P/PG-LQFP-64-4, -5, -13, -14, -16, -20, -23, -25 7.5 0.08 C 64x 7° MAX. 0.6 ±0.15 +0.07 0.2 -0.03 12 10 +0.05 H 0.5 C 0.15 -0.06 1.6 MAX. 1.4 ±0.05 0.1 ±0.05 Package Outline 0.08 M A-B D C 64x 0.2 A-B D 64x 1) 0.2 A-B D H 4x 10 B 64 12 A 1) D 1 Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side Foot Print Soldering Type: Reflow Soldering 1.35 1.35 0.29 0.5 11.45 0.29 0.5 11.45 Package Information Published by Infineon Tec hnologies AG P/PG-LQFP-64-4, -5, -13, -14, -16, -20, -23, -25 Marking Layout Type code Date code (YYWW) G = Green Product 123456789 123456789 12345678901 XXXXXXXX XXX G Manufacturer Pin 1 Marking Mother lot number Split lot number Tape and Reel Reel ø330 mm: 1.900 Pieces/Reel Reels/Box: 1 0.3 16 12.35 24 12.35 Index Marking 1.55 2.05 Bakable Tray 7.62 Pieces/Tray: 160 Trays/Box: 1; 6 13 15.7 135.9 315 13.1 15.2 Mark for Pin 1 Package Information Published by Infineon Technologies AG