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a
105-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-105-1)
Dimensions shown in millimeters
A1 BALL
CORNER
8.10
8.00 SQ
7.90
11 10 9
8
7 6 5 4
3 2 1
A
BALL A1
PAD CORNER
B
C
D
E
F
G
6.50
BSC SQ
H
J
K
L
0.65
BSC
BOTTOM VIEW
TOP VIEW
DETAIL A
DETAIL A
0.91 MIN
0.25 MIN
0.45
0.40
0.35
BALL DIAMETER
*COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
SEATING
PLANE
COPLANARITY
0.10
080807-A
*1.40
1.31
1.16