PIC16(L)F72X Family Silicon Errata and Data Sheet Clarification

PIC16(L)F72X
PIC16(L)F72X Family
Silicon Errata and Data Sheet Clarification
The PIC16(L)F72X family devices that you have
received conform functionally to the current Device Data
Sheet (DS41341E), except for the anomalies described
in this document.
For example, to identify the silicon revision level
using MPLAB IDE in conjunction with a hardware
debugger:
1.
The silicon issues discussed in the following pages are
for silicon revisions with the Device and Revision IDs
listed in Table 1. The silicon issues are summarized in
Table 2.
2.
3.
The errata described in this document will be addressed
in future revisions of the PIC16(L)F72X silicon.
4.
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated in the last column of
Table 2 apply to the current silicon
revision (AK).
5.
Data Sheet clarifications and corrections start on page 7,
following the discussion of silicon issues.
The silicon revision level can be identified using the
current version of MPLAB® IDE and Microchip’s
programmers, debuggers, and emulation tools, which
are available at the Microchip corporate web site
(www.microchip.com).
TABLE 1:
Using the appropriate interface, connect the
device to the hardware debugger.
Open an MPLAB IDE project.
Configure the MPLAB IDE project for the
appropriate device and hardware debugger.
Based on the version of MPLAB IDE you are
using, do one of the following:
a) For MPLAB IDE 8, select Programmer >
Reconnect.
b) For MPLAB X IDE, select Window >
Dashboard and click the Refresh Debug
Tool Status icon (
).
Depending on the development tool used, the
part number and Device Revision ID value
appear in the Output window.
Note:
If you are unable to extract the silicon
revision level, please contact your local
Microchip sales office for assistance.
The DEVREV values for the various PIC16(L)F72X
silicon revisions are shown in Table 1.
SILICON DEVREV VALUES
Part Number
Device ID(1)
Revision ID for Silicon Revision(2)
A7
A9
AA
AB
AC
AD
AK
0xB
0xC
0xD
0x12
PIC16F722
01 1000 100x xxxx
0x7
0x9
0xA
PIC16LF722
01 1001 100x xxxx
0x7
0x9
0xA
0xB
0xC
0xD
0x12
PIC16F723
01 1000 011x xxxx
0x7
0x9
0xA
0xB
0xC
0xD
0x12
PIC16LF723
01 1001 011x xxxx
0x7
0x9
0xA
0xB
0xC
0xD
0x12
PIC16F724
01 1000 010x xxxx
0x7
0x9
0xA
0xB
0xC
0xD
0x12
PIC16LF724
01 1001 010x xxxx
0x7
0x9
0xA
0xB
0xC
0xD
0x12
PIC16F726
01 1000 001x xxxx
0x7
0x9
0xA
0xB
0xC
0xD
0x12
PIC16LF726
01 1001 001x xxxx
0x7
0x9
0xA
0xB
0xC
0xD
0x12
PIC16F727
01 1000 000x xxxx
0x7
0x9
0xA
0xB
0xC
0xD
0x12
PIC16LF727
01 1001 000x xxxx
0x7
0x9
0xA
0xB
0xC
0xD
0x12
Note 1:
2:
The Device ID is located at 2006h. The five Least Significant bits comprise the revision ID.
Refer to the “PIC16F72X Memory Programming Specification” (DS41332) for detailed information on
Device and Revision IDs for your specific device.
 2008-2013 Microchip Technology Inc.
DS80000382K-page 1
PIC16(L)F72X
TABLE 2:
SILICON ISSUE SUMMARY
Module
Feature
Item
Number
Issue Summary
Affected Revisions(1)
A7 A9 AA AB AC AD AK
ADC (Analog-to-Digital Power-down
Converter)
1.1
ADC Power-down in
Sleep.
X
X
X
X
ADC (Analog-to-Digital Offset Error
Converter)
1.2
Error on Infrequent
Conversions.
X
X
X
X
X
ADC (Analog-to-Digital Conversion
Converter)
Results
1.3
Incorrect Conversion
below 0°C.
X
X
X
X
X
X
X
X
X
X
X
Timer1
Timer1 Oscillator
2.1
Operation above 90°C.
X
Internal Oscillator
Frequency
3.1
Frequency Shift on Reset.
X
Internal Oscillator
Frequency
3.2
Failure to wake from
Sleep.
X
X
Internal Oscillator
Frequency
3.3
Frequency Tolerance.
X
X
X
X
X
X
X
External Oscillator
External Oscillator
4.1
Operation below 2.7V in
HS mode.
X
X
X
X
X
X
X
X
X
CPU
Sleep
5.1
Reset on Wake.
X
X
BOR
Current
6.1
Current Draw in Sleep.
X
X
X
X
WDT
CLRWDT
Instruction
7.1
CLRWDT Instruction after
WDT Time-out.
X
X
X
X
X
Interrupts
Stack Push
8.1
Interrupt logic incorrectly
pushes two addresses to
the stack.
X
X
X
X
X
FVR
Initial Accuracy
9.1
Min. and Max. value
change.
DS80000382K-page 2
X
 2008-2013 Microchip Technology Inc.
PIC16(L)F72X
Silicon Errata Issues
Note:
1.3 Incorrect Conversion below 0°C
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (as applicable).
1. Module: ADC (Analog-to-Digital
Converter)
The ADC module incorrectly fails to power-down
after a conversion if the device is in Sleep and the
ADC interrupt is disabled. The proper operation is
to power the ADC off after the conversion is
complete if the device is sleeping and the ADC
interrupt is disabled.
Work around
Use the ADC conversion complete interrupt
(ADIF) to wake-up and explicitly shut down the
ADC by clearing the ADON bit.
Affected Silicon Revisions
A9
AA
AB
X
X
X
X
AC
AD
Work around
Set the ADC clock source to FOSC/2, FOSC/4 or
RC.
Affected Silicon Revisions
1.1 ADC Power-down in Sleep
A7
In some devices, the ADC may improperly convert
if the temperature is below 0°C and the ADC clock
source is set to FOSC/8, FOSC/16, FOSC/32, FOSC/
64.
AK
A7
A9
AA
AB
AC
X
X
X
X
X
AD
AK
2. Module: Timer1
2.1 Operation above 90°C
The Timer1 oscillator does not operate above
90C.
Work around
None.
Affected Silicon Revisions
A7
A9
AA
AB
AC
AD
AK
X
X
X
X
X
X
X
3. Module: Internal Oscillator
1.2 Error on Infrequent Conversions
The offset error incorrectly exceeds the data sheet
specifications if time between conversions is
longer than 10 ms. If the time between
conversions is greater than 10 ms, the offset error
is 1 LSb typical and 3.3 LSb maximum.
3.1 Frequency Shift on Reset
The internal oscillator module may experience a
±1% frequency shift after a Reset. The frequency
shift is not consistent and could cause the oscillator to operate outside of the 2% specification.
Work around
Work around
The time dependent error is insignificant when the
time between conversions is less than 10 ms.
When the time between conversions is greater
than 10 ms, take two back-to-back ADC
conversions and discard the results of the first
conversion.
To minimize the chances of experiencing the
frequency shift, the following steps should be
taken:
Affected Silicon Revisions
A7
A9
AA
AB
AC
X
X
X
X
X
AD
AK
1. Operate the internal oscillator at 8 MHz or
2 MHz.
2. Use an external pull-up on MCLR or use
internal MCLR mode.
3. Disable the Power Reset Timer (PWRT).
4. The bypass capacitor and the Voltage
Regulator Capacitor (VCAP) should be used
appropriately to minimize noise in the device.
Affected Silicon Revisions
A7
A9
AA
AB
AC
AD
AK
X
 2008-2013 Microchip Technology Inc.
DS80000382K-page 3
PIC16(L)F72X
3.2 Failure to Wake from Sleep
3.3 Frequency Tolerance
Due to internal race conditions upon entering
Sleep mode, the device will occasionally fail to
wake-up from Sleep. Only a device Power-on
Reset will force the device to exit Sleep mode.
The frequency tolerance of the internal oscillator is
±2% from 0-60°C and ±3% from 60-85°C (see
Figure 1).
Work around
None.
Work around
None. Do not use Sleep command.
Affected Silicon Revisions
Affected Silicon Revisions
A7
A9
X
X
AA
FIGURE 1:
AB
AC
AD
A7
A9
AA
AB
AC
AD
AK
X
X
X
X
X
X
X
AK
HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND
TEMPERATURE(1)
125
+ 5%
85
Temperature (°C)
± 3%
60
± 2%
25
0
-20
-40
1.8
+ 5%
2.0
2.5
3.0 3.3(2) 3.5
4.0
4.5
5.0
5.5
VDD (V)
Note 1: This chart covers both regulator enabled and regulator disabled states.
2: Regulator Nominal voltage.
DS80000382K-page 4
 2008-2013 Microchip Technology Inc.
PIC16(L)F72X
4. Module: External Oscillator
7. Module: WDT
4.1 Minimum Operating Voltage for HS Mode
7.1 CLRWDT Instruction after WDT Time-out
The minimum device VDD when using the external
crystal oscillator in HS mode is 2.7V.
Work around
Use the internal oscillator or an external clock
source if operation below 2.7V is required for the
frequency range supported by HS mode.
Affected Silicon Revisions
A7
A9
AA
AB
AC
AD
AK
X
X
X
X
X
X
X
5. Module: CPU
5.1 Reset on Wake
Work around
1. Disable all asynchronous interrupt before
going to Sleep.
2. Make sure the timing of an asynchronous
interrupt will not happen during the execution
of the Sleep instruction.
Affected Silicon Revisions
A9
X
X
AA
Work around
Wait at least 20 S after a WDT Reset before using
the CLRWDT instruction.
Affected Silicon Revisions
A7
A9
AA
AB
AC
X
X
X
X
X
AD
AK
8. Module: Interrupts
If a wake from Sleep event occurs during the
execution of a Sleep command, the device may
reset. This Reset will be seen as a Power-on
Reset to the device.
A7
After a WDT Reset, the TO bit of the STATUS
register remains clear until a SLEEP instruction or
CLRWDT instruction is issued, then, the TO bit will
be set. If the CLRWDT instruction is issued within 20
S of the Reset, the TO bit will remain clear.
AB
AC
AD
AK
8.1 Stack Push
The interrupt logic incorrectly pushes two
addresses to the stack when vectoring to the
interrupt vector. Specifically, the interrupt vector
address 0x4 is incorrectly pushed to the stack after
the current PC, at the time the interrupt was
received, is pushed. This will cause the stack to
overflow if the user program is operating seven
calls deep when an interrupt arrives. Because the
stack is circular, the overflow causes the first stack
address to be overwritten.
Work around
6. Module: BOR
Disable interrupts by clearing the GIE bit in the
INTCON register whenever the user program is
operating seven calls deep. This ensures that
interrupts will not cause the stack to overflow.
6.1 Current Draw in Sleep
Affected Silicon Revisions
With the BOR set to “Enabled during operation and
disabled during Sleep”, the device draws 2 A
more during Sleep than when the BOR is set to
“Disabled”.
A7
A9
AA
AB
AC
AD
AK
X
X
X
X
X
X
X
Work around
None.
Affected Silicon Revisions
A7
A9
AA
AB
X
X
X
X
AC
 2008-2013 Microchip Technology Inc.
AD
AK
DS80000382K-page 5
PIC16(L)F72X
9. Module: FVR
9.1 Initial Accuracy
The initial accuracy values shown below in bold
text have changed. These values are listed in the
DC Characteristics Table 23-1, found in the
Electrical Specifications chapter of the data sheet.
Work around
None.
Affected Silicon Revisions
A7
A9
AA
AB
AC
AD
AK
X
D003
VFVR
Fixed Voltage Reference Voltage,
Initial Accuracy
DS80000382K-page 6
-8
-8
-8
—
—
—
6
6
6
%
%
%
VFVR = 1.024V, VDD  2.5V
VFVR = 2.048V, VDD  2.5V
VFVR = 4.096V, VDD 4.75V;
-40 TA85°C
-8
-8
-8
—
—
—
6
6
6
%
%
%
VFVR = 1.024V, VDD  2.5V
VFVR = 2.048V, VDD  2.5V
VFVR = 4.096V, VDD 4.75V;
-40 TA125°C
 2008-2013 Microchip Technology Inc.
PIC16(L)F72X
Data Sheet Clarifications
The following typographic corrections and clarifications
are to be noted for the latest version of the device data
sheet (DS41341E):
Note:
Corrections are shown in bold. Where
possible, the original bold text formatting
has been removed for clarity.
None.
 2008-2013 Microchip Technology Inc.
DS80000382K-page 7
PIC16(L)F72X
APPENDIX A:
DOCUMENT
REVISION HISTORY
Rev. A Document (07/2008)
First revision of this document.
Rev. B Document (08/2008)
Added Module 4: Internal Oscillator; Revised Modules
1 and 2.
Rev. C Document (11/2008)
Added Module 5: Internal Oscillator, Module 6: CPU and
Module 7: BOR.
Rev. D Document (07/2009)
Updated document with new format. Added items 1.3
and 3.3. Updated Tables 1 and 2. Other minor changes.
Rev. E Document (09/2009)
Added Module 6: WDT; Revised Tables 1 and 2; Added
Rev. ID AC.
Rev. F Document (01/2010)
Added Rev. AD Silicon.
Rev. G Document (03/2010)
Added new Module 4: External Oscillator; Revised
Table 2; Revised Module 3.3: Frequency Tolerance;
Other minor corrections.
Rev. H Document (04/2010)
Updated Tables 1 and 2, adding Rev. AK silicon;
Updated Module 3, clarified condition.
Rev. J Document (02/2011)
Updated errata to new format; Added Module 8,
Interrupts.
Rev. K Document (10/2013)
Updated errata to new format, Added Module 9, FVR;
Other minor corrections.
DS80000382K-page 8
 2008-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
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ISBN: 9781620775103
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DS80000382K-page 9
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DS80000382K-page 10
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