PIC16(L)F722A/723A PIC16(L)F722A/723A Family Silicon Errata and Data Sheet Clarification The PIC16(L)F722A/723A family devices that you have received conform functionally to the current Device Data Sheet (DS41417B), except for the anomalies described in this document. For example, to identify the silicon revision level using MPLAB IDE in conjunction with a hardware debugger: 1. The silicon issues discussed in the following pages are for silicon revisions with the Device and Revision IDs listed in Table 1. The silicon issues are summarized in Table 2. 2. 3. The errata described in this document will be addressed in future revisions of the PIC16(L)F722A/723A silicon. 4. Note: This document summarizes all silicon errata issues from all revisions of silicon, previous as well as current. Only the issues indicated in the last column of Table 2 apply to the current silicon revision (A4). Data Sheet clarifications and corrections start on page 4, following the discussion of silicon issues. The silicon revision level can be identified using the current version of MPLAB® IDE and Microchip’s programmers, debuggers, and emulation tools, which are available at the Microchip corporate web site (www.microchip.com). TABLE 1: 5. Using the appropriate interface, connect the device to the hardware debugger. Open an MPLAB IDE project. Configure the MPLAB IDE project for the appropriate device and hardware debugger. Based on the version of MPLAB IDE you are using, do one of the following: a) For MPLAB IDE 8, select Programmer > Reconnect. b) For MPLAB X IDE, select Window > Dashboard and click the Refresh Debug Tool Status icon ( ) Depending on the development tool used, the part number and Device Revision ID value appear in the Output window. Note: If you are unable to extract the silicon revision level, please contact your local Microchip sales office for assistance. The DEVREV values for the various PIC16(L)F722A/ 723A silicon revisions are shown in Table 1. SILICON DEVREV VALUES Part Number Device ID(1) Revision ID for Silicon Revision(2) A2 A3 A4 PIC16F722A 01 1011 001x xxxx 0x2 0x3 0x4 PIC16LF722A 01 1011 011x xxxx 0x2 0x3 0x4 PIC16F723A 01 1011 000x xxxx 0x2 0x3 0x4 PIC16LF723A 01 1011 010x xxxx 0x2 0x3 0x4 Note 1: 2: The Device ID is located at 2006h. The five Least Significant bits comprise the revision ID. Refer to the “PIC16(L)F72X Memory Programming Specification” (DS41332) for detailed information on Device and Revision IDs for your specific device. 2010-2014 Microchip Technology Inc. DS80000513D-page 1 PIC16(L)F722A/723A TABLE 2: SILICON ISSUE SUMMARY Module Feature Item Number Affected Revisions Issue Summary A2 Oscillator External HS Oscillator 1.1 Operation below 2.7V. X Interrupts Stack Push 2.1 Interrupt logic incorrectly pushes two addresses to the stack. X DS80000513D-page 2 A3 A4 X X 2010-2014 Microchip Technology Inc. PIC16(L)F722A/723A Silicon Errata Issues Note: This document summarizes all silicon errata issues from all revisions of silicon, previous as well as current. Only the issues indicated by the shaded column in the following tables apply to the current silicon revision (A4). 1. Module: Oscillator 1.1 Operation below 2.7V The minimum device VDD when using the external crystal oscillator in HS mode is 3.0V. Work around Use the internal oscillator or an external clock source if operating below the 3.0V required for HS mode. Affected Silicon Revisions A2 A3 A4 X 2. Module: Interrupts 2.1 The interrupt logic incorrectly pushes two addresses to the stack when vectoring to the interrupt vector. Specifically, the interrupt vector address 0x4 is incorrectly pushed to the stack after the current PC, at the time the interrupt was received, is pushed. This will cause the stack to overflow if the user program is operating seven calls deep when an interrupt arrives. Because the stack is circular, the overflow causes the first stack address to be overwritten. Work around Disable interrupts by clearing the GIE bit in the INTCON register whenever the user program is operating seven calls deep. This ensures that interrupts will not cause the stack to overflow. Affected Silicon Revisions A2 A3 A4 X X X 2010-2014 Microchip Technology Inc. DS80000513D-page 3 PIC16(L)F722A/723A Data Sheet Clarifications The following typographic corrections and clarifications are to be noted for the latest version of the device data sheet (DS41417B). Note: Corrections are shown in bold. Where possible, the original bold text formatting has been removed for clarity. 1. Module: DC Characteristics In Section 23.2, the maximum values for D015 parameter have been modified as shown below. 23.2 DC Characteristics: PIC16(L)F22A/723A-I/E (Industrial, Extended) PIC16LF722A/723A Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended PIC16F722A/723A Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +85°C for industrial -40°C TA +125°C for extended Param No. Device Characteristics Conditions Min. Typ† Max. Units — 290 330 A 1.8 — 460 500 A 3.0 — 300 430 A 1.8 — 450 655 A 3.0 — 500 730 A 5.0 — 100 155 A 1.8 — 120 175 A 3.0 — 115 195 A 1.8 — 135 200 A 3.0 VDD Note Supply Current (IDD)(1, 2) D014 D014 D015 D015 — 150 220 A 5.0 D016 — 650 800 A 1.8 — 1000 1200 A 3.0 D016 — 625 850 A 1.8 — 1000 1200 A 3.0 — 1100 1500 A 5.0 — 1.0 1.2 mA 1.8 — 1.5 1.85 mA 3.0 — 1 1.2 mA 1.8 — 1.5 1.7 mA 3.0 — 1.7 2.1 mA 5.0 D017 D017 Note 1: 2: 3: 4: 5: FOSC = 4 MHz EC Oscillator mode FOSC = 4 MHz EC Oscillator mode (Note 5) FOSC = 500 kHz MFINTOSC mode FOSC = 500 kHz MFINTOSC mode (Note 5) FOSC = 8 MHz HFINTOSC mode FOSC = 8 MHz HFINTOSC mode (Note 5) FOSC = 16 MHz HFINTOSC mode FOSC = 16 MHz HFINTOSC mode (Note 5) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in k FVR and BOR are disabled. 0.1 F capacitor on VCAP (RA0). DS80000513D-page 4 2010-2014 Microchip Technology Inc. PIC16(L)F722A/723A APPENDIX A: DOCUMENT REVISION HISTORY Rev. A Document (07/2010) Initial release of this document. Rev. B Document (02/2011) Updated errata to new format; Added Module 2, Interrupts. Rev. C Document (01/2012) Added Silicon Revision A4. Rev. D Document (02/2014) Data Sheet Clarifications: Added Module 1; Other minor corrections. 2010-2014 Microchip Technology Inc. DS80000513D-page 5 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2010-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620778791 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS80000513D-page 6 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2010-2014 Microchip Technology Inc. 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