1: Individual interrupt flag bits are set,
regardless of the state of any other
enable bits.
2: All interrupts will be ignored while the GIE
bit is cleared. Any interrupt occurring
while the GIE bit is clear will be serviced
when the GIE bit is set again.
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FIGURE 7-2:
INTERRUPT LATENCY
OSC1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
CLKR
Interrupt Sampled
during Q1
Interrupt
GIE
PC
Execute
PC-1
PC
1 Cycle Instruction at PC
PC+1
0004h
0005h
NOP
NOP
Inst(0004h)
PC+1/FSR
ADDR
New PC/
PC+1
0004h
0005h
Inst(PC)
NOP
NOP
Inst(0004h)
FSR ADDR
PC+1
PC+2
0004h
0005h
INST(PC)
NOP
NOP
NOP
Inst(0004h)
Inst(0005h)
FSR ADDR
PC+1
0004h
0005h
INST(PC)
NOP
NOP
Inst(0004h)
Inst(PC)
Interrupt
GIE
PC
Execute
PC-1
PC
2 Cycle Instruction at PC
Interrupt
GIE
PC
Execute
PC-1
PC
3 Cycle Instruction at PC
Interrupt
GIE
PC
Execute
PC-1
PC
3 Cycle Instruction at PC
DS40001726C-page 80
PC+2
NOP
NOP
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PIC16(L)F1713/6
FIGURE 7-3:
INT PIN INTERRUPT TIMING
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
OSC1
CLKOUT (3)
(4)
INT pin
(1)
(1)
INTF
Interrupt Latency (2)
(5)
GIE
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Note 1:
PC
Inst (PC)
Inst (PC – 1)
PC + 1
Inst (PC + 1)
Inst (PC)
PC + 1
—
Forced NOP
0004h
Inst (0004h)
Forced NOP
0005h
Inst (0005h)
Inst (0004h)
INTF flag is sampled here (every Q1).
2:
Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3:
CLKOUT not available in all oscillator modes.
4:
For minimum width of INT pulse, refer to AC specifications in Section 34.0 “Electrical Specifications””.
5:
INTF is enabled to be set any time during the Q4-Q1 cycles.
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7.3
Interrupts During Sleep
Some interrupts can be used to wake from Sleep. To
wake from Sleep, the peripheral must be able to
operate without the system clock. The interrupt source
must have the appropriate Interrupt Enable bit(s) set
prior to entering Sleep.
On waking from Sleep, if the GIE bit is also set, the
processor will branch to the interrupt vector. Otherwise,
the processor will continue executing instructions after
the SLEEP instruction. The instruction directly after the
SLEEP instruction will always be executed before
branching to the ISR. Refer to Section 8.0
“Power-Down Mode (Sleep)” for more details.
7.4
INT Pin
The INT pin can be used to generate an asynchronous
edge-triggered interrupt. This interrupt is enabled by
setting the INTE bit of the INTCON register. The
INTEDG bit of the OPTION_REG register determines on
which edge the interrupt will occur. When the INTEDG
bit is set, the rising edge will cause the interrupt. When
the INTEDG bit is clear, the falling edge will cause the
interrupt. The INTF bit of the INTCON register will be set
when a valid edge appears on the INT pin. If the GIE and
INTE bits are also set, the processor will redirect
program execution to the interrupt vector.
7.5
Automatic Context Saving
Upon entering an interrupt, the return PC address is
saved on the stack. Additionally, the following registers
are automatically saved in the shadow registers:
•
•
•
•
•
W register
STATUS register (except for TO and PD)
BSR register
FSR registers
PCLATH register
Upon exiting the Interrupt Service Routine, these registers are automatically restored. Any modifications to
these registers during the ISR will be lost. If modifications to any of these registers are desired, the corresponding shadow register should be modified and the
value will be restored when exiting the ISR. The
shadow registers are available in Bank 31 and are
readable and writable. Depending on the user’s
application, other registers may also need to be saved.
DS40001726C-page 82
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7.6
Register Definitions: Interrupt Control
REGISTER 7-1:
INTCON: INTERRUPT CONTROL REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R-0/0
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF(1)
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
GIE: Global Interrupt Enable bit
1 = Enables all active interrupts
0 = Disables all interrupts
bit 6
PEIE: Peripheral Interrupt Enable bit
1 = Enables all active peripheral interrupts
0 = Disables all peripheral interrupts
bit 5
TMR0IE: Timer0 Overflow Interrupt Enable bit
1 = Enables the Timer0 interrupt
0 = Disables the Timer0 interrupt
bit 4
INTE: INT External Interrupt Enable bit
1 = Enables the INT external interrupt
0 = Disables the INT external interrupt
bit 3
IOCIE: Interrupt-on-Change Enable bit
1 = Enables the interrupt-on-change
0 = Disables the interrupt-on-change
bit 2
TMR0IF: Timer0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed
0 = TMR0 register did not overflow
bit 1
INTF: INT External Interrupt Flag bit
1 = The INT external interrupt occurred
0 = The INT external interrupt did not occur
bit 0
IOCIF: Interrupt-on-Change Interrupt Flag bit(1)
1 = When at least one of the interrupt-on-change pins changed state
0 = None of the interrupt-on-change pins have changed state
Note 1:
Note:
The IOCIF Flag bit is read-only and cleared when all the interrupt-on-change flags in the IOCxF registers
have been cleared by software.
Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
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REGISTER 7-2:
PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
TMR1GIE: Timer1 Gate Interrupt Enable bit
1 = Enables the Timer1 gate acquisition interrupt
0 = Disables the Timer1 gate acquisition interrupt
bit 6
ADIE: Analog-to-Digital Converter (ADC) Interrupt Enable bit
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5
RCIE: USART Receive Interrupt Enable bit
1 = Enables the USART receive interrupt
0 = Disables the USART receive interrupt
bit 4
TXIE: USART Transmit Interrupt Enable bit
1 = Enables the USART transmit interrupt
0 = Disables the USART transmit interrupt
bit 3
SSP1IE: Synchronous Serial Port (MSSP) Interrupt Enable bit
1 = Enables the MSSP interrupt
0 = Disables the MSSP interrupt
bit 2
CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1
TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the Timer2 to PR2 match interrupt
0 = Disables the Timer2 to PR2 match interrupt
bit 0
TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt
0 = Disables the Timer1 overflow interrupt
Note:
Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
DS40001726C-page 84
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REGISTER 7-3:
PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0/0
R/W-0/0
R/W-0/0
OSFIE
C2IE
C1IE
U-0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
—
BCL1IE
TMR6IE
TMR4IE
CCP2IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
OSFIE: Oscillator Fail Interrupt Enable bit
1 = Enables the Oscillator Fail interrupt
0 = Disables the Oscillator Fail interrupt
bit 6
C2IE: Comparator C2 Interrupt Enable bit
1 = Enables the Comparator C2 interrupt
0 = Disables the Comparator C2 interrupt
bit 5
C1IE: Comparator C1 Interrupt Enable bit
1 = Enables the Comparator C1 interrupt
0 = Disables the Comparator C1 interrupt
bit 4
Unimplemented: Read as ‘0’
bit 3
BCL1IE: MSSP Bus Collision Interrupt Enable bit
1 = Enables the MSSP Bus Collision Interrupt
0 = Disables the MSSP Bus Collision Interrupt
bit 2
TMR6IE: TMR6 to PR6 Match Interrupt Enable bit
1 = Enables the Timer6 to PR6 match interrupt
0 = Disables the Timer6 to PR6 match interrupt
bit 1
TMR4IE: TMR4to PR4 Match Interrupt Enable bit
1 = Enables the Timer4 to PR4 match interrupt
0 = Disables the Timer4 to PR4 match interrupt
bit 0
CCP2IE: CCP2 Interrupt Enable bit
1 = Enables the CCP2 interrupt
0 = Disables the CCP2 interrupt
Note:
Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
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PIC16(L)F1713/6
REGISTER 7-4:
U-0
—
PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
NCOIE
COGIE
ZCDIE
CLC4IE
CLC3IE
CLC2IE
CLC1IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6
NCOIE: NCO Interrupt Enable bit
1 = NCO interrupt enabled
0 = NCO interrupt disabled
bit 5
COGIE: COG Auto-Shutdown Interrupt Enable bit
1 = COG interrupt enabled
0 = COG interrupt disabled
bit 4
ZCDIE: Zero-Cross Detection Interrupt Enable bit
1 = ZCD interrupt enabled
0 = ZCD interrupt disabled
bit 3
CLC4IE: CLC4 Interrupt Enable bit
1 = CLC4 interrupt enabled
0 = CLC4 interrupt disabled
bit 2
CLC3IE: CLC3 Interrupt Enable bit
1 = CLC3 interrupt enabled
0 = CLC3 interrupt disabled
bit 1
CLC2IE: CLC2 Interrupt Enable bit
1 = CLC2 interrupt enabled
0 = CLC2 interrupt disabled
bit 0
CLC1IE: CLC1 Interrupt Enable bit
1 = CLC1 interrupt enabled
0 = CLC1 interrupt disabled
Note:
Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
DS40001726C-page 86
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
REGISTER 7-5:
PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1
R/W-0/0
R/W-0/0
R-0/0
R-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
TMR1GIF: Timer1 Gate Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 6
ADIF: Analog-to-Digital Converter (ADC) Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 5
RCIF: USART Receive Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4
TXIF: USART Transmit Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3
SSP1IF: Synchronous Serial Port (MSSP) Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 2
CCP1IF: CCP1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 1
TMR2IF: Timer2 to PR2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0
TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
Note:
Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 87
PIC16(L)F1713/6
REGISTER 7-6:
PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2
R/W-0/0
R/W-0/0
R/W-0/0
OSFIF
C2IF
C1IF
U-0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
—
BCL1IF
TMR6IF
TMR4IF
CCP2IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
OSFIF: Oscillator Fail Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 6
C2IF: Comparator C2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 5
C1IF: Comparator C1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4
Unimplemented: Read as ‘0’
bit 3
BCL1IF: MSSP Bus Collision Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 2
TMR6IF: Timer6 to PR6 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 1
TMR4IF: Timer4 to PR4 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0
CCP2IF: CCP2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
Note:
Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
DS40001726C-page 88
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
REGISTER 7-7:
U-0
—
PIR3: PERIPHERAL INTERRUPT REQUEST REGISTER 3
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
NCOIF
COGIF
ZCDIF
CLC4IF
CLC3IF
CLC2IF
CLC1IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6
NCOIF: NCO Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 5
COGIF: COG Auto-Shutdown Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4
ZCDIF: Zero-Cross Detection Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3
CLC4IF: CLC4 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 2
CLC3IF: CLC3 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 1
CLC2IF: CLC2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0
CLC1IF: CLC1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
Note:
Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 89
PIC16(L)F1713/6
TABLE 7-1:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
Bit 7
INTCON
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
TMR0IF
Bit 1
Bit 0
INTF
IOCIF
Register
on Page
GIE
PEIE
TMR0IE
INTE
IOCIE
WPUEN
INTEDG
TMR0CS
TMR0SE
PSA
PIE1
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
PIE2
OSFIE
C2IE
C1IE
—
BCL1IE
TMR6IE
TMR4IE
CCP2IE
85
PIE3
—
NCOIE
COGIE
ZCDIE
CLC4IE
CLC3IE
CLC2IE
CLC1IE
86
PIR1
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
87
PIR2
OSFIF
C2IF
C1IF
—
BCL1IF
TMR6IF
TMR4IF
CCP2IF
88
PIR3
—
NCOIF
COGIF
ZCDIF
CLC4IF
CLC3IF
CLC2IF
CLC1IF
89
OPTION_REG
Legend:
PS<2:0>
83
256
— = unimplemented location, read as ‘0’. Shaded cells are not used by interrupts.
DS40001726C-page 90
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
8.0
POWER-DOWN MODE (SLEEP)
8.1
Wake-up from Sleep
The Power-down mode is entered by executing a
SLEEP instruction.
The device can wake-up from Sleep through one of the
following events:
Upon entering Sleep mode, the following conditions
exist:
1.
2.
3.
4.
5.
6.
1.
2.
3.
4.
5.
6.
7.
8.
9.
WDT will be cleared but keeps running, if
enabled for operation during Sleep.
PD bit of the STATUS register is cleared.
TO bit of the STATUS register is set.
CPU clock is disabled.
31 kHz LFINTOSC is unaffected and peripherals
that operate from it may continue operation in
Sleep.
Timer1 and peripherals that operate from
Timer1 continue operation in Sleep when the
Timer1 clock source selected is:
• LFINTOSC
• T1CKI
• Secondary oscillator
ADC is unaffected, if the dedicated FRC
oscillator is selected.
I/O ports maintain the status they had before
SLEEP was executed (driving high, low or
high-impedance).
Resets other than WDT are not affected by
Sleep mode.
Refer to individual chapters for more details on
peripheral operation during Sleep.
To minimize current consumption, the following
conditions should be considered:
•
•
•
•
•
•
External Reset input on MCLR pin, if enabled
BOR Reset, if enabled
POR Reset
Watchdog Timer, if enabled
Any external interrupt
Interrupts by peripherals capable of running
during Sleep (see individual peripheral for more
information)
The first three events will cause a device Reset. The
last three events are considered a continuation of
program execution. To determine whether a device
Reset or wake-up event occurred, refer to
Section 5.12 “Determining the Cause of a Reset”.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be enabled. Wake-up will
occur regardless of the state of the GIE bit. If the GIE
bit is disabled, the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
enabled, the device executes the instruction after the
SLEEP instruction, the device will then call the Interrupt
Service Routine. In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
I/O pins should not be floating
External circuitry sinking current from I/O pins
Internal circuitry sourcing current from I/O pins
Current draw from pins with internal weak pull-ups
Modules using 31 kHz LFINTOSC
Modules using secondary oscillator
I/O pins that are high-impedance inputs should be
pulled to VDD or VSS externally to avoid switching
currents caused by floating inputs.
Examples of internal circuitry that might be sourcing
current include modules such as the DAC and FVR
modules. See Section 22.0 “Operational Amplifier
(OPA) Modules” and Section 14.0 “Fixed Voltage
Reference (FVR)” for more information on these modules.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 91
PIC16(L)F1713/6
8.1.1
WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
SLEEP instruction
- SLEEP instruction will execute as a NOP
- WDT and WDT prescaler will not be cleared
- TO bit of the STATUS register will not be set
- PD bit of the STATUS register will not be
cleared
FIGURE 8-1:
• If the interrupt occurs during or after the execution of a SLEEP instruction
- SLEEP instruction will be completely
executed
- Device will immediately wake-up from Sleep
- WDT and WDT prescaler will be cleared
- TO bit of the STATUS register will be set
- PD bit of the STATUS register will be cleared
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
WAKE-UP FROM SLEEP THROUGH INTERRUPT
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
CLKIN(1)
TOST(3)
CLKOUT(2)
Interrupt flag
Interrupt Latency (4)
GIE bit
(INTCON reg.)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
Note
1:
2:
3:
4:
Processor in
Sleep
PC
Inst(PC) = Sleep
Inst(PC - 1)
PC + 1
PC + 2
PC + 2
Inst(PC + 1)
Inst(PC + 2)
Sleep
Inst(PC + 1)
PC + 2
Forced NOP
0004h
0005h
Inst(0004h)
Inst(0005h)
Forced NOP
Inst(0004h)
External clock. High, Medium, Low mode assumed.
CLKOUT is shown here for timing reference.
TOST = 1024 TOSC. This delay does not apply to EC, RC and INTOSC Oscillator modes or Two-Speed Start-up (see Section 6.4
“Two-Speed Clock Start-up Mode”.
GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line.
DS40001726C-page 92
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PIC16(L)F1713/6
8.2
Low-Power Sleep Mode
The PIC16F1713/6 device contains an internal Low
Dropout (LDO) voltage regulator, which allows the
device I/O pins to operate at voltages up to 5.5V while
the internal device logic operates at a lower voltage.
The LDO and its associated reference circuitry must
remain active when the device is in Sleep mode. The
PIC16F1713/6 allows the user to optimize the
operating current in Sleep, depending on the
application requirements.
A Low-Power Sleep mode can be selected by setting
the VREGPM bit of the VREGCON register. With this
bit set, the LDO and reference circuitry are placed in a
low-power state when the device is in Sleep.
8.2.1
SLEEP CURRENT VS. WAKE-UP
TIME
In the default operating mode, the LDO and reference
circuitry remain in the normal configuration while in
Sleep. The device is able to exit Sleep mode quickly
since all circuits remain active. In Low-Power Sleep
mode, when waking up from Sleep, an extra delay time
is required for these circuits to return to the normal
configuration and stabilize.
8.2.2
PERIPHERAL USAGE IN SLEEP
Some peripherals that can operate in Sleep mode will
not operate properly with the Low-Power Sleep mode
selected. The Low-Power Sleep mode is intended for
use only with the following peripherals:
•
•
•
•
Brown-out Reset (BOR)
Watchdog Timer (WDT)
External interrupt pin/Interrupt-on-change pins
Timer1 (with external clock source < 100 kHz)
Note:
The PIC16LF1713/6 does not have a
configurable Low-Power Sleep mode.
PIC16LF1713/6 is an unregulated device
and is always in the lowest power state
when in Sleep, with no wake-up time
penalty. This device has a lower maximum
VDD and I/O voltage than the
PIC16F1713/6.
See
Section 34.0
“Electrical Specifications” for more
information.
The Low-Power Sleep mode is beneficial for applications that stay in Sleep mode for long periods of time.
The normal mode is beneficial for applications that
need to wake from Sleep quickly and frequently.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 93
PIC16(L)F1713/6
8.3
Register Definitions: Voltage Regulator Control
VREGCON: VOLTAGE REGULATOR CONTROL REGISTER(1)
REGISTER 8-1:
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0/0
R/W-1/1
—
—
—
—
—
—
VREGPM
Reserved
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-2
Unimplemented: Read as ‘0’
bit 1
VREGPM: Voltage Regulator Power Mode Selection bit
1 = Low-Power Sleep mode enabled in Sleep(2)
Draws lowest current in Sleep, slower wake-up
0 = Normal-Power mode enabled in Sleep(2)
Draws higher current in Sleep, faster wake-up
bit 0
Reserved: Read as ‘1’. Maintain this bit set.
Note 1:
2:
PIC16F1713/6 only.
See Section 34.0 “Electrical Specifications”.
TABLE 8-1:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE
Bit 6
Bit 5
Bit 4
Bit 3
STATUS
—
—
—
TO
PD
Z
DC
C
19
VREGCON(1)
—
—
—
—
—
—
VREGPM
Reserved
94
WDTCON
—
—
SWDTEN
98
Legend:
Note 1:
Bit 2
Bit 1
WDTPS<4:0>
Bit 0
Register on
Page
Bit 7
— = unimplemented location, read as ‘0’. Shaded cells are not used in Power-Down mode.
PIC16F1713/6 only.
DS40001726C-page 94
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PIC16(L)F1713/6
9.0
WATCHDOG TIMER (WDT)
The Watchdog Timer is a system timer that generates
a Reset if the firmware does not issue a CLRWDT
instruction within the time-out period. The Watchdog
Timer is typically used to recover the system from
unexpected events.
The WDT has the following features:
• Independent clock source
• Multiple operating modes
- WDT is always on
- WDT is off when in Sleep
- WDT is controlled by software
- WDT is always off
• Configurable time-out period is from 1 ms to 256
seconds (nominal)
• Multiple Reset conditions
• Operation during Sleep
FIGURE 9-1:
WATCHDOG TIMER BLOCK DIAGRAM
WDTE<1:0> = 01
SWDTEN
WDTE<1:0> = 11
LFINTOSC
23-bit Programmable
Prescaler WDT
WDT Time-out
WDTE<1:0> = 10
Sleep
 2013-2016 Microchip Technology Inc.
WDTPS<4:0>
DS40001726C-page 95
PIC16(L)F1713/6
9.1
Independent Clock Source
9.4
The WDT derives its time base from the 31 kHz
LFINTOSC internal oscillator. Time intervals in this
chapter are based on a nominal interval of 1 ms. See
Table 34-8: Oscillator Parameters for the LFINTOSC
specification.
9.2
WDT Operating Modes
The Watchdog Timer module has four operating modes
controlled by the WDTE<1:0> bits in Configuration
Words. See Table 9-1.
9.2.1
WDT protection is active during Sleep.
WDT IS OFF IN SLEEP
When the WDTE bits of Configuration Words are set to
‘10’, the WDT is on, except in Sleep.
WDT protection is not active during Sleep.
9.2.3
WDT CONTROLLED BY SOFTWARE
When the WDTE bits of Configuration Words are set to
‘01’, the WDT is controlled by the SWDTEN bit of the
WDTCON register.
WDT protection is unchanged by Sleep. See Table 9-1
for more details.
TABLE 9-1:
The WDT is cleared when any of the following
conditions occur:
•
•
•
•
•
•
•
Any Reset
CLRWDT instruction is executed
Device enters Sleep
Device wakes up from Sleep
Oscillator fail
WDT is disabled
Oscillator Start-up Timer (OST) is running
See Table 9-2 for more information.
WDT IS ALWAYS ON
When the WDTE bits of Configuration Words are set to
‘11’, the WDT is always on.
9.2.2
Clearing the WDT
9.5
Operation During Sleep
When the device enters Sleep, the WDT is cleared. If
the WDT is enabled during Sleep, the WDT resumes
counting.
When the device exits Sleep, the WDT is cleared
again. The WDT remains clear until the OST, if
enabled, completes. See Section 6.0 “Oscillator
Module (with Fail-Safe Clock Monitor)” for more
information on the OST.
When a WDT time-out occurs while the device is in
Sleep, no Reset is generated. Instead, the device
wakes up and resumes operation. The TO and PD bits
in the STATUS register are changed to indicate the
event. See STATUS Register (Register 3-1) for more
information.
WDT OPERATING MODES
WDTE<1:0>
SWDTEN
Device
Mode
11
X
X
10
X
WDT
Mode
Active
Awake Active
1
01
Sleep
X
0
00
9.3
X
X
Disabled
Active
Disabled
Disabled
Time-Out Period
The WDTPS bits of the WDTCON register set the
time-out period from 1 ms to 256 seconds (nominal).
After a Reset, the default time-out period is two
seconds.
DS40001726C-page 96
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PIC16(L)F1713/6
TABLE 9-2:
WDT CLEARING CONDITIONS
Conditions
WDT
WDTE<1:0> = 00
WDTE<1:0> = 01 and SWDTEN = 0
WDTE<1:0> = 10 and enter Sleep
CLRWDT Command
Cleared
Oscillator Fail Detected
Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK
Exit Sleep + System Clock = XT, HS, LP
Change INTOSC divider (IRCF bits)
 2013-2016 Microchip Technology Inc.
Cleared until the end of OST
Unaffected
DS40001726C-page 97
PIC16(L)F1713/6
9.6
Register Definitions: Watchdog Control
REGISTER 9-1:
U-0
WDTCON: WATCHDOG TIMER CONTROL REGISTER
U-0
—
R/W-0/0
R/W-1/1
R/W-0/0
R/W-1/1
R/W-1/1
(1)
—
WDTPS<4:0>
R/W-0/0
SWDTEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-m/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-1
WDTPS<4:0>: Watchdog Timer Period Select bits(1)
Bit Value = Prescale Rate
11111 = Reserved. Results in minimum interval (1:32)
•
•
•
10011 = Reserved. Results in minimum interval (1:32)
10010
10001
10000
01111
01110
01101
01100
01011
01010
01001
01000
00111
00110
00101
00100
00011
00010
00001
00000
bit 0
Note 1:
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
1:8388608 (223) (Interval 256s nominal)
1:4194304 (222) (Interval 128s nominal)
1:2097152 (221) (Interval 64s nominal)
1:1048576 (220) (Interval 32s nominal)
1:524288 (219) (Interval 16s nominal)
1:262144 (218) (Interval 8s nominal)
1:131072 (217) (Interval 4s nominal)
1:65536 (Interval 2s nominal) (Reset value)
1:32768 (Interval 1s nominal)
1:16384 (Interval 512 ms nominal)
1:8192 (Interval 256 ms nominal)
1:4096 (Interval 128 ms nominal)
1:2048 (Interval 64 ms nominal)
1:1024 (Interval 32 ms nominal)
1:512 (Interval 16 ms nominal)
1:256 (Interval 8 ms nominal)
1:128 (Interval 4 ms nominal)
1:64 (Interval 2 ms nominal)
1:32 (Interval 1 ms nominal)
SWDTEN: Software Enable/Disable for Watchdog Timer bit
If WDTE<1:0> = 1x:
This bit is ignored.
If WDTE<1:0> = 01:
1 = WDT is turned on
0 = WDT is turned off
If WDTE<1:0> = 00:
This bit is ignored.
Times are approximate. WDT time is based on 31 kHz LFINTOSC.
DS40001726C-page 98
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 9-3:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER
Bit 7
Bit 6
OSCCON
SPLLEN
STATUS
—
—
WDTCON
—
—
Bit 5
Bit 4
Bit 3
IRCF<3:0>
—
Bit 2
—
TO
PD
Z
Bit 1
Bit 0
SCS<1:0>
DC
WDTPS<4:0>
Register
on Page
75
C
19
SWDTEN
98
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by
Watchdog Timer.
TABLE 9-4:
Name
CONFIG1
Bits
SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER
Bit -/7
Bit -/6
Bit 13/5
Bit 12/4
Bit 11/3
IESO
CLKOUTEN
13:8
—
—
FCMEN
7:0
CP
MCLRE
PWRTE
WDTE<1:0>
Bit 10/2
Bit 9/1
Bit 8/0
BOREN<1:0>
—
FOSC<2:0>
Register
on Page
47
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 99
PIC16(L)F1713/6
10.0
FLASH PROGRAM MEMORY
CONTROL
The Flash program memory is readable and writable
during normal operation over the full VDD range.
Program memory is indirectly addressed using Special
Function Registers (SFRs). The SFRs used to access
program memory are:
•
•
•
•
•
•
PMCON1
PMCON2
PMDATL
PMDATH
PMADRL
PMADRH
When accessing the program memory, the
PMDATH:PMDATL register pair forms a 2-byte word
that holds the 14-bit data for read/write, and the
PMADRH:PMADRL register pair forms a 2-byte word
that holds the 15-bit address of the program memory
location being read.
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip charge
pump rated to operate over the operating voltage range
of the device.
The Flash program memory can be protected in two
ways; by code protection (CP bit in Configuration Words)
and write protection (WRT<1:0> bits in Configuration
Words).
Code protection (CP = 0)(1), disables access, reading
and writing, to the Flash program memory via external
device programmers. Code protection does not affect
the self-write and erase functionality. Code protection
can only be reset by a device programmer performing
a Bulk Erase to the device, clearing all Flash program
memory, Configuration bits and User IDs.
Write protection prohibits self-write and erase to a
portion or all of the Flash program memory as defined
by the bits WRT<1:0>. Write protection does not affect
a device programmers ability to read, write or erase the
device.
Note 1: Code protection of the entire Flash
program memory array is enabled by
clearing the CP bit of Configuration Words.
10.1
PMADRL and PMADRH Registers
The PMADRH:PMADRL register pair can address up
to a maximum of 32K words of program memory. When
selecting a program address value, the MSB of the
address is written to the PMADRH register and the LSB
is written to the PMADRL register.
DS40001726C-page 100
10.1.1
PMCON1 AND PMCON2
REGISTERS
PMCON1 is the control register for Flash program
memory accesses.
Control bits RD and WR initiate read and write,
respectively. These bits cannot be cleared, only set, in
software. They are cleared by hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental, premature
termination of a write operation.
The WREN bit, when set, will allow a write operation to
occur. On power-up, the WREN bit is clear. The
WRERR bit is set when a write operation is interrupted
by a Reset during normal operation. In these situations,
following Reset, the user can check the WRERR bit
and execute the appropriate error handling routine.
The PMCON2 register is a write-only register. Attempting
to read the PMCON2 register will return all ‘0’s.
To enable writes to the program memory, a specific
pattern (the unlock sequence), must be written to the
PMCON2 register. The required unlock sequence
prevents inadvertent writes to the program memory
write latches and Flash program memory.
10.2
Flash Program Memory Overview
It is important to understand the Flash program memory
structure for erase and programming operations. Flash
program memory is arranged in rows. A row consists of
a fixed number of 14-bit program memory words. A row
is the minimum size that can be erased by user software.
After a row has been erased, the user can reprogram
all or a portion of this row. Data to be written into the
program memory row is written to 14-bit wide data write
latches. These write latches are not directly accessible
to the user, but may be loaded via sequential writes to
the PMDATH:PMDATL register pair.
Note:
If the user wants to modify only a portion
of a previously programmed row, then the
contents of the entire row must be read
and saved in RAM prior to the erase.
Then, new data and retained data can be
written into the write latches to reprogram
the row of Flash program memory. However, any unprogrammed locations can be
written without first erasing the row. In this
case, it is not necessary to save and
rewrite the other previously programmed
locations.
See Table 10-1 for Erase Row size and the number of
write latches for Flash program memory.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 10-1:
Device
PIC16(L)F1713
PIC16(L)F1716
10.2.1
FLASH MEMORY
ORGANIZATION BY DEVICE
Row Erase
(words)
Write
Latches
(words)
32
32
READING THE FLASH PROGRAM
MEMORY
To read a program memory location, the user must:
1.
2.
3.
Write
the
desired
address
to
the
PMADRH:PMADRL register pair.
Clear the CFGS bit of the PMCON1 register.
Then, set control bit RD of the PMCON1 register.
Once the read control bit is set, the program memory
Flash controller will use the second instruction cycle to
read the data. This causes the second instruction
immediately following the “BSF PMCON1,RD” instruction
to be ignored. The data is available in the very next cycle,
in the PMDATH:PMDATL register pair; therefore, it can
be read as two bytes in the following instructions.
PMDATH:PMDATL register pair will hold this value until
another read or until it is written to by the user.
Note:
The two instructions following a program
memory read are required to be NOPs.
This prevents the user from executing a
2-cycle instruction on the next instruction
after the RD bit is set.
FIGURE 10-1:
FLASH PROGRAM
MEMORY READ
FLOWCHART
Start
Read Operation
Select
Program or Configuration Memory
(CFGS)
Select
Word Address
(PMADRH:PMADRL)
Initiate Read operation
(RD = 1)
Instruction Fetched ignored
NOP execution forced
Instruction Fetched ignored
NOP execution forced
Data read now in
PMDATH:PMDATL
End
Read Operation
 2013-2016 Microchip Technology Inc.
DS40001726C-page 101
PIC16(L)F1713/6
FIGURE 10-2:
FLASH PROGRAM MEMORY READ CYCLE EXECUTION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
PC
Flash ADDR
Flash Data
PC + 1
INSTR (PC)
INSTR(PC - 1)
executed here
PMADRH,PMADRL
INSTR (PC + 1)
BSF PMCON1,RD
executed here
PC
+3
PC+3
PMDATH,PMDATL
INSTR(PC + 1)
instruction ignored
Forced NOP
executed here
PC + 5
PC + 4
INSTR (PC + 3)
INSTR(PC + 2)
instruction ignored
Forced NOP
executed here
INSTR (PC + 4)
INSTR(PC + 3)
executed here
INSTR(PC + 4)
executed here
RD bit
PMDATH
PMDATL
Register
EXAMPLE 10-1:
FLASH PROGRAM MEMORY READ
* This code block will read 1 word of program
* memory at the memory address:
PROG_ADDR_HI : PROG_ADDR_LO
*
data will be returned in the variables;
*
PROG_DATA_HI, PROG_DATA_LO
BANKSEL
MOVLW
MOVWF
MOVLW
MOVWF
PMADRL
PROG_ADDR_LO
PMADRL
PROG_ADDR_HI
PMADRH
; Select Bank for PMCON registers
;
; Store LSB of address
;
; Store MSB of address
BCF
BSF
NOP
NOP
PMCON1,CFGS
PMCON1,RD
;
;
;
;
Do not select Configuration Space
Initiate read
Ignored (Figure 10-1)
Ignored (Figure 10-1)
MOVF
MOVWF
MOVF
MOVWF
PMDATL,W
PROG_DATA_LO
PMDATH,W
PROG_DATA_HI
;
;
;
;
Get LSB of word
Store in user location
Get MSB of word
Store in user location
DS40001726C-page 102
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
10.2.2
FLASH MEMORY UNLOCK
SEQUENCE
The unlock sequence is a mechanism that protects the
Flash program memory from unintended self-write programming or erasing. The sequence must be executed
and completed without interruption to successfully
complete any of the following operations:
• Row Erase
• Load program memory write latches
• Write of program memory write latches to
program memory
• Write of program memory write latches to User
IDs
The unlock sequence consists of the following steps:
FIGURE 10-3:
FLASH PROGRAM
MEMORY UNLOCK
SEQUENCE FLOWCHART
Start
Unlock Sequence
Write 055h to
PMCON2
Write 0AAh to
PMCON2
1. Write 55h to PMCON2
2. Write AAh to PMCON2
3. Set the WR bit in PMCON1
Initiate
Write or Erase operation
(WR = 1)
4. NOP instruction
5. NOP instruction
Once the WR bit is set, the processor will always force
two NOP instructions. When an Erase Row or Program
Row operation is being performed, the processor will stall
internal operations (typical 2 ms), until the operation is
complete and then resume with the next instruction.
When the operation is loading the program memory write
latches, the processor will always force the two NOP
instructions and continue uninterrupted with the next
instruction.
Instruction Fetched ignored
NOP execution forced
Instruction Fetched ignored
NOP execution forced
End
Unlock Sequence
Since the unlock sequence must not be interrupted,
global interrupts should be disabled prior to the unlock
sequence and re-enabled after the unlock sequence is
completed.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 103
PIC16(L)F1713/6
10.2.3
ERASING FLASH PROGRAM
MEMORY
While executing code, program memory can only be
erased by rows. To erase a row:
1.
2.
3.
4.
5.
Load the PMADRH:PMADRL register pair with
any address within the row to be erased.
Clear the CFGS bit of the PMCON1 register.
Set the FREE and WREN bits of the PMCON1
register.
Write 55h, then AAh, to PMCON2 (Flash
programming unlock sequence).
Set control bit WR of the PMCON1 register to
begin the erase operation.
See Example 10-2.
After the “BSF PMCON1,WR” instruction, the processor
requires two cycles to set up the erase operation. The
user must place two NOP instructions immediately following the WR bit set instruction. The processor will
halt internal operations for the typical 2 ms erase time.
This is not Sleep mode as the clocks and peripherals
will continue to run. After the erase cycle, the processor
will resume operation with the third instruction after the
PMCON1 write instruction.
FIGURE 10-4:
FLASH PROGRAM
MEMORY ERASE
FLOWCHART
Start
Erase Operation
Disable Interrupts
(GIE = 0)
Select
Program or Configuration Memory
(CFGS)
Select Row Address
(PMADRH:PMADRL)
Select Erase Operation
(FREE = 1)
Enable Write/Erase Operation
(WREN = 1)
Unlock Sequence
Figure 10-3
(FIGURE
x-x)
CPU stalls while
Erase operation completes
(2ms typical)
Disable Write/Erase Operation
(WREN = 0)
Re-enable Interrupts
(GIE = 1)
End
Erase Operation
DS40001726C-page 104
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
EXAMPLE 10-2:
ERASING ONE ROW OF PROGRAM MEMORY
Required
Sequence
; This row erase routine assumes the following:
; 1. A valid address within the erase row is loaded in ADDRH:ADDRL
; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM)
BCF
BANKSEL
MOVF
MOVWF
MOVF
MOVWF
BCF
BSF
BSF
INTCON,GIE
PMADRL
ADDRL,W
PMADRL
ADDRH,W
PMADRH
PMCON1,CFGS
PMCON1,FREE
PMCON1,WREN
MOVLW
MOVWF
MOVLW
MOVWF
BSF
NOP
NOP
55h
PMCON2
0AAh
PMCON2
PMCON1,WR
BCF
BSF
PMCON1,WREN
INTCON,GIE
 2013-2016 Microchip Technology Inc.
; Disable ints so required sequences will execute properly
; Load lower 8 bits of erase address boundary
; Load upper 6 bits of erase address boundary
; Not configuration space
; Specify an erase operation
; Enable writes
;
;
;
;
;
;
;
;
;
;
Start of required sequence to initiate erase
Write 55h
Write AAh
Set WR bit to begin erase
NOP instructions are forced as processor starts
row erase of program memory.
The processor stalls until the erase process is complete
after erase processor continues with 3rd instruction
; Disable writes
; Enable interrupts
DS40001726C-page 105
PIC16(L)F1713/6
10.2.4
WRITING TO FLASH PROGRAM
MEMORY
Program memory is programmed using the following
steps:
1.
2.
3.
4.
Load the address in PMADRH:PMADRL of the
row to be programmed.
Load each write latch with data.
Initiate a programming operation.
Repeat steps 1 through 3 until all data is written.
The following steps should be completed to load the
write latches and program a row of program memory.
These steps are divided into two parts. First, each write
latch is loaded with data from the PMDATH:PMDATL
using the unlock sequence with LWLO = 1. When the
last word to be loaded into the write latch is ready, the
LWLO bit is cleared and the unlock sequence
executed. This initiates the programming operation,
writing all the latches into Flash program memory.
Note:
Before writing to program memory, the word(s) to be
written must be erased or previously unwritten.
Program memory can only be erased one row at a time.
No automatic erase occurs upon the initiation of the
write.
Program memory can be written one or more words at
a time. The maximum number of words written at one
time is equal to the number of write latches. See
Figure 10-5 (row writes to program memory with 32
write latches) for more details.
The write latches are aligned to the Flash row address
boundary defined by the upper 10-bits of
PMADRH:PMADRL, (PMADRH<6:0>:PMADRL<7:5>)
with the lower five bits of PMADRL, (PMADRL<4:0>)
determining the write latch being loaded. Write operations do not cross these boundaries. At the completion
of a program memory write operation, the data in the
write latches is reset to contain 0x3FFF.
The special unlock sequence is required
to load a write latch with data or initiate a
Flash programming operation. If the
unlock sequence is interrupted, writing to
the latches or program memory will not be
initiated.
1.
2.
3.
Set the WREN bit of the PMCON1 register.
Clear the CFGS bit of the PMCON1 register.
Set the LWLO bit of the PMCON1 register.
When the LWLO bit of the PMCON1 register is
‘1’, the write sequence will only load the write
latches and will not initiate the write to Flash
program memory.
4. Load the PMADRH:PMADRL register pair with
the address of the location to be written.
5. Load the PMDATH:PMDATL register pair with
the program memory data to be written.
6. Execute the unlock sequence (Section 10.2.2
“Flash Memory Unlock Sequence”). The write
latch is now loaded.
7. Increment the PMADRH:PMADRL register pair
to point to the next location.
8. Repeat steps 5 through 7 until all but the last
write latch has been loaded.
9. Clear the LWLO bit of the PMCON1 register.
When the LWLO bit of the PMCON1 register is
‘0’, the write sequence will initiate the write to
Flash program memory.
10. Load the PMDATH:PMDATL register pair with
the program memory data to be written.
11. Execute the unlock sequence (Section 10.2.2
“Flash Memory Unlock Sequence”). The
entire program memory latch content is now
written to Flash program memory.
Note:
The program memory write latches are
reset to the blank state (0x3FFF) at the
completion of every write or erase
operation. As a result, it is not necessary
to load all the program memory write
latches. Unloaded latches will remain in
the blank state.
An example of the complete write sequence is shown in
Example 10-3. The initial address is loaded into the
PMADRH:PMADRL register pair; the data is loaded
using indirect addressing.
DS40001726C-page 106
 2013-2016 Microchip Technology Inc.
7
BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 32 WRITE LATCHES
6
0 7
5 4
PMADRH
-
r9
r8
r7
r6
r5
0
7
PMADRL
r4
r3
r2
r1
r0
c4
c3
c2
c1
-
5
-
0
7
PMDATH
PMDATL
6
c0
Rev. 10-000004A_A0
0
8
14
Program Memory Write Latches
5
10
14
PMADRL<4:0>
Write Latch #0
00h
14
CFGS = 0
 2013-2016 Microchip Technology Inc.
PMADRH<6:0>:
PMADRL<7:5>
Row
Address
Decode
14
14
Write Latch #1
01h
14
Write Latch #30
1Eh
14
Write Latch #31
1Fh
14
14
Row
Addr
Addr
Addr
Addr
000h
0000h
0001h
001Eh
001Fh
001h
0020h
0021h
003Eh
003Fh
002h
0040h
0041h
005Eh
005Fh
3FEh
7FC0h
7FC1h
7FDEh
7FDFh
3FFh
7FE0h
7FE1h
7FFEh
7FFFh
Flash Program Memory
400h
CFGS = 1
8000h - 8003h
8004h – 8005h
8006h
8007h – 8008h
8009h - 801Fh
USER ID 0 - 3
reserved
DEVICE ID
Dev / Rev
Configuration
Words
reserved
Configuration Memory
PIC16(L)F1713/6
DS40001726C-page 107
FIGURE 10-5:
PIC16(L)F1713/6
FIGURE 10-6:
FLASH PROGRAM MEMORY WRITE FLOWCHART
Start
Write Operation
Determine number of words
to be written into Program or
Configuration Memory.
The number of words cannot
exceed the number of words
per row.
(word_cnt)
Disable Interrupts
(GIE = 0)
Select
Program or Config. Memory
(CFGS)
Select Row Address
(PMADRH:PMADRL)
Enable Write/Erase
Operation (WREN = 1)
Load the value to write
(PMDATH:PMDATL)
Update the word counter
(word_cnt--)
Last word to
write ?
Yes
No
Unlock Sequence
(Figure10-3
x-x)
Figure
Select Write Operation
(FREE = 0)
No delay when writing to
Program Memory Latches
Load Write Latches Only
(LWLO = 1)
Increment Address
(PMADRH:PMADRL++)
Write Latches to Flash
(LWLO = 0)
Unlock Sequence
(Figure10-3
x-x)
Figure
CPU stalls while Write
operation completes
(2ms typical)
Disable
Write/Erase Operation
(WREN = 0)
Re-enable Interrupts
(GIE = 1)
End
Write Operation
DS40001726C-page 108
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
EXAMPLE 10-3:
;
;
;
;
;
;
;
WRITING TO FLASH PROGRAM MEMORY
This write routine assumes the following:
1. 64 bytes of data are loaded, starting at the address in DATA_ADDR
2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR,
stored in little endian format
3. A valid starting address (the least significant bits = 00000) is loaded in ADDRH:ADDRL
4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM)
BCF
BANKSEL
MOVF
MOVWF
MOVF
MOVWF
MOVLW
MOVWF
MOVLW
MOVWF
BCF
BSF
BSF
INTCON,GIE
PMADRH
ADDRH,W
PMADRH
ADDRL,W
PMADRL
LOW DATA_ADDR
FSR0L
HIGH DATA_ADDR
FSR0H
PMCON1,CFGS
PMCON1,WREN
PMCON1,LWLO
;
;
;
;
;
;
;
;
;
;
;
;
;
Disable ints so required sequences will execute properly
Bank 3
Load initial address
MOVIW
MOVWF
MOVIW
MOVWF
FSR0++
PMDATL
FSR0++
PMDATH
; Load first data byte into lower
;
; Load second data byte into upper
;
MOVF
XORLW
ANDLW
BTFSC
GOTO
PMADRL,W
0x1F
0x1F
STATUS,Z
START_WRITE
; Check if lower bits of address are '00000'
; Check if we're on the last of 32 addresses
;
; Exit if last of 32 words,
;
MOVLW
MOVWF
MOVLW
MOVWF
BSF
NOP
55h
PMCON2
0AAh
PMCON2
PMCON1,WR
;
;
;
;
;
;
;
;
PMADRL,F
LOOP
; Still loading latches Increment address
; Write next latches
PMCON1,LWLO
; No more loading latches - Actually start Flash program
; memory write
55h
PMCON2
0AAh
PMCON2
PMCON1,WR
;
;
;
;
;
;
;
;
;
;
;
;
;
Load initial data address
Load initial data address
Not configuration space
Enable writes
Only Load Write Latches
Required
Sequence
LOOP
NOP
INCF
GOTO
Required
Sequence
START_WRITE
BCF
MOVLW
MOVWF
MOVLW
MOVWF
BSF
NOP
NOP
BCF
BSF
PMCON1,WREN
INTCON,GIE
 2013-2016 Microchip Technology Inc.
Start of required write sequence:
Write 55h
Write AAh
Set WR bit to begin write
NOP instructions are forced as processor
loads program memory write latches
Start of required write sequence:
Write 55h
Write AAh
Set WR bit to begin write
NOP instructions are forced as processor writes
all the program memory write latches simultaneously
to program memory.
After NOPs, the processor
stalls until the self-write process in complete
after write processor continues with 3rd instruction
Disable writes
Enable interrupts
DS40001726C-page 109
PIC16(L)F1713/6
10.3
Modifying Flash Program Memory
When modifying existing data in a program memory
row, and data within that row must be preserved, it must
first be read and saved in a RAM image. Program
memory is modified using the following steps:
1.
2.
3.
4.
5.
6.
7.
Load the starting address of the row to be
modified.
Read the existing data from the row into a RAM
image.
Modify the RAM image to contain the new data
to be written into program memory.
Load the starting address of the row to be
rewritten.
Erase the program memory row.
Load the write latches with data from the RAM
image.
Initiate a programming operation.
FIGURE 10-7:
FLASH PROGRAM
MEMORY MODIFY
FLOWCHART
Start
Modify Operation
Read Operation
(Figure10-1
x.x)
Figure
An image of the entire row read
must be stored in RAM
Modify Image
The words to be modified are
changed in the RAM image
Erase Operation
(Figure10-4
x.x)
Figure
Write Operation
use RAM image
(Figure10-6
x.x)
Figure
End
Modify Operation
DS40001726C-page 110
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
10.4
User ID, Device ID and
Configuration Word Access
Instead of accessing program memory, the User ID’s,
Device ID/Revision ID and Configuration Words can be
accessed when CFGS = 1 in the PMCON1 register.
This is the region that would be pointed to by
PC<15> = 1, but not all addresses are accessible.
Different access may exist for reads and writes. Refer
to Table 10-2.
When read access is initiated on an address outside
the
parameters
listed
in
Table 10-2,
the
PMDATH:PMDATL register pair is cleared, reading
back ‘0’s.
TABLE 10-2:
USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS = 1)
Address
Function
8000h-8003h
8005h-8006h
8007h-8008h
EXAMPLE 10-4:
Read Access
Write Access
Yes
Yes
Yes
Yes
No
No
User IDs
Device ID/Revision ID
Configuration Words 1 and 2
CONFIGURATION WORD AND DEVICE ID ACCESS
* This code block will read 1 word of program memory at the memory address:
*
PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables;
*
PROG_DATA_HI, PROG_DATA_LO
BANKSEL
MOVLW
MOVWF
CLRF
PMADRL
PROG_ADDR_LO
PMADRL
PMADRH
; Select correct Bank
;
; Store LSB of address
; Clear MSB of address
BSF
BCF
BSF
NOP
NOP
BSF
PMCON1,CFGS
INTCON,GIE
PMCON1,RD
INTCON,GIE
;
;
;
;
;
;
Select Configuration Space
Disable interrupts
Initiate read
Executed (See Figure 10-2)
Ignored (See Figure 10-2)
Restore interrupts
MOVF
MOVWF
MOVF
MOVWF
PMDATL,W
PROG_DATA_LO
PMDATH,W
PROG_DATA_HI
;
;
;
;
Get LSB of word
Store in user location
Get MSB of word
Store in user location
 2013-2016 Microchip Technology Inc.
DS40001726C-page 111
PIC16(L)F1713/6
10.5
Write Verify
It is considered good programming practice to verify that
program memory writes agree with the intended value.
Since program memory is stored as a full page then the
stored program memory contents are compared with the
intended data stored in RAM after the last write is
complete.
FIGURE 10-8:
FLASH PROGRAM
MEMORY VERIFY
FLOWCHART
Start
Verify Operation
This routine assumes that the last row
of data written was from an image
saved in RAM. This image will be used
to verify the data currently stored in
Flash Program Memory.
Read Operation
(Figure
x.x)
Figure
10-1
PMDAT =
RAM image
?
Yes
No
No
Fail
Verify Operation
Last
Word ?
Yes
End
Verify Operation
DS40001726C-page 112
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
10.6
Register Definitions: Flash Program Memory Control
REGISTER 10-1:
R/W-x/u
PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
PMDAT<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
PMDAT<7:0>: Read/write value for Least Significant bits of program memory
REGISTER 10-2:
PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER
U-0
U-0
—
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
PMDAT<13:8>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
PMDAT<13:8>: Read/write value for Most Significant bits of program memory
REGISTER 10-3:
R/W-0/0
PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
PMADR<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
PMADR<7:0>: Specifies the Least Significant bits for program memory address
REGISTER 10-4:
U-1
PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER
R/W-0/0
R/W-0/0
—(1)
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
PMADR<14:8>
bit 0
bit 7
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘1’
bit 6-0
PMADR<14:8>: Specifies the Most Significant bits for program memory address
Note
1:
Unimplemented, read as ‘1’.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
REGISTER 10-5:
PMCON1: PROGRAM MEMORY CONTROL 1 REGISTER
U-1
R/W-0/0
R/W-0/0
R/W/HC-0/0
R/W/HC-x/q(2)
R/W-0/0
R/S/HC-0/0
R/S/HC-0/0
—(1)
CFGS
LWLO(3)
FREE
WRERR
WREN
WR
RD
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
S = Bit can only be set
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
HC = Bit is cleared by hardware
bit 7
Unimplemented: Read as ‘1’
bit 6
CFGS: Configuration Select bit
1 = Access Configuration, User ID and Device ID Registers
0 = Access Flash program memory
bit 5
LWLO: Load Write Latches Only bit(3)
1 = Only the addressed program memory write latch is loaded/updated on the next WR command
0 = The addressed program memory write latch is loaded/updated and a write of all program memory write latches
will be initiated on the next WR command
bit 4
FREE: Program Flash Erase Enable bit
1 = Performs an erase operation on the next WR command (hardware cleared upon completion)
0 = Performs a write operation on the next WR command
bit 3
WRERR: Program/Erase Error Flag bit
1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set automatically
on any set attempt (write ‘1’) of the WR bit).
0 = The program or erase operation completed normally
bit 2
WREN: Program/Erase Enable bit
1 = Allows program/erase cycles
0 = Inhibits programming/erasing of program Flash
bit 1
WR: Write Control bit
1 = Initiates a program Flash program/erase operation.
The operation is self-timed and the bit is cleared by hardware once operation is complete.
The WR bit can only be set (not cleared) in software.
0 = Program/erase operation to the Flash is complete and inactive
bit 0
RD: Read Control bit
1 = Initiates a program Flash read. Read takes one cycle. RD is cleared in hardware. The RD bit can only be set
(not cleared) in software.
0 = Does not initiate a program Flash read
Note 1:
2:
3:
Unimplemented bit, read as ‘1’.
The WRERR bit is automatically set by hardware when a program memory write or erase operation is started (WR = 1).
The LWLO bit is ignored during a program memory erase operation (FREE = 1).
DS40001726C-page 114
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PIC16(L)F1713/6
REGISTER 10-6:
W-0/0
PMCON2: PROGRAM MEMORY CONTROL 2 REGISTER
W-0/0
W-0/0
W-0/0
W-0/0
W-0/0
W-0/0
W-0/0
Program Memory Control Register 2
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
S = Bit can only be set
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Flash Memory Unlock Pattern bits
To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the
PMCON1 register. The value written to this register is used to unlock the writes. There are specific
timing requirements on these writes.
TABLE 10-3:
SUMMARY OF REGISTERS ASSOCIATED WITH FLASH PROGRAM MEMORY
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
INTCON
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
PMCON1
—(1)
CFGS
LWLO
FREE
WRERR
WREN
WR
RD
114
PMCON2
Program Memory Control Register 2
PMADRL
PMADRL<7:0>
PMADRH
—(1)
115
113
PMADRH<6:0>
PMDATL
113
PMDATL<7:0>
—
PMDATH
—
113
PMDATH<5:0>
113
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory.
Note 1: Unimplemented, read as ‘1’.
TABLE 10-4:
Name
SUMMARY OF CONFIGURATION WORD WITH FLASH PROGRAM MEMORY
Bits
Bit -/7
Bit -/6
Bit 13/5
Bit 12/4
Bit 11/3
13:8
—
—
—
—
CLKOUTEN
7:0
CP
MCLRE
PWRTE
CONFIG2 13:8
—
—
LVP
DEBUG
LPBOR
BORV
ZCDDIS
—
—
—
—
PPS1WAY
CONFIG1
7:0
WDTE<1:0>
Bit 10/2
Bit 9/1
BOREN<1:0>
—
Bit 8/0
—
FOSC<1:0>
STVREN
PLLEN
WRT<1:0>
Register
on Page
47
49
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory.
 2013-2016 Microchip Technology Inc.
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11.0
I/O PORTS
FIGURE 11-1:
GENERIC I/O PORT
OPERATION
Each port has six standard registers for its operation.
These registers are:
• TRISx registers (data direction)
• PORTx registers (reads the levels on the pins of
the device)
• LATx registers (output latch)
• INLVLx (input level control)
• ODCONx registers (open-drain)
• SLRCONx registers (slew rate
Some ports may have one or more of the following
additional registers. These registers are:
D
Write LATx
Write PORTx
TRISx
Q
CK
VDD
Data Register
Data Bus
I/O pin
• ANSELx (analog select)
• WPUx (weak pull-up)
Read PORTx
In general, when a peripheral is enabled on a port pin,
that pin cannot be used as a general purpose output.
However, the pin can still be read.
To digital peripherals
To analog peripherals
ANSELx
VSS
Device
PORTB
PORTC
PORTE
PORT AVAILABILITY PER
DEVICE
PORTA
TABLE 11-1:
Read LATx
PIC16(L)F1713
●
●
●
●
PIC16(L)F1716
●
●
●
●
The Data Latch (LATx registers) is useful for
read-modify-write operations on the value that the I/O
pins are driving.
A write operation to the LATx register has the same
effect as a write to the corresponding PORTx register.
A read of the LATx register reads of the values held in
the I/O PORT latches, while a read of the PORTx
register reads the actual I/O pin value.
Ports that support analog inputs have an associated
ANSELx register. When an ANSEL bit is set, the digital
input buffer associated with that bit is disabled.
Disabling the input buffer prevents analog signal levels
on the pin between a logic high and low from causing
excessive current in the logic input circuitry. A
simplified model of a generic I/O port, without the
interfaces to other peripherals, is shown in Figure 11-1.
DS40001726C-page 116
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11.1
11.1.1
PORTA Registers
DATA REGISTER
PORTA is an 8-bit wide, bidirectional port. The
corresponding data direction register is TRISA
(Register 11-2). Setting a TRISA bit (= 1) will make the
corresponding PORTA pin an input (i.e., disable the
output driver). Clearing a TRISA bit (= 0) will make the
corresponding PORTA pin an output (i.e., enables
output driver and puts the contents of the output latch
on the selected pin). Example 11-1 shows how to
initialize PORTA.
11.1.5
The INLVLA register (Register 11-8) controls the input
voltage threshold for each of the available PORTA input
pins. A selection between the Schmitt Trigger CMOS or
the TTL Compatible thresholds is available. The input
threshold is important in determining the value of a read
of the PORTA register and also the level at which an
interrupt-on-change occurs, if that feature is enabled.
See Table 34-4: I/O Ports for more information on
threshold levels.
Note:
Reading the PORTA register (Register 11-1) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then
written to the PORT data latch (LATA).
11.1.2
DIRECTION CONTROL
The TRISA register (Register 11-2) controls the
PORTA pin output drivers, even when they are being
used as analog inputs. The user should ensure the bits
in the TRISA register are maintained set when using
them as analog inputs. I/O pins configured as analog
inputs always read ‘0’.
11.1.3
OPEN-DRAIN CONTROL
The ODCONA register (Register 11-6) controls the
open-drain feature of the port. Open-drain operation is
independently selected for each pin. When an
ODCONA bit is set, the corresponding port output
becomes an open-drain driver capable of sinking
current only. When an ODCONA bit is cleared, the
corresponding port output pin is the standard push-pull
drive capable of sourcing and sinking current.
11.1.4
SLEW RATE CONTROL
The SLRCONA register (Register 11-7) controls the
slew rate option for each port pin. Slew rate control is
independently selectable for each port pin. When an
SLRCONA bit is set, the corresponding port pin drive is
slew rate limited. When an SLRCONA bit is cleared,
The corresponding port pin drive slews at the maximum
rate possible.
 2013-2016 Microchip Technology Inc.
INPUT THRESHOLD CONTROL
11.1.6
Changing the input threshold selection
should be performed while all peripheral
modules are disabled. Changing the
threshold level during the time a module is
active may inadvertently generate a
transition associated with an input pin,
regardless of the actual voltage level on
that pin.
ANALOG CONTROL
The ANSELA register (Register 11-4) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELA bit high will cause all
digital reads on the pin to be read as ‘0’ and allow
analog functions on the pin to operate correctly.
The state of the ANSELA bits has no effect on digital
output functions. A pin with TRIS clear and ANSEL set
will still operate as a digital output, but the Input mode
will be analog. This can cause unexpected behavior
when executing read-modify-write instructions on the
affected port.
Note:
The ANSELA bits default to the Analog
mode after Reset. To use any pins as
digital general purpose or peripheral
inputs, the corresponding ANSEL bits
must be initialized to ‘0’ by user software.
EXAMPLE 11-1:
;
;
;
;
INITIALIZING PORTA
This code example illustrates
initializing the PORTA register. The
other ports are initialized in the same
manner.
BANKSEL
CLRF
BANKSEL
CLRF
BANKSEL
CLRF
BANKSEL
MOVLW
MOVWF
PORTA
PORTA
LATA
LATA
ANSELA
ANSELA
TRISA
B'00111000'
TRISA
;
;Init PORTA
;Data Latch
;
;
;digital I/O
;
;Set RA<5:3> as inputs
;and set RA<2:0> as
;outputs
DS40001726C-page 117
PIC16(L)F1713/6
11.1.7
PORTA FUNCTIONS AND OUTPUT
PRIORITIES
Each PORTA pin is multiplexed with other functions.
Each pin defaults to the PORT latch data after reset.
Other functions are selected with the peripheral pin
select logic. See Section 12.0 “Peripheral Pin Select
(PPS) Module” for more information.
Analog input functions, such as ADC and comparator
inputs are not shown in the peripheral pin select lists.
These inputs are active when the I/O pin is set for
Analog mode using the ANSELA register. Digital output
functions may continue to control the pin when it is in
Analog mode.
DS40001726C-page 118
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11.2
Register Definitions: PORTA
REGISTER 11-1:
PORTA: PORTA REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R-x/u
R/W-x/u
R/W-x/u
R/W-x/u
RA7
RA6
RA5
RA4
RA3
RA2
RA1
RA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
RA<7:0>: PORTA I/O Value bits(1)
1 = Port pin is > VIH
0 = Port pin is < VIL
bit 7-0
Note 1:
Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return
of actual I/O pin values.
REGISTER 11-2:
TRISA: PORTA TRI-STATE REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
TRISA<7:0>: PORTA Tri-State Control bit
1 = PORTA pin configured as an input (tri-stated)
0 = PORTA pin configured as an output
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REGISTER 11-3:
LATA: PORTA DATA LATCH REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LATA7
LATA6
LATA5
LATA4
LATA3
LATA2
LATA1
LATA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
LATA<7:0>: RA<7:0> Output Latch Value bits(1)
bit 7-0
Note 1:
Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return
of actual I/O pin values.
REGISTER 11-4:
ANSELA: PORTA ANALOG SELECT REGISTER
U-0
U-0
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
—
—
ANSA5
ANSA4
ANSA3
ANSA2
ANSA1
ANSA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
ANSA<5:0>: Analog Select between Analog or Digital Function on pins RA<2:0>, respectively
1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled.
0 = Digital I/O. Pin is assigned to port or digital special function.
Note 1:
When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to
allow external control of the voltage on the pin.
DS40001726C-page 120
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REGISTER 11-5:
WPUA: WEAK PULL-UP PORTA REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
WPUA7
WPUA6
WPUA5
WPUA4
WPUA3
WPUA2
WPUA1
WPUA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
2:
WPUA<7:0>: Weak Pull-up Register bits
1 = Pull-up enabled
0 = Pull-up disabled
Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled.
The weak pull-up device is automatically disabled if the pin is configured as an output.
REGISTER 11-6:
ODCONA: PORTA OPEN-DRAIN CONTROL REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
ODA7
ODA6
ODA5
ODA4
ODA3
ODA2
ODA1
ODA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
ODA<7:0>: PORTA Open-Drain Enable bits
For RA<7:0> pins, respectively
1 = Port pin operates as open-drain drive (sink current only)
0 = Port pin operates as standard push-pull drive (source and sink current)
 2013-2016 Microchip Technology Inc.
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REGISTER 11-7:
SLRCONA: PORTA SLEW RATE CONTROL REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
SLRA7
SLRA6
SLRA5
SLRA4
SLRA3
SLRA2
SLRA1
SLRA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
SLRA<7:0>: PORTA Slew Rate Enable bits
For RA<7:0> pins, respectively
1 = Port pin slew rate is limited
0 = Port pin slews at maximum rate
REGISTER 11-8:
INLVLA: PORTA INPUT LEVEL CONTROL REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
INLVLA7
INLVLA6
INLVLA5
INLVLA4
INLVLA3
INLVLA2
INLVLA1
INLVLA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 75-0
INLVLA<7:0>: PORTA Input Level Select bits
For RA<7:0> pins, respectively
1 = ST input used for PORT reads and interrupt-on-change
0 = TTL input used for PORT reads and interrupt-on-change
DS40001726C-page 122
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TABLE 11-2:
Name
ANSELA
INLVLA
LATA
ODCONA
OPTION_REG
PORTA
SLRCONA
SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
ANSA5
ANSA4
ANSA3
ANSA2
ANSA1
ANSA0
120
INLVLA7
INLVLA6
INLVLA5
INLVLA4
INLVLA3
INLVLA2
INLVLA1
INLVLA0
122
LATA7
LATA6
LATA5
LATA4
LATA3
LATA2
LATA1
LATA0
120
ODA5
ODA4
ODA3
ODA2
ODA1
ODA0
121
ODA7
ODA6
WPUEN
INTEDG
RA7
RA6
RA5
RA4
RA3
RA2
RA1
RA0
119
SLRA7
SLRA6
SLRA5
SLRA4
SLRA3
SLRA2
SLRA1
SLRA0
122
TMR0CS TMR0SE
PSA
PS<2:0>
256
TRISA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
WPUA
WPUA7
WPUA6
WPUA5
WPUA4
WPUA3
WPUA2
WPUA1
WPUA0
121
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by
PORTA.
TABLE 11-3:
Name
CONFIG1
Legend:
SUMMARY OF CONFIGURATION WORD WITH PORTA
Bits
Bit -/7
Bit -/6
Bit 13/5
Bit 12/4
Bit 11/3
13:8
—
—
FCMEN
IESO
CLKOUTEN
7:0
CP
MCLRE
PWRTE
Bit 10/2
Bit 9/1
BOREN<1:0>
WDTE<1:0>
Bit 8/0
—
FOSC<2:0>
Register
on Page
47
— = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
11.3
PORTB Registers
PORTB is an 8-bit wide, bidirectional port. The
corresponding data direction register is TRISB
(Register 11-10). Setting a TRISB bit (= 1) will make the
corresponding PORTB pin an input (i.e., put the
corresponding output driver in a High-Impedance mode).
Clearing a TRISB bit (= 0) will make the corresponding
PORTB pin an output (i.e., enable the output driver and
put the contents of the output latch on the selected pin).
Example 11-1 shows how to initialize an I/O port.
Reading the PORTB register (Register 11-9) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then written
to the PORT data latch (LATB).
11.3.1
OPEN-DRAIN CONTROL
The ODCONB register (Register 11-14) controls the
open-drain feature of the port. Open-drain operation is
independently selected for each pin. When an
ODCONB bit is set, the corresponding port output
becomes an open-drain driver capable of sinking
current only. When an ODCONB bit is cleared, the
corresponding port output pin is the standard push-pull
drive capable of sourcing and sinking current.
11.3.3
Note:
11.3.5
DS40001726C-page 124
Changing the input threshold selection
should be performed while all peripheral
modules are disabled. Changing the
threshold level during the time a module is
active may inadvertently generate a
transition associated with an input pin,
regardless of the actual voltage level on
that pin.
ANALOG CONTROL
The ANSELB register (Register 11-12) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELB bit high will cause all
digital reads on the pin to be read as ‘0’ and allow
analog functions on the pin to operate correctly.
The state of the ANSELB bits has no effect on digital output functions. A pin with TRIS clear and ANSELB set will
still operate as a digital output, but the Input mode will be
analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected
port.
Note:
SLEW RATE CONTROL
The SLRCONB register (Register 11-15) controls the
slew rate option for each port pin. Slew rate control is
independently selectable for each port pin. When an
SLRCONB bit is set, the corresponding port pin drive is
slew rate limited. When an SLRCONB bit is cleared,
The corresponding port pin drive slews at the maximum
rate possible.
INPUT THRESHOLD CONTROL
The INLVLB register (Register 11-16) controls the input
voltage threshold for each of the available PORTB input
pins. A selection between the Schmitt Trigger CMOS or
the TTL Compatible thresholds is available. The input
threshold is important in determining the value of a read
of the PORTB register and also the level at which an
interrupt-on-change occurs, if that feature is enabled.
See Table 34-4: I/O Ports for more information on
threshold levels.
DIRECTION CONTROL
The TRISB register (Register 11-10) controls the
PORTB pin output drivers, even when they are being
used as analog inputs. The user should ensure the bits in
the TRISB register are maintained set when using them
as analog inputs. I/O pins configured as analog inputs
always read ‘0’.
11.3.2
11.3.4
11.3.6
The ANSELB bits default to the Analog
mode after Reset. To use any pins as
digital general purpose or peripheral
inputs, the corresponding ANSEL bits
must be initialized to ‘0’ by user software.
PORTB FUNCTIONS AND OUTPUT
PRIORITIES
Each pin defaults to the PORT latch data after reset.
Other functions are selected with the peripheral pin
select logic. See Section 12.0 “Peripheral Pin Select
(PPS) Module” for more information. Analog input
functions, such as ADC and Op Amp inputs, are not
shown in the peripheral pin select lists. These inputs
are active when the I/O pin is set for Analog mode using
the ANSELB register. Digital output functions continue
to may continue to control the pin when it is in Analog
mode.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
11.4
Register Definitions: PORTB
REGISTER 11-9:
PORTB: PORTB REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
RB<7:0>: PORTB General Purpose I/O Pin bits(1)
1 = Port pin is > VIH
0 = Port pin is < VIL
bit 7-0
Note 1:
Writes to PORTB are actually written to corresponding LATB register. Reads from PORTB register is return of
actual I/O pin values.
REGISTER 11-10: TRISB: PORTB TRI-STATE REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
TRISB<7:0>: PORTB Tri-State Control bits
1 = PORTB pin configured as an input (tri-stated)
0 = PORTB pin configured as an output
REGISTER 11-11: LATB: PORTB DATA LATCH REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
LATB<7:0>: PORTB Output Latch Value bits(1)
Writes to PORTB are actually written to corresponding LATB register. Reads from PORTB register is return of
actual I/O pin values.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
REGISTER 11-12: ANSELB: PORTB ANALOG SELECT REGISTER
U-0
U-0
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
ANSB<5:0>: Analog Select between Analog or Digital Function on pins RB<5:4>, respectively
0 = Digital I/O. Pin is assigned to port or digital special function.
1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled.
Note 1:
When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to
allow external control of the voltage on the pin.
REGISTER 11-13: WPUB: WEAK PULL-UP PORTB REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
WPUB7
WPUB6
WPUB5
WPUB4
WPUB3
WPUB2
WPUB1
WPUB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
2:
WPUB<7:0>: Weak Pull-up Register bits
1 = Pull-up enabled
0 = Pull-up disabled
Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled.
The weak pull-up device is automatically disabled if the pin is configured as an output.
DS40001726C-page 126
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PIC16(L)F1713/6
REGISTER 11-14: ODCONB: PORTB OPEN-DRAIN CONTROL REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
ODB7
ODB6
ODB5
ODB4
ODB3
ODB2
ODB1
ODB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
ODB<7:0>: PORTB Open-Drain Enable bits
For RB<7:0> pins, respectively
1 = Port pin operates as open-drain drive (sink current only)
0 = Port pin operates as standard push-pull drive (source and sink current)
REGISTER 11-15: SLRCONB: PORTB SLEW RATE CONTROL REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
SLRB7
SLRB6
SLRB5
SLRB4
SLRB3
SLRB2
SLRB1
SLRB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
SLRB<7:0>: PORTB Slew Rate Enable bits
For RB<7:0> pins, respectively
1 = Port pin slew rate is limited
0 = Port pin slews at maximum rate
REGISTER 11-16: INLVLB: PORTB INPUT LEVEL CONTROL REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
INLVLB7
INLVLB6
INLVLB5
INLVLB4
INLVLB3
INLVLB2
INLVLB1
INLVLB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
INLVLB<7:0>: PORTB Input Level Select bits
For RB<7:0> pins, respectively
1 = ST input used for PORT reads and interrupt-on-change
0 = TTL input used for PORT reads and interrupt-on-change
 2013-2016 Microchip Technology Inc.
DS40001726C-page 127
PIC16(L)F1713/6
TABLE 11-4:
SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
INLVLB7
INLVLB6
INLVLB5
INLVLB4
INLVLB3
INLVLB2
INLVLB1
INLVLB0
127
LATB
LATB7
LATB6
LATB5
LATB4
LATB3
LATB2
LATB1
LATB0
125
ODCONB
ODB7
ODB6
ODB5
ODB4
ODB3
ODB2
ODB1
ODB0
127
RB7
RB6
RB5
RB4
RB3
RB2
RB1
RB0
125
SLRB7
SLRB6
SLRB5
SLRB4
SLRB3
SLRB2
SLRB1
SLRB0
127
Name
ANSELB
INLVLB
PORTB
SLRCONB
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
127
WPUB
WPUB7
WPUB6
WPUB5
WPUB4
WPUB3
WPUB2
WPUB1
WPUB0
126
Legend:
x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by
PORTB.
DS40001726C-page 128
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PIC16(L)F1713/6
11.5
11.5.1
PORTC Registers
DATA REGISTER
PORTC is an 8-bit wide bidirectional port. The
corresponding data direction register is TRISC
(Register 11-18). Setting a TRISC bit (= 1) will make the
corresponding PORTC pin an input (i.e., put the
corresponding output driver in a High-Impedance mode).
Clearing a TRISC bit (= 0) will make the corresponding
PORTC pin an output (i.e., enable the output driver and
put the contents of the output latch on the selected pin).
Example 11-1 shows how to initialize an I/O port.
11.5.4
OPEN-DRAIN CONTROL
The ODCONC register (Register 11-22) controls the
open-drain feature of the port. Open-drain operation is
independently selected for each pin. When an
ODCONC bit is set, the corresponding port output
becomes an open-drain driver capable of sinking
current only. When an ODCONC bit is cleared, the
corresponding port output pin is the standard push-pull
drive capable of sourcing and sinking current.
11.5.5
SLEW RATE CONTROL
Reading the PORTC register (Register 11-17) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then written
to the PORT data latch (LATC).
The SLRCONC register (Register 11-23) controls the
slew rate option for each port pin. Slew rate control is
independently selectable for each port pin. When an
SLRCONC bit is set, the corresponding port pin drive is
slew rate limited. When an SLRCONC bit is cleared,
The corresponding port pin drive slews at the maximum
rate possible.
11.5.2
11.5.6
DIRECTION CONTROL
The TRISC register (Register 11-18) controls the
PORTC pin output drivers, even when they are being
used as analog inputs. The user should ensure the bits in
the TRISC register are maintained set when using them
as analog inputs. I/O pins configured as analog inputs
always read ‘0’.
11.5.3
INPUT THRESHOLD CONTROL
The INLVLC register (Register 11-24) controls the input
voltage threshold for each of the available PORTC
input pins. A selection between the Schmitt Trigger
CMOS or the TTL Compatible thresholds is available.
The input threshold is important in determining the
value of a read of the PORTC register and also the
level at which an interrupt-on-change occurs, if that
feature is enabled. See Table 34-4: I/O Ports for more
information on threshold levels.
Note:
Changing the input threshold selection
should be performed while all peripheral
modules are disabled. Changing the
threshold level during the time a module is
active may inadvertently generate a
transition associated with an input pin,
regardless of the actual voltage level on
that pin.
 2013-2016 Microchip Technology Inc.
ANALOG CONTROL
The ANSELC register (Register 11-20) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELC bit high will cause all
digital reads on the pin to be read as ‘0’ and allow
analog functions on the pin to operate correctly.
The state of the ANSELC bits has no effect on digital output functions. A pin with TRIS clear and ANSELC set will
still operate as a digital output, but the Input mode will be
analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected
port.
Note:
11.5.7
The ANSELC bits default to the Analog
mode after Reset. To use any pins as
digital general purpose or peripheral
inputs, the corresponding ANSEL bits
must be initialized to ‘0’ by user software.
PORTC FUNCTIONS AND OUTPUT
PRIORITIES
Each pin defaults to the PORT latch data after reset.
Other functions are selected with the peripheral pin
select logic. See Section 12.0 “Peripheral Pin Select
(PPS) Module” for more information.
Analog input functions, such as ADC and comparator
inputs, are not shown in the peripheral pin select lists.
These inputs are active when the I/O pin is set for
Analog mode using the ANSELC register. Digital output
functions may continue to control the pin when it is in
Analog mode.
DS40001726C-page 129
PIC16(L)F1713/6
11.6
Register Definitions: PORTC
REGISTER 11-17: PORTC: PORTC REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
RC7
RC6
RC5
RC4
RC3
RC2
RC1
RC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
RC<7:0>: PORTC General Purpose I/O Pin bits(1)
1 = Port pin is > VIH
0 = Port pin is < VIL
bit 7-0
Note 1:
Writes to PORTC are actually written to corresponding LATC register. Reads from PORTC register is return of actual
I/O pin values.
REGISTER 11-18: TRISC: PORTC TRI-STATE REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
TRISC<7:0>: PORTC Tri-State Control bits
1 = PORTC pin configured as an input (tri-stated)
0 = PORTC pin configured as an output
REGISTER 11-19: LATC: PORTC DATA LATCH REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LATC7
LATC6
LATC5
LATC4
LATC3
LATC2
LATC1
LATC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
LATC<7:0>: PORTC Output Latch Value bits
DS40001726C-page 130
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
REGISTER 11-20: ANSELC: PORTC ANALOG SELECT REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
U-0
U-0
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-2
ANSC<7:0>: Analog Select between Analog or Digital Function on pins RC<7:0>, respectively(1)
0 = Digital I/O. Pin is assigned to port or digital special function.
1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled.
bit 1-0
Unimplemented: Read as ‘0’
Note 1:
When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to
allow external control of the voltage on the pin.
REGISTER 11-21: WPUC: WEAK PULL-UP PORTC REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
WPUC7
WPUC6
WPUC5
WPUC4
WPUC3
WPUC2
WPUC1
WPUC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
2:
WPUC<7:0>: Weak Pull-up Register bits
1 = Pull-up enabled
0 = Pull-up disabled
Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled.
The weak pull-up device is automatically disabled if the pin is configured as an output.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 131
PIC16(L)F1713/6
REGISTER 11-22: ODCONC: PORTC OPEN-DRAIN CONTROL REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
ODC7
ODC6
ODC5
ODC4
ODC3
ODC2
ODC1
ODC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
ODC<7:0>: PORTC Open-Drain Enable bits
For RC<7:0> pins, respectively
1 = Port pin operates as open-drain drive (sink current only)
0 = Port pin operates as standard push-pull drive (source and sink current)
REGISTER 11-23: SLRCONC: PORTC SLEW RATE CONTROL REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
SLRC7
SLRC6
SLRC5
SLRC4
SLRC3
SLRC2
SLRC1
SLRC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
SLRC<7:0>: PORTC Slew Rate Enable bits
For RC<7:0> pins, respectively
1 = Port pin slew rate is limited
0 = Port pin slews at maximum rate
REGISTER 11-24: INLVLC: PORTC INPUT LEVEL CONTROL REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
INLVLC7
INLVLC6
INLVLC5
INLVLC4
INLVLC3
INLVLC2
INLVLC1
INLVLC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
INLVLC<7:0>: PORTC Input Level Select bits
For RC<7:0> pins, respectively
1 = ST input used for PORT reads and interrupt-on-change
0 = TTL input used for PORT reads and interrupt-on-change
DS40001726C-page 132
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 11-5:
SUMMARY OF REGISTERS ASSOCIATED WITH PORTC
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
INLVLC
INLVLC7
INLVLC6
INLVLC5
INLVLC4
INLVLC3
INLVLC2
LATC
LATC7
LATC6
LATC5
LATC4
LATC3
LATC2
LATC1
LATC0
130
ODCONC
ODC7
ODC6
ODC5
ODC4
ODC3
ODC2
ODC1
ODC0
132
RC7
RC6
RC5
RC4
RC3
RC2
RC1
RC0
130
SLRCONC
SLRC7
SLRC6
SLRC5
SLRC4
SLRC3
SLRC2
SLRC1
SLRC0
132
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
WPUC7
WPUC6
WPUC5
WPUC4
WPUC3
WPUC2
WPUC1
WPUC0
131
Name
PORTC
WPUC
Legend:
INLVLC1 INLVLC0
132
x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by
PORTC.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 133
PIC16(L)F1713/6
12.0
PERIPHERAL PIN SELECT
(PPS) MODULE
The Peripheral Pin Select (PPS) module connects
peripheral inputs and outputs to the device I/O pins.
Only digital signals are included in the selections. All
analog inputs and outputs remain fixed to their
assigned pins. Input and output selections are
independent as shown in the simplified block diagram
Figure 12-1.
12.1
PPS Inputs
Each peripheral has a PPS register with which the
inputs to the peripheral are selected. Inputs include the
device pins.
Multiple peripherals can operate from the same source
simultaneously. Port reads always return the pin level
regardless of peripheral PPS selection. If a pin also has
associated analog functions, the ANSEL bit for that pin
must be cleared to enable the digital input buffer.
Although every peripheral has its own PPS input selection register, the selections are identical for every
peripheral as shown in Register 12-1.
Note:
12.2
PPS Outputs
Each I/O pin has a PPS register with which the pin
output source is selected. With few exceptions, the port
TRIS control associated with that pin retains control
over the pin output driver. Peripherals that control the
pin output driver as part of the peripheral operation will
override the TRIS control as needed. These
peripherals include:
• EUSART (synchronous operation)
• MSSP (I2C)
• COG (auto-shutdown)
Although every pin has its own PPS peripheral
selection register, the selections are identical for every
pin as shown in Register 12-2.
Note:
FIGURE 12-1:
The notation “xxx” in the register name is
a place holder for the peripheral identifier.
For example, CLC1PPS.
The notation “Rxy” is a place holder for the
pin identifier. For example, RA0PPS.
SIMPLIFIED PPS BLOCK DIAGRAM
PPS Outputs
RA0PPS
PPS Inputs
abcPPS
RA0
RA0
Peripheral abc
RxyPPS
Rxy
Peripheral xyz
RC7
xyzPPS
DS40001726C-page 134
RC7PPS
RC7
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12.3
Bidirectional Pins
PPS selections for peripherals with bidirectional
signals on a single pin must be made so that the PPS
input and PPS output select the same pin. Peripherals
that have bidirectional signals include:
• EUSART (synchronous operation)
• MSSP (I2C)
Note:
12.4
The I2C default input pins are I2C and
SMBus compatible and are the only pins
on the device with this compatibility.
PPS Permanent Lock
The PPS can be permanently locked by setting the
PPS1WAY Configuration bit. When this bit is set, the
PPSLOCKED bit can only be cleared and set one time
after a device Reset. This allows for clearing the
PPSLOCKED bit so that the input and output selections
can be made during initialization. When the
PPSLOCKED bit is set after all selections have been
made, it will remain set and cannot be cleared until after
the next device Reset event.
12.6
Operation During Sleep
PPS input and output selections are unaffected by
Sleep.
PPS Lock
The PPS includes a mode in which all input and output
selections can be locked to prevent inadvertent
changes. PPS selections are locked by setting the
PPSLOCKED bit of the PPSLOCK register. Setting and
clearing this bit requires a special sequence as an extra
precaution against inadvertent changes. Examples of
setting and clearing the PPSLOCKED bit are shown in
Example 12-1.
EXAMPLE 12-1:
12.5
12.7
Effects of a Reset
A device Power-on Reset (POR) clears all PPS input
and output selections to their default values. All other
Resets leave the selections unchanged. Default input
selections are shown in pin allocation Table 1.
PPS LOCK/UNLOCK
SEQUENCE
; suspend interrupts
bcf
INTCON,GIE
;
BANKSEL PPSLOCK
; set bank
; required sequence, next 5 instructions
movlw
0x55
movwf
PPSLOCK
movlw
0xAA
movwf
PPSLOCK
; Set PPSLOCKED bit to disable writes or
; Clear PPSLOCKED bit to enable writes
bsf
PPSLOCK,PPSLOCKED
; restore interrupts
bsf
INTCON,GIE
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12.8
Register Definitions: PPS Input Selection
REGISTER 12-1:
xxxPPS: PERIPHERAL xxx INPUT SELECTION
U-0
U-0
U-0
—
—
—
R/W-q/u
R/W-q/u
R/W-q/u
R/W-q/u
R/W-q/u
xxxPPS<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = value depends on peripheral
bit 7-5
Unimplemented: Read as ‘0’
bit 4-3
xxxPPS<4:3>: Peripheral xxx Input PORTx Selection bits
See Table 12-1 for the list of available ports for each peripheral.
11 = Reserved. Do not use.
10 = Peripheral input is from PORTC
01 = Peripheral input is from PORTB
00 = Peripheral input is from PORTA
bit 2-0
xxxPPS<2:0>: Peripheral xxx Input PORTx Bit Selection bits
111 = Peripheral input is from PORTx Bit 7 (Rx7)
111 = Peripheral input is from PORTx Bit 6 (Rx6)
101 = Peripheral input is from PORTx Bit 5 (Rx5)
100 = Peripheral input is from PORTx Bit 4 (Rx4)
011 = Peripheral input is from PORTx Bit 3 (Rx3)
010 = Peripheral input is from PORTx Bit 2 (Rx2)
001 = Peripheral input is from PORTx Bit 1 (Rx1)
000 = Peripheral input is from PORTx Bit 0 (Rx0)
TABLE 12-1:
Peripheral
Register
PORTA
PORTB
PORTC
PIN interrupt
INTPPS
X
X
Timer0 clock
TOCKIPPS
X
X
Timer1 clock
T1CKIPPS
X
Timer1 gate
T1GPPS
X
X
CCP1
CCP1PPS
X
X
CCP2
CCP2PPS
X
X
X
COG
COGINPPS
X
X
MSSP
SSPCLKPPS
X
X
MSSP
SSPDATPPS
MSSP
SSPSSPPS
X
X
X
X
EUSART
RXPPS
X
X
EUSART
CKPPS
X
X
All CLCs
CLCIN0PPS
X
X
All CLCs
CLCIN1PPS
X
X
All CLCs
CLCIN2PPS
X
X
All CLCs
CLCIN3PPS
X
X
Example: CCP1PPS = 0x0B selects RB3 as the input to CCP1.
Note:
Inputs are not available on all ports. A check in a port column of a peripheral row indicates that the port
selection is valid for that peripheral. Unsupported ports will input a ‘0’.
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REGISTER 12-2:
RxyPPS: PIN Rxy OUTPUT SOURCE SELECTION REGISTER
U-0
U-0
U-0
—
—
—
R/W-0/u
R/W-0/u
R/W-0/u
R/W-0/u
R/W-0/u
RxyPPS<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
RxyPPS<4:0>: Pin Rxy Output Source Selection bits
11xxx = Reserved
10111 = Rxy source is C2OUT
10110 = Rxy source is C1OUT
10101 = Rxy source is DT(1)
10100 = Rxy source is TX/CK(1)
10011 = Reserved
10010 = Reserved
10001 = Rxy source is SDO/SDA(1)
10000 = Rxy source is SCK/SCL(1)
PORTA
PORTB
PORTC
X
X
X
X
X
X
X
X
X
X
01111 = Rxy source is PWM4OUT
01110 = Rxy source is PWM3OUT
01101 = Rxy source is CCP2
01100 = Rxy source is CCP1
01011 = Rxy source is COG1D(1)
01010 = Rxy source is COG1C(1)
01001 = Rxy source is COG1B(1)
01000 = Rxy source is COG1A(1)
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
00111 = Rxy source is LC4_out
00110 = Rxy source is LC3_out
00101 = Rxy source is LC2_out
00100 = Rxy source is LC1_out
00011 = Rxy source is NCO1_out
00010 = Reserved
00001 = Reserved
00000 = Rxy source is LATxy
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Example: RC3PPS = 0x0D outputs CCP2 on RC3
Outputs are available only on those ports indicated with
a check.
Note 1:
TRIS control is overridden by the peripheral as required.
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REGISTER 12-3:
PPSLOCK: PPS LOCK REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0/0
—
—
—
—
—
—
—
PPSLOCKED
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-1
Unimplemented: Read as ‘0’
bit 0
PPSLOCKED: PPS Locked bit
1= PPS is locked. PPS selections can not be changed.
0= PPS is not locked. PPS selections can be changed.
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TABLE 12-2:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH THE PPS MODULE
Bit 2
Bit 1
Bit 0
Register
on page
—
—
PPSLOCKED
138
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
PPSLOCK
—
—
—
—
—
INTPPS
—
—
—
INTPPS<4:0>
137
T0CKIPPS
—
—
—
T0CKIPPS<4:0>
137
T1CKIPPS
—
—
—
T1CKIPPS<4:0>
137
T1GPPS
—
—
—
T1GPPS<4:0>
137
CCP1PPS
—
—
—
CCP1PPS<4:0>
137
CCP2PPS
—
—
—
CCP2PPS<4:0>
137
COGINPPS
—
—
—
COGINPPS<4:0>
137
SSPCLKPPS
—
—
—
SSPCLKPPS<4:0>
137
SSPDATPPS
—
—
—
SSPDATPPS<4:0>
137
SSPSSPPS
—
—
—
SSPSSPPS<4:0>
137
RXPPS
—
—
—
RXPPS<4:0>
137
CKPPS
—
—
—
CKPPS<4:0>
137
CLCIN0PPS
—
—
—
CLCIN0PPS<4:0>
137
CLCIN1PPS
—
—
—
CLCIN1PPS<4:0>
137
CLCIN2PPS
—
—
—
CLCIN2PPS<4:0>
137
CLCIN3PPS
—
—
—
CLCIN3PPS<4:0>
137
RA0PPS
—
—
—
RA0PPS<4:0>
137
RA1PPS
—
—
—
RA1PPS<4:0>
137
RA2PPS
—
—
—
RA2PPS<4:0>
137
RA4PPS
—
—
—
RA4PPS<4:0>
137
RA5PPS
—
—
—
RA5PPS<4:0>
137
RA6PPS
—
—
—
RA6PPS<4:0>
137
RA7PPS
—
—
—
RA7PPS<4:0>
137
RB0PPS
—
—
—
RB0PPS<4:0>
137
RB1PPS
—
—
—
RB1PPS<4:0>
137
RB2PPS
—
—
—
RB2PPS<4:0>
137
RB3PPS
—
—
—
RB3PPS<4:0>
137
RB4PPS
—
—
—
RB4PPS<4:0>
137
RB5PPS
—
—
—
RB5PPS<4:0>
137
RB6PPS
—
—
—
RB6PPS<4:0>
137
RB7PPS
—
—
—
RB7PPS<4:0>
137
RC0PPS
—
—
—
RC0PPS<4:0>
137
RC1PPS
—
—
—
RC1PPS<4:0>
137
RC2PPS
—
—
—
RC2PPS<4:0>
137
RC3PPS
—
—
—
RC3PPS<4:0>
137
RC4PPS
—
—
—
RC4PPS<4:0>
137
RC5PPS
—
—
—
RC5PPS<4:0>
137
RC6PPS
—
—
—
RC6PPS<4:0>
137
RC7PPS
—
—
—
RC7PPS<4:0>
137
Legend:
— = unimplemented, read as ‘0’. Shaded cells are unused by the DAC module.
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13.0
INTERRUPT-ON-CHANGE
All pins on all ports can be configured to operate as
Interrupt-on-Change (IOC) pins. An interrupt can be
generated by detecting a signal that has either a rising
edge or a falling edge. Any individual pin, or combination
of pins, can be configured to generate an interrupt. The
interrupt-on-change module has the following features:
•
•
•
•
Interrupt-on-Change enable (Master Switch)
Individual pin configuration
Rising and falling edge detection
Individual pin interrupt flags
Figure 13-1 is a block diagram of the IOC module.
13.1
Enabling the Module
13.3
Interrupt Flags
The bits located in the IOCxF registers are status flags
that correspond to the interrupt-on-change pins of each
port. If an expected edge is detected on an appropriately
enabled pin, then the status flag for that pin will be set,
and an interrupt will be generated if the IOCIE bit is set.
The IOCIF bit of the INTCON register reflects the status
of all IOCxF bits.
13.4
Clearing Interrupt Flags
The individual status flags, (IOCxF register bits), can be
cleared by resetting them to zero. If another edge is
detected during this clearing operation, the associated
status flag will be set at the end of the sequence,
regardless of the value actually being written.
To allow individual pins to generate an interrupt, the
IOCIE bit of the INTCON register must be set. If the
IOCIE bit is disabled, the edge detection on the pin will
still occur, but an interrupt will not be generated.
In order to ensure that no detected edge is lost while
clearing flags, only AND operations masking out known
changed bits should be performed. The following
sequence is an example of what should be performed.
13.2
Individual Pin Configuration
EXAMPLE 13-1:
For each pin, a rising edge detector and a falling edge
detector are present. To enable a pin to detect a rising
edge, the associated bit of the IOCxP register is set. To
enable a pin to detect a falling edge, the associated bit
of the IOCxN register is set.
MOVLW
XORWF
ANDWF
A pin can be configured to detect rising and falling
edges simultaneously by setting the associated bits in
both of the IOCxP and IOCxN registers.
13.5
CLEARING INTERRUPT
FLAGS
(PORTA EXAMPLE)
0xff
IOCAF, W
IOCAF, F
Operation in Sleep
The interrupt-on-change interrupt sequence will wake
the device from Sleep mode, if the IOCIE bit is set.
If an edge is detected while in Sleep mode, the affected
IOCxF register will be updated prior to the first instruction
executed out of Sleep.
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FIGURE 13-1:
INTERRUPT-ON-CHANGE BLOCK DIAGRAM (PORTA EXAMPLE)
Rev. 10-000 037A
6/2/201 4
IOCANx
D
Q
R
Q4Q1
edge
detect
RAx
IOCAPx
D
data bus =
0 or 1
Q
D
S
to data bus
IOCAFx
Q
write IOCAFx
R
IOCIE
Q2
IOC interrupt
to CPU core
from all other
IOCnFx individual
pin detectors
FOSC
Q1
Q1
Q1
Q3
Q3
Q4
Q4Q1
Q2
Q2
Q2
Q3
Q4
Q4Q1
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Q4Q1
Q4Q1
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13.6
Register Definitions: Interrupt-on-Change Control
REGISTER 13-1:
IOCAP: INTERRUPT-ON-CHANGE PORTA POSITIVE EDGE REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
IOCAP7
IOCAP6
IOCAP5
IOCAP4
IOCAP3
IOCAP2
IOCAP1
IOCAP0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
IOCAP<7:0>: Interrupt-on-Change PORTA Positive Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a positive going edge. IOCAFx bit and IOCIF flag will
be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
REGISTER 13-2:
IOCAN: INTERRUPT-ON-CHANGE PORTA NEGATIVE EDGE REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
IOCAN7
IOCAN6
IOCAN5
IOCAN4
IOCAN3
IOCAN2
IOCAN1
IOCAN0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
IOCAN<7:0>: Interrupt-on-Change PORTA Negative Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a negative going edge. IOCAFx bit and IOCIF flag will
be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
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REGISTER 13-3:
IOCAF: INTERRUPT-ON-CHANGE PORTA FLAG REGISTER
R/W/HS-0/0
R/W/HS-0/0
IOCAF7
IOCAF6
R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0
IOCAF5
IOCAF4
IOCAF3
R/W/HS-0/0
R/W/HS-0/0
R/W/HS-0/0
IOCAF2
IOCAF1
IOCAF0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
HS - Bit is set in hardware
bit 7-0
IOCAF<7:0>: Interrupt-on-Change PORTA Flag bits
1 = An enabled change was detected on the associated pin.
Set when IOCAPx = 1 and a rising edge was detected on RAx, or when IOCANx = 1 and a falling
edge was detected on RAx.
0 = No change was detected, or the user cleared the detected change.
REGISTER 13-4:
IOCBP: INTERRUPT-ON-CHANGE PORTB POSITIVE EDGE REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
IOCBP7
IOCBP6
IOCBP5
IOCBP4
IOCBP3
IOCBP2
IOCBP1
IOCBP0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
IOCBP<7:0>: Interrupt-on-Change PORTB Positive Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a positive going edge. IOCBFx bit and IOCIF flag will
be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
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REGISTER 13-5:
IOCBN: INTERRUPT-ON-CHANGE PORTB NEGATIVE EDGE REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
IOCBN7
IOCBN6
IOCBN5
IOCBN4
IOCBN3
IOCBN2
IOCBN1
IOCBN0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
IOCBN<7:0>: Interrupt-on-Change PORTB Negative Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a negative going edge. IOCBFx bit and IOCIF flag will
be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
REGISTER 13-6:
IOCBF: INTERRUPT-ON-CHANGE PORTB FLAG REGISTER
R/W/HS-0/0
R/W/HS-0/0
IOCBF7
IOCBF6
R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0
IOCBF5
IOCBF4
IOCBF3
R/W/HS-0/0
R/W/HS-0/0
R/W/HS-0/0
IOCBF2
IOCBF1
IOCBF0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
HS - Bit is set in hardware
bit 7-0
U = Unimplemented bit, read as ‘0’
IOCBF<7:0>: Interrupt-on-Change PORTB Flag bits
1 = An enabled change was detected on the associated pin.
Set when IOCBPx = 1 and a rising edge was detected on RBx, or when IOCBNx = 1 and a falling
edge was detected on RBx.
0 = No change was detected, or the user cleared the detected change.
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REGISTER 13-7:
IOCCP: INTERRUPT-ON-CHANGE PORTC POSITIVE EDGE REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
IOCCP7
IOCCP6
IOCCP5
IOCCP4
IOCCP3
IOCCP2
IOCCP1
IOCCP0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
IOCCP<7:0>: Interrupt-on-Change PORTC Positive Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a positive going edge. IOCCFx bit and IOCIF flag will
be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
REGISTER 13-8:
IOCCN: INTERRUPT-ON-CHANGE PORTC NEGATIVE EDGE REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
IOCCN7
IOCCN6
IOCCN5
IOCCN4
IOCCN3
IOCCN2
IOCCN1
IOCCN0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
IOCCN<7:0>: Interrupt-on-Change PORTC Negative Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a negative going edge. IOCCFx bit and IOCIF flag will
be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
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REGISTER 13-9:
IOCCF: INTERRUPT-ON-CHANGE PORTC FLAG REGISTER
R/W/HS-0/0
R/W/HS-0/0
IOCCF7
IOCCF6
R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0
IOCCF5
IOCCF4
IOCCF3
R/W/HS-0/0
R/W/HS-0/0
R/W/HS-0/0
IOCCF2
IOCCF1
IOCCF0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
HS - Bit is set in hardware
bit 7-0
IOCCF<7:0>: Interrupt-on-Change PORTC Flag bits
1 = An enabled change was detected on the associated pin.
Set when IOCCPx = 1 and a rising edge was detected on RCx, or when IOCCNx = 1 and a falling
edge was detected on RCx.
0 = No change was detected, or the user cleared the detected change.
REGISTER 13-10: IOCEP: INTERRUPT-ON-CHANGE PORTE POSITIVE EDGE REGISTER
U-0
U-0
U-0
U-0
R/W-0/0
U-0
U-0
U-0
—
—
—
—
IOCEP3
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3
IOCEP: Interrupt-on-Change PORTE Positive Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a positive going edge. IOCEFx bit and IOCIF flag will
be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
bit 2-0
Unimplemented: Read as ‘0’
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PIC16(L)F1713/6
REGISTER 13-11: IOCEN: INTERRUPT-ON-CHANGE PORTE NEGATIVE EDGE REGISTER
U-0
U-0
U-0
U-0
R/W-0/0
U-0
U-0
U-0
—
—
—
—
IOCEN3
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3
IOCEN: Interrupt-on-Change PORTE Negative Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a negative going edge. IOCEFx bit and IOCIF flag will
be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
bit 2-0
Unimplemented: Read as ‘0’
REGISTER 13-12: IOCEF: INTERRUPT-ON-CHANGE PORTE FLAG REGISTER
U-0
U-0
U-0
U-0
R/W/HS-0/0
U-0
U-0
U-0
—
—
—
—
IOCEF3
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
HS - Bit is set in hardware
bit 7-4
Unimplemented: Read as ‘0’
bit 3
IOCEF: Interrupt-on-Change PORTE Flag bits
1 = An enabled change was detected on the associated pin.
Set when IOCEPx = 1 and a rising edge was detected on REx, or when IOCENx = 1 and a falling edge
was detected on REx.
0 = No change was detected, or the user cleared the detected change.
bit 2-0
Unimplemented: Read as ‘0’
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PIC16(L)F1713/6
TABLE 13-1:
SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
ANSELA
—
—
ANSA5
ANSA4
ANSA3
ANSA2
ANSA1
ANSA0
120
ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
Name
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
IOCAF
INTCON
IOCAF7
IOCAF6
IOCAF5
IOCAF4
IOCAF3
IOCAF2
IOCAF1
IOCAF0
143
IOCAN
IOCAN7
IOCAN6
IOCAN5
IOCAN4
IOCAN3
IOCAN2
IOCAN1
IOCAN0
142
IOCAP
IOCAP7
IOCAP6
IOCAP5
IOCAP4
IOCAP3
IOCAP2
IOCAP1
IOCAP0
142
IOCBF
IOCBF7
IOCBF6
IOCBF5
IOCBF4
IOCBF3
IOCBF2
IOCBF1
IOCBF0
144
IOCBN
IOCBN7
IOCBN6
IOCBN5
IOCBN4
IOCBN3
IOCBN2
IOCBN1
IOCBN0
144
IOCBP
IOCBP7
IOCBP6
IOCBP5
IOCBP4
IOCBP3
IOCBP2
IOCBP1
IOCBP0
143
IOCCF
IOCCF7
IOCCF6
IOCCF5
IOCCF4
IOCCF3
IOCCF2
IOCCF1
IOCCF0
146
IOCCN
IOCCN7
IOCCN6
IOCCN5
IOCCN4
IOCCN3
IOCCN2
IOCCN1
IOCCN0
145
IOCCP
IOCCP7
IOCCP6
IOCCP5
IOCCP4
IOCCP3
IOCCP2
IOCCP1
IOCCP0
145
IOCEF
—
—
—
—
IOCEF3
—
—
—
147
IOCEN
—
—
—
—
IOCEN3
—
—
—
147
146
IOCEP
—
—
—
—
IOCEP3
—
—
—
TRISA
TRISA7
TRISA6
TRISA5
TRISA4
TRASA3
TRISA2
TRISA1
TRISA0
119
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupt-on-change.
DS40001726C-page 148
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PIC16(L)F1713/6
14.0
FIXED VOLTAGE REFERENCE
(FVR)
The Fixed Voltage Reference, or FVR, is a stable
voltage reference, independent of VDD, with 1.024V,
2.048V or 4.096V selectable output levels. The output
of the FVR can be configured to supply a reference
voltage to the following:
•
•
•
•
ADC input channel
ADC positive reference
Comparator positive input
Digital-to-Analog Converter (DAC)
The FVR can be enabled by setting the FVREN bit of
the FVRCON register.
14.1
Independent Gain Amplifiers
The output of the FVR supplied to the ADC,
Comparators, and DAC is routed through two
independent programmable gain amplifiers. Each
amplifier can be programmed for a gain of 1x, 2x or 4x,
to produce the three possible voltage levels.
The ADFVR<1:0> bits of the FVRCON register are
used to enable and configure the gain amplifier settings
for the reference supplied to the ADC module.
Reference Section 21.0 “Analog-to-Digital Converter (ADC) Module” for additional information.
The CDAFVR<1:0> bits of the FVRCON register are
used to enable and configure the gain amplifier settings
for the reference supplied to the DAC and comparator
module. Reference Section 23.0 “8-Bit Digital-to-Analog Converter (DAC1) Module” and
Section 16.0 “Comparator Module” for additional
information.
14.2
FVR Stabilization Period
When the Fixed Voltage Reference module is enabled, it
requires time for the reference and amplifier circuits to
stabilize. Once the circuits stabilize and are ready for use,
the FVRRDY bit of the FVRCON register will be set. See
Figure 35-76: FVR Stabilization Period, PIC16LF1713/6
Only..
FIGURE 14-1:
VOLTAGE REFERENCE BLOCK DIAGRAM
ADFVR<1:0>
CDAFVR<1:0>
2
X1
X2
X4
FVR BUFFER1
(To ADC Module)
X1
X2
X4
FVR BUFFER2
(To Comparators, DAC)
2
HFINTOSC Enable
HFINTOSC
To BOR, LDO
FVREN
+
_
FVRRDY
Any peripheral requiring the
Fixed Reference
(See Table 14-1)
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PIC16(L)F1713/6
TABLE 14-1:
PERIPHERALS REQUIRING THE FIXED VOLTAGE REFERENCE (FVR)
Peripheral
HFINTOSC
BOR
LDO
Conditions
Description
FOSC<2:0> = 100 and
IRCF<3:0>  000x
INTOSC is active and device is not in Sleep
BOREN<1:0> = 11
BOR always enabled
BOREN<1:0> = 10 and BORFS = 1
BOR disabled in Sleep mode, BOR Fast Start enabled
BOREN<1:0> = 01 and BORFS = 1
BOR under software control, BOR Fast Start enabled
All PIC16F1713/6 devices, when
VREGPM = 1 and not in Sleep
The device runs off of the ULP regulator when in Sleep mode
DS40001726C-page 150
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PIC16(L)F1713/6
14.3
Register Definitions: FVR Control
REGISTER 14-1:
FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER
R/W-0/0
R-q/q
FVREN
FVRRDY(1)
R/W-0/0
TSEN
(3)
R/W-0/0
TSRNG
R/W-0/0
(3)
R/W-0/0
R/W-0/0
CDAFVR<1:0>
R/W-0/0
ADFVR<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
FVREN: Fixed Voltage Reference Enable bit
1 = Fixed Voltage Reference is enabled
0 = Fixed Voltage Reference is disabled
bit 6
FVRRDY: Fixed Voltage Reference Ready Flag bit(1)
1 = Fixed Voltage Reference output is ready for use
0 = Fixed Voltage Reference output is not ready or not enabled
bit 5
TSEN: Temperature Indicator Enable bit(3)
1 = Temperature Indicator is enabled
0 = Temperature Indicator is disabled
bit 4
TSRNG: Temperature Indicator Range Selection bit(3)
1 = VOUT = VDD - 4VT (High Range)
0 = VOUT = VDD - 2VT (Low Range)
bit 3-2
CDAFVR<1:0>: Comparator FVR Buffer Gain Selection bits
11 = Comparator FVR Buffer Gain is 4x, with output VCDAFVR = 4x VFVR(2)
10 = Comparator FVR Buffer Gain is 2x, with output VCDAFVR = 2x VFVR(2)
01 = Comparator FVR Buffer Gain is 1x, with output VCDAFVR = 1x VFVR
00 = Comparator FVR Buffer is off
bit 1-0
ADFVR<1:0>: ADC FVR Buffer Gain Selection bit
11 = ADC FVR Buffer Gain is 4x, with output VADFVR = 4x VFVR(2)
10 = ADC FVR Buffer Gain is 2x, with output VADFVR = 2x VFVR(2)
01 = ADC FVR Buffer Gain is 1x, with output VADFVR = 1x VFVR
00 = ADC FVR Buffer is off
Note 1:
2:
3:
FVRRDY is always ‘1’ on PIC16(L)F1713/6 only.
Fixed Voltage Reference output cannot exceed VDD.
See Section 15.0 “Temperature Indicator Module” for additional information.
TABLE 14-2:
Name
FVRCON
Legend:
SUMMARY OF REGISTERS ASSOCIATED WITH FIXED VOLTAGE REFERENCE
Bit 7
Bit 6
Bit 5
Bit 4
FVREN
FVRRDY
TSEN
TSRNG
Bit 3
Bit 2
CDAFVR<1:0>
Bit 1
Bit 0
ADFVR<1:0>
Register
on page
151
Shaded cells are not used with the Fixed Voltage Reference.
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DS40001726C-page 151
PIC16(L)F1713/6
15.0
TEMPERATURE INDICATOR
MODULE
FIGURE 15-1:
This family of devices is equipped with a temperature
circuit designed to measure the operating temperature
of the silicon die. The circuit’s range of operating
temperature falls between -40°C and +85°C. The
output is a voltage that is proportional to the device
temperature. The output of the temperature indicator is
internally connected to the device ADC.
VDD
TSEN
TSRNG
The circuit may be used as a temperature threshold
detector or a more accurate temperature indicator,
depending on the level of calibration performed. A onepoint calibration allows the circuit to indicate a
temperature closely surrounding that point. A two-point
calibration allows the circuit to sense the entire range
of temperature more accurately. Reference Application
Note AN1333, “Use and Calibration of the Internal
Temperature Indicator” (DS01333) for more details
regarding the calibration process.
15.1
Circuit Operation
Figure 15-1 shows a simplified block diagram of the
temperature circuit. The proportional voltage output is
achieved by measuring the forward voltage drop across
multiple silicon junctions.
Equation 15-1 describes the output characteristics of
the temperature indicator.
EQUATION 15-1:
VOUT RANGES
TEMPERATURE CIRCUIT
DIAGRAM
VOUT
Temp. Indicator
15.2
To ADC
Minimum Operating VDD
When the temperature circuit is operated in low range,
the device may be operated at any operating voltage
that is within specifications.
When the temperature circuit is operated in high range,
the device operating voltage, VDD, must be high
enough to ensure that the temperature circuit is
correctly biased.
Table 15-1 shows the recommended minimum VDD vs.
range setting.
High Range: VOUT = VDD - 4VT
TABLE 15-1:
Low Range: VOUT = VDD - 2VT
The temperature sense circuit is integrated with the
Fixed Voltage Reference (FVR) module. See
Section 14.0 “Fixed Voltage Reference (FVR)” for
more information.
The circuit is enabled by setting the TSEN bit of the
FVRCON register. When disabled, the circuit draws no
current.
The circuit operates in either high or low range. The high
range, selected by setting the TSRNG bit of the
FVRCON register, provides a wider output voltage. This
provides more resolution over the temperature range,
but may be less consistent from part to part. This range
requires a higher bias voltage to operate and thus, a
higher VDD is needed.
RECOMMENDED VDD VS.
RANGE
Min. VDD, TSRNG = 1
Min. VDD, TSRNG = 0
3.6V
1.8V
15.3
Temperature Output
The output of the circuit is measured using the internal
Analog-to-Digital Converter. A channel is reserved for
the temperature circuit output. Refer to Section 21.0
“Analog-to-Digital Converter (ADC) Module” for
detailed information.
The low range is selected by clearing the TSRNG bit of
the FVRCON register. The low range generates a lower
voltage drop and thus, a lower bias voltage is needed to
operate the circuit. The low range is provided for low
voltage operation.
DS40001726C-page 152
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PIC16(L)F1713/6
15.4
ADC Acquisition Time
To ensure accurate temperature measurements, the
user must wait at least 200 s after the ADC input
multiplexer is connected to the temperature indicator
output before the conversion is performed. In addition,
the user must wait 200 s between sequential
conversions of the temperature indicator output.
TABLE 15-2:
Name
FVRCON
Legend:
SUMMARY OF REGISTERS ASSOCIATED WITH THE TEMPERATURE INDICATOR
Bit 7
Bit 6
Bit 5
Bit 4
FVREN
FVRRDY
TSEN
TSRNG
Bit 3
Bit 2
CDFVR<1:0>
Bit 1
Bit 0
ADFVR<1:0>
Register
on page
151
Shaded cells are unused by the temperature indicator module.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
16.0
COMPARATOR MODULE
FIGURE 16-1:
Comparators are used to interface analog circuits to a
digital circuit by comparing two analog voltages and
providing a digital indication of their relative magnitudes.
Comparators are very useful mixed signal building
blocks because they provide analog functionality
independent of program execution. The analog
comparator module includes the following features:
•
•
•
•
•
•
•
•
•
Independent comparator control
Programmable input selection
Comparator output is available internally/externally
Programmable output polarity
Interrupt-on-change
Wake-up from Sleep
Programmable Speed/Power optimization
PWM shutdown
Programmable and fixed voltage reference
16.1
Comparator Overview
SINGLE COMPARATOR
VIN+
+
VIN-
–
Output
VINVIN+
Output
Note:
The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
A single comparator is shown in Figure 16-1 along with
the relationship between the analog input levels and
the digital output. When the analog voltage at VIN+ is
less than the analog voltage at VIN-, the output of the
comparator is a digital low level. When the analog
voltage at VIN+ is greater than the analog voltage at
VIN-, the output of the comparator is a digital high level.
The comparators available for this device are located in
Table 16-1.
TABLE 16-1:
AVAILABLE COMPARATORS
Device
PIC16(L)F1713/6
DS40001726C-page 154
C1
C2
●
●
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 16-2:
COMPARATOR MODULE SIMPLIFIED BLOCK DIAGRAM
CxNCH<2:0>
CxON(1)
3
CxINTP
Interrupt
det
CXIN0-
0
CXIN1-
1
CXIN2-
2 MUX
Set CxIF
CXIN3-
det
3
Reserved
4
Reserved
5
FVR Buffer2
6
CxINTN
Interrupt
(2)
CXPOL
CxVN
-
0
D
Cx
CxVP
ZLF
+
1
EN
Q1
7
CxHYS
AGND
CxSP
to CMXCON0 (CXOUT)
and CM2CON1 (MCXOUT)
Q
CxZLF
async_CxOUT
CXSYNC
TRIS bit
CXOUT
0
CXIN0+
0
CxIN1+
1
Reserved
2
Reserved
3
DAC2_output
4
DAC1_Output
5
FVR Buffer2
6
D
From Timer1
tmr1_clk
MUX
Q
1
sync_CxOUT
To Timer1
(2)
7
AGND
CxON
CXPCH<2:0>
3
Note 1:
2:
When CxON = 0, the comparator will produce a ‘0’ at the output.
When CxON = 0, all multiplexer inputs are disconnected.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 155
PIC16(L)F1713/6
16.2
Comparator Control
Each comparator has two control registers: CMxCON0
and CMxCON1.
The CMxCON0 register (see Register 16-1) contains
Control and Status bits for the following:
•
•
•
•
•
•
•
Enable
Output
Output polarity
Zero latency filter
Speed/Power selection
Hysteresis enable
Output synchronization
The CMxCON1 register (see Register 16-2) contains
Control bits for the following:
•
•
•
•
Interrupt enable
Interrupt edge polarity
Positive input channel selection
Negative input channel selection
16.2.1
COMPARATOR ENABLE
Setting the CxON bit of the CMxCON0 register enables
the comparator for operation. Clearing the CxON bit
disables the comparator resulting in minimum current
consumption.
16.2.2
COMPARATOR OUTPUT
SELECTION
16.2.3
COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the CxPOL bit of the CMxCON0 register.
Clearing the CxPOL bit results in a non-inverted output.
Table 16-2 shows the output state versus input
conditions, including polarity control.
TABLE 16-2:
COMPARATOR OUTPUT
STATE VS. INPUT
CONDITIONS
Input Condition
CxPOL
CxOUT
CxVN > CxVP
0
0
CxVN < CxVP
0
1
CxVN > CxVP
1
1
CxVN < CxVP
1
0
16.2.4
COMPARATOR SPEED/POWER
SELECTION
The trade-off between speed or power can be
optimized during program execution with the CxSP
control bit. The default state for this bit is ‘1’, which
selects the Normal-Speed mode. Device power
consumption can be optimized at the cost of slower
comparator propagation delay by clearing the CxSP bit
to ‘0’.
The output of the comparator can be monitored by
reading either the CxOUT bit of the CMxCON0 register
or the MCxOUT bit of the CMOUT register. In order to
make the output available for an external connection,
the following conditions must be true:
• Desired pin PPS control
• Corresponding TRIS bit must be cleared
• CxON bit of the CMxCON0 register must be set
Note 1: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external outputs are not latched.
DS40001726C-page 156
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PIC16(L)F1713/6
16.3
Comparator Hysteresis
A selectable amount of separation voltage can be
added to the input pins of each comparator to provide a
hysteresis function to the overall operation. Hysteresis
is enabled by setting the CxHYS bit of the CMxCON0
register.
The associated interrupt flag bit, CxIF bit of the PIR2
register, must be cleared in software. If another edge is
detected while this flag is being cleared, the flag will still
be set at the end of the sequence.
Note:
See Comparator Specifications in Table 34-18:
Comparator Specifications for more information.
16.4
Timer1 Gate Operation
The output resulting from a comparator operation can
be used as a source for gate control of Timer1. See
Section 26.6 “Timer1 Gate” for more information.
This feature is useful for timing the duration or interval
of an analog event.
It is recommended that the comparator output be
synchronized to Timer1. This ensures that Timer1 does
not increment while a change in the comparator is
occurring.
16.4.1
COMPARATOR OUTPUT
SYNCHRONIZATION
The output from a comparator can be synchronized
with Timer1 by setting the CxSYNC bit of the
CMxCON0 register.
Once enabled, the comparator output is latched on the
falling edge of the Timer1 source clock. If a prescaler is
used with Timer1, the comparator output is latched after
the prescaling function. To prevent a race condition, the
comparator output is latched on the falling edge of the
Timer1 clock source and Timer1 increments on the
rising edge of its clock source. See the Comparator
Block Diagram (Figure 16-2) and the Timer1 Block
Diagram (Figure 26-1) for more information.
16.5
Comparator Interrupt
An interrupt can be generated upon a change in the
output value of the comparator for each comparator, a
rising edge detector and a falling edge detector are
present.
When either edge detector is triggered and its associated enable bit is set (CxINTP and/or CxINTN bits of
the CMxCON1 register), the Corresponding Interrupt
Flag bit (CxIF bit of the PIR2 register) will be set.
To enable the interrupt, you must set the following bits:
• CxON, CxPOL and CxSP bits of the CMxCON0
register
• CxIE bit of the PIE2 register
• CxINTP bit of the CMxCON1 register (for a rising
edge detection)
• CxINTN bit of the CMxCON1 register (for a falling
edge detection)
• PEIE and GIE bits of the INTCON register
 2013-2016 Microchip Technology Inc.
16.6
Although a comparator is disabled, an
interrupt can be generated by changing
the output polarity with the CxPOL bit of
the CMxCON0 register, or by switching
the comparator on or off with the CxON bit
of the CMxCON0 register.
Comparator Positive Input
Selection
Configuring the CxPCH<2:0> bits of the CMxCON1
register directs an internal voltage reference or an
analog pin to the non-inverting input of the comparator:
•
•
•
•
CxIN+ analog pin
DAC output
FVR (Fixed Voltage Reference)
VSS (Ground)
See Section 14.0 “Fixed Voltage Reference (FVR)”
for more information on the Fixed Voltage Reference
module.
See Section 23.0 “8-Bit Digital-to-Analog Converter
(DAC1) Module” for more information on the DAC
input signal.
Any time the comparator is disabled (CxON = 0), all
comparator inputs are disabled.
16.7
Comparator Negative Input
Selection
The CxNCH<2:0> bits of the CMxCON0 register direct
an analog input pin and internal reference voltage or
analog ground to the inverting input of the comparator:
• CxIN- pin
• FVR (Fixed Voltage Reference)
• Analog Ground
Some inverting input selections share a pin with the
operational amplifier output function. Enabling both
functions at the same time will direct the operational
amplifier output to the comparator inverting input.
Note:
To use CxINy+ and CxINy- pins as analog
input, the appropriate bits must be set in
the ANSEL register and the corresponding TRIS bits must also be set to disable
the output drivers.
DS40001726C-page 157
PIC16(L)F1713/6
16.8
the hardware and software relying on this signal.
Therefore, a digital filter has been added to the
comparator output to suppress the comparator output
oscillation. Once the comparator output changes, the
output is prevented from reversing the change for a
nominal time of 20 ns. This allows the comparator
output to stabilize without affecting other dependent
devices. Refer to Figure 16-3.
Comparator Response Time
The comparator output is indeterminate for a period of
time after the change of an input source or the selection
of a new reference voltage. This period is referred to as
the response time. The response time of the comparator
differs from the settling time of the voltage reference.
Therefore, both of these times must be considered when
determining the total response time to a comparator
input change. See the Comparator and Voltage
Reference Specifications in Table 34-18: Comparator
Specifications for more details.
16.9
Zero Latency Filter
In high-speed operation, and under proper circuit
conditions, it is possible for the comparator output to
oscillate. This oscillation can have adverse effects on
FIGURE 16-3:
COMPARATOR ZERO LATENCY FILTER OPERATION
CxOUT From Comparator
CxOUT From ZLF
TZLF
Output waiting for TZLF to expire before an output change is allowed.
TZLF has expired so output change of ZLF is immediate based on
comparator output change.
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PIC16(L)F1713/6
16.10 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 16-4. Since the analog input pins share their
connection with a digital input, they have reverse
biased ESD protection diodes to VDD and VSS. The
analog input, therefore, must be between VSS and VDD.
If the input voltage deviates from this range by more
than 0.6V in either direction, one of the diodes is
forward biased and a latch-up may occur.
A maximum source impedance of 10 k is recommended
for the analog sources. Also, any external component
connected to an analog input pin, such as a capacitor or
a Zener diode, should have very little leakage current to
minimize inaccuracies introduced.
Note 1: When reading a PORT register, all pins
configured as analog inputs will read as a
‘0’. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
2: Analog levels on any pin defined as a
digital input, may cause the input buffer to
consume more current than is specified.
FIGURE 16-4:
ANALOG INPUT MODEL
VDD
Rs < 10K
Analog
Input
pin
VT  0.6V
RIC
To Comparator
VA
CPIN
5 pF
VT  0.6V
ILEAKAGE(1)
Vss
Legend: CPIN
= Input Capacitance
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC
= Interconnect Resistance
= Source Impedance
RS
= Analog Voltage
VA
VT
= Threshold Voltage
Note 1: See I/O Ports in Table 34-4: I/O Ports.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
16.11 Register Definitions: Comparator Control
REGISTER 16-1:
CMxCON0: COMPARATOR Cx CONTROL REGISTER 0
R/W-0/0
R-0/0
U-0
R/W-0/0
R/W-0/0
R/W-1/1
R/W-0/0
R/W-0/0
CxON
CxOUT
—
CxPOL
CxZLF
CxSP
CxHYS
CxSYNC
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
CxON: Comparator Enable bit
1 = Comparator is enabled
0 = Comparator is disabled and consumes no active power
bit 6
CxOUT: Comparator Output bit
If CxPOL = 1 (inverted polarity):
1 = CxVP < CxVN
0 = CxVP > CxVN
If CxPOL = 0 (non-inverted polarity):
1 = CxVP > CxVN
0 = CxVP < CxVN
bit 5
Unimplemented: Read as ‘0’
bit 4
CxPOL: Comparator Output Polarity Select bit
1 = Comparator output is inverted
0 = Comparator output is not inverted
bit 3
CxZLF: Comparator Zero Latency Filter Enable bit
1 = Comparator output is filtered
0 = Comparator output is unfiltered
bit 2
CxSP: Comparator Speed/Power Select bit
1 = Comparator operates in normal power, higher speed mode
0 = Comparator operates in low-power, low-speed mode
bit 1
CxHYS: Comparator Hysteresis Enable bit
1 = Comparator hysteresis enabled
0 = Comparator hysteresis disabled
bit 0
CxSYNC: Comparator Output Synchronous Mode bit
1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source.
Output updated on the falling edge of Timer1 clock source.
0 = Comparator output to Timer1 and I/O pin is asynchronous.
DS40001726C-page 160
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
REGISTER 16-2:
CMxCON1: COMPARATOR Cx CONTROL REGISTER 1
R/W-0/0
R/W-0/0
CxINTP
CxINTN
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
CxPCH<2:0>
R/W-0/0
R/W-0/0
CxNCH<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
CxINTP: Comparator Interrupt on Positive Going Edge Enable bits
1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit
0 = No interrupt flag will be set on a positive going edge of the CxOUT bit
bit 6
CxINTN: Comparator Interrupt on Negative Going Edge Enable bits
1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit
0 = No interrupt flag will be set on a negative going edge of the CxOUT bit
bit 5-3
CxPCH<2:0>: Comparator Positive Input Channel Select bits
111 = CxVP connects to AGND
110 = CxVP connects to FVR Buffer 2
101 = CxVP connects to DAC1_output
100 = CxVP connects to DAC2_output
011 = CxVP unconnected, input floating
010 = CxVP unconnected, input floating
001 = CxVN connects to CxIN1+ pin
000 = CxVP connects to CxIN0+ pin
bit 2-0
CxNCH<2:0>: Comparator Negative Input Channel Select bits
111 = CxVN connects to AGND
110 = CxVN connects to FVR Buffer 2
101 = CxVN unconnected, input floating
100 = CxVN unconnected, input floating
011 = CxVN connects to CxIN3- pin
010 = CxVN connects to CxIN2- pin
001 = CxVN connects to CxIN1- pin
000 = CxVN connects to CxIN0- pin
 2013-2016 Microchip Technology Inc.
DS40001726C-page 161
PIC16(L)F1713/6
REGISTER 16-3:
CMOUT: COMPARATOR OUTPUT REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
R-0/0
R-0/0
—
—
—
—
—
—
MC2OUT
MC1OUT
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-2
Unimplemented: Read as ‘0’
bit 1
MC2OUT: Mirror Copy of C2OUT bit
bit 0
MC1OUT: Mirror Copy of C1OUT bit
TABLE 16-3:
Name
ANSELA
SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
ANSA5
ANSA4
ANSA3
ANSA2
ANSA1
ANSA0
120
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
CM1CON0
C1ON
C1OUT
—
C1POL
C1ZLF
C1SP
C1HYS
C1SYNC
160
CM2CON0
C2ON
C2OUT
—
C2POL
C2ZLF
C2SP
C2HYS
C2SYNC
160
CM1CON1
C1NTP
C1INTN
CM2CON1
C2NTP
C2INTN
—
—
ANSELB
CMOUT
FVRCON
C1PCH<2:0>
C1NCH<2:0>
C2PCH<2:0>
—
—
C2NCH<2:0>
—
—
FVREN
FVRRDY
TSEN
TSRNG
CDAFVR<1:0>
DAC1EN
—
DAC1OE1
DAC1OE2
DAC1PSS<1:0>
GIE
PEIE
TMR0IE
INTE
IOCIE
PIE2
OSFIE
C2IE
C1IE
—
PIR2
OSFIF
C2IF
C1IF
TRISA
TRISA7
TRISA6
TRISB
TRISB7
TRISB6
TRISC
TRISC7
—
DAC1CON0
RxyPPS
Legend:
MC2OUT
161
MC1OUT
ADFVR<1:0>
162
151
—
DAC1NSS
TMR0IF
INTF
IOCIF
83
BCL1IE
TMR6IE
TMR4IE
CCP2IE
85
—
BCL1IF
TMR6IF
TMR4IF
CCP2IF
88
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
—
—
DAC1CON1
INTCON
161
DAC1R<7:0>
249
249
RxyPPS<4:0>
137
— = unimplemented location, read as ‘0’. Shaded cells are unused by the comparator module.
DS40001726C-page 162
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PIC16(L)F1713/6
17.0
Figure 17-1 shows a simplified block diagram of PWM
operation.
PULSE WIDTH MODULATION
(PWM)
Figure 17-2 shows a typical waveform of the PWM
signal.
The PWM module generates a Pulse-Width Modulated
signal determined by the duty cycle, period, and
resolution that are configured by the following registers:
•
•
•
•
•
PR2
T2CON
PWMxDCH
PWMxDCL
PWMxCON
FIGURE 17-1:
SIMPLIFIED PWM BLOCK DIAGRAM
Duty Cycle registers
PWMxDCL<7:6>
PWMxDCH
Latched
(Not visible to user)
Comparator
PWMxOUT
to other peripherals: CLC and CWG
R
Q
0
S
Q
1
PWMx
TMR2 Module
TMR2
(1)
Output Polarity (PWMxPOL)
Comparator
PR2
Note
1:
Clear Timer,
PWMx pin and
latch Duty Cycle
8-bit timer is concatenated with the two Least Significant bits of 1/FOSC adjusted by the Timer2 prescaler to
create a 10-bit time base.
For a step-by-step procedure on how to set up this
module for PWM operation, refer to Section 17.1.9
“Setup for PWM Operation using PWMx Pins”.
FIGURE 17-2:
PWM OUTPUT
Period
Pulse Width
TMR2 = 0
TMR2 = PR2
TMR2 =
PWMxDCH<7:0>:PWMxDCL<7:6>
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PIC16(L)F1713/6
17.1
PWMx Pin Configuration
All PWM outputs are multiplexed with the PORT data
latch. The user must configure the pins as outputs by
clearing the associated TRIS bits.
17.1.1
FUNDAMENTAL OPERATION
The PWM module produces a 10-bit resolution output.
Timer2 and PR2 set the period of the PWM. The
PWMxDCL and PWMxDCH registers configure the
duty cycle. The period is common to all PWM modules,
whereas the duty cycle is independently controlled.
Note: The Timer2 postscaler is not used in the
determination of the PWM frequency. The
postscaler could be used to have a servo
update rate at a different frequency than the
PWM output.
All PWM outputs associated with Timer2 are set when
TMR2 is cleared. Each PWMx is cleared when TMR2
is equal to the value specified in the corresponding
PWMxDCH (8 MSb) and PWMxDCL<7:6> (2 LSb)
registers. When the value is greater than or equal to
PR2, the PWM output is never cleared (100% duty
cycle).
Note: The PWMxDCH and PWMxDCL registers
are double buffered. The buffers are updated
when Timer2 matches PR2. Care should be
taken to update both registers before the
timer match occurs.
17.1.2
PWM OUTPUT POLARITY
The output polarity is inverted by setting the PWMxPOL
bit of the PWMxCON register.
17.1.3
PWM PERIOD
The PWM period is specified by the PR2 register of
Timer2. The PWM period can be calculated using the
formula of Equation 17-1.
EQUATION 17-1:
PWM PERIOD
PWM Period =   PR2  + 1   4  T OSC 
When TMR2 is equal to PR2, the following three events
occur on the next increment cycle:
• TMR2 is cleared
• The PWM output is active. (Exception: When the
PWM duty cycle = 0%, the PWM output will
remain inactive.)
• The PWMxDCH and PWMxDCL register values
are latched into the buffers.
Note:
17.1.4
The Timer2 postscaler has no effect on the
PWM operation.
PWM DUTY CYCLE
The PWM duty cycle is specified by writing a 10-bit value
to the PWMxDCH and PWMxDCL register pair. The
PWMxDCH register contains the eight MSbs and the
PWMxDCL<7:6>, the two LSbs. The PWMxDCH and
PWMxDCL registers can be written to at any time.
Equation 17-2 is used to calculate the PWM pulse
width.
Equation 17-3 is used to calculate the PWM duty cycle
ratio.
EQUATION 17-2:
PULSE WIDTH
Pulse Width =  PWMxDCH:PWMxDCL<7:6>  
T OS C  (TMR2 Prescale Value)
Note: TOSC = 1/FOSC
EQUATION 17-3:
DUTY CYCLE RATIO
 PWMxDCH:PWMxDCL<7:6> 
Duty Cycle Ratio = ----------------------------------------------------------------------------------4  PR2 + 1 
The 8-bit timer TMR2 register is concatenated with the
two Least Significant bits of 1/FOSC, adjusted by the
Timer2 prescaler to create the 10-bit time base. The
system clock is used if the Timer2 prescaler is set to 1:1.
(TMR2 Prescale Value)
Note:
TOSC = 1/FOSC
DS40001726C-page 164
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
17.1.5
PWM RESOLUTION
The resolution determines the number of available duty
cycles for a given period. For example, a 10-bit resolution
will result in 1024 discrete duty cycles, whereas an 8-bit
resolution will result in 256 discrete duty cycles.
The maximum PWM resolution is 10 bits when PR2 is
255. The resolution is a function of the PR2 register
value as shown by Equation 17-4.
EQUATION 17-4:
PWM RESOLUTION
log  4  PR2 + 1  
Resolution = ------------------------------------------ bits
log  2 
Note:
If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
TABLE 17-1:
EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
PWM Frequency
0.31 kHz
Timer Prescale
PR2 Value
78.12 kHz
156.3 kHz
208.3 kHz
64
4
1
1
1
1
0xFF
0xFF
0x3F
0x1F
0x17
10
10
10
8
7
6.6
EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
PWM Frequency
0.31 kHz
Timer Prescale
PR2 Value
4.90 kHz
19.61 kHz
76.92 kHz
153.85 kHz
200.0 kHz
64
4
1
1
1
1
0x65
0x65
0x65
0x19
0x0C
0x09
8
8
8
6
5
5
Maximum Resolution (bits)
17.1.6
19.53 kHz
0xFF
Maximum Resolution (bits)
TABLE 17-2:
4.88 kHz
OPERATION IN SLEEP MODE
In Sleep mode, the TMR2 register will not increment
and the state of the module will not change. If the
PWMx pin is driving a value, it will continue to drive that
value. When the device wakes up, TMR2 will continue
from its previous state.
17.1.7
CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency (FOSC). Any changes in the system clock
frequency will result in changes to the PWM frequency.
Refer to Section 6.0 “Oscillator Module (with
Fail-Safe Clock Monitor)” for additional details.
17.1.8
EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
PWM registers to their Reset states.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
17.1.9
SETUP FOR PWM OPERATION
USING PWMx PINS
The following steps should be taken when configuring
the module for PWM operation using the PWMx pins:
1.
Disable the PWMx pin output driver(s) by setting
the associated TRIS bit(s).
2. Clear the PWMxCON register.
3. Load the PR2 register with the PWM period value.
4. Load the PWMxDCH register and bits <7:6> of
the PWMxDCL register with the PWM duty cycle
value.
5. Configure and start Timer2:
• Clear the TMR2IF interrupt flag bit of the PIR1
register. See Note below.
• Configure the T2CKPS bits of the T2CON
register with the Timer2 prescale value.
• Enable Timer2 by setting the TMR2ON bit of
the T2CON register.
6. Enable PWM output pin and wait until Timer2
overflows, TMR2IF bit of the PIR1 register is set.
See Note below.
7. Enable the PWMx pin output driver(s) by clearing the associated TRIS bit(s) and setting the
desired pin PPS control bits.
8. Configure the PWM module by loading the
PWMxCON register with the appropriate values.
Note 1: In order to send a complete duty cycle
and period on the first PWM output, the
above steps must be followed in the order
given. If it is not critical to start with a
complete PWM signal, then move Step 8
to replace Step 4.
17.1.10
SETUP FOR PWM OPERATION TO
OTHER DEVICE PERIPHERALS
The following steps should be taken when configuring
the module for PWM operation to be used by other
device peripherals:
1.
2.
3.
4.
5.
•
•
•
6.
•
7.
Disable the PWMx pin output driver(s) by setting
the associated TRIS bit(s).
Clear the PWMxCON register.
Load the PR2 register with the PWM period value.
Load the PWMxDCH register and bits <7:6> of
the PWMxDCL register with the PWM duty cycle
value.
Configure and start Timer2:
Clear the TMR2IF interrupt flag bit of the PIR1
register. See Note below.
Configure the T2CKPS bits of the T2CON
register with the Timer2 prescale value.
Enable Timer2 by setting the TMR2ON bit of
the T2CON register.
Enable PWM output pin:
Wait until Timer2 overflows, TMR2IF bit of the
PIR1 register is set. See Note below.
Configure the PWM module by loading the
PWMxCON register with the appropriate values.
Note:
In order to send a complete duty cycle and
period on the first PWM output, the above
steps must be included in the setup
sequence. If it is not critical to start with a
complete PWM signal on the first output,
then step 6 may be ignored.
2: For operation with other peripherals only,
disable PWMx pin outputs.
DS40001726C-page 166
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
17.2
Register Definitions: PWM Control
REGISTER 17-1:
PWMxCON: PWM CONTROL REGISTER
R/W-0/0
U-0
R-0/0
R/W-0/0
U-0
U-0
U-0
U-0
PWMxEN
—
PWMxOUT
PWMxPOL
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
PWMxEN: PWM Module Enable bit
1 = PWM module is enabled
0 = PWM module is disabled
bit 6
Unimplemented: Read as ‘0’
bit 5
PWMxOUT: PWM module output level when bit is read.
bit 4
PWMxPOL: PWMx Output Polarity Select bit
1 = PWM output is active low.
0 = PWM output is active high.
bit 3-0
Unimplemented: Read as ‘0’
 2013-2016 Microchip Technology Inc.
DS40001726C-page 167
PIC16(L)F1713/6
REGISTER 17-2:
R/W-x/u
PWMxDCH: PWM DUTY CYCLE HIGH BITS
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
PWMxDCH<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
PWMxDCH<7:0>: PWM Duty Cycle Most Significant bits
These bits are the MSbs of the PWM duty cycle. The two LSbs are found in PWMxDCL Register.
bit 7-0
REGISTER 17-3:
R/W-x/u
PWMxDCL: PWM DUTY CYCLE LOW BITS
R/W-x/u
PWMxDCL<7:6>
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
PWMxDCL<7:6>: PWM Duty Cycle Least Significant bits
These bits are the LSbs of the PWM duty cycle. The MSbs are found in PWMxDCH Register.
bit 5-0
Unimplemented: Read as ‘0’
TABLE 17-3:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH PWM
Bit 7
CCPTMRS
Bit 6
P4TSEL<1:0>
Bit 5
Bit 4
Bit 3
P3TSEL<1:0>
PR2
Bit 2
Bit 1
C2TSEL<1:0>
Bit 0
C1TSEL<1:0>
Timer2 module Period Register
PWM3CON
PWM3EN
—
PWM3OUT
PWM3DCH
PWM3POL
—
PWM3DCL<7:6>
PWM4CON
PWM4EN
—
272
268
—
—
—
PWM3DCH<7:0>
PWM3DCL
Register
on Page
167
168
—
—
—
—
—
—
168
PWM4OUT
PWM4POL
—
—
—
—
167
PWM4DCH
PWM4DCH<7:0>
168
—
—
—
—
—
—
TRISA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
—
—
—
PWM4DCL
RxyPPS
PWM4DCL<7:6>
TOUTPS<3:0>
T2CON
TMR2
Legend:
RxyPPS<4:0>
TMR2ON
168
137
T2CKPS<1:0>
Timer2 module Register
270
268
- = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM.
DS40001726C-page 168
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
18.0
COMPLEMENTARY OUTPUT
GENERATOR (COG) MODULE
The primary purpose of the Complementary Output
Generator (COG) is to convert a single output PWM signal into a two output complementary PWM signal. The
COG can also convert two separate input events into a
single or complementary PWM output.
The COG PWM frequency and duty cycle are determined by a rising event input and a falling event input.
The rising event and falling event may be the same
source. Sources may be synchronous or asynchronous
to the COG_clock.
The rate at which the rising event occurs determines
the PWM frequency. The time from the rising event
input to the falling event input determines the duty
cycle.
A selectable clock input is used to generate the phase
delay, blanking, and dead-band times. Dead-band time
can also be generated with a programmable time delay,
which is independent from all clock sources.
Simplified block diagrams of the various COG modes
are shown in Figure 18-2 through Figure 18-6.
The COG module has the following features:
• Six modes of operation:
- Steered PWM mode
- Synchronous Steered PWM mode
- Forward Full-Bridge mode
- Reverse Full-Bridge mode
- Half-Bridge mode
- Push-Pull mode
• Selectable COG_clock clock source
• Independently selectable rising event sources
• Independently selectable falling event sources
• Independently selectable edge or level event
sensitivity
• Independent output polarity selection
• Phase delay with independent rising and falling
delay times
• Dead-band control with:
- independent rising and falling event
dead-band times
- Synchronous and asynchronous timing
• Blanking control with independent rising and
falling event blanking times
• Auto-shutdown control with:
- Independently selectable shutdown sources
- Auto-restart enable
- Auto-shutdown pin override control
(high, low, off, and Hi-Z)
 2013-2016 Microchip Technology Inc.
18.1
18.1.1
Fundamental Operation
STEERED PWM MODES
In steered PWM mode, the PWM signal derived from
the input event sources is output as a single phase
PWM which can be steered to any combination of the
four COG outputs. Outputs are selected by setting the
GxSTRA through GxSTRD bits of the COGxSTR
register (Register 18-9). When the steering bits are
cleared, then the output data is the static level
determined by the GxSDATA through GxSDATD bits of
the COGxSTR register. Output steering takes effect on
the instruction cycle following the write to the
COGxSTR register.
Synchronous steered PWM mode is identical to the
steered PWM mode except that changes to the output
steering take effect on the first rising event after the
COGxSTR register write. Static output data is not
synchronized.
Steering mode configurations are shown in Figure 18-2
and Figure 18-3.
Steered PWM and synchronous steered PWM modes
are selected by setting the GxMD bits of the
COGxCON0 register (Register 18-1) to ‘000’ and ‘001’
respectively.
18.1.2
FULL-BRIDGE MODES
In both Forward and Reverse Full-Bridge modes, two of
the four COG outputs are active and the other two are
inactive. Of the two active outputs, one is modulated by
the PWM input signal and the other is on at 100% duty
cycle. When the direction is changed, the dead-band
time is inserted to delay the modulated output. This
gives the unmodulated driver time to shut down,
thereby, preventing shoot-through current in the series
connected power devices.
In Forward Full-Bridge mode, the PWM input modulates the COGxD output and drives the COGA output at
100%.
In Reverse Full-Bridge mode, the PWM input modulates the COGxB output and drives the COGxC output
at 100%.
The full-bridge configuration is shown in Figure 18-4.
Typical full-bridge waveforms are shown in
Figure 18-12 and Figure 18-13.
Full-Bridge Forward and Full-Bridge Reverse modes
are selected by setting the GxMD bits of the
COGxCON0 register to ‘010’ and ‘011’, respectively.
DS40001726C-page 169
EXAMPLE OF FULL-BRIDGE APPLICATION
V+
FET
Driver
QC
QA
FET
Driver
COGxA
Load
COGxB
FET
Driver
COGxC
FET
Driver
QD
QB
VCOGxD
PIC16(L)F1713/6
DS40001726C-page 170
FIGURE 18-1:
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
18.1.3
HALF-BRIDGE MODE
In half-bridge mode, the COG generates a two output
complementary PWM waveform from rising and falling
event sources. In the simplest configuration, the rising
and falling event sources are the same signal, which is
a PWM signal with the desired period and duty cycle.
The COG converts this single PWM input into a dual
complementary PWM output. The frequency and duty
cycle of the dual PWM output match those of the single
input PWM signal. The off-to-on transition of each output can be delayed from the on-to-off transition of the
other output, thereby, creating a time immediately after
the PWM transition where neither output is driven. This
is referred to as dead time and is covered in
Section 18.5 “Dead-Band Control”.
It may be necessary to guard against the possibility of
circuit faults. In this case, the active drive must be terminated before the Fault condition causes damage.
This is referred to as auto-shutdown and is covered in
Section 18.8 “Auto-shutdown Control”.
The COG can be configured to operate in phase
delayed conjunction with another PWM. The active
drive cycle is delayed from the rising event by a phase
delay timer. Phase delay is covered in more detail in
Section 18.7 “Phase Delay”.
A typical operating waveform, with phase delay and
dead-band, generated from a single CCP1 input is
shown in Figure 18-10.
A typical operating waveform, with dead-band, generated
from a single CCP1 input is shown in Figure 18-9.
The primary output can be steered to either or both
COGxA and COGxC. The complementary output can be
steered to either or both COGxB and COGxD.
Half-Bridge mode is selected by setting the GxMD bits
of the COGxCON0 register to ‘100’.
18.1.4
PUSH-PULL MODE
In Push-Pull mode, the COG generates a single PWM
output that alternates, every PWM period, between the
two pairs of the COG outputs. COGxA has the same
signal as COGxC. COGxB has the same signal as
COGxD. The output drive activates with the rising input
event and terminates with the falling event input. Each
rising event starts a new period and causes the output
to switch to the COG pair not used in the previous
period.
The push-pull configuration is shown in Figure 18-6. A
typical push-pull waveform generated from a single
CCP1 input is shown in Figure 18-11.
Push-Pull mode is selected by setting the GxMD bits of
the COGxCON0 register to ‘101’.
18.1.5
EVENT DRIVEN PWM (ALL MODES)
Besides generating PWM and complementary outputs
from a single PWM input, the COG can also generate
PWM waveforms from a periodic rising event and a
separate falling event. In this case, the falling event is
usually derived from analog feedback within the
external PWM driver circuit. In this configuration, high
power switching transients may trigger a false falling
event that needs to be blanked out. The COG can be
configured to blank falling (and rising) event inputs for
a period of time immediately following the rising (and
falling) event drive output. This is referred to as input
blanking and is covered in Section 18.6 “Blanking
Control”.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 171
SIMPLIFIED COG BLOCK DIAGRAM (STEERED PWM MODE, GXMD = 0)
GxASDAC<1:0>
‘1’
‘0’
High-Z
reserved
HFINTOSC
11
10
FOSC
FOSC/4
01
00
NCO1_out
PWM3OUT
CCP2
CCP1
LC1_out
C2OUT
C1OUT
COGINPPS
COG_clock
1
0
src7
src6
src5
src4
src3
src2
src1
src0
src7
src6
src5
src4
src3
src2
src1
src0
GxSDATA
0
GxSTRA
Rising Input Block
GxASDBD<1:0>
clock
‘1’
‘0’
High-Z
Reset Dominates
rising_event
S Q
count_en
GxPOLB
GxSDATB
COGxB
0
GxASDAC<1:0>
GxSTRB
‘1’
‘0’
High-Z
clock
11
10
01
00
1
falling_event
COGxC
1
count_en
GxPOLC
GxSDATC
0
0
GxASDBD<1:0>
‘1’
‘0’
High-Z
GxEN
 2013-2016 Microchip Technology Inc.
Write GxASE High
1
0
GxSTRC
COGINPPS
GxAS0E
C1OUT
GxAS1E
C2OUT
GxAS2E
LC2_out
GxAS3E
11
10
01
00
1
R Q
Falling Input Block
NCO1_out
PWM3OUT
CCP2
CCP1
LC1_out
C2OUT
C1OUT
COGINPPS
COGxA
1
GxPOLA
GxCS<1:0>
11
10
01
00
11
10
01
00
1
COGxD
1
GxPOLD
Auto-shutdown source
GxSDATD
0
0
GxSTRD
GxASE
S Q
GxARSEN
Write GxASE Low
R
Set Dominates
S
D Q
PIC16(L)F1713/6
DS40001726C-page 172
FIGURE 18-2:
 2013-2016 Microchip Technology Inc.
FIGURE 18-3:
SIMPLIFIED COG BLOCK DIAGRAM (SYNCHRONOUS STEERED PWM MODE, GXMD = 1)
GxASDAC<1:0>
‘1’
‘0’
High-Z
reserved
HFINTOSC
11
10
FOSC
FOSC/4
01
00
GxCS<1:0>
NCO1_out
PWM3OUT
CCP2
CCP1
LC1_out
C2OUT
C1OUT
COGINPPS
COG_clock
1
0
GxPOLA
GxSTRA
Rising Input Block
src7
src6
src5
src4
src3
src2
src1
src0
src7
src6
src5
src4
src3
src2
src1
src0
GxSDATA
0
D Q
GxASDBD<1:0>
clock
‘1’
‘0’
High-Z
Reset Dominates
rising_event
S Q
count_en
GxPOLB
GxSTRB
GxSDATB
1
COGxB
0
0
D Q
GxASDAC<1:0>
‘1’
‘0’
High-Z
clock
11
10
01
00
1
falling_event
COGxC
1
count_en
GxPOLC
GxSDATC
0
0
D Q
GxASDBD<1:0>
11
10
01
00
1
COGxD
1
GxPOLD
GxSTRD
Auto-shutdown source
GxSDATD
0
0
D Q
DS40001726C-page 173
GxASE
S Q
GxARSEN
Write GxASE Low
R
Set Dominates
S
D Q
PIC16(L)F1713/6
‘1’
‘0’
High-Z
GxEN
Write GxASE High
11
10
01
00
1
R Q
GxSTRC
COGINPPS
GxAS0E
C1OUT
GxAS1E
C2OUT
GxAS2E
LC2_out
GxAS3E
COGxA
1
Falling Input Block
NCO1_out
PWM3OUT
CCP2
CCP1
LC1_out
C2OUT
C1OUT
COGINPPS
11
10
01
00
SIMPLIFIED COG BLOCK DIAGRAM (FULL-BRIDGE MODES, FORWARD: GXMD = 2, REVERSE: GXMD = 3)
GxASDAC<1:0>
‘1’
‘0’
High-Z
reserved
HFINTOSC
11
10
FOSC
FOSC/4
01
00
NCO1_out
PWM3OUT
CCP2
CCP1
LC1_out
C2OUT
C1OUT
COGINPPS
COG_clock
1
1
Rising Input Block
src7
src6
src5
src4
src3
src2
src1
src0
GxSDATA
GxPOLA
clock
clock
Reset Dominates
rising_event
src0
‘1’
‘0’
High-Z
count_en
Falling Dead-Band Block
1
GxASDAC<1:0>
GxSTRB
‘1’
‘0’
High-Z
signal_out
signal_in
11
10
01
00
1
falling_event
1
count_en
GxMD0
‘1’
‘0’
High-Z
Q
GxASDBD<1:0>
 2013-2016 Microchip Technology Inc.
11
10
01
00
1
1
GxSDATD
GxPOLD
R
Set Dominates
COGxD
0
0
GxSTRD
GxASE
S Q
GxARSEN
Write GxASE Low
COGxC
0
GxSDATC 0
GxPOLC
GxSTRC
D Q
Auto-shutdown source
COGxB
0
clock
GxEN
Write GxASE High
11
10
01
00
0
GxSDATB
clock
GxASDBD<1:0>
1
R Q
Forward/Reverse
COGINPPS
GxAS0E
C1OUT
GxAS1E
C2OUT
GxAS2E
LC2_out
GxAS3E
GxSTRA
S Q
Falling Input Block
src7
src6
src5
src4
src3
src2
src1
0
signal_out
signal_in
GxPOLB
NCO1_out
PWM3OUT
CCP2
CCP1
LC1_out
C2OUT
C1OUT
COGINPPS
COGxA
0
Rising Dead-Band Block
GxCS<1:0>
11
10
01
00
S
D Q
PIC16(L)F1713/6
DS40001726C-page 174
FIGURE 18-4:
 2013-2016 Microchip Technology Inc.
FIGURE 18-5:
SIMPLIFIED COG BLOCK DIAGRAM (HALF-BRIDGE MODE, GXMD = 4)
GxASDAC<1:0>
‘1’
‘0’
High-Z
reserved
HFINTOSC
11
10
FOSC
FOSC/4
01
00
GxCS<1:0>
NCO1_out
PWM3OUT
CCP2
CCP1
LC1_out
C2OUT
C1OUT
COGINPPS
COG_clock
1
1
GxSDATA
GxPOLA
Rising Input Block
src7
src6
src5
src4
src3
src2
src1
src0
Rising Dead-Band Block
clock
Reset Dominates
rising_event
S Q
src7
src6
src5
src4
src3
src2
src1
src0
0
GxSTRA
‘1’
‘0’
High-Z
clock
signal_out
signal_in
count_en
1
Falling Dead-Band Block
GxASDAC<1:0>
GxSTRB
‘1’
‘0’
High-Z
clock
signal_out
signal_in
11
10
01
00
1
falling_event
1
GxASDBD<1:0>
11
10
01
00
1
1
GxSDATD
Auto-shutdown source
GxPOLD
DS40001726C-page 175
R
Set Dominates
0
GxSTRD
GxASE
S Q
GxARSEN
Write GxASE Low
COGxD
0
S
D Q
PIC16(L)F1713/6
‘1’
‘0’
High-Z
COGxC
0
GxSDATC 0
GxPOLC
GxSTRC
count_en
COGxB
0
GxEN
Write GxASE High
11
10
01
00
0
GxSDATB
clock
GxASDBD<1:0>
1
R Q
GxPOLB
COGINPPS
GxAS0E
C1OUT
GxAS1E
C2OUT
GxAS2E
LC2_out
GxAS3E
COGxA
0
Falling Input Block
NCO1_out
PWM3OUT
CCP2
CCP1
LC1_out
C2OUT
C1OUT
COGINPPS
11
10
01
00
SIMPLIFIED COG BLOCK DIAGRAM (PUSH-PULL MODE, GXMD = 5)
GxASDAC<1:0>
‘1’
‘0’
High-Z
reserved
HFINTOSC
11
10
FOSC
FOSC/4
01
00
GxCS<1:0>
NCO1_out
PWM3OUT
CCP2
CCP1
LC1_out
C2OUT
C1OUT
COGINPPS
COG_clock
1
1
GxSDATA
GxPOLA
Rising Input Block
src7
src6
src5
src4
src3
src2
src1
src0
src7
src6
src5
src4
src3
src2
src1
src0
0
GxSTRA
Push-Pull
clock
Reset Dominates
rising_event
S Q
‘1’
‘0’
High-Z
D Q
R
Q
count_en
1
GxSDATB
0
GxASDAC<1:0>
GxSTRB
‘1’
‘0’
High-Z
clock
11
10
01
00
1
falling_event
1
‘1’
‘0’
High-Z
GxASDBD<1:0>
 2013-2016 Microchip Technology Inc.
11
10
01
00
1
1
GxSDATD
Auto-shutdown source
GxPOLD
R
Set Dominates
COGxD
0
0
GxSTRD
GxASE
S Q
GxARSEN
Write GxASE Low
COGxC
0
GxSDATC 0
GxPOLC
GxSTRC
count_en
COGxB
0
GxEN
Write GxASE High
GxASDBD<1:0>
11
10
01
00
1
R Q
Falling Input Block
COGINPPS
GxAS0E
C1OUT
GxAS1E
C2OUT
GxAS2E
LC2_out
GxAS3E
COGxA
0
GxPOLB
NCO1_out
PWM3OUT
CCP2
CCP1
LC1_out
C2OUT
C1OUT
COGINPPS
11
10
01
00
S
D Q
PIC16(L)F1713/6
DS40001726C-page 176
FIGURE 18-6:
 2013-2016 Microchip Technology Inc.
FIGURE 18-7:
COG (RISING/FALLING) INPUT BLOCK
clock
GxPH(R/F)<3:0>
Blanking
=
Cnt/Clr
count_en
Phase
Delay
GxBLK(F/R)<3:0>
src7
Gx(R/F)IS7
src6
Gx(R/F)SIM7
Gx(R/F)IS6
src5
Gx(R/F)SIM6
Gx(R/F)IS5
src4
Gx(R/F)SIM5
Gx(R/F)IS4
src3
Gx(R/F)SIM4
Gx(R/F)IS3
Gx(R/F)IS2
src1
Gx(R/F)SIM2
Gx(R/F)IS1
DS40001726C-page 177
src0
Gx(R/F)SIM1
Gx(R/F)IS0
Gx(R/F)SIM0
1
LE
0
D Q
1
LE
0
D Q
1
LE
0
D Q
1
LE
0
D Q
1
LE
0
D Q
1
LE
0
D Q
1
LE
0
D Q
1
LE
0
(rising/falling)_event
PIC16(L)F1713/6
src2
Gx(R/F)SIM3
D Q
PIC16(L)F1713/6
FIGURE 18-8:
COG (RISING/FALLING) DEAD-BAND BLOCK
Gx(R/F)DBTS
Synchronous
Delay
=
Cnt/Clr
clock
0
0
1
GxDBR<3:0>
1
Asynchronous
Delay Chain
signal_in
DS40001726C-page 178
signal_out
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 18-9:
TYPICAL HALF-BRIDGE MODE COG OPERATION WITH CCP1
COG_clock
Source
CCP1
COGxA
Rising_event Dead-band
Falling_event Dead-band
Falling_event Dead-band
COGxB
FIGURE 18-10:
HALF-BRIDGE MODE COG OPERATION WITH CCP1 AND PHASE DELAY
COG_clock
Source
CCP1
COGxA
Falling_event Dead-Band
Phase Delay
Rising_event
Dead-Band
COGxB
FIGURE 18-11:
Falling_event
Dead-Band
PUSH-PULL MODE COG OPERATION WITH CCP1
CCP1
COGxA
COGxB
 2013-2016 Microchip Technology Inc.
DS40001726C-page 179
PIC16(L)F1713/6
FIGURE 18-12:
FULL-BRIDGE FORWARD MODE COG OPERATION WITH CCP1
CCP1
COGxA
COGxB
COGxC
COGxD
FIGURE 18-13:
FULL-BRIDGE MODE COG OPERATION WITH CCP1 AND DIRECTION CHANGE
CCP1
COGxA
Falling_event Dead-Band
COGxB
COGxC
COGxD
CxMD0
DS40001726C-page 180
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
18.2
Clock Sources
The COG_clock is used as the reference clock to the
various timers in the peripheral. Timers that use the
COG_clock include:
• Rising and falling dead-band time
• Rising and falling blanking time
• Rising and falling event phase delay
precluding an output change. The comparator output
stays low and without a high-to-low transition to trigger
the edge sense, the drive of the COG output will be stuck
in a constant drive-on condition. See Figure 18-14.
FIGURE 18-14:
Rising (CCP1)
Clock sources available for selection include:
Falling (C1OUT)
• 8 MHz HFINTOSC (active during Sleep)
• Instruction clock (FOSC/4)
• System clock (FOSC)
COGOUT
Edge Sensitive
Selectable Event Sources
Rising (CCP1)
The COG uses any combination of independently
selectable event sources to generate the complementary waveform. Sources fall into two categories:
Falling (C1OUT)
• Rising event sources
• Falling event sources
C1IN-
The rising event sources are selected by setting bits in
the COGxRIS register (Register 18-3). The falling event
sources are selected by setting bits in the COGxFIS
register (Register 18-5). All selected sources are ‘OR’d
together to generate the corresponding event signal.
Refer to Figure 18-7.
COGOUT
18.3.1
hyst
C1IN-
The clock source is selected with the GxCS<1:0> bits
of the COGxCON0 register (Register 18-1).
18.3
EDGE VS LEVEL SENSE
EDGE VS. LEVEL SENSING
Event input detection may be selected as level or edge
sensitive. The detection mode is individually selectable
for every source. Rising source detection modes are
selected with the COGxRSIM register (Register 18-4).
Falling source detection modes are selected with the
COGxFSIM register (Register 18-6). A set bit enables
edge detection for the corresponding event source. A
cleared bit enables level detection.
In general, events that are driven from a periodic
source should be edge detected and events that are
derived from voltage thresholds at the target circuit
should be level sensitive. Consider the following two
examples:
hyst
Level Sensitive
18.3.2
RISING EVENT
The rising event starts the PWM output active duty
cycle period. The rising event is the low-to-high
transition of the rising_event output. When the rising
event phase delay and dead-band time values are zero,
the primary output starts immediately. Otherwise, the
primary output is delayed. The rising event source
causes all the following actions:
•
•
•
•
•
Start rising event phase delay counter (if enabled).
Clear complementary output after phase delay.
Start falling event input blanking (if enabled).
Start dead-band delay (if enabled).
Set primary output after dead-band delay expires.
18.3.3
FALLING EVENT
1. The first example is an application in which the
period is determined by a 50% duty cycle clock and the
COG output duty cycle is determined by a voltage level
fed back through a comparator. If the clock input is level
sensitive, duty cycles less than 50% will exhibit erratic
operation.
The falling event terminates the PWM output active duty
cycle period. The falling event is the high-to-low
transition of the falling_event output. When the falling
event phase delay and dead-band time values are zero,
the complementary output starts immediately. Otherwise,
the complementary output is delayed. The falling event
source causes all the following actions:
2. The second example is similar to the first except that
the duty cycle is close to 100%. The feedback comparator high-to-low transition trips the COG drive off, but
almost immediately the period source turns the drive
back on. If the off cycle is short enough, the comparator
input may not reach the low side of the hysteresis band
•
•
•
•
•
 2013-2016 Microchip Technology Inc.
Start falling event phase delay counter (if enabled).
Clear primary output.
Start rising event input blanking (if enabled).
Start falling event dead-band delay (if enabled).
Set complementary output after dead-band delay
expires.
DS40001726C-page 181
PIC16(L)F1713/6
18.4
Output Control
Upon disabling, or immediately after enabling the COG
module, the primary COG outputs are inactive and
complementary COG outputs are active.
18.4.1
OUTPUT ENABLES
There are no output enable controls in the COG module. Instead, each device pin has an individual output
selection control called the PPS register. All four COG
outputs are available for selection in the PPS register
of every pin.
When a COG output is enabled by PPS selection, the
output on the pin has several possibilities, which
depend on the steering control, GxEN bit, and shutdown state as shown in Table 18-1
.
TABLE 18-1:
PIN OUTPUT STATES
GxEN
COGxSTR
bit
Shutdown
x
0
Inactive
Static steering data
x
1
Active
Shutdown override
0
1
Inactive
Inactive state
1
1
Inactive
Active PWM signal
18.4.2
Output
POLARITY CONTROL
The polarity of each COG output can be selected
independently. When the output polarity bit is set, the
corresponding output is active low. Clearing the output
polarity bit configures the corresponding output as
active high. However, polarity affects the outputs in
only one of the four shutdown override modes. See
Section 18.8, Auto-shutdown Control for more details.
Output polarity is selected with the GxPOLA through
GxPOLD
bits
of
the
COGxCON1
register
(Register 18-2).
18.5
Dead-Band Control
The dead-band control provides for non-overlapping
PWM output signals to prevent shoot-through current
in the external power switches. Dead time affects the
output only in the Half-Bridge mode and when changing direction in the Full-Bridge mode.
The COG contains two dead-band timers. One
dead-band timer is used for rising event dead-band
control. The other is used for falling event dead-band
control. Timer modes are selectable as either:
• Asynchronous delay chain
• Synchronous counter
The dead-band timer mode is selected for the
rising_event and falling_event dead-band times with
the respective GxRDBS and GxFDBS bits of the
COGxCON1 register (Register 18-2).
DS40001726C-page 182
In Half-Bridge mode, the rising_event dead-band time
delays all selected primary outputs from going active
for the selected dead time after the rising event.
COGxA and COGxC are the primary outputs in
Half-Bridge mode.
In Half-Bridge mode, the falling_event dead-band time
delays all selected complementary outputs from going
active for the selected dead time after the falling event.
COGxB and COGxD are the complementary outputs in
Half-Bridge mode.
In Full-Bridge mode, the dead-time delay occurs only
during direction changes. The modulated output is
delayed for the falling_event dead time after a direction
change from forward to reverse. The modulated output
is delayed for the rising_event dead time after a direction change from reverse to forward.
18.5.1
ASYNCHRONOUS DELAY CHAIN
DEAD-BAND DELAY
Asynchronous dead-band delay is determined by the
time it takes the input to propagate through a series of
delay elements. Each delay element is a nominal five
nanoseconds.
Set the COGxDBR register (Register 18-10) value to
the desired number of delay elements in the
rising_event dead-band time. Set the COGxDBF register (Register 18-11) value to the desired number of
delay elements in the falling_event dead-band time.
When the value is zero, dead-band delay is disabled.
18.5.2
SYNCHRONOUS COUNTER
DEAD-BAND DELAY
Synchronous counter dead band is timed by counting
COG_clock periods from zero up to the value in the
dead-band count register. Use Equation 18-1 to
calculate dead-band times.
Set the COGxDBR count register value to obtain the
desired rising_event dead-band time. Set the
COGxDBF count register value to obtain the desired
falling_event dead-band time. When the value is zero,
dead-band delay is disabled.
18.5.3
SYNCHRONOUS COUNTER
DEAD-BAND TIME UNCERTAINTY
When the rising and falling events that trigger the
dead-band counters come from asynchronous inputs,
it creates uncertainty in the synchronous counter
dead-band time. The maximum uncertainty is equal to
one COG_clock period. Refer to Example 18-1 for
more detail.
When event input sources are asynchronous with no
phase delay, use the asynchronous delay chain
dead-band mode to avoid the dead-band time
uncertainty.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
18.5.4
RISING EVENT DEAD-BAND
Rising event dead band delays the turn-on of the primary outputs from when complementary outputs are
turned off. The rising event dead-band time starts
when the rising_ event output goes true.
See Section 18.5.1, Asynchronous Delay Chain
Dead-band Delay and Section 18.5.2, Synchronous
Counter Dead-band Delay for more information on setting the rising edge dead-band time.
18.5.5
FALLING EVENT DEAD-BAND
Falling event dead band delays the turn-on of complementary outputs from when the primary outputs are
turned off. The falling event dead-band time starts
when the falling_ event output goes true.
See Section 18.5.1, Asynchronous Delay Chain
Dead-band Delay and Section 18.5.2, Synchronous
Counter Dead-band Delay for more information on setting the rising edge dead-band time.
18.5.6
• Rising-to-falling
• Falling-to-rising
Rising-to-Falling Overlap
In this case, the falling event occurs while the rising
event dead-band counter is still counting. When this
happens, the primary drives are suppressed and the
dead-band extends by the falling event dead-band
time. At the termination of the extended dead-band
time, the complementary drive goes true.
18.5.6.2
Falling-to-Rising Overlap
In this case, the rising event occurs while the falling
event dead-band counter is still counting. When this
happens, the complementary drive is suppressed and
the dead-band extends by the rising event dead-band
time. At the termination of the extended dead-band
time, the primary drive goes true.
18.6
18.6.1
Blanking Control
Input blanking is a function, whereby, the event inputs
can be masked or blanked for a short period of time.
This is to prevent electrical transients caused by the
turn-on/off of power components from generating a
false input event.
The COG contains two blanking counters: one triggered by the rising event and the other triggered by
the falling event. The counters are cross coupled with
the events they are blanking. The falling event blanking counter is used to blank rising input events and the
rising event blanking counter is used to blank falling
input events. Once started, blanking extends for the
time specified by the corresponding blanking counter.
 2013-2016 Microchip Technology Inc.
FALLING EVENT BLANKING OF
RISING EVENT INPUTS
The falling event blanking counter inhibits rising event
inputs from triggering a rising event. The falling event
blanking time starts when the rising event output drive
goes false.
The falling event blanking time is set by the value contained in the COGxBLKF register (Register 18-13).
Blanking times are calculated using the formula shown
in Equation 18-1.
When the COGxBLKF value is zero, falling event
blanking is disabled and the blanking counter output is
true, thereby, allowing the event signal to pass straight
through to the event trigger circuit.
18.6.2
DEAD-BAND OVERLAP
There are two cases of dead-band overlap:
18.5.6.1
Blanking is timed by counting COG_clock periods from
zero up to the value in the blanking count register. Use
Equation 18-1 to calculate blanking times.
RISING EVENT BLANKING OF
FALLING EVENT INPUTS
The rising event blanking counter inhibits falling event
inputs from triggering a falling event. The rising event
blanking time starts when the falling event output drive
goes false.
The rising event blanking time is set by the value
contained in the COGxBLKR register (Register 18-12).
When the COGxBLKR value is zero, rising event
blanking is disabled and the blanking counter output is
true, thereby, allowing the event signal to pass straight
through to the event trigger circuit.
18.6.3
BLANKING TIME UNCERTAINTY
When the rising and falling sources that trigger the
blanking counters are asynchronous to the
COG_clock, it creates uncertainty in the blanking time.
The maximum uncertainty is equal to one COG_clock
period. Refer to Equation 18-1 and Example 18-1 for
more detail.
18.7
Phase Delay
It is possible to delay the assertion of either or both the
rising event and falling events. This is accomplished
by placing a non-zero value in COGxPHR or
COGxPHF phase-delay count register, respectively
(Register 18-14 and Register 18-15). Refer to
Figure 18-10 for COG operation with CCP1 and phase
delay. The delay from the input rising event signal
switching to the actual assertion of the events is calculated the same as the dead-band and blanking delays.
Refer to Equation 18-1.
When the phase-delay count value is zero, phase
delay is disabled and the phase-delay counter output
is true, thereby, allowing the event signal to pass
straight through to the complementary output driver
flop.
DS40001726C-page 183
PIC16(L)F1713/6
18.7.1
CUMULATIVE UNCERTAINTY
It is not possible to create more than one COG_clock of
uncertainty by successive stages. Consider that the
phase-delay stage comes after the blanking stage, the
dead-band stage comes after either the blanking or
phase-delay stages, and the blanking stage comes
after the dead-band stage. When the preceding stage
is enabled, the output of that stage is necessarily
synchronous with the COG_clock, which removes any
possibility of uncertainty in the succeeding stage.
EQUATION 18-1:
PHASE, DEAD-BAND,
AND BLANKING TIME
CALCULATION
T min = Count
EXAMPLE 18-1:
Given:
Count = Ah = 10d
F COG_Clock = 8MHz
Therefore:
1
T uncertainty = -------------------------F COG_clock
1
= --------------- = 125ns
8MHz
Proof:
Count
T min = -------------------------F COG_clock
= 125ns  10d = 1.25s
F COG_clock
T max
Count + 1
= -------------------------F COG_clock
T uncertainty = T max – T min
Count + 1
T max = -------------------------F COG_clock
= 125ns   10d + 1 
Also:
1
T uncertainty = -------------------------F COG_clock
Where:
TIMER UNCERTAINTY
= 1.375s
Therefore:
T uncertainty = T max – T min
T
Count
Rising Phase Delay
COGxPHR
Falling Phase Delay
COGxPHF
Rising Dead Band
COGxDBR
Falling Dead Band
COGxDBF
Rising Event Blanking
COGxBLKR
Falling Event Blanking
COGxBLKF
DS40001726C-page 184
= 1.375s – 1.25s
= 125ns
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18.8
Auto-shutdown Control
Auto-shutdown is a method to immediately override
the COG output levels with specific overrides that
allow for safe shutdown of the circuit.
The shutdown state can be either cleared automatically or held until cleared by software. In either case,
the shutdown overrides remain in effect until the first
rising event after the shutdown is cleared.
18.8.1
SHUTDOWN
The shutdown state can be entered by either of the
following two mechanisms:
• Software generated
• External Input
18.8.1.1
When auto-restart is disabled, the shutdown state will
persist until the first rising event after the GxASE bit is
cleared by software.
When auto-restart is enabled, the GxASE bit will clear
automatically and resume operation on the first rising
event after the shutdown input clears. See
Figure 18-15 and Section 18.8.3.2 “Auto-Restart”.
External Shutdown Source
External shutdown inputs provide the fastest way to
safely suspend COG operation in the event of a Fault
condition. When any of the selected shutdown inputs
goes true, the output drive latches are reset and the
COG outputs immediately go to the selected override
levels without software delay.
Any combination of the input sources can be selected
to cause a shutdown condition. Shutdown occurs
when the selected source is low. Shutdown input
sources include:
•
•
•
•
Any input pin selected with the COGxPPS control
C2OUT
C1OUT
CLC2OUT
PIN OVERRIDE LEVELS
The levels driven to the output pins, while the shutdown is active, are controlled by the GxASDAC<1:0>
and GxASDBC<1:0> bits of the COGxASD0 register
(Register 18-7). GxASDAC<1:0> controls the COGxA
and COGxC override levels and GxASDBC<1:0> controls the COGxB and COGxD override levels. There
are four override options for each output pair:
•
•
•
•
Forced low
Forced high
Tri-state
PWM inactive state (same state as that caused by
a falling event)
Note:
Software Generated Shutdown
Setting the GxASE bit of the COGxASD0 register
(Register 18-7) will force the COG into the shutdown
state.
18.8.1.2
18.8.2
18.8.3
The polarity control does not apply to the
forced low and high override levels but
does apply to the PWM inactive state.
AUTO-SHUTDOWN RESTART
After an auto-shutdown event has occurred, there are
two ways to resume operation:
• Software controlled
• Auto-restart
The restart method is selected with the GxARSEN bit
of the COGxASD0 register. Waveforms of a software
controlled automatic restart are shown in Figure 18-15.
18.8.3.1
Software Controlled Restart
When the GxARSEN bit of the COGxASD0 register is
cleared, software must clear the GxASE bit to restart
COG operation after an auto-shutdown event.
The COG will resume operation on the first rising
event after the GxASE bit is cleared. Clearing the shutdown state requires all selected shutdown inputs to be
false, otherwise, the GxASE bit will remain set.
18.8.3.2
Auto-Restart
When the GxARSEN bit of the COGxASD0 register is
set, the COG will restart from the auto-shutdown state
automatically.
The GxASE bit will clear automatically and the COG
will resume operation on the first rising event after all
selected shutdown inputs go false.
Shutdown inputs are selected independently with bits
of the COGxASD1 register (Register 18-8).
Note:
Shutdown inputs are level sensitive, not
edge sensitive. The shutdown state cannot
be cleared as long as the shutdown input
level persists, except by disabling
auto-shutdown,
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DS40001726C-page 185
1
2
3
4
5
CCP1
GxARSEN
Next rising event
Shutdown input
Next rising event
GxASE
Cleared in hardware
Cleared in software
GxASDAC
2b00
2b00
2b00
GxASDBD
COGxA
COGxB
 2013-2016 Microchip Technology Inc.
Operating State
NORMAL OUTPUT
SHUTDOWN
NORMAL OUTPUT
SOFTWARE CONTROLLED RESTART
SHUTDOWN
NORMAL OUTPUT
AUTO-RESTART
PIC16(L)F1713/6
DS40001726C-page 186
FIGURE 18-15: AUTO-SHUTDOWN WAVEFORM – CCP1 AS RISING AND FALLING EVENT INPUT SOURCE
PIC16(L)F1713/6
18.9
Buffer Updates
Changes to the phase, dead band, and blanking count
registers need to occur simultaneously during COG
operation to avoid unintended operation that may
occur as a result of delays between each register
write. This is accomplished with the GxLD bit of the
COGxCON0 register and double buffering of the
phase, blanking, and dead-band count registers.
Before the COG module is enabled, writing the count
registers loads the count buffers without need of the
GxLD bit. However, when the COG is enabled, the
count buffer updates are suspended after writing the
count registers until after the GxLD bit is set. When the
GxLD bit is set, the phase, dead-band, and blanking
register values are transferred to the corresponding
buffers synchronous with COG operation. The GxLD
bit is cleared by hardware when the transfer is
complete.
18.10 Input and Output Pin Selection
The COG has one selection for an input from a device
pin. That one input can be used as rising and falling
event source or a fault source. The COG1PPS register
is used to select the pin. Refer to Register 12-1 and
Register 12-2.
The pin PPS control registers are used to enable the
COG outputs. Any combination of outputs to pins is
possible including multiple pins for the same output.
See the RxyPPS control register and Section 12.2
“PPS Outputs” for more details.
18.12 Configuring the COG
The following steps illustrate how to properly configure
the COG to ensure a synchronous start with the rising
event input:
1.
2.
3.
4.
5.
6.
7.
8.
9.
18.11 Operation During Sleep
The COG continues to operate in Sleep provided that
the COG_clock, rising event, and falling event sources
remain active.
The HFINTSOC remains active during Sleep when the
COG is enabled and the HFINTOSC is selected as the
COG_clock source.
10.
11.
12.
13.
14.
15.
16.
17.
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If a pin is to be used for the COG fault or event
input, use the COGxPPS register to configure
the desired pin.
Clear all ANSEL register bits associated with
pins that are used for COG functions.
Ensure that the TRIS control bits corresponding
to the COG outputs to be used are cleared so
that all are configured as inputs. The COG module will disable the output drivers as needed for
shutdown.
Clear the GxEN bit, if not already cleared.
Set desired dead-band times with the
COGxDBR and COGxDBF registers and select
the source with the COGxRDBS and
COGxFDBS bits of the COGxCON1 register.
Set desired blanking times with the COGxBLKR
and COGxBLKF registers.
Set desired phase delay with the COGxPHR
and COGxPHF registers.
Select the desired shutdown sources with the
COGxASD1 register.
Setup the following controls in COGxASD0
auto-shutdown register:
• Select both output override controls to the
desired levels (this is necessary, even if not
using auto-shutdown because start-up will be
from a shutdown state).
• Set the GxASE bit and clear the GxARSEN
bit.
Select the desired rising and falling event sources
with the COGxRIS and COGxFIS registers.
Select the desired rising and falling event modes
with the COGxRSIM and COGxFSIM registers.
Configure the following controls in the
COGxCON1 register:
• Select the desired clock source
• Select the desired dead-band timing sources
Configure the following controls in the
COGxSTR register:
• Set the steering bits of the outputs to be
used.
• Set the static levels.
Set the polarity controls in the COGxCON1
register.
Set the GxEN bit.
Set the pin PPS controls to direct the COG
outputs to the desired pins.
If auto-restart is to be used, set the GxARSEN bit
and the GxASE will be cleared automatically.
Otherwise, clear the GxASE bit to start the COG.
DS40001726C-page 187
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18.13 Register Definitions: COG Control
REGISTER 18-1:
COGxCON0: COG CONTROL REGISTER 0
R/W-0/0
R/W-0/0
U-0
GxEN
GxLD
—
R/W-0/0
R/W-0/0
R/W-0/0
GxCS<1:0>
R/W-0/0
R/W-0/0
GxMD<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
GxEN: COGx Enable bit
1 = Module is enabled
0 = Module is disabled
bit 6
GxLD: COGx Load Buffers bit
1 = Phase, blanking, and dead-band buffers to be loaded with register values on next input events
0 = Register to buffer transfer is complete
bit 5
Unimplemented: Read as ‘0’
bit 4-3
GxCS<1:0>: COGx Clock Selection bits
11 = Reserved. Do not use.
10 = COG_clock is HFINTOSC (stays active during Sleep)
01 = COG_clock is FOSC
00 = COG_clock is FOSC/4
bit 2-0
GxMD<2:0>: COGx Mode Selection bits
11x = Reserved. Do not use.
101 = COG outputs operate in Push-Pull mode
100 = COG outputs operate in Half-Bridge mode
011 = COG outputs operate in Reverse Full-Bridge mode
010 = COG outputs operate in Forward Full-Bridge mode
001 = COG outputs operate in synchronous steered PWM mode
000 = COG outputs operate in steered PWM mode
DS40001726C-page 188
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REGISTER 18-2:
R/W-0/0
GxRDBS
COGxCON1: COG CONTROL REGISTER 1
R/W-0/0
U-0
U-0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
GxFDBS
—
—
GxPOLD
GxPOLC
GxPOLB
GxPOLA
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
GxRDBS: COGx Rising Event Dead-band Timing Source Select bit
1 = Delay chain and COGxDBR are used for dead-band timing generation
0 = COGx_clock and COGxDBR are used for dead-band timing generation
bit 6
GxFDBS: COGx Falling Event Dead-band Timing Source select bit
1 = Delay chain and COGxDF are used for dead-band timing generation
0 = COGx_clock and COGxDBF are used for dead-band timing generation
bit 5-4
Unimplemented: Read as ‘0’.
bit 3
GxPOLD: COGxD Output Polarity Control bit
1 = Active level of COGxD output is low
0 = Active level of COGxD output is high
bit 2
GxPOLC: COGxC Output Polarity Control bit
1 = Active level of COGxC output is low
0 = Active level of COGxC output is high
bit 1
GxPOLB: COGxB Output Polarity Control bit
1 = Active level of COGxB output is low
0 = Active level of COGxB output is high
bit 0
GxPOLA: COGxA Output Polarity Control bit
1 = Active level of COGxA output is low
0 = Active level of COGxA output is high
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DS40001726C-page 189
PIC16(L)F1713/6
REGISTER 18-3:
COGxRIS: COG RISING EVENT INPUT SELECTION REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
GxRIS7
GxRIS6
GxRIS5
GxRIS4
GxRIS3
GxRIS2
GxRIS1
GxRIS0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
GxRIS7: COGx Rising Event Input Source 7 Enable bit
1 = NCO1_out is enabled as a rising event input
0 = NCO1_out has no effect on the rising event
bit 6
GxRIS6: COGx Rising Event Input Source 6 Enable bit
1 = PWM3 output is enabled as a rising event input
0 = PWM3 has no effect on the rising event
bit 5
GxRIS5: COGx Rising Event Input Source 5 Enable bit
1 = CCP2 output is enabled as a rising event input
0 = CCP2 output has no effect on the rising event
bit 4
GxRIS4: COGx Rising Event Input Source 4 Enable bit
1 = CCP1 is enabled as a rising event input
0 = CCP1 has no effect on the rising event
bit 3
GxRIS3: COGx Rising Event Input Source 3 Enable bit
1 = CLC1 output is enabled as a rising event input
0 = CLC1 output has no effect on the rising event
bit 2
GxRIS2: COGx Rising Event Input Source 2 Enable bit
1 = Comparator 2 output is enabled as a rising event input
0 = Comparator 2 output has no effect on the rising event
bit 1
GxRIS1: COGx Rising Event Input Source 1 Enable bit
1 = Comparator 1 output is enabled as a rising event input
0 = Comparator 1 output has no effect on the rising event
bit 0
GxRIS0: COGx Rising Event Input Source 0 Enable bit
1 = Pin selected with COGxPPS control register is enabled as rising event input
0 = Pin selected with COGxPPS control has no effect on the rising event
DS40001726C-page 190
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REGISTER 18-4:
COGxRSIM: COG RISING EVENT SOURCE INPUT MODE REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
GxRSIM7
GxRSIM6
GxRSIM5
GxRSIM4
GxRSIM3
GxRSIM2
GxRSIM1
GxRSIM0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
GxRSIM7: COGx Rising Event Input Source 7 Mode bit
GxRIS7 = 1:
1 = NCO1_out low-to-high transition will cause a rising event after rising event phase delay
0 = NCO1_out high level will cause an immediate rising event
GxRIS7 = 0:
NCO1_out has no effect on rising event
bit 6
GxRSIM6: COGx Rising Event Input Source 6 Mode bit
GxRIS6 = 1:
1 = PWM3 output low-to-high transition will cause a rising event after rising event phase delay
0 = PWM3 output high level will cause an immediate rising event
GxRIS6 = 0:
PWM3 output has no effect on rising event
bit 5
GxRSIM5: COGx Rising Event Input Source 5 Mode bit
GxRIS5 = 1:
1 = CCP2 output low-to-high transition will cause a rising event after rising event phase delay
0 = CCP2 output high level will cause an immediate rising event
GxRIS5 = 0:
CCP2 output has no effect on rising event
bit 4
GxRSIM4: COGx Rising Event Input Source 4 Mode bit
GxRIS4 = 1:
1 = CCP1 low-to-high transition will cause a rising event after rising event phase delay
0 = CCP1 high level will cause an immediate rising event
GxRIS4 = 0:
CCP1 has no effect on rising event
bit 3
GxRSIM3: COGx Rising Event Input Source 3 Mode bit
GxRIS3 = 1:
1 = CLC1 output low-to-high transition will cause a rising event after rising event phase delay
0 = CLC1 output high level will cause an immediate rising event
GxRIS3 = 0:
CLC1 output has no effect on rising event
bit 2
GxRSIM2: COGx Rising Event Input Source 2 Mode bit
GxRIS2 = 1:
1 = Comparator 2 low-to-high transition will cause a rising event after rising event phase delay
0 = Comparator 2 high level will cause an immediate rising event
GxRIS2 = 0:
Comparator 2 has no effect on rising event
bit 1
GxRSIM1: COGx Rising Event Input Source 1 Mode bit
GxRIS1 = 1:
1 = Comparator 1 low-to-high transition will cause a rising event after rising event phase delay
0 = Comparator 1 high level will cause an immediate rising event
GxRIS1 = 0:
Comparator 1 has no effect on rising event
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PIC16(L)F1713/6
REGISTER 18-4:
bit 0
COGxRSIM: COG RISING EVENT SOURCE INPUT MODE REGISTER
GxRSIM0: COGx Rising Event Input Source 0 Mode bit
GxRIS0 = 1:
1 = Pin selected with COGxPPS control low-to-high transition will cause a rising event after rising event
phase delay
0 = Pin selected with COGxPPS control high level will cause an immediate rising event
GxRIS0 = 0:
Pin selected with COGxPPS control has no effect on rising event
DS40001726C-page 192
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REGISTER 18-5:
COGxFIS: COG FALLING EVENT INPUT SELECTION REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
GxFIS7
GxFIS6
GxFIS5
GxFIS4
GxFIS3
GxFIS2
GxFIS1
GxFIS0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
GxFIS7: COGx Falling Event Input Source 7 Enable bit
1 = NCO1_out is enabled as a falling event input
0 = NCO1_out has no effect on the falling event
bit 6
GxFIS6: COGx Falling Event Input Source 6 Enable bit
1 = PWM3 output is enabled as a falling event input
0 = PWM3 has no effect on the falling event
bit 5
GxFIS5: COGx Falling Event Input Source 5 Enable bit
1 = CCP2 output is enabled as a falling event input
0 = CCP2 output has no effect on the falling event
bit 4
GxFIS4: COGx Falling Event Input Source 4 Enable bit
1 = CCP1 is enabled as a falling event input
0 = CCP1 has no effect on the falling event
bit 3
GxFIS3: COGx Falling Event Input Source 3 Enable bit
1 = CLC1 output is enabled as a falling event input
0 = CLC1 output has no effect on the falling event
bit 2
GxFIS2: COGx Falling Event Input Source 2 Enable bit
1 = Comparator 2 output is enabled as a falling event input
0 = Comparator 2 output has no effect on the falling event
bit 1
GxFIS1: COGx Falling Event Input Source 1 Enable bit
1 = Comparator 1 output is enabled as a falling event input
0 = Comparator 1 output has no effect on the falling event
bit 0
GxFIS0: COGx Falling Event Input Source 0 Enable bit
1 = Pin selected with COGxPPS control register is enabled as falling event input
0 = Pin selected with COGxPPS control has no effect on the falling event
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
REGISTER 18-6:
COGxFSIM: COG FALLING EVENT SOURCE INPUT MODE REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
GxFSIM7
GxFSIM6
GxFSIM5
GxFSIM4
GxFSIM3
GxFSIM2
GxFSIM1
GxFSIM0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
GxFSIM7: COGx Falling Event Input Source 7 Mode bit
GxFIS7 = 1:
1 = NCO1_out high-to-low transition will cause a falling event after falling event phase delay
0 = NCO1_out low level will cause an immediate falling event
GxFIS7 = 0:
NCO1_out has no effect on falling event
bit 6
GxFSIM6: COGx Falling Event Input Source 6 Mode bit
GxFIS6 = 1:
1 = PWM3 output high-to-low transition will cause a falling event after falling event phase delay
0 = PWM3 output low level will cause an immediate falling event
GxFIS6 = 0:
PWM3 output has no effect on falling event
bit 5
GxFSIM5: COGx Falling Event Input Source 5 Mode bit
GxFIS5 = 1:
1 = CCP2 output high-to-low transition will cause a falling event after falling event phase delay
0 = CCP2 output low level will cause an immediate falling event
GxFIS5 = 0:
CCP2 output has no effect on falling event
bit 4
GxFSIM4: COGx Falling Event Input Source 4 Mode bit
GxFIS4 = 1:
1 = CCP1 high-to-low transition will cause a falling event after falling event phase delay
0 = CCP1 low level will cause an immediate falling event
GxFIS4 = 0:
CCP1 has no effect on falling event
bit 3
GxFSIM3: COGx Falling Event Input Source 3 Mode bit
GxFIS3 = 1:
1 = CLC1 output high-to-low transition will cause a falling event after falling event phase delay
0 = CLC1 output low level will cause an immediate falling event
GxFIS3 = 0:
CLC1 output has no effect on falling event
bit 2
GxFSIM2: COGx Falling Event Input Source 2 Mode bit
GxFIS2 = 1:
1 = Comparator 2 high-to-low transition will cause a falling event after falling event phase delay
0 = Comparator 2 low level will cause an immediate falling event
GxFIS2 = 0:
Comparator 2 has no effect on falling event
bit 1
GxFSIM1: COGx Falling Event Input Source 1 Mode bit
GxFIS1 = 1:
1 = Comparator 1 high-to-low transition will cause a falling event after falling event phase delay
0 = Comparator 1 low level will cause an immediate falling event
GxFIS1 = 0:
Comparator 1 has no effect on falling event
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REGISTER 18-6:
bit 0
COGxFSIM: COG FALLING EVENT SOURCE INPUT MODE REGISTER
GxFSIM0: COGx Falling Event Input Source 0 Mode bit
GxFIS0 = 1:
1 = Pin selected with COGxPPS control high-to-low transition will cause a falling event after falling event
phase delay
0 = Pin selected with COGxPPS control low level will cause an immediate falling event
GxFIS0 = 0:
Pin selected with COGxPPS control has no effect on falling event
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REGISTER 18-7:
COGxASD0: COG AUTO-SHUTDOWN CONTROL REGISTER 0
R/W-0/0
R/W-0/0
GxASE
GxARSEN
R/W-0/0
R/W-0/0
GxASDBD<1:0>
R/W-0/0
R/W-0/0
GxASDAC<1:0>
U-0
U-0
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
GxASE: Auto-Shutdown Event Status bit
1 = COG is in the shutdown state
0 = COG is either not in the shutdown state or will exit the shutdown state on the next rising event
bit 6
GxARSEN: Auto-Restart Enable bit
1 = Auto-restart is enabled
0 = Auto-restart is disabled
bit 5-4
GxASDBD<1:0>: COGxB and COGxD Auto-shutdown Override Level Select bits
11 = A logic ‘1’ is placed on COGxB and COGxD when shutdown is active
10 = A logic ‘0’ is placed on COGxB and COGxD when shutdown is active
01 = COGxB and COGxD are tri-stated when shutdown is active
00 = The inactive state of the pin, including polarity, is placed on COGxB and COGxD when shutdown
is active
bit 3-2
GxASDAC<1:0>: COGxA and COGxC Auto-shutdown Override Level Select bits
11 = A logic ‘1’ is placed on COGxA and COGxC when shutdown is active
10 = A logic ‘0’ is placed on COGxA and COGxC when shutdown is active
01 = COGxA and COGxC are tri-stated when shutdown is active
00 = The inactive state of the pin, including polarity, is placed on COGxA and COGxC when shutdown
is active
bit 1-0
Unimplemented: Read as ‘0’
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PIC16(L)F1713/6
REGISTER 18-8:
COGxASD1: COG AUTO-SHUTDOWN CONTROL REGISTER 1
U-0
U-0
U-0
U-0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
—
—
—
—
GxAS3E
GxAS2E
GxAS1E
GxAS0E
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7-4
Unimplemented: Read as ‘0’
bit 3
GxAS3E: COGx Auto-shutdown Source Enable bit 3
1 = COGx is shutdown when CLC2 output is low
0 = CLC2 output has no effect on shutdown
bit 2
GxAS2E: COGx Auto-shutdown Source Enable bit 2
1 = COGx is shutdown when Comparator 2 output is low
0 = Comparator 2 output has no effect on shutdown
bit 1
GxAS1E: COGx Auto-shutdown Source Enable bit 1
1 = COGx is shutdown when Comparator 1 output is low
0 = Comparator 1 output has no effect on shutdown
bit 0
GxAS0E: COGx Auto-shutdown Source Enable bit 0
1 = COGx is shutdown when Pin selected with COGxPPS control is low
0 = Pin selected with COGxPPS control has no effect on shutdown
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REGISTER 18-9:
COGxSTR: COG STEERING CONTROL REGISTER 1
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
GxDATD
GxDATC
GxDATB
GxDATA
GxSTRD
GxSTRC
GxSTRB
GxSTRA
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
GxSDATD: COGxD Static Output Data bit
1 = COGxD static data is high
0 = COGxD static data is low
bit 6
GxSDATC: COGxC Static Output Data bit
1 = COGxC static data is high
0 = COGxC static data is low
bit 5
GxSDATB: COGxB Static Output Data bit
1 = COGxB static data is high
0 = COGxB static data is low
bit 4
GxSDATA: COGxA Static Output Data bit
1 = COGxA static data is high
0 = COGxA static data is low
bit 3
GxSTRD: COGxD Steering Control bit
1 = COGxD output has the COGxD waveform with polarity control from GxPOLD bit
0 = COGxD output is the static data level determined by the GxSDATD bit
bit 2
GxSTRC: COGxC Steering Control bit
1 = COGxC output has the COGxC waveform with polarity control from GxPOLC bit
0 = COGxC output is the static data level determined by the GxSDATC bit
bit 1
GxSTRB: COGxB Steering Control bit
1 = COGxB output has the COGxB waveform with polarity control from GxPOLB bit
0 = COGxB output is the static data level determined by the GxSDATB bit
bit 0
GxSTRA: COGxA Steering Control bit
1 = COGxA output has the COGxA waveform with polarity control from GxPOLA bit
0 = COGxA output is the static data level determined by the GxSDATA bit
DS40001726C-page 198
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REGISTER 18-10: COGxDBR: COG RISING EVENT DEAD-BAND COUNT REGISTER
U-0
U-0
—
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
GxDBR<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
GxDBR<5:0>: Rising Event Dead-band Count Value bits
GxRDBS = 0:
= Number of COGx clock periods to delay primary output after rising event
GxRDBS = 1:
= Number of delay chain element periods to delay primary output after rising event
REGISTER 18-11: COGxDBF: COG FALLING EVENT DEAD-BAND COUNT REGISTER
U-0
U-0
—
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
GxDBF<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
GxDBF<5:0>: Falling Event Dead-band Count Value bits
GxFDBS = 0:
= Number of COGx clock periods to delay complementary output after falling event input
GxFDBS = 1:
= Number of delay chain element periods to delay complementary output after falling event input
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REGISTER 18-12: COGxBLKR: COG RISING EVENT BLANKING COUNT REGISTER
U-0
U-0
—
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
GxBLKR<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
GxBLKR<5:0>: Rising Event Blanking Count Value bits
= Number of COGx clock periods to inhibit falling event inputs
REGISTER 18-13: COGxBLKF: COG FALLING EVENT BLANKING COUNT REGISTER
U-0
U-0
—
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
GxBLKF<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
GxBLKF<5:0>: Falling Event Blanking Count Value bits
= Number of COGx clock periods to inhibit rising event inputs
DS40001726C-page 200
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REGISTER 18-14: COGxPHR: COG RISING EDGE PHASE DELAY COUNT REGISTER
U-0
U-0
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
GxPHR<5:0>
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
GxPHR<5:0>: Rising Edge Phase Delay Count Value bits
= Number of COGx clock periods to delay rising edge event
REGISTER 18-15: COGxPHF: COG FALLING EDGE PHASE DELAY COUNT REGISTER
U-0
U-0
—
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
GxPHF<5:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
GxPHF<5:0>: Falling Edge Phase Delay Count Value bits
= Number of COGx clock periods to delay falling edge event
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TABLE 18-2:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH COG
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
120
ANSELA
—
—
ANSA5
ANSA4
ANSA3
ANSA2
ANSA1
ANSA0
ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
COG1PHR
—
—
G1PHR<5:0>
201
COG1PHF
—
—
G1PHF<5:0>
201
COG1BLKR
—
—
G1BLKR<5:0>
200
COG1BLKF
—
—
G1BLKF<5:0>
200
COG1DBR
—
—
G1DBR<5:0>
199
COG1DBF
—
—
G1DBF<5:0>
COG1RIS
G1RIS7
G1RIS6
G1RIS5
G1RIS4
G1RIS3
G1RIS2
G1RIS1
G1RIS0
190
G1RSIM7
G1RSIM6
G1RSIM5
G1RSIM4
G1RSIM3
G1RSIM2
G1RSIM1
G1RSIM0
191
193
COG1RSIM
COG1FIS
199
G1FIS7
G1FIS6
G1FIS5
G1FIS4
G1FIS3
G1FIS2
G1FIS1
G1FIS0
COG1FSIM
G1FSIM7
G1FSIM6
G1FSIM5
G1FSIM4
G1FSIM3
G1FSIM2
G1FSIM1
G1FSIM0
COG1CON0
G1EN
G1LD
—
COG1CON1
G1RDBS
G1FDBS
—
COG1ASD0
G1ASE
G1ARSEN
G1CS<1:0>
—
G1ASDBD<1:0>
G1MD<2:0>
G1POLD
G1POLC
G1ASDAC<1:0>
194
188
G1POLB
G1POLA
189
—
—
196
COG1ASD1
—
—
—
—
G1AS3E
G1AS2E
G1AS1E
G1AS0E
197
COG1STR
G1SDATD
G1SDATC
G1SDATB
G1SDATA
G1STRD
G1STRC
G1STRB
G1STRA
198
GIE
PEIE
T0IE
INTE
IOCIE
T0IF
INTF
IOCIF
—
—
—
PIE2
OSFIE
C2IE
C1IE
—
BCL1IE
TMR6IE
TMR4IE
CCP2IE
85
PIR2
OSFIF
C2IF
C1IF
—
BCL1IF
TMR6IF
TMR4IF
CCP2IF
88
—
—
—
INTCON
COG1PPS
RxyPPS
Legend:
COG1PPS<4:0>
83
136
RxyPPS<4:0>
137
x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by COG.
DS40001726C-page 202
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19.0
CONFIGURABLE LOGIC CELL
(CLC)
The Configurable Logic Cell (CLCx) provides programmable logic that operates outside the speed limitations
of software execution. The logic cell takes up to 32
input signals and, through the use of configurable
gates, reduces the 32 inputs to four logic lines that drive
one of eight selectable single-output logic functions.
Input sources are a combination of the following:
•
•
•
•
I/O pins
Internal clocks
Peripherals
Register bits
The output can be directed internally to peripherals and
to an output pin.
FIGURE 19-1:
Refer to Figure 19-1 for a simplified diagram showing
signal flow through the CLCx.
Possible configurations include:
• Combinatorial Logic
- AND
- NAND
- AND-OR
- AND-OR-INVERT
- OR-XOR
- OR-XNOR
• Latches
- S-R
- Clocked D with Set and Reset
- Transparent D with Set and Reset
- Clocked J-K with Reset
CLCx SIMPLIFIED BLOCK DIAGRAM
D
Q
LCxOUT
MLCxOUT
Q1
.
.
.
LCx_in[29]
LCx_in[30]
LCx_in[31]
to Peripherals
Input Data Selection Gates(1)
LCx_in[0]
LCx_in[1]
LCx_in[2]
LCxEN
lcxg1
lcxg2
lcxg3
Logic
Function
LCx_out
lcxq
(2)
PPS
Module
CLCxOUT
lcxg4
LCxPOL
LCxMODE<2:0>
Interrupt
det
LCXINTP
LCXINTN
set bit
CLCxIF
Interrupt
det
Note 1:
2:
See Figure 19-2: Input Data Selection and Gating.
See Figure 19-3: Programmable Logic Functions.
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19.1
CLCx Setup
Programming the CLCx module is performed by configuring the four stages in the logic signal flow. The four
stages are:
•
•
•
•
Data selection
Data gating
Logic function selection
Output polarity
Each stage is setup at run time by writing to the corresponding CLCx Special Function Registers. This has
the added advantage of permitting logic reconfiguration
on-the-fly during program execution.
19.1.1
DATA SELECTION
There are 32 signals available as inputs to the configurable logic. Four 32-input multiplexers are used to
select the inputs to pass on to the next stage.
TABLE 19-1:
Data Input
CLCx DATA INPUT SELECTION
lcxdy
DxS
CLCx
LCx_in[31] 11111 FOSC
LCx_in[30] 11110 HFINTOSC
LCx_in[29] 11101 LFINTOSC
LCx_in[28] 11100 ADCRC
LCx_in[27] 11011 IOCIF set signal
LCx_in[26] 11010 T2_match
LCx_in[25] 11001 T1_overflow
LCx_in[24] 11000 T0_overflow
LCx_in[23] 10111 T6_match
LCx_in[22] 10110 T4_match
LCx_in[21] 10101 DT from EUSART
LCx_in[20] 10100 TX/CK from EUSART
Data selection is through four multiplexers as indicated
on the left side of Figure 19-2. Data inputs in the figure
are identified by a generic numbered input name.
LCx_in[19] 10011 ZCDx_out from Zero-Cross Detect
Table 19-1 correlates the generic input name to the
actual signal for each CLC module. The column labeled
lcxdy indicates the MUX selection code for the selected
data input. DxS is an abbreviation for the MUX select
input codes: LCxD1S<4:0> through LCxD4S<4:0>.
LCx_in[16] 10000 SCK from MSSP
Data inputs are selected with CLCxSEL0 through
CLCxSEL3
registers
(Register 19-3
through
Register 19-6).
LCx_in[12] 01100 CCP1 output
Note:
Data selections are undefined at power-up.
DS40001726C-page 204
LCx_in[18] 10010 NCO1_out
LCx_in[17] 10001 SDO/SDA from MSSP
LCx_in[15] 01111 PWM4_out
LCx_in[14] 01110 PWM3_out
LCx_in[13] 01101 CCP2 output
LCx_in[11] 01011 COG1B
LCx_in[10] 01010 COG1A
LCx_in[9]
01001 sync_C2OUT
LCx_in[8]
01000 sync_C1OUT
LCx_in[7]
00111 LC4_out from the CLC4
LCx_in[6]
00110 LC3_out from the CLC3
LCx_in[5]
00101 LC2_out from the CLC2
LCx_in[4]
00100 LC1_out from the CLC1
LCx_in[3]
00011 CLCIN3 pin input selected in
CLCIN3PPS register
LCx_in[2]
00010 CLCIN2 pin input selected in
CLCIN2PPS register
LCx_in[1]
00001 CLCIN1 pin input selected in
CLCIN1PPS register
LCx_in[0]
00000 CLCIN0 pin input selected in
CLCIN0PPS register
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PIC16(L)F1713/6
19.1.2
DATA GATING
Outputs from the input multiplexers are directed to the
desired logic function input through the data gating
stage. Each data gate can direct any combination of the
four selected inputs.
Note:
Data gating is undefined at power-up.
The gate stage is more than just signal direction. The
gate can be configured to direct each input signal as
inverted or non-inverted data. Directed signals are
ANDed together in each gate. The output of each gate
can be inverted before going on to the logic function
stage.
The gating is in essence a 1-to-4 input
AND/NAND/OR/NOR gate. When every input is
inverted and the output is inverted, the gate is an OR of
all enabled data inputs. When the inputs and output are
not inverted, the gate is an AND or all enabled inputs.
Table 19-2 summarizes the basic logic that can be
obtained in gate 1 by using the gate logic select bits.
The table shows the logic of four input variables, but
each gate can be configured to use less than four. If
no inputs are selected, the output will be zero or one,
depending on the gate output polarity bit.
TABLE 19-2:
DATA GATING LOGIC
CLCxGLS0
LCxG1POL
Gate Logic
0x55
1
AND
0x55
0
NAND
0xAA
1
NOR
0xAA
0
OR
0x00
0
Logic 0
0x00
1
Logic 1
Data gating is indicated in the right side of Figure 19-2.
Only one gate is shown in detail. The remaining three
gates are configured identically with the exception that
the data enables correspond to the enables for that
gate.
19.1.3
LOGIC FUNCTION
There are eight available logic functions including:
•
•
•
•
•
•
•
•
AND-OR
OR-XOR
AND
S-R Latch
D Flip-Flop with Set and Reset
D Flip-Flop with Reset
J-K Flip-Flop with Reset
Transparent Latch with Set and Reset
Logic functions are shown in Figure 19-3. Each logic
function has four inputs and one output. The four inputs
are the four data gate outputs of the previous stage.
The output is fed to the inversion stage and from there
to other peripherals, an output pin, and back to the
CLCx itself.
19.1.4
OUTPUT POLARITY
The last stage in the configurable logic cell is the output
polarity. Setting the LCxPOL bit of the CLCxCON register inverts the output signal from the logic stage.
Changing the polarity while the interrupts are enabled
will cause an interrupt for the resulting output transition.
It is possible (but not recommended) to select both the
true and negated values of an input. When this is done,
the gate output is zero, regardless of the other inputs,
but may emit logic glitches (transient-induced pulses).
If the output of the channel must be zero or one, the
recommended method is to set all gate bits to zero and
use the gate polarity bit to set the desired level.
Data gating is configured with the logic gate select
registers as follows:
•
•
•
•
Gate 1: CLCxGLS0 (Register 19-7)
Gate 2: CLCxGLS1 (Register 19-8)
Gate 3: CLCxGLS2 (Register 19-9)
Gate 4: CLCxGLS3 (Register 19-10)
Register number suffixes are different than the gate
numbers because other variations of this module have
multiple gate selections in the same register.
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19.1.5
CLCx SETUP STEPS
The following steps should be followed when setting up
the CLCx:
• Disable CLCx by clearing the LCxEN bit.
• Select desired inputs using CLCxSEL0 through
CLCxSEL3 registers (See Table 19-1).
• Clear any associated ANSEL bits.
• Set all TRIS bits associated with inputs.
• Clear all TRIS bits associated with outputs.
• Enable the chosen inputs through the four gates
using CLCxGLS0, CLCxGLS1, CLCxGLS2, and
CLCxGLS3 registers.
• Select the gate output polarities with the
LCxPOLy bits of the CLCxPOL register.
• Select the desired logic function with the
LCxMODE<2:0> bits of the CLCxCON register.
• Select the desired polarity of the logic output with
the LCxPOL bit of the CLCxPOL register. (This
step may be combined with the previous gate output polarity step).
• If driving a device pin, set the desired pin PPS
control register and also clear the TRIS bit
corresponding to that output.
• If interrupts are desired, configure the following
bits:
- Set the LCxINTP bit in the CLCxCON register
for rising event.
- Set the LCxINTN bit in the CLCxCON
register for falling event.
- Set the CLCxIE bit of the associated PIE
registers.
- Set the GIE and PEIE bits of the INTCON
register.
• Enable the CLCx by setting the LCxEN bit of the
CLCxCON register.
19.2
CLCx Interrupts
An interrupt will be generated upon a change in the
output value of the CLCx when the appropriate interrupt
enables are set. A rising edge detector and a falling
edge detector are present in each CLC for this purpose.
The CLCxIF bit of the associated PIR registers will be
set when either edge detector is triggered and its associated enable bit is set. The LCxINTP enables rising
edge interrupts and the LCxINTN bit enables falling
edge interrupts. Both are located in the CLCxCON
register.
To fully enable the interrupt, set the following bits:
• LCxON bit of the CLCxCON register
• CLCxIE bit of the associated PIE registers
• LCxINTP bit of the CLCxCON register (for a rising
edge detection)
• LCxINTN bit of the CLCxCON register (for a
falling edge detection)
• PEIE and GIE bits of the INTCON register
The CLCxIF bit of the associated PIR registers, must
be cleared in software as part of the interrupt service. If
another edge is detected while this flag is being
cleared, the flag will still be set at the end of the
sequence.
19.3
Output Mirror Copies
Mirror copies of all LCxCON output bits are contained
in the CLCxDATA register. Reading this register reads
the outputs of all CLCs simultaneously. This prevents
any reading skew introduced by testing or reading the
CLCxOUT bits in the individual CLCxCON registers.
19.4
Effects of a Reset
The CLCxCON register is cleared to zero as the result
of a Reset. All other selection and gating values remain
unchanged.
19.5
Operation During Sleep
The CLC module operates independently from the
system clock and will continue to run during Sleep,
provided that the input sources selected remain active.
The HFINTOSC remains active during Sleep when the
CLC module is enabled and the HFINTOSC is
selected as an input source, regardless of the system
clock source selected.
In other words, if the HFINTOSC is simultaneously
selected as the system clock and as a CLC input
source, when the CLC is enabled, the CPU will go idle
during Sleep, but the CLC will continue to operate and
the HFINTOSC will remain active.
This will have a direct effect on the Sleep mode current.
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FIGURE 19-2:
LCx_in[0]
INPUT DATA SELECTION AND GATING
Data Selection
00000
Data GATE 1
LCx_in[31]
lcxd1T
LCxD1G1T
lcxd1N
LCxD1G1N
11111
LCxD2G1T
LCxD1S<4:0>
LCxD2G1N
LCx_in[0]
lcxg1
00000
LCxD3G1T
lcxd2T
LCxG1POL
LCxD3G1N
lcxd2N
LCx_in[31]
LCxD4G1T
11111
LCxD2S<4:0>
LCx_in[0]
LCxD4G1N
00000
Data GATE 2
lcxg2
lcxd3T
(Same as Data GATE 1)
lcxd3N
LCx_in[31]
Data GATE 3
11111
lcxg3
LCxD3S<4:0>
LCx_in[0]
(Same as Data GATE 1)
Data GATE 4
00000
lcxg4
lcxd4T
(Same as Data GATE 1)
lcxd4N
LCx_in[31]
11111
LCxD4S<4:0>
Note:
All controls are undefined at power-up.
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FIGURE 19-3:
PROGRAMMABLE LOGIC FUNCTIONS
AND - OR
OR - XOR
lcxg1
lcxg1
lcxg2
lcxq
lcxg3
lcxg4
lcxg2
lcxq
lcxg3
lcxg4
LCxMODE<2:0>= 000
LCxMODE<2:0>= 001
4-Input AND
S-R Latch
lcxg1
lcxg1
lcxg2
lcxg2
lcxq
lcxg3
S
lcxg3
lcxg4
R
lcxg4
LCxMODE<2:0>= 010
lcxq
Q
LCxMODE<2:0>= 011
1-Input D Flip-Flop with S and R
2-Input D Flip-Flop with R
lcxg4
lcxg2
D
S
lcxg4
Q
lcxq
D
lcxg2
lcxg1
lcxg1
Q
lcxq
R
R
lcxg3
lcxg3
LCxMODE<2:0>= 100
LCxMODE<2:0>= 101
J-K Flip-Flop with R
1-Input Transparent Latch with S and R
lcxg4
lcxg2
J
Q
lcxg1
lcxg4
K
R
lcxq
lcxg2
D
lcxg1
LE
lcxg3
S
Q
lcxq
R
lcxg3
LCxMODE<2:0>= 110
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LCxMODE<2:0>= 111
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19.6
Register Definitions: CLC Control
REGISTER 19-1:
CLCxCON: CONFIGURABLE LOGIC CELL CONTROL REGISTER
R/W-0/0
U-0
R-0/0
R/W-0/0
R/W-0/0
LCxEN
—
LCxOUT
LCxINTP
LCxINTN
R/W-0/0
R/W-0/0
R/W-0/0
LCxMODE<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
LCxEN: Configurable Logic Cell Enable bit
1 = Configurable logic cell is enabled and mixing input signals
0 = Configurable logic cell is disabled and has logic zero output
bit 6
Unimplemented: Read as ‘0’
bit 5
LCxOUT: Configurable Logic Cell Data Output bit
Read-only: logic cell output data, after LCxPOL; sampled from LCx_out wire.
bit 4
LCxINTP: Configurable Logic Cell Positive Edge Going Interrupt Enable bit
1 = CLCxIF will be set when a rising edge occurs on LCx_out
0 = CLCxIF will not be set
bit 3
LCxINTN: Configurable Logic Cell Negative Edge Going Interrupt Enable bit
1 = CLCxIF will be set when a falling edge occurs on LCx_out
0 = CLCxIF will not be set
bit 2-0
LCxMODE<2:0>: Configurable Logic Cell Functional Mode bits
111 = Cell is 1-input transparent latch with S and R
110 = Cell is J-K flip-flop with R
101 = Cell is 2-input D flip-flop with R
100 = Cell is 1-input D flip-flop with S and R
011 = Cell is S-R latch
010 = Cell is 4-input AND
001 = Cell is OR-XOR
000 = Cell is AND-OR
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REGISTER 19-2:
CLCxPOL: SIGNAL POLARITY CONTROL REGISTER
R/W-0/0
U-0
U-0
U-0
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LCxPOL
—
—
—
LCxG4POL
LCxG3POL
LCxG2POL
LCxG1POL
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
LCxPOL: LCOUT Polarity Control bit
1 = The output of the logic cell is inverted
0 = The output of the logic cell is not inverted
bit 6-4
Unimplemented: Read as ‘0’
bit 3
LCxG4POL: Gate 4 Output Polarity Control bit
1 = The output of gate 4 is inverted when applied to the logic cell
0 = The output of gate 4 is not inverted
bit 2
LCxG3POL: Gate 3 Output Polarity Control bit
1 = The output of gate 3 is inverted when applied to the logic cell
0 = The output of gate 3 is not inverted
bit 1
LCxG2POL: Gate 2 Output Polarity Control bit
1 = The output of gate 2 is inverted when applied to the logic cell
0 = The output of gate 2 is not inverted
bit 0
LCxG1POL: Gate 1 Output Polarity Control bit
1 = The output of gate 1 is inverted when applied to the logic cell
0 = The output of gate 1 is not inverted
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REGISTER 19-3:
CLCxSEL0: GENERIC CLCx DATA 1 SELECT REGISTER
U-0
U-0
U-0
—
—
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LCxD1S<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
LCxD1S<4:0>: CLCx Data1 Input Selection bits
See Table 19-1.
REGISTER 19-4:
CLCxSEL1: GENERIC CLCx DATA 2 SELECT REGISTER
U-0
U-0
U-0
—
—
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LCxD2S<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
LCxD2S<4:0>: CLCx Data 2 Input Selection bits
See Table 19-1.
REGISTER 19-5:
CLCxSEL2: GENERIC CLCx DATA 3 SELECT REGISTER
U-0
U-0
U-0
—
—
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LCxD3S<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
LCxD3S<4:0>: CLCx Data 3 Input Selection bits
See Table 19-1.
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REGISTER 19-6:
CLCxSEL3: GENERIC CLCx DATA 4 SELECT REGISTER
U-0
U-0
U-0
—
—
—
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LCxD4S<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
LCxD4S<4:0>: CLCx Data 4 Input Selection bits
See Table 19-1.
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REGISTER 19-7:
CLCxGLS0: GATE 1 LOGIC SELECT REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LCxG1D4T
LCxG1D4N
LCxG1D3T
LCxG1D3N
LCxG1D2T
LCxG1D2N
LCxG1D1T
LCxG1D1N
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
LCxG1D4T: Gate 1 Data 4 True (non-inverted) bit
1 = lcxd4T is gated into lcxg1
0 = lcxd4T is not gated into lcxg1
bit 6
LCxG1D4N: Gate 1 Data 4 Negated (inverted) bit
1 = lcxd4N is gated into lcxg1
0 = lcxd4N is not gated into lcxg1
bit 5
LCxG1D3T: Gate 1 Data 3 True (non-inverted) bit
1 = lcxd3T is gated into lcxg1
0 = lcxd3T is not gated into lcxg1
bit 4
LCxG1D3N: Gate 1 Data 3 Negated (inverted) bit
1 = lcxd3N is gated into lcxg1
0 = lcxd3N is not gated into lcxg1
bit 3
LCxG1D2T: Gate 1 Data 2 True (non-inverted) bit
1 = lcxd2T is gated into lcxg1
0 = lcxd2T is not gated into lcxg1
bit 2
LCxG1D2N: Gate 1 Data 2 Negated (inverted) bit
1 = lcxd2N is gated into lcxg1
0 = lcxd2N is not gated into lcxg1
bit 1
LCxG1D1T: Gate 1 Data 1 True (non-inverted) bit
1 = lcxd1T is gated into lcxg1
0 = lcxd1T is not gated into lcxg1
bit 0
LCxG1D1N: Gate 1 Data 1 Negated (inverted) bit
1 = lcxd1N is gated into lcxg1
0 = lcxd1N is not gated into lcxg1
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REGISTER 19-8:
CLCxGLS1: GATE 2 LOGIC SELECT REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LCxG2D4T
LCxG2D4N
LCxG2D3T
LCxG2D3N
LCxG2D2T
LCxG2D2N
LCxG2D1T
LCxG2D1N
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
LCxG2D4T: Gate 2 Data 4 True (non-inverted) bit
1 = lcxd4T is gated into lcxg2
0 = lcxd4T is not gated into lcxg2
bit 6
LCxG2D4N: Gate 2 Data 4 Negated (inverted) bit
1 = lcxd4N is gated into lcxg2
0 = lcxd4N is not gated into lcxg2
bit 5
LCxG2D3T: Gate 2 Data 3 True (non-inverted) bit
1 = lcxd3T is gated into lcxg2
0 = lcxd3T is not gated into lcxg2
bit 4
LCxG2D3N: Gate 2 Data 3 Negated (inverted) bit
1 = lcxd3N is gated into lcxg2
0 = lcxd3N is not gated into lcxg2
bit 3
LCxG2D2T: Gate 2 Data 2 True (non-inverted) bit
1 = lcxd2T is gated into lcxg2
0 = lcxd2T is not gated into lcxg2
bit 2
LCxG2D2N: Gate 2 Data 2 Negated (inverted) bit
1 = lcxd2N is gated into lcxg2
0 = lcxd2N is not gated into lcxg2
bit 1
LCxG2D1T: Gate 2 Data 1 True (non-inverted) bit
1 = lcxd1T is gated into lcxg2
0 = lcxd1T is not gated into lcxg2
bit 0
LCxG2D1N: Gate 2 Data 1 Negated (inverted) bit
1 = lcxd1N is gated into lcxg2
0 = lcxd1N is not gated into lcxg2
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REGISTER 19-9:
CLCxGLS2: GATE 3 LOGIC SELECT REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LCxG3D4T
LCxG3D4N
LCxG3D3T
LCxG3D3N
LCxG3D2T
LCxG3D2N
LCxG3D1T
LCxG3D1N
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
LCxG3D4T: Gate 3 Data 4 True (non-inverted) bit
1 = lcxd4T is gated into lcxg3
0 = lcxd4T is not gated into lcxg3
bit 6
LCxG3D4N: Gate 3 Data 4 Negated (inverted) bit
1 = lcxd4N is gated into lcxg3
0 = lcxd4N is not gated into lcxg3
bit 5
LCxG3D3T: Gate 3 Data 3 True (non-inverted) bit
1 = lcxd3T is gated into lcxg3
0 = lcxd3T is not gated into lcxg3
bit 4
LCxG3D3N: Gate 3 Data 3 Negated (inverted) bit
1 = lcxd3N is gated into lcxg3
0 = lcxd3N is not gated into lcxg3
bit 3
LCxG3D2T: Gate 3 Data 2 True (non-inverted) bit
1 = lcxd2T is gated into lcxg3
0 = lcxd2T is not gated into lcxg3
bit 2
LCxG3D2N: Gate 3 Data 2 Negated (inverted) bit
1 = lcxd2N is gated into lcxg3
0 = lcxd2N is not gated into lcxg3
bit 1
LCxG3D1T: Gate 3 Data 1 True (non-inverted) bit
1 = lcxd1T is gated into lcxg3
0 = lcxd1T is not gated into lcxg3
bit 0
LCxG3D1N: Gate 3 Data 1 Negated (inverted) bit
1 = lcxd1N is gated into lcxg3
0 = lcxd1N is not gated into lcxg3
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REGISTER 19-10: CLCxGLS3: GATE 4 LOGIC SELECT REGISTER
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
LCxG4D4T
LCxG4D4N
LCxG4D3T
LCxG4D3N
LCxG4D2T
LCxG4D2N
LCxG4D1T
LCxG4D1N
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
LCxG4D4T: Gate 4 Data 4 True (non-inverted) bit
1 = lcxd4T is gated into lcxg4
0 = lcxd4T is not gated into lcxg4
bit 6
LCxG4D4N: Gate 4 Data 4 Negated (inverted) bit
1 = lcxd4N is gated into lcxg4
0 = lcxd4N is not gated into lcxg4
bit 5
LCxG4D3T: Gate 4 Data 3 True (non-inverted) bit
1 = lcxd3T is gated into lcxg4
0 = lcxd3T is not gated into lcxg4
bit 4
LCxG4D3N: Gate 4 Data 3 Negated (inverted) bit
1 = lcxd3N is gated into lcxg4
0 = lcxd3N is not gated into lcxg4
bit 3
LCxG4D2T: Gate 4 Data 2 True (non-inverted) bit
1 = lcxd2T is gated into lcxg4
0 = lcxd2T is not gated into lcxg4
bit 2
LCxG4D2N: Gate 4 Data 2 Negated (inverted) bit
1 = lcxd2N is gated into lcxg4
0 = lcxd2N is not gated into lcxg4
bit 1
LCxG4D1T: Gate 4 Data 1 True (non-inverted) bit
1 = lcxd1T is gated into lcxg4
0 = lcxd1T is not gated into lcxg4
bit 0
LCxG4D1N: Gate 4 Data 1 Negated (inverted) bit
1 = lcxd1N is gated into lcxg4
0 = lcxd1N is not gated into lcxg4
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REGISTER 19-11: CLCDATA: CLC DATA OUTPUT
U-0
U-0
U-0
U-0
R-0
R-0
R-0
R-0
—
—
—
—
MCL4OUT
MLC3OUT
MLC2OUT
MLC1OUT
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3
MCL4OUT: Mirror copy of LC4OUT bit
bit 2
MLC3OUT: Mirror copy of LC3OUT bit
bit 1
MLC2OUT: Mirror copy of LC2OUT bit
bit 0
MLC1OUT: Mirror copy of LC1OUT bit
 2013-2016 Microchip Technology Inc.
DS40001726C-page 217
PIC16(L)F1713/6
TABLE 19-3:
Name
ANSELA
SUMMARY OF REGISTERS ASSOCIATED WITH CLCx
Bit7
Bit6
Bit5
Bit4
—
—
ANSA5
ANSA4
ANSB4
Bit2
Bit1
Bit0
Register
on Page
ANSA3
ANSA2
ANSA1
ANSA0
120
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSC2
—
—
BIt3
ANSELB
—
—
ANSB5
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
CLC1CON
LC1EN
—
LC1OUT
LC1INTP
LC1INTN
LC1MODE<2:0>
209
CLC2CON
LC2EN
—
LC2OUT
LC2INTP
LC2INTN
LC2MODE<2:0>
209
CLC3CON
LC3EN
—
LC3OUT
LC3INTP
LC3INTN
CLCDATA
—
—
—
—
MCL4OUT
MLC3OUT
MLC2OUT
MLC1OUT
217
CLC1GLS0
LC1G1D4T
LC1G1D4N
LC1G1D3T
LC1G1D3N
LC1G1D2T
LC1G1D2N
LC1G1D1T
LC1G1D1N
213
CLC1GLS1
LC1G2D4T
LC1G2D4N
LC1G2D3T
LC1G2D3N
LC1G2D2T
LC1G2D2N
LC1G2D1T
LC1G2D1N
214
CLC1GLS2
LC1G3D4T
LC1G3D4N
LC1G3D3T
LC1G3D3N
LC1G3D2T
LC1G3D2N
LC1G3D1T
LC1G3D1N
215
CLC1GLS3
LC1G4D4T
LC1G4D4N
LC1G4D3T
LC1G4D3N
LC1G4D2T
LC1G4D2N
LC1G4D1T
LC1G4D1N
216
CLC1POL
LC1POL
—
—
—
LC1G4POL
LC1G3POL
LC1G2POL
LC1G1POL
CLC1SEL0
—
—
—
LC1D1S<4:0>
210
CLC1SEL1
—
—
—
LC1D2S<4:0>
211
CLC1SEL2
—
—
—
LC1D3S<4:0>
211
CLC1SEL3
—
—
—
LC1D4S<4:0>
212
CLC2GLS0
LC2G1D4T
LC2G1D4N
LC2G1D3T
LC2G1D3N
LC2G1D2T
LC2G1D2N
LC2G1D1T
LC2G1D1N
213
CLC2GLS1
LC2G2D4T
LC2G2D4N
LC2G2D3T
LC2G2D3N
LC2G2D2T
LC2G2D2N
LC2G2D1T
LC2G2D1N
214
CLC2GLS2
LC2G3D4T
LC2G3D4N
LC2G3D3T
LC2G3D3N
LC2G3D2T
LC2G3D2N
LC2G3D1T
LC2G3D1N
215
CLC2GLS3
LC2G4D4T
LC2G4D4N
LC2G4D3T
LC2G4D3N
LC2G4D2T
LC2G4D2N
LC2G4D1T
LC2G4D1N
216
CLC2POL
LC2POL
—
—
—
LC2G4POL
LC2G3POL
LC2G2POL
LC2G1POL
210
CLC2SEL0
—
—
—
LC2D1S<4:0>
211
CLC2SEL1
—
—
—
LC2D2S<4:0>
211
CLC2SEL2
—
—
—
LC2D3S<4:0>
211
CLC2SEL3
—
—
—
LC2D4S<4:0>
212
CLC3GLS0
LC3G1D4T
LC3G1D4N
LC3G1D3T
LC3G1D3N
LC3G1D2T
LC3G1D2N
LC3G1D1T
LC3G1D1N
213
CLC3GLS1
LC3G2D4T
LC3G2D4N
LC3G2D3T
LC3G2D3N
LC3G2D2T
LC3G2D2N
LC3G2D1T
LC3G2D1N
214
CLC3GLS2
LC3G3D4T
LC3G3D4N
LC3G3D3T
LC3G3D3N
LC3G3D2T
LC3G3D2N
LC3G3D1T
LC3G3D1N
215
CLC3GLS3
LC3G4D4T
LC3G4D4N
LC3G4D3T
LC3G4D3N
LC3G4D2T
LC3G4D2N
LC3G4D1T
LC3G4D1N
216
CLC3POL
LC3POL
—
—
—
LC3G4POL
LC3G3POL
LC3G2POL
LC3G1POL
210
CLC3SEL0
—
—
—
LC3D1S<4:0>
211
CLC3SEL1
—
—
—
LC3D2S<4:0>
211
CLC3SEL2
—
—
—
LC3D3S<4:0>
211
CLC3SEL3
—
—
—
LC3D4S<4:0>
CLC4GLS0
LC4G1D4T
LC4G1D4N
LC4G1D3T
LC4G1D3N
LC4G1D2T
LC4G1D2N
LC4G1D1T
LC4G1D1N
213
CLC4GLS1
LC4G2D4T
LC4G2D4N
LC4G2D3T
LC4G2D3N
LC4G2D2T
LC4G2D2N
LC4G2D1T
LC4G2D1N
214
CLC4GLS2
LC4G3D4T
LC4G3D4N
LC4G3D3T
LC4G3D3N
LC4G3D2T
LC4G3D2N
LC4G3D1T
LC4G3D1N
215
CLC4GLS3
LC4G4D4T
LC4G4D4N
LC4G4D3T
LC4G4D3N
LC4G4D2T
LC4G4D2N
LC4G4D1T
LC4G4D1N
216
CLC4POL
LC4POL
—
—
—
LC4G4POL
LC4G3POL
LC4G2POL
LC4G1POL
210
CLC4SEL0
—
—
—
LC4D1S<4:0>
211
CLC4SEL1
—
—
—
LC4D2S<4:0>
211
CLC4SEL2
—
—
—
LC4D3S<4:0>
211
CLC4SEL3
—
—
—
LC4D4S<4:0>
212
CLCxPPS
INTCON
Legend:
—
—
—
GIE
PEIE
TMR0IE
LC3MODE<2:0>
209
IOCIE
TMR0IF
210
212
CLCxPPS<4:0>
INTE
131
136
INTF
IOCIF
83
— = unimplemented read as ‘0’. Shaded cells are not used for CLC module.
DS40001726C-page 218
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 19-3:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH CLCx
Register
on Page
Bit7
Bit6
Bit5
Bit4
BIt3
Bit2
Bit1
Bit0
PIE3
—
NCOIE
COGIE
ZCDIE
CLC4IE
CLC3IE
CLC2IE
CLC1IE
86
PIR3
—
NCOIF
COGIF
ZCDIF
CLC4IF
CLC3IF
CLC2IF
CLC1IF
89
RxyPPS
—
—
—
TRISA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
Legend:
RxyPPS<4:0>
137
— = unimplemented read as ‘0’. Shaded cells are not used for CLC module.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 219
PIC16(L)F1713/6
20.0
NUMERICALLY CONTROLLED
OSCILLATOR (NCO) MODULE
The NCOx clock source is selected by configuring the
NxCKS<2:0> bits in the NCOxCLK register.
The Numerically Controlled Oscillator (NCOx) module
is a timer that uses the overflow from the addition of an
increment value to divide the input frequency. The
advantage of the addition method over simple counter
driven timer is that the resolution of division does not
vary with the divider value. The NCOx is most useful for
applications that require frequency accuracy and fine
resolution at a fixed duty cycle.
20.1.2
Features of the NCOx include:
20.1.3
•
•
•
•
•
•
•
The NCOx adder is a full adder, which operates
independently from the system clock. The addition of the
previous result and the increment value replaces the
accumulator value on the rising edge of each input clock.
20-bit increment function
Fixed Duty Cycle (FDC) mode
Pulse Frequency (PF) mode
Output pulse width control
Multiple clock input sources
Output polarity control
Interrupt capability
Figure 20-1 is a simplified block diagram of the NCOx
module.
20.1
NCOx Operation
The NCOx operates by repeatedly adding a fixed value
to an accumulator. Additions occur at the input clock rate.
The accumulator will overflow with a carry periodically,
which is the raw NCOx output (NCO_overflow). This
effectively reduces the input clock by the ratio of the
addition value to the maximum accumulator value. See
Equation 20-1.
The NCOx output can be further modified by stretching
the pulse or toggling a flip-flop. The modified NCOx
output is then distributed internally to other peripherals
and optionally output to a pin. The accumulator
overflow also generates an interrupt (NCO_interrupt).
The NCOx period changes in discrete steps to create
an average frequency. This output depends on the
ability of the receiving circuit (i.e., CWG or external
resonant converter circuitry) to average the NCOx
output to reduce uncertainty.
20.1.1
ACCUMULATOR
The accumulator is a 20-bit register. Read and write
access to the accumulator is available through three
registers:
• NCOxACCL
• NCOxACCH
• NCOxACCU
20.1.4
ADDER
INCREMENT REGISTERS
The increment value is stored in three registers making
up a 20-bit increment. In order of LSB to MSB they are:
• NCOxINCL
• NCOxINCH
• NCOxINCU
When the NCO module is enabled, the NCOxINCU and
NCOxINCH registers should be written first, then the
NCOxINCL register. Writing to the NCOxINCL register
initiates the increment buffer registers to be loaded
simultaneously on the second rising edge of the
NCOx_clk signal.
The registers are readable and writable. The increment
registers are double-buffered to allow value changes to
be made without first disabling the NCOx module.
When the NCO module is disabled, the increment
buffers are loaded immediately after a write to the
increment registers.
Note: The increment buffer registers are not
user-accessible.
NCOx CLOCK SOURCES
Clock sources available to the NCOx include:
• HFINTOSC
• FOSC
• LC3_out
EQUATION 20-1:
NCO Clock Frequency  Increment Value
F OVERFLOW = --------------------------------------------------------------------------------------------------------------n
2
n = Accumulator width in bits
DS40001726C-page 220
 2013-2016 Microchip Technology Inc.
NUMERICALLY CONTROLLED OSCILLATOR (NCOx) MODULE SIMPLIFIED BLOCK DIAGRAM
NCOxINCU NCOxINCH NCOxINCL
20
Rev. 10-000028B
1/16/2014
(1)
INCBUFU
INCBUFH
20
NCO_overflow
FINTOSC
00
FOSC
01
LC3_out
10
reserved
11
xCKS<1:0>
INCBUFL
20
Adder
20
NCOx_clk
NCOxACCU NCOxACCH NCOxACCL
20
NCO_interrupt
set bit
NCOxIF
2
Fixed Duty
Cycle Mode
Circuitry
D
Q
D
Q
0
_
1
Q
NxPFM
TRIS bit
NCOxOUT
NxPOL
NCOx_out
 2013-2016 Microchip Technology Inc.
EN
S
Q
Ripple
Counter
R
Q
R
3
NxPWS<2:0>
e 1:
D
_
Pulse
Frequency
Mode Circuitry
Q
To Peripherals
NxOUT
Q1
The increment registers are double-buffered to allow for value changes to be made without first disabling the NCO module. The full increment value is loaded into the buffer registers on the
second rising edge of the NCOx_clk signal that occurs immediately after a write to NCOxINCL register. The buffers are not user-accessible and are shown here for reference.
PIC16(L)F1713/6
DS40001726C-page 221
FIGURE 20-1:
PIC16(L)F1713/6
20.2
Fixed Duty Cycle (FDC) Mode
In Fixed Duty Cycle (FDC) mode, every time the
accumulator overflows (NCO_overflow), the output is
toggled. This provides a 50% duty cycle, provided that
the increment value remains constant. For more
information, see Figure 20-2.
The FDC mode is selected by clearing the NxPFM bit
in the NCOxCON register.
20.3
Pulse Frequency (PF) Mode
In Pulse Frequency (PF) mode, every time the accumulator overflows (NCO_overflow), the output becomes
active for one or more clock periods. Once the clock
period expires, the output returns to an inactive state.
This provides a pulsed output.
The output becomes active on the rising clock edge
immediately following the overflow event. For more
information, see Figure 20-2.
The value of the active and inactive states depends on
the polarity bit, NxPOL in the NCOxCON register.
The PF mode is selected by setting the NxPFM bit in
the NCOxCON register.
20.3.1
OUTPUT PULSE WIDTH CONTROL
When operating in PF mode, the active state of the output can vary in width by multiple clock periods. Various
pulse widths are selected with the NxPWS<2:0> bits in
the NCOxCLK register.
When the selected pulse width is greater than the
accumulator overflow time frame, the output of the
NCOx operation is indeterminate.
20.4
Output Polarity Control
20.5
Interrupts
When the accumulator overflows (NCO_overflow), the
NCOx Interrupt Flag bit, NCOxIF, of the PIRx register is
set. To enable the interrupt event (NCO_interrupt), the
following bits must be set:
•
•
•
•
NxEN bit of the NCOxCON register
NCOxIE bit of the PIEx register
PEIE bit of the INTCON register
GIE bit of the INTCON register
The interrupt must be cleared by software by clearing
the NCOxIF bit in the Interrupt Service Routine.
20.6
Effects of a Reset
All of the NCOx registers are cleared to zero as the
result of a Reset.
20.7
Operation In Sleep
The NCO module operates independently from the
system clock and will continue to run during Sleep,
provided that the clock source selected remains
active.
The HFINTOSC remains active during Sleep when the
NCO module is enabled and the HFINTOSC is
selected as the clock source, regardless of the system
clock source selected.
In other words, if the HFINTOSC is simultaneously
selected as the system clock and the NCO clock
source, when the NCO is enabled, the CPU will go idle
during Sleep, but the NCO will continue to operate and
the HFINTOSC will remain active.
This will have a direct effect on the Sleep mode current.
The last stage in the NCOx module is the output polarity. The NxPOL bit in the NCOxCON register selects the
output polarity. Changing the polarity while the interrupts are enabled will cause an interrupt for the resulting output transition.
The NCOx output can be used internally by source
code or other peripherals. Accomplish this by reading
the NxOUT (read-only) bit of the NCOxCON register.
The NCOx output signal is available to the following
peripherals:
• CLC
• CWG
DS40001726C-page 222
 2013-2016 Microchip Technology Inc.
NCO – FIXED DUTY CYCLE (FDC) AND PULSE FREQUENCY MODE (PFM) OUTPUT OPERATION DIAGRAM
Rev. 10-000 029A_A0
NCOx
Clock
Source
NCOx
Increment
Value
NCOx
Accumulator
Value
NCO_overflow
NCO_interrupt
 2013-2016 Microchip Technology Inc.
NCOx Output
FDC Mode
NCOx Output
PF Mode
NCOxPWS =
000
NCOx Output
PF Mode
NCOxPWS =
00
4000h
00000h
04000h
4000h
4000h
08000h
FC000h 00000h
04000h
08000h
FC000h 00000h
04000h
08000h
PIC16(L)F1713/6
DS40001726C-page 223
FIGURE 20-2:
PIC16(L)F1713/6
20.8
Register Definitions: NCOx Control Registers
REGISTER 20-1:
NCOxCON: NCOx CONTROL REGISTER
R/W-0/0
U-0
R-0/0
R/W-0/0
U-0
U-0
U-0
R/W-0/0
NxEN
—
NxOUT
NxPOL
—
—
—
NxPFM
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
NxEN: NCOx Enable bit
1 = NCOx module is enabled
0 = NCOx module is disabled
bit 6
Unimplemented: Read as ‘0’
bit 5
NxOUT: NCOx Output bit
1 = NCOx output is high
0 = NCOx output is low
bit 4
NxPOL: NCOx Polarity bit
1 = NCOx output signal is active low (inverted)
0 = NCOx output signal is active high (non-inverted)
bit 3-1
Unimplemented: Read as ‘0’
bit 0
NxPFM: NCOx Pulse Frequency Mode bit
1 = NCOx operates in Pulse Frequency mode
0 = NCOx operates in Fixed Duty Cycle mode
REGISTER 20-2:
R/W-0/0
NCOxCLK: NCOx INPUT CLOCK CONTROL REGISTER
R/W-0/0
R/W-0/0
NxPWS<2:0>(1, 2)
U-0
U-0
U-0
—
—
—
R/W-0/0
R/W-0/0
NxCKS<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-5
NxPWS<2:0>: NCOx Output Pulse Width Select bits(1, 2)
111 = 128 NCOx clock periods
110 = 64 NCOx clock periods
101 = 32 NCOx clock periods
100 = 16 NCOx clock periods
011 = 8 NCOx clock periods
010 = 4 NCOx clock periods
001 = 2 NCOx clock periods
000 = 1 NCOx clock periods
bit 4-2
Unimplemented: Read as ‘0’
bit 1-0
NxCKS<1:0>: NCOx Clock Source Select bits
11 = Reserved
10 = LC3_out
01 = FOSC
00 = HFINTOSC (16 MHz)
Note 1: NxPWS applies only when operating in Pulse Frequency mode.
2: If NCOx pulse width is greater than NCO_overflow period, operation is undeterminate.
DS40001726C-page 224
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
REGISTER 20-3:
R/W-0/0
NCOxACCL: NCOx ACCUMULATOR REGISTER – LOW BYTE
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
NCOxACC<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
NCOxACC<7:0>: NCOx Accumulator, Low Byte
REGISTER 20-4:
R/W-0/0
NCOxACCH: NCOx ACCUMULATOR REGISTER – HIGH BYTE
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
NCOxACC<15:8>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
NCOxACC<15:8>: NCOx Accumulator, High Byte
REGISTER 20-5:
NCOxACCU: NCOx ACCUMULATOR REGISTER – UPPER BYTE
U-0
U-0
U-0
U-0
—
—
—
—
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
NCOxACC<19:16>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
NCOxACC<19:16>: NCOx Accumulator, Upper Byte
 2013-2016 Microchip Technology Inc.
DS40001726C-page 225
PIC16(L)F1713/6
NCOxINCL: NCOx INCREMENT REGISTER – LOW BYTE(1)
REGISTER 20-6:
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-1/1
NCOxINC<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
NCOxINC<7:0>: NCOx Increment, Low Byte
Write the NCOxINCH register first, then the NCOxINCL register. See Section 20.1.4 “Increment Registers” for more information.
NCOxINCH: NCOx INCREMENT REGISTER – HIGH BYTE(1)
REGISTER 20-7:
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
NCOxINC<15:8>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
NCOxINC<15:8>: NCOx Increment, High Byte
Write the NCOxINCH register first, then the NCOxINCL register. See Section 20.1.4 “Increment Registers” for more information.
NCOxINCU: NCOx INCREMENT REGISTER – UPPER BYTE(1)
REGISTER 20-8:
U/0
U/0
U/0
U/0
R/W-0/0
—
R/W-0/0
R/W-0/0
R/W-0/0
NCOxINC<19:16>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
NCOxINC<19:16>: NCOx Increment, Upper Byte
Note 1:
Write the NCOxINCH register first, then the NCOxINCL register. See Section 20.1.4 “Increment Registers” for more information.
DS40001726C-page 226
 2013-2016 Microchip Technology Inc.
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TABLE 20-1:
Name
INTCON
SUMMARY OF REGISTERS ASSOCIATED WITH NCOx
Bit 7
Bit 6
GIE
PEIE
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
—
NCO1ACCU
NCO1ACC<19:16>
Register
on Page
83
225
NCO1ACCH
NCO1ACC<15:8>
225
NCO1ACCL
NCO1ACC<7:0>
225
NCO1CLK
NCO1CON
N1PWS<2:0>
N1EN
—
N1OUT
—
—
—
—
—
NCO1INCU
N1CKS<1:0>
—
N1PFM
NCO1INC<19:16>
NCO1INCH
226
NCO1INC<7:0>
—
NCOIE
COGIE
ZCDIE
CLC4IE
224
224
226
NCO1INC<15:8>
NCO1INCL
PIE3
—
N1POL
226
CLC3IE
CLC2IE
CLC1IE
86
—
NCOIF
COGIF
ZCDIF
CLC4IF
CLC3IF
CLC2IF
CLC1IF
89
TRISA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
—
—
—
PIR3
RxyPPS
Legend:
RxyPPS<4:0>
137
x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not
used for NCOx module.
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NOTES:
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21.0
The ADC can generate an interrupt upon completion of
a conversion. This interrupt can be used to wake-up the
device from Sleep.
ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs, which are multiplexed into a single sample and
hold circuit. The output of the sample and hold is
connected to the input of the converter. The converter
generates a 10-bit binary result via successive
approximation and stores the conversion result into the
ADC result registers (ADRESH:ADRESL register pair).
Figure 21-1 shows the block diagram of the ADC.
The ADC voltage reference is software selectable to be
either internally generated or externally supplied.
FIGURE 21-1:
ADC BLOCK DIAGRAM
VDD
ADPREF = 00
VREF+
ADPREF = 11
ADPREF = 10
VREFAN0
00000
AN1
00001
ADNREF = 1
ADNREF = 0
VREF-/AN2
00010
VREF+/AN3
00011
AN4
00100
AN8
01000
AN9
01001
AN10
01010
Ref+ RefADC
AN11
01011
AN12
01100
AN13
01101
AN14
01110
AN15
01111
AN16
10000
AN17
10001
AN18
10010
AN19
10011
DAC2_output
11100
Temp Indicator
11101
DAC1_output
11110
FVR Buffer1
11111
FVR Buffer1
Vss
10
GO/DONE
ADFM
0 = Left Justify
1 = Right Justify
16
ADON
VSS
ADRESH
ADRESL
CHS<4:0>
Note 1:
When ADON = 0, all multiplexer inputs are disconnected.
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21.1
ADC Configuration
When configuring and using the ADC the following
functions must be considered:
•
•
•
•
•
•
Port configuration
Channel selection
ADC voltage reference selection
ADC conversion clock source
Interrupt control
Result formatting
21.1.1
PORT CONFIGURATION
The ADC can be used to convert both analog and
digital signals. When converting analog signals, the I/O
pin should be configured for analog by setting the
associated TRIS and ANSEL bits. Refer to
Section 11.0 “I/O Ports” for more information.
Note:
21.1.2
Analog voltages on any pin that is defined
as a digital input may cause the input buffer to conduct excess current.
CHANNEL SELECTION
There are up to 21 channel selections available:
•
•
•
•
•
21.1.4
CONVERSION CLOCK
The source of the conversion clock is software selectable via the ADCS bits of the ADCON1 register. There
are seven possible clock options:
•
•
•
•
•
•
•
FOSC/2
FOSC/4
FOSC/8
FOSC/16
FOSC/32
FOSC/64
FRC (internal RC oscillator)
The time to complete one bit conversion is defined as
TAD. One full 10-bit conversion requires 11.5 TAD periods as shown in Figure 21-2.
For correct conversion, the appropriate TAD specification
must be met. Refer to Table 34-16: ADC Conversion
Requirements for more information. Table 21-1 gives
examples of appropriate ADC clock selections.
Note:
Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
AN<19:8, 4:0> pins
Temperature Indicator
DAC_output
FVR_buffer1
FVR_buffer2
The CHS bits of the ADCON0 register (Register 21-1)
determine which channel is connected to the sample
and hold circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 21.2
“ADC Operation” for more information.
21.1.3
ADC VOLTAGE REFERENCE
The ADPREF bits of the ADCON1 register provides
control of the positive voltage reference. The positive
voltage reference can be:
•
•
•
•
•
VREF+ pin
VDD
FVR 2.048V
FVR 4.096V (Not available on LF devices)
VSS
The ADNREF bit of the ADCON1 register provides control of the negative voltage reference. The negative
voltage reference can be:
• VREF- pin
• VDD
See Section 21.0 “Analog-to-Digital Converter
(ADC) Module” for more details on the Fixed Voltage
Reference.
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TABLE 21-1:
ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES
ADC Clock Period (TAD)
Device Frequency (FOSC)
ADC
Clock Source
ADCS<2:0>
32 MHz
20 MHz
16 MHz
8 MHz
4 MHz
1 MHz
FOSC/2
000
62.5ns(2)
100 ns(2)
125 ns(2)
250 ns(2)
500 ns(2)
2.0 s
FOSC/4
100
125 ns
(2)
(2)
(2)
(2)
FOSC/8
001
0.5 s(2)
400 ns(2)
0.5 s(2)
FOSC/16
101
800 ns
800 ns
010
1.0 s
FOSC/64
110
FRC
x11
FOSC/32
Legend:
Note 1:
2:
3:
4:
1.0 s
4.0 s
1.0 s
2.0 s
8.0 s(3)
1.0 s
2.0 s
4.0 s
16.0 s(3)
1.6 s
2.0 s
4.0 s
2.0 s
3.2 s
4.0 s
1.0-6.0 s(1,4)
1.0-6.0 s(1,4)
1.0-6.0 s(1,4)
200 ns
250 ns
500 ns
8.0 s
32.0 s(2)
(3)
8.0 s
16.0 s
(3)
64.0 s(2)
(2)
1.0-6.0 s(1,4)
1.0-6.0 s(1,4)
1.0-6.0 s(1,4)
Shaded cells are outside of recommended range.
See TAD parameter for FRC source typical TAD value.
These values violate the required TAD time.
Outside the recommended TAD time.
The ADC clock period (TAD) and total ADC conversion time can be minimized when the ADC clock is derived from the
system clock FOSC. However, the FRC oscillator source must be used when conversions are to be performed with the
device in Sleep mode.
FIGURE 21-2:
ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
TAD1
TAD2
TAD3
TAD4
TAD5
TAD6
TAD7
TAD8
TAD9
TAD10
TAD11
b9
b8
b7
b6
b5
b4
b3
b2
b1
b0
THCD
Conversion Starts
TACQ
Holding capacitor disconnected
from analog input (THCD).
Set GO bit
On the following cycle:
ADRESH:ADRESL is loaded,
GO bit is cleared,
ADIF bit is set,
holding capacitor is reconnected to analog input.
Enable ADC (ADON bit)
and
Select channel (ACS bits)
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21.1.5
INTERRUPTS
21.1.6
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC Interrupt Flag is the ADIF bit in
the PIR1 register. The ADC Interrupt Enable is the
ADIE bit in the PIE1 register. The ADIF bit must be
cleared in software.
RESULT FORMATTING
The 10-bit ADC conversion result can be supplied in
two formats, left justified or right justified. The ADFM bit
of the ADCON1 register controls the output format.
Figure 21-3 shows the two output formats.
Note 1: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
2: The ADC operates during Sleep only
when the FRC oscillator is selected.
This interrupt can be generated while the device is
operating or while in Sleep. If the device is in Sleep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruction is always executed. If the user is attempting
to wake-up from Sleep and resume in-line code
execution, the ADIE bit of the PIE1 register and the
PEIE bit of the INTCON register must both be set and
the GIE bit of the INTCON register must be cleared. If
all three of these bits are set, the execution will switch
to the Interrupt Service Routine.
FIGURE 21-3:
10-BIT ADC CONVERSION RESULT FORMAT
ADRESH
(ADFM = 0)
ADRESL
MSB
LSB
bit 7
bit 0
bit 7
10-bit ADC Result
(ADFM = 1)
Unimplemented: Read as ‘0’
MSB
bit 7
Unimplemented: Read as ‘0’
DS40001726C-page 232
bit 0
LSB
bit 0
bit 7
bit 0
10-bit ADC Result
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21.2
21.2.1
ADC Operation
STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the
GO/DONE bit of the ADCON0 register to a ‘1’ will start
the Analog-to-Digital conversion.
Note:
21.2.2
The GO/DONE bit should not be set in the
same instruction that turns on the ADC.
Refer to Section 21.2.6 “ADC Conversion Procedure”.
COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
• Clear the GO/DONE bit
• Set the ADIF Interrupt Flag bit
• Update the ADRESH and ADRESL registers with
new conversion result
21.2.3
TERMINATING A CONVERSION
If a conversion must be terminated before completion,
the GO/DONE bit can be cleared in software. The
ADRESH and ADRESL registers will be updated with
the partially complete Analog-to-Digital conversion
sample. Incomplete bits will match the last bit
converted.
Note:
A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
21.2.4
ADC OPERATION DURING SLEEP
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the FRC
option. When the FRC oscillator source is selected, the
ADC waits one additional instruction before starting the
conversion. This allows the SLEEP instruction to be
executed, which can reduce system noise during the
conversion. If the ADC interrupt is enabled, the device
will wake-up from Sleep when the conversion
completes. If the ADC interrupt is disabled, the ADC
module is turned off after the conversion completes,
although the ADON bit remains set.
When the ADC clock source is something other than
FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off,
although the ADON bit remains set.
21.2.5
AUTO-CONVERSION TRIGGER
The Auto-conversion Trigger allows periodic ADC measurements without software intervention. When a rising
edge of the selected source occurs, the GO/DONE bit
is set by hardware.
The Auto-conversion Trigger source is selected with
the TRIGSEL<3:0> bits of the ADCON2 register.
Using the Auto-conversion Trigger does not assure
proper ADC timing. It is the user’s responsibility to
ensure that the ADC timing requirements are met.
See Table 21-2 for auto-conversion sources.
TABLE 21-2:
AUTO-CONVERSION
SOURCES
Source Peripheral
Signal Name
CCP1
CCP2
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Timer0
T0_overflow
Timer1
T1_overflow
Timer2
T2_match
Timer4
T4_match
Timer6
T6_match
Comparator C1
sync_C1OUT
Comparator C2
sync_C2OUT
CLC1
LC1_out
CLC2
LC2_out
CLC3
LC3_out
CLC4
LC4_out
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21.2.6
ADC CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an Analog-to-Digital conversion:
1.
2.
3.
4.
5.
6.
7.
8.
Configure Port:
• Disable pin output driver (Refer to the TRIS
register)
• Configure pin as analog (Refer to the ANSEL
register)
• Disable weak pull-ups either globally (Refer
to the OPTION_REG register) or individually
(Refer to the appropriate WPUx register)
Configure the ADC module:
• Select ADC conversion clock
• Configure voltage reference
• Select ADC input channel
• Turn on ADC module
Configure ADC interrupt (optional):
• Clear ADC interrupt flag
• Enable ADC interrupt
• Enable peripheral interrupt
• Enable global interrupt(1)
Wait the required acquisition time(2).
Start conversion by setting the GO/DONE bit.
Wait for ADC conversion to complete by one of
the following:
• Polling the GO/DONE bit
• Waiting for the ADC interrupt (interrupts
enabled)
Read ADC Result.
Clear the ADC interrupt flag (required if interrupt
is enabled).
EXAMPLE 21-1:
ADC CONVERSION
;This code block configures the ADC
;for polling, Vdd and Vss references, FRC
;oscillator and AN0 input.
;
;Conversion start & polling for completion
; are included.
;
BANKSEL
ADCON1
;
MOVLW
B’11110000’ ;Right justify, FRC
;oscillator
MOVWF
ADCON1
;Vdd and Vss Vref
BANKSEL
TRISA
;
BSF
TRISA,0
;Set RA0 to input
BANKSEL
ANSEL
;
BSF
ANSEL,0
;Set RA0 to analog
BANKSEL
WPUA
BCF
WPUA,0
;Disable weak
;pull-up on RA0
BANKSEL
ADCON0
;
MOVLW
B’00000001’ ;Select channel AN0
MOVWF
ADCON0
;Turn ADC On
CALL
SampleTime
;Acquisiton delay
BSF
ADCON0,ADGO ;Start conversion
BTFSC
ADCON0,ADGO ;Is conversion done?
GOTO
$-1
;No, test again
BANKSEL
ADRESH
;
MOVF
ADRESH,W
;Read upper 2 bits
MOVWF
RESULTHI
;store in GPR space
BANKSEL
ADRESL
;
MOVF
ADRESL,W
;Read lower 8 bits
MOVWF
RESULTLO
;Store in GPR space
Note 1: The global interrupt can be disabled if the
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: Refer to Section 21.4 “ADC Acquisition Requirements”.
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21.3
Register Definitions: ADC Control
REGISTER 21-1:
U-0
ADCON0: ADC CONTROL REGISTER 0
R/W-0/0
R/W-0/0
—
R/W-0/0
R/W-0/0
CHS<4:0>
R/W-0/0
R/W-0/0
R/W-0/0
GO/DONE
ADON
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6-2
CHS<4:0>: Analog Channel Select bits
11111 = FVR (Fixed Voltage Reference) Buffer 1 Output(2)
11110 = DAC1_output(1)
11101 = Temperature Indicator(3)
11100 = DAC2_output(4)
11011 = Reserved. No channel connected.
•
•
•
10011 = AN19
10010 = AN18
10001 = AN17
10000 = AN16
01111 = AN15
01110 = AN14
01101 = AN13
01100 = AN12
01011 = AN11
01010 = AN10
01001 = AN9
01000 = AN8
00111 = Reserved. No channel connected.
00110 = Reserved. No channel connected.
00101 = Reserved. No channel connected.
00100 = AN4
00011 = AN3
00010 = AN2
00001 = AN1
00000 = AN0
bit 1
GO/DONE: ADC Conversion Status bit
1 = ADC conversion cycle in progress. Setting this bit starts an ADC conversion cycle.
This bit is automatically cleared by hardware when the ADC conversion has completed.
0 = ADC conversion completed/not in progress
bit 0
ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
Note 1:
2:
3:
4:
See Section 23.0 “8-Bit Digital-to-Analog Converter (DAC1) Module” for more information.
See Section 14.0 “Fixed Voltage Reference (FVR)” for more information.
See Section 15.0 “Temperature Indicator Module” for more information.
See Section 24.0 “5-Bit Digital-to-Analog Converter (DAC2) Module”for more information.
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REGISTER 21-2:
R/W-0/0
ADCON1: ADC CONTROL REGISTER 1
R/W-0/0
ADFM
R/W-0/0
R/W-0/0
ADCS<2:0>
U-0
R/W-0/0
—
ADNREF
R/W-0/0
bit 7
R/W-0/0
ADPREF<1:0>
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
ADFM: ADC Result Format Select bit
1 = Right justified. Six Most Significant bits of ADRESH are set to ‘0’ when the conversion result is
loaded.
0 = Left justified. Six Least Significant bits of ADRESL are set to ‘0’ when the conversion result is
loaded.
bit 6-4
ADCS<2:0>: ADC Conversion Clock Select bits
111 = FRC (clock supplied from an internal RC oscillator)
110 = FOSC/64
101 = FOSC/16
100 = FOSC/4
011 = FRC (clock supplied from an internal RC oscillator)
010 = FOSC/32
001 = FOSC/8
000 = FOSC/2
bit 3
Unimplemented: Read as ‘0’
bit 2
ADNREF: A/D Negative Voltage Reference Configuration bit
1 = VREF- is connected to Vref- pin
0 = VREF- is connected to VSS
bit 1-0
ADPREF<1:0>: ADC Positive Voltage Reference Configuration bits
11 = VREF+ is connected to internal Fixed Voltage Reference (FVR) module(1)
10 = VREF+ is connected to external VREF+ pin(1)
01 = Reserved
00 = VREF+ is connected to VDD
Note 1:
When selecting the VREF+ pin as the source of the positive reference, be aware that a minimum voltage
specification exists. See Table 34-16: ADC Conversion Requirements for details.
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REGISTER 21-3:
R/W-0/0
ADCON2: ADC CONTROL REGISTER 2
R/W-0/0
R/W-0/0
TRIGSEL<3:0>
R/W-0/0
(1)
U-0
U-0
U-0
U-0
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
bit 3-0
Note 1:
2:
TRIGSEL<3:0>: Auto-Conversion Trigger Selection bits(1)
0000 = No auto-conversion trigger selected
0001 = CCP1
0010 = CCP2
0011 = Timer0 – T0_overflow(2)
0100 = Timer1 – T1_overflow(2)
0101 = Timer2 – T2_match
0110 = Comparator C1 – sync_C1OUT
0111 = Comparator C2 – sync_C2OUT
1000 = CLC1 – LC1_out
1001 = CLC2 – LC2_out
1010 = CLC3 – LC3_out
1011 = CLC4 – LC4_out
1100 = Timer4 – T4_match
1101 = Timer6 – T6_match
1110 = Reserved
1111 = Reserved
Unimplemented: Read as ‘0’
This is a rising edge sensitive input for all sources.
Signal also sets its corresponding interrupt flag.
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REGISTER 21-4:
R/W-x/u
ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
ADRES<9:2>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
ADRES<9:2>: ADC Result Register bits
Upper eight bits of 10-bit conversion result
REGISTER 21-5:
R/W-x/u
ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0
R/W-x/u
ADRES<1:0>
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
—
—
—
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
ADRES<1:0>: ADC Result Register bits
Lower two bits of 10-bit conversion result
bit 5-0
Reserved: Do not use.
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REGISTER 21-6:
ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
—
—
—
—
—
—
R/W-x/u
R/W-x/u
ADRES<9:8>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-2
Reserved: Do not use.
bit 1-0
ADRES<9:8>: ADC Result Register bits
Upper two bits of 10-bit conversion result
REGISTER 21-7:
R/W-x/u
ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
R/W-x/u
ADRES<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
ADRES<7:0>: ADC Result Register bits
Lower eight bits of 10-bit conversion result
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21.4
ADC Acquisition Requirements
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 21-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge
the capacitor CHOLD. The sampling switch (RSS)
impedance varies over the device voltage (VDD), refer
to Figure 21-4. The maximum recommended
impedance for analog sources is 10 k. As the
EQUATION 21-1:
Assumptions:
source impedance is decreased, the acquisition time
may be decreased. After the analog input channel is
selected (or changed), an ADC acquisition must be
done before the conversion can be started. To calculate
the minimum acquisition time, Equation 21-1 may be
used. This equation assumes that 1/2 LSb error is used
(1,024 steps for the ADC). The 1/2 LSb error is the
maximum error allowed for the ADC to meet its
specified resolution.
ACQUISITION TIME EXAMPLE
Temperature = 50°C and external impedance of 10k  5.0V V DD
T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient
= T AMP + T C + T COFF
= 2µs + T C +   Temperature - 25°C   0.05µs/°C  
The value for TC can be approximated with the following equations:
1
 = V CHOLD
V AP P LI ED  1 – -------------------------n+1


2
–1
;[1] VCHOLD charged to within 1/2 lsb
–TC
----------

RC
V AP P LI ED  1 – e  = V CHOLD


;[2] VCHOLD charge response to VAPPLIED
– Tc
---------

1
RC
 ;combining [1] and [2]
V AP P LI ED  1 – e  = V A PP LIE D  1 – -------------------------n+1



2
–1
Note: Where n = number of bits of the ADC.
Solving for TC:
T C = – C HOLD  R IC + R SS + R S  ln(1/2047)
= – 10pF  1k  + 7k  + 10k   ln(0.0004885)
= 1.37 µs
Therefore:
T A CQ = 2µs + 892ns +   50°C- 25°C   0.05 µs/°C  
= 4.62µs
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
DS40001726C-page 240
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 21-4:
ANALOG INPUT MODEL
VDD
Analog
Input
pin
Rs
VT  0.6V
CPIN
5 pF
VA
RIC  1k
Sampling
Switch
SS Rss
I LEAKAGE(1)
VT  0.6V
CHOLD = 10 pF
Ref-
6V
5V
VDD 4V
3V
2V
= Sample/Hold Capacitance
= Input Capacitance
Legend: CHOLD
CPIN
RSS
I LEAKAGE = Leakage current at the pin due to
various junctions
= Interconnect Resistance
RIC
= Resistance of Sampling Switch
RSS
SS
= Sampling Switch
VT
= Threshold Voltage
Note 1:
FIGURE 21-5:
5 6 7 8 9 10 11
Sampling Switch
(k)
Refer to Table 34-4: I/O Ports (parameter D060).
ADC TRANSFER FUNCTION
Full-Scale Range
3FFh
3FEh
ADC Output Code
3FDh
3FCh
3FBh
03h
02h
01h
00h
Analog Input Voltage
0.5 LSB
Ref-
 2013-2016 Microchip Technology Inc.
Zero-Scale
Transition
1.5 LSB
Full-Scale
Transition
Ref+
DS40001726C-page 241
PIC16(L)F1713/6
TABLE 21-3:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH ADC
Bit 7
ADCON0
—
ADCON1
ADFM
ADCON2
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
—
ADNREF
—
—
CHS<4:0>
ADCS<2:0>
TRIGSEL<3:0>
ADRESH
ADC Result Register High
ADRESL
ADC Result Register Low
Bit 1
Bit 0
GO/DONE
ADON
Register
on Page
235
ADPREF<1:0>
236
—
237
—
239
239
ANSELA
—
—
ANSA5
ANSA4
ANSA3
ANSA2
ANSA1
ANSA0
120
ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
INTCON
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
PIE1
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
PIR1
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
87
TRISA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
FVRCON
FVREN
FVRRDY
TSEN
TSRNG
CDAFVR<1:0>
DAC1EN
—
DAC1OE1
DAC1OE2
DAC1PSS<1:0>
DAC1CON0
Legend:
131
ADFVR<1:0>
—
DAC1NSS
151
249
x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not
used for the ADC module.
DS40001726C-page 242
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
22.0
OPERATIONAL AMPLIFIER
(OPA) MODULES
The Operational Amplifier (OPA) is a standard
three-terminal device requiring external feedback to
operate. The OPA module has the following features:
• External connections to I/O ports
• Low leakage inputs
• Factory Calibrated Input Offset Voltage
FIGURE 22-1:
OPAx MODULE BLOCK DIAGRAM
OPAxIN+
DAC2_output
DAC1_output
00
01
10
FVR Buffer 2
11
OPAXEN
OPAXSP(1)
OPAxIN-
0
OPA
OPAXOUT
1
OPAxNCH<1:0>
Note 1:
OPAXUG
The OPAxSP bit must be set. Low-Power mode is not supported.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 243
PIC16(L)F1713/6
22.1
OPA Module Performance
Common AC and DC performance specifications for
the OPA module:
•
•
•
•
•
Common Mode Voltage Range
Leakage Current
Input Offset Voltage
Open Loop Gain
Gain Bandwidth Product
Common mode voltage range is the specified voltage
range for the OPA+ and OPA- inputs, for which the OPA
module will perform to within its specifications. The
OPA module is designed to operate with input voltages
between VSS and VDD. Behavior for Common mode
voltages greater than VDD, or below VSS, are not
guaranteed.
Leakage current is a measure of the small source or
sink currents on the OPA+ and OPA- inputs. To
minimize the effect of leakage currents, the effective
impedances connected to the OPA+ and OPA- inputs
should be kept as small as possible and equal.
Input offset voltage is a measure of the voltage
difference between the OPA+ and OPA- inputs in a
closed loop circuit with the OPA in its linear region. The
offset voltage will appear as a DC offset in the output
equal to the input offset voltage, multiplied by the gain
of the circuit. The input offset voltage is also affected by
the Common mode voltage. The OPA is factory
calibrated to minimize the input offset voltage of the
module.
22.1.1
OPA Module Control
The OPA module is enabled by setting the OPAxEN bit
of the OPAxCON register. When enabled, the OPA
forces the output driver of OPAxOUT pin into tri-state to
prevent contention between the driver and the OPA
output.
Note:
22.1.2
When the OPA module is enabled, the
OPAxOUT pin is driven by the op amp
output, not by the PORT digital driver.
Refer to Table 34-17: Operational Amplifier
(OPA) for the op amp output drive
capability.
UNITY GAIN MODE
The OPAxUG bit of the OPAxCON register selects the
Unity Gain mode. When unity gain is selected, the OPA
output is connected to the inverting input and the
OPAxIN pin is relinquished, releasing the pin for
general purpose input and output.
22.2
Effects of Reset
A device Reset forces all registers to their Reset state.
This disables the OPA module.
Open loop gain is the ratio of the output voltage to the
differential input voltage, (OPA+) - (OPA-). The gain is
greatest at DC and falls off with frequency.
Gain Bandwidth Product or GBWP is the frequency
at which the open loop gain falls off to 0 dB.
DS40001726C-page 244
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
22.3
Register Definitions: Op Amp Control
REGISTER 22-1:
OPAxCON: OPERATIONAL AMPLIFIERS (OPAx) CONTROL REGISTERS
R/W-0/0
R/W-0/0
U-0
R/W-0/0
U-0
U-0
OPAxEN
OPAxSP
—
OPAxUG
—
—
R/W-0/0
R/W-0/0
OPAxCH<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = Value depends on condition
bit 7
OPAxEN: Op Amp Enable bit
1 = Op amp is enabled
0 = Op amp is disabled and consumes no active power
bit 6
OPAxSP: Op Amp Speed/Power Select bit
1 = Op amp operates in high GBWP mode
0 = Reserved. D not use.
bit 5
Unimplemented: Read as ‘0’
bit 4
OPAxUG: Op Amp Unity Gain Select bit
1 = OPA output is connected to inverting input. OPAxIN- pin is available for general purpose I/O.
0 = Inverting input is connected to the OPAxIN- pin
bit 3-2
Unimplemented: Read as ‘0’
bit 1-0
OPAxCH<1:0>: Non-inverting Channel Selection bits
11 = Non-inverting input connects to FVR Buffer 2 output
10 = Non-inverting input connects to DAC1_output
01 = Non-inverting input connects to DAC2_output
00 = Non-inverting input connects to OPAxIN+ pin
TABLE 22-1:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH OP AMPS
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
120
ANSELA
—
—
ANSA
ANSA4
ANSA3
ANSA2
ANSA1
ANSA0
ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
DAC1EN
—
—
DAC1NSS
249
FVREN
FVRRDY
TSEN
TSRNG
OPA1CON
OPA1EN
OPA1SP
—
OPA1UG
—
OPA2CON
OPA2EN
OPA2SP
—
OPA2UG
—
DAC1CON0
DAC1OE1 DAC1OE2
DAC1CON1
FVRCON
DAC1PSS<1:0>
DAC1R<7:0>
249
CDAFVR<1:0>
ADFVR<1:0>
151
—
OPA1PCH<1:0>
245
—
OPA2PCH<1:0>
245
TRISA
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
119
TRISB
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
125
Legend:
— = unimplemented location, read as ‘0’. Shaded cells are not used by op amps.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 245
PIC16(L)F1713/6
23.0
8-BIT DIGITAL-TO-ANALOG
CONVERTER (DAC1) MODULE
The Digital-to-Analog Converter supplies a variable
voltage reference, ratiometric with the input source,
with 256 selectable output levels.
23.1
Output Voltage Selection
The DAC has 256 voltage level ranges. The 256 levels
are set with the DAC1R<7:0> bits of the DAC1CON1
register.
The DAC output voltage is determined by Equation 23-1:
The input of the DAC can be connected to:
• External VREF pins
• VDD supply voltage
• FVR (Fixed Voltage Reference)
The output of the DAC can be configured to supply a
reference voltage to the following:
•
•
•
•
Comparator positive input
ADC input channel
DAC1OUT1 pin
DAC1OUT2 pin
The Digital-to-Analog Converter (DAC) is enabled by
setting the DAC1EN bit of the DAC1CON0 register.
EQUATION 23-1:
DAC OUTPUT VOLTAGE
IF DAC1EN = 1
DAC1R  7:0 
VOUT =   VSOURCE+ – VSOURCE-   -------------------------------- + VSOURCE8


2
VSOURCE+ = VDD, VREF, or FVR BUFFER 2
VSOURCE- = VSS
23.2
Ratiometric Output Level
The DAC output value is derived using a resistor ladder
with each end of the ladder tied to a positive and
negative voltage reference input source. If the voltage
of either input source fluctuates, a similar fluctuation will
result in the DAC output value.
The value of the individual resistors within the ladder
can be found in Table 34-19: 8-bit Digital-to-Analog
Converter (DAC1) Specifications.
23.3
DAC Voltage Reference Output
The DAC voltage can be output to the DAC1OUT1 and
DAC1OUT2 pins by setting the respective DAC1OE1
and DAC1OE2 pins of the DAC1CON0 register.
Selecting the DAC reference voltage for output on
either DAC1OUTX pin automatically overrides the
digital output buffer and digital input threshold detector
functions of that pin. Reading the DAC1OUTX pin when
it has been configured for DAC reference voltage
output will always return a ‘0’.
Due to the limited current drive capability, a buffer must
be used on the DAC voltage reference output for
external connections to either DAC1OUTx pin.
Figure 23-2 shows an example buffering technique.
DS40001726C-page 246
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 23-1:
DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM
Digital-to-Analog Converter (DAC)
FVR Buffer2
VSOURCE+
VDD
8
VREF+
DAC1R<4:0>
R
R
DAC1PSS<1:0>
2
R
DAC1EN
R
256
Steps
R
32-to-1 MUX
R
DAC1_Output
R
(To Peripherals)
DAC1OUT1
R
DAC1OE1
DAC1NSS
DAC1OUT2
VREF-
DAC1OE2
VSOURCE-
VSS
FIGURE 23-2:
VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE
PIC® MCU
DAC
Module
R
Voltage
Reference
Output
Impedance
 2013-2016 Microchip Technology Inc.
DAC1OUTX
+
–
Buffered DAC Output
DS40001726C-page 247
PIC16(L)F1713/6
23.4
Operation During Sleep
The DAC continues to function during Sleep. When the
device wakes up from Sleep through an interrupt or a
Watchdog Timer time-out, the contents of the
DAC1CON0 register are not affected. To minimize
current consumption in Sleep mode, the voltage
reference should be disabled.
23.5
Effects of a Reset
A device Reset affects the following:
• DAC is disabled.
• DAC output voltage is removed from the
DAC1OUT pin.
• The DAC1R<4:0> range select bits are cleared.
DS40001726C-page 248
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
23.6
Register Definitions: DAC Control
REGISTER 23-1:
DAC1CON0: VOLTAGE REFERENCE CONTROL REGISTER 0
R/W-0/0
U-0
R/W-0/0
R/W-0/0
DAC1EN
—
DAC1OE1
DAC1OE2
R/W-0/0
R/W-0/0
U-0
R/W-0/0
—
DAC1NSS
DAC1PSS<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
DAC1EN: DAC1 Enable bit
1 = DAC is enabled
0 = DAC is disabled
bit 6
Unimplemented: Read as ‘0’
bit 5
DAC1OE1: DAC1 Voltage Output 1 Enable bit
1 = DAC voltage level is also an output on the DAC1OUT1 pin
0 = DAC voltage level is disconnected from the DAC1OUT1 pin
bit 4
DAC1OE2: DAC1 Voltage Output 2 Enable bit
1 = DAC voltage level is also an output on the DAC1OUT2 pin
0 = DAC voltage level is disconnected from the DAC1OUT2 pin
bit 3-2
DAC1PSS<1:0>: DAC1 Positive Source Select bits
11 = Reserved, do not use
10 = FVR Buffer2 output
01 = VREF+ pin
00 = VDD
bit 1
Unimplemented: Read as ‘0’
bit 0
DAC1NSS: DAC1 Negative Source Select bits
1 = VREF- pin
0 = VSS
REGISTER 23-2:
R/W-0/0
DAC1CON1: VOLTAGE REFERENCE CONTROL REGISTER 1
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
DAC1R<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
DAC1R<7:0>: DAC1 Voltage Output Select bits
TABLE 23-1:
Name
DAC1CON0
SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC1 MODULE
Bit 7
Bit 6
DAC1EN
—
DAC1CON1
Legend:
Bit 5
Bit 4
DAC1OE1 DAC1OE2
Bit 3
Bit 2
DAC1PSS<1:0>
Bit 1
Bit 0
Register
on page
—
DAC1NSS
249
DAC1R<7:0>
249
— = Unimplemented location, read as ‘0’. Shaded cells are not used with the DAC module.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 249
PIC16(L)F1713/6
24.0
5-BIT DIGITAL-TO-ANALOG
CONVERTER (DAC2) MODULE
The Digital-to-Analog Converter supplies a variable
voltage reference, ratiometric with the input source,
with 32 selectable output levels.
The input of the DAC can be connected to:
• External VREF pins
• VDD supply voltage
• FVR (Fixed Voltage Reference)
The Digital-to-Analog Converter (DAC) can be enabled
by setting the DACEN bit of the DACCON0 register.
24.1
Output Voltage Selection
The DAC has 32 voltage level ranges. The 32 levels
are set with the DACR<4:0> bits of the DACCON1
register.
The DAC output voltage is determined by the following
equations:
The output of the DAC can be configured to supply a
reference voltage to the following:
•
•
•
•
•
Comparator positive input
ADC input channel
DAC2OUT1/DAC2OUT2 pin
Comparators
Op Amps
EQUATION 24-1:
DAC OUTPUT VOLTAGE
IF DACEN = 1
DACR  4:0 
VOUT =   VSOURCE+ – VSOURCE-   ----------------------------+ VSOURCE5


2
IF DACEN = 0 and DACLPS = 1 and DACR[4:0] = 11111
V OUT = V SOURCE +
IF DACEN = 0 and DACLPS = 0 and DACR[4:0] = 00000
V OUT = V SOURCE –
VSOURCE+ = VDD, VREF, or FVR BUFFER 2
VSOURCE- = VSS
24.2
Ratiometric Output Level
The DAC output value is derived using a resistor ladder
with each end of the ladder tied to a positive and
negative voltage reference input source. If the voltage
of either input source fluctuates, a similar fluctuation will
result in the DAC output value.
The value of the individual resistors within the ladder
can be found in Table 34-20.
24.3
DAC Voltage Reference Output
The DAC can be output to the DACOUT pin by setting
the DACOE bit of the DACCON0 register to ‘1’.
Selecting the DAC reference voltage for output on the
DACOUT pin automatically overrides the digital output
buffer and digital input threshold detector functions of
that pin. Reading the DACOUT pin when it has been
configured for DAC reference voltage output will
always return a ‘0’.
Due to the limited current drive capability, a buffer must
be used on the DAC voltage reference output for
external connections to DACOUT. Figure 24-2 shows
an example buffering technique.
DS40001726C-page 250
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 24-1:
DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM
Digital-to-Analog Converter (DAC)
FVR BUFFER2
VDD
VSOURCE+
5
VREF+
DACR<4:0>
R
DACPSS<1:0>
R
2
R
DACEN
R
32
Steps
R
32-to-1 MUX
R
DAC_Output (To Comparator, Op Amp and
ADC Modules)
R
DAC2OUT1
R
DAC2OE1
DACNSS
DAC2OUT2
DAC2OE2
VREF-
VSOURCE-
VSS
FIGURE 24-2:
VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE
PIC® MCU
DAC
Module
R
Voltage
Reference
Output
Impedance
 2013-2016 Microchip Technology Inc.
DACOUT
+
–
Buffered DAC Output
DS40001726C-page 251
PIC16(L)F1713/6
24.4
Operation During Sleep
When the device wakes up from Sleep through an
interrupt or a Watchdog Timer time-out, the contents of
the DACCON0 register are not affected. To minimize
current consumption in Sleep mode, the voltage
reference should be disabled.
24.5
Effects of a Reset
A device Reset affects the following:
• DAC is disabled
• DAC output voltage is removed from the
DACOUT pin
• The DACR<4:0> range select bits are cleared
DS40001726C-page 252
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
24.6
Register Definitions: DAC2 Control
REGISTER 24-1:
DAC2CON0: VOLTAGE REFERENCE CONTROL REGISTER 0
R/W-0/0
U-0
R/W-0/0
R/W-0/0
DAC2EN
—
DAC2OE1
DAC2OE2
R/W-0/0
R/W-0/0
U-0
R/W-0/0
—
DAC2NSS
DAC2PSS<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
DAC2EN: DAC2 Enable bit
1 = DAC is enabled
0 = DAC is disabled
bit 6
Unimplemented: Read as ‘0’
bit 5
DAC2OE1: DAC2 Voltage Output Enable bit
1 = DAC voltage level is also an output on the DAC2OUT1 pin
0 = DAC voltage level is disconnected from the DAC2OUT1 pin
bit 4
DAC2OE2: DAC2 Voltage Output Enable bit
1 = DAC voltage level is also an output on the DAC2OUT2 pin
0 = DAC voltage level is disconnected from the DAC2OUT2 pin
bit 3-2
DAC2PSS<1:0>: DAC2 Positive Source Select bits
11 = Reserved, do not use
10 = FVR Buffer2 output
01 = VREF+ pin
00 = VDD
bit 1
Unimplemented: Read as ‘0’
bit 0
DAC2NSS: DAC2 Negative Source Select bits
1 = VREF0 = VSS
REGISTER 24-2:
DAC2CON1: VOLTAGE REFERENCE CONTROL REGISTER 1
U-0
U-0
U-0
—
—
—
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
DAC2R<4:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
DAC2R<4:0>: DAC Voltage Output Select bits
TABLE 24-1:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC2 MODULE
Bit 7
Bit 6
Bit 5
Bit 4
DAC2CON0
DAC2EN
—
DAC2OE1
DAC2OE2
DAC2CON1
—
—
—
Legend:
Bit 3
Bit 2
DAC2PSS<1:0>
Bit 1
Bit 0
—
DAC2NSS
DAC2R<4:0>
Register
on page
253
253
— = Unimplemented location, read as ‘0’. Shaded cells are not used with the DAC module.
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25.0
25.1.2
TIMER0 MODULE
8-BIT COUNTER MODE
The Timer0 module is an 8-bit timer/counter with the
following features:
In 8-Bit Counter mode, the Timer0 module will increment
on every rising or falling edge of the T0CKI pin.
•
•
•
•
•
•
8-Bit Counter mode using the T0CKI pin is selected by
setting the TMR0CS bit in the OPTION_REG register to
‘1’.
8-bit timer/counter register (TMR0)
8-bit prescaler (independent of Watchdog Timer)
Programmable internal or external clock source
Programmable external clock edge selection
Interrupt on overflow
TMR0 can be used to gate Timer1
The rising or falling transition of the incrementing edge
for either input source is determined by the TMR0SE bit
in the OPTION_REG register.
Figure 25-1 is a block diagram of the Timer0 module.
25.1
Timer0 Operation
The Timer0 module can be used as either an 8-bit timer
or an 8-bit counter.
25.1.1
8-BIT TIMER MODE
The Timer0 module will increment every instruction
cycle, if used without a prescaler. 8-bit Timer mode is
selected by clearing the TMR0CS bit of the
OPTION_REG register.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
Note:
The value written to the TMR0 register
can be adjusted, in order to account for
the two instruction cycle delay when
TMR0 is written.
FIGURE 25-1:
BLOCK DIAGRAM OF THE TIMER0
FOSC/4
Data Bus
0
8
T0CKI
1
Sync
2 TCY
1
TMR0
0
TMR0SE TMR0CS
8-bit
Prescaler
PSA
Set Flag bit TMR0IF
on Overflow
Overflow to Timer1
8
PS<2:0>
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25.1.3
SOFTWARE PROGRAMMABLE
PRESCALER
A software programmable prescaler is available for
exclusive use with Timer0. The prescaler is enabled by
clearing the PSA bit of the OPTION_REG register.
Note:
The Watchdog Timer (WDT) uses its own
independent prescaler.
There are eight prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are
selectable via the PS<2:0> bits of the OPTION_REG
register. In order to have a 1:1 prescaler value for the
Timer0 module, the prescaler must be disabled by
setting the PSA bit of the OPTION_REG register.
The prescaler is not readable or writable. All instructions
writing to the TMR0 register will clear the prescaler.
25.1.4
TIMER0 INTERRUPT
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The TMR0IF
interrupt flag bit of the INTCON register is set every
time the TMR0 register overflows, regardless of
whether or not the Timer0 interrupt is enabled. The
TMR0IF bit can only be cleared in software. The Timer0
interrupt enable is the TMR0IE bit of the INTCON
register.
Note:
25.1.5
The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sleep.
8-BIT COUNTER MODE
SYNCHRONIZATION
When in 8-Bit Counter mode, the incrementing edge on
the T0CKI pin must be synchronized to the instruction
clock. Synchronization can be accomplished by
sampling the prescaler output on the Q2 and Q4 cycles
of the instruction clock. The high and low periods of the
external clocking source must meet the timing
requirements as shown in Table 34-12: Timer0 and
Timer1 External Clock Requirements.
25.1.6
OPERATION DURING SLEEP
Timer0 cannot operate while the processor is in Sleep
mode. The contents of the TMR0 register will remain
unchanged while the processor is in Sleep mode.
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25.2
Register Definitions: Option Register
REGISTER 25-1:
OPTION_REG: OPTION REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
WPUEN
INTEDG
TMR0CS
TMR0SE
PSA
R/W-1/1
R/W-1/1
R/W-1/1
PS<2:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
WPUEN: Weak Pull-Up Enable bit
1 = All weak pull-ups are disabled (except MCLR, if it is enabled)
0 = Weak pull-ups are enabled by individual WPUx latch values
bit 6
INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5
TMR0CS: Timer0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (FOSC/4)
bit 4
TMR0SE: Timer0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3
PSA: Prescaler Assignment bit
1 = Prescaler is not assigned to the Timer0 module
0 = Prescaler is assigned to the Timer0 module
bit 2-0
PS<2:0>: Prescaler Rate Select bits
TABLE 25-1:
Name
INTCON
TRISA
Timer0 Rate
000
001
010
011
100
101
110
111
1:2
1:4
1:8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
Bit 7
GIE
OPTION_REG WPUEN
TMR0
Bit Value
Bit 6
PEIE
INTEDG
Bit 5
Bit 4
Bit 3
Bit 2
TMR0IE
INTE
IOCIE
TMR0IF
TMR0CS TMR0SE
PSA
Bit 1
Bit 0
INTF
IOCIF
PS<2:0>
TRISA6
TRISA5
83
256
Timer0 Module Register
TRISA7
Register
on Page
254*
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the Timer0 module.
* Page provides register information.
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26.0
•
•
•
•
TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer/counter with the
following features:
Figure 26-1 is a block diagram of the Timer1 module.
•
•
•
•
•
•
•
•
16-bit timer/counter register pair (TMR1H:TMR1L)
Programmable internal or external clock source
2-bit prescaler
Dedicated 32 kHz oscillator circuit
Optionally synchronized comparator out
Multiple Timer1 gate (count enable) sources
Interrupt on overflow
Wake-up on overflow (external clock,
Asynchronous mode only)
• Time base for the Capture/Compare function
• Auto-conversion Trigger (with CCP)
• Selectable Gate Source Polarity
FIGURE 26-1:
Gate Toggle mode
Gate Single-pulse mode
Gate Value Status
Gate Event Interrupt
TIMER1 BLOCK DIAGRAM
T1GSS<1:0>
T1G
T1GSPM
00
From Timer0
Overflow
01
sync_C1OUT
10
0
t1g_in
T1GVAL
0
sync_C2OUT
Single-Pulse
D
Q
CK
R
Q
11
TMR1ON
T1GPOL
T1GTM
1
Acq. Control
1
Q1
Data Bus
D
Q
RD
T1GCON
EN
Interrupt
T1GGO/DONE
Set
TMR1GIF
det
TMR1GE
Set flag bit
TMR1IF on
Overflow
To ADC Auto-Conversion
TMR1ON
To Comparator Module
TMR1(2)
TMR1H
EN
TMR1L
Q
D
T1CLK
Synchronized
clock input
0
1
TMR1CS<1:0>
SOSCO
LFINTOSC
SOSC
SOSCI
T1SYNC
OUT
11
1
Synchronize(3)
Prescaler
1, 2, 4, 8
det
10
EN
0
T1OSCEN
(1)
FOSC
Internal
Clock
01
FOSC/4
Internal
Clock
00
2
T1CKPS<1:0>
FOSC/2
Internal
Clock
Sleep input
T1CKI
To Clock Switching Modules
Note 1: ST Buffer is high speed type when using T1CKI.
2: Timer1 register increments on rising edge.
3: Synchronize does not operate while in Sleep.
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26.1
Timer1 Operation
26.2
The Timer1 module is a 16-bit incrementing counter
which is accessed through the TMR1H:TMR1L register
pair. Writes to TMR1H or TMR1L directly update the
counter.
When used with an internal clock source, the module is
a timer and increments on every instruction cycle.
When used with an external clock source, the module
can be used as either a timer or counter and increments on every selected edge of the external source.
Timer1 is enabled by configuring the TMR1ON and
TMR1GE bits in the T1CON and T1GCON registers,
respectively. Table 26-1 displays the Timer1 enable
selections.
TABLE 26-1:
TIMER1 ENABLE
SELECTIONS
Clock Source Selection
The TMR1CS<1:0> and T1OSCEN bits of the T1CON
register are used to select the clock source for Timer1.
Table 26-2 displays the clock source selections.
26.2.1
INTERNAL CLOCK SOURCE
When the internal clock source is selected, the
TMR1H:TMR1L register pair will increment on multiples
of FOSC as determined by the Timer1 prescaler.
When the FOSC internal clock source is selected, the
Timer1 register value will increment by four counts every
instruction clock cycle. Due to this condition, a 2 LSB
error in resolution will occur when reading the Timer1
value. To utilize the full resolution of Timer1, an
asynchronous input signal must be used to gate the
Timer1 clock input.
The following asynchronous sources may be used:
Timer1
Operation
• Asynchronous event on the T1G pin to Timer1
gate
• C1 or C2 comparator input to Timer1 gate
TMR1ON
TMR1GE
0
0
Off
0
1
Off
26.2.2
1
0
Always On
1
1
Count Enabled
When the external clock source is selected, the Timer1
module may work as a timer or a counter.
EXTERNAL CLOCK SOURCE
When enabled to count, Timer1 is incremented on the
rising edge of the external clock input T1CKI, which can
be synchronized to the microcontroller system clock or
can run asynchronously.
When used as a timer with a clock oscillator, an
external 32.768 kHz crystal can be used in conjunction
with the dedicated internal oscillator circuit.
Note:
In Counter mode, a falling edge must be
registered by the counter prior to the first
incrementing rising edge after any one or
more of the following conditions:
•
•
•
•
TABLE 26-2:
TMR1CS<1:0>
Timer1 enabled after POR
Write to TMR1H or TMR1L
Timer1 is disabled
Timer1 is disabled (TMR1ON = 0)
when T1CKI is high then Timer1 is
enabled (TMR1ON=1) when T1CKI is
low.
CLOCK SOURCE SELECTIONS
T1OSCEN
Clock Source
11
x
LFINTOSC
10
0
External Clocking on T1CKI Pin
01
x
System Clock (FOSC)
00
x
Instruction Clock (FOSC/4)
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26.3
Timer1 Prescaler
Timer1 has four prescaler options allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits of the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however, the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
26.4
Timer1 (Secondary) Oscillator
26.5.1
READING AND WRITING TIMER1 IN
ASYNCHRONOUS COUNTER
MODE
Reading TMR1H or TMR1L while the timer is running
from an external asynchronous clock will ensure a valid
read (taken care of in hardware). However, the user
should keep in mind that reading the 16-bit timer in two
8-bit values itself, poses certain problems, since the
timer may overflow between the reads.
A dedicated low-power 32.768 kHz oscillator circuit is
built-in between pins SOSCI (input) and SOSCO
(amplifier output). This internal circuit is to be used in
conjunction with an external 32.768 kHz crystal.
For writes, it is recommended that the user simply stop
the timer and write the desired values. A write
contention may occur by writing to the timer registers,
while the register is incrementing. This may produce an
unpredictable value in the TMR1H:TMR1L register pair.
The oscillator circuit is enabled by setting the T1OSCEN bit of the T1CON register. The oscillator will continue to run during Sleep.
26.6
Note:
26.5
The oscillator requires a start-up and
stabilization time before use. Thus,
T1OSCEN should be set and a suitable
delay observed prior to using Timer1. A
suitable delay similar to the OST delay
can be implemented in software by
clearing the TMR1IF bit then presetting
the TMR1H:TMR1L register pair to
FC00h. The TMR1IF flag will be set when
1024 clock cycles have elapsed, thereby
indicating that the oscillator is running and
reasonably stable.
Timer1 Operation in
Asynchronous Counter Mode
If the control bit T1SYNC of the T1CON register is set,
the external clock input is not synchronized. The timer
increments asynchronously to the internal phase
clocks. If the external clock source is selected then the
timer will continue to run during Sleep and can
generate an interrupt on overflow, which will wake-up
the processor. However, special precautions in
software are needed to read/write the timer (see
Section 26.5.1 “Reading and Writing Timer1 in
Asynchronous Counter Mode”).
Note:
When switching from synchronous to
asynchronous operation, it is possible to
skip an increment. When switching from
asynchronous to synchronous operation,
it is possible to produce an additional
increment.
 2013-2016 Microchip Technology Inc.
Timer1 Gate
Timer1 can be configured to count freely or the count
can be enabled and disabled using Timer1 gate
circuitry. This is also referred to as Timer1 Gate Enable.
Timer1 gate can also be driven by multiple selectable
sources.
26.6.1
TIMER1 GATE ENABLE
The Timer1 Gate Enable mode is enabled by setting
the TMR1GE bit of the T1GCON register. The polarity
of the Timer1 Gate Enable mode is configured using
the T1GPOL bit of the T1GCON register.
When Timer1 Gate Enable mode is enabled, Timer1
will increment on the rising edge of the Timer1 clock
source. When Timer1 Gate Enable mode is disabled,
no incrementing will occur and Timer1 will hold the
current count. See Figure 26-3 for timing details.
TABLE 26-3:
TIMER1 GATE ENABLE
SELECTIONS
T1CLK
T1GPOL
T1G
Timer1 Operation

0
0
Counts

0
1
Holds Count

1
0
Holds Count

1
1
Counts
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26.6.2
TIMER1 GATE SOURCE
SELECTION
Timer1 gate source selections are shown in Table 26-4.
Source selection is controlled by the T1GSS bits of the
T1GCON register. The polarity for each available source
is also selectable. Polarity selection is controlled by the
T1GPOL bit of the T1GCON register.
TABLE 26-4:
T1GSS
TIMER1 GATE SOURCES
Timer1 Gate Source
00
Timer1 Gate Pin
01
Overflow of Timer0
(TMR0 increments from FFh to 00h)
10
Comparator 1 Output sync_C1OUT
(optionally Timer1 synchronized output)
11
Comparator 2 Output sync_C2OUT
(optionally Timer1 synchronized output)
26.6.2.1
T1G Pin Gate Operation
The T1G pin is one source for Timer1 gate control. It
can be used to supply an external source to the Timer1
gate circuitry.
26.6.2.2
Timer0 Overflow Gate Operation
When Timer0 increments from FFh to 00h, a
low-to-high pulse will automatically be generated and
internally supplied to the Timer1 gate circuitry.
26.6.2.3
Comparator C1 Gate Operation
The output resulting from a Comparator 1 operation can
be selected as a source for Timer1 gate control. The
Comparator 1 output (sync_C1OUT) can be
synchronized to the Timer1 clock or left asynchronous.
For more information see Section 16.4.1 “Comparator
Output Synchronization”.
26.6.2.4
Comparator C2 Gate Operation
The output resulting from a Comparator 2 operation
can be selected as a source for Timer1 gate control.
The Comparator 2 output (sync_C2OUT) can be
synchronized to the Timer1 clock or left asynchronous.
For more information see Section 16.4.1 “Comparator
Output Synchronization”.
26.6.3
TIMER1 GATE TOGGLE MODE
When Timer1 Gate Toggle mode is enabled, it is possible to measure the full-cycle length of a Timer1 gate
signal, as opposed to the duration of a single level
pulse.
Timer1 Gate Toggle mode is enabled by setting the
T1GTM bit of the T1GCON register. When the T1GTM
bit is cleared, the flip-flop is cleared and held clear. This
is necessary in order to control which edge is
measured.
Note:
26.6.4
Enabling Toggle mode at the same time
as changing the gate polarity may result in
indeterminate operation.
TIMER1 GATE SINGLE-PULSE
MODE
When Timer1 Gate Single-Pulse mode is enabled, it is
possible to capture a single-pulse gate event. Timer1
Gate Single-Pulse mode is first enabled by setting the
T1GSPM bit in the T1GCON register. Next, the
T1GGO/DONE bit in the T1GCON register must be set.
The Timer1 will be fully enabled on the next
incrementing edge. On the next trailing edge of the
pulse, the T1GGO/DONE bit will automatically be
cleared. No other gate events will be allowed to
increment Timer1 until the T1GGO/DONE bit is once
again set in software. See Figure 26-5 for timing details.
If the Single-Pulse Gate mode is disabled by clearing the
T1GSPM bit in the T1GCON register, the T1GGO/DONE
bit should also be cleared.
Enabling the Toggle mode and the Single-Pulse mode
simultaneously will permit both sections to work
together. This allows the cycle times on the Timer1 gate
source to be measured. See Figure 26-6 for timing
details.
26.6.5
TIMER1 GATE VALUE STATUS
When Timer1 Gate Value Status is utilized, it is possible
to read the most current level of the gate control value.
The value is stored in the T1GVAL bit in the T1GCON
register. The T1GVAL bit is valid even when the Timer1
gate is not enabled (TMR1GE bit is cleared).
26.6.6
TIMER1 GATE EVENT INTERRUPT
When Timer1 Gate Event Interrupt is enabled, it is
possible to generate an interrupt upon the completion
of a gate event. When the falling edge of T1GVAL
occurs, the TMR1GIF flag bit in the PIR1 register will be
set. If the TMR1GIE bit in the PIE1 register is set, then
an interrupt will be recognized.
The TMR1GIF flag bit operates even when the Timer1
gate is not enabled (TMR1GE bit is cleared).
The Timer1 gate source is routed through a flip-flop that
changes state on every incrementing edge of the signal. See Figure 26-4 for timing details.
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26.7
Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Timer1 interrupt flag bit of the PIR1 register is
set. To enable the interrupt on rollover, you must set
these bits:
•
•
•
•
TMR1ON bit of the T1CON register
TMR1IE bit of the PIE1 register
PEIE bit of the INTCON register
GIE bit of the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
The TMR1H:TMR1L register pair and the
TMR1IF bit should be cleared before
enabling interrupts.
Note:
26.8
Timer1 Operation During Sleep
Timer1 can only operate during Sleep when setup in
Asynchronous Counter mode. In this mode, an external
crystal or clock source can be used to increment the
counter. To set up the timer to wake the device:
•
•
•
•
•
TMR1ON bit of the T1CON register must be set
TMR1IE bit of the PIE1 register must be set
PEIE bit of the INTCON register must be set
T1SYNC bit of the T1CON register must be set
TMR1CS bits of the T1CON register must be
configured
• T1OSCEN bit of the T1CON register must be
configured
The device will wake-up on an overflow and execute
the next instructions. If the GIE bit of the INTCON
register is set, the device will call the Interrupt Service
Routine.
26.9
CCP Capture/Compare Time Base
The CCP modules use the TMR1H:TMR1L register
pair as the time base when operating in Capture or
Compare mode.
In Capture mode, the value in the TMR1H:TMR1L
register pair is copied into the CCPR1H:CCPR1L
register pair on a configured event.
In Compare mode, an event is triggered when the value
CCPR1H:CCPR1L register pair matches the value in
the TMR1H:TMR1L register pair. This event can be an
Auto-conversion Trigger.
For
more
information,
see
“Capture/Compare/PWM Modules”.
Section 29.0
26.10 CCP Auto-Conversion Trigger
When any of the CCP’s are configured to trigger an
auto-conversion, the trigger will clear the
TMR1H:TMR1L register pair. This auto-conversion
does not cause a Timer1 interrupt. The CCP module
may still be configured to generate a CCP interrupt.
In this mode of operation, the CCPR1H:CCPR1L
register pair becomes the period register for Timer1.
Timer1 should be synchronized and FOSC/4 should be
selected as the clock source in order to utilize the
Auto-conversion Trigger. Asynchronous operation of
Timer1 can cause an Auto-conversion Trigger to be
missed.
In the event that a write to TMR1H or TMR1L coincides
with an Auto-conversion Trigger from the CCP, the
write will take precedence.
For more information, see Section 29.2.4 “Auto-Conversion Trigger”.
Secondary oscillator will continue to operate in Sleep
regardless of the T1SYNC bit setting.
FIGURE 26-2:
TIMER1 INCREMENTING EDGE
T1CKI = 1
when TMR1
Enabled
T1CKI = 0
when TMR1
Enabled
Note 1:
2:
Arrows indicate counter increments.
In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock.
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FIGURE 26-3:
TIMER1 GATE ENABLE MODE
TMR1GE
T1GPOL
t1g_in
T1CKI
T1GVAL
Timer1
N
FIGURE 26-4:
N+1
N+2
N+3
N+4
TIMER1 GATE TOGGLE MODE
TMR1GE
T1GPOL
T1GTM
t1g_in
T1CKI
T1GVAL
Timer1
N
DS40001726C-page 262
N+1 N+2 N+3
N+4
N+5 N+6 N+7
N+8
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PIC16(L)F1713/6
FIGURE 26-5:
TIMER1 GATE SINGLE-PULSE MODE
TMR1GE
T1GPOL
T1GSPM
T1GGO/
Cleared by hardware on
falling edge of T1GVAL
Set by software
DONE
Counting enabled on
rising edge of T1G
t1g_in
T1CKI
T1GVAL
Timer1
TMR1GIF
N
Cleared by software
 2013-2016 Microchip Technology Inc.
N+1
N+2
Set by hardware on
falling edge of T1GVAL
Cleared by
software
DS40001726C-page 263
PIC16(L)F1713/6
FIGURE 26-6:
TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE
TMR1GE
T1GPOL
T1GSPM
T1GTM
T1GGO/
Cleared by hardware on
falling edge of T1GVAL
Set by software
DONE
Counting enabled on
rising edge of T1G
t1g_in
T1CKI
T1GVAL
Timer1
TMR1GIF
DS40001726C-page 264
N
Cleared by software
N+1
N+2
N+3
N+4
Set by hardware on
falling edge of T1GVAL
Cleared by
software
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
26.11 Register Definitions: Timer1 Control
REGISTER 26-1:
R/W-0/u
T1CON: TIMER1 CONTROL REGISTER
R/W-0/u
R/W-0/u
TMR1CS<1:0>
R/W-0/u
T1CKPS<1:0>
R/W-0/u
R/W-0/u
U-0
R/W-0/u
T1OSCEN
T1SYNC
—
TMR1ON
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
TMR1CS<1:0>: Timer1 Clock Source Select bits
11 = LFINTOSC
10 = Timer1 clock source is pin or oscillator:
If T1OSCEN = 0:
External clock from T1CKI pin (on the rising edge)
If T1OSCEN = 1:
Crystal oscillator on SOSCI/SOSCO pins
01 = Timer1 clock source is system clock (FOSC)
00 = Timer1 clock source is instruction clock (FOSC/4)
bit 5-4
T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 3
T1OSCEN: LP Oscillator Enable Control bit
1 = Dedicated secondary oscillator circuit enabled
0 = Dedicated secondary oscillator circuit disabled
bit 2
T1SYNC: Timer1 Synchronization Control bit
1 = Do not synchronize asynchronous clock input
0 = Synchronize asynchronous clock input with system clock (FOSC)
bit 1
Unimplemented: Read as ‘0’
bit 0
TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1 and clears Timer1 gate flip-flop
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
REGISTER 26-2:
T1GCON: TIMER1 GATE CONTROL REGISTER
R/W-0/u
R/W-0/u
R/W-0/u
R/W-0/u
R/W/HC-0/u
R-x/x
TMR1GE
T1GPOL
T1GTM
T1GSPM
T1GGO/
DONE
T1GVAL
R/W-0/u
R/W-0/u
T1GSS<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
HC = Bit is cleared by hardware
bit 7
TMR1GE: Timer1 Gate Enable bit
If TMR1ON = 0:
This bit is ignored
If TMR1ON = 1:
1 = Timer1 counting is controlled by the Timer1 gate function
0 = Timer1 counts regardless of Timer1 gate function
bit 6
T1GPOL: Timer1 Gate Polarity bit
1 = Timer1 gate is active-high (Timer1 counts when gate is high)
0 = Timer1 gate is active-low (Timer1 counts when gate is low)
bit 5
T1GTM: Timer1 Gate Toggle Mode bit
1 = Timer1 Gate Toggle mode is enabled
0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared
Timer1 gate flip-flop toggles on every rising edge.
bit 4
T1GSPM: Timer1 Gate Single-Pulse Mode bit
1 = Timer1 Gate Single-Pulse mode is enabled and is controlling Timer1 gate
0 = Timer1 Gate Single-Pulse mode is disabled
bit 3
T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit
1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge
0 = Timer1 gate single-pulse acquisition has completed or has not been started
bit 2
T1GVAL: Timer1 Gate Value Status bit
Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L
Unaffected by Timer1 Gate Enable (TMR1GE)
bit 1-0
T1GSS<1:0>: Timer1 Gate Source Select bits
11 = Comparator 2 optionally synchronized output (sync_C2OUT)
10 = Comparator 1 optionally synchronized output (sync_C1OUT)
01 = Timer0 overflow output
00 = Timer1 gate pin
DS40001726C-page 266
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TABLE 26-5:
Name
ANSELA
SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
ANSA5
ANSA4
ANSA3
ANSA2
ANSA1
ANSA0
120
126
ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
CCP1CON
—
—
DC1B<1:0>
CCP1M<3:0>
284
CCP2CON
—
—
DC2B<1:0>
CCP2M<3:0>
284
INTCON
PIE1
PIR1
131
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
TMR1H
Holding Register for the Most Significant Byte of the 16-bit TMR1 Register
TMR1L
Holding Register for the Least Significant Byte of the 16-bit TMR1 Register
87
257*
257*
TRISA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
T1OSCEN
T1SYNC
—
TMR1ON
265
T1GGO/
DONE
T1GVAL
T1CON
T1GCON
Legend:
*
TMR1CS<1:0>
TMR1GE
T1GPOL
T1CKPS<1:0>
T1GTM
T1GSPM
T1GSS<1:0>
266
— = unimplemented location, read as ‘0’. Shaded cells are not used by the Timer1 module.
Page provides register information.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
27.0
TIMER2/4/6 MODULE
The Timer2/4/6 modules are 8-bit
incorporate the following features:
timers
that
• 8-bit Timer and Period registers (TMR2 and PR2,
respectively)
• Readable and writable (both registers)
• Software programmable prescaler (1:1, 1:4, 1:16,
and 1:64)
• Software programmable postscaler (1:1 to 1:16)
• Interrupt on TMR2 match with PR2, respectively
• Optional use as the shift clock for the MSSP
module
See Figure 27-1 for a block diagram of Timer2.
Three identical Timer2 modules are implemented on this
device. To maintain consistency with earlier devices, the
timers are named Timer2, Timer4, and Timer6. All
references to Timer2 apply as well to Timer4 and
Timer6.
FIGURE 27-1:
Fosc/4
TIMER2 BLOCK DIAGRAM
Prescaler
1:1, 1:4, 1:16, 1:64
T2_match
TMR2
R
To Peripherals
2
T2CKPS<1:0>
Comparator
Postscaler
1:1 to 1:16
set bit
TMR2IF
4
PR2
DS40001726C-page 268
T2OUTPS<3:0>
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
27.1
Timer2 Operation
The clock input to the Timer2 modules is the system
instruction clock (FOSC/4).
TMR2 increments from 00h on each clock edge.
A 4-bit counter/prescaler on the clock input allows direct
input, divide-by-4 and divide-by-16 prescale options.
These options are selected by the prescaler control bits,
T2CKPS<1:0> of the T2CON register. The value of
TMR2 is compared to that of the Period register, PR2, on
each clock cycle. When the two values match, the
comparator generates a match signal as the timer
output. This signal also resets the value of TMR2 to 00h
on the next cycle and drives the output
counter/postscaler
(see
Section 27.2
“Timer2
Interrupt”).
27.3
Timer2 Output
The unscaled output of TMR2 is available primarily to
the CCP modules, where it is used as a time base for
operations in PWM mode.
Timer2 can be optionally used as the shift clock source
for the MSSP module operating in SPI mode.
Additional information is provided in Section 30.0
“Master Synchronous Serial Port (MSSP) Module”
27.4
Timer2 Operation During Sleep
The Timer2 timers cannot be operated while the
processor is in Sleep mode. The contents of the TMR2
and PR2 registers will remain unchanged while the
processor is in Sleep mode.
The TMR2 and PR2 registers are both directly readable
and writable. The TMR2 register is cleared on any
device Reset, whereas the PR2 register initializes to
FFh. Both the prescaler and postscaler counters are
cleared on the following events:
•
•
•
•
•
•
•
•
•
a write to the TMR2 register
a write to the T2CON register
Power-on Reset (POR)
Brown-out Reset (BOR)
MCLR Reset
Watchdog Timer (WDT) Reset
Stack Overflow Reset
Stack Underflow Reset
RESET Instruction
Note:
27.2
TMR2 is not cleared when T2CON is
written.
Timer2 Interrupt
Timer2 can also generate an optional device interrupt.
The Timer2 output signal (TMR2-to-PR2 match)
provides the input for the 4-bit counter/postscaler. This
counter generates the TMR2 match interrupt flag which
is latched in TMR2IF of the PIR1 register. The interrupt
is enabled by setting the TMR2 Match Interrupt Enable
bit, TMR2IE, of the PIE1 register.
A range of 16 postscale options (from 1:1 through 1:16
inclusive) can be selected with the postscaler control
bits, T2OUTPS<3:0>, of the T2CON register.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
27.5
Register Definitions: Timer2 Control
REGISTER 27-1:
U-0
T2CON: TIMER2 CONTROL REGISTER
R/W-0/0
—
R/W-0/0
R/W-0/0
R/W-0/0
T2OUTPS<3:0>
R/W-0/0
R/W-0/0
TMR2ON
bit 7
R/W-0/0
T2CKPS<1:0>
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6-3
T2OUTPS<3:0>: Timer2 Output Postscaler Select bits
1111 = 1:16 Postscaler
1110 = 1:15 Postscaler
1101 = 1:14 Postscaler
1100 = 1:13 Postscaler
1011 = 1:12 Postscaler
1010 = 1:11 Postscaler
1001 = 1:10 Postscaler
1000 = 1:9 Postscaler
0111 = 1:8 Postscaler
0110 = 1:7 Postscaler
0101 = 1:6 Postscaler
0100 = 1:5 Postscaler
0011 = 1:4 Postscaler
0010 = 1:3 Postscaler
0001 = 1:2 Postscaler
0000 = 1:1 Postscaler
bit 2
TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0
T2CKPS<1:0>: Timer2 Clock Prescale Select bits
11 = Prescaler is 64
10 = Prescaler is 16
01 = Prescaler is 4
00 = Prescaler is 1
DS40001726C-page 270
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 27-1:
SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2
Bit 7
Bit 6
CCP2CON
—
—
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
PIR1
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
87
PR2
Timer2 Module Period Register
INTCON
PIE1
T2CON
TMR2
—
Bit 5
Bit 4
Bit 3
DC2B<1:0>
T2OUTPS<3:0>
Bit 2
Bit 1
Bit 0
Register
on Page
Name
CCP2M<3:0>
284
268*
TMR2ON
T2CKPS<1:0>
Holding Register for the 8-bit TMR2 Register
270
268*
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Timer2 module.
* Page provides register information.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
27.6
CCP/PWM Clock Selection
The PIC16(L)F1713/6 allows each individual CCP and
PWM module to select the timer source that controls
the module. Each module has an independent
selection.
As there are up to three 8-bit timers with auto-reload
(Timer2, Timer4, and Timer6), PWM mode on the CCP
and PWM modules can use any of these timers.
The CCPTMRS register is used to select which timer is
used.
27.7
Register Definitions: CCP/PWM Timers Control
REGISTER 27-2:
R/W-0/0
CCPTMRS: PWM TIMER SELECTION CONTROL REGISTER 0
R/W-0/0
P4TSEL<1:0>
R/W-0/0
R/W-0/0
R/W-0/0
P3TSEL<1:0>
R/W-0/0
R/W-0/0
C2TSEL<1:0>
R/W-0/0
C1TSEL<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
P4TSEL<1:0>: PWM4 Timer Selection
11 = Reserved
10 = PWM4 is based off Timer 6
01 = PWM4 is based off Timer 4
00 = PWM4 is based off Timer 2
bit 5-4
P3TSEL<1:0>: PWM3 Timer Selection
11 = Reserved
10 = PWM3 is based off Timer 6
01 = PWM3 is based off Timer 4
00 = PWM3 is based off Timer 2
bit 3-2
C2TSEL<1:0>: CCP2 (PWM2) Timer Selection
11 = Reserved
10 = CCP2 is based off Timer 6 in PWM mode
01 = CCP2 is based off Timer 4 in PWM mode
00 = CCP2 is based off Timer 2 in PWM mode
bit 1-0
C1TSEL<1:0>: CCP1 (PWM1) Timer Selection
11 = Reserved
10 = CCP1 is based off Timer 6 in PWM mode
01 = CCP1 is based off Timer 4 in PWM mode
00 = CCP1 is based off Timer 2 in PWM mode
DS40001726C-page 272
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PIC16(L)F1713/6
28.0
ZERO-CROSS DETECTION
(ZCD) MODULE
28.1
The ZCD module detects when an A/C signal crosses
through the ground potential. The actual zero-crossing
threshold is the zero-crossing reference voltage,
ZCPINV, which is typically 0.75V above ground.
The connection to the signal to be detected is through
a series current limiting resistor. The module applies a
current source or sink to the ZCD pin to maintain a
constant voltage on the pin, thereby preventing the pin
voltage from forward biasing the ESD protection
diodes. When the applied voltage is greater than the
reference voltage, the module sinks current. When the
applied voltage is less than the reference voltage, the
module sources current. The current source and sink
action keeps the pin voltage constant over the full
range of the applied voltage. The ZCD module is
shown in the simplified block diagram Figure 28-2.
The ZCD module requires a current limiting resistor in
series with the external voltage source. The impedance
and rating of this resistor depends on the external
source peak voltage. Select a resistor value that will
drop all of the peak voltage when the current through
the resistor is nominally 300 µA (refer to Equation 28-1
and Figure 28-1). Make sure that the ZCD I/O pin internal weak pull-up is disabled so it does not interfere with
the current source and sink.
EQUATION 28-1:
FIGURE 28-1:
EXTERNAL VOLTAGE
VMAXPEAK
VMINPEAK
VPEAK
A/C period measurement
Accurate long term time measurement
Dimmer phase delayed drive
Low EMI cycle switching
FIGURE 28-2:
EXTERNAL RESISTOR
V PEAK
R SERIES = ---------------–4
3 10
The ZCD module is useful when monitoring an A/C
waveform for, but not limited to, the following purposes:
•
•
•
•
External Resistor Selection
ZCPINV
SIMPLIFIED ZCD BLOCK DIAGRAM
VPULLUP
optional
VDD
RPULLUP
External current
limiting resistor
ZCPINV
+
RSERIES
ZCD pin
RPULLDOWN
optional
External
voltage
source
ZCDx_output
D
ZCDxPOL
Q1
Q
ZCDxOUT
LE
Interrupt
det
ZCDxINTP
Sets
ZCDIF flag
ZCDxINTN
Interrupt
det
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PIC16(L)F1713/6
28.2
ZCD Logic Output
The ZCD module includes a Status bit, which can be
read to determine whether the current source or sink is
active. The ZCDxOUT bit of the ZCDxCON register is
set when the current sink is active, and cleared when
the current source is active. The ZCDxOUT bit is
affected by the polarity bit.
28.3
ZCD Logic Polarity
The ZCDxPOL bit of the ZCDxCON register inverts the
ZCDxOUT bit relative to the current source and sink
output. When the ZCDxPOL bit is set, a ZCDxOUT high
indicates that the current source is active, and a low
output indicates that the current sink is active.
The ZCDxPOL bit affects the ZCD interrupts. See
Section 28.4 “ZCD Interrupts”.
28.5
Correcting for ZCPINV offset
The actual voltage at which the ZCD switches is the
reference voltage at the non-inverting input of the ZCD
op amp. For external voltage source waveforms, other
than square waves, this voltage offset from zero
causes the zero-cross event to occur either too early or
too late. When the waveform is varying relative to VSS,
then the zero cross is detected too early as the
waveform falls and too late as the waveform rises.
When the waveform is varying relative to VDD, then the
zero cross is detected too late as the waveform rises
and too early as the waveform falls. The actual offset
time can be determined for sinusoidal waveforms with
the corresponding equations shown in Equation 28-2.
EQUATION 28-2:
ZCD EVENT OFFSET
When External Voltage Source is relative to Vss:
28.4
ZCD Interrupts
An interrupt will be generated upon a change in the
ZCD logic output when the appropriate interrupt
enables are set. A rising edge detector and a falling
edge detector are present in the ZCD for this purpose.
The ZCDIF bit of the PIR3 register will be set when
either edge detector is triggered and its associated
enable bit is set. The ZCDxINTP enables rising edge
interrupts and the ZCDxINTN bit enables falling edge
interrupts. Both are located in the ZCDxCON register.
To fully enable the interrupt, the following bits must be set:
• ZCDIE bit of the PIE3 register
• ZCDxINTP bit of the ZCDxCON register
(for a rising edge detection)
• ZCDxINTN bit of the ZCDxCON register
(for a falling edge detection)
• PEIE and GIE bits of the INTCON register
Changing the ZCDxPOL bit will cause an interrupt,
regardless of the level of the ZCDxEN bit.
The ZCDIF bit of the PIR3 register must be cleared in
software as part of the interrupt service. If another edge
is detected while this flag is being cleared, the flag will
still be set at the end of the sequence.
T OFFSET
Z CPINV
asin  ------------------
V PEAK
= ----------------------------------2  Freq
When External Voltage Source is relative to VDD:
T OFFSET
V DD – Z CPINV
asin  ---------------------------------
V PEAK
= ------------------------------------------------2  Freq
This offset time can be compensated for by adding a
pull-up or pull-down biasing resistor to the ZCD pin. A
pull-up resistor is used when the external voltage
source is varying relative to VSS. A pull-down resistor is
used when the voltage is varying relative to VDD. The
resistor adds a bias to the ZCD pin so that the target
external voltage source must go to zero to pull the pin
voltage to the ZCPINV switching voltage. The pull-up or
pull-down value can be determined with the equations
shown in Equation 28-3 or Equation 28-4.
EQUATION 28-3:
ZCD PULL-UP/DOWN
When External Signal is relative to Vss:
R SERIE S  V PULLUP – Z CPINV 
R PULLUP = -------------------------------------------------------------------------
Z CPINV
When External Signal is relative to VDD:
R SERIES  Z CPINV 
R PULLDOWN = -------------------------------------------- V DD – Z CPINV 
DS40001726C-page 274
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
The pull-up and pull-down resistor values are
significantly affected by small variations of ZCPINV.
Measuring ZCPINV can be difficult, especially when the
waveform is relative to VDD. However, by combining
Equations 28-2 and 28-3, the resistor value can be
determined from the time difference between the
ZCDx_output high and low periods. Note that the time
difference, ∆T, is 4*TOFFSET. The equation for
determining the pull-up and pull-down resistor values
from the high and low ZCDx_output periods is shown in
Equation 28-4. The ZCDx_output signal can be directly
observed on a pin by routing the ZCDx_output signal
through one of the CLCs.
EQUATION 28-4:




V BI A S
R = R SERIES  ---------------------------------------------------------------- – 1
T  
 V PE AK  sin  Freq ----------


 
2 
R is pull-up or pull-down resistor.
VBIAS is VPULLUP when R is pull-up or VDD when R
is pull-down.
∆T is the ZCDOUT high and low period difference.
28.6
Handling VPEAK Variations
If the peak amplitude of the external voltage is
expected to vary, the series resistor must be selected
to keep the ZCD current source and sink below the
design maximum range of ± 600 A and above a
reasonable minimum range. A general rule of thumb is
that the maximum peak voltage can be no more than
six times the minimum peak voltage. To ensure that the
maximum current does not exceed ± 600 A and the
minimum is at least ± 100 A, compute the series
resistance as shown in Equation 28-5. The
compensating pull-up for this series resistance can be
determined with Equation 28-3 because the pull-up
value is independent from the peak voltage.
EQUATION 28-5:
SERIES R FOR V RANGE
V MAXPEAK + V MINPEAK
R SERIES = --------------------------------------------------------–4
7 10
28.7
Operation During Sleep
The ZCD current sources and interrupts are unaffected
by Sleep.
28.8
Effects of a Reset
The ZCD circuit can be configured to default to the active
or inactive state on Power-on Reset (POR). When the
ZCDDIS Configuration bit is cleared, the ZCD circuit will
be active at POR. When the ZCDDIS Configuration bit is
set, the ZCDxEN bit of the ZCDxCON register must be
set to enable the ZCD module.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
28.9
Register Definitions: ZCD Control
REGISTER 28-1:
ZCDxCON: ZERO-CROSS DETECTION CONTROL REGISTER
R/W-0/0
U-0
R-x/x
R/W-0/0
U-0
U-0
R/W-0/0
R/W-0/0
ZCDxEN
—
ZCDxOUT
ZCDxPOL
—
—
ZCDxINTP
ZCDxINTN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
q = value depends on configuration bits
bit 7
ZCDxEN: Zero-Cross Detection Enable bit(1)
1 = Zero-cross detect is enabled. ZCD pin is forced to output to source and sink current.
0 = Zero-cross detect is disabled. ZCD pin operates according to PPS and TRIS controls.
bit 6
Unimplemented: Read as ‘0’
bit 5
ZCDxOUT: Zero-Cross Detection Logic Level bit
ZCDxPOL bit = 0:
1 = ZCD pin is sinking current
0 = ZCD pin is sourcing current
ZCDxPOL bit = 1:
1 = ZCD pin is sourcing current
0 = ZCD pin is sinking current
bit 4
ZCDxPOL: Zero-Cross Detection Logic Output Polarity bit
1 = ZCD logic output is inverted
0 = ZCD logic output is not inverted
bit 3-2
Unimplemented: Read as ‘0’
bit 1
ZCDxINTP: Zero-Cross Positive Edge Interrupt Enable bit
1 = ZCDIF bit is set on low-to-high ZCDx_output transition
0 = ZCDIF bit is unaffected by low-to-high ZCDx_output transition
bit 0
ZCDxINTN: Zero-Cross Negative Edge Interrupt Enable bit
1 = ZCDIF bit is set on high-to-low ZCDx_output transition
0 = ZCDIF bit is unaffected by high-to-low ZCDx_output transition
Note 1:
The ZCDxEN bit has no effect when the ZCDDIS Configuration bit is cleared.
TABLE 28-1:
SUMMARY OF REGISTERS ASSOCIATED WITH THE ZCD MODULE
Name
Bit 7
Bit 6
PIE3
—
—
PIR3
—
—
ZCD1EN
—
ZCD1OUT
ZCD1CON
Legend:
CONFIG2
Legend:
Bit 4
Bit 3
COGIE
ZCDIE
CWGIF
ZCDIF
ZCD1POL
Bit 0
Register
on page
—
—
86
—
—
Bit 2
Bit 1
—
—
—
—
—
—
ZCD1INTP ZCD1INTN
89
276
— = unimplemented, read as ‘0’. Shaded cells are unused by the ZCD module.
TABLE 28-2:
Name
Bit 5
SUMMARY OF CONFIGURATION WORD WITH THE ZCD MODULE
Bits
Bit -/7
Bit -/6
Bit 13/5
Bit 12/4
Bit 11/3
Bit 10/2
Bit 9/1
Bit 8/0
Register
on Page
13:8
—
—
LVP
DEBUG
LPBOR
BORV
STVREN
PLLEN
49
7:0
ZCDDIS
—
—
—
—
—
WRT<1:0>
— = unimplemented location, read as ‘0’. Shaded cells are not used by the ZCD module.
DS40001726C-page 276
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
29.0
CAPTURE/COMPARE/PWM
MODULES
The Capture/Compare/PWM module is a peripheral
which allows the user to time and control different
events, and to generate Pulse-Width Modulation
(PWM) signals. In Capture mode, the peripheral allows
the timing of the duration of an event. The Compare
mode allows the user to trigger an external event when
a predetermined amount of time has expired. The
PWM mode can generate Pulse-Width Modulated
signals of varying frequency and duty cycle.
This family of devices contains two standard
Capture/Compare/PWM modules (CCP1 and CCP2).
The Capture and Compare functions are identical for all
CCP modules.
Note 1: In devices with more than one CCP
module, it is very important to pay close
attention to the register names used. A
number placed after the module acronym
is used to distinguish between separate
modules. For example, the CCP1CON
and CCP2CON control the same
operational aspects of two completely
different CCP modules.
2: Throughout
this
section,
generic
references to a CCP module in any of its
operating modes may be interpreted as
being equally applicable to CCPx module.
Register names, module signals, I/O pins,
and bit names may use the generic
designator ‘x’ to indicate the use of a
numeral to distinguish a particular module,
when required.
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29.1
29.1.2
Capture Mode
The Capture mode function described in this section is
available and identical for all CCP modules.
Capture mode makes use of the 16-bit Timer1
resource. When an event occurs on the CCPx pin, the
16-bit CCPRxH:CCPRxL register pair captures and
stores the 16-bit value of the TMR1H:TMR1L register
pair, respectively. An event is defined as one of the
following and is configured by the CCPxM<3:0> bits of
the CCPxCON register:
•
•
•
•
Every falling edge
Every rising edge
Every 4th rising edge
Every 16th rising edge
When a capture is made, the Interrupt Request Flag bit
CCPxIF of the PIRx register is set. The interrupt flag
must be cleared in software. If another capture occurs
before the value in the CCPRxH, CCPRxL register pair
is read, the old captured value is overwritten by the new
captured value.
Figure 29-1 shows a simplified diagram of the capture
operation.
29.1.1
CCP PIN CONFIGURATION
In Capture mode, the CCPx pin should be configured
as an input by setting the associated TRIS control bit.
Note:
If the CCPx pin is configured as an output,
a write to the port can cause a capture
condition.
FIGURE 29-1:
Prescaler
 1, 4, 16
CAPTURE MODE
OPERATION BLOCK
DIAGRAM
Set Flag bit CCPxIF
(PIRx register)
CCPx
pin
CCPRxH
TIMER1 MODE RESOURCE
Timer1 must be running in Timer mode or Synchronized
Counter mode for the CCP module to use the capture
feature. In Asynchronous Counter mode, the capture
operation may not work.
See Section 26.0 “Timer1 Module with Gate
Control” for more information on configuring Timer1.
29.1.3
SOFTWARE INTERRUPT MODE
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCPxIE interrupt enable bit of the PIEx register clear to
avoid false interrupts. Additionally, the user should
clear the CCPxIF interrupt flag bit of the PIRx register
following any change in Operating mode.
Note:
29.1.4
Clocking Timer1 from the system clock
(FOSC) should not be used in Capture
mode. In order for Capture mode to
recognize the trigger event on the CCPx
pin, Timer1 must be clocked from the
instruction clock (FOSC/4) or from an
external clock source.
CCP PRESCALER
There are four prescaler settings specified by the
CCPxM<3:0> bits of the CCPxCON register. Whenever
the CCP module is turned off, or the CCP module is not
in Capture mode, the prescaler counter is cleared. Any
Reset will clear the prescaler counter.
Switching from one capture prescaler to another does not
clear the prescaler and may generate a false interrupt. To
avoid this unexpected operation, turn the module off by
clearing the CCPxCON register before changing the
prescaler. Example 29-1 demonstrates the code to
perform this function.
EXAMPLE 29-1:
CCPRxL
CHANGING BETWEEN
CAPTURE PRESCALERS
BANKSEL CCPxCON
and
Edge Detect
Capture
Enable
TMR1H
CCPxM<3:0>
System Clock (FOSC)
DS40001726C-page 278
TMR1L
CLRF
MOVLW
MOVWF
;Set Bank bits to point
;to CCPxCON
CCPxCON
;Turn CCP module off
NEW_CAPT_PS ;Load the W reg with
;the new prescaler
;move value and CCP ON
CCPxCON
;Load CCPxCON with this
;value
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
29.1.5
CAPTURE DURING SLEEP
29.2.1
Capture mode depends upon the Timer1 module for
proper operation. There are two options for driving the
Timer1 module in Capture mode. It can be driven by the
instruction clock (FOSC/4), or by an external clock source.
The user must configure the CCPx pin as an output by
clearing the associated TRIS bit.
Note:
When Timer1 is clocked by FOSC/4, Timer1 will not
increment during Sleep. When the device wakes from
Sleep, Timer1 will continue from its previous state.
Capture mode will operate during Sleep when Timer1
is clocked by an external clock source.
29.2
Compare Mode
The Compare mode function described in this section
is available and identical for all CCP modules.
Compare mode makes use of the 16-bit Timer1
resource. The 16-bit value of the CCPRxH:CCPRxL
register pair is constantly compared against the 16-bit
value of the TMR1H:TMR1L register pair. When a
match occurs, one of the following events can occur:
•
•
•
•
•
Toggle the CCPx output
Set the CCPx output
Clear the CCPx output
Generate an Auto-conversion Trigger
Generate a Software Interrupt
CCPX PIN CONFIGURATION
29.2.2
Clearing the CCPxCON register will force
the CCPx compare output latch to the
default low level. This is not the PORT I/O
data latch.
TIMER1 MODE RESOURCE
In Compare mode, Timer1 must be running in either
Timer mode or Synchronized Counter mode. The
compare operation may not work in Asynchronous
Counter mode.
See Section 26.0 “Timer1 Module with Gate Control”
for more information on configuring Timer1.
Note:
29.2.3
Clocking Timer1 from the system clock
(FOSC) should not be used in Compare
mode. In order for Compare mode to
recognize the trigger event on the CCPx
pin, TImer1 must be clocked from the
instruction clock (FOSC/4) or from an
external clock source.
SOFTWARE INTERRUPT MODE
The action on the pin is based on the value of the
CCPxM<3:0> control bits of the CCPxCON register. At
the same time, the interrupt flag CCPxIF bit is set.
When Generate Software Interrupt mode is chosen
(CCPxM<3:0> = 1010), the CCPx module does not
assert control of the CCPx pin (see the CCPxCON
register).
All Compare modes can generate an interrupt.
29.2.4
Figure 29-2 shows a simplified diagram of the compare
operation.
When Auto-conversion Trigger mode is chosen
(CCPxM<3:0> = 1011), the CCPx module does the
following:
FIGURE 29-2:
COMPARE MODE
OPERATION BLOCK
DIAGRAM
Set CCPxIF Interrupt Flag
(PIRx)
4
CCPRxH CCPRxL
Q
S
R
Output
Logic
• Resets Timer1
• Starts an ADC conversion if ADC is enabled
The CCPx module does not assert control of the CCPx
pin in this mode.
CCPxM<3:0>
Mode Select
CCPx
Pin
AUTO-CONVERSION TRIGGER
Match
TRIS
Output Enable
Comparator
TMR1H
TMR1L
The Auto-conversion Trigger output of the CCP occurs
immediately upon a match between the TMR1H,
TMR1L register pair and the CCPRxH, CCPRxL
register pair. The TMR1H, TMR1L register pair is not
reset until the next rising edge of the Timer1 clock. The
Auto-conversion Trigger output starts an ADC conversion (if the ADC module is enabled). This allows the
CCPRxH, CCPRxL register pair to effectively provide a
16-bit programmable period register for Timer1.
Auto-conversion Trigger
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Refer to Section 29.2.4 “Auto-Conversion Trigger”
for more information.
Note 1: The Auto-conversion Trigger from the
CCP module does not set interrupt flag
bit TMR1IF of the PIR1 register.
2: Removing the match condition by
changing the contents of the CCPRxH
and CCPRxL register pair, between the
clock
edge
that
generates
the
Auto-conversion Trigger and the clock
edge that generates the Timer1 Reset,
will preclude the Reset from occurring.
29.2.5
COMPARE DURING SLEEP
The Compare mode is dependent upon the system
clock (FOSC) for proper operation. Since FOSC is shut
down during Sleep mode, the Compare mode will not
function properly during Sleep.
29.3
29.3.1
STANDARD PWM OPERATION
The standard PWM function described in this section is
available and identical for all CCP modules.
The standard PWM mode generates a Pulse-Width
Modulation (PWM) signal on the CCPx pin with up to 10
bits of resolution. The period, duty cycle, and resolution
are controlled by the following registers:
•
•
•
•
PR2 registers
T2CON registers
CCPRxL registers
CCPxCON registers
Figure 29-4 shows a simplified block diagram of PWM
operation.
The corresponding TRIS bit must be
cleared to enable the PWM output on the
CCPx pin.
Note:
PWM Overview
Pulse-Width Modulation (PWM) is a scheme that
provides power to a load by switching quickly between
fully on and fully off states. The PWM signal resembles
a square wave where the high portion of the signal is
considered the on state and the low portion of the signal
is considered the off state. The high portion, also known
as the pulse width, can vary in time and is defined in
steps. A larger number of steps applied, which
lengthens the pulse width, also supplies more power to
the load. Lowering the number of steps applied, which
shortens the pulse width, supplies less power. The
PWM period is defined as the duration of one complete
cycle or the total amount of on and off time combined.
PWM resolution defines the maximum number of steps
that can be present in a single PWM period. A higher
resolution allows for more precise control of the pulse
width time and in turn the power that is applied to the
load.
The term duty cycle describes the proportion of the on
time to the off time and is expressed in percentages,
where 0% is fully off and 100% is fully on. A lower duty
cycle corresponds to less power applied and a higher
duty cycle corresponds to more power applied.
FIGURE 29-3:
Period
Pulse Width
TMR2 = PR2
TMR2 = CCPRxH:CCPxCON<5:4>
TMR2 = 0
FIGURE 29-4:
SIMPLIFIED PWM BLOCK
DIAGRAM
CCP1CON<5:4>
Duty Cycle Registers
CCPR1L
CCPR1H(2) (Slave)
CCP1
R
Comparator
Figure 29-3 shows a typical waveform of the PWM
signal.
(1)
TMR2
Q
S
TRIS
Comparator
PR2
Note
1:
2:
DS40001726C-page 280
CCP PWM OUTPUT SIGNAL
Clear Timer,
toggle CCP1 pin and
latch duty cycle
The 8-bit timer TMR2 register is
concatenated with the 2-bit internal system
clock (FOSC), or two bits of the prescaler, to
create the 10-bit time base.
In PWM mode, CCPR1H is a read-only
register.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
29.3.2
SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for standard PWM operation:
1.
2.
3.
4.
5.
6.
Use the desired output pin RxyPPS control to
select CCPx as the source and disable the
CCPx pin output driver by setting the associated
TRIS bit.
Load the PR2 register with the PWM period
value.
Configure the CCP module for the PWM mode
by loading the CCPxCON register with the
appropriate values.
Load the CCPRxL register and the DCxBx bits
of the CCPxCON register, with the PWM duty
cycle value.
Configure and start Timer2:
• Clear the TMR2IF interrupt flag bit of the
PIRx register. See Note below.
• Configure the T2CKPS bits of the T2CON
register with the Timer prescale value.
• Enable the Timer by setting the TMR2ON
bit of the T2CON register.
Enable PWM output pin:
• Wait until the Timer overflows and the
TMR2IF bit of the PIR1 register is set. See
Note below.
• Enable the CCPx pin output driver by
clearing the associated TRIS bit.
Note:
29.3.3
In order to send a complete duty cycle and
period on the first PWM output, the above
steps must be included in the setup
sequence. If it is not critical to start with a
complete PWM signal on the first output,
then step 6 may be ignored.
TIMER2 TIMER RESOURCE
The PWM standard mode makes use of the 8-bit
Timer2 timer resources to specify the PWM period.
29.3.4
PWM PERIOD
The PWM period is specified by the PR2 register of
Timer2. The PWM period can be calculated using the
formula of Equation 29-1.
EQUATION 29-1:
PWM PERIOD
PWM Period =   PR2  + 1   4  T OSC 
(TMR2 Prescale Value)
Note 1:
TOSC = 1/FOSC
When TMR2 is equal to PR2, the following three events
occur on the next increment cycle:
• TMR2 is cleared
• The CCPx pin is set. (Exception: If the PWM duty
cycle = 0%, the pin will not be set.)
• The PWM duty cycle is latched from CCPRxL into
CCPRxH.
Note:
29.3.5
The Timer postscaler (see Section 27.1
“Timer2 Operation”) is not used in the
determination of the PWM frequency.
PWM DUTY CYCLE
The PWM duty cycle is specified by writing a 10-bit
value to multiple registers: CCPRxL register and
DCxB<1:0> bits of the CCPxCON register. The
CCPRxL contains the eight MSbs and the DCxB<1:0>
bits of the CCPxCON register contain the two LSbs.
CCPRxL and DCxB<1:0> bits of the CCPxCON
register can be written to at any time. The duty cycle
value is not latched into CCPRxH until after the period
completes (i.e., a match between PR2 and TMR2
registers occurs). While using the PWM, the CCPRxH
register is read-only.
Equation 29-2 is used to calculate the PWM pulse
width.
Equation 29-3 is used to calculate the PWM duty cycle
ratio.
EQUATION 29-2:
PULSE WIDTH
Pulse Width =  CCPRxL:CCPxCON<5:4>  
T OSC  (TMR2 Prescale Value)
EQUATION 29-3:
DUTY CYCLE RATIO
 CCPRxL:CCPxCON<5:4> 
Duty Cycle Ratio = ----------------------------------------------------------------------4  PR2 + 1 
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The CCPRxH register and a 2-bit internal latch are
used to double buffer the PWM duty cycle. This double
buffering is essential for glitchless PWM operation.
The 8-bit timer TMR2 register is concatenated with
either the 2-bit internal system clock (FOSC), or two bits
of the prescaler, to create the 10-bit time base. The
system clock is used if the Timer2 prescaler is set to 1:1.
When the 10-bit time base matches the CCPRxH and
2-bit latch, then the CCPx pin is cleared (see
Figure 29-4).
29.3.6
PWM RESOLUTION
The maximum PWM resolution is 10 bits when PR2 is
255. The resolution is a function of the PR2 register
value as shown by Equation 29-4.
EQUATION 29-4:
PWM RESOLUTION
log  4  PR2 + 1  
Resolution = ------------------------------------------ bits
log  2 
If the pulse width value is greater than the period the
assigned PWM pin(s) will remain unchanged.
The resolution determines the number of available duty
cycles for a given period. For example, a 10-bit resolution
will result in 1024 discrete duty cycles, whereas an 8-bit
resolution will result in 256 discrete duty cycles.
TABLE 29-1:
EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
PWM Frequency
1.22 kHz
4.88 kHz
19.53 kHz
78.12 kHz
156.3 kHz
208.3 kHz
16
4
1
1
1
1
0xFF
0xFF
0xFF
0x3F
0x1F
0x17
10
10
10
8
7
6.6
Timer Prescale
PR2 Value
Maximum Resolution (bits)
TABLE 29-2:
EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
PWM Frequency
1.22 kHz
Timer Prescale
PR2 Value
19.61 kHz
76.92 kHz
153.85 kHz
200.0 kHz
16
4
1
1
1
1
0x65
0x65
0x65
0x19
0x0C
0x09
8
8
8
6
5
5
Maximum Resolution (bits)
29.3.7
4.90 kHz
OPERATION IN SLEEP MODE
In Sleep mode, the TMR2 register will not increment
and the state of the module will not change. If the CCPx
pin is driving a value, it will continue to drive that value.
When the device wakes up, TMR2 will continue from its
previous state.
29.3.8
CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency. Any changes in the system clock frequency
will result in changes to the PWM frequency. See
Section 6.0 “Oscillator Module (with Fail-Safe
Clock Monitor)” for additional details.
29.3.9
EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
CCP registers to their Reset states.
DS40001726C-page 282
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TABLE 29-3:
Name
CCP1CON
CCPR1L
CCPTMRS
SUMMARY OF REGISTERS ASSOCIATED WITH CCP
Bit 7
Bit 6
—
—
Bit 5
Bit 4
Bit 3
DC1B<1:0>
Bit 0
P4TSEL<1:0>
Register
on Page
284
Capture/Compare/PWM Register 1 (LSB)
281*
P3TSEL<1:0>
C2TSEL<1:0>
PEIE
TMR0IE
INTE
IOCIE
PIE1
TMR1GIE
ADIE
RCIE
TXIE
PIE2
OSFIE
C2IE
C1IE
—
PIR1
TMR1GIF
ADIF
RCIF
TXIF
PIR2
OSFIF
C2IF
C1IF
—
PR2
Bit 1
CCP1M<3:0>
GIE
INTCON
Bit 2
C1TSEL<1:0>
272
TMR0IF
INTF
IOCIF
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
BCL1IE
TMR6IE
TMR4IE
CCP2IE
85
SSP1IF
CCP1IF
TMR2IF
TMR1IF
87
BCL1IF
TMR6IF
TMR4IF
CCP2IF
88
Timer2 Period Register
83
268*
ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
125
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
RxyPPS
—
—
—
RxyPPS<4:0>
137
CCP1PPS
—
—
—
CCP1PPS<4:0>
136
CCP2PPS
—
—
—
CCP2PPS<4:0>
T2CON
—
TMR2
T2OUTPS<3:0>
TMR2ON
Timer2 Module Register
130
136
T2CKPS<1:0>
270
268
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the CCP.
* Page provides register information.
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29.4
Register Definitions: CCP Control
REGISTER 29-1:
CCPxCON: CCPx CONTROL REGISTER
U-0
U-0
—
—
R/W-0/0
R/W-0/0
R/W-0/0
DCxB<1:0>
R/W-0/0
R/W-0/0
R/W-0/0
CCPxM<3:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Reset
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-4
DCxB<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused
Compare mode:
Unused
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPRxL.
bit 3-0
CCPxM<3:0>: CCPx Mode Select bits
11xx = PWM mode
1011 = Compare mode: Auto-conversion Trigger (sets CCPxIF bit), starts ADC conversion if
TRIGSEL = CCPx (see Register 21-3)
1010 = Compare mode: generate software interrupt only
1001 = Compare mode: clear output on compare match (set CCPxIF)
1000 = Compare mode: set output on compare match (set CCPxIF)
0111 =
0110 =
0101 =
0100 =
Capture mode: every 16th rising edge
Capture mode: every 4th rising edge
Capture mode: every rising edge
Capture mode: every falling edge
0011 =
0010 =
0001 =
0000 =
Reserved
Compare mode: toggle output on match
Reserved
Capture/Compare/PWM off (resets CCPx module)
DS40001726C-page 284
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30.0
MASTER SYNCHRONOUS
SERIAL PORT (MSSP)
MODULE
30.1
MSSP Module Overview
The Master Synchronous Serial Port (MSSP) module is
a serial interface useful for communicating with other
peripheral or microcontroller devices. These peripheral
devices may be serial EEPROMs, shift registers,
display drivers, A/D converters, etc. The MSSP module
can operate in one of two modes:
• Serial Peripheral Interface (SPI)
• Inter-Integrated Circuit (I2C)
The SPI interface supports the following modes and
features:
•
•
•
•
•
Master mode
Slave mode
Clock Parity
Slave Select Synchronization (Slave mode only)
Daisy-chain connection of slave devices
Figure 30-1 is a block diagram of the SPI interface
module.
FIGURE 30-1:
MSSP BLOCK DIAGRAM (SPI MODE)
Data Bus
Read
Write
SSPBUF Reg
SDI
SSPSR Reg
SDO
bit 0
SS
SS Control
Enable
Shift
Clock
2 (CKP, CKE)
Clock Select
Edge
Select
SSPM<3:0>
4
SCK
Edge
Select
TRIS bit
 2013-2016 Microchip Technology Inc.
(
T2_match
2
)
Prescaler TOSC
4, 16, 64
Baud Rate
Generator
(SSPADD)
DS40001726C-page 285
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The I2C interface supports the following modes and
features:
•
•
•
•
•
•
•
•
•
•
•
•
•
Master mode
Slave mode
Byte NACKing (Slave mode)
Limited multi-master support
7-bit and 10-bit addressing
Start and Stop interrupts
Interrupt masking
Clock stretching
Bus collision detection
General call address matching
Address masking
Address Hold and Data Hold modes
Selectable SDA hold times
Figure 30-2 is a block diagram of the I2C interface module in Master mode. Figure 30-3 is a diagram of the I2C
interface module in Slave mode.
MSSP BLOCK DIAGRAM (I2C MASTER MODE)
Internal
data bus
Read
[SSPM<3:0>]
Write
SSP1BUF
Shift
Clock
SDA in
Receive Enable (RCEN)
SCL
SCL in
Bus Collision
DS40001726C-page 286
LSb
Start bit, Stop bit,
Acknowledge
Generate (SSPCON2)
Start bit detect,
Stop bit detect
Write collision detect
Clock arbitration
State counter for
end of XMIT/RCV
Address Match detect
Clock Cntl
SSPSR
MSb
(Hold off clock source)
SDA
Baud Rate
Generator
(SSPADD)
Clock arbitrate/BCOL detect
FIGURE 30-2:
Set/Reset: S, P, SSPSTAT, WCOL, SSPOV
Reset SEN, PEN (SSPCON2)
Set SSP1IF, BCL1IF
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 30-3:
MSSP BLOCK DIAGRAM (I2C SLAVE MODE)
Internal
Data Bus
Read
Write
SSPBUF Reg
SCL
Shift
Clock
SSPSR Reg
SDA
MSb
LSb
SSPMSK Reg
Match Detect
Addr Match
SSPADD Reg
Start and
Stop bit Detect
 2013-2016 Microchip Technology Inc.
Set, Reset
S, P bits
(SSPSTAT Reg)
DS40001726C-page 287
PIC16(L)F1713/6
30.2
SPI Mode Overview
The Serial Peripheral Interface (SPI) bus is a
synchronous serial data communication bus that
operates in Full-Duplex mode. Devices communicate
in a master/slave environment where the master device
initiates the communication. A slave device is
controlled through a Chip Select known as Slave
Select.
The SPI bus specifies four signal connections:
•
•
•
•
Serial Clock (SCK)
Serial Data Out (SDO)
Serial Data In (SDI)
Slave Select (SS)
Figure 30-1 shows the block diagram of the MSSP
module when operating in SPI mode.
The SPI bus operates with a single master device and
one or more slave devices. When multiple slave
devices are used, an independent Slave Select
connection is required from the master device to each
slave device.
Figure 30-4 shows a typical connection between a
master device and multiple slave devices.
The master selects only one slave at a time. Most slave
devices have tri-state outputs so their output signal
appears disconnected from the bus when they are not
selected.
Transmissions involve two shift registers, eight bits in
size, one in the master and one in the slave. With either
the master or the slave device, data is always shifted
out one bit at a time, with the Most Significant bit (MSb)
shifted out first. At the same time, a new Least
Significant bit (LSb) is shifted into the same register.
During each SPI clock cycle, a full-duplex data
transmission occurs. This means that while the master
device is sending out the MSb from its shift register (on
its SDO pin) and the slave device is reading this bit and
saving it as the LSb of its shift register, that the slave
device is also sending out the MSb from its shift register
(on its SDO pin) and the master device is reading this
bit and saving it as the LSb of its shift register.
After eight bits have been shifted out, the master and
slave have exchanged register values.
If there is more data to exchange, the shift registers are
loaded with new data and the process repeats itself.
Whether the data is meaningful or not (dummy data),
depends on the application software. This leads to
three scenarios for data transmission:
• Master sends useful data and slave sends dummy
data.
• Master sends useful data and slave sends useful
data.
• Master sends dummy data and slave sends useful
data.
Transmissions may involve any number of clock
cycles. When there is no more data to be transmitted,
the master stops sending the clock signal and it
deselects the slave.
Every slave device connected to the bus that has not
been selected through its slave select line must disregard the clock and transmission signals and must not
transmit out any data of its own.
Figure 30-5 shows a typical connection between two
processors configured as master and slave devices.
Data is shifted out of both shift registers on the
programmed clock edge and latched on the opposite
edge of the clock.
The master device transmits information out on its SDO
output pin which is connected to, and received by, the
slave’s SDI input pin. The slave device transmits information out on its SDO output pin, which is connected
to, and received by, the master’s SDI input pin.
To begin communication, the master device first sends
out the clock signal. Both the master and the slave
devices should be configured for the same clock polarity.
The master device starts a transmission by sending out
the MSb from its shift register. The slave device reads
this bit from that same line and saves it into the LSb
position of its shift register.
DS40001726C-page 288
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FIGURE 30-4:
SPI MASTER AND MULTIPLE SLAVE CONNECTION
SPI Master
SCK
SCK
SDO
SDI
SDI
SDO
General I/O
General I/O
SS
General I/O
SCK
SDI
SDO
SPI Slave
#1
SPI Slave
#2
SS
SCK
SDI
SDO
SPI Slave
#3
SS
30.2.1
SPI MODE REGISTERS
The MSSP module has five registers for SPI mode
operation. These are:
•
•
•
•
•
•
MSSP STATUS register (SSPSTAT)
MSSP Control register 1 (SSPCON1)
MSSP Control register 3 (SSPCON3)
MSSP Data Buffer register (SSPBUF)
MSSP Address register (SSPADD)
MSSP Shift register (SSPSR)
(Not directly accessible)
SSPCON1 and SSPSTAT are the control and STATUS
registers in SPI mode operation. The SSPCON1
register is readable and writable. The lower six bits of
the SSPSTAT are read-only. The upper two bits of the
SSPSTAT are read/write.
In one SPI master mode, SSPADD can be loaded with
a value used in the Baud Rate Generator. More information on the Baud Rate Generator is available in
Section 30.7 “Baud Rate Generator”.
SSPSR is the shift register used for shifting data in and
out. SSPBUF provides indirect access to the SSPSR
register. SSPBUF is the buffer register to which data
bytes are written, and from which data bytes are read.
In receive operations, SSPSR and SSPBUF together
create a buffered receiver. When SSPSR receives a
complete byte, it is transferred to SSPBUF and the
SSPIF interrupt is set.
During transmission, the SSPBUF is not buffered. A
write to SSPBUF will write to both SSPBUF and
SSPSR.
30.2.2
SPI MODE OPERATION
When initializing the SPI, several options need to be
specified. This is done by programming the appropriate
control bits (SSPCON1<5:0> and SSPSTAT<7:6>).
These control bits allow the following to be specified:
•
•
•
•
Master mode (SCK is the clock output)
Slave mode (SCK is the clock input)
Clock Polarity (Idle state of SCK)
Data Input Sample Phase (middle or end of data
output time)
• Clock Edge (output data on rising/falling edge of
SCK)
• Clock Rate (Master mode only)
• Slave Select mode (Slave mode only)
To enable the serial port, SSP Enable bit, SSPEN of the
SSPCON1 register, must be set. To reset or reconfigure SPI mode, clear the SSPEN bit, re-initialize the
SSPCONx registers and then set the SSPEN bit. This
configures the SDI, SDO, SCK and SS pins as serial
port pins. For the pins to behave as the serial port
function, some must have their data direction bits (in
the TRIS register) appropriately programmed as
follows:
• SDI must have corresponding TRIS bit set
• SDO must have corresponding TRIS bit cleared
• SCK (Master mode) must have corresponding
TRIS bit cleared
• SCK (Slave mode) must have corresponding
TRIS bit set
• SS must have corresponding TRIS bit set
Any serial port function that is not desired may be
overridden by programming the corresponding data
direction (TRIS) register to the opposite value.
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PIC16(L)F1713/6
The MSSP consists of a transmit/receive shift register
(SSPSR) and a buffer register (SSPBUF). The SSPSR
shifts the data in and out of the device, MSb first. The
SSPBUF holds the data that was written to the SSPSR
until the received data is ready. Once the eight bits of
data have been received, that byte is moved to the
SSPBUF register. Then, the Buffer Full Detect bit, BF
of the SSPSTAT register, and the interrupt flag bit,
SSPIF, are set. This double-buffering of the received
data (SSPBUF) allows the next byte to start reception
before reading the data that was just received. Any
write to the SSPBUF register during transmission/reception of data will be ignored and the write
collision detect bit WCOL of the SSPCON1 register, will
be set. User software must clear the WCOL bit to allow
the following write(s) to the SSPBUF register to
complete successfully.
FIGURE 30-5:
When the application software is expecting to receive
valid data, the SSPBUF should be read before the next
byte of data to transfer is written to the SSPBUF. The
Buffer Full bit, BF of the SSPSTAT register, indicates
when SSPBUF has been loaded with the received data
(transmission is complete). When the SSPBUF is read,
the BF bit is cleared. This data may be irrelevant if the
SPI is only a transmitter. Generally, the MSSP interrupt
is used to determine when the transmission/reception
has completed. If the interrupt method is not going to
be used, then software polling can be done to ensure
that a write collision does not occur.
The SSPSR is not directly readable or writable and can
only be accessed by addressing the SSPBUF register.
Additionally, the SSPSTAT register indicates the
various Status conditions.
SPI MASTER/SLAVE CONNECTION
SPI Master SSPM<3:0> = 00xx
= 1010
SPI Slave SSPM<3:0> = 010x
SDO
SDI
Serial Input Buffer
(BUF)
SDI
Shift Register
(SSPSR)
MSb
Serial Input Buffer
(SSPBUF)
LSb
SCK
General I/O
Processor 1
DS40001726C-page 290
SDO
Serial Clock
Slave Select
(optional)
Shift Register
(SSPSR)
MSb
LSb
SCK
SS
Processor 2
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30.2.3
SPI MASTER MODE
The master can initiate the data transfer at any time
because it controls the SCK line. The master
determines when the slave (Processor 2, Figure 30-5)
is to broadcast data by the software protocol.
In Master mode, the data is transmitted/received as
soon as the SSPBUF register is written to. If the SPI is
only going to receive, the SDO output could be
disabled (programmed as an input). The SSPSR
register will continue to shift in the signal present on the
SDI pin at the programmed clock rate. As each byte is
received, it will be loaded into the SSPBUF register as
if a normal received byte (interrupts and Status bits
appropriately set).
The clock polarity is selected by appropriately
programming the CKP bit of the SSPCON1 register
and the CKE bit of the SSPSTAT register. This then,
would give waveforms for SPI communication as
shown in Figure 30-6, Figure 30-8, Figure 30-9 and
Figure 30-10, where the MSB is transmitted first. In
Master mode, the SPI clock rate (bit rate) is user
programmable to be one of the following:
•
•
•
•
•
FOSC/4 (or TCY)
FOSC/16 (or 4 * TCY)
FOSC/64 (or 16 * TCY)
Timer2 output/2
FOSC/(4 * (SSPADD + 1))
Figure 30-6 shows the waveforms for Master mode.
When the CKE bit is set, the SDO data is valid before
there is a clock edge on SCK. The change of the input
sample is shown based on the state of the SMP bit. The
time when the SSPBUF is loaded with the received
data is shown.
Note:
 2013-2016 Microchip Technology Inc.
In Master mode the clock signal output to
the SCK pin is also the clock signal input
to the peripheral. The pin selected for output with the RxyPPS register must also be
selected as the peripheral input with the
SSPCLKPPS register.
DS40001726C-page 291
PIC16(L)F1713/6
FIGURE 30-6:
SPI MODE WAVEFORM (MASTER MODE)
Write to
SSPBUF
SCK
(CKP = 0
CKE = 0)
SCK
(CKP = 1
CKE = 0)
4 Clock
Modes
SCK
(CKP = 0
CKE = 1)
SCK
(CKP = 1
CKE = 1)
SDO
(CKE = 0)
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
SDO
(CKE = 1)
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
SDI
(SMP = 0)
bit 0
bit 7
Input
Sample
(SMP = 0)
SDI
(SMP = 1)
bit 7
bit 0
Input
Sample
(SMP = 1)
SSPIF
SSPSR to
SSPBUF
30.2.4
SPI SLAVE MODE
In Slave mode, the data is transmitted and received as
external clock pulses appear on SCK. When the last
bit is latched, the SSPIF interrupt flag bit is set.
Before enabling the module in SPI Slave mode, the clock
line must match the proper Idle state. The clock line can
be observed by reading the SCK pin. The Idle state is
determined by the CKP bit of the SSPCON1 register.
While in Slave mode, the external clock is supplied by
the external clock source on the SCK pin. This external
clock must meet the minimum high and low times as
specified in the electrical specifications.
While in Sleep mode, the slave can transmit/receive
data. The shift register is clocked from the SCK pin
input and when a byte is received, the device will
generate an interrupt. If enabled, the device will
wake-up from Sleep.
Daisy-Chain Configuration
DS40001726C-page 292
The SPI bus can sometimes be connected in a
daisy-chain configuration. The first slave output is
connected to the second slave input, the second slave
output is connected to the third slave input, and so on.
The final slave output is connected to the master input.
Each slave sends out, during a second group of clock
pulses, an exact copy of what was received during the
first group of clock pulses. The whole chain acts as
one large communication shift register. The
daisy-chain feature only requires a single Slave Select
line from the master device.
Figure 30-7 shows the block diagram of a typical
daisy-chain connection when operating in SPI mode.
In a daisy-chain configuration, only the most recent
byte on the bus is required by the slave. Setting the
BOEN bit of the SSPCON3 register will enable writes
to the SSPBUF register, even if the previous byte has
not been read. This allows the software to ignore data
that may not apply to it.
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30.2.5
SLAVE SELECT
SYNCHRONIZATION
When the SS pin is low, transmission and reception are
enabled and the SDO pin is driven.
The Slave Select can also be used to synchronize
communication. The Slave Select line is held high until
the master device is ready to communicate. When the
Slave Select line is pulled low, the slave knows that a
new transmission is starting.
If the slave fails to receive the communication properly,
it will be reset at the end of the transmission, when the
Slave Select line returns to a high state. The slave is
then ready to receive a new transmission when the
Slave Select line is pulled low again. If the Slave Select
line is not used, there is a risk that the slave will
eventually become out of sync with the master. If the
slave misses a bit, it will always be one bit off in future
transmissions. Use of the Slave Select line allows the
slave and master to align themselves at the beginning
of each transmission.
The SS pin allows a Synchronous Slave mode. The
SPI must be in Slave mode with SS pin control enabled
(SSPCON1<3:0> = 0100).
FIGURE 30-7:
When the SS pin goes high, the SDO pin is no longer
driven, even if in the middle of a transmitted byte and
becomes a floating output. External pull-up/pull-down
resistors may be desirable depending on the application.
Note 1: When the SPI is in Slave mode with SS pin
control enabled (SSPCON1<3:0> =
0100), the SPI module will reset if the SS
pin is set to VDD.
2: When the SPI is used in Slave mode with
CKE set; the user must enable SS pin
control.
3: While operated in SPI Slave mode the
SMP bit of the SSPSTAT register must
remain clear.
When the SPI module resets, the bit counter is forced
to ‘0’. This can be done by either forcing the SS pin to
a high level or clearing the SSPEN bit.
SPI DAISY-CHAIN CONNECTION
SPI Master
SCK
SCK
SDO
SDI
SDI
General I/O
SDO
SPI Slave
#1
SS
SCK
SDI
SDO
SPI Slave
#2
SS
SCK
SDI
SDO
SPI Slave
#3
SS
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FIGURE 30-8:
SLAVE SELECT SYNCHRONOUS WAVEFORM
SS
SCK
(CKP = 0
CKE = 0)
SCK
(CKP = 1
CKE = 0)
Write to
SSPBUF
Shift register SSPSR
and bit count are reset
SSPBUF to
SSPSR
SDO
bit 7
bit 6
bit 7
SDI
bit 6
bit 0
bit 0
bit 7
bit 7
Input
Sample
SSPIF
Interrupt
Flag
SSPSR to
SSPBUF
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FIGURE 30-9:
SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)
SS
Optional
SCK
(CKP = 0
CKE = 0)
SCK
(CKP = 1
CKE = 0)
Write to
SSPBUF
Valid
SDO
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
SDI
bit 0
bit 7
Input
Sample
SSPIF
Interrupt
Flag
SSPSR to
SSPBUF
Write Collision
detection active
FIGURE 30-10:
SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)
SS
Not Optional
SCK
(CKP = 0
CKE = 1)
SCK
(CKP = 1
CKE = 1)
Write to
SSPBUF
Valid
SDO
bit 7
bit 6
bit 5
bit 4
bit 3
bit 2
bit 1
bit 0
SDI
bit 7
bit 0
Input
Sample
SSPIF
Interrupt
Flag
SSPSR to
SSPBUF
Write Collision
detection active
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30.2.6
SPI OPERATION IN SLEEP MODE
In SPI Master mode, module clocks may be operating
at a different speed than when in Full-Power mode; in
the case of the Sleep mode, all clocks are halted.
Special care must be taken by the user when the MSSP
clock is much faster than the system clock.
In Slave mode, when MSSP interrupts are enabled,
after the master completes sending data, an MSSP
interrupt will wake the controller from Sleep.
If an exit from Sleep mode is not desired, MSSP
interrupts should be disabled.
TABLE 30-1:
In SPI Master mode, when the Sleep mode is selected,
all module clocks are halted and the transmission/reception will remain in that state until the device
wakes. After the device returns to Run mode, the
module will resume transmitting and receiving data.
In SPI Slave mode, the SPI Transmit/Receive Shift
register operates asynchronously to the device. This
allows the device to be placed in Sleep mode and data
to be shifted into the SPI Transmit/Receive Shift
register. When all eight bits have been received, the
MSSP interrupt flag bit will be set and if enabled, will
wake the device.
SUMMARY OF REGISTERS ASSOCIATED WITH SPI OPERATION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
ANSELA
—
—
ANSA5
ANSA4
ANSA3
ANSA2
ANSA1
ANSA0
120
ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
Name
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
PIE1
INTCON
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
PIR1
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
TMR1GIF
ADIF
RCIF
RxyPPS
—
—
—
RxyPPS<4:0>
137
SSPCLKPPS
—
—
—
SSPCLKPPS<4:0>
136
SSPDATPPS
—
—
—
SSPDATPPS<4:0>
136
SSPSSPPS
—
—
—
SSPSSPPS<4:0>
136
SSP1BUF
Synchronous Serial Port Receive Buffer/Transmit Register
87
289*
SSP1CON1
WCOL
SSPOV
SSPEN
CKP
SSP1CON3
ACKTIM
PCIE
SCIE
BOEN
SDAHT
SBCDE
AHEN
DHEN
332
SSP1STAT
SMP
CKE
D/A
P
S
R/W
UA
BF
332
TRISA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
TRISC
Legend:
*
SSPM<3:0>
333
— = Unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP in SPI mode.
Page provides register information.
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30.3
I2C MODE OVERVIEW
FIGURE 30-11:
The Inter-Integrated Circuit (I2C) bus is a multi-master
serial data communication bus. Devices communicate
in a master/slave environment where the master
devices initiate the communication. A slave device is
controlled through addressing.
VDD
SCL
The I2C bus specifies two signal connections:
• Serial Clock (SCL)
• Serial Data (SDA)
Figure 30-11 shows the block diagram of the MSSP
module when operating in I2C mode.
Both the SCL and SDA connections are bidirectional
open-drain lines, each requiring pull-up resistors for the
supply voltage. Pulling the line to ground is considered
a logical zero and letting the line float is considered a
logical one.
Figure 30-11 shows a typical connection between two
processors configured as master and slave devices.
The I2C bus can operate with one or more master
devices and one or more slave devices.
There are four potential modes of operation for a given
device:
• Master Transmit mode
(master is transmitting data to a slave)
• Master Receive mode
(master is receiving data from a slave)
• Slave Transmit mode
(slave is transmitting data to a master)
• Slave Receive mode
(slave is receiving data from the master)
To begin communication, a master device starts out in
Master Transmit mode. The master device sends out a
Start bit followed by the address byte of the slave it
intends to communicate with. This is followed by a
single Read/Write bit, which determines whether the
master intends to transmit to or receive data from the
slave device.
If the requested slave exists on the bus, it will respond
with an Acknowledge bit, otherwise known as an ACK.
The master then continues in either Transmit mode or
Receive mode and the slave continues in the complement, either in Receive mode or Transmit mode,
respectively.
A Start bit is indicated by a high-to-low transition of the
SDA line while the SCL line is held high. Address and
data bytes are sent out, Most Significant bit (MSb) first.
The Read/Write bit is sent out as a logical one when the
master intends to read data from the slave, and is sent
out as a logical zero when it intends to write data to the
slave.
 2013-2016 Microchip Technology Inc.
I2C MASTER/
SLAVE CONNECTION
SCL
VDD
Master
Slave
SDA
SDA
The Acknowledge bit (ACK) is an active-low signal,
which holds the SDA line low to indicate to the transmitter that the slave device has received the transmitted
data and is ready to receive more.
The transition of a data bit is always performed while
the SCL line is held low. Transitions that occur while the
SCL line is held high are used to indicate Start and Stop
bits.
If the master intends to write to the slave, then it repeatedly sends out a byte of data, with the slave responding
after each byte with an ACK bit. In this example, the
master device is in Master Transmit mode and the
slave is in Slave Receive mode.
If the master intends to read from the slave, then it
repeatedly receives a byte of data from the slave, and
responds after each byte with an ACK bit. In this example, the master device is in Master Receive mode and
the slave is Slave Transmit mode.
On the last byte of data communicated, the master
device may end the transmission by sending a Stop bit.
If the master device is in Receive mode, it sends the
Stop bit in place of the last ACK bit. A Stop bit is
indicated by a low-to-high transition of the SDA line
while the SCL line is held high.
In some cases, the master may want to maintain
control of the bus and re-initiate another transmission.
If so, the master device may send another Start bit in
place of the Stop bit or last ACK bit when it is in receive
mode.
The I2C bus specifies three message protocols;
• Single message where a master writes data to a
slave.
• Single message where a master reads data from
a slave.
• Combined message where a master initiates a
minimum of two writes, or two reads, or a
combination of writes and reads, to one or more
slaves.
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When one device is transmitting a logical one, or letting
the line float, and a second device is transmitting a logical zero, or holding the line low, the first device can
detect that the line is not a logical one. This detection,
when used on the SCL line, is called clock stretching.
Clock stretching gives slave devices a mechanism to
control the flow of data. When this detection is used on
the SDA line, it is called arbitration. Arbitration ensures
that there is only one master device communicating at
any single time.
30.3.1
CLOCK STRETCHING
When a slave device has not completed processing
data, it can delay the transfer of more data through the
process of clock stretching. An addressed slave device
may hold the SCL clock line low after receiving or sending a bit, indicating that it is not yet ready to continue.
The master that is communicating with the slave will
attempt to raise the SCL line in order to transfer the
next bit, but will detect that the clock line has not yet
been released. Because the SCL connection is
open-drain, the slave has the ability to hold that line low
until it is ready to continue communicating.
Clock stretching allows receivers that cannot keep up
with a transmitter to control the flow of incoming data.
30.3.2
ARBITRATION
Each master device must monitor the bus for Start and
Stop bits. If the device detects that the bus is busy, it
cannot begin a new message until the bus returns to an
Idle state.
However, two master devices may try to initiate a transmission on or about the same time. When this occurs,
the process of arbitration begins. Each transmitter
checks the level of the SDA data line and compares it
to the level that it expects to find. The first transmitter to
observe that the two levels do not match, loses arbitration, and must stop transmitting on the SDA line.
For example, if one transmitter holds the SDA line to a
logical one (lets it float) and a second transmitter holds
it to a logical zero (pulls it low), the result is that the
SDA line will be low. The first transmitter then observes
that the level of the line is different than expected and
concludes that another transmitter is communicating.
The first transmitter to notice this difference is the one
that loses arbitration and must stop driving the SDA
line. If this transmitter is also a master device, it also
must stop driving the SCL line. It then can monitor the
lines for a Stop condition before trying to reissue its
transmission. In the meantime, the other device that
has not noticed any difference between the expected
and actual levels on the SDA line continues with its
original transmission. It can do so without any complications, because so far, the transmission appears
exactly as expected with no other transmitter disturbing
the message.
Slave Transmit mode can also be arbitrated, when a
master addresses multiple slaves, but this is less
common.
If two master devices are sending a message to two
different slave devices at the address stage, the master
sending the lower slave address always wins arbitration. When two master devices send messages to the
same slave address, and addresses can sometimes
refer to multiple slaves, the arbitration process must
continue into the data stage.
Arbitration usually occurs very rarely, but it is a
necessary process for proper multi-master support.
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30.4
I2C MODE OPERATION
All MSSP I2C communication is byte oriented and
shifted out MSb first. Six SFR registers and two
interrupt flags interface the module with the PIC®
microcontroller and user software. Two pins, SDA and
SCL, are exercised by the module to communicate
with other external I2C devices.
30.4.1
BYTE FORMAT
All communication in I2C is done in 9-bit segments. A
byte is sent from a master to a slave or vice-versa, followed by an Acknowledge bit sent back. After the
eighth falling edge of the SCL line, the device outputting data on the SDA changes that pin to an input and
reads in an acknowledge value on the next clock
pulse.
The clock signal, SCL, is provided by the master. Data
is valid to change while the SCL signal is low, and
sampled on the rising edge of the clock. Changes on
the SDA line while the SCL line is high define special
conditions on the bus, explained below.
30.4.2
DEFINITION OF I2C TERMINOLOGY
There is language and terminology in the description
of I2C communication that have definitions specific to
I2C. That word usage is defined below and may be
used in the rest of this document without explanation.
This table was adapted from the Philips I2C
specification.
30.4.3
SDA AND SCL PINS
Selection of any I2C mode with the SSPEN bit set,
forces the SCL and SDA pins to be open-drain. These
pins should be set by the user to inputs by setting the
appropriate TRIS bits.
Note 1: Data is tied to output zero when an I2C
mode is enabled.
2: Any device pin can be selected for SDA
and SCL functions with the PPS peripheral.
These functions are bidirectional. The SDA
input is selected with the SSPDATPPS
registers. The SCL input is selected with
the SSPCLKPPS registers. Outputs are
selected with the RxyPPS registers. It is the
user’s responsibility to make the selections
so that both the input and the output for
each function is on the same pin.
30.4.4
TABLE 30-2:
TERM
I2C BUS TERMS
Description
Transmitter
The device which shifts data out
onto the bus.
Receiver
The device which shifts data in
from the bus.
Master
The device that initiates a transfer,
generates clock signals and terminates a transfer.
Slave
The device addressed by the
master.
Multi-master
A bus with more than one device
that can initiate data transfers.
Arbitration
Procedure to ensure that only one
master at a time controls the bus.
Winning arbitration ensures that
the message is not corrupted.
Synchronization Procedure to synchronize the
clocks of two or more devices on
the bus.
Idle
No master is controlling the bus,
and both SDA and SCL lines are
high.
Active
Any time one or more master
devices are controlling the bus.
Slave device that has received a
Addressed
Slave
matching address and is actively
being clocked by a master.
Matching
Address byte that is clocked into a
Address
slave that matches the value
stored in SSPADD.
Write Request
Slave receives a matching
address with R/W bit clear, and is
ready to clock in data.
Read Request
Master sends an address byte with
the R/W bit set, indicating that it
wishes to clock data out of the
Slave. This data is the next and all
following bytes until a Restart or
Stop.
Clock Stretching When a device on the bus hold
SCL low to stall communication.
Bus Collision
Any time the SDA line is sampled
low by the module while it is outputting and expected high state.
SDA HOLD TIME
The hold time of the SDA pin is selected by the SDAHT
bit of the SSPCON3 register. Hold time is the time SDA
is held valid after the falling edge of SCL. Setting the
SDAHT bit selects a longer 300 ns minimum hold time
and may help on buses with large capacitance.
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30.4.5
START CONDITION
30.4.7
I2C
The
specification defines a Start condition as a
transition of SDA from a high to a low state while SCL
line is high. A Start condition is always generated by
the master and signifies the transition of the bus from
an Idle to an Active state. Figure 30-12 shows wave
forms for Start and Stop conditions.
A Restart is valid any time that a Stop would be valid.
A master can issue a Restart if it wishes to hold the
bus after terminating the current transfer. A Restart
has the same effect on the slave that a Start would,
resetting all slave logic and preparing it to clock in an
address. The master may want to address the same or
another slave. Figure 30-13 shows the wave form for a
Restart condition.
A bus collision can occur on a Start condition if the
module samples the SDA line low before asserting it
low. This does not conform to the I2C Specification that
states no bus collision can occur on a Start.
30.4.6
RESTART CONDITION
In 10-bit Addressing Slave mode a Restart is required
for the master to clock data out of the addressed
slave. Once a slave has been fully addressed, matching both high and low address bytes, the master can
issue a Restart and the high address byte with the
R/W bit set. The slave logic will then hold the clock
and prepare to clock out data.
STOP CONDITION
A Stop condition is a transition of the SDA line from
low-to-high state while the SCL line is high.
Note: At least one SCL low time must appear
before a Stop is valid, therefore, if the SDA
line goes low then high again while the SCL
line stays high, only the Start condition is
detected.
After a full match with R/W clear in 10-bit mode, a prior
match flag is set and maintained until a Stop condition, a
high address with R/W clear, or high address match fails.
30.4.8
START/STOP CONDITION
INTERRUPT MASKING
The SCIE and PCIE bits of the SSPCON3 register can
enable the generation of an interrupt in Slave modes
that do not typically support this function. Slave modes
where interrupt on Start and Stop detect are already
enabled, these bits will have no effect.
I2C START AND STOP CONDITIONS
FIGURE 30-12:
SDA
SCL
S
Start
P
Change of
Change of
Data Allowed
Data Allowed
Condition
FIGURE 30-13:
Stop
Condition
I2C RESTART CONDITION
Sr
Change of
Change of
Data Allowed
Restart
Data Allowed
Condition
DS40001726C-page 300
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30.4.9
ACKNOWLEDGE SEQUENCE
30.5.1.1
I2C Slave 7-bit Addressing Mode
The 9th SCL pulse for any transferred byte in I2C is
dedicated as an Acknowledge. It allows receiving
devices to respond back to the transmitter by pulling
the SDA line low. The transmitter must release control
of the line during this time to shift in the response. The
Acknowledge (ACK) is an active-low signal, pulling the
SDA line low indicates to the transmitter that the
device has received the transmitted data and is ready
to receive more.
In 7-bit Addressing mode, the LSb of the received data
byte is ignored when determining if there is an address
match.
The result of an ACK is placed in the ACKSTAT bit of
the SSPCON2 register.
After the acknowledge of the high byte the UA bit is set
and SCL is held low until the user updates SSPADD
with the low address. The low address byte is clocked
in and all eight bits are compared to the low address
value in SSPADD. Even if there is not an address
match; SSPIF and UA are set, and SCL is held low
until SSPADD is updated to receive a high byte again.
When SSPADD is updated the UA bit is cleared. This
ensures the module is ready to receive the high
address byte on the next communication.
Slave software, when the AHEN and DHEN bits are
set, allow the user to set the ACK value sent back to
the transmitter. The ACKDT bit of the SSPCON2 register is set/cleared to determine the response.
Slave hardware will generate an ACK response if the
AHEN and DHEN bits of the SSPCON3 register are
clear.
There are certain conditions where an ACK will not be
sent by the slave. If the BF bit of the SSPSTAT register
or the SSPOV bit of the SSPCON1 register are set
when a byte is received.
When the module is addressed, after the eighth falling
edge of SCL on the bus, the ACKTIM bit of the
SSPCON3 register is set. The ACKTIM bit indicates
the acknowledge time of the active bus. The ACKTIM
Status bit is only active when the AHEN bit or DHEN
bit is enabled.
30.5
I2C SLAVE MODE OPERATION
The MSSP Slave mode operates in one of four modes
selected by the SSPM bits of SSPCON1 register. The
modes can be divided into 7-bit and 10-bit Addressing
mode. 10-bit Addressing modes operate the same as
7-bit with some additional overhead for handling the
larger addresses.
Modes with Start and Stop bit interrupts operate the
same as the other modes with SSPIF additionally
getting set upon detection of a Start, Restart, or Stop
condition.
30.5.1
SLAVE MODE ADDRESSES
The SSPADD register (Register 30-6) contains the
Slave mode address. The first byte received after a
Start or Restart condition is compared against the
value stored in this register. If the byte matches, the
value is loaded into the SSPBUF register and an interrupt is generated. If the value does not match, the
module goes idle and no indication is given to the
software that anything happened.
30.5.1.2
I2C Slave 10-bit Addressing Mode
In 10-bit Addressing mode, the first received byte is
compared to the binary value of ‘1 1 1 1 0 A9 A8 0’. A9
and A8 are the two MSb’s of the 10-bit address and
stored in bits 2 and 1 of the SSPADD register.
A high and low address match as a write request is
required at the start of all 10-bit addressing communication. A transmission can be initiated by issuing a
Restart once the slave is addressed, and clocking in
the high address with the R/W bit set. The slave
hardware will then acknowledge the read request and
prepare to clock out data. This is only valid for a slave
after it has received a complete high and low address
byte match.
30.5.2
SLAVE RECEPTION
When the R/W bit of a matching received address byte
is clear, the R/W bit of the SSPSTAT register is cleared.
The received address is loaded into the SSPBUF
register and acknowledged.
When the overflow condition exists for a received
address, then not Acknowledge is given. An overflow
condition is defined as either bit BF of the SSPSTAT
register is set, or bit SSPOV of the SSPCON1 register
is set. The BOEN bit of the SSPCON3 register modifies
this operation. For more information see Register 30-4.
An MSSP interrupt is generated for each transferred
data byte. Flag bit, SSPIF, must be cleared by software.
When the SEN bit of the SSPCON2 register is set, SCL
will be held low (clock stretch) following each received
byte. The clock must be released by setting the CKP
bit of the SSPCON1 register, except sometimes in
10-bit
mode.
See
Section 30.5.6.2
“10-bit
Addressing Mode” for more detail.
The SSP Mask register (Register 30-5) affects the
address matching process. See Section 30.5.9 “SSP
Mask Register” for more information.
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PIC16(L)F1713/6
30.5.2.1
7-bit Addressing Reception
This section describes a standard sequence of events
for the MSSP module configured as an I2C slave in
7-bit Addressing mode. Figure 30-14 and Figure 30-15
is used as a visual reference for this description.
This is a step by step process of what typically must
be done to accomplish I2C communication.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
Start bit detected.
S bit of SSPSTAT is set; SSPIF is set if interrupt
on Start detect is enabled.
Matching address with R/W bit clear is received.
The slave pulls SDA low sending an ACK to the
master, and sets SSPIF bit.
Software clears the SSPIF bit.
Software reads received address from SSPBUF
clearing the BF flag.
If SEN = 1; Slave software sets CKP bit to
release the SCL line.
The master clocks out a data byte.
Slave drives SDA low sending an ACK to the
master, and sets SSPIF bit.
Software clears SSPIF.
Software reads the received byte from SSPBUF
clearing BF.
Steps 8-12 are repeated for all received bytes
from the master.
Master sends Stop condition, setting P bit of
SSPSTAT, and the bus goes idle.
30.5.2.2
7-bit Reception with AHEN and
DHEN
Slave device reception with AHEN and DHEN set
operate the same as without these options with extra
interrupts and clock stretching added after the eighth
falling edge of SCL. These additional interrupts allow
the slave software to decide whether it wants to ACK
the receive address or data byte, rather than the hardware. This functionality adds support for PMBus™ that
was not present on previous versions of this module.
This list describes the steps that need to be taken by
slave software to use these options for I2C communication. Figure 30-16 displays a module using both
address and data holding. Figure 30-17 includes the
operation with the SEN bit of the SSPCON2 register
set.
1.
S bit of SSPSTAT is set; SSPIF is set if interrupt
on Start detect is enabled.
2. Matching address with R/W bit clear is clocked
in. SSPIF is set and CKP cleared after the eighth
falling edge of SCL.
3. Slave clears the SSPIF.
4. Slave can look at the ACKTIM bit of the
SSPCON3 register to determine if the SSPIF
was after or before the ACK.
5. Slave reads the address value from SSPBUF,
clearing the BF flag.
6. Slave sets ACK value clocked out to the master
by setting ACKDT.
7. Slave releases the clock by setting CKP.
8. SSPIF is set after an ACK, not after a NACK.
9. If SEN = 1 the slave hardware will stretch the
clock after the ACK.
10. Slave clears SSPIF.
Note: SSPIF is still set after the 9th falling edge of
SCL even if there is no clock stretching and
BF has been cleared. Only if NACK is sent
to master is SSPIF not set
11. SSPIF set and CKP cleared after eighth falling
edge of SCL for a received data byte.
12. Slave looks at ACKTIM bit of SSPCON3 to
determine the source of the interrupt.
13. Slave reads the received data from SSPBUF
clearing BF.
14. Steps 7-14 are the same for each received data
byte.
15. Communication is ended by either the slave
sending an ACK = 1, or the master sending a
Stop condition. If a Stop is sent and Interrupt on
Stop Detect is disabled, the slave will only know
by polling the P bit of the SSTSTAT register.
DS40001726C-page 302
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 2013-2016 Microchip Technology Inc.
SSPOV
BF
SSPIF
S
1
A7
2
A6
3
A5
4
A4
5
A3
Receiving Address
6
A2
7
A1
8
9
ACK
1
D7
2
D6
4
5
D3
6
D2
7
D1
SSPBUF is read
Cleared by software
3
D4
Receiving Data
D5
8
9
2
D6
First byte
of data is
available
in SSPBUF
1
D0 ACK D7
4
5
D3
6
D2
7
D1
SSPOV set because
SSPBUF is still full.
ACK is not sent.
Cleared by software
3
D4
Receiving Data
D5
8
D0
9
P
SSPIF set on 9th
falling edge of
SCL
ACK = 1
FIGURE 30-14:
SCL
SDA
From Slave to Master
Bus Master sends
Stop condition
PIC16(L)F1713/6
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0)
DS40001726C-page 303
DS40001726C-page 304
CKP
SSPOV
BF
SSPIF
1
SCL
S
A7
2
A6
3
A5
4
A4
5
A3
6
A2
7
A1
8
9
R/W=0 ACK
SEN
2
D6
3
D5
4
D4
5
D3
6
D2
7
D1
8
D0
CKP is written to ‘1’ in software,
releasing SCL
SSPBUF is read
Cleared by software
Clock is held low until CKP is set to ‘1’
1
D7
Receive Data
9
ACK
SEN
3
D5
4
D4
5
D3
First byte
of data is
available
in SSPBUF
6
D2
7
D1
SSPOV set because
SSPBUF is still full.
ACK is not sent.
Cleared by software
2
D6
CKP is written to ‘1’ in software,
releasing SCL
1
D7
Receive Data
8
D0
9
ACK
SCL is not held
low because
ACK= 1
SSPIF set on 9th
falling edge of SCL
P
FIGURE 30-15:
SDA
Receive Address
Bus Master sends
Stop condition
PIC16(L)F1713/6
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
 2013-2016 Microchip Technology Inc.
 2013-2016 Microchip Technology Inc.
P
S
ACKTIM
CKP
ACKDT
BF
SSPIF
S
Receiving Address
1
3
5
6
7
8
ACK the received
byte
Slave software
clears ACKDT to
Address is
read from
SSBUF
If AHEN = 1:
SSPIF is set
4
ACKTIM set by hardware
on 8th falling edge of SCL
When AHEN=1:
CKP is cleared by hardware
and SCL is stretched
2
A7 A6 A5 A4 A3 A2 A1
Receiving Data
9
2
3
4
5
6
7
ACKTIM cleared by
hardware in 9th
rising edge of SCL
When DHEN=1:
CKP is cleared by
hardware on 8th falling
edge of SCL
SSPIF is set on
9th falling edge of
SCL, after ACK
1
8
ACK D7 D6 D5 D4 D3 D2 D1 D0
Received Data
1
2
4
5
6
ACKTIM set by hardware
on 8th falling edge of SCL
CKP set by software,
SCL is released
8
Slave software
sets ACKDT to
not ACK
7
Cleared by software
3
D7 D6 D5 D4 D3 D2 D1 D0
Data is read from SSPBUF
9
ACK
9
P
No interrupt
after not ACK
from Slave
ACK=1
Master sends
Stop condition
FIGURE 30-16:
SCL
SDA
Master Releases SDA
to slave for ACK sequence
PIC16(L)F1713/6
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1)
DS40001726C-page 305
DS40001726C-page 306
P
S
ACKTIM
CKP
ACKDT
BF
SSPIF
S
Receiving Address
4
5
6 7
8
When AHEN = 1;
on the 8th falling edge
of SCL of an address
byte, CKP is cleared
Slave software clears
ACKDT to ACK
the received byte
Received
address is loaded into
SSPBUF
2 3
ACKTIM is set by hardware
on 8th falling edge of SCL
1
A7 A6 A5 A4 A3 A2 A1
9
ACK
Receive Data
2 3
4
5
6 7
8
ACKTIM is cleared by hardware
on 9th rising edge of SCL
When DHEN = 1;
on the 8th falling edge
of SCL of a received
data byte, CKP is cleared
Received data is
available on SSPBUF
Cleared by software
1
D7 D6 D5 D4 D3 D2 D1 D0
9
ACK
Receive Data
1
3 4
5
6 7
8
Set by software,
release SCL
Slave sends
not ACK
SSPBUF can be
read any time before
next byte is loaded
2
D7 D6 D5 D4 D3 D2 D1 D0
9
ACK
CKP is not cleared
if not ACK
No interrupt after
if not ACK
from Slave
P
Master sends
Stop condition
FIGURE 30-17:
SCL
SDA
R/W = 0
Master releases
SDA to slave for ACK sequence
PIC16(L)F1713/6
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1)
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
30.5.3
SLAVE TRANSMISSION
30.5.3.2
7-bit Transmission
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit of the
SSPSTAT register is set. The received address is
loaded into the SSPBUF register, and an ACK pulse is
sent by the slave on the ninth bit.
A master device can transmit a read request to a
slave, and then clock data out of the slave. The list
below outlines what software for a slave will need to
do to accomplish a standard transmission.
Figure 30-18 can be used as a reference to this list.
Following the ACK, slave hardware clears the CKP bit
and the SCL pin is held low (see Section 30.5.6
“Clock Stretching” for more detail). By stretching the
clock, the master will be unable to assert another clock
pulse until the slave is done preparing the transmit
data.
1.
The transmit data must be loaded into the SSPBUF
register which also loads the SSPSR register. Then the
SCL pin should be released by setting the CKP bit of
the SSPCON1 register. The eight data bits are shifted
out on the falling edge of the SCL input. This ensures
that the SDA signal is valid during the SCL high time.
The ACK pulse from the master-receiver is latched on
the rising edge of the ninth SCL input pulse. This ACK
value is copied to the ACKSTAT bit of the SSPCON2
register. If ACKSTAT is set (not ACK), then the data
transfer is complete. In this case, when the not ACK is
latched by the slave, the slave goes idle and waits for
another occurrence of the Start bit. If the SDA line was
low (ACK), the next transmit data must be loaded into
the SSPBUF register. Again, the SCL pin must be
released by setting bit CKP.
An MSSP interrupt is generated for each data transfer
byte. The SSPIF bit must be cleared by software and
the SSPSTAT register is used to determine the status
of the byte. The SSPIF bit is set on the falling edge of
the ninth clock pulse.
30.5.3.1
Slave Mode Bus Collision
A slave receives a Read request and begins shifting
data out on the SDA line. If a bus collision is detected
and the SBCDE bit of the SSPCON3 register is set, the
BCLIF bit of the PIR register is set. Once a bus collision
is detected, the slave goes idle and waits to be
addressed again. User software can use the BCLIF bit
to handle a slave bus collision.
 2013-2016 Microchip Technology Inc.
Master sends a Start condition on SDA and
SCL.
2. S bit of SSPSTAT is set; SSPIF is set if interrupt
on Start detect is enabled.
3. Matching address with R/W bit set is received by
the Slave setting SSPIF bit.
4. Slave hardware generates an ACK and sets
SSPIF.
5. SSPIF bit is cleared by user.
6. Software reads the received address from
SSPBUF, clearing BF.
7. R/W is set so CKP was automatically cleared
after the ACK.
8. The slave software loads the transmit data into
SSPBUF.
9. CKP bit is set releasing SCL, allowing the
master to clock the data out of the slave.
10. SSPIF is set after the ACK response from the
master is loaded into the ACKSTAT register.
11. SSPIF bit is cleared.
12. The slave software checks the ACKSTAT bit to
see if the master wants to clock out more data.
Note 1: If the master ACKs the clock will be
stretched.
2: ACKSTAT is the only bit updated on the
rising edge of SCL (9th) rather than the
falling.
13. Steps 9-13 are repeated for each transmitted
byte.
14. If the master sends a not ACK; the clock is not
held, but SSPIF is still set.
15. The master sends a Restart condition or a Stop.
16. The slave is no longer addressed.
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P
S
D/A
R/W
ACKSTAT
CKP
BF
SSPIF
S
1
2
5
6
7
Received address
is read from SSPBUF
4
Indicates an address
has been received
R/W is copied from the
matching address byte
When R/W is set
SCL is always
held low after 9th SCL
falling edge
3
8
9
Automatic
2
3
4
5
Set by software
Data to transmit is
loaded into SSPBUF
Cleared by software
1
6
7
8
9
D7 D6 D5 D4 D3 D2 D1 D0 ACK
Transmitting Data
2
3
4
5
7
8
CKP is not
held for not
ACK
6
Masters not ACK
is copied to
ACKSTAT
BF is automatically
cleared after 8th falling
edge of SCL
1
D7 D6 D5 D4 D3 D2 D1 D0
Transmitting Data
9
ACK
P
FIGURE 30-18:
SCL
SDA
R/W = 1 Automatic
A7 A6 A5 A4 A3 A2 A1
ACK
Receiving Address
Master sends
Stop condition
PIC16(L)F1713/6
I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0)
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
30.5.3.3
7-bit Transmission with Address
Hold Enabled
Setting the AHEN bit of the SSPCON3 register
enables additional clock stretching and interrupt
generation after the eighth falling edge of a received
matching address. Once a matching address has
been clocked in, CKP is cleared and the SSPIF
interrupt is set.
Figure 30-19 displays a standard waveform of a 7-bit
address slave transmission with AHEN enabled.
1.
2.
Bus starts Idle.
Master sends Start condition; the S bit of
SSPSTAT is set; SSPIF is set if interrupt on Start
detect is enabled.
3. Master sends matching address with R/W bit
set. After the eighth falling edge of the SCL line
the CKP bit is cleared and SSPIF interrupt is
generated.
4. Slave software clears SSPIF.
5. Slave software reads ACKTIM bit of SSPCON3
register, and R/W and D/A of the SSPSTAT
register to determine the source of the interrupt.
6. Slave reads the address value from the
SSPBUF register clearing the BF bit.
7. Slave software decides from this information if it
wishes to ACK or not ACK and sets the ACKDT
bit of the SSPCON2 register accordingly.
8. Slave sets the CKP bit releasing SCL.
9. Master clocks in the ACK value from the slave.
10. Slave hardware automatically clears the CKP bit
and sets SSPIF after the ACK if the R/W bit is
set.
11. Slave software clears SSPIF.
12. Slave loads value to transmit to the master into
SSPBUF setting the BF bit.
Note: SSPBUF cannot be loaded until after the
ACK.
13. Slave sets the CKP bit releasing the clock.
14. Master clocks out the data from the slave and
sends an ACK value on the 9th SCL pulse.
15. Slave hardware copies the ACK value into the
ACKSTAT bit of the SSPCON2 register.
16. Steps 10-15 are repeated for each byte transmitted to the master from the slave.
17. If the master sends a not ACK the slave
releases the bus allowing the master to send a
Stop and end the communication.
Note: Master must send a not ACK on the last
byte to ensure that the slave releases the
SCL line to receive a Stop.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 309
DS40001726C-page 310
D/A
R/W
ACKTIM
CKP
ACKSTAT
ACKDT
BF
SSPIF
S
Receiving Address
2
4
5
6
7
8
Slave clears
ACKDT to ACK
address
ACKTIM is set on 8th falling
edge of SCL
9
ACK
When R/W = 1;
CKP is always
cleared after ACK
R/W = 1
Received address
is read from SSPBUF
3
When AHEN = 1;
CKP is cleared by hardware
after receiving matching
address.
1
A7 A6 A5 A4 A3 A2 A1
3
4
5
6
Cleared by software
2
Set by software,
releases SCL
Data to transmit is
loaded into SSPBUF
1
7
8
9
Transmitting Data
Automatic
D7 D6 D5 D4 D3 D2 D1 D0 ACK
ACKTIM is cleared
on 9th rising edge of SCL
Automatic
Transmitting Data
1
3
4
5
6
7
after not ACK
CKP not cleared
Master’s ACK
response is copied
to SSPSTAT
BF is automatically
cleared after 8th falling
edge of SCL
2
8
D7 D6 D5 D4 D3 D2 D1 D0
9
ACK
P
Master sends
Stop condition
FIGURE 30-19:
SCL
SDA
Master releases SDA
to slave for ACK sequence
PIC16(L)F1713/6
I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1)
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
30.5.4
SLAVE MODE 10-BIT ADDRESS
RECEPTION
This section describes a standard sequence of events
for the MSSP module configured as an I2C slave in
10-bit Addressing mode.
Figure 30-20 is used as a visual reference for this
description.
This is a step by step process of what must be done by
slave software to accomplish I2C communication.
1.
2.
3.
4.
5.
6.
7.
8.
Bus starts Idle.
Master sends Start condition; S bit of SSPSTAT
is set; SSPIF is set if interrupt on Start detect is
enabled.
Master sends matching high address with R/W
bit clear; UA bit of the SSPSTAT register is set.
Slave sends ACK and SSPIF is set.
Software clears the SSPIF bit.
Software reads received address from SSPBUF
clearing the BF flag.
Slave loads low address into SSPADD,
releasing SCL.
Master sends matching low address byte to the
slave; UA bit is set.
30.5.5
10-BIT ADDRESSING WITH
ADDRESS OR DATA HOLD
Reception using 10-bit addressing with AHEN or
DHEN set is the same as with 7-bit modes. The only
difference is the need to update the SSPADD register
using the UA bit. All functionality, specifically when the
CKP bit is cleared and SCL line is held low are the
same. Figure 30-21 can be used as a reference of a
slave in 10-bit addressing with AHEN set.
Figure 30-22 shows a standard waveform for a slave
transmitter in 10-bit Addressing mode.
Note: Updates to the SSPADD register are not
allowed until after the ACK sequence.
9.
Slave sends ACK and SSPIF is set.
Note: If the low address does not match, SSPIF
and UA are still set so that the slave software can set SSPADD back to the high
address. BF is not set because there is no
match. CKP is unaffected.
10. Slave clears SSPIF.
11. Slave reads the received matching address
from SSPBUF clearing BF.
12. Slave loads high address into SSPADD.
13. Master clocks a data byte to the slave and
clocks out the slaves ACK on the 9th SCL pulse;
SSPIF is set.
14. If SEN bit of SSPCON2 is set, CKP is cleared by
hardware and the clock is stretched.
15. Slave clears SSPIF.
16. Slave reads the received byte from SSPBUF
clearing BF.
17. If SEN is set the slave sets CKP to release the
SCL.
18. Steps 13-17 repeat for each received byte.
19. Master sends Stop to end the transmission.
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DS40001726C-page 311
DS40001726C-page 312
CKP
UA
BF
SSPIF
S
1
1
2
1
5
6
7
0 A9 A8
8
Set by hardware
on 9th falling edge
4
1
When UA = 1;
SCL is held low
If address matches
SSPADD it is loaded into
SSPBUF
3
1
Receive First Address Byte
9
ACK
1
3
4
5
6
7
8
Software updates SSPADD
and releases SCL
2
9
A7 A6 A5 A4 A3 A2 A1 A0 ACK
Receive Second Address Byte
1
3
4
5
6
7
8
9
1
3
4
5
6
7
Data is read
from SSPBUF
SCL is held low
while CKP = 0
2
8
9
D7 D6 D5 D4 D3 D2 D1 D0 ACK
Receive Data
Set by software,
When SEN = 1;
releasing SCL
CKP is cleared after
9th falling edge of received byte
Receive address is
read from SSPBUF
Cleared by software
2
D7 D6 D5 D4 D3 D2 D1 D0 ACK
Receive Data
P
FIGURE 30-20:
SCL
SDA
Master sends
Stop condition
PIC16(L)F1713/6
I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
 2013-2016 Microchip Technology Inc.
 2013-2016 Microchip Technology Inc.
ACKTIM
CKP
UA
ACKDT
BF
2
1
5
0
6
A9
7
A8
Set by hardware
on 9th falling edge
4
1
8
R/W = 0
ACKTIM is set by hardware
on 8th falling edge of SCL
If when AHEN = 1;
on the 8th falling edge
of SCL of an address
byte, CKP is cleared
Slave software clears
ACKDT to ACK
the received byte
3
1
Receive First Address Byte
9
ACK
UA
2
3
A5
4
A4
6
A2
7
A1
Update to SSPADD is
not allowed until 9th
falling edge of SCL
SSPBUF can be
read anytime before
the next received byte
5
A3
Receive Second Address Byte
A6
Cleared by software
1
A7
8
A0
9
ACK
UA
2
D6
3
D5
4
D4
6
D2
Set CKP with software
releases SCL
7
D1
Update of SSPADD,
clears UA and releases
SCL
5
D3
Receive Data
Cleared by software
1
D7
8
9
2
Received data
is read from
SSPBUF
1
D6 D5
Receive Data
D0 ACK D7
FIGURE 30-21:
SSPIF
1
SCL
S
1
SDA
PIC16(L)F1713/6
I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0)
DS40001726C-page 313
DS40001726C-page 314
D/A
R/W
ACKSTAT
CKP
UA
BF
SSPIF
4
5
6
7
Set by hardware
3
Indicates an address
has been received
UA indicates SSPADD
must be updated
SSPBUF loaded
with received address
2
8
9
1
SCL
S
Receiving Address R/W = 0
1 1 1 1 0 A9 A8
ACK
1
3
4
5
6
7 8
After SSPADD is
updated, UA is cleared
and SCL is released
Cleared by software
2
9
A7 A6 A5 A4 A3 A2 A1 A0 ACK
Receiving Second Address Byte
1
4
5
6
7 8
Set by hardware
2 3
R/W is copied from the
matching address byte
When R/W = 1;
CKP is cleared on
9th falling edge of SCL
High address is loaded
back into SSPADD
Received address is
read from SSPBUF
Sr
1 1 1 1 0 A9 A8
Receive First Address Byte
9
ACK
2
3
4
5
6
7
8
Masters not ACK
is copied
Set by software
releases SCL
Data to transmit is
loaded into SSPBUF
1
D7 D6 D5 D4 D3 D2 D1 D0
Transmitting Data Byte
9
P
Master sends
Stop condition
ACK = 1
Master sends
not ACK
FIGURE 30-22:
SDA
Master sends
Restart event
PIC16(L)F1713/6
I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0)
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
30.5.6
CLOCK STRETCHING
30.5.6.2
Clock stretching occurs when a device on the bus
holds the SCL line low, effectively pausing communication. The slave may stretch the clock to allow more
time to handle data or prepare a response for the
master device. A master device is not concerned with
stretching as anytime it is active on the bus and not
transferring data it is stretching. Any stretching done
by a slave is invisible to the master software and
handled by the hardware that generates SCL.
The CKP bit of the SSPCON1 register is used to
control stretching in software. Any time the CKP bit is
cleared, the module will wait for the SCL line to go low
and then hold it. Setting CKP will release SCL and
allow more communication.
30.5.6.1
Normal Clock Stretching
Following an ACK if the R/W bit of SSPSTAT is set, a
read request, the slave hardware will clear CKP. This
allows the slave time to update SSPBUF with data to
transfer to the master. If the SEN bit of SSPCON2 is
set, the slave hardware will always stretch the clock
after the ACK sequence. Once the slave is ready; CKP
is set by software and communication resumes.
Note 1: The BF bit has no effect on if the clock will
be stretched or not. This is different than
previous versions of the module that
would not stretch the clock, clear CKP, if
SSPBUF was read before the 9th falling
edge of SCL.
2: Previous versions of the module did not
stretch the clock for a transmission if
SSPBUF was loaded before the 9th
falling edge of SCL. It is now always
cleared for read requests.
FIGURE 30-23:
10-bit Addressing Mode
In 10-bit Addressing mode, when the UA bit is set the
clock is always stretched. This is the only time the SCL
is stretched without CKP being cleared. SCL is
released immediately after a write to SSPADD.
Note: Previous versions of the module did not
stretch the clock if the second address byte
did not match.
30.5.6.3
Byte NACKing
When AHEN bit of SSPCON3 is set; CKP is cleared by
hardware after the eighth falling edge of SCL for a
received matching address byte. When DHEN bit of
SSPCON3 is set; CKP is cleared after the eighth falling edge of SCL for received data.
Stretching after the eighth falling edge of SCL allows
the slave to look at the received address or data and
decide if it wants to ACK the received data.
30.5.7
CLOCK SYNCHRONIZATION AND
THE CKP BIT
Any time the CKP bit is cleared, the module will wait
for the SCL line to go low and then hold it. However,
clearing the CKP bit will not assert the SCL output low
until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an
external I2C master device has already asserted the
SCL line. The SCL output will remain low until the CKP
bit is set and all other devices on the I2C bus have
released SCL. This ensures that a write to the CKP bit
will not violate the minimum high time requirement for
SCL (see Figure 30-23).
CLOCK SYNCHRONIZATION TIMING
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
SDA
DX ‚ – 1
DX
SCL
CKP
Master device
asserts clock
Master device
releases clock
WR
SSPCON1
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30.5.8
GENERAL CALL ADDRESS
SUPPORT
software can read SSPBUF
Figure 30-24 shows a general
sequence.
The addressing procedure for the I2C bus is such that
the first byte after the Start condition usually determines which device will be the slave addressed by the
master device. The exception is the general call
address which can address all devices. When this
address is used, all devices should, in theory, respond
with an acknowledge.
respond.
reception
In 10-bit Address mode, the UA bit will not be set on
the reception of the general call address. The slave
will prepare to receive the second byte as data, just as
it would in 7-bit mode.
If the AHEN bit of the SSPCON3 register is set, just as
with any other address reception, the slave hardware
will stretch the clock after the eighth falling edge of
SCL. The slave must then set its ACKDT value and
release the clock with communication progressing as it
would normally.
The general call address is a reserved address in the
I2C protocol, defined as address 0x00. When the
GCEN bit of the SSPCON2 register is set, the slave
module will automatically ACK the reception of this
address regardless of the value stored in SSPADD.
After the slave clocks in an address of all zeros with
the R/W bit clear, an interrupt is generated and slave
FIGURE 30-24:
and
call
SLAVE MODE GENERAL CALL ADDRESS SEQUENCE
Address is compared to General Call Address
after ACK, set interrupt
R/W = 0
ACK D7
General Call Address
SDA
SCL
S
1
2
3
4
5
6
7
8
9
1
Receiving Data
ACK
D6
D5
D4
D3
D2
D1
D0
2
3
4
5
6
7
8
9
SSPIF
BF (SSPSTAT<0>)
Cleared by software
GCEN (SSPCON2<7>)
SSPBUF is read
’1’
30.5.9
SSP MASK REGISTER
An SSP Mask (SSPMSK) register (Register 30-5) is
available in I2C Slave mode as a mask for the value
held in the SSPSR register during an address
comparison operation. A zero (‘0’) bit in the SSPMSK
register has the effect of making the corresponding bit
of the received address a “don’t care”.
This register is reset to all ‘1’s upon any Reset
condition and, therefore, has no effect on standard
SSP operation until written with a mask value.
The SSP Mask register is active during:
• 7-bit Address mode: address compare of A<7:1>.
• 10-bit Address mode: address compare of A<7:0>
only. The SSP mask has no effect during the
reception of the first (high) byte of the address.
DS40001726C-page 316
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PIC16(L)F1713/6
30.6
I2C Master Mode
30.6.1
I2C MASTER MODE OPERATION
Master mode is enabled by setting and clearing the
appropriate SSPM bits in the SSPCON1 register and
by setting the SSPEN bit. In Master mode, the SDA and
SCK pins must be configured as inputs. The MSSP
peripheral hardware will override the output driver TRIS
controls when necessary to drive the pins low.
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop
conditions. The Stop (P) and Start (S) bits are cleared
from a Reset or when the MSSP module is disabled.
Control of the I 2C bus may be taken when the P bit is
set, or the bus is Idle.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the Read/Write (R/W) bit.
In this case, the R/W bit will be logic ‘0’. Serial data is
transmitted eight bits at a time. After each byte is
transmitted, an Acknowledge bit is received. Start and
Stop conditions are output to indicate the beginning
and the end of a serial transfer.
In Firmware Controlled Master mode, user code
conducts all I 2C bus operations based on Start and
Stop bit condition detection. Start and Stop condition
detection is the only active circuitry in this mode. All
other communication is done by the user software
directly manipulating the SDA and SCL lines.
The following events will cause the SSP Interrupt Flag
bit, SSPIF, to be set (SSP interrupt, if enabled):
•
•
•
•
•
Start condition detected
Stop condition detected
Data transfer byte transmitted/received
Acknowledge transmitted/received
Repeated Start generated
Note 1: The MSSP module, when configured in
I2C Master mode, does not allow queuing
of events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSPBUF register to
initiate transmission before the Start
condition is complete. In this case, the
SSPBUF will not be written to and the
WCOL bit will be set, indicating that a
write to the SSPBUF did not occur
2: When in Master mode, Start/Stop
detection is masked and an interrupt is
generated when the SEN/PEN bit is
cleared and the generation is complete.
 2013-2016 Microchip Technology Inc.
In Master Receive mode, the first byte transmitted
contains the slave address of the transmitting device
(7 bits) and the R/W bit. In this case, the R/W bit will be
logic ‘1’. Thus, the first byte transmitted is a 7-bit slave
address followed by a ‘1’ to indicate the receive bit.
Serial data is received via SDA, while SCL outputs the
serial clock. Serial data is received eight bits at a time.
After each byte is received, an Acknowledge bit is
transmitted. Start and Stop conditions indicate the
beginning and end of transmission.
A Baud Rate Generator is used to set the clock
frequency output on SCL. See Section 30.7 “Baud
Rate Generator” for more detail.
30.6.2
CLOCK ARBITRATION
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition,
releases the SCL pin (SCL allowed to float high). When
the SCL pin is allowed to float high, the Baud Rate
Generator (BRG) is suspended from counting until the
SCL pin is actually sampled high. When the SCL pin is
sampled high, the Baud Rate Generator is reloaded
with the contents of SSPADD<7:0> and begins counting. This ensures that the SCL high time will always be
at least one BRG rollover count in the event that the
clock is held low by an external device (Figure 30-25).
DS40001726C-page 317
PIC16(L)F1713/6
FIGURE 30-25:
BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
SDA
DX ‚ – 1
DX
SCL allowed to transition high
SCL deasserted but slave holds
SCL low (clock arbitration)
SCL
BRG decrements on
Q2 and Q4 cycles
BRG
Value
03h
02h
01h
00h (hold off)
03h
02h
SCL is sampled high, reload takes
place and BRG starts its count
BRG
Reload
30.6.3
WCOL STATUS FLAG
Start condition and causes the S bit of the SSPSTAT1
register to be set. Following this, the Baud Rate
Generator is reloaded with the contents of
SSPADD<7:0> and resumes its count. When the Baud
Rate Generator times out (TBRG), the SEN bit of the
SSPCON2 register will be automatically cleared by
hardware; the Baud Rate Generator is suspended,
leaving the SDA line held low and the Start condition is
complete.
If the user writes the SSPBUF when a Start, Restart,
Stop, Receive or Transmit sequence is in progress, the
WCOL is set and the contents of the buffer are
unchanged (the write does not occur). Any time the
WCOL bit is set it indicates that an action on SSPBUF
was attempted while the module was not idle.
Note:
30.6.4
Because queuing of events is not allowed,
writing to the lower five bits of SSPCON2
is disabled until the Start condition is
complete.
Note 1: If at the beginning of the Start condition,
the SDA and SCL pins are already
sampled low, or if during the Start condition, the SCL line is sampled low before
the SDA line is driven low, a bus collision
occurs, the Bus Collision Interrupt Flag,
BCLIF, is set, the Start condition is
aborted and the I2C module is reset into
its Idle state.
I2C MASTER MODE START
CONDITION TIMING
To initiate a Start condition (Figure 30-26), the user
sets the Start Enable bit, SEN bit of the SSPCON2
register. If the SDA and SCL pins are sampled high,
the Baud Rate Generator is reloaded with the contents
of SSPADD<7:0> and starts its count. If SCL and SDA
are both sampled high when the Baud Rate Generator
times out (TBRG), the SDA pin is driven low. The action
of the SDA being driven low while SCL is high is the
FIGURE 30-26:
2: The Philips I2C specification states that a
bus collision cannot occur on a Start.
FIRST START BIT TIMING
Write to SEN bit occurs here
Set S bit (SSPSTAT<3>)
At completion of Start bit,
hardware clears SEN bit
and sets SSPIF bit
SDA = 1,
SCL = 1
TBRG
TBRG
Write to SSPBUF occurs here
SDA
2nd bit
1st bit
TBRG
SCL
S
DS40001726C-page 318
TBRG
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PIC16(L)F1713/6
30.6.5
I2C MASTER MODE REPEATED
START CONDITION TIMING
SSPCON2 register will be automatically cleared and
the Baud Rate Generator will not be reloaded, leaving
the SDA pin held low. As soon as a Start condition is
detected on the SDA and SCL pins, the S bit of the
SSPSTAT register will be set. The SSPIF bit will not be
set until the Baud Rate Generator has timed out.
A Repeated Start condition (Figure 30-27) occurs when
the RSEN bit of the SSPCON2 register is programmed
high and the master state machine is no longer active.
When the RSEN bit is set, the SCL pin is asserted low.
When the SCL pin is sampled low, the Baud Rate
Generator is loaded and begins counting. The SDA pin
is released (brought high) for one Baud Rate Generator
count (TBRG). When the Baud Rate Generator times
out, if SDA is sampled high, the SCL pin will be
deasserted (brought high). When SCL is sampled high,
the Baud Rate Generator is reloaded and begins counting. SDA and SCL must be sampled high for one TBRG.
This action is then followed by assertion of the SDA pin
(SDA = 0) for one TBRG while SCL is high. SCL is
asserted low. Following this, the RSEN bit of the
FIGURE 30-27:
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
2: A bus collision during the Repeated Start
condition occurs if:
• SDA is sampled low when SCL
goes from low-to-high.
• SCL goes low before SDA is
asserted low. This may indicate
that another master is attempting
to transmit a data ‘1’.
REPEATED START CONDITION WAVEFORM
S bit set by hardware
Write to SSPCON2
occurs here
SDA = 1,
SCL (no change)
At completion of Start bit,
hardware clears RSEN bit
and sets SSPIF
SDA = 1,
SCL = 1
TBRG
TBRG
TBRG
1st bit
SDA
Write to SSPBUF occurs here
TBRG
SCL
Sr
TBRG
Repeated Start
30.6.6
I2C MASTER MODE
TRANSMISSION
Transmission of a data byte, a 7-bit address or the
other half of a 10-bit address is accomplished by simply
writing a value to the SSPBUF register. This action will
set the Buffer Full flag bit, BF, and allow the Baud Rate
Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out
onto the SDA pin after the falling edge of SCL is
asserted. SCL is held low for one Baud Rate Generator
rollover count (TBRG). Data should be valid before SCL
is released high. When the SCL pin is released high, it
is held that way for TBRG. The data on the SDA pin
must remain stable for that duration and some hold
time after the next falling edge of SCL. After the eighth
bit is shifted out (the falling edge of the eighth clock),
the BF flag is cleared and the master releases SDA.
This allows the slave device being addressed to
respond with an ACK bit during the ninth bit time if an
address match occurred, or if data was received properly. The status of ACK is written into the ACKSTAT bit
 2013-2016 Microchip Technology Inc.
on the rising edge of the ninth clock. If the master
receives an Acknowledge, the Acknowledge Status bit,
ACKSTAT, is cleared. If not, the bit is set. After the ninth
clock, the SSPIF bit is set and the master clock (Baud
Rate Generator) is suspended until the next data byte
is loaded into the SSPBUF, leaving SCL low and SDA
unchanged (Figure 30-28).
After the write to the SSPBUF, each bit of the address
will be shifted out on the falling edge of SCL until all
seven address bits and the R/W bit are completed. On
the falling edge of the eighth clock, the master will
release the SDA pin, allowing the slave to respond with
an Acknowledge. On the falling edge of the ninth clock,
the master will sample the SDA pin to see if the address
was recognized by a slave. The status of the ACK bit is
loaded into the ACKSTAT Status bit of the SSPCON2
register. Following the falling edge of the ninth clock
transmission of the address, the SSPIF is set, the BF
flag is cleared and the Baud Rate Generator is turned
off until another write to the SSPBUF takes place,
holding SCL low and allowing SDA to float.
DS40001726C-page 319
PIC16(L)F1713/6
30.6.6.1
BF Status Flag
In Transmit mode, the BF bit of the SSPSTAT register
is set when the CPU writes to SSPBUF and is cleared
when all eight bits are shifted out.
30.6.6.2
WCOL Status Flag
If the user writes the SSPBUF when a transmit is
already in progress (i.e., SSPSR is still shifting out a
data byte), the WCOL bit is set and the contents of the
buffer are unchanged (the write does not occur).
WCOL must be cleared by software before the next
transmission.
30.6.6.3
ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit of the SSPCON2
register is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does not
Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a
general call), or when the slave has properly received
its data.
30.6.6.4
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
Typical transmit sequence:
The user generates a Start condition by setting
the SEN bit of the SSPCON2 register.
SSPIF is set by hardware on completion of the
Start.
SSPIF is cleared by software.
The MSSP module will wait the required start
time before any other operation takes place.
The user loads the SSPBUF with the slave
address to transmit.
Address is shifted out the SDA pin until all eight
bits are transmitted. Transmission begins as
soon as SSPBUF is written to.
The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit of the SSPCON2 register.
The MSSP module generates an interrupt at the
end of the ninth clock cycle by setting the SSPIF
bit.
The user loads the SSPBUF with eight bits of
data.
Data is shifted out the SDA pin until all eight bits
are transmitted.
The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit of the SSPCON2 register.
Steps 8-11 are repeated for all transmitted data
bytes.
The user generates a Stop or Restart condition
by setting the PEN or RSEN bits of the
SSPCON2 register. Interrupt is generated once
the Stop/Restart condition is complete.
DS40001726C-page 320
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S
R/W
PEN
SEN
BF (SSPSTAT<0>)
SSPIF
SCL
SDA
A6
A5
A4
A3
A2
A1
3
4
5
Cleared by software
2
6
7
8
9
After Start condition, SEN cleared by hardware
SSPBUF written
1
D7
1
SCL held low
while CPU
responds to SSPIF
ACK = 0
R/W = 0
SSPBUF written with 7-bit address and R/W
start transmit
A7
Transmit Address to Slave
3
D5
4
D4
5
D3
6
D2
7
D1
8
D0
SSPBUF is written by software
Cleared by software service routine
from SSP interrupt
2
D6
Transmitting Data or Second Half
of 10-bit Address
From slave, clear ACKSTAT bit SSPCON2<6>
P
Cleared by software
9
ACK
ACKSTAT in
SSPCON2 = 1
FIGURE 30-28:
SEN = 0
Write SSPCON2<0> SEN = 1
Start condition begins
PIC16(L)F1713/6
I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)
DS40001726C-page 321
PIC16(L)F1713/6
30.6.7
I2C MASTER MODE RECEPTION
Master mode reception (Figure 30-29) is enabled by
programming the Receive Enable bit, RCEN bit of the
SSP1CON2 register.
Note:
The MSSP module must be in an Idle
state before the RCEN bit is set or the
RCEN bit will be disregarded.
The Baud Rate Generator begins counting and on each
rollover, the state of the SCL pin changes
(high-to-low/low-to-high) and data is shifted into the
SSPSR. After the falling edge of the eighth clock, the
receive enable flag is automatically cleared, the
contents of the SSPSR are loaded into the SSPBUF,
the BF flag bit is set, the SSPIF flag bit is set and the
Baud Rate Generator is suspended from counting,
holding SCL low. The MSSP is now in Idle state
awaiting the next command. When the buffer is read by
the CPU, the BF flag bit is automatically cleared. The
user can then send an Acknowledge bit at the end of
reception by setting the Acknowledge Sequence
Enable, ACKEN bit of the SSPCON2 register.
30.6.7.1
BF Status Flag
In receive operation, the BF bit is set when an address
or data byte is loaded into SSPBUF from SSPSR. It is
cleared when the SSPBUF register is read.
30.6.7.2
SSPOV Status Flag
30.6.7.4
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
In receive operation, the SSPOV bit is set when eight
bits are received into the SSPSR and the BF flag bit is
already set from a previous reception.
13.
14.
30.6.7.3
15.
WCOL Status Flag
If the user writes the SSPBUF when a receive is
already in progress (i.e., SSPSR is still shifting in a data
byte), the WCOL bit is set and the contents of the buffer
are unchanged (the write does not occur).
DS40001726C-page 322
Typical Receive Sequence:
The user generates a Start condition by setting
the SEN bit of the SSPCON2 register.
SSPIF is set by hardware on completion of the
Start.
SSPIF is cleared by software.
User writes SSPBUF with the slave address to
transmit and the R/W bit set.
Address is shifted out the SDA pin until all eight
bits are transmitted. Transmission begins as
soon as SSPBUF is written to.
The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit of the SSPCON2 register.
The MSSP module generates an interrupt at the
end of the ninth clock cycle by setting the SSPIF
bit.
User sets the RCEN bit of the SSPCON2 register
and the master clocks in a byte from the slave.
After the eighth falling edge of SCL, SSPIF and
BF are set.
Master clears SSPIF and reads the received
byte from SSPUF, clears BF.
Master sets ACK value sent to slave in ACKDT
bit of the SSPCON2 register and initiates the
ACK by setting the ACKEN bit.
Master’s ACK is clocked out to the slave and
SSPIF is set.
User clears SSPIF.
Steps 8-13 are repeated for each received byte
from the slave.
Master sends a not ACK or Stop to end
communication.
 2013-2016 Microchip Technology Inc.
 2013-2016 Microchip Technology Inc.
RCEN
ACKEN
SSPOV
BF
(SSPSTAT<0>)
SDA = 0, SCL = 1
while CPU
responds to SSPIF
SSPIF
S
1
A7
2
4
5
6
Cleared by software
3
A6 A5 A4 A3 A2
Transmit Address to Slave
7
8
9
ACK
2
3
5
6
7
8
D0
9
ACK
2
3
4
RCEN cleared
automatically
5
6
7
Cleared by software
Set SSPIF interrupt
at end of Acknowledge
sequence
Data shifted in on falling edge of CLK
1
ACK from Master
SDA = ACKDT = 0
Cleared in
software
Set SSPIF at end
of receive
9
ACK is not sent
ACK
P
Set SSPIF interrupt
at end of Acknowledge sequence
Bus master
terminates
transfer
Set P bit
(SSPSTAT<4>)
and SSPIF
PEN bit = 1
written here
SSPOV is set because
SSPBUF is still full
8
D0
RCEN cleared
automatically
D7 D6 D5 D4 D3 D2 D1
RCEN cleared
automatically
Set ACKEN, start Acknowledge sequence
SDA = ACKDT = 1
Receiving Data from Slave
RCEN = 1, start
next receive
ACK from Master
SDA = ACKDT = 0
Last bit is shifted into SSPSR and
contents are unloaded into SSPBUF
Cleared by software
Set SSPIF interrupt
at end of receive
4
Cleared by software
1
D7 D6 D5 D4 D3 D2 D1
Receiving Data from Slave
RCEN cleared
automatically
Master configured as a receiver
by programming SSPCON2<3> (RCEN = 1)
A1 R/W
ACK from Slave
Master configured as a receiver
by programming SSPCON2<3> (RCEN = 1)
FIGURE 30-29:
SCL
SDA
SEN = 0
Write to SSPBUF occurs here,
start XMIT
Write to SSPCON2<0> (SEN = 1),
begin Start condition
Write to SSPCON2<4>
to start Acknowledge sequence
SDA = ACKDT (SSPCON2<5>) = 0
PIC16(L)F1713/6
I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)
DS40001726C-page 323
PIC16(L)F1713/6
30.6.8
ACKNOWLEDGE SEQUENCE
TIMING
30.6.9
A Stop bit is asserted on the SDA pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN bit of the SSPCON2 register. At the end of a
receive/transmit, the SCL line is held low after the
falling edge of the ninth clock. When the PEN bit is set,
the master will assert the SDA line low. When the SDA
line is sampled low, the Baud Rate Generator is
reloaded and counts down to ‘0’. When the Baud Rate
Generator times out, the SCL pin will be brought high
and one TBRG (Baud Rate Generator rollover count)
later, the SDA pin will be deasserted. When the SDA
pin is sampled high while SCL is high, the P bit of the
SSPSTAT register is set. A TBRG later, the PEN bit is
cleared and the SSPIF bit is set (Figure 30-31).
An Acknowledge sequence is enabled by setting the
Acknowledge Sequence Enable bit, ACKEN bit of the
SSPCON2 register. When this bit is set, the SCL pin is
pulled low and the contents of the Acknowledge data bit
are presented on the SDA pin. If the user wishes to
generate an Acknowledge, then the ACKDT bit should
be cleared. If not, the user should set the ACKDT bit
before starting an Acknowledge sequence. The Baud
Rate Generator then counts for one rollover period
(TBRG) and the SCL pin is deasserted (pulled high).
When the SCL pin is sampled high (clock arbitration),
the Baud Rate Generator counts for TBRG. The SCL pin
is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off
and the MSSP module then goes into Idle mode
(Figure 30-30).
30.6.8.1
30.6.9.1
WCOL Status Flag
If the user writes the SSPBUF when a Stop sequence
is in progress, then the WCOL bit is set and the
contents of the buffer are unchanged (the write does
not occur).
WCOL Status Flag
If the user writes the SSPBUF when an Acknowledge
sequence is in progress, then WCOL bit is set and the
contents of the buffer are unchanged (the write does
not occur).
FIGURE 30-30:
STOP CONDITION TIMING
ACKNOWLEDGE SEQUENCE WAVEFORM
Acknowledge sequence starts here,
write to SSPCON2
ACKEN = 1, ACKDT = 0
ACKEN automatically cleared
TBRG
TBRG
SDA
ACK
D0
SCL
8
9
SSPIF
SSPIF set at
the end of receive
Cleared in
software
Cleared in
software
SSPIF set at the end
of Acknowledge sequence
Note: TBRG = one Baud Rate Generator period.
FIGURE 30-31:
STOP CONDITION RECEIVE OR TRANSMIT MODE
SCL = 1 for TBRG, followed by SDA = 1 for TBRG
after SDA sampled high. P bit (SSPSTAT<4>) is set.
Write to SSPCON2,
set PEN
PEN bit (SSPCON2<2>) is cleared by
hardware and the SSPIF bit is set
Falling edge of
9th clock
TBRG
SCL
SDA
ACK
P
TBRG
TBRG
TBRG
SCL brought high after TBRG
SDA asserted low before rising edge of clock
to setup Stop condition
Note: TBRG = one Baud Rate Generator period.
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PIC16(L)F1713/6
30.6.10
SLEEP OPERATION
30.6.13
the I2C slave
While in Sleep mode,
module can receive
addresses or data and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSP interrupt is enabled).
30.6.11
EFFECTS OF A RESET
A Reset disables the MSSP module and terminates the
current transfer.
30.6.12
MULTI-MASTER MODE
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
determination of when the bus is free. The Stop (P) and
Start (S) bits are cleared from a Reset or when the
MSSP module is disabled. Control of the I 2C bus may
be taken when the P bit of the SSPSTAT register is set,
or the bus is Idle, with both the S and P bits clear. When
the bus is busy, enabling the SSP interrupt will generate the interrupt when the Stop condition occurs.
In multi-master operation, the SDA line must be
monitored for arbitration to see if the signal level is the
expected output level. This check is performed by
hardware with the result placed in the BCLIF bit.
The states where arbitration can be lost are:
•
•
•
•
•
Address Transfer
Data Transfer
A Start Condition
A Repeated Start Condition
An Acknowledge Condition
MULTI -MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto
the SDA pin, arbitration takes place when the master
outputs a ‘1’ on SDA, by letting SDA float high and
another master asserts a ‘0’. When the SCL pin floats
high, data should be stable. If the expected data on
SDA is a ‘1’ and the data sampled on the SDA pin is ‘0’,
then a bus collision has taken place. The master will set
the Bus Collision Interrupt Flag, BCLIF and reset the
I2C port to its Idle state (Figure 30-32).
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF flag is
cleared, the SDA and SCL lines are deasserted and the
SSPBUF can be written to. When the user services the
bus collision Interrupt Service Routine and if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the
condition is aborted, the SDA and SCL lines are
deasserted and the respective control bits in the SSPCON2 register are cleared. When the user services the
bus collision Interrupt Service Routine and if the I2C bus
is free, the user can resume communication by asserting
a Start condition.
The master will continue to monitor the SDA and SCL
pins. If a Stop condition occurs, the SSPIF bit will be set.
A write to the SSPBUF will start the transmission of
data at the first data bit, regardless of where the
transmitter left off when the bus collision occurred.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus
can be taken when the P bit is set in the SSPSTAT
register, or the bus is Idle and the S and P bits are
cleared.
FIGURE 30-32:
BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
Data changes
while SCL = 0
SDA line pulled low
by another source
SDA released
by master
Sample SDA. While SCL is high,
data does not match what is driven
by the master.
Bus collision has occurred.
SDA
SCL
Set bus collision
interrupt (BCLIF)
BCLIF
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DS40001726C-page 325
PIC16(L)F1713/6
30.6.13.1
Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a)
b)
SDA or SCL are sampled low at the beginning of
the Start condition (Figure 30-33).
SCL is sampled low before SDA is asserted low
(Figure 30-34).
During a Start condition, both the SDA and the SCL
pins are monitored.
If the SDA pin is sampled low during this count, the
BRG is reset and the SDA line is asserted early
(Figure 30-35). If, however, a ‘1’ is sampled on the SDA
pin, the SDA pin is asserted low at the end of the BRG
count. The Baud Rate Generator is then reloaded and
counts down to zero; if the SCL pin is sampled as ‘0’
during this time, a bus collision does not occur. At the
end of the BRG count, the SCL pin is asserted low.
Note:
If the SDA pin is already low, or the SCL pin is already
low, then all of the following occur:
• the Start condition is aborted,
• the BCLIF flag is set and
• the MSSP module is reset to its Idle state
(Figure 30-33).
The Start condition begins with the SDA and SCL pins
deasserted. When the SDA pin is sampled high, the
Baud Rate Generator is loaded and counts down. If the
SCL pin is sampled low while SDA is high, a bus
collision occurs because it is assumed that another
master is attempting to drive a data ‘1’ during the Start
condition.
FIGURE 30-33:
The reason that bus collision is not a
factor during a Start condition is that no
two bus masters can assert a Start condition at the exact same time. Therefore,
one master will always assert SDA before
the other. This condition does not cause a
bus collision because the two masters
must be allowed to arbitrate the first
address following the Start condition. If the
address is the same, arbitration must be
allowed to continue into the data portion,
Repeated Start or Stop conditions.
BUS COLLISION DURING START CONDITION (SDA ONLY)
SDA goes low before the SEN bit is set.
Set BCLIF,
S bit and SSPIF set because
SDA = 0, SCL = 1.
SDA
SCL
Set SEN, enable Start
condition if SDA = 1, SCL = 1
SEN cleared automatically because of bus collision.
SSP module reset into Idle state.
SEN
BCLIF
SDA sampled low before
Start condition. Set BCLIF.
S bit and SSPIF set because
SDA = 0, SCL = 1.
SSPIF and BCLIF are
cleared by software
S
SSPIF
SSPIF and BCLIF are
cleared by software
DS40001726C-page 326
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PIC16(L)F1713/6
FIGURE 30-34:
BUS COLLISION DURING START CONDITION (SCL = 0)
SDA = 0, SCL = 1
TBRG
TBRG
SDA
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
SCL
SCL = 0 before SDA = 0,
bus collision occurs. Set BCLIF.
SEN
SCL = 0 before BRG time-out,
bus collision occurs. Set BCLIF.
BCLIF
Interrupt cleared
by software
S
’0’
’0’
SSPIF
’0’
’0’
FIGURE 30-35:
BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDA = 0, SCL = 1
Set S
Less than TBRG
SDA
Set SSPIF
TBRG
SDA pulled low by other master.
Reset BRG and assert SDA.
SCL
S
SCL pulled low after BRG
time-out
SEN
BCLIF
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
’0’
S
SSPIF
SDA = 0, SCL = 1,
set SSPIF
 2013-2016 Microchip Technology Inc.
Interrupts cleared
by software
DS40001726C-page 327
PIC16(L)F1713/6
30.6.13.2
Bus Collision During a Repeated
Start Condition
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, Figure 30-36).
If SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high-to-low before the BRG
times out, no bus collision occurs because no two
masters can assert SDA at exactly the same time.
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
A low level is sampled on SDA when SCL goes
from low level to high level (Case 1).
SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’ (Case 2).
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition,
see Figure 30-37.
When the user releases SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD and counts
down to zero. The SCL pin is then deasserted and
when sampled high, the SDA pin is sampled.
FIGURE 30-36:
If, at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is
complete.
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
SDA
SCL
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
RSEN
BCLIF
Cleared by software
S
’0’
SSPIF
’0’
FIGURE 30-37:
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
TBRG
TBRG
SDA
SCL
BCLIF
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
Interrupt cleared
by software
RSEN
S
’0’
SSPIF
DS40001726C-page 328
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PIC16(L)F1713/6
30.6.13.3
Bus Collision During a Stop
Condition
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD and
counts down to zero. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 30-38). If the SCL pin is sampled
low before SDA is allowed to float high, a bus collision
occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 30-39).
Bus collision occurs during a Stop condition if:
a)
b)
After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out (Case 1).
After the SCL pin is deasserted, SCL is sampled
low before SDA goes high (Case 2).
FIGURE 30-38:
BUS COLLISION DURING A STOP CONDITION (CASE 1)
TBRG
TBRG
TBRG
SDA
SDA sampled
low after TBRG,
set BCLIF
SDA asserted low
SCL
PEN
BCLIF
P
’0’
SSPIF
’0’
FIGURE 30-39:
BUS COLLISION DURING A STOP CONDITION (CASE 2)
TBRG
TBRG
TBRG
SDA
Assert SDA
SCL
SCL goes low before SDA goes high,
set BCLIF
PEN
BCLIF
P
’0’
SSPIF
’0’
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PIC16(L)F1713/6
TABLE 30-3:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH I2C OPERATION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
Values on
Page:
ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
INTCON
PIE1
PIE2
OSFIE
C2IE
C1IE
—
BCL1IE
TMR6IE
TMR4IE
CCP2IE
85
PIR1
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
87
PIR2
—
BCL1IF
TMR6IF
TMR4IF
CCP2IF
OSFIF
C2IF
C1IF
RxyPPS
—
—
—
RxyPPS<4:0>
137
SSPCLKPPS
—
—
—
SSPCLKPPS<4:0>
136
SSPDATPPS
—
—
—
SSPDATPPS<4:0>
136
SSP1ADD
SSP1BUF
SSP1CON1
ADD<7:0>
88
336
Synchronous Serial Port Receive Buffer/Transmit Register
289*
WCOL
SSPOV
SSPEN
CKP
SSP1CON2
GCEN
ACKSTAT
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
334
SSP1CON3
ACKTIM
PCIE
SCIE
BOEN
SDAHT
SBCDE
AHEN
DHEN
335
SMP
CKE
D/A
P
R/W
UA
BF
332
SSP1MSK
SSP1STAT
SSPM<3:0>
333
MSK<7:0>
336
S
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
Legend:
*
— = unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP module in I2C mode.
Page provides register information.
DS40001726C-page 330
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PIC16(L)F1713/6
30.7
BAUD RATE GENERATOR
The MSSP module has a Baud Rate Generator available for clock generation in both I2C and SPI Master
modes. The Baud Rate Generator (BRG) reload value
is placed in the SSPADD register (Register 30-6).
When a write occurs to SSPBUF, the Baud Rate
Generator will automatically begin counting down.
Once the given operation is complete, the internal clock
will automatically stop counting and the clock pin will
remain in its last state.
clock line. The logic dictating when the reload signal is
asserted depends on the mode the MSSP is being
operated in.
Table 30-4 demonstrates clock rates based on
instruction cycles and the BRG value loaded into
SSPADD.
EQUATION 30-1:
FOSC
FCLOCK = ------------------------------------------------ SSPxADD + 1   4 
An internal signal “Reload” in Figure 30-40 triggers the
value from SSPADD to be loaded into the BRG counter.
This occurs twice for each oscillation of the module
FIGURE 30-40:
BAUD RATE GENERATOR BLOCK DIAGRAM
SSPM<3:0>
SSPM<3:0>
Reload
SSPADD<7:0>
Reload
Control
SCL
SSPCLK
BRG Down Counter
FOSC/2
Note: Values of 0x00, 0x01 and 0x02 are not valid
for SSPADD when used as a Baud Rate
Generator for I2C. This is an implementation
limitation.
TABLE 30-4:
Note:
MSSP CLOCK RATE W/BRG
FOSC
FCY
BRG Value
FCLOCK
(2 Rollovers of BRG)
32 MHz
8 MHz
13h
400 kHz
32 MHz
8 MHz
19h
308 kHz
32 MHz
8 MHz
4Fh
100 kHz
16 MHz
4 MHz
09h
400 kHz
16 MHz
4 MHz
0Ch
308 kHz
16 MHz
4 MHz
27h
100 kHz
4 MHz
1 MHz
09h
100 kHz
Refer to the I/O port electrical specifications in Table 34-4 to ensure the system is designed to support IOL
requirements.
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30.8
Register Definitions: MSSP Control
REGISTER 30-1:
SSP1STAT: SSP STATUS REGISTER
R/W-0/0
R/W-0/0
R-0/0
R-0/0
R-0/0
R-0/0
R-0/0
R-0/0
SMP
CKE
D/A
P
S
R/W
UA
BF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
SMP: SPI Data Input Sample bit
SPI Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
SPI Slave mode:
SMP must be cleared when SPI is used in Slave mode
In I2 C Master or Slave mode:
1 = Slew rate control disabled for Standard Speed mode (100 kHz and 1 MHz)
0 = Slew rate control enabled for High-Speed mode (400 kHz)
bit 6
CKE: SPI Clock Edge Select bit (SPI mode only)
In SPI Master or Slave mode:
1 = Transmit occurs on transition from active to Idle clock state
0 = Transmit occurs on transition from Idle to active clock state
In I2 C™ mode only:
1 = Enable input logic so that thresholds are compliant with SMBus specification
0 = Disable SMBus specific inputs
bit 5
bit 4
D/A: Data/Address bit (I2C mode only)
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
P: Stop bit
(I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset)
0 = Stop bit was not detected last
bit 3
S: Start bit
(I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset)
0 = Start bit was not detected last
bit 2
R/W: Read/Write bit information (I2C mode only)
This bit holds the R/W bit information following the last address match. This bit is only valid from the address match
to the next Start bit, Stop bit, or not ACK bit.
In I2 C Slave mode:
1 = Read
0 = Write
In I2 C Master mode:
1 = Transmit is in progress
0 = Transmit is not in progress
OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode.
bit 1
UA: Update Address bit (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0
BF: Buffer Full Status bit
Receive (SPI and I2 C modes):
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Transmit (I2 C mode only):
1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full
0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty
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REGISTER 30-2:
SSP1CON1: SSP CONTROL REGISTER 1
R/C/HS-0/0
R/C/HS-0/0
R/W-0/0
R/W-0/0
WCOL
SSPOV(1)
SSPEN
CKP
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
SSPM<3:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
HS = Bit is set by hardware
C = User cleared
bit 7
WCOL: Write Collision Detect bit
Master mode:
1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started
0 = No collision
Slave mode:
1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software)
0 = No collision
bit 6
SSPOV: Receive Overflow Indicator bit(1)
In SPI mode:
1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR is lost.
Overflow can only occur in Slave mode. In Slave mode, the user must read the SSPBUF, even if only transmitting data, to avoid
setting overflow. In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the
SSPBUF register (must be cleared in software).
0 = No overflow
In I2C mode:
1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a “don’t care” in Transmit mode
(must be cleared in software).
0 = No overflow
bit 5
SSPEN: Synchronous Serial Port Enable bit
In both modes, when enabled, these pins must be properly configured as input or output
In SPI mode:
1 = Enables serial port and configures SCK, SDO, SDI and SS as the source of the serial port pins(2)
0 = Disables serial port and configures these pins as I/O port pins
In I2C mode:
1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port pins(3)
0 = Disables serial port and configures these pins as I/O port pins
bit 4
CKP: Clock Polarity Select bit
In SPI mode:
1 = Idle state for clock is a high level
0 = Idle state for clock is a low level
In I2C Slave mode:
SCL release control
1 = Enable clock
0 = Holds clock low (clock stretch). (Used to ensure data setup time.)
In I2C Master mode:
Unused in this mode
bit 3-0
SSPM<3:0>: Synchronous Serial Port Mode Select bits
1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled
1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled
1101 = Reserved
1100 = Reserved
1011 = I2C firmware controlled Master mode (slave idle)
1010 = SPI Master mode, clock = FOSC/(4 * (SSPADD+1))(5)
1001 = Reserved
1000 = I2C Master mode, clock = FOSC / (4 * (SSPADD+1))(4)
0111 = I2C Slave mode, 10-bit address
0110 = I2C Slave mode, 7-bit address
0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin
0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled
0011 = SPI Master mode, clock = T2_match/2
0010 = SPI Master mode, clock = FOSC/64
0001 = SPI Master mode, clock = FOSC/16
0000 = SPI Master mode, clock = FOSC/4
Note
1:
2:
3:
4:
5:
In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register.
When enabled, these pins must be properly configured as input or output. Use SSPSSPPS, SSPCLKPPS, SSPDATPPS, and RxyPPS
to select the pins.
When enabled, the SDA and SCL pins must be configured as inputs. Use SSPCLKPPS, SSPDATPPS, and RxyPPS to select the pins.
SSPADD values of 0, 1 or 2 are not supported for I2C mode.
SSPADD value of ‘0’ is not supported. Use SSPM = 0000 instead.
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SSP1CON2: SSP CONTROL REGISTER 2(1)
REGISTER 30-3:
R/W-0/0
R-0/0
R/W-0/0
R/S/HS-0/0
R/S/HS-0/0
R/S/HS-0/0
R/S/HS-0/0
R/W/HS-0/0
GCEN
ACKSTAT
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
HC = Cleared by hardware
S = User set
bit 7
GCEN: General Call Enable bit (in I2C Slave mode only)
1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPSR
0 = General call address disabled
bit 6
ACKSTAT: Acknowledge Status bit (in I2C mode only)
1 = Acknowledge was not received
0 = Acknowledge was received
bit 5
ACKDT: Acknowledge Data bit (in I2C mode only)
In Receive mode:
Value transmitted when the user initiates an Acknowledge sequence at the end of a receive
1 = Not Acknowledge
0 = Acknowledge
bit 4
ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only)
In Master Receive mode:
1 = Initiate Acknowledge sequence on SDA and SCL pins, and transmit ACKDT data bit.
Automatically cleared by hardware.
0 = Acknowledge sequence idle
bit 3
RCEN: Receive Enable bit (in I2C Master mode only)
1 = Enables Receive mode for I2C
0 = Receive idle
bit 2
PEN: Stop Condition Enable bit (in I2C Master mode only)
SCKMSSP Release Control:
1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Stop condition Idle
bit 1
RSEN: Repeated Start Condition Enable bit (in I2C Master mode only)
1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Repeated Start condition Idle
bit 0
SEN: Start Condition Enable/Stretch Enable bit
In Master mode:
1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Start condition Idle
In Slave mode:
1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled)
0 = Clock stretching is disabled
Note 1:
For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be
set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled).
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REGISTER 30-4:
SSP1CON3: SSP CONTROL REGISTER 3
R-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
ACKTIM(3)
PCIE
SCIE
BOEN
SDAHT
SBCDE
AHEN
DHEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
ACKTIM: Acknowledge Time Status bit (I2C mode only)(3)
1 = Indicates the I2C bus is in an Acknowledge sequence, set on eighth falling edge of SCL clock
0 = Not an Acknowledge sequence, cleared on 9TH rising edge of SCL clock
bit 6
PCIE: Stop Condition Interrupt Enable bit (I2C mode only)
1 = Enable interrupt on detection of Stop condition
0 = Stop detection interrupts are disabled(2)
bit 5
SCIE: Start Condition Interrupt Enable bit (I2C mode only)
1 = Enable interrupt on detection of Start or Restart conditions
0 = Start detection interrupts are disabled(2)
bit 4
BOEN: Buffer Overwrite Enable bit
In SPI Slave mode:(1)
1 = SSPBUF updates every time that a new data byte is shifted in ignoring the BF bit
0 = If new byte is received with BF bit of the SSPSTAT register already set, SSPOV bit of the
SSPCON1 register is set, and the buffer is not updated
In I2C Master mode and SPI Master mode:
This bit is ignored.
In I2C Slave mode:
1 = SSPBUF is updated and ACK is generated for a received address/data byte, ignoring the state
of the SSPOV bit only if the BF bit = 0.
0 = SSPBUF is only updated when SSPOV is clear
bit 3
SDAHT: SDA Hold Time Selection bit (I2C mode only)
1 = Minimum of 300 ns hold time on SDA after the falling edge of SCL
0 = Minimum of 100 ns hold time on SDA after the falling edge of SCL
bit 2
SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only)
If, on the rising edge of SCL, SDA is sampled low when the module is outputting a high state, the
BCL1IF bit of the PIR2 register is set, and bus goes idle
1 = Enable slave bus collision interrupts
0 = Slave bus collision interrupts are disabled
bit 1
AHEN: Address Hold Enable bit (I2C Slave mode only)
1 = Following the eighth falling edge of SCL for a matching received address byte; CKP bit of the
SSPCON1 register will be cleared and the SCL will be held low.
0 = Address holding is disabled
bit 0
DHEN: Data Hold Enable bit (I2C Slave mode only)
1 = Following the eighth falling edge of SCL for a received data byte; slave hardware clears the CKP
bit of the SSPCON1 register and SCL is held low.
0 = Data holding is disabled
Note 1:
2:
3:
For daisy-chained SPI operation; allows the user to ignore all but the last received byte. SSPOV is still set
when a new byte is received and BF = 1, but hardware continues to write the most recent byte to SSPBUF.
This bit has no effect in Slave modes that Start and Stop condition detection is explicitly listed as enabled.
The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is set.
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REGISTER 30-5:
R/W-1/1
SSP1MSK: SSP MASK REGISTER
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
R/W-1/1
MSK<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-1
MSK<7:1>: Mask bits
1 = The received address bit n is compared to SSPADD<n> to detect I2C address match
0 = The received address bit n is not used to detect I2C address match
bit 0
MSK<0>: Mask bit for I2C Slave mode, 10-bit Address
I2C Slave mode, 10-bit address (SSPM<3:0> = 0111 or 1111):
1 = The received address bit 0 is compared to SSPADD<0> to detect I2C address match
0 = The received address bit 0 is not used to detect I2C address match
I2C Slave mode, 7-bit address, the bit is ignored
REGISTER 30-6:
R/W-0/0
SSP1ADD: MSSP ADDRESS AND BAUD RATE REGISTER (I2C MODE)
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
ADD<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
Master mode:
bit 7-0
ADD<7:0>: Baud Rate Clock Divider bits
SCL pin clock period = ((ADD<7:0> + 1) *4)/FOSC
10-Bit Slave mode – Most Significant Address Byte:
bit 7-3
Not used: Unused for Most Significant Address Byte. Bit state of this register is a “don’t care”. Bit
pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits
are compared by hardware and are not affected by the value in this register.
bit 2-1
ADD<2:1>: Two Most Significant bits of 10-bit address
bit 0
Not used: Unused in this mode. Bit state is a “don’t care”.
10-Bit Slave mode – Least Significant Address Byte:
bit 7-0
ADD<7:0>: Eight Least Significant bits of 10-bit address
7-Bit Slave mode:
bit 7-1
ADD<7:1>: 7-bit address
bit 0
Not used: Unused in this mode. Bit state is a “don’t care”.
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31.0
•
•
•
•
•
•
•
•
•
Two-character input buffer
One-character output buffer
Programmable 8-bit or 9-bit character length
Address detection in 9-bit mode
Input buffer overrun error detection
Received character framing error detection
Half-duplex synchronous master
Half-duplex synchronous slave
Programmable clock polarity in synchronous
modes
• Sleep operation
ENHANCED UNIVERSAL
SYNCHRONOUS
ASYNCHRONOUS RECEIVER
TRANSMITTER (EUSART)
The Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) module is a serial I/O
communications peripheral. It contains all the clock
generators, shift registers and data buffers necessary
to perform an input or output serial data transfer
independent of device program execution. The
EUSART, also known as a Serial Communications
Interface (SCI), can be configured as a full-duplex
asynchronous system or half-duplex synchronous
system.
Full-Duplex
mode
is
useful
for
communications with peripheral systems, such as CRT
terminals and personal computers. Half-Duplex
Synchronous mode is intended for communications
with peripheral devices, such as A/D or D/A integrated
circuits, serial EEPROMs or other microcontrollers.
These devices typically do not have internal clocks for
baud rate generation and require the external clock
signal provided by a master synchronous device.
The EUSART module implements the following
additional features, making it ideally suited for use in
Local Interconnect Network (LIN) bus systems:
• Automatic detection and calibration of the baud rate
• Wake-up on Break reception
• 13-bit Break character transmit
Block diagrams of the EUSART transmitter and
receiver are shown in Figure 31-1 and Figure 31-2.
The EUSART transmit output (TX_out) is available to
the TX/CK pin and internally to the following peripherals:
The EUSART module includes the following capabilities:
• Configurable Logic Cell (CLC)
• Full-duplex asynchronous transmit and receive
FIGURE 31-1:
EUSART TRANSMIT BLOCK DIAGRAM
Data Bus
TXIE
Interrupt
TXIF
TXREG Register
8
MSb
LSb
(8)
0
• • •
TX/CK pin
Pin Buffer
and Control
Transmit Shift Register (TSR)
TX_out
TXEN
TRMT
Baud Rate Generator
FOSC
÷n
+1
SPBRGH
TX9
n
BRG16
SPBRGL
Multiplier
x4
x16 x64
SYNC
1 X 0 0
0
BRGH
X 1 1 0
0
BRG16
X 1 0 1
0
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TX9D
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FIGURE 31-2:
EUSART RECEIVE BLOCK DIAGRAM
SPEN
CREN
RX/DT pin
Baud Rate Generator
Data
Recovery
FOSC
BRG16
+1
SPBRGH
SPBRGL
RSR Register
MSb
Pin Buffer
and Control
Multiplier
x4
x16 x64
SYNC
1 X 0 0
0
BRGH
X 1 1 0
0
BRG16
X 1 0 1
0
Stop
RCIDL
OERR
(8)
•••
7
1
LSb
0 Start
RX9
÷n
n
FERR
RX9D
RCREG Register
8
FIFO
Data Bus
RCIF
RCIE
Interrupt
The operation of the EUSART module is controlled
through three registers:
• Transmit Status and Control (TXSTA)
• Receive Status and Control (RCSTA)
• Baud Rate Control (BAUDCON)
These registers are detailed in Register 31-1,
Register 31-2 and Register 31-3, respectively.
The RX and CK input pins are selected with the RXPPS
and CKPPS registers, respectively. TX, CK, and DT
output pins are selected with each pin’s RxyPPS register.
Since the RX input is coupled with the DT output in
Synchronous mode, it is the user’s responsibility to select
the same pin for both of these functions when operating
in Synchronous mode. The EUSART control logic will
control the data direction drivers automatically.
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31.1
EUSART Asynchronous Mode
The EUSART transmits and receives data using the
standard non-return-to-zero (NRZ) format. NRZ is
implemented with two levels: a VOH Mark state which
represents a ‘1’ data bit, and a VOL Space state which
represents a ‘0’ data bit. NRZ refers to the fact that
consecutively transmitted data bits of the same value
stay at the output level of that bit without returning to a
neutral level between each bit transmission. An NRZ
transmission port idles in the Mark state. Each character
transmission consists of one Start bit followed by eight
or nine data bits and is always terminated by one or
more Stop bits. The Start bit is always a space and the
Stop bits are always marks. The most common data
format is eight bits. Each transmitted bit persists for a
period of 1/(Baud Rate). An on-chip dedicated
8-bit/16-bit Baud Rate Generator is used to derive
standard baud rate frequencies from the system
oscillator. See Table 31-5 for examples of baud rate
configurations.
31.1.1.2
Transmitting Data
A transmission is initiated by writing a character to the
TXREG register. If this is the first character, or the
previous character has been completely flushed from
the TSR, the data in the TXREG is immediately
transferred to the TSR register. If the TSR still contains
all or part of a previous character, the new character
data is held in the TXREG until the Stop bit of the
previous character has been transmitted. The pending
character in the TXREG is then transferred to the TSR
in one TCY immediately following the Stop bit
transmission. The transmission of the Start bit, data bits
and Stop bit sequence commences immediately
following the transfer of the data to the TSR from the
TXREG.
31.1.1.3
Transmit Data Polarity
The EUSART transmits and receives the LSb first. The
EUSART’s transmitter and receiver are functionally
independent, but share the same data format and baud
rate. Parity is not supported by the hardware, but can
be implemented in software and stored as the ninth
data bit.
The polarity of the transmit data can be controlled with
the SCKP bit of the BAUDCON register. The default
state of this bit is ‘0’ which selects high true transmit idle
and data bits. Setting the SCKP bit to ‘1’ will invert the
transmit data resulting in low true idle and data bits. The
SCKP bit controls transmit data polarity in
Asynchronous mode only. In Synchronous mode, the
SCKP bit has a different function. See Section 31.5.1.2
“Clock Polarity”.
31.1.1
31.1.1.4
EUSART ASYNCHRONOUS
TRANSMITTER
The EUSART transmitter block diagram is shown in
Figure 31-1. The heart of the transmitter is the serial
Transmit Shift Register (TSR), which is not directly
accessible by software. The TSR obtains its data from
the transmit buffer, which is the TXREG register.
31.1.1.1
Enabling the Transmitter
The EUSART transmitter is enabled for asynchronous
operations by configuring the following three control
bits:
• TXEN = 1
• SYNC = 0
• SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Setting the TXEN bit of the TXSTA register enables the
transmitter circuitry of the EUSART. Clearing the SYNC
bit of the TXSTA register configures the EUSART for
asynchronous operation. Setting the SPEN bit of the
RCSTA register enables the EUSART and automatically
configures the TX/CK I/O pin as an output. If the TX/CK
pin is shared with an analog peripheral, the analog I/O
function must be disabled by clearing the corresponding
ANSEL bit.
Note:
Transmit Interrupt Flag
The TXIF interrupt flag bit of the PIR1 register is set
whenever the EUSART transmitter is enabled and no
character is being held for transmission in the TXREG.
In other words, the TXIF bit is only clear when the TSR
is busy with a character and a new character has been
queued for transmission in the TXREG. The TXIF flag bit
is not cleared immediately upon writing TXREG. TXIF
becomes valid in the second instruction cycle following
the write execution. Polling TXIF immediately following
the TXREG write will return invalid results. The TXIF bit
is read-only, it cannot be set or cleared by software.
The TXIF interrupt can be enabled by setting the TXIE
interrupt enable bit of the PIE1 register. However, the
TXIF flag bit will be set whenever the TXREG is empty,
regardless of the state of TXIE enable bit.
To use interrupts when transmitting data, set the TXIE
bit only when there is more data to send. Clear the
TXIE interrupt enable bit upon writing the last character
of the transmission to the TXREG.
The TXIF Transmitter Interrupt flag is set
when the TXEN enable bit is set.
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31.1.1.5
TSR Status
31.1.1.7
The TRMT bit of the TXSTA register indicates the
status of the TSR register. This is a read-only bit. The
TRMT bit is set when the TSR register is empty and is
cleared when a character is transferred to the TSR
register from the TXREG. The TRMT bit remains clear
until all bits have been shifted out of the TSR register.
No interrupt logic is tied to this bit, so the user has to
poll this bit to determine the TSR status.
Note:
31.1.1.6
1.
2.
3.
The TSR register is not mapped in data
memory, so it is not available to the user.
Transmitting 9-Bit Characters
The EUSART supports 9-bit character transmissions.
When the TX9 bit of the TXSTA register is set, the
EUSART will shift nine bits out for each character transmitted. The TX9D bit of the TXSTA register is the ninth,
and Most Significant data bit. When transmitting 9-bit
data, the TX9D data bit must be written before writing
the eight Least Significant bits into the TXREG. All nine
bits of data will be transferred to the TSR shift register
immediately after the TXREG is written.
A special 9-bit Address mode is available for use with
multiple receivers. See Section 31.1.2.7 “Address
Detection” for more information on the Address mode.
FIGURE 31-3:
Write to TXREG
BRG Output
(Shift Clock)
TX/CK
pin
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
DS40001726C-page 340
4.
5.
6.
7.
8.
Asynchronous Transmission Setup:
Initialize the SPBRGH, SPBRGL register pair and
the BRGH and BRG16 bits to achieve the desired
baud rate (see Section 31.4 “EUSART Baud
Rate Generator (BRG)”).
Enable the asynchronous serial port by clearing
the SYNC bit and setting the SPEN bit.
If 9-bit transmission is desired, set the TX9
control bit. A set ninth data bit will indicate that
the eight Least Significant data bits are an
address when the receiver is set for address
detection.
Set SCKP bit if inverted transmit is desired.
Enable the transmission by setting the TXEN
control bit. This will cause the TXIF interrupt bit
to be set.
If interrupts are desired, set the TXIE interrupt
enable bit of the PIE1 register. An interrupt will
occur immediately provided that the GIE and
PEIE bits of the INTCON register are also set.
If 9-bit transmission is selected, the ninth bit
should be loaded into the TX9D data bit.
Load 8-bit data into the TXREG register. This
will start the transmission.
ASYNCHRONOUS TRANSMISSION
Word 1
Start bit
bit 0
bit 1
bit 7/8
Stop bit
Word 1
1 TCY
Word 1
Transmit Shift Reg.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 31-4:
ASYNCHRONOUS TRANSMISSION (BACK-TO-BACK)
Write to TXREG
Word 1
BRG Output
(Shift Clock)
TX/CK
pin
Word 2
Start bit
bit 0
bit 1
Word 1
1 TCY
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
TABLE 31-1:
Word 1
Transmit Shift Reg.
Bit 7
Bit 6
Word 2
Transmit Shift Reg.
BAUD1CON
ABDOVF
GIE
PIE1
PIR1
Bit 2
Bit 1
Bit 0
Register on
Page
BRG16
—
WUE
ABDEN
349
IOCIE
TMR0IF
INTF
IOCIF
83
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
87
CREN
ADDEN
FERR
OERR
RX9D
348
Bit 5
Bit 4
Bit 3
RCIDL
—
SCKP
PEIE
TMR0IE
INTE
TMR1GIE
ADIE
RCIE
TMR1GIF
ADIF
RCIF
RC1STA
SPEN
RX9
SREN
RxyPPS
—
—
—
RxyPPS<4:0>
SP1BRGL
SP1BRG<7:0>
SP1BRGH
SP1BRG<15:8>
TX1REG
TX1STA
Legend:
*
bit 0
SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Name
TRISC
Start bit
Word 2
This timing diagram shows two consecutive transmissions.
Note:
TRISB
Stop bit
1 TCY
TRMT bit
(Transmit Shift
Reg. Empty Flag)
INTCON
bit 7/8
137
350*
350*
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
EUSART Transmit Data Register
CSRC
TX9
TXEN
125
130
339*
SYNC
SENDB
BRGH
TRMT
TX9D
347
— = unimplemented location, read as ‘0’. Shaded cells are not used for asynchronous transmission.
Page provides register information.
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31.1.2
EUSART ASYNCHRONOUS
RECEIVER
The Asynchronous mode is typically used in RS-232
systems. The receiver block diagram is shown in
Figure 31-2. The data is received on the RX/DT pin and
drives the data recovery block. The data recovery block
is actually a high-speed shifter operating at 16 times
the baud rate, whereas the serial Receive Shift
Register (RSR) operates at the bit rate. When all eight
or nine bits of the character have been shifted in, they
are immediately transferred to a two character
First-In-First-Out (FIFO) memory. The FIFO buffering
allows reception of two complete characters and the
start of a third character before software must start
servicing the EUSART receiver. The FIFO and RSR
registers are not directly accessible by software.
Access to the received data is via the RCREG register.
31.1.2.1
Enabling the Receiver
The EUSART receiver is enabled for asynchronous
operation by configuring the following three control bits:
• CREN = 1
• SYNC = 0
• SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Setting the CREN bit of the RCSTA register enables the
receiver circuitry of the EUSART. Clearing the SYNC bit
of the TXSTA register configures the EUSART for
asynchronous operation. Setting the SPEN bit of the
RCSTA register enables the EUSART. The programmer
must set the corresponding TRIS bit to configure the
RX/DT I/O pin as an input.
Note:
If the RX/DT function is on an analog pin,
the corresponding ANSEL bit must be
cleared for the receiver to function.
31.1.2.2
Receiving Data
The receiver data recovery circuit initiates character
reception on the falling edge of the first bit. The first bit,
also known as the Start bit, is always a zero. The data
recovery circuit counts one-half bit time to the center of
the Start bit and verifies that the bit is still a zero. If it is
not a zero then the data recovery circuit aborts
character reception, without generating an error, and
resumes looking for the falling edge of the Start bit. If
the Start bit zero verification succeeds then the data
recovery circuit counts a full bit time to the center of the
next bit. The bit is then sampled by a majority detect
circuit and the resulting ‘0’ or ‘1’ is shifted into the RSR.
This repeats until all data bits have been sampled and
shifted into the RSR. One final bit time is measured and
the level sampled. This is the Stop bit, which is always
a ‘1’. If the data recovery circuit samples a ‘0’ in the
Stop bit position then a framing error is set for this
character, otherwise the framing error is cleared for this
character. See Section 31.1.2.4 “Receive Framing
Error” for more information on framing errors.
Immediately after all data bits and the Stop bit have
been received, the character in the RSR is transferred
to the EUSART receive FIFO and the RCIF interrupt
flag bit of the PIR1 register is set. The top character in
the FIFO is transferred out of the FIFO by reading the
RCREG register.
Note:
31.1.2.3
If the receive FIFO is overrun, no additional
characters will be received until the overrun
condition is cleared. See Section 31.1.2.5
“Receive Overrun Error” for more
information on overrun errors.
Receive Interrupts
The RCIF interrupt flag bit of the PIR1 register is set
whenever the EUSART receiver is enabled and there is
an unread character in the receive FIFO. The RCIF
interrupt flag bit is read-only, it cannot be set or cleared
by software.
RCIF interrupts are enabled by setting all of the
following bits:
• RCIE, Interrupt Enable bit of the PIE1 register
• PEIE, Peripheral Interrupt Enable bit of the
INTCON register
• GIE, Global Interrupt Enable bit of the INTCON
register
The RCIF interrupt flag bit will be set when there is an
unread character in the FIFO, regardless of the state of
interrupt enable bits.
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31.1.2.4
Receive Framing Error
Each character in the receive FIFO buffer has a
corresponding framing error Status bit. A framing error
indicates that a Stop bit was not seen at the expected
time. The framing error status is accessed via the
FERR bit of the RCSTA register. The FERR bit
represents the status of the top unread character in the
receive FIFO. Therefore, the FERR bit must be read
before reading the RCREG.
The FERR bit is read-only and only applies to the top
unread character in the receive FIFO. A framing error
(FERR = 1) does not preclude reception of additional
characters. It is not necessary to clear the FERR bit.
Reading the next character from the FIFO buffer will
advance the FIFO to the next character and the next
corresponding framing error.
The FERR bit can be forced clear by clearing the SPEN
bit of the RCSTA register which resets the EUSART.
Clearing the CREN bit of the RCSTA register does not
affect the FERR bit. A framing error by itself does not
generate an interrupt.
Note:
31.1.2.5
31.1.2.7
Address Detection
A special Address Detection mode is available for use
when multiple receivers share the same transmission
line, such as in RS-485 systems. Address detection is
enabled by setting the ADDEN bit of the RCSTA
register.
Address detection requires 9-bit character reception.
When address detection is enabled, only characters
with the ninth data bit set will be transferred to the
receive FIFO buffer, thereby setting the RCIF interrupt
bit. All other characters will be ignored.
Upon receiving an address character, user software
determines if the address matches its own. Upon
address match, user software must disable address
detection by clearing the ADDEN bit before the next
Stop bit occurs. When user software detects the end of
the message, determined by the message protocol
used, software places the receiver back into the
Address Detection mode by setting the ADDEN bit.
If all receive characters in the receive
FIFO have framing errors, repeated reads
of the RCREG will not clear the FERR bit.
Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be generated if a third character, in its
entirety, is received before the FIFO is accessed. When
this happens the OERR bit of the RCSTA register is set.
The characters already in the FIFO buffer can be read
but no additional characters will be received until the
error is cleared. The error must be cleared by either
clearing the CREN bit of the RCSTA register or by
resetting the EUSART by clearing the SPEN bit of the
RCSTA register.
31.1.2.6
Receiving 9-Bit Characters
The EUSART supports 9-bit character reception. When
the RX9 bit of the RCSTA register is set the EUSART
will shift nine bits into the RSR for each character
received. The RX9D bit of the RCSTA register is the
ninth and Most Significant data bit of the top unread
character in the receive FIFO. When reading 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read before reading the eight Least Significant bits
from the RCREG.
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31.1.2.8
Asynchronous Reception Setup:
31.1.2.9
1.
Initialize the SPBRGH, SPBRGL register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 31.4 “EUSART
Baud Rate Generator (BRG)”).
2. Clear the ANSEL bit for the RX pin (if applicable).
3. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
4. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
5. If 9-bit reception is desired, set the RX9 bit.
6. Enable reception by setting the CREN bit.
7. The RCIF interrupt flag bit will be set when a
character is transferred from the RSR to the
receive buffer. An interrupt will be generated if
the RCIE interrupt enable bit was also set.
8. Read the RCSTA register to get the error flags
and, if 9-bit data reception is enabled, the ninth
data bit.
9. Get the received eight Least Significant data bits
from the receive buffer by reading the RCREG
register.
10. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
FIGURE 31-5:
Rcv Shift
Reg
Rcv Buffer Reg.
RCIDL
This mode would typically be used in RS-485 systems.
To set up an Asynchronous Reception with Address
Detect Enable:
1.
Initialize the SPBRGH, SPBRGL register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 31.4 “EUSART
Baud Rate Generator (BRG)”).
2. Clear the ANSEL bit for the RX pin (if applicable).
3. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
4. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
5. Enable 9-bit reception by setting the RX9 bit.
6. Enable address detection by setting the ADDEN
bit.
7. Enable reception by setting the CREN bit.
8. The RCIF interrupt flag bit will be set when a
character with the ninth bit set is transferred
from the RSR to the receive buffer. An interrupt
will be generated if the RCIE interrupt enable bit
was also set.
9. Read the RCSTA register to get the error flags.
The ninth data bit will always be set.
10. Get the received eight Least Significant data bits
from the receive buffer by reading the RCREG
register. Software determines if this is the
device’s address.
11. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
12. If the device has been addressed, clear the
ADDEN bit to allow all received data into the
receive buffer and generate interrupts.
ASYNCHRONOUS RECEPTION
Start
bit
bit 0
RX/DT pin
9-bit Address Detection Mode Setup
bit 1
bit 7/8 Stop
bit
Start
bit
Word 1
RCREG
bit 0
bit 7/8 Stop
bit
Start
bit
bit 7/8
Stop
bit
Word 2
RCREG
Read Rcv
Buffer Reg.
RCREG
RCIF
(Interrupt Flag)
OERR bit
CREN
Note:
This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word,
causing the OERR (overrun) bit to be set.
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TABLE 31-2:
Name
ANSELB
ANSELC
BAUD1CON
INTCON
SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
ABDOVF
RCIDL
—
SCKP
BRG16
—
WUE
ABDEN
349
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
PIE1
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
PIR1
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
RC1REG
EUSART Receive Data Register
RC1STA
SPEN
RX9
SREN
RXPPS
—
—
—
CREN
ADDEN
FERR
OERR
RX9D
RXPPS<4:0>
SP1BRGL
BRG<7:0>
SP1BRGH
BRG<15:8>
87
342*
348
136
350
350
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
CSRC
TX9
TXEN
SYNC
SENDB
BRGH
TRMT
TX9D
347
TX1STA
Legend:
*
— = unimplemented location, read as ‘0’. Shaded cells are not used for asynchronous reception.
Page provides register information.
 2013-2016 Microchip Technology Inc.
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31.2
Clock Accuracy with
Asynchronous Operation
The factory calibrates the internal oscillator block
output (INTOSC). However, the INTOSC frequency
may drift as VDD or temperature changes, and this
directly affects the asynchronous baud rate. Two
methods may be used to adjust the baud rate clock, but
both require a reference clock source of some kind.
The first (preferred) method uses the OSCTUNE
register to adjust the INTOSC output. Adjusting the
value in the OSCTUNE register allows for fine resolution
changes to the system clock source. See
Section 6.2.2.3 “Internal Oscillator Frequency
Adjustment” for more information.
The other method adjusts the value in the Baud Rate
Generator. This can be done automatically with the
Auto-Baud Detect feature (see Section 31.4.1
“Auto-Baud Detect”). There may not be fine enough
resolution when adjusting the Baud Rate Generator to
compensate for a gradual change in the peripheral
clock frequency.
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31.3
Register Definitions: EUSART Control
REGISTER 31-1:
R/W-/0
TX1STA: TRANSMIT STATUS AND CONTROL REGISTER
R/W-0/0
CSRC
TX9
R/W-0/0
TXEN
(1)
R/W-0/0
R/W-0/0
R/W-0/0
R-1/1
R/W-0/0
SYNC
SENDB
BRGH
TRMT
TX9D
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
CSRC: Clock Source Select bit
Asynchronous mode:
Don’t care
Synchronous mode:
1 = Master mode (clock generated internally from BRG)
0 = Slave mode (clock from external source)
bit 6
TX9: 9-bit Transmit Enable bit
1 = Selects 9-bit transmission
0 = Selects 8-bit transmission
bit 5
TXEN: Transmit Enable bit(1)
1 = Transmit enabled
0 = Transmit disabled
bit 4
SYNC: EUSART Mode Select bit
1 = Synchronous mode
0 = Asynchronous mode
bit 3
SENDB: Send Break Character bit
Asynchronous mode:
1 = Send Sync Break on next transmission (cleared by hardware upon completion)
0 = Sync Break transmission completed
Synchronous mode:
Don’t care
bit 2
BRGH: High Baud Rate Select bit
Asynchronous mode:
1 = High speed
0 = Low speed
Synchronous mode:
Unused in this mode
bit 1
TRMT: Transmit Shift Register Status bit
1 = TSR empty
0 = TSR full
bit 0
TX9D: Ninth bit of Transmit Data
Can be address/data bit or a parity bit.
Note 1:
SREN/CREN overrides TXEN in Sync mode.
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REGISTER 31-2:
RC1STA: RECEIVE STATUS AND CONTROL REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R-0/0
R-0/0
R-0/0
SPEN
RX9
SREN
CREN
ADDEN
FERR
OERR
RX9D
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
SPEN: Serial Port Enable bit
1 = Serial port enabled
0 = Serial port disabled (held in Reset)
bit 6
RX9: 9-Bit Receive Enable bit
1 = Selects 9-bit reception
0 = Selects 8-bit reception
bit 5
SREN: Single Receive Enable bit
Asynchronous mode:
Don’t care
Synchronous mode – Master:
1 = Enables single receive
0 = Disables single receive
This bit is cleared after reception is complete.
Synchronous mode – Slave
Don’t care
bit 4
CREN: Continuous Receive Enable bit
Asynchronous mode:
1 = Enables receiver
0 = Disables receiver
Synchronous mode:
1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)
0 = Disables continuous receive
bit 3
ADDEN: Address Detect Enable bit
Asynchronous mode 9-bit (RX9 = 1):
1 = Enables address detection, enable interrupt and load the receive buffer when RSR<8> is set
0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit
Asynchronous mode 8-bit (RX9 = 0):
Don’t care
bit 2
FERR: Framing Error bit
1 = Framing error (can be updated by reading RCREG register and receive next valid byte)
0 = No framing error
bit 1
OERR: Overrun Error bit
1 = Overrun error (can be cleared by clearing bit CREN)
0 = No overrun error
bit 0
RX9D: Ninth bit of Received Data
This can be address/data bit or a parity bit and must be calculated by user firmware.
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REGISTER 31-3:
BAUD1CON: BAUD RATE CONTROL REGISTER
R-0/0
R-1/1
U-0
R/W-0/0
R/W-0/0
U-0
R/W-0/0
R/W-0/0
ABDOVF
RCIDL
—
SCKP
BRG16
—
WUE
ABDEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
ABDOVF: Auto-Baud Detect Overflow bit
Asynchronous mode:
1 = Auto-baud timer overflowed
0 = Auto-baud timer did not overflow
Synchronous mode:
Don’t care
bit 6
RCIDL: Receive Idle Flag bit
Asynchronous mode:
1 = Receiver is Idle
0 = Start bit has been received and the receiver is receiving
Synchronous mode:
Don’t care
bit 5
Unimplemented: Read as ‘0’
bit 4
SCKP: Synchronous Clock Polarity Select bit
Asynchronous mode:
1 = Transmit inverted data to the TX/CK pin
0 = Transmit non-inverted data to the TX/CK pin
Synchronous mode:
1 = Data is clocked on rising edge of the clock
0 = Data is clocked on falling edge of the clock
bit 3
BRG16: 16-bit Baud Rate Generator bit
1 = 16-bit Baud Rate Generator is used
0 = 8-bit Baud Rate Generator is used
bit 2
Unimplemented: Read as ‘0’
bit 1
WUE: Wake-up Enable bit
Asynchronous mode:
1 = Receiver is waiting for a falling edge. No character will be received, byte RCIF will be set. WUE
will automatically clear after RCIF is set.
0 = Receiver is operating normally
Synchronous mode:
Don’t care
bit 0
ABDEN: Auto-Baud Detect Enable bit
Asynchronous mode:
1 = Auto-Baud Detect mode is enabled (clears when auto-baud is complete)
0 = Auto-Baud Detect mode is disabled
Synchronous mode:
Don’t care
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31.4
EUSART Baud Rate Generator
(BRG)
The Baud Rate Generator (BRG) is an 8-bit or 16-bit
timer that is dedicated to the support of both the
asynchronous and synchronous EUSART operation.
By default, the BRG operates in 8-bit mode. Setting the
BRG16 bit of the BAUDCON register selects 16-bit
mode.
The SPBRGH, SPBRGL register pair determines the
period of the free running baud rate timer. In
Asynchronous mode the multiplier of the baud rate
period is determined by both the BRGH bit of the TXSTA
register and the BRG16 bit of the BAUDCON register. In
Synchronous mode, the BRGH bit is ignored.
Table 31-3 contains the formulas for determining the
baud rate. Example 31-1 provides a sample calculation
for determining the baud rate and baud rate error.
Typical baud rates and error values for various
asynchronous modes have been computed for your
convenience and are shown in Table 31-5. It may be
advantageous to use the high baud rate (BRGH = 1),
or the 16-bit BRG (BRG16 = 1) to reduce the baud rate
error. The 16-bit BRG mode is used to achieve slow
baud rates for fast oscillator frequencies.
EXAMPLE 31-1:
CALCULATING BAUD
RATE ERROR
For a device with FOSC of 16 MHz, desired baud rate
of 9600, Asynchronous mode, 8-bit BRG:
F OS C
Desired Baud Rate = -----------------------------------------------------------------------64  [SPBRGH:SPBRGL] + 1 
Solving for SPBRGH:SPBRGL:
FOSC
--------------------------------------------Desired Baud Rate
X = --------------------------------------------- – 1
64
16000000
-----------------------9600
= ------------------------ – 1
64
=  25.042  = 25
16000000
Calculated Baud Rate = --------------------------64  25 + 1 
= 9615
Calc. Baud Rate – Desired Baud Rate
Error = -------------------------------------------------------------------------------------------Desired Baud Rate
 9615 – 9600 
= ---------------------------------- = 0.16%
9600
Writing a new value to the SPBRGH, SPBRGL register
pair causes the BRG timer to be reset (or cleared). This
ensures that the BRG does not wait for a timer overflow
before outputting the new baud rate.
If the system clock is changed during an active receive
operation, a receive error or data loss may result. To
avoid this problem, check the status of the RCIDL bit to
make sure that the receive operation is idle before
changing the system clock.
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TABLE 31-3:
BAUD RATE FORMULAS
Configuration Bits
BRG/EUSART Mode
Baud Rate Formula
0
8-bit/Asynchronous
FOSC/[64 (n+1)]
0
1
8-bit/Asynchronous
0
1
0
16-bit/Asynchronous
0
1
1
16-bit/Asynchronous
1
0
x
8-bit/Synchronous
1
x
16-bit/Synchronous
SYNC
BRG16
BRGH
0
0
0
1
Legend:
FOSC/[4 (n+1)]
x = Don’t care, n = value of SPBRGH, SPBRGL register pair.
TABLE 31-4:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR
Bit 7
BAUD1CON ABDOVF
RC1STA
SPEN
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
RCIDL
—
SCKP
BRG16
—
WUE
ABDEN
349
RX9
SREN
CREN
ADDEN
FERR
OERR
RX9D
348
SP1BRGL
SP1BRG<7:0>
SP1BRGH
TX1STA
FOSC/[16 (n+1)]
350
SP1BRG<15:8>
CSRC
TX9
TXEN
SYNC
SENDB
350
BRGH
TRMT
TX9D
347
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for the Baud Rate Generator.
* Page provides register information.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 351
PIC16(L)F1713/6
TABLE 31-5:
BAUD RATES FOR ASYNCHRONOUS MODES
SYNC = 0, BRGH = 0, BRG16 = 0
BAUD
RATE
FOSC = 32.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 20.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 18.432 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
300
—
—
—
—
—
—
—
—
—
—
—
—
1200
—
—
—
1221
1.73
255
1200
0.00
239
1200
0.00
143
2400
2404
0.16
207
2404
0.16
129
2400
0.00
119
2400
0.00
71
9600
9615
0.16
51
9470
-1.36
32
9600
0.00
29
9600
0.00
17
10417
10417
0.00
47
10417
0.00
29
10286
-1.26
27
10165
-2.42
16
19.2k
19.23k
0.16
25
19.53k
1.73
15
19.20k
0.00
14
19.20k
0.00
8
57.6k
55.55k
-3.55
3
—
—
—
57.60k
0.00
7
57.60k
0.00
2
115.2k
—
—
—
—
—
—
—
—
—
—
—
—
SYNC = 0, BRGH = 0, BRG16 = 0
BAUD
RATE
FOSC = 8.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 4.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 3.6864 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
300
—
—
—
300
0.16
207
300
0.00
191
300
0.16
51
1200
1202
0.16
103
1202
0.16
51
1200
0.00
47
1202
0.16
12
2400
2404
0.16
51
2404
0.16
25
2400
0.00
23
—
—
—
9600
9615
0.16
12
—
—
—
9600
0.00
5
—
—
—
10417
10417
0.00
11
10417
0.00
5
—
—
—
—
—
—
19.2k
—
—
—
—
—
—
19.20k
0.00
2
—
—
—
57.6k
—
—
—
—
—
—
57.60k
0.00
0
—
—
—
115.2k
—
—
—
—
—
—
—
—
—
—
—
—
SYNC = 0, BRGH = 1, BRG16 = 0
BAUD
RATE
FOSC = 32.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 20.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 18.432 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
300
—
—
—
—
—
—
—
—
—
—
—
—
1200
—
—
—
—
—
—
—
—
—
—
—
—
2400
—
—
—
—
—
—
—
—
—
—
—
—
9600
9615
0.16
207
9615
0.16
129
9600
0.00
119
9600
0.00
71
10417
10417
0.00
191
10417
0.00
119
10378
-0.37
110
10473
0.53
65
19.2k
19.23k
0.16
103
19.23k
0.16
64
19.20k
0.00
59
19.20k
0.00
35
57.6k
57.14k
-0.79
34
56.82k
-1.36
21
57.60k
0.00
19
57.60k
0.00
11
115.2k
117.64k
2.12
16
113.64k
-1.36
10
115.2k
0.00
9
115.2k
0.00
5
DS40001726C-page 352
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 31-5:
BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
SYNC = 0, BRGH = 1, BRG16 = 0
BAUD
RATE
FOSC = 8.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 4.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
FOSC = 3.6864 MHz
Actual
Rate
FOSC = 1.000 MHz
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300
1200
—
—
—
—
—
—
—
1202
—
0.16
—
207
—
1200
—
0.00
—
191
300
1202
0.16
0.16
207
51
2400
2404
0.16
207
2404
0.16
103
2400
0.00
95
2404
0.16
25
—
9600
9615
0.16
51
9615
0.16
25
9600
0.00
23
—
—
10417
10417
0.00
47
10417
0.00
23
10473
0.53
21
10417
0.00
5
19.2k
19231
0.16
25
19.23k
0.16
12
19.2k
0.00
11
—
—
—
57.6k
55556
-3.55
8
—
—
—
57.60k
0.00
3
—
—
—
115.2k
—
—
—
—
—
—
115.2k
0.00
1
—
—
—
SYNC = 0, BRGH = 0, BRG16 = 1
BAUD
RATE
FOSC = 32.000 MHz
Actual
Rate
FOSC = 20.000 MHz
%
Error
SPBRG
value
(decimal)
Actual
Rate
FOSC = 18.432 MHz
%
Error
SPBRG
value
(decimal)
Actual
Rate
FOSC = 11.0592 MHz
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300
300.0
0.00
6666
300.0
-0.01
4166
300.0
0.00
3839
300.0
0.00
2303
1200
1200
-0.02
3332
1200
-0.03
1041
1200
0.00
959
1200
0.00
575
2400
2401
-0.04
832
2399
-0.03
520
2400
0.00
479
2400
0.00
287
9600
9615
0.16
207
9615
0.16
129
9600
0.00
119
9600
0.00
71
10417
10417
0.00
191
10417
0.00
119
10378
-0.37
110
10473
0.53
65
19.2k
19.23k
0.16
103
19.23k
0.16
64
19.20k
0.00
59
19.20k
0.00
35
57.6k
57.14k
-0.79
34
56.818
-1.36
21
57.60k
0.00
19
57.60k
0.00
11
115.2k
117.6k
2.12
16
113.636
-1.36
10
115.2k
0.00
9
115.2k
0.00
5
SYNC = 0, BRGH = 0, BRG16 = 1
BAUD
RATE
FOSC = 8.000 MHz
Actual
Rate
FOSC = 4.000 MHz
%
Error
SPBRG
value
(decimal)
Actual
Rate
FOSC = 3.6864 MHz
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
FOSC = 1.000 MHz
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300
299.9
-0.02
1666
300.1
0.04
832
300.0
0.00
767
300.5
0.16
207
1200
1199
-0.08
416
1202
0.16
207
1200
0.00
191
1202
0.16
51
2400
2404
0.16
207
2404
0.16
103
2400
0.00
95
2404
0.16
25
9600
9615
0.16
51
9615
0.16
25
9600
0.00
23
—
—
—
10417
10417
0.00
47
10417
0.00
23
10473
0.53
21
10417
0.00
5
19.2k
19.23k
0.16
25
19.23k
0.16
12
19.20k
0.00
11
—
—
—
57.6k
55556
-3.55
8
—
—
—
57.60k
0.00
3
—
—
—
115.2k
—
—
—
—
—
—
115.2k
0.00
1
—
—
—
 2013-2016 Microchip Technology Inc.
DS40001726C-page 353
PIC16(L)F1713/6
TABLE 31-5:
BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
BAUD
RATE
FOSC = 32.000 MHz
FOSC = 20.000 MHz
FOSC = 18.432 MHz
FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
300
1200
300.0
1200
0.00
0.00
26666
6666
300.0
1200
0.00
-0.01
16665
4166
300.0
1200
0.00
0.00
15359
3839
300.0
1200
0.00
0.00
9215
2303
2400
2400
0.01
3332
2400
0.02
2082
2400
0.00
1919
2400
0.00
1151
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
9600
9604
0.04
832
9597
-0.03
520
9600
0.00
479
9600
0.00
287
10417
10417
0.00
767
10417
0.00
479
10425
0.08
441
10433
0.16
264
19.2k
19.18k
-0.08
416
19.23k
0.16
259
19.20k
0.00
239
19.20k
0.00
143
57.6k
57.55k
-0.08
138
57.47k
-0.22
86
57.60k
0.00
79
57.60k
0.00
47
115.2k
115.9k
0.64
68
116.3k
0.94
42
115.2k
0.00
39
115.2k
0.00
23
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
BAUD
RATE
FOSC = 8.000 MHz
Actual
Rate
FOSC = 4.000 MHz
%
Error
SPBRG
value
(decimal)
Actual
Rate
FOSC = 3.6864 MHz
%
Error
SPBRG
value
(decimal)
Actual
Rate
FOSC = 1.000 MHz
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300
300.0
0.00
6666
300.0
0.01
3332
300.0
0.00
3071
300.1
0.04
832
1200
1200
-0.02
1666
1200
0.04
832
1200
0.00
767
1202
0.16
207
2400
2401
0.04
832
2398
0.08
416
2400
0.00
383
2404
0.16
103
9600
9615
0.16
207
9615
0.16
103
9600
0.00
95
9615
0.16
25
10417
10417
0
191
10417
0.00
95
10473
0.53
87
10417
0.00
23
19.2k
19.23k
0.16
103
19.23k
0.16
51
19.20k
0.00
47
19.23k
0.16
12
57.6k
57.14k
-0.79
34
58.82k
2.12
16
57.60k
0.00
15
—
—
—
115.2k
117.6k
2.12
16
111.1k
-3.55
8
115.2k
0.00
7
—
—
—
DS40001726C-page 354
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
31.4.1
AUTO-BAUD DETECT
The EUSART module supports automatic detection
and calibration of the baud rate.
and SPBRGL registers are clocked at 1/8th the BRG
base clock rate. The resulting byte measurement is the
average bit time when clocked at full speed.
Note 1: If the WUE bit is set with the ABDEN bit,
auto-baud detection will occur on the byte
following the Break character (see
Section 31.4.3
“Auto-Wake-up
on
Break”).
In the Auto-Baud Detect (ABD) mode, the clock to the
BRG is reversed. Rather than the BRG clocking the
incoming RX signal, the RX signal is timing the BRG.
The Baud Rate Generator is used to time the period of
a received 55h (ASCII “U”) which is the Sync character
for the LIN bus. The unique feature of this character is
that it has five rising edges including the Stop bit edge.
Setting the ABDEN bit of the BAUDCON register starts
the auto-baud calibration sequence. While the ABD
sequence takes place, the EUSART state machine is
held in Idle. On the first rising edge of the receive line,
after the Start bit, the SPBRG begins counting up using
the BRG counter clock as shown in Figure 31-6. The
fifth rising edge will occur on the RX pin at the end of
the eighth bit period. At that time, an accumulated
value totaling the proper BRG period is left in the
SPBRGH, SPBRGL register pair, the ABDEN bit is
automatically cleared and the RCIF interrupt flag is set.
The value in the RCREG needs to be read to clear the
RCIF interrupt. RCREG content should be discarded.
When calibrating for modes that do not use the
SPBRGH register the user can verify that the SPBRGL
register did not overflow by checking for 00h in the
SPBRGH register.
2: It is up to the user to determine that the
incoming character baud rate is within the
range of the selected BRG clock source.
Some combinations of oscillator frequency
and EUSART baud rates are not possible.
3: During the auto-baud process, the
auto-baud counter starts counting at one.
Upon completion of the auto-baud
sequence, to achieve maximum accuracy,
subtract 1 from the SPBRGH:SPBRGL
register pair.
TABLE 31-6:
The BRG auto-baud clock is determined by the BRG16
and BRGH bits as shown in Table 31-6. During ABD,
both the SPBRGH and SPBRGL registers are used as
a 16-bit counter, independent of the BRG16 bit setting.
While calibrating the baud rate period, the SPBRGH
FIGURE 31-6:
BRG16
BRGH
BRG Base
Clock
BRG ABD
Clock
0
0
FOSC/64
FOSC/512
0
1
FOSC/16
FOSC/128
1
0
FOSC/16
FOSC/128
1
1
FOSC/4
FOSC/32
Note:
During the ABD sequence, SPBRGL and
SPBRGH registers are both used as a 16-bit
counter, independent of the BRG16 setting.
AUTOMATIC BAUD RATE CALIBRATION
XXXXh
BRG Value
BRG COUNTER CLOCK RATES
0000h
RX pin
001Ch
Start
Edge #1
bit 1
bit 0
Edge #2
bit 3
bit 2
Edge #3
bit 5
bit 4
Edge #4
bit 7
bit 6
Edge #5
Stop bit
BRG Clock
Auto Cleared
Set by User
ABDEN bit
RCIDL
RCIF bit
(Interrupt)
Read
RCREG
SPBRGL
XXh
1Ch
SPBRGH
XXh
00h
Note 1:
The ABD sequence requires the EUSART module to be configured in Asynchronous mode.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 355
PIC16(L)F1713/6
31.4.2
AUTO-BAUD OVERFLOW
During the course of automatic baud detection, the
ABDOVF bit of the BAUDxCON register will be set if
the baud rate counter overflows before the fifth rising
edge is detected on the RX pin. The ABDOVF bit indicates that the counter has exceeded the maximum
count that can fit in the 16 bits of the
SPxBRGH:SPxBRGL register pair. The overflow condition will set the RCIF flag. The counter continues to
count until the fifth rising edge is detected on the RX
pin. The RCIDL bit will remain false (‘0’) until the fifth
rising edge, at which time, the RCIDL bit will be set. If
the RCREG is read after the overflow occurs but,
before the fifth rising edge, the fifth rising edge will set
the RCIF again.
Terminating the auto-baud process early to clear an
overflow condition will prevent proper detection of the
sync character’s fifth rising edge. If any falling edges of
the sync character have not yet occurred when the
ABDEN bit is cleared, then those will be falsely
detected as Start bits. The following steps are recommended to clear the overflow condition:
31.4.3.1
Special Considerations
Break Character
To avoid character errors or character fragments during
a wake-up event, the wake-up character must be all
zeros.
When the wake-up is enabled the function works
independent of the low time on the data stream. If the
WUE bit is set and a valid non-zero character is
received, the low time from the Start bit to the first rising
edge will be interpreted as the wake-up event. The
remaining bits in the character will be received as a
fragmented character and subsequent characters can
result in framing or overrun errors.
Therefore, the initial character in the transmission must
be all ‘0’s. This must be ten or more bit times, 13-bit
times recommended for LIN bus, or any number of bit
times for standard RS-232 devices.
Oscillator Start-up Time
3. Clear the ABDOVF bit.
Oscillator start-up time must be considered, especially
in applications using oscillators with longer start-up
intervals (i.e., LP, XT or HS/PLL mode). The Sync
Break (or wake-up signal) character must be of
sufficient length, and be followed by a sufficient
interval, to allow enough time for the selected oscillator
to start and provide proper initialization of the EUSART.
31.4.3
WUE Bit
1. Read RCREG to clear RCIF.
2. If RCIDL is zero then wait for RCIF and repeat step 1.
AUTO-WAKE-UP ON BREAK
During Sleep mode, all clocks to the EUSART are
suspended. Because of this, the Baud Rate Generator
is inactive and a proper character reception cannot be
performed. The Auto-Wake-up feature allows the
controller to wake-up due to activity on the RX/DT line.
This feature is available only in Asynchronous mode.
The Auto-Wake-up feature is enabled by setting the
WUE bit of the BAUDCON register. Once set, the normal
receive sequence on RX/DT is disabled, and the
EUSART remains in an Idle state, monitoring for a
wake-up event independent of the CPU mode. A
wake-up event consists of a high-to-low transition on the
RX/DT line. (This coincides with the start of a Sync Break
or a wake-up signal character for the LIN protocol.)
The wake-up event causes a receive interrupt by
setting the RCIF bit. The WUE bit is cleared in
hardware by a rising edge on RX/DT. The interrupt
condition is then cleared in software by reading the
RCREG register and discarding its contents.
To ensure that no actual data is lost, check the RCIDL
bit to verify that a receive operation is not in process
before setting the WUE bit. If a receive operation is not
occurring, the WUE bit may then be set just prior to
entering the Sleep mode.
The EUSART module generates an RCIF interrupt
coincident with the wake-up event. The interrupt is
generated synchronously to the Q clocks in normal CPU
operating modes (Figure 31-7), and asynchronously if
the device is in Sleep mode (Figure 31-8). The interrupt
condition is cleared by reading the RCREG register.
The WUE bit is automatically cleared by the low-to-high
transition on the RX line at the end of the Break. This
signals to the user that the Break event is over. At this
point, the EUSART module is in Idle mode waiting to
receive the next character.
DS40001726C-page 356
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 31-7:
AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
Auto Cleared
Bit set by user
WUE bit
RX/DT Line
RCIF
Note 1:
Cleared due to User Read of RCREG
The EUSART remains in Idle while the WUE bit is set.
FIGURE 31-8:
AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP
Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4
Q1
Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4
OSC1
Auto Cleared
Bit Set by User
WUE bit
RX/DT Line
Note 1
RCIF
Sleep Command Executed
Note 1:
2:
Sleep Ends
Cleared due to User Read of RCREG
If the wake-up event requires long oscillator warm-up time, the automatic clearing of the WUE bit can occur while the stposc signal is
still active. This sequence should not depend on the presence of Q clocks.
The EUSART remains in Idle while the WUE bit is set.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 357
PIC16(L)F1713/6
31.4.4
BREAK CHARACTER SEQUENCE
The EUSART module has the capability of sending the
special Break character sequences that are required by
the LIN bus standard. A Break character consists of a
Start bit, followed by 12 ‘0’ bits and a Stop bit.
To send a Break character, set the SENDB and TXEN
bits of the TXSTA register. The Break character transmission is then initiated by a write to the TXREG. The
value of data written to TXREG will be ignored and all
‘0’s will be transmitted.
The SENDB bit is automatically reset by hardware after
the corresponding Stop bit is sent. This allows the user
to preload the transmit FIFO with the next transmit byte
following the Break character (typically, the Sync
character in the LIN specification).
The TRMT bit of the TXSTA register indicates when the
transmit operation is active or idle, just as it does during
normal transmission. See Figure 31-9 for the timing of
the Break character sequence.
31.4.4.1
Break and Sync Transmit Sequence
The following sequence will start a message frame
header made up of a Break, followed by an auto-baud
Sync byte. This sequence is typical of a LIN bus
master.
1.
2.
3.
4.
5.
31.4.5
RECEIVING A BREAK CHARACTER
The Enhanced EUSART module can receive a Break
character in two ways.
The first method to detect a Break character uses the
FERR bit of the RCSTA register and the received data
as indicated by RCREG. The Baud Rate Generator is
assumed to have been initialized to the expected baud
rate.
A Break character has been received when;
• RCIF bit is set
• FERR bit is set
• RCREG = 00h
The second method uses the Auto-Wake-up feature
described in Section 31.4.3 “Auto-Wake-up on
Break”. By enabling this feature, the EUSART will
sample the next two transitions on RX/DT, cause an
RCIF interrupt, and receive the next data byte followed
by another interrupt.
Note that following a Break character, the user will
typically want to enable the Auto-Baud Detect feature.
For both methods, the user can set the ABDEN bit of
the BAUDCON register before placing the EUSART in
Sleep mode.
Configure the EUSART for the desired mode.
Set the TXEN and SENDB bits to enable the
Break sequence.
Load the TXREG with a dummy character to
initiate transmission (the value is ignored).
Write ‘55h’ to TXREG to load the Sync character
into the transmit FIFO buffer.
After the Break has been sent, the SENDB bit is
reset by hardware and the Sync character is
then transmitted.
When the TXREG becomes empty, as indicated by the
TXIF, the next data byte can be written to TXREG.
FIGURE 31-9:
Write to TXREG
SEND BREAK CHARACTER SEQUENCE
Dummy Write
BRG Output
(Shift Clock)
TX (pin)
Start bit
bit 0
bit 1
bit 11
Stop bit
Break
TXIF bit
(Transmit
Interrupt Flag)
TRMT bit
(Transmit Shift
Empty Flag)
SENDB
(send Break
control bit)
DS40001726C-page 358
SENDB Sampled Here
Auto Cleared
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
31.5
EUSART Synchronous Mode
Synchronous serial communications are typically used
in systems with a single master and one or more
slaves. The master device contains the necessary
circuitry for baud rate generation and supplies the clock
for all devices in the system. Slave devices can take
advantage of the master clock by eliminating the
internal clock generation circuitry.
There are two signal lines in Synchronous mode: a
bidirectional data line and a clock line. Slaves use the
external clock supplied by the master to shift the serial
data into and out of their respective receive and transmit shift registers. Since the data line is bidirectional,
synchronous operation is half-duplex only. Half-duplex
refers to the fact that master and slave devices can
receive and transmit data but not both simultaneously.
The EUSART can operate as either a master or slave
device.
Start and Stop bits are not used in synchronous
transmissions.
31.5.1
SYNCHRONOUS MASTER MODE
The following bits are used to configure the EUSART
for synchronous master operation:
•
•
•
•
•
SYNC = 1
CSRC = 1
SREN = 0 (for transmit); SREN = 1 (for receive)
CREN = 0 (for transmit); CREN = 1 (for receive)
SPEN = 1
Setting the SYNC bit of the TXSTA register configures
the device for synchronous operation. Setting the CSRC
bit of the TXSTA register configures the device as a
master. Clearing the SREN and CREN bits of the RCSTA
register ensures that the device is in the Transmit mode,
otherwise the device will be configured to receive. Setting
the SPEN bit of the RCSTA register enables the
EUSART.
31.5.1.1
Master Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device configured as a master transmits the clock on the TX/CK line.
The TX/CK pin output driver is automatically enabled
when the EUSART is configured for synchronous
transmit or receive operation. Serial data bits change
on the leading edge to ensure they are valid at the
trailing edge of each clock. One clock cycle is generated for each data bit. Only as many clock cycles are
generated as there are data bits.
 2013-2016 Microchip Technology Inc.
31.5.1.2
Clock Polarity
A clock polarity option is provided for Microwire
compatibility. Clock polarity is selected with the SCKP
bit of the BAUDCON register. Setting the SCKP bit sets
the clock Idle state as high. When the SCKP bit is set,
the data changes on the falling edge of each clock.
Clearing the SCKP bit sets the Idle state as low. When
the SCKP bit is cleared, the data changes on the rising
edge of each clock.
31.5.1.3
Synchronous Master Transmission
Data is transferred out of the device on the RX/DT pin.
The RX/DT and TX/CK pin output drivers are automatically enabled when the EUSART is configured for
synchronous master transmit operation.
A transmission is initiated by writing a character to the
TXREG register. If the TSR still contains all or part of a
previous character the new character data is held in the
TXREG until the last bit of the previous character has
been transmitted. If this is the first character, or the
previous character has been completely flushed from
the TSR, the data in the TXREG is immediately transferred to the TSR. The transmission of the character
commences immediately following the transfer of the
data to the TSR from the TXREG.
Each data bit changes on the leading edge of the
master clock and remains valid until the subsequent
leading clock edge.
Note:
The TSR register is not mapped in data
memory, so it is not available to the user.
31.5.1.4
Synchronous Master Transmission
Setup:
1.
2.
3.
4.
5.
6.
7.
8.
Initialize the SPBRGH, SPBRGL register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 31.4 “EUSART
Baud Rate Generator (BRG)”).
Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
Disable Receive mode by clearing bits SREN
and CREN.
Enable Transmit mode by setting the TXEN bit.
If 9-bit transmission is desired, set the TX9 bit.
If interrupts are desired, set the TXIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
If 9-bit transmission is selected, the ninth bit
should be loaded in the TX9D bit.
Start transmission by loading data to the TXREG
register.
DS40001726C-page 359
PIC16(L)F1713/6
FIGURE 31-10:
SYNCHRONOUS TRANSMISSION
RX/DT
pin
bit 0
bit 1
Word 1
bit 2
bit 7
bit 0
bit 1
Word 2
bit 7
TX/CK pin
(SCKP = 0)
TX/CK pin
(SCKP = 1)
Write to
TXREG Reg
Write Word 1
Write Word 2
TXIF bit
(Interrupt Flag)
TRMT bit
TXEN bit
Note:
‘1’
‘1’
Sync Master mode, SPBRGL = 0, continuous transmission of two 8-bit words.
FIGURE 31-11:
SYNCHRONOUS TRANSMISSION (THROUGH TXEN)
RX/DT pin
bit 0
bit 1
bit 2
bit 6
bit 7
TX/CK pin
Write to
TXREG reg
TXIF bit
TRMT bit
TXEN bit
DS40001726C-page 360
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 31-7:
Name
ANSELB
ANSELC
BAUD1CON
INTCON
SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER
TRANSMISSION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
ABDOVF
RCIDL
—
SCKP
BRG16
—
WUE
ABDEN
349
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
PIE1
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
PIR1
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
87
RC1STA
SPEN
RX9
SREN
CREN
ADDEN
FERR
OERR
RX9D
348
RxyPPS
—
—
—
RxyPPS<4:0>
SP1BRGL
137
SP1BRG<7:0>
SP1BRGH
350
SP1BRG<15:8>
350
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
CSRC
TX9
TXEN
TRMT
TX9D
TX1REG
TX1STA
Legend:
*
EUSART Transmit Data Register
SYNC
SENDB
339*
BRGH
347
— = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous master transmission.
Page provides register information.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 361
PIC16(L)F1713/6
31.5.1.5
Synchronous Master Reception
Data is received at the RX/DT pin. The RX/DT pin
output driver is automatically disabled when the
EUSART is configured for synchronous master receive
operation.
In Synchronous mode, reception is enabled by setting
either the Single Receive Enable bit (SREN of the
RCSTA register) or the Continuous Receive Enable bit
(CREN of the RCSTA register).
When SREN is set and CREN is clear, only as many
clock cycles are generated as there are data bits in a
single character. The SREN bit is automatically cleared
at the completion of one character. When CREN is set,
clocks are continuously generated until CREN is
cleared. If CREN is cleared in the middle of a character
the CK clock stops immediately and the partial character is discarded. If SREN and CREN are both set, then
SREN is cleared at the completion of the first character
and CREN takes precedence.
To initiate reception, set either SREN or CREN. Data is
sampled at the RX/DT pin on the trailing edge of the
TX/CK clock pin and is shifted into the Receive Shift
Register (RSR). When a complete character is
received into the RSR, the RCIF bit is set and the character is automatically transferred to the two character
receive FIFO. The Least Significant eight bits of the top
character in the receive FIFO are available in RCREG.
The RCIF bit remains set as long as there are unread
characters in the receive FIFO.
Note:
31.5.1.6
If the RX/DT function is on an analog pin,
the corresponding ANSEL bit must be
cleared for the receiver to function.
Slave Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device configured
as a slave receives the clock on the TX/CK line. The
TX/CK pin output driver is automatically disabled when
the device is configured for synchronous slave transmit
or receive operation. Serial data bits change on the
leading edge to ensure they are valid at the trailing edge
of each clock. One data bit is transferred for each clock
cycle. Only as many clock cycles should be received as
there are data bits.
Note:
If the device is configured as a slave and
the TX/CK function is on an analog pin, the
corresponding ANSEL bit must be cleared.
DS40001726C-page 362
31.5.1.7
Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be generated if a third character, in its
entirety, is received before RCREG is read to access
the FIFO. When this happens the OERR bit of the
RCSTA register is set. Previous data in the FIFO will
not be overwritten. The two characters in the FIFO
buffer can be read, however, no additional characters
will be received until the error is cleared. The OERR bit
can only be cleared by clearing the overrun condition.
If the overrun error occurred when the SREN bit is set
and CREN is clear then the error is cleared by reading
RCREG. If the overrun occurred when the CREN bit is
set then the error condition is cleared by either clearing
the CREN bit of the RCSTA register or by clearing the
SPEN bit which resets the EUSART.
31.5.1.8
Receiving 9-bit Characters
The EUSART supports 9-bit character reception. When
the RX9 bit of the RCSTA register is set the EUSART
will shift nine bits into the RSR for each character
received. The RX9D bit of the RCSTA register is the
ninth, and Most Significant, data bit of the top unread
character in the receive FIFO. When reading 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read before reading the eight Least Significant bits
from the RCREG.
31.5.1.9
Synchronous Master Reception
Setup:
1.
Initialize the SPBRGH, SPBRGL register pair for
the appropriate baud rate. Set or clear the
BRGH and BRG16 bits, as required, to achieve
the desired baud rate.
2. Clear the ANSEL bit for the RX pin (if applicable).
3. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
4. Ensure bits CREN and SREN are clear.
5. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
6. If 9-bit reception is desired, set bit RX9.
7. Start reception by setting the SREN bit or for
continuous reception, set the CREN bit.
8. Interrupt flag bit RCIF will be set when reception
of a character is complete. An interrupt will be
generated if the enable bit RCIE was set.
9. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
10. Read the 8-bit received data by reading the
RCREG register.
11. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTA
register or by clearing the SPEN bit which resets
the EUSART.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 31-12:
SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
RX/DT
pin
bit 0
bit 1
bit 2
bit 3
bit 4
bit 5
bit 6
bit 7
TX/CK pin
(SCKP = 0)
TX/CK pin
(SCKP = 1)
Write to
bit SREN
SREN bit
CREN bit ‘0’
‘0’
RCIF bit
(Interrupt)
Read
RCREG
Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0.
Note:
TABLE 31-8:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER
RECEPTION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
ABDOVF
RCIDL
—
SCKP
BRG16
—
WUE
ABDEN
349
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
PIE1
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
PIR1
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
87
RC1STA
SPEN
RX9
SREN
OERR
RX9D
RXPPS
—
—
—
RXPPS<4:0>
136
RxyPPS
—
—
—
RxyPPS<4:0>
137
BAUD1CON
INTCON
RC1REG
EUSART Receive Data Register
CREN
ADDEN
342*
FERR
348
SP1BRGL
SP1BRG<7:0>
350*
SP1BRGH
SP1BRG<15:8>
350*
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
CSRC
TX9
TXEN
SYNC
SENDB
BRGH
TRMT
TX9D
347
TX1STA
Legend:
*
— = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous master reception.
Page provides register information.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 363
PIC16(L)F1713/6
31.5.2
SYNCHRONOUS SLAVE MODE
The following bits are used to configure the EUSART
for synchronous slave operation:
•
•
•
•
•
SYNC = 1
CSRC = 0
SREN = 0 (for transmit); SREN = 1 (for receive)
CREN = 0 (for transmit); CREN = 1 (for receive)
SPEN = 1
Setting the SYNC bit of the TXSTA register configures the
device for synchronous operation. Clearing the CSRC bit
of the TXSTA register configures the device as a slave.
Clearing the SREN and CREN bits of the RCSTA register
ensures that the device is in the Transmit mode,
otherwise the device will be configured to receive. Setting
the SPEN bit of the RCSTA register enables the
EUSART.
31.5.2.1
31.5.2.2
1.
2.
3.
4.
5.
6.
7.
8.
Synchronous Slave Transmission
Setup:
Set the SYNC and SPEN bits and clear the
CSRC bit.
Clear the ANSEL bit for the CK pin (if applicable).
Clear the CREN and SREN bits.
If interrupts are desired, set the TXIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
If 9-bit transmission is desired, set the TX9 bit.
Enable transmission by setting the TXEN bit.
If 9-bit transmission is selected, insert the Most
Significant bit into the TX9D bit.
Start transmission by writing the Least
Significant eight bits to the TXREG register.
EUSART Synchronous Slave
Transmit
The operation of the Synchronous Master and Slave
modes
are
identical
(see
Section 31.5.1.3
“Synchronous Master Transmission”), except in the
case of the Sleep mode.
If two words are written to the TXREG and then the
SLEEP instruction is executed, the following will occur:
1.
2.
3.
4.
5.
The first character will immediately transfer to
the TSR register and transmit.
The second word will remain in the TXREG
register.
The TXIF bit will not be set.
After the first character has been shifted out of
TSR, the TXREG register will transfer the second
character to the TSR and the TXIF bit will now be
set.
If the PEIE and TXIE bits are set, the interrupt
will wake the device from Sleep and execute the
next instruction. If the GIE bit is also set, the
program will call the Interrupt Service Routine.
DS40001726C-page 364
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 31-9:
Name
ANSELB
SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE
TRANSMISSION
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
ABDOVF
RCIDL
—
SCKP
BRG16
—
WUE
ABDEN
349
CKPPS
—
—
—
INTCON
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
PIE1
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
PIR1
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
87
RC1STA
SPEN
RX9
SREN
CREN
ADDEN
FERR
OERR
RX9D
RxyPPS
—
—
—
ANSELC
BAUD1CON
CKPPS<4:0>
136
RxyPPS<4:0>
83
348
137
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISC0
130
TRMT
TX9D
TX1REG
TX1STA
Legend:
*
EUSART Transmit Data Register
CSRC
TX9
TXEN
SYNC
SENDB
339*
BRGH
347
— = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous slave transmission.
Page provides register information.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 365
PIC16(L)F1713/6
31.5.2.3
EUSART Synchronous Slave
Reception
31.5.2.4
The operation of the Synchronous Master and Slave
modes is identical (Section 31.5.1.5 “Synchronous
Master Reception”), with the following exceptions:
• Sleep
• CREN bit is always set, therefore the receiver is
never idle
• SREN bit, which is a “don’t care” in Slave mode
1.
2.
3.
A character may be received while in Sleep mode by
setting the CREN bit prior to entering Sleep. Once the
word is received, the RSR register will transfer the data
to the RCREG register. If the RCIE enable bit is set, the
interrupt generated will wake the device from Sleep
and execute the next instruction. If the GIE bit is also
set, the program will branch to the interrupt vector.
4.
5.
6.
7.
8.
9.
Synchronous Slave Reception
Setup:
Set the SYNC and SPEN bits and clear the
CSRC bit.
Clear the ANSEL bit for both the CK and DT pins
(if applicable).
If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
If 9-bit reception is desired, set the RX9 bit.
Set the CREN bit to enable reception.
The RCIF bit will be set when reception is
complete. An interrupt will be generated if the
RCIE bit was set.
If 9-bit mode is enabled, retrieve the Most
Significant bit from the RX9D bit of the RCSTA
register.
Retrieve the eight Least Significant bits from the
receive FIFO by reading the RCREG register.
If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTA
register or by clearing the SPEN bit which resets
the EUSART.
TABLE 31-10: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE
RECEPTION
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
ANSELB
—
—
ANSB5
ANSB4
ANSB3
ANSB2
ANSB1
ANSB0
126
ANSELC
ANSC7
ANSC6
ANSC5
ANSC4
ANSC3
ANSC2
—
—
131
ABDOVF
RCIDL
—
SCKP
BRG16
—
WUE
ABDEN
—
—
—
BAUD1CON
CKPPS
CKPPS<4:0>
349
136
GIE
PEIE
TMR0IE
INTE
IOCIE
TMR0IF
INTF
IOCIF
83
PIE1
TMR1GIE
ADIE
RCIE
TXIE
SSP1IE
CCP1IE
TMR2IE
TMR1IE
84
PIR1
TMR1GIF
ADIF
RCIF
TXIF
SSP1IF
CCP1IF
TMR2IF
TMR1IF
87
OERR
RX9D
INTCON
RC1REG
EUSART Receive Data Register
342*
FERR
348
SPEN
RX9
SREN
RXPPS
—
—
—
TRISB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
TRISC
TRISC7
TRISC6
TRISC5
TRISC4
TRISC3
TRISC2
TRISC1
TRISA0
130
CSRC
TX9
TXEN
SYNC
SENDB
BRGH
TRMT
TX9D
347
TX1STA
Legend:
*
CREN
ADDEN
RC1STA
RXPPS<4:0>
136
— = unimplemented location, read as ‘0’. Shaded cells are not used for synchronous slave reception.
Page provides register information.
DS40001726C-page 366
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
31.6
EUSART Operation During Sleep
The EUSART will remain active during Sleep only in the
Synchronous Slave mode. All other modes require the
system clock and therefore cannot generate the necessary signals to run the Transmit or Receive Shift
registers during Sleep.
Synchronous Slave mode uses an externally generated
clock to run the Transmit and Receive Shift registers.
31.6.1
SYNCHRONOUS RECEIVE DURING
SLEEP
To receive during Sleep, all the following conditions
must be met before entering Sleep mode:
• RCSTA and TXSTA Control registers must be
configured for Synchronous Slave Reception (see
Section 31.5.2.4 “Synchronous Slave
Reception Setup:”).
• If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
• The RCIF interrupt flag must be cleared by reading RCREG to unload any pending characters in
the receive buffer.
Upon entering Sleep mode, the device will be ready to
accept data and clocks on the RX/DT and TX/CK pins,
respectively. When the data word has been completely
clocked in by the external device, the RCIF interrupt
flag bit of the PIR1 register will be set. Thereby, waking
the processor from Sleep.
31.6.2
SYNCHRONOUS TRANSMIT
DURING SLEEP
To transmit during Sleep, all the following conditions
must be met before entering Sleep mode:
• The RCSTA and TXSTA Control registers must be
configured for synchronous slave transmission
(see Section 31.5.2.2 “Synchronous Slave
Transmission Setup:”).
• The TXIF interrupt flag must be cleared by writing
the output data to the TXREG, thereby filling the
TSR and transmit buffer.
• If interrupts are desired, set the TXIE bit of the
PIE1 register and the PEIE bit of the INTCON
register.
• Interrupt enable bits TXIE of the PIE1 register and
PEIE of the INTCON register must set.
Upon entering Sleep mode, the device will be ready to
accept clocks on TX/CK pin and transmit data on the
RX/DT pin. When the data word in the TSR has been
completely clocked out by the external device, the
pending byte in the TXREG will transfer to the TSR and
the TXIF flag will be set. Thereby, waking the processor
from Sleep. At this point, the TXREG is available to
accept another character for transmission, which will
clear the TXIF flag.
Upon waking from Sleep, the instruction following the
SLEEP instruction will be executed. If the Global
Interrupt Enable (GIE) bit is also set then the Interrupt
Service Routine at address 0004h will be called.
Upon waking from Sleep, the instruction following the
SLEEP instruction will be executed. If the Global
Interrupt Enable (GIE) bit of the INTCON register is
also set, then the Interrupt Service Routine at address
004h will be called.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
32.0
IN-CIRCUIT SERIAL
PROGRAMMING™ (ICSP™)
ICSP™ programming allows customers to manufacture
circuit boards with unprogrammed devices. Programming
can be done after the assembly process, allowing the
device to be programmed with the most recent firmware
or a custom firmware. Five pins are needed for ICSP™
programming:
• ICSPCLK
• ICSPDAT
• MCLR/VPP
• VDD
• VSS
In Program/Verify mode the program memory, user IDs
and the Configuration Words are programmed through
serial communications. The ICSPDAT pin is a
bidirectional I/O used for transferring the serial data
and the ICSPCLK pin is the clock input. For more
information on ICSP™ refer to the “PIC16(L)F170X
Memory Programming Specification” (DS41683).
32.1
High-Voltage Programming Entry
Mode
The device is placed into High-Voltage Programming
Entry mode by holding the ICSPCLK and ICSPDAT
pins low then raising the voltage on MCLR/VPP to VIHH.
32.2
Low-Voltage Programming Entry
Mode
The Low-Voltage Programming Entry mode allows the
PIC® Flash MCUs to be programmed using VDD only,
without high voltage. When the LVP bit of Configuration
Words is set to ‘1’, the low-voltage ICSP programming
entry is enabled. To disable the Low-Voltage ICSP
mode, the LVP bit must be programmed to ‘0’.
Entry into the Low-Voltage Programming Entry mode
requires the following steps:
1.
2.
MCLR is brought to VIL.
A 32-bit key sequence is presented on
ICSPDAT, while clocking ICSPCLK.
32.3
Common Programming Interfaces
Connection to a target device is typically done through
an ICSP™ header. A commonly found connector on
development tools is the RJ-11 in the 6P6C (6-pin,
6-connector) configuration. See Figure 32-1.
FIGURE 32-1:
VDD
ICD RJ-11 STYLE
CONNECTOR INTERFACE
ICSPDAT
NC
2 4 6
ICSPCLK
1 3 5
Target
VPP/MCLR
VSS
PC Board
Bottom Side
Pin Description*
1 = VPP/MCLR
2 = VDD Target
3 = VSS (ground)
4 = ICSPDAT
5 = ICSPCLK
6 = No Connect
Another connector often found in use with the PICkit™
programmers is a standard 6-pin header with 0.1 inch
spacing. Refer to Figure 32-2.
For additional interface recommendations, refer to your
specific device programmer manual prior to PCB
design.
It is recommended that isolation devices be used to
separate the programming pins from other circuitry.
The type of isolation is highly dependent on the specific
application and may include devices such as resistors,
diodes, or even jumpers. See Figure 32-3 for more
information.
Once the key sequence is complete, MCLR must be
held at VIL for as long as Program/Verify mode is to be
maintained.
If low-voltage programming is enabled (LVP = 1), the
MCLR Reset function is automatically enabled and
cannot be disabled. See Section 5.5 “MCLR” for more
information.
The LVP bit can only be reprogrammed to ‘0’ by using
the High-Voltage Programming mode.
DS40001726C-page 368
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 32-2:
PICkit™ PROGRAMMER STYLE CONNECTOR INTERFACE
Pin 1 Indicator
Pin Description*
1 = VPP/MCLR
1
2
3
4
5
6
2 = VDD Target
3 = VSS (ground)
4 = ICSPDAT
5 = ICSPCLK
6 = No Connect
*
FIGURE 32-3:
The 6-pin header (0.100" spacing) accepts 0.025" square pins.
TYPICAL CONNECTION FOR ICSP™ PROGRAMMING
External
Programming
Signals
Device to be
Programmed
VDD
VDD
VDD
VPP
MCLR/VPP
VSS
VSS
Data
ICSPDAT
Clock
ICSPCLK
*
*
*
To Normal Connections
* Isolation devices (as required).
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
33.0
INSTRUCTION SET SUMMARY
33.1
Read-Modify-Write Operations
• Byte Oriented
• Bit Oriented
• Literal and Control
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (R-M-W)
operation. The register is read, the data is modified,
and the result is stored according to either the instruction, or the destination designator ‘d’. A read operation
is performed on a register even if the instruction writes
to that register.
The literal and control category contains the most
varied instruction word format.
TABLE 33-1:
Each instruction is a 14-bit word containing the operation code (opcode) and all required operands. The
opcodes are broken into three broad categories.
Table 33-3 lists the instructions recognized by the
MPASMTM assembler.
All instructions are executed within a single instruction
cycle, with the following exceptions, which may take
two or three cycles:
• Subroutine takes two cycles (CALL, CALLW)
• Returns from interrupts or subroutines take two
cycles (RETURN, RETLW, RETFIE)
• Program branching takes two cycles (GOTO, BRA,
BRW, BTFSS, BTFSC, DECFSZ, INCSFZ)
• One additional instruction cycle will be used when
any instruction references an indirect file register
and the file select register is pointing to program
memory.
One instruction cycle consists of 4 oscillator cycles; for
an oscillator frequency of 4 MHz, this gives a nominal
instruction execution rate of 1 MHz.
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
OPCODE FIELD
DESCRIPTIONS
Field
f
Description
Register file address (0x00 to 0x7F)
W
Working register (accumulator)
b
Bit address within an 8-bit file register
k
Literal field, constant data or label
x
Don’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
d
Destination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
n
FSR or INDF number. (0-1)
mm
Pre-post increment-decrement mode
selection
TABLE 33-2:
ABBREVIATION
DESCRIPTIONS
Field
Program Counter
TO
Time-Out bit
C
DC
Z
PD
DS40001726C-page 370
Description
PC
Carry bit
Digit Carry bit
Zero bit
Power-Down bit
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 33-1:
GENERAL FORMAT FOR
INSTRUCTIONS
Byte-oriented file register operations
13
8 7 6
OPCODE
d
f (FILE #)
0
d = 0 for destination W
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13
10 9
7 6
OPCODE
b (BIT #)
f (FILE #)
0
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
General
13
OPCODE
8
7
0
k (literal)
k = 8-bit immediate value
CALL and GOTO instructions only
13
11 10
OPCODE
0
k (literal)
k = 11-bit immediate value
MOVLP instruction only
13
OPCODE
7
6
0
k (literal)
k = 7-bit immediate value
MOVLB instruction only
13
OPCODE
5 4
0
k (literal)
k = 5-bit immediate value
BRA instruction only
13
OPCODE
9
8
0
k (literal)
k = 9-bit immediate value
FSR Offset instructions
13
OPCODE
7
6
n
5
0
k (literal)
n = appropriate FSR
k = 6-bit immediate value
FSR Increment instructions
13
OPCODE
3
2 1
0
n m (mode)
n = appropriate FSR
m = 2-bit mode value
OPCODE only
13
0
OPCODE
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PIC16(L)F1713/6
TABLE 33-3:
PIC16(L)F1713/6 INSTRUCTION SET
14-Bit Opcode
Mnemonic,
Operands
Description
Cycles
MSb
LSb
Status
Affected
Notes
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ADDWFC
ANDWF
ASRF
LSLF
LSRF
CLRF
CLRW
COMF
DECF
INCF
IORWF
MOVF
MOVWF
RLF
RRF
SUBWF
SUBWFB
SWAPF
XORWF
f, d
f, d
f, d
f, d
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
f
f, d
f, d
f, d
f, d
f, d
f, d
Add W and f
Add with Carry W and f
AND W with f
Arithmetic Right Shift
Logical Left Shift
Logical Right Shift
Clear f
Clear W
Complement f
Decrement f
Increment f
Inclusive OR W with f
Move f
Move W to f
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Subtract with Borrow W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
00
11
00
11
11
11
00
00
00
00
00
00
00
00
00
00
00
11
00
00
0111
1101
0101
0111
0101
0110
0001
0001
1001
0011
1010
0100
1000
0000
1101
1100
0010
1011
1110
0110
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0000
dfff
dfff
dfff
dfff
dfff
1fff
dfff
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
00xx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
C, DC, Z
C, DC, Z
Z
C, Z
C, Z
C, Z
Z
Z
Z
Z
Z
Z
Z
C
C
C, DC, Z
C, DC, Z
Z
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
BYTE ORIENTED SKIP OPERATIONS
DECFSZ
INCFSZ
f, d
f, d
Decrement f, Skip if 0
Increment f, Skip if 0
BCF
BSF
f, b
f, b
Bit Clear f
Bit Set f
1(2)
1(2)
00
00
1, 2
1, 2
1011 dfff ffff
1111 dfff ffff
BIT-ORIENTED FILE REGISTER OPERATIONS
1
1
01
01
00bb bfff ffff
01bb bfff ffff
2
2
1, 2
1, 2
BIT-ORIENTED SKIP OPERATIONS
BTFSC
BTFSS
f, b
f, b
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1 (2)
1 (2)
01
01
10bb bfff ffff
11bb bfff ffff
1
1
1
1
1
1
1
1
11
11
11
00
11
11
11
11
1110
1001
1000
0000
0001
0000
1100
1010
LITERAL OPERATIONS
ADDLW
ANDLW
IORLW
MOVLB
MOVLP
MOVLW
SUBLW
XORLW
k
k
k
k
k
k
k
k
Note 1:
If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require
one additional instruction cycle.
2:
Add literal and W
AND literal with W
Inclusive OR literal with W
Move literal to BSR
Move literal to PCLATH
Move literal to W
Subtract W from literal
Exclusive OR literal with W
DS40001726C-page 372
kkkk
kkkk
kkkk
001k
1kkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
C, DC, Z
Z
Z
C, DC, Z
Z
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 33-3:
PIC16(L)F1713/6 INSTRUCTION SET (CONTINUED)
14-Bit Opcode
Mnemonic,
Operands
Description
Cycles
MSb
LSb
Status
Affected
Notes
CONTROL OPERATIONS
BRA
BRW
CALL
CALLW
GOTO
RETFIE
RETLW
RETURN
k
–
k
–
k
k
k
–
Relative Branch
Relative Branch with W
Call Subroutine
Call Subroutine with W
Go to address
Return from interrupt
Return with literal in W
Return from Subroutine
CLRWDT
NOP
OPTION
RESET
SLEEP
TRIS
–
–
–
–
–
f
Clear Watchdog Timer
No Operation
Load OPTION_REG register with W
Software device Reset
Go into Standby mode
Load TRIS register with W
ADDFSR
MOVIW
n, k
n mm
MOVWI
k[n]
n mm
Add Literal k to FSRn
Move Indirect FSRn to W with pre/post inc/dec
modifier, mm
Move INDFn to W, Indexed Indirect.
Move W to Indirect FSRn with pre/post inc/dec
modifier, mm
Move W to INDFn, Indexed Indirect.
2
2
2
2
2
2
2
2
11
00
10
00
10
00
11
00
001k
0000
0kkk
0000
1kkk
0000
0100
0000
kkkk
0000
kkkk
0000
kkkk
0000
kkkk
0000
kkkk
1011
kkkk
1010
kkkk
1001
kkkk
1000
00
00
00
00
00
00
0000
0000
0000
0000
0000
0000
0110
0000
0110
0000
0110
0110
0100 TO, PD
0000
0010
0001
0011 TO, PD
0fff
INHERENT OPERATIONS
1
1
1
1
1
1
C-COMPILER OPTIMIZED
k[n]
Note 1:
2:
3:
1
1
11
00
0001 0nkk kkkk
0000 0001 0nmm Z
2, 3
1
1
11
00
1111 0nkk kkkk Z
0000 0001 1nmm
2
2, 3
1
11
1111 1nkk kkkk
2
If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require
one additional instruction cycle.
See Table in the MOVIW and MOVWI instruction descriptions.
 2013-2016 Microchip Technology Inc.
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PIC16(L)F1713/6
33.2
Instruction Descriptions
ADDFSR
Add Literal to FSRn
ANDLW
AND literal with W
Syntax:
[ label ] ADDFSR FSRn, k
Syntax:
[ label ] ANDLW
Operands:
-32  k  31
n  [ 0, 1]
Operands:
0  k  255
Operation:
FSR(n) + k  FSR(n)
Status Affected:
None
Description:
The signed 6-bit literal ‘k’ is added to
the contents of the FSRnH:FSRnL
register pair.
k
Operation:
(W) .AND. (k)  (W)
Status Affected:
Z
Description:
The contents of W register are
AND’ed with the 8-bit literal ‘k’. The
result is placed in the W register.
ANDWF
AND W with f
FSRn is limited to the range
0000h-FFFFh. Moving beyond these
bounds will cause the FSR to
wrap-around.
ADDLW
Add literal and W
Syntax:
[ label ] ADDLW
Operands:
0  k  255
Operation:
Status Affected:
Syntax:
[ label ] ANDWF
Operands:
0  f  127
d 0,1
(W) + k  (W)
Operation:
(W) .AND. (f)  (destination)
C, DC, Z
Status Affected:
Z
Description:
The contents of the W register are
added to the 8-bit literal ‘k’ and the
result is placed in the W register.
Description:
AND the W register with register ‘f’. If
‘d’ is ‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
ASRF
Arithmetic Right Shift
ADDWF
Add W and f
Syntax:
[ label ] ADDWF
Operands:
0  f  127
d 0,1
Operation:
(W) + (f)  (destination)
Status Affected:
C, DC, Z
Description:
Add the contents of the W register
with register ‘f’. If ‘d’ is ‘0’, the result is
stored in the W register. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
k
f,d
ADDWFC
ADD W and CARRY bit to f
Syntax:
[ label ] ADDWFC
Operands:
0  f  127
d [0,1]
Operation:
(W) + (f) + (C)  dest
Syntax:
[ label ] ASRF
Operands:
0  f  127
d [0,1]
f {,d}
Operation:
(f<7>) dest<7>
(f<7:1>)  dest<6:0>,
(f<0>)  C,
Status Affected:
C, Z
Description:
The contents of register ‘f’ are shifted
one bit to the right through the Carry
flag. The MSb remains unchanged. If
‘d’ is ‘0’, the result is placed in W. If ‘d’
is ‘1’, the result is stored back in
register ‘f’.
register f
C
f {,d}
Status Affected:
C, DC, Z
Description:
Add W, the Carry flag and data memory location ‘f’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed in data memory location ‘f’.
DS40001726C-page 374
f,d
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
BCF
Bit Clear f
Syntax:
[ label ] BCF
BTFSC
f,b
Bit Test f, Skip if Clear
Syntax:
[ label ] BTFSC f,b
0  f  127
0b7
Operands:
0  f  127
0b7
Operands:
Operation:
0  (f<b>)
Operation:
skip if (f<b>) = 0
Status Affected:
None
Status Affected:
None
Description:
Bit ‘b’ in register ‘f’ is cleared.
Description:
If bit ‘b’ in register ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’, in register ‘f’, is ‘0’, the next
instruction is discarded, and a NOP is
executed instead, making this a
2-cycle instruction.
BRA
Relative Branch
BTFSS
Bit Test f, Skip if Set
Syntax:
[ label ] BRA label
[ label ] BRA $+k
Syntax:
[ label ] BTFSS f,b
Operands:
0  f  127
0b<7
Operands:
-256  label - PC + 1  255
-256  k  255
Operation:
skip if (f<b>) = 1
Operation:
(PC) + 1 + k  PC
Status Affected:
None
Status Affected:
None
Description:
Description:
Add the signed 9-bit literal ‘k’ to the
PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 1 + k. This instruction is a
2-cycle instruction. This branch has a
limited range.
If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is executed.
If bit ‘b’ is ‘1’, then the next instruction
is discarded and a NOP is executed
instead, making this a 2-cycle
instruction.
BRW
Relative Branch with W
Syntax:
[ label ] BRW
Operands:
None
Operation:
(PC) + (W)  PC
Status Affected:
None
Description:
Add the contents of W (unsigned) to
the PC. Since the PC will have
incremented to fetch the next
instruction, the new address will be
PC + 1 + (W). This instruction is a
2-cycle instruction.
BSF
Bit Set f
Syntax:
[ label ] BSF
Operands:
0  f  127
0b7
Operation:
1  (f<b>)
Status Affected:
None
Description:
Bit ‘b’ in register ‘f’ is set.
f,b
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PIC16(L)F1713/6
CALL
Call Subroutine
CLRWDT
Clear Watchdog Timer
Syntax:
[ label ] CALL k
Syntax:
[ label ] CLRWDT
Operands:
0  k  2047
Operands:
None
Operation:
(PC)+ 1 TOS,
k  PC<10:0>,
(PCLATH<6:3>)  PC<14:11>
Operation:
Status Affected:
None
00h  WDT
0  WDT prescaler,
1  TO
1  PD
Description:
Call Subroutine. First, return address
(PC + 1) is pushed onto the stack.
The 11-bit immediate address is
loaded into PC bits <10:0>. The upper
bits of the PC are loaded from
PCLATH. CALL is a 2-cycle
instruction.
Status Affected:
TO, PD
Description:
CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler
of the WDT. Status bits TO and PD
are set.
CALLW
Subroutine Call With W
COMF
Complement f
Syntax:
[ label ] CALLW
Syntax:
[ label ] COMF
Operands:
None
Operands:
Operation:
(PC) +1  TOS,
(W)  PC<7:0>,
(PCLATH<6:0>) PC<14:8>
0  f  127
d  [0,1]
Operation:
(f)  (destination)
Status Affected:
Z
Description:
The contents of register ‘f’ are
complemented. If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
DECF
Decrement f
Syntax:
[ label ] DECF f,d
Status Affected:
None
Description:
Subroutine call with W. First, the
return address (PC + 1) is pushed
onto the return stack. Then, the
contents of W is loaded into PC<7:0>,
and the contents of PCLATH into
PC<14:8>. CALLW is a 2-cycle
instruction.
CLRF
Clear f
Syntax:
[ label ] CLRF
f
f,d
Operands:
0  f  127
Operands:
Operation:
00h  (f)
1Z
0  f  127
d  [0,1]
Operation:
(f) - 1  (destination)
Status Affected:
Z
Status Affected:
Z
Description:
The contents of register ‘f’ are cleared
and the Z bit is set.
Description:
Decrement register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If ‘d’
is ‘1’, the result is stored back in
register ‘f’.
CLRW
Clear W
Syntax:
[ label ] CLRW
Operands:
None
Operation:
00h  (W)
1Z
Status Affected:
Z
Description:
W register is cleared. Zero bit (Z) is
set.
DS40001726C-page 376
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
DECFSZ
Decrement f, Skip if 0
INCFSZ
Syntax:
[ label ] DECFSZ f,d
Syntax:
[ label ]
Operands:
0  f  127
d  [0,1]
Operands:
0  f  127
d  [0,1]
Operation:
(f) - 1  (destination);
skip if result = 0
Operation:
(f) + 1  (destination),
skip if result = 0
Status Affected:
None
Status Affected:
None
Description:
The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
If the result is ‘1’, the next instruction is
executed. If the result is ‘0’, then a
NOP is executed instead, making it a
2-cycle instruction.
Description:
The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
If the result is ‘1’, the next instruction is
executed. If the result is ‘0’, a NOP is
executed instead, making it a 2-cycle
instruction.
GOTO
Unconditional Branch
IORLW
Inclusive OR literal with W
Syntax:
[ label ]
Syntax:
[ label ]
GOTO k
Increment f, Skip if 0
INCFSZ f,d
IORLW k
Operands:
0  k  2047
Operands:
0  k  255
Operation:
k  PC<10:0>
PCLATH<6:3>  PC<14:11>
Operation:
(W) .OR. k  (W)
Status Affected:
Z
Status Affected:
None
Description:
Description:
GOTO is an unconditional branch. The
11-bit immediate value is loaded into
PC bits <10:0>. The upper bits of PC
are loaded from PCLATH<4:3>. GOTO
is a 2-cycle instruction.
The contents of the W register are
OR’ed with the 8-bit literal ‘k’. The
result is placed in the W register.
INCF
Increment f
IORWF
Inclusive OR W with f
Syntax:
[ label ]
Syntax:
[ label ]
Operands:
0  f  127
d  [0,1]
Operands:
0  f  127
d  [0,1]
Operation:
(f) + 1  (destination)
Operation:
(W) .OR. (f)  (destination)
Status Affected:
Z
Status Affected:
Z
Description:
The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
Description:
Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
INCF f,d
 2013-2016 Microchip Technology Inc.
IORWF
f,d
DS40001726C-page 377
PIC16(L)F1713/6
LSLF
Logical Left Shift
MOVF
Syntax:
[ label ] LSLF
Syntax:
[ label ]
Operands:
0  f  127
d [0,1]
Operands:
0  f  127
d  [0,1]
Operation:
(f<7>)  C
(f<6:0>)  dest<7:1>
0  dest<0>
Operation:
(f)  (dest)
f {,d}
Status Affected:
C, Z
Description:
The contents of register ‘f’ are shifted
one bit to the left through the Carry flag.
A ‘0’ is shifted into the LSb. If ‘d’ is ‘0’,
the result is placed in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
C
register f
0
Z
Description:
The contents of register f is moved to
a destination dependent upon the
status of d. If d = 0, destination is W
register. If d = 1, the destination is file
register f itself. d = 1 is useful to test a
file register since status flag Z is
affected.
Words:
1
Cycles:
1
Logical Right Shift
Syntax:
[ label ] LSRF
Operands:
0  f  127
d [0,1]
Operation:
0  dest<7>
(f<7:1>)  dest<6:0>,
(f<0>)  C,
Status Affected:
C, Z
Description:
The contents of register ‘f’ are shifted
one bit to the right through the Carry
flag. A ‘0’ is shifted into the MSb. If ‘d’ is
‘0’, the result is placed in W. If ‘d’ is ‘1’,
the result is stored back in register ‘f’.
DS40001726C-page 378
MOVF
FSR, 0
After Instruction
W = value in FSR register
Z = 1
LSRF
f {,d}
register f
MOVF f,d
Status Affected:
Example:
0
Move f
C
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
MOVIW
Move INDFn to W
MOVLP
Syntax:
[ label ] MOVIW ++FSRn
[ label ] MOVIW --FSRn
[ label ] MOVIW FSRn++
[ label ] MOVIW FSRn-[ label ] MOVIW k[FSRn]
Syntax:
[ label ] MOVLP k
Operands:
0  k  127
Operation:
k  PCLATH
Status Affected:
None
Operands:
n  [0,1]
mm  [00,01, 10, 11]
-32  k  31
Description:
The 7-bit literal ‘k’ is loaded into the
PCLATH register.
Operation:
INDFn  W
Effective address is determined by
• FSR + 1 (preincrement)
• FSR - 1 (predecrement)
• FSR + k (relative offset)
After the Move, the FSR value will be
either:
• FSR + 1 (all increments)
• FSR - 1 (all decrements)
• Unchanged
Status Affected:
MOVLW
Move literal to W
Syntax:
[ label ]
0  k  255
Operation:
k  (W)
Status Affected:
None
Description:
The 8-bit literal ‘k’ is loaded into W register. The “don’t cares” will assemble as
‘0’s.
Words:
1
1
Mode
Syntax
mm
Cycles:
Preincrement
++FSRn
00
Example:
--FSRn
01
Postincrement
FSRn++
10
Postdecrement
FSRn--
11
Description:
This instruction is used to move data
between W and one of the indirect
registers (INDFn). Before/after this
move, the pointer (FSRn) is updated by
pre/post incrementing/decrementing it.
Note: The INDFn registers are not
physical registers. Any instruction that
accesses an INDFn register actually
accesses the register at the address
specified by the FSRn.
FSRn is limited to the range 0000h FFFFh. Incrementing/decrementing it
beyond these bounds will cause it to
wrap-around.
MOVLB
Move literal to BSR
Syntax:
[ label ] MOVLB k
Operands:
0  k  31
Operation:
k  BSR
Status Affected:
None
Description:
The 5-bit literal ‘k’ is loaded into the
Bank Select Register (BSR).
 2013-2016 Microchip Technology Inc.
MOVLW k
Operands:
Z
Predecrement
Move literal to PCLATH
MOVLW
0x5A
After Instruction
W =
MOVWF
Move W to f
Syntax:
[ label ]
MOVWF
Operands:
0  f  127
Operation:
(W)  (f)
0x5A
f
Status Affected:
None
Description:
Move data from W register to register
‘f’.
Words:
1
Cycles:
1
Example:
MOVWF
OPTION_REG
Before Instruction
OPTION_REG = 0xFF
W = 0x4F
After Instruction
OPTION_REG = 0x4F
W = 0x4F
DS40001726C-page 379
PIC16(L)F1713/6
MOVWI
Move W to INDFn
NOP
No Operation
Syntax:
[ label ] MOVWI ++FSRn
[ label ] MOVWI --FSRn
[ label ] MOVWI FSRn++
[ label ] MOVWI FSRn-[ label ] MOVWI k[FSRn]
Syntax:
[ label ]
Operands:
None
Operation:
No operation
Status Affected:
None
n  [0,1]
mm  [00,01, 10, 11]
-32  k  31
Description:
No operation.
Words:
1
Cycles:
1
Operands:
Operation:
Status Affected:
W  INDFn
Effective address is determined by
• FSR + 1 (preincrement)
• FSR - 1 (predecrement)
• FSR + k (relative offset)
After the Move, the FSR value will be
either:
• FSR + 1 (all increments)
• FSR - 1 (all decrements)
Unchanged
None
NOP
OPTION
Load OPTION_REG Register
with W
Syntax:
[ label ] OPTION
Operands:
None
Operation:
(W)  OPTION_REG
Status Affected:
None
Description:
Move data from W register to
OPTION_REG register.
1
Mode
Syntax
Preincrement
++FSRn
00
Predecrement
--FSRn
01
Postincrement
FSRn++
10
Words:
Postdecrement
FSRn--
11
Cycles:
1
Example:
OPTION
Description:
mm
Example:
Before Instruction
OPTION_REG = 0xFF
W = 0x4F
After Instruction
OPTION_REG = 0x4F
W = 0x4F
This instruction is used to move data
between W and one of the indirect
registers (INDFn). Before/after this
move, the pointer (FSRn) is updated by
pre/post incrementing/decrementing it.
Note: The INDFn registers are not
physical registers. Any instruction that
accesses an INDFn register actually
accesses the register at the address
specified by the FSRn.
FSRn is limited to the range
0000h-FFFFh.
Incrementing/decrementing it beyond
these bounds will cause it to
wrap-around.
The increment/decrement operation on
FSRn WILL NOT affect any Status bits.
DS40001726C-page 380
NOP
RESET
Software Reset
Syntax:
[ label ] RESET
Operands:
None
Operation:
Execute a device Reset. Resets the
RI flag of the PCON register.
Status Affected:
None
Description:
This instruction provides a way to
execute a hardware Reset by
software.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
RETFIE
Return from Interrupt
RETURN
Return from Subroutine
Syntax:
[ label ]
Syntax:
[ label ]
None
RETFIE k
RETURN
Operands:
None
Operands:
Operation:
TOS  PC,
1  GIE
Operation:
TOS  PC
Status Affected:
None
Status Affected:
None
Description:
Description:
Return from Interrupt. Stack is POPed
and Top-of-Stack (TOS) is loaded in
the PC. Interrupts are enabled by
setting Global Interrupt Enable bit,
GIE (INTCON<7>). This is a 2-cycle
instruction.
Return from subroutine. The stack is
POPed and the top of the stack (TOS)
is loaded into the program counter.
This is a 2-cycle instruction.
Words:
1
Cycles:
2
Example:
RETFIE
After Interrupt
PC =
GIE =
TOS
1
RETLW
Return with literal in W
Syntax:
[ label ]
Operands:
0  k  255
Operation:
k  (W);
TOS  PC
Status Affected:
None
Description:
The W register is loaded with the 8-bit
literal ‘k’. The program counter is
loaded from the top of the stack (the
return address). This is a 2-cycle
instruction.
Words:
1
Cycles:
2
Example:
TABLE
RETLW k
RLF
Rotate Left f through Carry
Syntax:
[ label ]
Operands:
0  f  127
d  [ 0, 1]
Operation:
See description below
Status Affected:
C
Description:
The contents of register ‘f’ are rotated
one bit to the left through the Carry
flag. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
RLF
C
CALL TABLE;W contains table
;offset value
•
;W now has table value
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ; End of table
Before Instruction
W =
After Instruction
W =
 2013-2016 Microchip Technology Inc.
Words:
1
Cycles:
1
Example:
RLF
f,d
Register f
REG1,0
Before Instruction
REG1
C
After Instruction
REG1
W
C
=
=
1110 0110
0
=
=
=
1110 0110
1100 1100
1
0x07
value of k8
DS40001726C-page 381
PIC16(L)F1713/6
SUBLW
Subtract W from literal
Syntax:
[ label ]
RRF
Rotate Right f through Carry
Syntax:
[ label ]
Operands:
0  f  127
d  [0,1]
Operation:
See description below
Status Affected:
C, DC, Z
Status Affected:
C
Description:
Description:
The contents of register ‘f’ are rotated
one bit to the right through the Carry
flag. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
The W register is subtracted (2’s
complement method) from the 8-bit
literal ‘k’. The result is placed in the W
register.
RRF f,d
C
SUBLW k
Operands:
0 k 255
Operation:
k - (W) W)
Register f
C=0
Wk
C=1
Wk
DC = 0
W<3:0>  k<3:0>
DC = 1
W<3:0>  k<3:0>
SLEEP
Enter Sleep mode
SUBWF
Subtract W from f
Syntax:
[ label ]
Syntax:
[ label ]
Operands:
0 f 127
d  [0,1]
SLEEP
Operands:
None
Operation:
00h  WDT,
0  WDT prescaler,
1  TO,
0  PD
Status Affected:
TO, PD
Description:
The power-down Status bit, PD is
cleared. Time-out Status bit, TO is
set. Watchdog Timer and its
prescaler are cleared.
The processor is put into Sleep mode
with the oscillator stopped.
DS40001726C-page 382
SUBWF f,d
Operation:
(f) - (W) destination)
Status Affected:
C, DC, Z
Description:
Subtract (2’s complement method) W
register from register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f.
C=0
Wf
C=1
Wf
DC = 0
W<3:0>  f<3:0>
DC = 1
W<3:0>  f<3:0>
SUBWFB
Subtract W from f with Borrow
Syntax:
SUBWFB
Operands:
0  f  127
d  [0,1]
Operation:
(f) – (W) – (B) dest
f {,d}
Status Affected:
C, DC, Z
Description:
Subtract W and the BORROW flag
(CARRY) from register ‘f’ (2’s
complement method). If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
SWAPF
Swap Nibbles in f
XORLW
Exclusive OR literal with W
Syntax:
[ label ]
Syntax:
[ label ]
Operands:
0  f  127
d  [0,1]
Operands:
0 k 255
(f<3:0>)  (destination<7:4>),
(f<7:4>)  (destination<3:0>)
Operation:
(W) .XOR. k W)
Status Affected:
Z
Description:
The contents of the W register are
XOR’ed with the 8-bit literal ‘k’. The
result is placed in the W register.
Operation:
SWAPF f,d
Status Affected:
None
Description:
The upper and lower nibbles of
register ‘f’ are exchanged. If ‘d’ is ‘0’,
the result is placed in the W register. If
‘d’ is ‘1’, the result is placed in register
‘f’.
XORWF
TRIS
Load TRIS Register with W
XORLW k
Exclusive OR W with f
Syntax:
[ label ]
Operands:
0  f  127
d  [0,1]
XORWF
f,d
(W) .XOR. (f) destination)
Syntax:
[ label ] TRIS f
Operands:
5f7
Operation:
Operation:
(W)  TRIS register ‘f’
Status Affected:
Z
Status Affected:
None
Description:
Description:
Move data from W register to TRIS
register.
When ‘f’ = 5, TRISA is loaded.
When ‘f’ = 6, TRISB is loaded.
When ‘f’ = 7, TRISC is loaded.
Exclusive OR the contents of the W
register with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If ‘d’
is ‘1’, the result is stored back in
register ‘f’.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 383
PIC16(L)F1713/6
34.0
ELECTRICAL SPECIFICATIONS
34.1
Absolute Maximum Ratings(†)
Ambient temperature under bias ...................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin
PIC16F1713/6 ........................................................................................................... -0.3V to +6.5V
PIC16LF1713/6 ......................................................................................................... -0.3V to +4.0V
on MCLR pin ........................................................................................................................... -0.3V to +9.0V
on all other pins ............................................................................................................ -0.3V to (VDD + 0.3V)
Maximum current
on VSS pin(1)
-40°C  TA  +85°C .............................................................................................................. 350 mA
+85°C  TA  +125°C ........................................................................................................... 120 mA
on VDD pin(1)
-40°C  TA  +85°C .............................................................................................................. 250 mA
+85°C  TA  +125°C ............................................................................................................. 85 mA
Sunk by any standard I/O pin ............................................................................................................... 50 mA
Sourced by any standard I/O pin .......................................................................................................... 50 mA
Sourced by any Op Amp output pin .................................................................................................... 100 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD) ................................................................................................... 20 mA
Total power dissipation(2) ...............................................................................................................................800 mW
Note 1:
2:
Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be
limited by the device package power dissipation characterizations, see Table 34-6: Thermal
Characteristics to calculate device specifications.
Power dissipation is calculated as follows: PDIS = VDD x {IDD –  IOH} +  {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
DS40001726C-page 384
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
34.2
Standard Operating Conditions
The standard operating conditions for any device are defined as:
Operating Voltage:
Operating Temperature:
VDDMIN VDD VDDMAX
TA_MIN TA TA_MAX
VDD — Operating Supply Voltage(1)
PIC16LF1713/6
VDDMIN (Fosc  16 MHz) ......................................................................................................... +1.8V
VDDMIN (Fosc  16 MHz) ......................................................................................................... +2.5V
VDDMAX .................................................................................................................................... +3.6V
PIC16F1713/6
VDDMIN (Fosc  16 MHz) ......................................................................................................... +2.3V
VDDMIN (16 MHz) .................................................................................................................. +2.5V
VDDMAX .................................................................................................................................... +5.5V
TA — Operating Ambient Temperature Range
Industrial Temperature
TA_MIN ...................................................................................................................................... -40°C
TA_MAX .................................................................................................................................... +85°C
Extended Temperature
TA_MIN ...................................................................................................................................... -40°C
TA_MAX .................................................................................................................................. +125°C
Note 1:
See Parameter D001, DS Characteristics: Supply Voltage.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 385
PIC16(L)F1713/6
VOLTAGE FREQUENCY GRAPH, -40°C  TA +125°C, PIC16F1713/6 ONLY
FIGURE 34-1:
VDD (V)
5.5
2.5
2.3
0
10
4
16
32
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: Refer to Table 34-7 for each Oscillator mode’s supported frequencies.
VOLTAGE FREQUENCY GRAPH, -40°C  TA +125°C, PIC16LF1713/6 ONLY
VDD (V)
FIGURE 34-2:
3.6
2.5
1.8
0
4
10
16
32
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: Refer to Table 34-7 for each Oscillator mode’s supported frequencies.
DS40001726C-page 386
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
34.3
DC Characteristics
TABLE 34-1:
SUPPLY VOLTAGE
PIC16LF1713/6
Standard Operating Conditions (unless otherwise stated)
PIC16F1713/6
Param.
No.
D001
Sym.
VDD
Characteristic
VDR
VFVR
D004*
SVDD
*
†
Note
1:
2:
3:
4:
Conditions
VDDMIN
1.8
2.5
—
—
VDDMAX
3.6
3.6
V
V
FOSC  16 MHz
FOSC 16 MHz (Note 2)
2.3
2.5
—
—
5.5
5.5
V
V
FOSC  16 MHz:
FOSC  16 MHz (Note 2)
1.5
—
—
V
Device in Sleep mode
1.7
—
—
V
Device in Sleep mode
—
1.6
—
V
—
1.6
—
V
—
0.8
—
V
—
1.5
—
V
-4
—
+4
%
1x Gain, 1.024, VDD 2.5V, -40°C to
85°C
-4
—
+4
%
2x Gain, 2.048, VDD 2.5V, -40°C to
85°C
-5
—
+5
%
4x Gain, 4.096, VDD 4.75V, -40°C to
85°C
0.05
—
—
V/ms
Power-on Reset Rearm Voltage(3)
D002B*
D003
Units
Power-on Reset Release Voltage(3)
D002A*
D002B* VPORR*
Max.
RAM Data Retention Voltage(1)
D002*
D002A* VPOR
Typ†
Supply Voltage
D001
D002*
Min.
Fixed Voltage Reference Voltage(4)
VDD Rise Rate
Ensures that the Power-on Reset
signal is released properly.
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
PLL required for 32 MHz operation.
See Figure 34-3: POR and POR Rearm with Slow Rising VDD.
Industrial temperature range only.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 387
PIC16(L)F1713/6
FIGURE 34-3:
POR AND POR REARM WITH SLOW RISING VDD
VDD
VPOR
VPORR
SVDD
VSS
NPOR(1)
POR REARM
VSS
TVLOW(2)
Note 1:
2:
3:
DS40001726C-page 388
TPOR(3)
When NPOR is low, the device is held in Reset.
TPOR 1 s typical.
TVLOW 2.7 s typical.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 34-2:
SUPPLY CURRENT (IDD)(1,2)
PIC16LF1713/6
Standard Operating Conditions
(unless otherwise stated)
PIC16F1713/6
Param
No.
Device
Characteristics
LDO Regulator
Conditions
Min.
Typ†
Max.
Units
VDD
Note
—
75
—
A
—
High-Power mode, normal operation
—
15
—
A
—
Sleep, VREGCON<1> = 0
—
0.3
—
A
—
Sleep, VREGCON<1> = 1
—
5.0
12
A
1.8
—
7.0
18
A
3.0
FOSC = 32 kHz,
LP Oscillator mode (Note 4),
-40°C  TA  +85°C
—
16
26
A
2.3
—
18
32
A
3.0
—
22
35
A
5.0
D012
—
190
290
A
1.8
—
390
580
A
3.0
D012
—
280
380
A
2.3
—
380
500
A
3.0
—
420
550
A
5.0
—
160
240
A
1.8
—
260
350
A
3.0
—
240
360
A
2.3
—
310
450
A
3.0
—
390
580
A
5.0
—
2.2
3
mA
3.0
—
2.7
3.8
mA
3.6
—
2.2
3
mA
3.0
—
2.4
3.5
mA
5.0
D009
D010
D010
D014
D014
D015
D015
†
Note 1:
2:
3:
4:
5:
FOSC = 32 kHz,
LP Oscillator mode (Note 4)
-40°C  TA  +85°C
FOSC = 4 MHz,
XT Oscillator mode
FOSC = 4 MHz,
XT Oscillator mode
FOSC = 4 MHz,
External Clock (ECM),
Medium Power mode
FOSC = 4 MHz,
External Clock (ECM),
Medium Power mode
FOSC = 32 MHz,
External Clock (ECH),
High-Power mode
FOSC = 32 MHz,
External Clock (ECH),
High-Power mode (Note 5)
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
For RC oscillator configurations, current through REXT is not included. The current by the formula
IR = VDD/2REXT (mA) with REXT in kΩ.
FVR and BOR are disabled.
8 MHz clock with 4x PLL enabled.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 389
PIC16(L)F1713/6
TABLE 34-2:
SUPPLY CURRENT (IDD)(1,2) (CONTINUED)
PIC16LF1713/6
Standard Operating Conditions
(unless otherwise stated)
PIC16F1713/6
Param
No.
Device
Characteristics
D017
D017
Conditions
Min.
Typ†
Max.
Units
VDD
—
115
175
A
1.8
—
135
210
A
3.0
—
150
230
A
2.3
—
170
250
A
3.0
—
215
310
A
5.0
D019
—
0.7
1.3
mA
1.8
—
1.2
1.9
mA
3.0
D019
—
1.1
1.8
mA
2.3
—
1.3
2
mA
3.0
—
1.4
2.1
mA
5.0
D020
D020
D022
D022
†
Note 1:
2:
3:
4:
5:
—
2.5
3.3
mA
3.0
—
3
4.1
mA
3.6
—
2.6
3.8
mA
3.0
—
2.7
3.9
mA
5.0
—
2.3
3.1
mA
3.0
—
2.8
3.9
mA
3.6
—
2.4
3.6
mA
3.0
—
2.6
3.8
mA
5.0
Note
FOSC = 500 kHz,
MFINTOSC mode
FOSC = 500 kHz,
MFINTOSC mode
FOSC = 16 MHz,
HFINTOSC mode
FOSC = 16 MHz,
HFINTOSC mode
FOSC = 32 MHz,
HFINTOSC mode
FOSC = 32 MHz,
HFINTOSC mode
FOSC = 32 MHz,
HS Oscillator mode (Note 5)
FOSC = 32 MHz
HS Oscillator mode (Note 5)
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
For RC oscillator configurations, current through REXT is not included. The current by the formula
IR = VDD/2REXT (mA) with REXT in kΩ.
FVR and BOR are disabled.
8 MHz clock with 4x PLL enabled.
DS40001726C-page 390
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 34-3:
POWER-DOWN CURRENTS (IPD)(1,2)
PIC16LF1713/6
Operating Conditions: (unless otherwise stated)
Low-Power Sleep Mode
PIC16F1713/6
Low-Power Sleep Mode, VREGPM = 1
Param
No.
Device Characteristics
Conditions
Min.
Typ†
Max.
+85°C
Max.
+125°C
Units
Note
VDD
D023
Base IPD
—
0.05
1.0
8.0
A
1.8
—
0.08
2.0
9.0
A
3.0
D023
Base IPD
—
0.3
3
10
A
2.3
—
0.4
4
12
A
3.0
—
0.5
6
15
A
5.0
—
9.8
16
18
A
2.3
—
10.3
18
20
A
3.0
—
11.5
21
26
A
5.0
WDT, BOR, FVR and SOSC
disabled, all Peripherals inactive,
Normal-Power Sleep mode
VREGPM = 0
D024
—
0.5
6
14
A
1.8
WDT Current
—
0.8
7
17
A
3.0
D024
—
0.8
6
15
A
2.3
—
0.9
7
20
A
3.0
—
1.0
8
22
A
5.0
—
15
28
30
A
1.8
—
18
30
33
A
3.0
—
18
33
35
A
2.3
—
19
35
37
A
3.0
D023A
Base IPD
D025
D025
WDT, BOR, FVR, and SOSC
disabled, all Peripherals Inactive
WDT, BOR, FVR, and SOSC
disabled, all Peripherals Inactive,
Low-Power Sleep mode
WDT Current
FVR Current
FVR Current
—
20
37
39
A
5.0
D026
—
7.5
25
28
A
3.0
BOR Current
D026
—
10
25
28
A
3.0
BOR Current
—
12
28
31
A
5.0
D027
—
0.5
4
10
A
3.0
LPBOR Current
D027
—
0.8
6
14
A
3.0
LPBOR Current
—
1
8
17
A
5.0
D028
—
0.5
5
9
A
1.8
—
0.8
8.5
12
A
3.0
D028
—
1.1
6
10
A
2.3
—
1.3
8.5
20
A
3.0
—
1.4
10
25
A
5.0
—
0.05
2
9
A
1.8
—
0.08
3
10
A
3.0
—
0.3
4
12
A
2.3
—
0.4
5
13
A
3.0
—
0.5
7
16
A
5.0
D029
D029
*
†
Note 1:
2:
3:
SOSC Current
SOSC Current
ADC Current (Note 3),
no conversion in progress
ADC Current (Note 3),
no conversion in progress
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
The peripheral current is the sum of the base IPD and the additional current consumed when this peripheral is enabled.
The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should
be used when calculating total current consumption.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS.
ADC clock source is FRC.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 391
PIC16(L)F1713/6
TABLE 34-3:
POWER-DOWN CURRENTS (IPD)(1,2) (CONTINUED)
PIC16LF1713/6
Operating Conditions: (unless otherwise stated)
Low-Power Sleep Mode
PIC16F1713/6
Low-Power Sleep Mode, VREGPM = 1
Param
No.
Device Characteristics
D030
D030
Min.
Typ†
Conditions
Max.
+85°C
Max.
+125°C
Units
VDD
—
250
—
—
A
1.8
—
250
—
—
A
3.0
—
280
—
—
A
2.3
—
280
—
—
A
3.0
Note
ADC Current (Note 3),
conversion in progress
ADC Current (Note 3),
conversion in progress
—
280
—
—
A
5.0
D031
—
250
650
—
A
3.0
Op Amp (High-power)
D031
—
250
650
—
A
3.0
Op Amp (High-power)
—
350
850
—
A
5.0
D032
D032
*
†
Note 1:
2:
3:
—
250
600
—
A
1.8
—
300
650
—
A
3.0
—
280
600
—
A
2.3
—
300
650
—
A
3.0
—
310
650
—
A
5.0
Comparator,
CxSP = 0
Comparator,
CxSP = 0
VREGPM = 0
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
The peripheral current is the sum of the base IPD and the additional current consumed when this peripheral is enabled.
The peripheral  current can be determined by subtracting the base IDD or IPD current from this limit. Max values should
be used when calculating total current consumption.
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS.
ADC clock source is FRC.
DS40001726C-page 392
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 34-4:
I/O PORTS
Standard Operating Conditions (unless otherwise stated)
Param
No.
Sym.
VIL
Characteristic
Min.
Typ†
Max.
Units
—
—
with Schmitt Trigger buffer
with I2C levels
Conditions
—
0.8
V
4.5V  VDD  5.5V
—
0.15 VDD
V
1.8V  VDD  4.5V
—
—
0.2 VDD
V
2.0V  VDD  5.5V
—
—
0.3 VDD
V
Input Low Voltage
I/O PORT:
D034
with TTL buffer
D034A
D035
—
—
0.8
V
2.7V  VDD  5.5V
D036
MCLR, OSC1 (EXTRC mode)
—
—
0.2 VDD
V
(Note 1)
D036A
OSC1 (HS mode)
—
—
0.3 VDD
V
with SMBus levels
VIH
Input High Voltage
I/O ports:
D040
2.0
—
—
V
4.5V  VDD 5.5V
0.25 VDD +
0.8
—
—
V
1.8V  VDD  4.5V
with Schmitt Trigger buffer
0.8 VDD
—
—
V
2.0V  VDD  5.5V
with I2C levels
0.7 VDD
—
—
V
with TTL buffer
D040A
D041
with SMBus levels
D042
MCLR
2.1
—
—
V
0.8 VDD
—
—
V
2.7V  VDD  5.5V
D043A
OSC1 (HS mode)
0.7 VDD
—
—
V
D043B
OSC1 (EXTRC oscillator)
0.9 VDD
—
—
V
VDD  2.0V(Note 1)
—
±5
± 125
nA
VSS  VPIN  VDD,
Pin at high-impedance, 85°C
—
±5
± 1000
nA
VSS  VPIN  VDD,
Pin at high-impedance, 125°C
—
±5
± 200
nA
VSS  VPIN  VDD,
Pin at high-impedance, 85°C
25
100
200
A
VDD = 3.3V, VPIN = VSS
25
140
300
A
VDD = 5.0V, VPIN = VSS
—
—
0.6
V
IOL = 8mA, VDD = 5V
IOL = 6mA, VDD = 3.3V
IOL = 1.8mA, VDD = 1.8V
VDD - 0.7
—
—
V
IOH = 3.5mA, VDD = 5V
IOH = 3mA, VDD = 3.3V
IOH = 1mA, VDD = 1.8V
—
—
15
pF
—
—
50
pF
IIL
D060
Input Leakage Current(2)
I/O Ports
MCLR(3)
D061
IPUR
Weak Pull-up Current
D070*
VOL
D080
Output Low Voltage(4)
I/O ports
VOH
D090
Output High Voltage(4)
I/O ports
Capacitive Loading Specs on Output Pins
D101*
COSC2 OSC2 pin
D101A* CIO
*
†
Note 1:
2:
3:
4:
All I/O pins
In XT, HS and LP modes when
external clock is used to drive
OSC1
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an
external clock in EXTRC mode.
Negative current is defined as current sourced by the pin.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
Including OSC2 in CLKOUT mode.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 393
PIC16(L)F1713/6
TABLE 34-5:
MEMORY PROGRAMMING SPECIFICATIONS
Standard Operating Conditions (unless otherwise stated)
Param
No.
Sym.
Characteristic
Min.
Typ†
Max.
Units
Conditions
Program Memory
Programming Specifications
D110
VIHH
Voltage on MCLR/VPP pin
8.0
—
9.0
V
D111
IDDP
Supply Current during
Programming
—
—
10
mA
D112
VBE
VDD for Bulk Erase
2.7
—
VDDMA
V
(Note 2)
X
D113
VPEW
VDD for Write or Row Erase
VDDMIN
—
VDDMA
V
X
D114
IPPPGM Current on MCLR/VPP during
Erase/Write
—
1.0
—
mA
D115
IDDPGM Current on VDD during
Erase/Write
—
5.0
—
mA
10K
—
—
E/W
VDDMIN
—
VDDMA
V
Program Flash Memory
D121
EP
Cell Endurance
D122
VPRW
VDD for Read/Write
-40C  TA  +85C
(Note 1)
X
D123
TIW
Self-timed Write Cycle Time
—
2
2.5
ms
D124
TRETD
Characteristic Retention
—
40
—
Year
Provided no other
specifications are violated
D125
EHEFC
High-Endurance Flash Cell
100K
—
—
E/W
-0C  TA  +60°C, Lower
byte last 128 addresses
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Self-write and Block Erase.
2: Required only if single-supply programming is disabled.
DS40001726C-page 394
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 34-6:
THERMAL CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Param
No.
TH01
TH02
TH03
TH04
TH05
Sym.
Characteristic
Typ.
Units
JA
Thermal Resistance Junction to Ambient
60
C/W
28-pin SPDIP package
80
C/W
28-pin SOIC package
90
C/W
28-pin SSOP package
36
C/W
28-pin QFN 6x6x0.9 mm package
48
C/W
28-pin 4x4x0.5 UQFN package
31.4
C/W
28-pin SPDIP package
24
C/W
28-pin SOIC package
24
C/W
28-pin SSOP package
6
C/W
28-pin QFN 6x6x0.9 mm package
28-pin 4x4x0.5 mm UQFN package
JC
TJMAX
PD
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
PINTERNAL Internal Power Dissipation
Conditions
12
C/W
150
C
—
W
PD = PINTERNAL + PI/O
—
W
PINTERNAL = IDD x VDD(1)
TH06
PI/O
I/O Power Dissipation
—
W
PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07
PDER
Derated Power
—
W
PDER = PDMAX (TJ - TA)/JA(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature, TJ = Junction Temperature
 2013-2016 Microchip Technology Inc.
DS40001726C-page 395
PIC16(L)F1713/6
34.4
AC Characteristics
Timing Parameter Symbology has been created with one of the following formats:
1. TppS2ppS
2. TppS
T
F
Frequency
Lowercase letters (pp) and their meanings:
pp
cc
CCP1
ck
CLKOUT
cs
CS
di
SDI
do
SDO
dt
Data in
io
I/O PORT
mc
MCLR
Uppercase letters and their meanings:
S
F
Fall
H
High
I
Invalid (High-impedance)
L
Low
FIGURE 34-4:
T
Time
osc
rd
rw
sc
ss
t0
t1
wr
OSC1
RD
RD or WR
SCK
SS
T0CKI
T1CKI
WR
P
R
V
Z
Period
Rise
Valid
High-impedance
LOAD CONDITIONS
Load Condition
Pin
CL
VSS
Legend: CL = 50 pF for all pins
DS40001726C-page 396
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 34-5:
CLOCK TIMING
Q4
Q1
Q2
Q3
Q4
Q1
CLKIN
OS12
OS02
OS11
OS03
CLKOUT
(CLKOUT Mode)
Note
1:
See Table 34-10.
TABLE 34-7:
CLOCK OSCILLATOR TIMING REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Param
No.
OS01
Sym.
FOSC
Characteristic
External CLKIN Frequency(1)
Oscillator Frequency(1)
OS02
TOSC
External CLKIN Period(1)
Oscillator Period(1)
OS03
TCY
Instruction Cycle Time(1)
OS04*
TosH,
TosL
External CLKIN High,
External CLKIN Low
TosR,
TosF
External CLKIN Rise,
External CLKIN Fall
OS05*
Min.
Typ†
Max.
Units
Conditions
DC
—
0.5
MHz
External Clock (ECL)
DC
—
4
MHz
External Clock (ECM)
DC
—
20
MHz
External Clock (ECH)
—
32.768
—
kHz
LP Oscillator
0.1
—
4
MHz
XT Oscillator
1
—
4
MHz
HS Oscillator
1
—
20
MHz
HS Oscillator, VDD > 2.7V
DC
—
4
MHz
EXTRC, VDD > 2.0V
27
—

s
LP Oscillator
250
—

ns
XT Oscillator
50
—

ns
HS Oscillator
50
—

ns
External Clock (EC)
—
30.5
—
s
LP Oscillator
250
—
10,000
ns
XT Oscillator
50
—
1,000
ns
HS Oscillator
250
—
—
ns
EXTRC
125
TCY
DC
ns
TCY = 4/FOSC
2
—
—
s
LP Oscillator
100
—
—
ns
XT Oscillator
20
—
—
ns
HS Oscillator
0
—

ns
LP Oscillator
0
—

ns
XT Oscillator
0
—

ns
HS Oscillator
*
†
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current
consumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an
external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 397
PIC16(L)F1713/6
TABLE 34-8:
OSCILLATOR PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Param
No.
Sym.
Characteristic
Freq.
Tolerance
Min.
Typ†
Max.
Units
Conditions
OS08
HFOSC
Internal Calibrated HFINTOSC
Frequency(1)
±2%
—
16.0
—
MHz
VDD = 3.0V, TA = 25°C,
(Note 2)
OS08A
MFOSC
Internal Calibrated MFINTOSC
Frequency(1)
±2%
—
500
—
kHz
VDD = 3.0V, TA = 25°C,
(Note 2)
OS09
LFOSC
Internal LFINTOSC Frequency
—
—
31
—
kHz
-40°C  TA  +125°C
(Note 3)
OS10*
TWARM
HFINTOSC
Wake-up from Sleep Start-up
Time
—
—
3.2
8
s
MFINTOSC
Wake-up from Sleep Start-up
Time
—
—
24
35
s
LFINTOSC
Wake-up from Sleep Start-up
Time
—
—
0.5
—
ms
*
†
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
2: See Figure 34-6.
3: See Figure 35-57: LFINTOSC Frequency, PIC16LF1713/6 Only., and
Figure 35-58: LFINTOSC Frequency, PIC16F1713/6 Only.
FIGURE 34-6:
HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE
125
± 5%
85
Temperature (°C)
± 3%
60
± 2%
25
0
-20
-40
1.8
± 5%
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VDD (V)
DS40001726C-page 398
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 34-9:
PLL CLOCK TIMING SPECIFICATIONS
Standard Operating Conditions (unless otherwise stated)
Param
No.
Sym.
F10
Characteristic
Min.
Typ†
Max.
Units
FOSC Oscillator Frequency Range
4
—
8
MHz
F11
FSYS
On-Chip VCO System Frequency
16
—
32
MHz
F12
TRC
PLL Start-up Time (Lock Time)
F13*
CLK
CLKOUT Stability (Jitter)
—
—
2
ms
-0.25%
—
+0.25%
%
Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 399
PIC16(L)F1713/6
FIGURE 34-7:
CLKOUT AND I/O TIMING
Cycle
Write
Fetch
Q1
Q4
Read
Execute
Q2
Q3
FOSC
OS12
OS11
OS20
OS21
CLKOUT
OS19
OS18
OS16
OS13
OS17
I/O pin
(Input)
OS14
OS15
I/O pin
(Output)
New Value
Old Value
OS18, OS19
TABLE 34-10: CLKOUT AND I/O TIMING PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Param
No.
Sym.
Characteristic
Min.
Typ†
Max.
Units
Conditions
OS11
TosH2ckL
FOSC to CLKOUT (1)
—
—
70
ns
3.3V  VDD 5.0V
OS12
TosH2ckH
FOSC to CLKOUT (1)
—
—
72
ns
3.3V  VDD 5.0V
ns
OS13
TckL2ioV
CLKOUT to Port out valid
OS14
TioV2ckH
Port input valid before CLKOUT(1)
OS15
TosH2ioV
OS16
(1)
—
—
20
TOSC + 200 ns
—
—
ns
Fosc (Q1 cycle) to Port out valid
—
50
70*
ns
3.3V  VDD 5.0V
TosH2ioI
Fosc (Q2 cycle) to Port input invalid
(I/O in hold time)
50
—
—
ns
3.3V  VDD 5.0V
OS17
TioV2osH
Port input valid to Fosc(Q2 cycle)
(I/O in setup time)
20
—
—
ns
OS18*
TioR
Port output rise time(2)
—
—
40
15
72
32
ns
VDD = 1.8V
3.3V  VDD 5.0V
OS19*
TioF
Port output fall time(2)
—
—
28
15
55
30
ns
VDD = 1.8V
3.3V  VDD 5.0V
OS20*
Tinp
INT pin input high or low time
25
—
—
ns
OS21*
Tioc
Interrupt-on-change new input level time
25
—
—
ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25C unless otherwise stated.
Note 1: Measurements are taken in EXTRC mode where CLKOUT output is 4 x TOSC.
2: Slew rate limited.
DS40001726C-page 400
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 34-8:
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
VDD
MCLR
30
Internal
POR
PWRT
Time-out
33
32
OSC
Start-up Time
Internal Reset(1)
Watchdog Timer
Reset(1)
34
31
34
I/O pins
Note 1: Asserted low.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 401
PIC16(L)F1713/6
TABLE 34-11: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS(2)
Standard Operating Conditions (unless otherwise stated)
Param
No.
Sym.
Characteristic
Min.
Typ†
Max.
Units
2
—
—
s
10
16
27
ms
Conditions
30
TMCL
31
TWDTLP Low-Power Watchdog Timer
Time-out Period
32
TOST
Oscillator Start-up Timer Period(1)
—
1024
—
Tosc
33*
TPWRT
Power-up Timer Period, PWRTE = 0
40
65
140
ms
34*
TIOZ
I/O high-impedance from MCLR Low
or Watchdog Timer Reset
—
—
2.0
s
35
VBOR
Brown-out Reset Voltage
2.55
2.70
2.85
V
BORV = 0
2.30
1.80
2.45
1.90
2.60
2.10
V
V
BORV = 1 (PIC16F1713/6)
BORV = 1 (PIC16LF1713/6)
1.8
2.1
2.5
V
LPBOR = 1
0
25
75
mV
-40°C  TA  +85°C
1
3
35
s
VDD  VBOR
MCLR Pulse Width (low)
35A
VLPBOR Low-Power Brown-out
36*
VHYST
37*
TBORDC Brown-out Reset DC Response
Time
Brown-out Reset Hysteresis
VDD = 3.3V-5V
1:512 Prescaler used
*
†
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: By design, the Oscillator Start-up Timer (OST) counts the first 1024 cycles, independent of frequency.
2: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
DS40001726C-page 402
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 34-9:
TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
T0CKI
40
41
42
T1CKI
45
46
49
47
TMR0 or
TMR1
FIGURE 34-10:
BROWN-OUT RESET TIMING AND CHARACTERISTICS
VDD
VBOR and VHYST
VBOR
(Device in Brown-out Reset)
(Device not in Brown-out Reset)
37
Reset
(due to BOR)
33(1)
Note 1: 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’.
2 ms delay if PWRTE = 0.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 403
PIC16(L)F1713/6
TABLE 34-12: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No.
40*
Sym.
TT0H
Characteristic
T0CKI High Pulse Width
Min.
No Prescaler
With Prescaler
41*
TT0L
T0CKI Low Pulse Width
No Prescaler
With Prescaler
Typ†
Max.
Units
0.5 TCY + 20
—
—
ns
10
—
—
ns
0.5 TCY + 20
—
—
ns
10
—
—
ns
Greater of:
20 or TCY + 40
*N
—
—
ns
42*
TT0P
T0CKI Period
45*
TT1H
T1CKI High Synchronous, No Prescaler
Time
Synchronous, with Prescaler
0.5 TCY + 20
—
—
ns
15
—
—
ns
Asynchronous
30
—
—
ns
Synchronous, No Prescaler
0.5 TCY + 20
—
—
ns
Synchronous, with Prescaler
15
—
—
ns
Asynchronous
30
—
—
ns
Greater of:
30 or TCY + 40
*N
—
—
ns
46*
TT1L
T1CKI Low
Time
47*
TT1P
T1CKI Input Synchronous
Period
48
FT1
Secondary Oscillator Input Frequency Range
(oscillator enabled by setting bit T1OSCEN)
49*
TCKEZTMR1 Delay from External Clock Edge to Timer
Increment
Asynchronous
*
†
60
—
—
ns
32.4
32.768
33.1
kHz
2 TOSC
—
7 TOSC
—
Conditions
N = prescale value
N = prescale value
Timers in Sync
mode
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
DS40001726C-page 404
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 34-11:
CAPTURE/COMPARE/PWM TIMINGS (CCP)
CCPx
(Capture mode)
CC01
CC02
CC03
Note:
Refer to Figure 34-4 for load conditions.
TABLE 34-13: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP)
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C  TA  +125°C
Param
Sym.
No.
Characteristic
CC01* TccL
CCPx Input Low Time
No Prescaler
CC02* TccH
CCPx Input High Time
No Prescaler
CC03* TccP
CCPx Input Period
With Prescaler
With Prescaler
*
†
Min.
Typ†
Max.
Units
0.5TCY + 20
—
—
ns
20
—
—
ns
0.5TCY + 20
—
—
ns
20
—
—
ns
3TCY + 40
*N
—
—
ns
Conditions
N = prescale value
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 405
PIC16(L)F1713/6
FIGURE 34-12:
CLC PROPAGATION TIMING
CLCxINn
CLC
Input time
CLCxINn
CLC
Input time
LCx_in[n](1)
LCx_in[n](1)
CLC01
Note 1:
CLC
Module
LCx_out(1)
CLC
Output time
CLCx
CLC
Module
LCx_out(1)
CLC
Output time
CLCx
CLC02
CLC03
See Figure 19-1 to identify specific CLC signals.
TABLE 34-14: CONFIGURATION LOGIC CELL (CLC) CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param.
No.
Sym.
Characteristic
Min.
Typ†
Max.
Units
Conditions
CLC01* TCLCIN
CLC input time
—
7
OS17
ns
(Note 1)
CLC02* TCLC
CLC module input to output progagation time
—
—
24
12
—
—
ns
ns
VDD = 1.8V
VDD > 3.6V
—
OS18
—
—
(Note 1)
—
OS19
—
—
(Note 1)
—
45
—
MHz
CLC03* TCLCOUT CLC output time
Rise Time
Fall Time
CLC04* FCLCMAX CLC maximum switching frequency
*
†
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: See Table 34-10 for OS17, OS18 and OS19 rise and fall times.
DS40001726C-page 406
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 34-15:
ANALOG-TO-DIGITAL CONVERTER (ADC) CHARACTERISTICS(1,2,3,4):
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA = 25°C, Single-ended, 2 s TAD, VREF+ = 3V, VREF- = VSS
Param
Sym.
No.
Characteristic
Min.
Typ†
Max.
Units
Conditions
AD01
NR
Resolution
—
—
10
AD02
EIL
Integral Error
—
—
±1.7
AD03
EDL
Differential Error
—
—
±1
AD04
EOFF Offset Error
—
—
±2.5
LSb VREF = 3.0V
AD05
EGN
Gain Error
—
—
±2.0
LSb VREF = 3.0V
AD06
VREF Reference Voltage
1.8
—
VDD
VSS
—
VREF
V
—
—
10
k
AD07
VAIN
Full-Scale Range
AD08
ZAIN
Recommended Impedance of
Analog Voltage Source
*
†
Note 1:
2:
3:
4:
bit
LSb VREF = 3.0V
LSb No missing codes, VREF = 3.0V
V
VREF = (VREF+ minus VREF-)
Can go higher if external 0.01 F capacitor is
present on input pin.
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Total Absolute Error includes integral, differential, offset and gain errors.
The ADC conversion result never decreases with an increase in the input voltage and has no missing codes.
ADC VREF is from external VREF+ pin, VDD pin or FVR, whichever is selected as reference input.
See Section 35.0 “DC and AC Characteristics Graphs and Charts” for operating characterization.
TABLE 34-16: ADC CONVERSION REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Param
Sym.
No.
AD130* TAD
AD131 TCNV
Characteristic
Min.
Typ†
Max.
Units
ADC Clock Period (TADC)
1.0
ADC Internal FRC Oscillator Period
(TFRC)
1.0
Conversion Time (not including
Acquisition Time)(1)
—
Conditions
—
9.0
s
FOSC-based
2
6.0
s
ADCS<1:0> = 11 (ADC FRC mode)
11
—
TAD
Set GO/DONE bit to conversion
complete
s
AD132* TACQ Acquisition Time
—
5.0
—
AD133* THCD Holding Capacitor Disconnect Time
—
1/2 TAD
—
ADCS<2:0>  x11 (FOSC based)
—
1/2 TAD + 1TCY
—
ADCS<2:0> = x11 (FRC based)
*
†
These parameters are characterized but not tested.
Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: The ADRES register may be read on the following TCY cycle.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 407
PIC16(L)F1713/6
FIGURE 34-13:
ADC CONVERSION TIMING (ADC CLOCK FOSC-BASED)
BSF ADCON0, GO
AD133
1 TCY
AD131
Q4
AD130
ADC_clk
9
ADC Data
8
7
6
3
2
1
0
NEW_DATA
OLD_DATA
ADRES
1 TCY
ADIF
GO
Sample
DONE
Sampling Stopped
AD132
FIGURE 34-14:
ADC CONVERSION TIMING (ADC CLOCK FROM FRC)
BSF ADCON0, GO
AD133
1 TCY
AD131
Q4
AD130
ADC_clk
9
ADC Data
8
7
6
OLD_DATA
ADRES
2
1
0
NEW_DATA
1 TCY
ADIF
GO
Sample
3
DONE
AD132
Sampling Stopped
Note 1: If the ADC clock source is selected as FRC, a time of TCY is added before the ADC clock starts. This allows the
SLEEP instruction to be executed.
DS40001726C-page 408
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
TABLE 34-17: OPERATIONAL AMPLIFIER (OPA)
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA = 25°C, OPAxSP = 1 (High GBWP mode)
Param
No.
Symbol
OPA01*
GBWP
Parameters
Min.
Typ.
Max.
Units
Gain Bandwidth Product
—
3.5
—
MHz
OPA02*
TON
Turn on Time
—
10
—
s
OPA03*
PM
Phase Margin
—
40
—
degrees
OPA04*
SR
Slew Rate
—
3
—
V/s
OPA05
OFF
Offset
—
±3
±9
mV
OPA06
CMRR
Common Mode Rejection Ratio
52
70
—
dB
OPA07*
AOL
Open Loop Gain
—
90
—
dB
OPA08
VICM
Input Common Mode Voltage
0
—
VDD
V
OPA09*
PSRR
Power Supply Rejection Ratio
—
80
—
dB
*
Conditions
VDD > 2.5V
These parameters are characterized but not tested.
TABLE 34-18: COMPARATOR SPECIFICATIONS
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA = 25°C
See Section 35.0 “DC and AC Characteristics Graphs and Charts” for operating characterization.
Param
No.
Sym.
Characteristics
Min.
Typ.
Max.
Units
Comments
CM01
VIOFF
Input Offset Voltage
—
±2.5
±5
mV
CM02
VICM
Input Common Mode Voltage
0
—
VDD
V
CM03
CMRR
Common Mode Rejection Ratio
40
50
—
dB
Response Time Rising Edge
—
60
85
ns
CxSP = 1
CM04A
CM04B
CM04C
TRESP(1)
CM04D
CxSP = 1,
VICM = VDD/2
Response Time Falling Edge
—
60
90
ns
CxSP = 1
Response Time Rising Edge
—
85
—
ns
CxSP = 0
Response Time Falling Edge
—
85
—
ns
CxSP = 0
Comparator Mode Change to
Output Valid*
—
—
10
s
20
45
75
mV
CM05*
TMC2OV
CM06
CHYSTER Comparator Hysteresis
*
Note 1:
These parameters are characterized but not tested.
Response time measured with one comparator input at VDD/2, while the other input transitions from VSS to
VDD.
 2013-2016 Microchip Technology Inc.
CxHYS = 1,
CxSP = 1
DS40001726C-page 409
PIC16(L)F1713/6
TABLE 34-19: 8-BIT DIGITAL-TO-ANALOG CONVERTER (DAC1) SPECIFICATIONS
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA = 25°C
See Section 35.0 “DC and AC Characteristics Graphs and Charts” for operating characterization.
Param
No.
Sym.
Characteristics
Min.
Typ.
Max.
Units
—
VDD/256
—
V
DAC01*
CLSB
Step Size
DAC02*
CACC
Absolute Accuracy
—
—
 1.5
LSb
DAC03*
CR
Unit Resistor Value (R)
—
600
—

—
—
10
s
DAC04*
*
Note 1:
CST
Settling Time
(1)
Comments
These parameters are characterized but not tested.
Settling time measured while DACR<7:0> transitions from ‘0x00’ to ‘0xFF’.
TABLE 34-20: 5-BIT DIGITAL-TO-ANALOG CONVERTER (DAC2) SPECIFICATIONS
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA = 25°C
See Section 35.0 “DC and AC Characteristics Graphs and Charts” for operating characterization.
Param
No.
Sym.
Characteristics
Min.
Typ.
Max.
Units
DAC05*
CLSB
Step Size
—
VDD/32
—
V
DAC06*
CACC
Absolute Accuracy
—
—
 0.5
LSb
DAC07*
CR
Unit Resistor Value (R)
—
6000
—

DAC08*
CST
Settling Time(1)
—
—
10
s
*
Note 1:
Comments
These parameters are characterized but not tested.
Settling time measured while DACR<7:0> transitions from ‘0x00’ to ‘0xFF’.
TABLE 34-21: ZERO CROSS PIN SPECIFICATIONS
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA = 25°C
Param.
No.
Sym.
Characteristics
Min.
Typ.
Max.
Units
ZC01
ZCPINV
Voltage on Zero Cross Pin
—
0.75
—
V
ZC02
ZCSRC
Source current
—
600
—
A
ZC03
ZCSNK
Sink current
—
600
—
A
ZC04
ZCISW
Response Time Rising Edge
—
1
—
s
Response Time Falling Edge
—
1
—
s
ZC05
ZCOUT
Response Time Rising Edge
—
1
—
s
Response Time Falling Edge
—
1
—
s
*
Comments
These parameters are characterized but not tested.
DS40001726C-page 410
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 34-15:
USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
CK
US121
US121
DT
US122
US120
Note:
Refer to Figure 34-4 for load conditions.
TABLE 34-22: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Symbol
US120
TCKH2DTV
US121
US122
TCKRF
TDTRF
FIGURE 34-16:
Characteristic
Min.
Max.
Units
Conditions
SYNC XMIT (Master and Slave)
Clock high to data-out valid
—
80
ns
3.0V  VDD  5.5V
—
100
ns
1.8V  VDD  5.5V
Clock out rise time and fall time
(Master mode)
—
45
ns
3.0V  VDD  5.5V
—
50
ns
1.8V  VDD  5.5V
Data-out rise time and fall time
—
45
ns
3.0V  VDD  5.5V
—
50
ns
1.8V  VDD  5.5V
USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
CK
US125
DT
US126
Note: Refer to Figure 34-4 for load conditions.
TABLE 34-23: USART SYNCHRONOUS RECEIVE REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Symbol
Characteristic
US125 TDTV2CKL SYNC RCV (Master and Slave)
Data-setup before CK  (DT hold time)
US126 TCKL2DTL
Data-hold after CK  (DT hold time)
 2013-2016 Microchip Technology Inc.
Min.
Max.
Units
10
—
ns
15
—
ns
Conditions
DS40001726C-page 411
PIC16(L)F1713/6
FIGURE 34-17:
SPI MASTER MODE TIMING (CKE = 0, SMP = 0)
SS
SP81
SCK
(CKP = 0)
SP71
SP72
SP78
SP79
SP79
SP78
SCK
(CKP = 1)
SP80
bit 6 - - - - - -1
MSb
SDO
LSb
SP75, SP76
SDI
MSb In
bit 6 - - - -1
LSb In
SP74
SP73
Note: Refer to Figure 34-4 for load conditions.
FIGURE 34-18:
SPI MASTER MODE TIMING (CKE = 1, SMP = 1)
SS
SP81
SCK
(CKP = 0)
SP71
SP72
SP79
SP73
SCK
(CKP = 1)
SP80
SDO
MSb
bit 6 - - - - - -1
SP78
LSb
SP75, SP76
SDI
MSb In
bit 6 - - - -1
LSb In
SP74
Note: Refer to Figure 34-4 for load conditions.
DS40001726C-page 412
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 34-19:
SPI SLAVE MODE TIMING (CKE = 0)
SS
SP70
SCK
(CKP = 0)
SP83
SP71
SP72
SP78
SP79
SP79
SP78
SCK
(CKP = 1)
SP80
MSb
SDO
LSb
bit 6 - - - - - -1
SP77
SP75, SP76
SDI
MSb In
bit 6 - - - -1
LSb In
SP74
SP73
Note: Refer to Figure 34-4 for load conditions.
FIGURE 34-20:
SS
SPI SLAVE MODE TIMING (CKE = 1)
SP82
SP70
SP83
SCK
(CKP = 0)
SP71
SP72
SCK
(CKP = 1)
SP80
SDO
MSb
bit 6 - - - - - -1
LSb
SP77
SP75, SP76
SDI
MSb In
bit 6 - - - -1
LSb In
SP74
Note: Refer to Figure 34-4 for load conditions.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 413
PIC16(L)F1713/6
TABLE 34-24: SPI MODE REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Param
No.
Symbol
Characteristic
Min.
Typ†
Max. Units
2.25 TCY
—
—
ns
SP70* TSSL2SCH,
TSSL2SCL
SS to SCK or SCK input
SP71* TSCH
SCK input high time (Slave mode)
TCY + 20
—
—
ns
SCK input low time (Slave mode)
TCY + 20
—
—
ns
SP72*
TSCL
Conditions
SP73* TDIV2SCH,
TDIV2SCL
Setup time of SDI data input to SCK
edge
100
—
—
ns
SP74* TSCH2DIL,
TSCL2DIL
Hold time of SDI data input to SCK
edge
100
—
—
ns
SP75* TDOR
SDO data output rise time
—
10
25
ns
3.0V  VDD  5.5V
—
25
50
ns
1.8V  VDD  5.5V
SP76* TDOF
SDO data output fall time
—
10
25
ns
SP77* TSSH2DOZ
SS to SDO output high-impedance
10
—
50
ns
SP78* TSCR
SCK output rise time
(Master mode)
—
10
25
ns
3.0V  VDD  5.5V
—
25
50
ns
1.8V  VDD  5.5V
SP79* TSCF
SCK output fall time (Master mode)
—
10
25
ns
SP80* TSCH2DOV,
TSCL2DOV
SDO data output valid after SCK
edge
—
—
50
ns
3.0V  VDD  5.5V
1.8V  VDD  5.5V
SP81* TDOV2SCH, SDO data output setup to SCK edge
TDOV2SCL
SP82* TSSL2DOV
SDO data output valid after SS
edge
SP83* TSCH2SSH,
TSCL2SSH
SS after SCK edge
—
—
145
ns
1 Tcy
—
—
ns
—
—
50
ns
1.5 TCY + 40
—
—
ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
DS40001726C-page 414
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
FIGURE 34-21:
I2C BUS START/STOP BITS TIMING
SCL
SP93
SP91
SP90
SP92
SDA
Stop
Condition
Start
Condition
Note: Refer to Figure 34-4 for load conditions.
TABLE 34-25: I2C BUS START/STOP BITS REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Param
No.
Symbol
Characteristic
SP90*
TSU:STA
Start condition
SP91*
THD:STA
SP92*
TSU:STO
SP93
THD:STO Stop condition
Typ
4700
—
Max. Units
—
Setup time
400 kHz mode
600
—
—
Start condition
100 kHz mode
4000
—
—
Hold time
400 kHz mode
600
—
—
Stop condition
100 kHz mode
4700
—
—
Setup time
Hold time
*
100 kHz mode
Min.
400 kHz mode
600
—
—
100 kHz mode
4000
—
—
400 kHz mode
600
—
—
Conditions
ns
Only relevant for Repeated
Start condition
ns
After this period, the first
clock pulse is generated
ns
ns
These parameters are characterized but not tested.
FIGURE 34-22:
I2C BUS DATA TIMING
SP103
SCL
SP100
SP90
SP102
SP101
SP106
SP107
SP91
SDA
In
SP92
SP110
SP109
SP109
SDA
Out
Note: Refer to Figure 34-4 for load conditions.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 415
PIC16(L)F1713/6
TABLE 34-26: I2C BUS DATA REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Param.
No.
Symbol
SP100* THIGH
Characteristic
Clock high time
Min.
Max.
Units
100 kHz mode
4.0
—
s
Device must operate at a
minimum of 1.5 MHz
400 kHz mode
0.6
—
s
Device must operate at a
minimum of 10 MHz
1.5TCY
—
100 kHz mode
4.7
—
s
Device must operate at a
minimum of 1.5 MHz
400 kHz mode
1.3
—
s
Device must operate at a
minimum of 10 MHz
1.5TCY
—
SSP module
SP101*
TLOW
Clock low time
SSP module
SP102* TR
SP103* TF
SDA and SCL rise
time
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1CB
300
ns
SDA and SCL fall
time
100 kHz mode
—
250
ns
400 kHz mode
20 + 0.1CB
250
ns
0
—
ns
SP106* THD:DAT
Data input hold time 100 kHz mode
400 kHz mode
0
0.9
s
SP107* TSU:DAT
Data input setup
time
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
SP109* TAA
Output valid from
clock
100 kHz mode
—
3500
ns
400 kHz mode
—
—
ns
SP110*
Bus free time
100 kHz mode
4.7
—
s
400 kHz mode
1.3
—
s
—
400
pF
SP111
*
Note 1:
2:
TBUF
CB
Conditions
Bus capacitive loading
CB is specified to be from
10-400 pF
CB is specified to be from
10-400 pF
(Note 2)
(Note 1)
Time the bus must be free
before a new transmission
can start
These parameters are characterized but not tested.
As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
A Fast mode (400 kHz) I2C bus device can be used in a Standard mode (100 kHz) I2C bus system, but the
requirement TSU:DAT 250 ns must then be met. This will automatically be the case if the device does not
stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it
must output the next data bit to the SDA line TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the
Standard mode I2C bus specification), before the SCL line is released.
DS40001726C-page 416
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
 2013-2016 Microchip Technology Inc.
DS40001726C-page 417
PIC16(L)F1713/6
35.0
DC AND AC
CHARACTERISTICS GRAPHS
AND CHARTS
The graphs and tables provided in this section are for design guidance and are not tested.
In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD
range). This is for information only and devices are ensured to operate properly only within the specified range.
Unless otherwise noted, all graphs apply to both the L and LF devices.
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
“Typical” represents the mean of the distribution at 25C. “Maximum”, “Max.”, “Minimum” or “Min.”
represents (mean + 3) or (mean - 3) respectively, where  is a standard deviation, over each
temperature range.
DS40001726C-page 418
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
28
10
Max: 85°C + 3ı
Typical: 25°C
9
Max.
24
Max.
8
Typical
22
Typical
IDD (µA)
7
IDD (µA)
Max: 85°C + 3ı
Typical: 25°C
26
6
20
18
5
16
4
14
3
12
2
10
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
2.0
2.5
3.0
3.5
VDD (V)
FIGURE 35-1:
IDD, LP Oscillator Mode,
Fosc = 32 kHz, PIC16LF1713/6 Only.
4.5
5.0
5.5
6.0
FIGURE 35-2:
IDD, LP Oscillator Mode,
Fosc = 32 kHz, PIC16F1713/6 Only.
400
400
Typical: 25°C
350
4 MHz XT
4 MHz XT
Max: 85°C + 3ı
350
300
300
250
250
IDD (µA)
IDD (µA)
4.0
VDD (V)
200
150
200
150
1 MHz XT
1 MHz XT
100
100
50
50
0
0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
1.6
1.8
2.0
2.2
2.4
VDD (V)
2.6
2.8
3.0
3.2
3.4
3.6
3.8
VDD (V)
FIGURE 35-3:
IDD Typical, XT and EXTRC
Oscillator, PIC16LF1713/6 Only.
FIGURE 35-4:
IDD Maximum, XT and
EXTRC Oscillator, PIC16LF1713/6 Only.
500
450
4 MHz XT
4 MHz XT
Max: 85°C + 3ı
450
Typical: 25°C
400
400
350
350
300
IDD (µA)
IDD (µA)
300
250
1 MHz XT
200
150
1 MHz XT
250
200
150
100
100
50
50
0
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-5:
IDD Typical, XT and EXTRC
Oscillator, PIC16F1713/6 Only.
DS40001726C-page 419
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-6:
IDD Maximum, XT and
EXTRC Oscillator, PIC16F1713/6 Only.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
12
24
Max: 85°C + 3ı
Typical: 25°C
10
Max.
Max.
20
IDD (µA)
8
IDD (µA)
Max: 85°C + 3ı
Typical: 25°C
22
Typical
6
Typical
18
16
4
14
2
12
0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
10
3.8
2.0
2.5
3.0
3.5
VDD (V)
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-7:
IDD, EC Oscillator LP Mode,
Fosc = 32 kHz, PIC16LF1713/6 Only.
FIGURE 35-8:
IDD, EC Oscillator LP Mode,
Fosc = 32 kHz, PIC16F1713/6 Only.
50
60
45
Max.
40
50
35
45
Max.
Max: 85°C + 3ı
Typical: 25°C
55
Max: 85°C + 3ı
Typical: 25°C
IDD (µA)
IDD (µA)
Typical
Typical
30
40
25
35
20
30
15
25
10
20
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
2.0
2.5
3.0
3.5
VDD (V)
FIGURE 35-9:
IDD, EC Oscillator LP Mode,
Fosc = 500 kHz, PIC16LF1713/6 Only.
4.5
5.0
5.5
6.0
FIGURE 35-10:
IDD, EC Oscillator LP Mode,
Fosc = 500 kHz, PIC16F1713/6 Only.
350
350
Typical: 25°C
4 MHz
Max: 85°C + 3ı
300
300
4 MHz
250
IDD (µA)
250
IDD (µA)
4.0
VDD (V)
200
200
150
150
100
1 MHz
100
1 MHz
50
50
0
0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
VDD (V)
FIGURE 35-11:
IDD Typical, EC Oscillator
MP Mode, PIC16LF1713/6 Only.
 Microchip Technology Inc.
3.8
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
VDD ((V))
FIGURE 35-12:
IDD Maximum, EC Oscillator
MP Mode, PIC16LF1713/6 Only.
DS40001726C-page 420
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
450
400
350
400
Typical: 25°C
Max: 85°C + 3ı
4 MHz
350
300
4 MHz
250
IDD (µA)
IDD (µA)
300
200
1 MHz
250
200
1 MHz
150
150
100
100
50
50
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0
6.0
2.0
2.5
3.0
3.5
4.0
VDD (V)
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-13:
IDD Typical, EC Oscillator
MP Mode, PIC16F1713/6 Only.
FIGURE 35-14:
IDD Maximum, EC Oscillator
MP Mode, PIC16F1713/6 Only.
2.5
3.0
32 MHz
Typical: 25°C
Max: 85°C + 3ı
2.5
2.0
32 MHz
IDD (mA)
IDD (mA)
2.0
1.5
16 MHz
1.5
1.0
16 MHz
1.0
8 MHz
0.5
8 MHz
0.5
0.0
0.0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
1.6
1.8
2.0
2.2
2.4
VDD (V)
2.6
2.8
3.0
3.2
3.4
3.6
3.8
VDD ((V))
FIGURE 35-15:
IDD Typical, EC Oscillator
HP Mode, PIC16LF1713/6 Only.
FIGURE 35-16:
IDD Maximum, EC Oscillator
HP Mode, PIC16LF1713/6 Only.
2.5
2.5
32 MHz
Max: 85°C + 3ı
Typical: 25°C
2.0
32 MHz
2.0
IDD (mA)
IDD (mA)
1.5
16 MHz
1.0
1.5
16 MHz
1.0
8 MHz
8 MHz
0.5
0.5
0.0
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VDD (V)
FIGURE 35-17:
IDD Typical, EC Oscillator
HP Mode, PIC16F1713/6 Only.
DS40001726C-page 421
6.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-18:
IDD Maximum, EC Oscillator
HP Mode, PIC16F1713/6 Only.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
9
24
Max.
8
Max.
Max: 85°C + 3ı
Typical: 25°C
22
7
IDD (µA)
IDD (µA)
20
Typical
6
5
4
Typical
18
16
3
14
2
12
1
0
Max: 85°C + 3ı
Typical: 25°C
10
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
2.0
2.5
3.0
3.5
VDD (V)
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-19:
IDD, LFINTOSC Mode,
Fosc = 31 kHz, PIC16LF1713/6 Only.
FIGURE 35-20:
IDD, LFINTOSC Mode,
Fosc = 31 kHz, PIC16F1713/6 Only.
180
260
Max.
Max: 85°C + 3ı
Typical: 25°C
170
Max: 85°C + 3ı
Typical: 25°C
240
Typical
Max.
160
220
200
IDD (µA)
IDD (µA)
150
Typical
140
180
130
160
120
140
110
120
100
100
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
2.0
2.5
3.0
3.5
VDD (V)
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-21:
IDD, MFINTOSC Mode,
Fosc = 500 kHz, PIC16LF1713/6 Only.
FIGURE 35-22:
IDD, MFINTOSC Mode,
Fosc = 500 kHz, PIC16F1713/6 Only.
1.6
1.6
16 MHz
16 MHz
Typical: 25°C
1.4
1.2
1.2
1.0
IDD (mA)
IDD (mA)
Max: 85°C + 3ı
1.4
8 MHz
0.8
8 MHz
1.0
0.8
4 MHz
4 MHz
0.6
0.6
2 MHz
0.4
2 MHz
0.4
1 MHz
1 MHz
0.2
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
VDD (V)
FIGURE 35-23:
IDD Typical, HFINTOSC
Mode, PIC16LF1713/6 Only.
 Microchip Technology Inc.
3.8
0.2
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
VDD (V)
FIGURE 35-24:
IDD Maximum, HFINTOSC
Mode, PIC16LF1713/6 Only.
DS40001726C-page 422
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
1.6
1.6
16 MHz
16 MHz
Typical: 25°C
1.4
1.2
1.2
1.0
8 MHz
0.8
IDD (mA)
IDD (mA)
Max: 85°C + 3ı
1.4
4 MHz
2 MHz
0.6
0.8
4 MHz
2 MHz
0.6
1 MHz
0.4
8 MHz
1.0
1 MHz
0.4
0.2
0.2
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
2.0
2.5
3.0
3.5
4.0
VDD (V)
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-25:
IDD Typical, HFINTOSC
Mode, PIC16F1713/6 Only.
FIGURE 35-26:
IDD Maximum, HFINTOSC
Mode, PIC16F1713/6 Only.
2.0
2.0
1.8
Max: 85°C + 3ı
1.8
Typical: 25°C
20 MHz
1.6
1.6
20 MHz
1.4
1.4
16 MHz
IDD (mA)
IDD (mA)
1.2
16 MHz
1.2
1.0
0.8
0.8
8 MHz
0.6
8 MHz
0.6
1.0
0.4
0.4
4 MHz
4 MHz
0.2
0.2
0.0
0.0
2.4
2.6
2.8
3.0
3.2
3.4
3.6
2.4
3.8
2.6
2.8
3.0
3.2
3.4
3.6
3.8
VDD (V)
VDD (V)
FIGURE 35-27:
IDD Typical, HS Oscillator,
25°C, PIC16LF1713/6 Only.
FIGURE 35-28:
IDD Maximum, HS Oscillator,
PIC16LF1713/6 Only.
2.2
2.0
Typical: 25°C
1.8
20 MHz
Max: 85°C + 3ı
2.0
20 MHz
1.8
1.6
16 MHz
1.4
1.6
1.2
1.4
IDD (mA)
IDD (mA)
16 MHz
1.0
8 MHz
0.8
1.2
1.0
8 MHz
0.8
0.6
4 MHz
0.4
0.6
0.2
0.4
0.0
0.2
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-29:
IDD Typical, HS Oscillator,
25°C, PIC16F1713/6 Only.
DS40001726C-page 423
4 MHz
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-30:
IDD Maximum, HS Oscillator,
PIC16F1713/6 Only.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
3.0
3.5
Max.
2.5
3.0
Max.
Typical
2.5
IDD (mA)
IDD (mA)
2.0
1.5
1.0
Typical
2.0
1.5
Typical: 25°C
Max: 85°C + 3ı
Typical: 25°C
Max: 85°C + 3ı
0.5
1.0
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
2.0
2.5
3.0
3.5
4.0
VDD (V)
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-31:
IDD, HS Oscillator, 32 MHz
(8 MHz + 4x PLL), PIC16LF1713/6 Only.
FIGURE 35-32:
IDD, HS Oscillator, 32 MHz
(8 MHz + 4x PLL), PIC16F1713/6 Only.
450
1.2
Max.
400
Max.
1.0
350
0.8
IPD (µA)
IDD (nA)
300
250
Max: 85°C + 3ı
Typical: 25°C
200
150
Max: 85°C + 3ı
T i l 25°C
Typical:
0.6
0.4
Typical
00
100
0.2
50
Typical
0
0.0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
2.0
2.5
3.0
3.5
4.0
FIGURE 35-33:
IPD Base, LP Sleep Mode,
PIC16LF1713/6 Only.
5.0
5.5
6.0
FIGURE 35-34:
IPD Base, LP Sleep Mode
(VREGPM = 1), PIC16F1713/6 Only.
2.5
3.0
Max: 85°C + 3ı
Typical: 25°C
2.5
Max: 85°C + 3ı
Typical: 25°C
2.0
Max.
Max.
IPD (µA)
2.0
IPD (µA)
µA)
4.5
VDD (V)
VDD (V)
1.5
15
1.5
1.0
1.0
Typical
Typical
0.5
0.5
0.0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
0.0
1.5
VDD (V)
FIGURE 35-35:
IPD, Watchdog Timer (WDT),
PIC16LF1713/6 Only.
 Microchip Technology Inc.
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-36:
IPD, Watchdog Timer (WDT),
PIC16F1713/6 Only.
DS40001726C-page 424
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
35
35
Max: 85°C + 3
M
3ı
Typical: 25°C
30
Max.
30
Max.
IDD (nA)
IDD (nA)
25
20
25
Typical
20
Typical
15
15
Max: 85°C + 3ı
Typical: 25°C
10
10
5
1.5
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
3.6
VDD (V)
VDD (V)
FIGURE 35-37:
IPD, Fixed Voltage Reference
(FVR), PIC16LF1713/6 Only.
FIGURE 35-38:
IPD, Fixed Voltage Reference
(FVR), PIC16F1713/6 Only.
11
13
Max: 85°C + 3
M
3ı
Typical: 25°C
10
Max: 85°C + 3ı
Typical: 25°C
12
Max.
Max.
11
10
8
Typical
IDD (nA)
nA)
IDD (nA)
9
7
9
Typical
8
7
6
6
5
5
4
4
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
2.8
3.0
3.2
3.4
3.6
3.8
4.0
VDD (V)
FIGURE 35-39:
IPD, Brown-out Reset
(BOR), BORV = 1, PIC16LF1713/6 Only.
4.4
4.6
4.8
5.0
5.2
5.4
5.6
5.4
5.6
FIGURE 35-40:
IPD, Brown-out Reset
(BOR), BORV = 1, PIC16F1713/6 Only.
1.8
1.8
Max.
1.6
Max: 85°C + 3ı
Typical: 25°C
1.6
1.4
Max.
1.4
1.2
1.2
Max: 85°C + 3ı
Typical: 25°C
1.0
IDD (µA)
IDD (nA)
4.2
VDD (V)
0.8
0.6
1.0
0.8
0.6
Typical
0.4
0.4
0.2
02
0.2
0.0
Typical
0.0
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
VDD (V)
FIGURE 35-41:
IPD, LP Brown-out Reset
(LPBOR = 0), PIC16LF1713/6 Only.
DS40001726C-page 425
3.7
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
4.6
4.8
5.0
5.2
VDD (V)
FIGURE 35-42:
IPD, LP Brown-out Reset
(LPBOR = 0), PIC16F1713/6 Only.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
12
7
Max: 85°C + 3
M
3ı
Typical: 25°C
Max: 85°C + 3ı
Typical: 25°C
6
10
Max.
5
Max.
IDD (µA)
µA)
IDD (µA)
8
4
3
Typical
6
Typical
4
2
2
1
0
0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
1.5
2.0
2.5
3.0
3.5
4.0
VDD (V)
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-43:
IPD, Timer1 Oscillator,
FOSC = 32 kHz, PIC16LF1713/6 Only.
FIGURE 35-44:
IPD, Timer1 Oscillator,
FOSC = 32 kHz, PIC16F1713/6 Only.
700
900
Max: 85°C + 3ı
Typical: 25°C
600
Max: 8
M
85°C
°C + 3
3ı
Typical: 25°C
800
Max.
700
Max.
500
IDD (µA)
IDD (µA)
µA)
600
400
Typical
300
500
Typical
400
300
200
200
100
100
0
0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
1.5
3.8
2.0
2.5
3.0
3.5
FIGURE 35-45:
IPD, Op Amp, High GBWP
Mode (OPAxSP = 1), PIC16LF1713/6 Only.
4.5
5.0
5.5
6.0
FIGURE 35-46:
IPD, Op Amp, High GBWP
Mode (OPAxSP = 1), PIC16F1713/6 Only.
500
1.4
Max: 85°C + 3ı
Typical: 25°C
450
Max: 85°C + 3ı
Typical: 25°C
1.2
Max.
400
Max.
1.0
350
IDD (µA)
µA)
300
IDD (µA)
µA)
4.0
VDD (V)
VDD (V)
250
200
150
0.8
0.6
0.4
Typical
100
0.2
50
Typical
0
0.0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
VDD (V)
FIGURE 35-47:
IPD, ADC Non-Converting,
PIC16LF1713/6 Only.
 Microchip Technology Inc.
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-48:
IPD, ADC Non-Converting,
PIC16F1713/6 Only.
DS40001726C-page 426
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
800
800
Max: -40°C + 3ı
Typical: 25°C
Max: -40°C + 3ı
Typical: 25°C
700
Max.
600
600
Typical
IDD (µA)
IDD
D (µA)
Max.
700
500
Typical
500
400
400
300
300
200
200
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
2.0
3.8
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
VDD (V)
FIGURE 35-49:
IPD, Comparator, NP Mode
(CxSP = 1), PIC16LF1713/6 Only.
FIGURE 35-50:
IPD, Comparator, NP Mode
(CxSP = 1), PIC16F1713/6 Only.
6
5
Graph represents 3ı Limits
Graph represents 3ı Limits
5
4
3
-40°C
VOL (V)
VOH (V)
4
3
125°C
2
-40°C
2
Typical
Typical
125°C
1
1
0
0
-30
-25
-20
-15
-10
-5
0
0
10
20
30
IOH (mA)
FIGURE 35-51:
VOH vs. IOH Over
Temperature, VDD = 5.0V, PIC16F1713/6 Only.
50
60
70
80
FIGURE 35-52:
VOL vs. IOL Over
Temperature, VDD = 5.0V, PIC16F1713/6 Only.
3.0
3.5
Graph represents 3ı Limits
Graph represents 3ı Limits
3.0
2.5
2.5
2.0
VOL (V)
VOH (V)
40
IOL (mA)
2.0
1.5
-40°C
Typical
1.5
125°C
125°C
1.0
Typical
1.0
-40°C
0.5
0.5
0.0
0.0
-14
-12
-10
-8
-6
-4
IOH (mA)
FIGURE 35-53:
VOH vs. IOH Over
Temperature, VDD = 3.0V.
DS40001726C-page 427
-2
0
0
5
10
15
20
25
30
IOL (mA)
FIGURE 35-54:
VOL vs. IOL Over
Temperature, VDD = 3.0V.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
2.0
1.8
Graph represents 3ı Limits
1.8
Graph represents 3ı Limits
1.6
1.6
1.4
1.4
Vol (V)
VOH (V)
1.2
1.2
125°C
1.0
1.0
125°C
Typical
0.8
0.8
-40°C
Typical
-40°C
0.6
0.6
0.4
0.4
0.2
0.2
0.0
-4.0
-3.5
-3.0
-2.5
-2.0
-1.5
-1.0
-0.5
0.0
0.0
0
1
2
3
4
5
6
FIGURE 35-55:
VOH vs. IOH Over
Temperature, VDD = 1.8V, PIC16LF1713/6 Only.
8
9
10
FIGURE 35-56:
VOL vs. IOL Over
Temperature, VDD = 1.8V, PIC16LF1713/6 Only.
40,000
40,000
38,000
38,000
Max.
36,000
36,000
34,000
34,000
Max.
Typical
32,000
Frequency (Hz)
Frequency (Hz)
7
IOL (mA)
IOH (mA)
30,000
Min.
28,000
26,000
Typical
32,000
30,000
Min.
28,000
26,000
24,000
24,000
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
22,000
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
22,000
20,000
20,000
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
2.0
2.5
3.0
3.5
VDD (V)
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-57:
LFINTOSC Frequency,
PIC16LF1713/6 Only.
FIGURE 35-58:
LFINTOSC Frequency,
PIC16F1713/6 Only.
Title
40,000
WDT TIME OUT PERIOD
24
38,000
22
Max.
36,000
Max.
20
Typical
32,000
Time (ms)
Frequency (Hz)
34,000
30,000
Min.
28,000
18
Typical
16
Min.
26,000
14
24,000
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
22,000
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
12
20,000
10
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
1.6
1.8
2.0
2.2
2.4
2.6
VDD (V)
2.8
3.0
3.2
3.4
3.6
3.8
VDD (V)
FIGURE 35-59:
WDT Time-Out Period,
PIC16F1713/6 Only.
 Microchip Technology Inc.
FIGURE 35-60:
WDT Time-Out Period,
PIC16LF1713/6 Only.
DS40001726C-page 428
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
70
2.00
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
60
Max.
1.95
Max.
50
Voltage (mV)
Voltage (V)
Typical
1.90
Min.
40
30
Typical
20
1.85
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
Min.
10
0
1.80
-60
-40
-20
0
20
40
60
80
100
120
-60
140
-40
-20
0
Temperature (°C)
( C)
20
40
60
80
100
120
140
Temperature (°C)
FIGURE 35-61:
Brown-out Reset Voltage,
Low Trip Point (BORV = 1), PIC16LF1713/6 Only.
FIGURE 35-62:
Brown-out Reset Hysteresis,
Low Trip Point (BORV = 1), PIC16LF1713/6 Only.
70.0
2.60
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
60.0
2.55
Max.
Max.
Typical
50.0
Voltage (mV)
Voltage (V)
2.50
Min.
2.45
40.0
Typical
30.0
2.40
20.0
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
2.35
Min.
10.0
0.0
2.30
-60
-40
-20
0
20
40
60
80
100
120
-60
140
-40
-20
0
Temperature (°C)
40
60
80
100
120
140
Temperature (°C)
FIGURE 35-63:
Brown-out Reset Voltage,
Low Trip Point (BORV = 1), PIC16F1713/6 Only.
FIGURE 35-64:
Brown-out Reset Hysteresis,
Low Trip Point (BORV = 1), PIC16F1713/6 Only.
2.85
80
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
2.80
Max.
60
Voltage (mV)
2.75
Typical
Min.
2.70
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
70
Max.
Voltage (V)
20
50
Typical
40
30
20
2.65
Min.
10
2.60
-60
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
FIGURE 35-65:
Brown-out Reset Voltage,
High Trip Point (BORV = 0).
DS40001726C-page 429
140
0
-60
-40
-20
0
20
40
60
80
100
120
140
Temperature (°C)
( C)
FIGURE 35-66:
Brown-out Reset Hysteresis,
High Trip Point (BORV = 0).
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
2.7
50
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
2.6
2.5
Max.
40
2.4
Voltage (V)
Max: Typical + 3ı
Typical: statistical mean
45
Max.
35
Voltage (mV)
2.3
2.2
Typical
2.1
30
25
20
Typical
2.0
15
1.9
10
Min.
1.8
5
1.7
-60
-40
-20
0
20
40
60
80
100
120
0
140
-60
-40
-20
0
20
Temperature (°C)
FIGURE 35-67:
40
60
80
100
120
140
Temperature (°C)
LPBOR Reset Voltage.
FIGURE 35-68:
100
LPBOR Reset Hysteresis.
100
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
90
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
90
Max.
Max.
80
Time (ms)
Time (ms)
80
Typical
70
Typical
70
Min.
60
60
50
Min.
50
40
2
2.5
3
3.5
4
4.5
5
5.5
40
6
1.6
1.8
2
2.2
VDD (V)
2.6
2.8
3
3.2
3.4
3.6
3.8
VDD (V)
FIGURE 35-69:
PWRT Period,
PIC16F1713/6 Only.
FIGURE 35-70:
PWRT Period,
PIC16LF1713/6 Only.
1.58
1.58
1.70
1.68
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
1.56
1.56
Max.
1.66
Max.
Voltage
Voltage
(V) (V)
1.64
Typical
Voltage (V)
2.4
1.62
1.60
Min.
1.58
1.54
1.54
Typical
1.52
1.52
1.5
1.50
Min.
1.48
1.48
1.56
1.54
1.46
Max: Typical + 3ı 0
1.46 -40 Typical:-20
statistical mean
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
1.52
20
40
60
80
100
120
75
100
125
150
Temperature (°C)
Min: Typical - 3ı
1.44
1.50
-50
-25
0
25
50
75
100
125
Temperature (°C)
FIGURE 35-71:
POR Release Voltage.
 Microchip Technology Inc.
150
-50
-25
0
25
50
Temperature (°C)
FIGURE 35-72:
POR Rearm Voltage,
NP Mode (VREGPM1 = 0), PIC16F1713/6 Only.
DS40001726C-page 430
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
12
1.4
1.3
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
10
Max.
1.2
Time (µs)
Voltage (V)
8
1.1
Typical
1.0
Max.
6
Typical
0.9
4
Min.
0.8
2
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
0.7
0
0.6
-50
-25
0
25
50
75
100
125
1.5
150
2.0
2.5
3.0
3.5
Temperature (°C)
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-73:
POR Rearm Voltage,
NP Mode, PIC16LF1713/6 Only.
FIGURE 35-74:
VREGPM = 0.
50
Wake From Sleep,
40
Max: Typical + 3ı
Typical: statistical mean @ 25°C
45
35
40
Max.
Max.
35
Time (µs)
30
Time (µs)
30
Typical
25
Typical
25
20
20
15
10
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
5
0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Note:
The FVR Stabiliztion Period applies when coming out of RESET
or exiting sleep mode.
15
10
6.0
1.6
1.8
2.0
2.2
Wake From Sleep,
2.6
2.8
3.0
3.2
3.4
3.6
3.8
FIGURE 35-76:
FVR Stabilization Period,
PIC16LF1713/6 Only.
1.0
1.0
0.5
0.5
DNL(LSb)
DNL(LSb)
FIGURE 35-75:
VREGPM = 1.
2.4
VDD (mV)
VDD (V)
0.0
0.0
Ͳ0.5
Ͳ0.5
Ͳ1.0
Ͳ1.0
0
128
256
384
512
640
768
896
1024
OutputCode
FIGURE 35-77:
ADC 10-bit Mode,
Single-Ended DNL, VDD = 3.0V, TAD = 1 S, 25°C.
DS40001726C-page 431
0
128
256
384
512
640
768
896
1024
OutputCode
FIGURE 35-78:
ADC 10-bit Mode,
Single-Ended DNL, VDD = 3.0V, TAD = 4 S, 25°C.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
2.0
1.0
1.0
1.5
1.0
INL(LSb)
DNL(LSb)
INL(LSb)
0.5
0.0
0.5
0.5
0.0
Ͳ0.5
0.0
Ͳ1.0
Ͳ1.5
Ͳ0.5
Ͳ2.0
Ͳ0.5
0
512
1024
1536
2048
2560
3072
3584
4096
640
768
896
1024
OutputCode
Ͳ1.0
Ͳ1.0
0
128
256
384
512
640
768
896
0
1024
128
256
384
512
OutputCode
OutputCode
FIGURE 35-79:
ADC 10-bit Mode,
Single-Ended INL, VDD = 3.0V, TAD = 1 S, 25°C.
FIGURE 35-80:
ADC 10-bit Mode,
Single-Ended INL, VDD = 3.0V, TAD = 4 S, 25°C.
1.5
1.5
MaxͲ40°C
1.0
MinͲ40°C
1.0
Min25°C
0.5
Min125°C
0.0
Min125°C
INL(LSb)
DNL(LSb)
0.5
Min25°C
Ͳ0.5
Max25°C
Max125°C
0.0
Ͳ0.5
Min25°C
Min125°C
MinͲ40°C
MinͲ40°C
Ͳ1.0
Ͳ1.0
Ͳ1.5
Ͳ1.5
5.00EͲ07
1.00EͲ06
2.00EͲ06
4.00EͲ06
5.00EͲ07
8.00EͲ06
FIGURE 35-81:
ADC 10-bit Mode,
Single-Ended DNL, VDD = 3.0V, VREF = 3.0V.
2.00EͲ06
4.00EͲ06
8.00EͲ06
FIGURE 35-82:
ADC 10-bit Mode,
Single-Ended INL, VDD = 3.0V, VREF = 3.0V.
1.5
1.5
1.0
MaxͲ40°C
1.0
MaxͲ40°C
0.5
Max25°C
Max25°C
Max125°C
0.0
INL(LSb)
DNL(LSb)
1.00EͲ06
TADs
TADs
0.5
Max125°C
0.0
Min125°C
Ͳ0.5
Min125°C
Min25°C
MinͲ40°C
Ͳ1.0
MinͲ40°C
Ͳ0.5
Min25°C
Ͳ1.0
Ͳ1.5
1.8
2.3
3
VREF
FIGURE 35-83:
ADC 10-bit Mode,
Single-Ended DNL, VDD = 3.0V, TAD = 1 S.
 Microchip Technology Inc.
1.8
2.3
3
VREF
FIGURE 35-84:
ADC 10-bit Mode,
Single-Ended INL, VDD = 3.0V, TAD = 1 S.
DS40001726C-page 432
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
900
800
ADC VREF+ SET TO VDD
ADC VREF- SET TO GND
ADC VREF+ SET TO VDD
ADC VREF- SET TO GND
700
Max.
Max.
800
Typical
600
Min.
Typical
ADC Output Codes
ADC Output Codes
700
500
Min.
400
300
200
500
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
400
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
100
600
300
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.0
6.0
2.5
3.0
FIGURE 35-85:
Temp. Indicator Initial Offset,
High Range, Temp. = 20°C, PIC16F1713/6 Only.
4.0
4.5
5.0
5.5
6.0
FIGURE 35-86:
Temp. Indicator Initial Offset,
Low Range, Temp. = 20°C, PIC16F1713/6 Only.
150
800
ADC VREF+ SET TO VDD
ADC VREF- SET TO GND
100
Typical
600
Max.
Typical
ADC VREF+ SET TO VDD
ADC VREF- SET TO GND
125
Max.
700
Min.
Min.
75
ADC Output Codes
ADC Output Codes
3.5
VDD (V)
VDD (V)
500
400
300
50
25
0
-25
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
200
100
1.5
1.8
2.1
2.4
2.7
3.0
3.3
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
-50
3.6
-75
3.9
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
( C)
VDD (V)
FIGURE 35-87:
Temp. Indicator Initial Offset,
Low Range, Temp. = 20°C, PIC16LF1713/6 Only.
FIGURE 35-88:
Temp. Indicator Slope
Normalized to 20°C, High Range, VDD = 5.5V,
PIC16F1713/6 Only.
150
250
ADC VREF+ SET TO VDD
ADC VREF- SET TO GND
200
Max.
150
Max.
ADC VREF+ SET TO VDD
ADC VREF- SET TO GND
125
Typical
Typical
100
Min.
Min.
ADC Output Codes
ADC Output Codes
75
100
50
0
-50
50
25
0
-25
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
-100
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
-50
-75
-150
-50
-25
0
25
50
75
100
125
Temperature (°C)
( C)
FIGURE 35-89:
Temp. Indicator Slope
Normalized to 20°C, High Range, VDD = 3.0V,
PIC16F1713/6 Only.
DS40001726C-page 433
150
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
( C)
FIGURE 35-90:
Temp. Indicator Slope
Normalized to 20°C, Low Range, VDD = 3.0V,
PIC16F1713/6 Only.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
250
150
Max.
ADC VREF+ SET TO VDD
ADC VREF- SET TO GND
200
ADC VREF+ SET TO VDD
ADC VREF- SET TO GND
Typical
Max.
Typical
100
Min.
Min.
100
ADC Output Codes
ADC Output Codes
150
50
0
-50
50
0
-50
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
-100
-150
-100
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
Temperature (°C)
( C)
FIGURE 35-91:
Temp. Indicator Slope
Normalized to 20°C, Low Range, VDD = 1.8V,
PIC16LF1713/6 Only.
100
125
150
80
ADC VREF+ SET TO VDD
ADC VREF- SET TO GND
Max.
Typical
75
Min.
70
Max.
CMRR (dB)
150
ADC Output Codes
75
FIGURE 35-92:
Temp. Indicator Slope
Normalized to 20°C, Low Range, VDD = 3.0V,
PIC16LF1713/6 Only.
250
200
50
Temperature (°C)
( C)
100
50
65
Typical
60
0
55
Min.
-50
50
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
-100
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
45
-150
-50
-25
0
25
50
75
100
125
40
150
-50
-25
0
25
50
Temperature (°C)
Temperature (°C)
FIGURE 35-93:
Temp. Indicator Slope
Normalized to 20°C, High Range, VDD = 3.6V,
PIC16LF1713/6 Only.
75
100
125
150
FIGURE 35-94:
Op Amp, Common Mode
Rejection Ratio (CMRR), VDD = 3.0V.
35%
8
-40°C
Sample Size = 3,200
25°C
30%
Max.
6
85°C
Offset Voltage (V)
Percent of Units
4
125°C
25%
20%
15%
10%
Typical
2
0
Min.
-2
-4
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
-6
5%
-8
-0.3
0%
-7
-5
-4
-3
-2
-1
0
1
2
Offset Voltage (mV)
3
4
5
6
FIGURE 35-95:
Op Amp, Input Offset
Voltage Histogram, VDD = 3.0V, VCM = VDD/2.
 Microchip Technology Inc.
0.0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3.0
3.3
7
Common Mode Voltage (V)
FIGURE 35-96:
Op Amp, Offset Over
Common Mode Voltage, VDD = 3.0V,
Temp. = 25°C.
DS40001726C-page 434
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
8
3.8
Max.
VDD = 3.6V
6
3.7
3.6
Typical
Slew Rate (V/µs)
Offset Voltage (V)
4
2
0
-2
VDD = 5.5V
3.5
3.4
VDD = 2.3V
3.3
VDD = 3V
-4
3.2
Min.
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
-6
3.1
-8
3.0
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
-60
-40
-20
0
Common Mode Voltage (V)
20
40
60
80
100
120
140
Temperature (°C)
FIGURE 35-97:
Op Amp, Offset Over
Common Mode Voltage, VDD = 5.0V,
Temp. = 25°C, PIC16F1713/6 Only.
FIGURE 35-98:
Op Amp, Output Slew Rate,
Rising Edge, PIC16F1713/6 Only.
5.4
45
43
5.2
-40°C
41
VDD = 2.3V
Hysteresis (mV)
Slew Rate (V/µs)
5.0
4.8
4.6
4.4
VDD = 3.6V
4.2
VDD = 5.5V
39
25°C
37
85°C
35
125°C
33
31
4.0
29
3.8
27
VDD = 3V
3.6
25
-60
-40
-20
0
20
40
60
80
100
120
140
0.0
0.5
1.0
Temperature (°C)
1.5
2.0
2.5
3.0
3.5
Common Mode Voltage (V)
FIGURE 35-99:
Op Amp, Output Slew Rate,
Falling Edge, PIC16F1713/6 Only.
FIGURE 35-100:
Comparator Hysteresis,
NP Mode (CxSP = 1), VDD = 3.0V, Typical
Measured Values.
30
30
25
25
Max.
20
20
15
Offset Voltage (mV)
Offset Voltage (mV)
Max.
10
5
0
Min.
-5
15
10
5
0
Min.
-5
-10
-10
-15
-15
-20
-20
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Common Mode Voltage (V)
FIGURE 35-101:
Comparator Offset, NP Mode
(CxSP = 1), VDD = 3.0V, Typical Measured Values
at 25°C.
DS40001726C-page 435
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Common Mode Voltage (V)
FIGURE 35-102:
Comparator Offset, NP Mode
(CxSP = 1), VDD = 3.0V, Typical Measured Values
From -40°C to 125°C.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
30
50
25
45
Hysteresis (mV)
Hysteresis (mV)
40
25°C
85°C
35
125°C
Max.
20
-40°C
30
15
10
5
0
Min.
-5
-10
25
-15
-20
20
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.0
6.0
0.5
1.0
Common Mode Voltage (V)
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Common Mode Voltage (V)
FIGURE 35-103:
Comparator Hysteresis,
NP Mode (CxSP = 1), VDD = 5.5V, Typical
Measured Values, PIC16F1713/6 Only.
FIGURE 35-104:
Comparator Offset, NP Mode
(CxSP = 1), VDD = 5.0V, Typical Measured Values
at 25°C, PIC16F1713/6 Only.
140
40
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
120
30
Max.
Time (ns)
Offset Voltage (mV)
100
20
10
80
60
Max.
0
Typical
40
Min.
Min.
-10
20
-20
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
1.5
2.0
2.5
Common Mode Voltage (V)
3.0
3.5
4.0
VDD (V)
FIGURE 35-105:
Comparator Offset, NP Mode
(CxSP = 1), VDD = 5.5V, Typical Measured Values
From -40°C to 125°C, PIC16F1713/6 Only.
FIGURE 35-106:
Comparator Response Time
Over Voltage, NP Mode (CxSP = 1), Typical
Measured Values, PIC16LF1713/6 Only.
C
SU
U S
1,400
90
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
80
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
1,200
70
1,000
Time (ns)
Time (ns)
60
50
Max.
40
800
600
Typical
30
400
Min.
Max.
20
Typical
200
10
Min.
0
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
1.5
2.0
2.5
3.0
3.5
4.0
VDD (V)
VDD (V)
FIGURE 35-107:
Comparator Response Time
Over Voltage, NP Mode (CxSP = 1), Typical
Measured Values, PIC16F1713/6 Only.
 Microchip Technology Inc.
FIGURE 35-108:
Comparator Output Filter
Delay Time Over Temp., NP Mode (CxSP = 1),
Typical Measured Values, PIC16LF1713/6 Only.
DS40001726C-page 436
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
TYPICAL MEASURED VALUES
0.025
800
-40°C
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
700
0.020
25°C
85°C
0.015
125°C
600
500
DNL (LSb)
Time (ns)
0.010
400
0.005
0.000
300
-0.005
Max.
200
-0.010
Typical
100
Min.
-0.015
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
-0.020
6.0
0
16
32
48
64
80
96
VDD (V)
FIGURE 35-109:
Comparator Output Filter
Delay Time Over Temp., NP Mode (CxSP = 1),
Typical Measured Values, PIC16F1713/6 Only.
112 128 144 160 176 192 208 224 240
Output Code
FIGURE 35-110:
Typical DAC DNL Error,
VDD = 3.0V, VREF = External 3V.
0.020
0.00
-40°C
-0.05
25°C
0.015
85°C
-0.10
125°C
0.010
DNL (LSb)
INL (LSb)
-0.15
-0.20
-0.25
0.005
0.000
-0.30
-0.005
-40°C
-0.35
25°C
85°C
-0.40
-0.010
125°C
-0.45
-0.015
0
16
32
48
64
80
96
0
112 128 144 160 176 192 208 224 240
Output Code
FIGURE 35-111:
Typical DAC INL Error,
VDD = 3.0V, VREF = External 3V.
16
32
48
64
80
96
112 128 144 160 176 192 208 224 240
Output Code
FIGURE 35-112:
Typical DAC INL Error,
VDD = 5.0V, VREF = External 5V, PIC16F1713/6
Only.
,
0.00
24
-0.05
Max.
22
-0.10
20
DNL (LSb)
INL (LSb)
-0.15
-0.20
-0.25
18
Typical
16
-0.30
14
-40°C
-0.35
Min.
25°C
Max: Typical + 3ı (-40°C to +125°C)
Typical; statistical mean @ 25°C
Min: Typical - 3ı (-40°C to +125°C)
12
85°C
-0.40
125°C
10
-0.45
0
16
32
48
64
80
96
112 128 144 160 176 192 208 224 240
Output Code
FIGURE 35-113:
Typical DAC INL Error,
VDD = 5.0V, VREF = External 5V, PIC16F1713/6
Only.
DS40001726C-page 437
1.6
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
3.8
Output Code
FIGURE 35-114:
DAC INL Error,
VDD = 3.0V, PIC16LF1713/6 Only.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
1.4
0.85
Fall-2.3V
1.2
Fall-3.0V
0.80
Fall-5.5V
1.0
0.75
Time (µs)
ZCD Pin Voltage (V)
-40°C
25°C
0.70
85°C
0.8
0.6
0.4
Rise-2.3V
Rise-3.0V
Rise-5.5V
125°C
0.65
0.2
0.60
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.0
6.0
-50
-25
0
25
VDD (V)
FIGURE 35-115:
Measured Values
Title
ZCD Pin Voltage, Typical
50
75
Temperature (°C)
100
125
150
FIGURE 35-116:
ZCD Response Time Over
Voltage, Typical Measured Values.
TYPICAL MEASURED VALUES FROM 40 C to 125 C
8.0
1.00
0.90
6.0
0.80
2.3V
4.0
0.70
Time (µs)
ZCD Source/Sink Current (mA)
5.5V
3.0V
1.8V
2.0
0.0
0.60
0.50
0.40
0.30
1.8V
0.20
3.0V
-2.0
2.3V
5.5V
-4.0
-0.20
0.10
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
0
2.20
100
200
300
400
500
ZCD Source/Sink Current (uA)
ZCD Pin Voltage (V)
FIGURE 35-117:
ZCD Pin Current Over ZCD
Pin Voltage, Typical Measured Values From -40°C
to 125°C.
FIGURE 35-118:
ZCD Pin Response Time
Over Current, Typical Measured Values From
-40°C to 125°C.
9.0
0.28
8.5
0.26
8.0
7.5
Time (ns)
Time (µs)
0.24
0.22
7.0
6.5
0.20
6.0
0.18
125°C
85°C
25°C
-40°C
0.16
5.5
125°C
85°C
25°C
-40°C
5.0
4.5
0.14
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VDD (V)
FIGURE 35-119:
COG Deadband Delay,
DBR/DBF = 32, Typical Measured Values
DS40001726C-page 438
6.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 35-120:
COG Deadband DBR/DBF
Delay Per Step, Typical Measured Values.
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note: Unless otherwise noted, VIN = 5V, FOSC = 300 kHz, CIN = 0.1 µF, TA = 25°C.
Title
Title
TYPICAL MEASURED VALUES
TYPICAL MEASURED VALUES
0.07
0.45
Max.
0.40
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
0.35
Max.
Max: Typical + 3ı
Typical; statistical mean
Min: Typical - 3ı
0.06
Typical
Typical
0.05
0.30
Min.
0.04
0.25
Time (µs)
Time (µs)
Min.
0.20
0.03
0.15
0.02
0.10
0.01
0.05
0.00
0.00
0
10
20
30
40
50
60
70
DBR/DBF Value
FIGURE 35-121:
COG Deadband Delay Per
Step, Typical Measured Values
 Microchip Technology Inc.
0
1
2
3
4
5
6
7
8
9
10
11
DBR/DBF Value
FIGURE 35-122:
COG Deadband Delay Per
Step, Zoomed to First 10 Codes, Typical
Measured Values.
DS40001726C-page 439
PIC16(L)F1713/6
NOTES:
DS40001726C-page 440
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
36.0
DEVELOPMENT SUPPORT
The PIC® microcontrollers (MCU) and dsPIC® digital
signal controllers (DSC) are supported with a full range
of software and hardware development tools:
• Integrated Development Environment
- MPLAB® X IDE Software
• Compilers/Assemblers/Linkers
- MPLAB XC Compiler
- MPASMTM Assembler
- MPLINKTM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB X SIM Software Simulator
• Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers/Programmers
- MPLAB ICD 3
- PICkit™ 3
• Device Programmers
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits and Starter Kits
• Third-party development tools
36.1
MPLAB X Integrated Development
Environment Software
The MPLAB X IDE is a single, unified graphical user
interface for Microchip and third-party software, and
hardware development tool that runs on Windows®,
Linux and Mac OS® X. Based on the NetBeans IDE,
MPLAB X IDE is an entirely new IDE with a host of free
software components and plug-ins for highperformance application development and debugging.
Moving between tools and upgrading from software
simulators to hardware debugging and programming
tools is simple with the seamless user interface.
With complete project management, visual call graphs,
a configurable watch window and a feature-rich editor
that includes code completion and context menus,
MPLAB X IDE is flexible and friendly enough for new
users. With the ability to support multiple tools on
multiple projects with simultaneous debugging, MPLAB
X IDE is also suitable for the needs of experienced
users.
Feature-Rich Editor:
• Color syntax highlighting
• Smart code completion makes suggestions and
provides hints as you type
• Automatic code formatting based on user-defined
rules
• Live parsing
User-Friendly, Customizable Interface:
• Fully customizable interface: toolbars, toolbar
buttons, windows, window placement, etc.
• Call graph window
Project-Based Workspaces:
•
•
•
•
Multiple projects
Multiple tools
Multiple configurations
Simultaneous debugging sessions
File History and Bug Tracking:
• Local file history feature
• Built-in support for Bugzilla issue tracker
 2013-2016 Microchip Technology Inc.
DS40001726C-page 441
PIC16(L)F1713/6
36.2
MPLAB XC Compilers
The MPLAB XC Compilers are complete ANSI C
compilers for all of Microchip’s 8, 16, and 32-bit MCU
and DSC devices. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use. MPLAB XC Compilers run on Windows,
Linux or MAC OS X.
For easy source level debugging, the compilers provide
debug information that is optimized to the MPLAB X
IDE.
The free MPLAB XC Compiler editions support all
devices and commands, with no time or memory
restrictions, and offer sufficient code optimization for
most applications.
MPLAB XC Compilers include an assembler, linker and
utilities. The assembler generates relocatable object
files that can then be archived or linked with other relocatable object files and archives to create an executable file. MPLAB XC Compiler uses the assembler to
produce its object file. Notable features of the assembler include:
•
•
•
•
•
•
Support for the entire device instruction set
Support for fixed-point and floating-point data
Command-line interface
Rich directive set
Flexible macro language
MPLAB X IDE compatibility
36.3
MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code, and COFF files for
debugging.
The MPASM Assembler features include:
36.4
MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler. It can link
relocatable objects from precompiled libraries, using
directives from a linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
36.5
MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC DSC devices. MPLAB XC Compiler
uses the assembler to produce its object file. The
assembler generates relocatable object files that can
then be archived or linked with other relocatable object
files and archives to create an executable file. Notable
features of the assembler include:
•
•
•
•
•
•
Support for the entire device instruction set
Support for fixed-point and floating-point data
Command-line interface
Rich directive set
Flexible macro language
MPLAB X IDE compatibility
• Integration into MPLAB X IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multipurpose
source files
• Directives that allow complete control over the
assembly process
DS40001726C-page 442
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
36.6
MPLAB X SIM Software Simulator
The MPLAB X SIM Software Simulator allows code
development in a PC-hosted environment by simulating the PIC MCUs and dsPIC DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB X SIM Software Simulator fully supports
symbolic debugging using the MPLAB XC Compilers,
and the MPASM and MPLAB Assemblers. The software simulator offers the flexibility to develop and
debug code outside of the hardware laboratory environment, making it an excellent, economical software
development tool.
36.7
MPLAB REAL ICE In-Circuit
Emulator System
The MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs all 8, 16 and 32-bit MCU, and DSC devices
with the easy-to-use, powerful graphical user interface of
the MPLAB X IDE.
The emulator is connected to the design engineer’s
PC using a high-speed USB 2.0 interface and is
connected to the target with either a connector
compatible with in-circuit debugger systems (RJ-11)
or with the new high-speed, noise tolerant, LowVoltage Differential Signal (LVDS) interconnection
(CAT5).
The emulator is field upgradeable through future firmware downloads in MPLAB X IDE. MPLAB REAL ICE
offers significant advantages over competitive emulators
including full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, logic
probes, a ruggedized probe interface and long (up to
three meters) interconnection cables.
 2013-2016 Microchip Technology Inc.
36.8
MPLAB ICD 3 In-Circuit Debugger
System
The MPLAB ICD 3 In-Circuit Debugger System is
Microchip’s most cost-effective, high-speed hardware
debugger/programmer for Microchip Flash DSC and
MCU devices. It debugs and programs PIC Flash
microcontrollers and dsPIC DSCs with the powerful,
yet easy-to-use graphical user interface of the MPLAB
IDE.
The MPLAB ICD 3 In-Circuit Debugger probe is
connected to the design engineer’s PC using a highspeed USB 2.0 interface and is connected to the target
with a connector compatible with the MPLAB ICD 2 or
MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3
supports all MPLAB ICD 2 headers.
36.9
PICkit 3 In-Circuit Debugger/
Programmer
The MPLAB PICkit 3 allows debugging and programming of PIC and dsPIC Flash microcontrollers at a most
affordable price point using the powerful graphical user
interface of the MPLAB IDE. The MPLAB PICkit 3 is
connected to the design engineer’s PC using a fullspeed USB interface and can be connected to the target via a Microchip debug (RJ-11) connector (compatible with MPLAB ICD 3 and MPLAB REAL ICE). The
connector uses two device I/O pins and the Reset line
to implement in-circuit debugging and In-Circuit Serial
Programming™ (ICSP™).
36.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages, and a modular, detachable socket assembly to support various
package types. The ICSP cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices, and incorporates an MMC card for file
storage and data applications.
DS40001726C-page 443
PIC16(L)F1713/6
36.11 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully
functional systems. Most boards include prototyping
areas for adding custom circuitry and provide application firmware and source code for examination and
modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
36.12 Third-Party Development Tools
Microchip also offers a great collection of tools from
third-party vendors. These tools are carefully selected
to offer good value and unique functionality.
• Device Programmers and Gang Programmers
from companies, such as SoftLog and CCS
• Software Tools from companies, such as Gimpel
and Trace Systems
• Protocol Analyzers from companies, such as
Saleae and Total Phase
• Demonstration Boards from companies, such as
MikroElektronika, Digilent® and Olimex
• Embedded Ethernet Solutions from companies,
such as EZ Web Lynx, WIZnet and IPLogika®
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™
demonstration/development board series of circuits,
Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security
ICs, CAN, IrDA®, PowerSmart battery management,
SEEVAL® evaluation system, Sigma-Delta ADC, flow
rate sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
DS40001726C-page 444
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
37.0
PACKAGING INFORMATION
37.1
Package Marking Information
28-Lead SPDIP (.300”)
Example
PIC16F1713
-I/SP e3
1304017
28-Lead SOIC (7.50 mm)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead SSOP (5.30 mm)
Example
PIC16F1713
-I/SO e3
1304017
Example
PIC16F1713
-I/SS e3
1304017
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 445
PIC16(L)F1713/6
Package Marking Information (Continued)
28-Lead UQFN (4x4x0.5 mm)
PIN 1
Example
PIN 1
PIC16
F1713
-I/MV e3
1304017
28-Lead QFN (6x6x0.9 mm)
PIN 1
Example
PIN 1
XXXXXXXX
XXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
16F1713
-I/ML e3
1402017
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS40001726C-page 446
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
37.2
Package Details
The following sections give the technical details of the packages.
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PIC16(L)F1713/6
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS40001726C-page 448
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2013-2016 Microchip Technology Inc.
DS40001726C-page 449
PIC16(L)F1713/6
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS40001726C-page 450
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
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DS40001726C-page 451
PIC16(L)F1713/6
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS40001726C-page 452
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2013-2016 Microchip Technology Inc.
DS40001726C-page 453
PIC16(L)F1713/6
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS40001726C-page 454
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
 2013-2016 Microchip Technology Inc.
DS40001726C-page 455
PIC16(L)F1713/6
DS40001726C-page 456
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
 2013-2016 Microchip Technology Inc.
DS40001726C-page 457
PIC16(L)F1713/6
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DS40001726C-page 458
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
NOTES:
 2013-2016 Microchip Technology Inc.
DS40001726C-page 459
PIC16(L)F1713/6
APPENDIX A:
DATA SHEET
REVISION HISTORY
Revision A (11/2013)
Initial release.
Revision B (01/2014)
Updated the Pin allocation table; Updated Tables 1-2,
3-9 and 12-1; Updated Registers 11-20, 18-6, 18-7 and
21-1; Updated Register summaries; Added Registers
13-10 to 13-12; Added Section 24; Updated the ZCD
section; Removed the HFINTOSC graphs; Added 28
QFN package; Other minor corrections.
Revision C (01/2016)
Updated first page, under Memory information.
Updated PIC16(L)F1713/6 Family Types Table.
Added Sections 3.2: High Endurance Flash and 6.3.5:
Clock Switching Before Sleep. Added Table 3-4 and
3-6.
Removed Sections 18.1.1 and 24.4. Updated new
Section 18.1.1.
Updated Examples 3-2 and 21-1. Updated Figures
18-2, 18-3, 18-4, 18-5, 18-6, 21-1, 22-1, and 23-1.
Updated Register 21-1 and 22-1. Updated Sections
8.2.2, 18.12, 20.0, 21.1.3, 21.2.6, 22.0, 22.1, 22.1.1,
31.1, 31.4.2, and 35.0. Updated Tables 3-1, 3-9, 6-1,
34-1, 34-2, 34-3, 34-4, 34-7, 34-8, 34-10, 34-11 and
34-24.
DS40001726C-page 460
 2013-2016 Microchip Technology Inc.
PIC16(L)F1713/6
THE MICROCHIP WEBSITE
CUSTOMER SUPPORT
Microchip provides online support via our website at
www.microchip.com. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the website
at: http://www.microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip website at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
 2013-2016 Microchip Technology Inc.
DS40001726C-page 461
PIC16(L)F1713/6
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](1)
PART NO.
Device
-
X
Tape and Reel Temperature
Option
Range
/XX
XXX
Package
Pattern
Examples:
a)
b)
Device:
PIC16F1713, PIC16LF1713,
PIC16F1716, PIC16LF1716
Tape and Reel
Option:
Blank
T
= Standard packaging (tube or tray)
= Tape and Reel(1)
Temperature
Range:
I
E
= -40C to +85C
= -40C to +125C
Package:(2)
SP
SO
SS
MV
ML
=
=
=
=
=
Pattern:
(Industrial)
(Extended)
SPDIP
SOIC
SSOP
UQFN
QFN
QTP, SQTP, Code or Special Requirements
(blank otherwise)
DS40001726C-page 462
PIC16LF1713- I/P
Industrial temperature
PDIP package
PIC16F1716- E/SS
Extended temperature,
SSOP package
Note
1:
2:
Tape and Reel identifier only appears in
the catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package.
Check with your Microchip Sales Office
for package availability with the Tape and
Reel option.
Small form-factor packaging options may
be available. Please check
www.microchip.com/packaging for
small-form factor package availability, or
contact your local Sales Office.
 2013-2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2013-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0172-8
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2013-2016 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS40001726C-page 463
Worldwide Sales and Service
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07/14/15
DS40001726C-page 464
 2013-2016 Microchip Technology Inc.