MMASENSORFS Fact Sheet

Sensors
MMA Series
Acceleration Sensors
Device
Freescale Semiconductor’s
Acceleration Sensing Sensitivity Frequency
(g)
Axis
(mV/g)
(Hz)
VDD Supply
Zero g Output
Voltage
(Typ) (V)
Packaging
(Typ) (V)
micromachined accelerometer (MMA)
series acceleration sensors are
MMA6260Q
1.5
XY
800
50
3.3
1.65
Quad Flat No-Lead (QFN)
designed for end products or
MMA6261Q
1.5
XY
800
300
3.3
1.65
Quad Flat No-Lead (QFN)
MMA6262Q
1.5
XY
800
150
3.3
1.65
Quad Flat No-Lead (QFN)
embedded systems that require
MMA6263Q
1.5
XY
800
900
3.3
1.65
Quad Flat No-Lead (QFN)
measurement of forces resulting from
MMA2260D
1.5
X
1200
50
5.0
2.5
16-pin SOIC
tilt, motion, positioning, shock or
MMA1260D
1.5
Z
1200
50
5.0
2.5
16-pin SOIC
MMA1270D
2.5
Z
750
50
5.0
2.5
16-pin SOIC
vibration. We offer a broad portfolio
MMA1250D
5
Z
400
50
5.0
2.5
16-pin SOIC
of acceleration sensors for
MMA1220D
8
Z
250
250
5.0
2.5
16-pin SOIC
applications ranging from highly
MMA6231Q
10
XY
120
300
3.3
1.65
Quad Flat No-Lead (QFN)
sensitive seismic detection to robust
MMA6233Q
10
XY
120
900
3.3
1.65
Quad Flat No-Lead (QFN)
MMA3201D
40
XY
50
400
5.0
2.5
20-pin SOIC
MMA2201D
40
X
50
400
5.0
2.5
16-pin SOIC
MMA2202D
50
X
40
400
5.0
2.5
16-pin SOIC
MMA1213D
50
Z
40
400
5.0
2.5
16-pin SOIC
sensing capabilities derive from
MMA2204D
100
X
20
400
5.0
2.5
16-pin SOIC
micro-electromechanical systems
MMA1210D
100
Z
20
400
5.0
2.5
16-pin SOIC
(MEMS) technology. The acceleration
MMA1211D
150
Z
13
400
5.0
2.5
16-pin SOIC
MMA1212D
200
Z
10
400
5.0
2.5
16-pin SOIC
MMA2300D
250
X
8
400
5.0
2.5
16-pin SOIC
MMA1200D
250
Z
8
400
5.0
2.5
16-pin SOIC
collision detection.
Freescale’s MMA series acceleration
sensors incorporate a surface
micromachined structure.
The g-cell is coupled with an
ASIC, which provides the
accelerometer with amplification,
Features
> X, XY and Z axis of sensitivity
> Ratiometric, ideally suited to
interface with A to D converters
> 1.5g–250g for a wide variety of
applications
> Hermetically sealed g-cell
This two-chip solution serves as a
system-in-a-package (SIP).
> Sensitivity as high as ±1,200 mV/g
signal conditioning, low-pass filter
and temperature compensation.
> Signal conditioned with internal filter
> Calibrated self-test for functional
verification
> Linear output
> Cost-effective plastic packages in
low-dimension Quad Flat No-Lead
(QFN) Pb-free package (6 mm x 6 mm
x 1.98 mm) or SOIC-16 or 20 with
through hole or surface mount available
CASE 1477-01 ISSUE 0
A
A
G/2
2 PLACES, 16 TIPS
G
0.15 T A B
9
16
B
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS "A" AND "B" DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 PER SIDE.
4. DIMENSION "D" DOES NOT INCLUDE DAMBAR
PROTRUSION. PROTRUSIONS SHALL NOT CAUSE
THE LEAD WIDTH TO EXCEED 0.75.
P
1
B
8
16X
D
0.13
M
T A B
R
X 45
J
C
0.1
K
T
SEATING
PLANE
F
M
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MAX
MIN
10.15 10.45
7.40
7.60
3.30
3.55
0.35
0.49
1.14
0.76
1.27 BSC
0.32
0.25
0.25
0.10
7˚
0˚
10.16 10.67
0.25
0.75
SOIC PHYSICAL DIMENSIONS
Benefits
> Single board 3-D sensing
> Bi-directional multi-axis sensing
> Design flexibility
> Small package
> Seismic detection
CASE 1477-01 ISSUE 0
> Health care applications
0.1 C A B
> Robotics
> Automotive crash detection and
suspension control
Typical Applications
> Smart portable electronics
> Motion control
> Vibration monitoring
> Fall log
> Computer hard drive protection
> Smart motor maintenance
> Back-up GPS
4.24
4.04
EXPOSED DIE
ATTACH PAD
4.24
4.04
13
1
9
4
0.5
0.1 C A B
16X
0.63
0.43
8
QFN PHYSICAL DIMENSIONS
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Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2004
MMASERIESFS
REV 0
16
12
> Sports diagnostic systems
> Appliance balance and
vibration controls
DETAIL M
PIN 1 INDEX
5
16X
12X
1
0.60
0.40
0.1
M
C A B
0.05
M
C
3