P/PG-DSO-20-27, -30, -67, -71 1.1 1.27 C 9 x 1.27 = 11.43 0.4 ±0.08 2) 0.7 ±0.2 0.1 C 20x SEATING PLANE 10.3 ±0.3 0.25 M A-B C D 20x A 11 D Bottom View Ejector Mark Flat Shape Ejector Mark Flat Shape 11 20 Exposed Diepad 1 Index Marking Ball Shape Ey 20 0.23 +0.09 7.6 -0.2 1) 8° MAX. 0.35 x 45° 2.55 MAX. 3) 0...0.10 STAND OFF 2.45 -0.2 Package Outline 10 1 10 B Ex 12.8 -0.21) Index Marking Ball Shape 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Does not include dambar protrusion of 0.05 max. per side 3) Distance from leads bottom (= seating plane) to exposed diepad Exposed Diepad Dimensions Leadframe Package C66065-A6680-C005 PG-DSO-20-27, -67 C66065-A6680-C009 PG-DSO-20-30, -71 PG-DSO-20-27 C66065-A6680-C016 PG-DSO-20-30, -71 C66065-A6680-C017 Ex 5.2 7.0 5.2 7.0 Ey 4.6 4.8 4.6 4.8 Excluding the mold flash allowance of 0.3 mm max. per side Foot Print Soldering Type: Reflow Soldering 0.65 Package Information 9.73 1.67 Ey Ex 1.27 Published by Infineon Technologies AG P/PG-DSO-20-27, -30, -67, -71 Marking Layout on demand Tape and Reel Reel ø330 mm: 1.000 Pieces/Reel Reels/Box: 1 12 Ejectormark Flat Shape 24 0.3 13.3 Index Marking Ball Shape 2.7 10.9 3.2 Tube 6.5 Pieces/Tube: 39 Length: 528 -2 Tubes/Box: 40 15.4 Only for PG-DSO-20-30 Package Information Published by Infineon Technologies AG