a 124-Lead Chip Scale Package Ball Grid Array [CSP_BGA] (BC-124-1) Dimensions shown in millimeters A1 CORNER INDEX AREA 9.10 9.00 SQ 8.90 12 11 10 9 8 7 6 5 4 3 2 1 BALL A1 PAD CORNER TOP VIEW A B C D E F G H J K L M 7.15 BSC SQ 0.65 BSC DETAIL A *1.40 MAX DETAIL A 0.65 MIN 0.15 MIN 0.45 0.40 0.35 BALL DIAMETER *COMPLIANT TO JEDEC STANDARDS MO-225 WITH THE EXCEPTION OF PACKAGE HEIGHT. ............................. SEATING PLANE COPLANARITY 0.10