PG-DSO-20-27, -30, -67, -71 Package Overview

P/PG-DSO-20-27, -30, -67, -71
1.1
1.27
C
9 x 1.27 = 11.43
0.4 ±0.08 2)
0.7 ±0.2
0.1 C 20x
SEATING PLANE
10.3 ±0.3
0.25 M A-B C D 20x
A
11
D
Bottom View
Ejector Mark
Flat Shape
Ejector Mark
Flat Shape
11
20
Exposed Diepad
1
Index Marking
Ball Shape
Ey
20
0.23 +0.09
7.6 -0.2 1)
8° MAX.
0.35 x 45°
2.55 MAX.
3)
0...0.10
STAND OFF
2.45 -0.2
Package Outline
10
1
10
B
Ex
12.8 -0.21)
Index Marking
Ball Shape
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.05 max. per side
3) Distance from leads bottom (= seating plane) to exposed diepad
Exposed Diepad Dimensions
Leadframe
Package
C66065-A6680-C005
PG-DSO-20-27, -67
C66065-A6680-C009
PG-DSO-20-30, -71
PG-DSO-20-27
C66065-A6680-C016
PG-DSO-20-30, -71
C66065-A6680-C017
Ex
5.2
7.0
5.2
7.0
Ey
4.6
4.8
4.6
4.8
Excluding the mold flash allowance of 0.3 mm max. per side
Foot Print
Soldering Type: Reflow Soldering
0.65
Package Information
9.73
1.67
Ey
Ex
1.27
Published by Infineon Technologies AG
P/PG-DSO-20-27, -30, -67, -71
Marking Layout
on demand
Tape and Reel
Reel ø330 mm: 1.000 Pieces/Reel
Reels/Box:
1
12
Ejectormark
Flat Shape
24
0.3
13.3
Index Marking
Ball Shape
2.7
10.9
3.2
Tube
6.5
Pieces/Tube: 39
Length:
528 -2
Tubes/Box: 40
15.4
Only for PG-DSO-20-30
Package Information
Published by Infineon Technologies AG